JP2008141306A - Crystal oscillator - Google Patents

Abstract

【Task】
An object of the present invention is to provide a crystal oscillator having an oscillation characteristic in which an oscillation frequency is stable without being affected by an external environment.
[Solution]
An integrated circuit element in which an oscillation circuit is incorporated is mounted on the front main surface of the insulating base in the concave first container surrounding the first space provided on the front main surface of the insulating base. An integrated circuit element is electrically connected to the integrated circuit element through the first and second connection electrode portions in the second container of the same concave shape surrounding the second space portion formed on the upper surface of the first space portion of the conductive substrate. The first and second containers are joined via the first and second connection electrode portions, and a lid is placed on the upper edge of the opening of the second container and hermetically sealed. A first groove formed along the outer periphery of the first container and / or the second container 1 on the opening upper edge side of the first container. A second groove having the same shape opposite to the first groove is formed at the bottom of the substrate to solve the problem.
[Selection] Figure 1

Description

      The present invention relates to a crystal oscillator used in an electronic device such as a portable communication device.

      Conventionally, crystal oscillators have been used in electronic devices such as portable communication devices.

      As such a conventional crystal oscillator, for example, as shown in FIG. 6, a crystal resonator 23 in which a crystal resonator element is accommodated in a second space portion is not shown. An integrated circuit element 26 that controls the oscillation output based on the vibration of the crystal resonator element and a first container 21 in which an electronic component element such as a capacitor is accommodated in the space 25. By placing such a crystal oscillator on a mounting circuit board such as a mother board and soldering the electrode terminals provided on the bottom surface of the first container 21 to the wiring of the mounting circuit board. It is mounted on a mounting circuit board.

      The crystal unit 23 and the first container 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface thereof, and a conventionally known ceramic green sheet lamination method or the like is employed. Produced.

      The integrated circuit element 26 is provided with a temperature compensation circuit for correcting the oscillation frequency of the crystal oscillator based on the temperature compensation data created according to the temperature characteristics of the crystal resonator element. After assembling the oscillator, in order to store the temperature compensation data in the memory of the integrated circuit element 26, a write control terminal 27 for writing temperature compensation data is provided on the bottom surface and the outer surface of the first container 21. Provided. The temperature compensation data is stored in the memory of the integrated circuit element 26 by applying the probe needle of the temperature compensation data writing device to the write control terminal 27 and inputting the temperature compensation data to the memory in the integrated circuit element 26. The

JP 2003-158441 A JP 2004-064651 A JP 2005-101848 A

      The applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information described above.

      However, when the integrated circuit element of the conventional crystal oscillator described above is disposed in the first space portion of the first container 21, external insulation is provided from the gap between the joint surfaces of the crystal resonator and the first container. Therefore, there is a drawback that unnecessary materials such as a resin used for the protection of intrusion may enter and the oscillation frequency may be changed in the crystal oscillator.

      The present invention has been conceived in view of the above-mentioned drawbacks. Accordingly, an object of the present invention is to provide a crystal oscillator having an oscillation characteristic in which the oscillation frequency is stable without being affected by the external environment.

      In the crystal oscillator according to the present invention, an oscillation circuit is incorporated on the front main surface of the insulating base in the first container having a concave shape surrounding the first space provided on the front main surface of the insulating base. The integrated circuit element is mounted, and in the second container of the same concave shape surrounding the second space formed on the upper surface of the first space of the insulating substrate, the connection electrode is connected to the previous integrated circuit element. A quartz crystal resonator element that is electrically connected through the part is accommodated, the first container and the second container are joined via the connection electrode part, and a lid is formed on the upper edge of the opening of the second container. Is mounted and hermetically sealed, the first groove formed along the outer periphery of the first container and / or the opening of the first container in the upper edge of the opening of the first container A second groove having the same shape facing the first groove is formed at the bottom of the second container on the edge side. It is a sign.

      In the crystal oscillator of the present invention, the first groove and / or the second groove are not formed so as to be continuously connected to each other in the connection electrode portion, but are formed in an interrupted manner. It is characterized by that.

      According to the crystal oscillator of the present invention, the first groove formed along the outer periphery of the first container over the upper edge of the opening of the first container, and / or the opening upper edge side of the first container. The second groove having the same shape facing the first groove is formed at the bottom of the second container, so that the first groove and the second groove are generated at the corners outside the crystal oscillator, and the like. Due to the surface tension acting on the surface, the intrusion of unnecessary materials such as the resin from the outside is blocked, and as a result, it is possible to obtain a crystal oscillator having stable characteristics that is not affected by the external environment of the crystal oscillator.

      Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In addition, the same code | symbol in each figure shall show the same object.

      1 is a cross-sectional view of the crystal oscillator according to the present invention taken along line XX ′ shown in FIG. 2, and FIG. 2 shows a first space portion 15 showing one substrate region cut from an insulating ceramic aggregate substrate. It is a top view of the 1st container 10 which has these. The crystal oscillator shown in FIG. 1 is provided with an electrode terminal 19 on the bottom surface of a first container 10 having a first space 15 for accommodating an integrated circuit element 7, and a first space for accommodating the integrated circuit element 7. An integrated circuit element 7 is mounted on the upper surface of the first container 10 having 15. In addition, a wall 13 surrounding the first space 15 of the first container 10 having the first space 15 for housing the integrated circuit element 7 is provided, and a plurality of documents are provided on the outer surface of the wall 13. Control terminal 11 is formed. Further, as shown in FIG. 1, the upper surface of the wall 13 has a structure in which a crystal resonator A in which the crystal resonator element 5 is accommodated is placed and fixed. In the crystal oscillator according to the present invention, the first groove 12 formed along the outer periphery of the first container 10 and / or the opening of the first container 10 in the upper edge of the opening of the first container 10. A second groove 9 having the same shape facing the first groove 12 is formed at the bottom of the second container 1 on the upper edge side.

      In FIG. 1, a quartz resonator A includes, for example, a second container 1 including a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, and a side wall 3 made of a ceramic material similar to the substrate 2; 42, a lid 4 made of a metal such as alloy, kovar, phosphor bronze, etc., and a quartz resonator by attaching a side wall 3 to the upper surface of the substrate 2 and mounting and fixing the lid 4 on the upper surface. A is configured, and the crystal resonator element 5 is mounted on the upper surface of the substrate 2 located inside the side wall 3.

      The crystal resonator A accommodates the crystal resonator element 5 in the second space 6 surrounded by the upper surface of the substrate 2, the inner surface of the side wall 3, and the bottom surface of the lid body 4. A pair of mounting pads connected to the vibration electrode of the crystal resonator element 5 is provided on the upper surface of the substrate 2, and a wall body 13 on the first container 10 described later is provided on the bottom surface of the substrate 2. A plurality of second connection electrode portions 17 connected to each other are provided, and these pads and terminals correspond to each other through wiring patterns on the surface of the substrate 2 and via holes embedded in the substrate, They are electrically connected to each other.

      On the other hand, the crystal resonator element 5 accommodated in the crystal unit A is formed by attaching and forming a pair of vibration electrodes on both main surfaces of a crystal base plate cut along a predetermined crystal axis, and the fluctuation from the outside. When a voltage is applied to the quartz base plate via a pair of vibrating electrodes, a thickness shear vibration occurs at a predetermined frequency.

      Here, the lid 4 of the crystal unit A is connected to a ground terminal electrode terminal 19 which will be described later via the second connection electrode portion 17 of the second container 1 and the first connection electrode portion 18 of the first container 10. If the connection is made, the lid 4 made of metal is connected to the reference potential and a shielding function is given at the time of use, so that the crystal resonator element 5 and the integrated circuit element 7 are not required from the outside. It can be well protected from electrical effects. Therefore, the lid 4 of the crystal unit A is connected to the electrode terminal 19 for the ground terminal via the second connection electrode unit 17 of the crystal unit A and the first connection electrode unit 18 of the first container 10. It is preferable to keep it.

      And the 1st container 10 which has the 1st space part 15 which accommodates the integrated circuit element 7 in which the crystal oscillator A mentioned above is attached has comprised the substantially rectangular shape, glass cloth base material epoxy resin, It is formed so as to have a flat plate shape by a resin material such as polycarbonate, epoxy resin, polyimide resin or the like, or a ceramic material such as glass-ceramic or alumina ceramic.

      A first container 10 having a first space 15 for accommodating the integrated circuit element 7 has four electrode terminals 19 (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control) at the four corners of the bottom surface of the substrate region. Are formed on the outer periphery of the wall 13 between the four corners, and on the outer side surface of the wall 13 between the four corners. A write control terminal 11 is provided.

      The four electrode terminals 19 provided on the bottom surface of the first container 10 having the first space 15 for accommodating the integrated circuit element 7 are terminals for connecting the crystal oscillator to a mounting circuit board such as a mother board. When the crystal oscillator is mounted on the mounting circuit board, it is electrically connected to the circuit wiring of the mounting circuit board via a conductive bonding material such as solder.

      The wall body 13 provided on the upper surface of the first container 10 having the first space portion 15 for accommodating the integrated circuit element 7 has the first space portion 15 for accommodating the integrated circuit element 7. The first space portion 15 that accommodates the integrated circuit element 7 is secured between the container 10 and the quartz crystal resonator A while ensuring a predetermined interval necessary for disposing the integrated circuit element 7. This is for connecting the first connection electrode portion 18 of the container 10 to the second connection electrode portion 17 of the crystal unit A.

      Further, a plurality of electrode pads are provided in the central region of the first container 10 having the first space 15 for accommodating the integrated circuit element 7 described above, and the connection of the integrated circuit element 7 to these electrode pads. The integrated circuit element 7 has a first space portion 15 by electrically and mechanically connecting the pad via a conductive bonding material 8 such as an Au bump, solder, or anisotropic conductive adhesive. It is attached to a predetermined position on the container 10.

      The integrated circuit element 7 has, on its circuit forming surface (lower surface), a temperature sensing element such as a thermistor for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the crystal vibration element 5, A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to a temperature change based on the temperature compensation data, an oscillation circuit that is connected to the previous temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is used as a reference signal such as a clock signal after being output to the outside.

      Here, as shown in FIGS. 1 to 2, the characteristic part of the present invention is the insulation in the first container 10 having a concave shape surrounding the first space 15 provided on the front main surface of the insulating substrate. An integrated circuit element 7 in which an oscillation circuit is incorporated is mounted on the front main surface of the insulating substrate, and also has a concave shape surrounding the second space 6 formed on the upper surface of the first space 15 of the insulating substrate. In the second container 10, the crystal resonator element 5 electrically connected to the integrated circuit element 7 through the first and second connection electrode portions 17.18 is accommodated. The first container 10 and the second container 1 is a crystal oscillator that is joined via first and second connection electrode portions 17.18, and the lid 4 is placed on the upper edge of the opening of the second container 10 and hermetically sealed. The first groove 12 formed along the outer periphery of the first container 10 within the upper edge of the opening of the container 10 and / or the first Since the second groove 9 having the same shape facing the first groove 12 is formed at the bottom of the second container 1 on the opening upper edge side of the vessel 10, the first groove 12 and the second groove Even when the crystal oscillator is covered with a resin fill in the external environment of the crystal oscillator by blocking the intrusion of unwanted materials from the outside by the surface tension that acts on the resin 20 or the like in the corner portion of the groove 9 outside the crystal oscillator It becomes possible to obtain a stable crystal oscillator. That is, as shown in FIG. 5, when the crystal oscillator of the present invention is mounted on the mounting circuit board 16, when the crystal oscillator is covered with a resin fill, the resin 20 flowing from the outside is in contact with the first container 10 and the second container. As shown in FIG. 5, the resin 20 flowing from the outside enters the first groove 12 and the second groove 9 as it enters from the gap between the first and second connection electrode portions 17.18 of the container 1. However, the resin 20 does not flow into the crystal oscillator and stops due to the surface tension acting on the resin 20 and the like, which is generated at the outer corner of the crystal oscillator. The depth of the first groove 12 and the second groove 9 used here can be set in the range of 0.05 mm to 0.3 mm, but the upper limit of the groove depth is 0.3 mm. Since the height dimension of the first container 10 and the second container 1 is about 0.5 mm, considering the strength of the container in which the groove is formed, the maximum depth of the groove is about 60% of the container height. It becomes.

      In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

      For example, in the above-described embodiment, as shown in FIGS. 2 and 3, the first groove 12 and the second groove 9 are formed discontinuously in the first and second connection electrode portions 17.18. However, it may be formed continuously in the first connection electrode portion 18 as in the first groove 12 shown in FIG. 4. Similarly, the second connection electrode portion is also formed in the second groove 9. 17 may be formed continuously. Moreover, as shown in FIG. 1, the vertical cross-sectional shape of the first groove 12 and the second groove 9 is substantially U-shaped, but other than this, a horseshoe shape, a trapezoidal shape, a semicircular shape, etc. Needless to say, this case is also included in the technical scope of the present invention.

1 is a schematic cross-sectional view of a crystal oscillator according to the present invention as viewed from a horizontal direction. It is a schematic top view of the 1st container which has the 1st space part of the crystal oscillator concerning the embodiment of the present invention. It is a schematic bottom view of the 2nd container of the crystal oscillator concerning embodiment of this invention. It is a schematic bottom view of the 2nd container of the crystal oscillator concerning other embodiment of this invention. 1 is a schematic cross-sectional view of a crystal oscillator mounted on a substrate and coated with a resin according to an embodiment of the present invention when viewed from the horizontal direction. It is the schematic perspective view which looked at the conventional crystal oscillator from diagonally upward.

Explanation of symbols

A ... Quartz crystal resonator 1 ... Second container 2 ... Substrate 3 ... Side wall 4 ... Lid 5 ... Quartz vibrating element 6 ... Second space 7 ... Integrated circuit element 8 ... conductive bonding material 9 ... second groove 10 ... first container 11 ... write control terminal 12 ... first groove 13 ... wall DESCRIPTION OF SYMBOLS 15 ... 1st space part 16 ... Mounting circuit board 17 ... 2nd connection electrode part 18 ... 1st connection electrode part 19 ... Electrode terminal 20 ... It flows in from the outside resin

Claims (2)

An integrated circuit element in which an oscillation circuit is incorporated is mounted on the front main surface of the insulating base in the first container having a concave shape surrounding the first space provided on the front main surface of the insulating base. In the second container of the same concave shape surrounding the second space formed on the upper surface of the first space of the insulating substrate, the integrated circuit element is electrically connected to the integrated circuit element through the connection electrode. A quartz resonator element to be connected is accommodated, the first container and the second container are joined via the connection electrode portion, and a lid is formed on the upper edge of the opening of the second container. In a crystal oscillator that is mounted and hermetically sealed,
The first groove formed along the outer periphery of the first container in the upper edge of the opening of the first container, and / or the second container on the opening upper edge side of the first container. A crystal oscillator, wherein a second groove having the same shape opposite to the first groove is formed at the bottom.       2. The crystal oscillator according to claim 1, wherein the first groove and / or the second groove is not formed so as to be continuously connected in the connection electrode portion, but is disconnected. .

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