JP2008124272A - Lead frame and optical coupler device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame which requires less component count and assures easy manufacturing, and to provide an optical coupler device using such a lead frame. <P>SOLUTION: The optical coupler device using the lead frame comprises a light-emitting element, a photodetector arranged in opposition to the light-emitting element at given intervals, a first electrode lead section 12 with the light-emitting element positioned at one side and with a remaining lead section folded back like an L shape on the opposite side of the photodetector on the way and extended to the outer side of the light-emitting element at the other side, and a second electrode lead section 14 with the photodetector positioned at one side and with a remaining lead section folded back like an L shape to the light-emitting element side on the way and extended to the outer side of the light-emitting element at the other side. A concave portion 31 is formed in a region where a light-emitting section 21 and a photodetector section 22 each of which molds the light-emitting element and the photodetector respectively with a transparent resin against the light-emitting wavelength are placed in opposite to each other, and windows 32 and 33 are formed to pass the received/emitted light to the opposing sidewalls, then the whole area is molded with an opaque resin 34. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lead frame and an optical coupling device using the lead frame.

An optical coupling device in which a light emitting element and a light receiving element are arranged to face each other is used as a photo interrupter for detecting the position of an object, for example.
Conventionally, a photo interrupter with a terminal for connecting to an external circuit is assembled by pressing or welding a light emitting element and a light receiving element individually housed in a package at a mounting position of a case-integrated holder having terminal electrodes. (For example, refer to Patent Document 1).

In the optical coupling device disclosed in Patent Document 1, a light emitting element and a light receiving element are arranged with their electrode terminals fixed to corresponding connection portions provided on a lead frame, and arranged to face each other with a predetermined interval. A sealing body for sealing the lead frame, a light emitting element and a light receiving element, each having an opening for inserting an element at the upper end, and a light emitting slit and a light receiving member that are parallel to the element mounting direction on opposite side walls. The case body provided with the slit for use is formed by integral molding with a synthetic resin material.
As a result, the number of components is small, the manufacturing process can be simplified, and the cost is reduced.

However, since the optical coupling device disclosed in Patent Document 1 assembles individual components such as a single light emitting device, a single light receiving device, a holder, and a case, the number of components still constituting is large, and the manufacturing process is complicated. There is a problem.
Further, the characteristics may vary due to the optical axis alignment accuracy between the light emitting element and the light receiving element, mechanical thermal stress during pressure welding or welding, and the like.
JP 2002-368255 A

  The present invention provides a lead frame that has a small number of components and can be easily manufactured, and an optical coupling device using the lead frame.

  A lead frame according to an aspect of the present invention includes a first electrode lead portion having a first mount bed on one side and a second electrode lead portion having a second mount bed on one side, and a tip of the first mount bed; The tip of the second mount bed is disposed to face the other, the other of the first electrode lead portions extends to the opposite side of the second mount bed, and the other of the second electrode lead portions is connected to the first mount bed. It extends to the opposite side, is folded back to the first mount bed side in the middle, and extends outward from the first mount bed.

  The optical coupling device of one embodiment of the present invention includes a first optical semiconductor element that emits or receives light, and a second optical semiconductor element that receives or emits light that is disposed to face the first optical semiconductor element with a predetermined interval. And the first optical semiconductor element is placed on one side, and the other is bent in an L-shape on the opposite side to the second optical semiconductor element and extended outward from the first optical semiconductor element, A first electrode lead portion for electrically connecting the first optical semiconductor element to the outside, and the second optical semiconductor element is placed on one side, and the other is L-shaped on the first optical semiconductor element side in the middle And a second electrode lead portion that extends outward from the first optical semiconductor element and electrically connects the second optical semiconductor element to the outside.

  According to the present invention, a lead frame that can be easily manufactured with a small number of components and an optical coupling device using the lead frame can be obtained.

  Embodiments of the present invention will be described below with reference to the drawings.

  A lead frame according to Embodiment 1 of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view showing a lead frame, and FIG. 2 is a perspective view showing a state in which the lead frame is used.

  As shown in FIG. 1, the lead frame 10 of the present embodiment has a first electrode lead 12 part having a first mount bed 11 on one side and a second electrode lead 14 part having a second mount bed 13 on one side. I have.

  The front end of the first mount bed 11 and the front end of the second mount bed 13 are arranged to face each other, the other of the first electrode leads 12 extends to the side opposite to the first mount bed 11, and the second electrode lead 14 The other of the two extends to the opposite side of the second mount bed 13, is folded back to the first mount bed 11 side from the middle, and extends to the first mount bed 11 side.

  Specifically, the first electrode lead 12 part is provided to be separated from the first mount bed 11 with the electrode lead 12a extending from the first mount bed 11 in the first direction X, and in parallel with the electrode lead 12a. And an electrode lead 12b extending in the first direction X.

  The second electrode lead portion 14 extends from the second mount bed 13 in the direction opposite to the first direction X, and has an electrode lead 14a having a folded portion 14c that is folded in the first direction X in the middle. An electrode lead 14b provided apart from the mount bed 13 and extending in a direction opposite to the first direction X in parallel with the electrode lead 14a and having a folded portion 14d folded in the first direction X in the middle. It has. The electrode leads 14a and 14b are folded back via the connecting bar 15, respectively.

  The folded portions 14c and 14d of the electrode leads 14a and 14b extend to the other ends of the electrode leads 12a and 12b. The other ends of the electrode leads 12a and 12b and the electrode leads 14a and 14b are connected to the connecting bar 16, respectively. In the first direction X, the electrode terminal portion 17 extends from the connecting bar 16.

A first optical semiconductor element (not shown), for example, a light emitting element is mounted on the first mount bed 11 via a conductive adhesive, the electrode lead 12a serves as the cathode terminal of the light emitting element, and the electrode lead 12b is the first lead. 1 An anode terminal is formed by wire bonding to the anode of a semiconductor element.
A second optical semiconductor element (not shown), for example, a light receiving element is mounted on the second mount bed 13 via a conductive adhesive, the electrode lead 14a serves as the cathode terminal of the light receiving element, and the electrode lead 14b is the first lead. 2 Wire-bonded to the anode of the semiconductor element to become the anode terminal of the light receiving element.

  The lead frame 10 is, for example, a copper plate plated with nickel and silver having a thickness of about 0.15 mm. The first and second mount heads 11 and 13, the first and second electrode lead portions 12 and 14, An electrode terminal portion 17 is formed.

  The first and second mount heads 11 and 13 have a substantially rectangular shape, and a light emitting element and a light receiving element are mounted at the center thereof.

  As shown in FIG. 2, the lead frame 10 is cut between the electrode lead 14 a and the electrode lead 14 b of the connecting bar 15. The space between the electrode lead 12a and the electrode lead 12b of the connecting bar 16 is cut. The space between the electrode lead 12a of the connecting bar 16 and the folded electrode lead 14d is cut.

  As a result, the anode terminal of the light emitting element (first optical semiconductor element) 21a is drawn out to the electrode terminal 17b. The cathode terminal of the light receiving element (second optical semiconductor element) 22a is drawn out to the electrode terminal 17a. The cathode terminal of the light emitting element and the anode terminal of the light receiving element are drawn in common to the electrode terminal 17c.

  Next, the electrode leads 12 a and 12 b are bent in an L shape with respect to the first direction X at the connection point with the connecting bar 16. The electrode leads 14 a and 14 b are bent in an L shape with respect to the direction opposite to the first direction X at the connection point with the connecting bar 15.

  Further, the folded portions 14c and 14d of the electrode leads 14a and 14b are bent in a V shape by a depth D in the direction opposite to the electrode leads 14a and 14b, respectively.

As a result, the first mount bed 11 and the second mount bed 13 are arranged to face each other with a predetermined distance L.
Here, as will be described later, a light emitting section 21 in which a light emitting element (first optical semiconductor element) 21a mounted on the first mount bed 11 is molded with a resin transparent to the emission wavelength, and the second mount bed 13 are used. The light receiving element (second optical semiconductor element) 22a mounted on the light receiving part 22a, which is molded with a resin transparent to the emission wavelength, is disposed facing the light receiving part 22 with a predetermined distance L.

  Next, an optical coupling device using the lead frame 10 will be described with reference to FIG. FIG. 3 is a perspective view showing a state in which the inside of the optical coupling element is seen through.

  As shown in FIG. 3, the optical coupling device 30 has a recess 31 formed in a region where the light emitting unit 21 and the light receiving unit 22 face each other, and vertically emits light emitted from the light emitting unit 21 on the side wall part facing the recess 31. A light emitting slit (window) 32 that shapes the light into a substantially parallel beam, and a light receiving slit (window) 33 that cuts scattered light, external stray light, and the like into the light receiving unit 22 and makes only a substantially vertically long parallel beam incident thereon are formed. The terminal 17 is extended, and the light emitting portion 21, the light receiving portion 22, the first electrode lead 12, and the second electrode lead 14 are integrally molded with a resin 34 that is opaque with respect to the emission wavelength.

Furthermore, a male connector 35 for electrically connecting the optical coupling device 30 to the outside is formed on the side surface of the optical coupling device 30 where the electrode terminal 17 extends.
By inserting a female connector (not shown) into the male connector 35, the light emitting unit 21 and the light receiving unit 22 are electrically connected to the outside.

  Further, on the lower surface of the optical coupling device 30, hooks 36 for inserting and fixing the optical coupling device 30 into attachment holes formed in the printed wiring board are formed at the four corners.

  Next, a method for manufacturing the optical coupling device 30 will be described with reference to FIGS. 4 and 5 are cross-sectional views sequentially showing the manufacturing process of the optical coupling device 30. FIG.

  As shown in FIG. 4A, a lead frame 10 having first and second mount heads 11 and 13 and first and second electrode lead portions 12 and 14 is prepared.

  Next, as shown in FIG. 4B, the light emitting element 41 is mounted on the first mount bed 11, the light receiving element 42 is mounted on the second mount bed 13, and the light emitting element 41 is connected to the electrode lead via the wire 43. The light receiving element 42 is wire-bonded to the electrode lead 14b via the wire 44.

  Next, as shown in FIG. 4C, the light emitting element 41 and the light receiving element 42 invert the lead frame 10 that has been mounted and bonded, respectively.

  As shown in FIG. 5A, the light emitting element 41 and the light receiving element 42 are molded (inner mold) with a resin transparent to the emission wavelength, and the light emitting part 21 and the light receiving part 22 are formed.

  Next, as shown in FIG. 5 (b), unnecessary portions of the connecting bars 15 and 16 are cut, and the electrode leads 12a and 12b are bent into an L shape at the connection points with the connecting bars 16, so that the electrode leads 14a, 14b is bent in an L shape at a connection point with the connecting bar 15, the folded portions 14c and 14d of the electrode leads 14a and 14b are bent in a V shape, and the lead frame 10 is cut and formed.

  In this specification, the L-shape includes not only the case where the bending angle of the electrode lead is substantially right angle, but also the case where the light emitted from the light emitting portion 21 is inclined from the right angle within the range where the light receiving portion 22 can receive light. It is out.

  Next, as shown in FIG. 5C, a recess 31 is formed in a region where the light emitting unit 21 and the light receiving unit 22 face each other, and light emitted from the light emitting unit 21 is vertically elongated on the side wall portion where the recess 31 faces. A light emitting slit 32 that shapes the light into a substantially parallel beam, and a light receiving slit 33 that cuts scattered light and external stray light into the light receiving unit 22 to allow only a vertically long substantially parallel beam to enter are formed, extending the electrode terminal 17. The light emitting unit 21, the light receiving unit 22, the first electrode lead 12, and the second electrode lead 14 are integrally molded (outer mold) with a resin 34 that is opaque to the emission wavelength.

Furthermore, a male connector 35 for electrically connecting the optical coupling device 30 to the outside is formed on the side surface of the optical coupling device 30 where the electrode terminal 17 extends.
Further, on the lower surface of the optical coupling device 30, hooks 36 for inserting and fixing the optical coupling device 30 into attachment holes formed in the printed wiring board are formed at the four corners.

  As described above, in this embodiment, the lead frame 10 in which the first and second mount beds 11 and 13 and the first and second electrode leads 12 and 14 are integrally formed is used.

  As a result, the light emitting element 41 and the light receiving element 42 are mounted, bonded, and inner molded on the lead frame 10 in the same process, and after the lead frame 10 is cut and formed, it can be integrally outer molded.

  Therefore, the lead frame 10 and the optical coupling device 30 using the lead frame 10 that can be easily manufactured with a small number of components are obtained.

  Furthermore, the facing distance L between the light emitting portion 21 and the light receiving portion 22 can be adjusted by the bent shape D of the folded portions 14c, 14d of the electrode leads 14a, 14b.

  Although the case where the first optical semiconductor element is a light emitting element and the second optical semiconductor element is a light receiving element has been described here, the first optical semiconductor element may be a light receiving element and the second optical semiconductor element may be a light emitting element. Absent.

  Further, the light emitting part 21, the light receiving part 22, the first electrode lead part 12 and the second electrode lead part 14 in which the first and second optical semiconductor elements 41 and 42 are inner-molded with a resin transparent to the emission wavelength are provided. The case where the outer mold is integrally molded with the resin 34 that is opaque to the emission wavelength has been described. However, depending on the purpose, only the inner mold may be used, or it may not be molded with the resin.

The case where the first electrode lead portion 12 has a pair of electrode leads 12a and 12b and the second electrode lead portion 14 has a pair of electrode leads 14a and 14b has been described. You may change suitably.
For example, when a phototransistor in which a photodiode and a transistor are combined is used as the light receiving element 42, a third electrode lead is newly formed in the second electrode lead portion 14.

  Further, the case where the electrode lead 12b and the electrode lead 14a are connected to the common electrode terminal 17c has been described. However, a new electrode terminal may be provided in the electrode terminal portion 17 and connected to different electrode terminals.

  The case where the folded portions 14c and 14d of the electrode leads 14a and 14b are bent in a V-shape by a depth D in the opposite direction to the electrode leads 14a and 14b has been described, but in the direction of the electrode leads 14a and 14b. You may bend and you may bend in a U shape or W shape. Bending in a W shape has the advantage that the depth D can be reduced.

  Further, it can be bent in, for example, a wave shape in both directions opposite to the direction of the electrode leads 14a and 14b. This has the advantage that the depth D can be further reduced. When the depth D is reduced, the amount of the resin 34 can be reduced.

  FIG. 6 is a plan view showing a lead frame according to Embodiment 2 of the present invention. In the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof will be omitted, and different portions will be described.

  This embodiment differs from the first embodiment in that a lead frame is used in which the tip of the first mount bed and the tip of the second mount bed are opposed to each other in the opposite direction.

  That is, as shown in FIG. 6, the lead frame 60 of this embodiment includes a first electrode lead portion 62 having a first mount bed 61 on one side and a first electrode lead portion 64 having a second mount bed 63 on one side. And the tip of the first mount bed 61 and the tip of the second mount bed 63 are arranged opposite to each other in the opposite direction.

The other of the first electrode lead portions 62 extends toward the second mount bed 63, and is folded back toward the first mount bed 61 in the middle and extends outward from the first mount bed 61.
The other of the second electrode lead portions 63 extends toward the first mount bed 61, is bent in a crank shape in the middle, and extends outward from the first mount bed 61.

  Specifically, the first electrode lead 62 portion extends from the first mount bed 61 in a direction opposite to the first direction X, and has an electrode lead 62a having a folded portion 62c that is folded back in the first direction X. And an electrode having a folded portion 62d which is provided apart from the first mount bed 61, extends in a direction opposite to the first direction X in parallel with the electrode lead 62a, and is folded in the first direction X in the middle. And lead 62b.

  The second electrode lead portion 64 extends from the second mount bed 63 in the first direction X, and is provided in the middle of the electrode lead 64a having a crank portion 64c and spaced apart from the second mount bed 63, and the electrode lead 64a. And an electrode lead 64b extending in the first direction X and having a crank part 64d in the middle.

The folded portion 62 c of the electrode lead 62 a is connected to the wide electrode terminal 67 a of the electrode terminal portion 17, and the folded portion 62 d of the electrode lead 62 b is connected to the wide electrode terminal 67 b of the electrode terminal portion 17.
The crank portion 64 c of the electrode lead 64 a is commonly connected to the wide electrode terminal 67 b of the electrode terminal portion 17, and the crank portion 64 d of the electrode lead 64 b is connected to the wide electrode terminal 67 c of the electrode terminal portion 17.

A first optical semiconductor element (not shown), for example, a light emitting element is mounted on the first mount bed 61 via a conductive adhesive, the electrode lead 62a serves as the cathode terminal of the light emitting element, and the electrode lead 62b is the first lead. 1 An anode terminal is formed by wire bonding to the anode of a semiconductor element.
A second optical semiconductor element (not shown), for example, a light receiving element is mounted on the second mount bed 63 via a conductive adhesive, the electrode lead 64a serves as the cathode terminal of the light receiving element, and the electrode lead 64b 2 Wire-bonded to the anode of the semiconductor element to become the anode terminal of the light receiving element.

  FIG. 7 is a cross-sectional view sequentially illustrating manufacturing steps of the optical coupling device 70 using the lead frame 60.

  First, as shown in FIG. 7A, a lead frame 60 having first and second mount heads 61 and 63 and first and second electrode lead portions 62 and 64 is prepared.

  Next, as shown in FIG. 7B, the light emitting element 41 is mounted on the first mount bed 61, the light receiving element 42 is mounted on the second mount bed 63, and the light emitting element 41 is connected to the electrode lead via the wire 43. The light receiving element 42 is wire-bonded to the electrode lead 64b via the wire 44.

  Next, as shown in FIG. 7C, the light emitting element 41 and the light receiving element 42 are molded (inner mold) with a resin transparent to the emission wavelength, and the light emitting part 21 and the light receiving part 22 are formed.

  Next, as shown in FIG. 7D, in order to maintain the mechanical strength of the electrode terminal portion 67, each of the wide electrode terminals 67a, 67b, 67c is bent into a U shape, and the connection bars 65, 66 are not required. Then, the electrode leads 62a and 62b are bent in an L shape before the folded portion, and the electrode leads 64a and 64b are bent in an L shape before reaching the crank portions 64c and 64d.

  Next, the folded-back portions 62c and 62d of the electrode leads 62a and 62b and the electrode lead 64e after the crank portion 64d of the electrode lead 64b are bent in a V shape, and the lead frame 60 is cut and formed.

  Next, as shown in FIG. 7D, the whole is molded (outer mold) with a resin that is opaque with respect to the emission wavelength, whereby the optical coupling device 70 is obtained.

  As described above, in the present embodiment, the lead frame 60 in which the tip of the first mount bed 61 and the tip of the second mount bed 63 are arranged to face each other in the opposite direction is used. The distance L between the light emitting part 21 and the light receiving part 22 is uniquely determined by the design of the lead frame 60, and there is an advantage that the labor for adjusting the distance L between the light emitting part 21 and the light receiving part 22 during assembly can be saved.

1 is a perspective view showing a lead frame according to Embodiment 1 of the present invention. 1 is a perspective view showing a state in which a lead frame according to Embodiment 1 of the present invention is used. 1 is a perspective view illustrating the inside of an optical coupling device according to Embodiment 1 of the present invention. Sectional drawing which shows the manufacturing process of the optical coupling device which concerns on Example 1 of this invention in order. Sectional drawing which shows the manufacturing process of the optical coupling device which concerns on Example 1 of this invention in order. The top view which shows the lead frame which concerns on Example 2 of this invention. Sectional drawing which shows the manufacturing process of the optical coupling device which concerns on Example 2 of this invention in order.

Explanation of symbols

10, 60 Lead frame 11, 61 First mount bed 12, 62 First electrode lead 12a, 12b, 14a, 14b, 62a, 62b, 64a, 64b, 64e Electrode lead 13, 63 Second mount bed 14, 64 First 2 electrode lead part 14c, 14d, 62c, 62d Folding part 15, 16, 65, 66 Connecting bar 17, 67 Electrode terminal part 17a, 17b, 17c, 67a, 67b, 67c Electrode terminal 21a Light emitting element (first optical semiconductor element) )
21 Light Emitting Unit 22a Light Receiving Element (Second Optical Semiconductor Element)
22 Light receiving portion 30, 70 Optical coupling device 31 Recess 32 Light emitting slit 33 Light receiving slit 34 Resin 35 Connector 36 Claw 41 Light emitting device 42 Light receiving device 43, 44 Wire 64c, 64d Crank portion

Claims (5)

A first optical semiconductor element that emits or receives light;
A second optical semiconductor element that receives or emits light and is disposed opposite to the first optical semiconductor element at a predetermined interval;
The first optical semiconductor element is placed on one side, the other is bent in an L-shape on the opposite side to the second optical semiconductor element, and extended outward from the first optical semiconductor element. A first electrode lead portion for electrically connecting the optical semiconductor element to the outside;
The second optical semiconductor element is placed on one side, the other is bent in an L-shape on the first optical semiconductor element side in the middle, and extends outward from the first optical semiconductor element, and the second optical semiconductor element A second electrode lead portion for electrically connecting the element to the outside;
An optical coupling device comprising:   The second electrode lead portion is bent in a V shape between the L-shaped bent portion of the second electrode lead portion and the L-shaped bent portion of the first electrode lead portion. The optical coupling device according to claim 1.   The optical coupling device according to claim 1, wherein the first electrode lead portion and the second electrode lead portion are formed on the same lead frame. A first electrode lead portion having a first mount bed on one side and a second electrode lead portion having a second mount bed on one side;
The tip end of the first mount bed and the tip end of the second mount bed are arranged to face each other, the other of the first electrode lead portions extends to the opposite side of the second mount bed, and the second electrode lead portion The other of the lead frame extends to the opposite side of the first mount bed, is folded back to the first mount bed side in the middle, and extends to the outside of the first mount bed.   The front end of the first mount bed and the front end of the second mount bed are arranged opposite to each other, and the other end of the first electrode lead portion extends toward the second mount bed, and the first mount is halfway Folded to the bed side and extended outward from the first mount bed, the other of the second electrode lead portions extended to the first mount bed side, bent halfway in the shape of a crank, and from the first mount bed The lead frame according to claim 4, wherein the lead frame extends outward.

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