JP2008098563A - Element substrate and manufacturing method thereof - Google Patents

Abstract

An element substrate on which a metal layer is accurately formed and a method for manufacturing the element substrate are provided.
An element substrate manufacturing method according to the present invention includes a step of forming a release layer on a first support substrate, a step of forming a metal layer 33 having a predetermined pattern on the release layer, A step of disposing the second support substrate 110 above the first support substrate 10 so as to be sandwiched, a step of pouring the resin material 114a in a fluid state between the first support substrate and the second support substrate, and a resin A step of forming a resin substrate 114 by curing the material, a step of separating the metal layer from the first support substrate by decomposing the release layer, and transferring the back surface of the resin substrate to the resin substrate. Polishing.
[Selection] Figure 15

Description

  The present invention relates to an element substrate and a manufacturing method thereof.

When forming a metal wiring or the like on the substrate, it is formed by, for example, a subtractive method. In the subtractive method, a metal layer is formed on the entire surface of the substrate, a photoresist is applied on the metal layer and patterned, and the metal layer is etched using the photoresist as a mask. In such a method, consumption of resources and materials may be a problem in that the photoresist is finally removed and the amount of removal of the metal layer is large.
Japanese Patent Laid-Open No. 10-65315

  An object of the present invention is to provide an element substrate on which a metal layer is accurately formed and a method for manufacturing the same.

The element substrate manufacturing method according to the present invention includes:
(A) forming a release layer on the first support substrate;
(B) forming a metal layer having a predetermined pattern on the release layer;
(C) disposing a second support substrate above the first support substrate so as to sandwich the metal layer;
(D) pouring a fluid resin material between the first support substrate and the second support substrate;
(E) curing the resin material to form a resin substrate;
(F) disassembling the release layer to release the metal layer from the first support substrate and transferring it to the surface of the resin substrate;
(G) polishing the back surface of the resin substrate;
including.

The element substrate manufacturing method according to the present invention includes:
(A) forming a release layer on the first support substrate;
(B) forming a metal layer having a predetermined pattern on the release layer;
(D) applying a sol-gel solution containing a raw material for the inorganic substrate on the first support substrate;
(E) removing the solvent of the sol-gel solution by performing a heat treatment to form an inorganic substrate;
(F) decomposing the release layer to release the metal layer from the first support substrate and transferring it to the surface of the inorganic substrate;
(G) polishing the back surface of the inorganic substrate;
including.

In the manufacturing method of the element substrate according to the present invention,
After step (f)
The method may further include a step of polishing the surface of the resin substrate or the inorganic substrate.

In the manufacturing method of the element substrate according to the present invention,
In the step (b),
The metal layer can be formed using an electroless plating method.

In the manufacturing method of the element substrate according to the present invention,
In the step (a),
By immersing the first support substrate in a surfactant solution, a surfactant layer is formed as the release layer,
The step (b)
Forming a catalyst layer on the release layer by immersing the first support substrate in a catalyst solution;
Depositing a metal layer on the catalyst layer by immersing the first support substrate in an electroless plating solution;
Can have.

In the manufacturing method of the element substrate according to the present invention,
Before the step (a),
(H) further comprising the step of forming the resin molded body of the predetermined pattern on the first support substrate;
In the step (a),
The release layer can be formed on the resin molded body.

In the manufacturing method of the element substrate according to the present invention,
The step (h)
Applying a fluid resin material to the first support substrate;
Pressing a nanostamper having a concave pattern of a predetermined pattern onto the substrate, and transferring the predetermined pattern to the resin material;
Curing the resin material;
Can be included.

In the manufacturing method of the element substrate according to the present invention,
Between the steps (h) and (a),
By ashing, the resin material in the upper part of the cured resin material and the region other than the predetermined pattern can be removed.

In the manufacturing method of the element substrate according to the present invention,
The resin molded body is made of a photoresist,
In the step (h), the resin molded body can be formed using an interference exposure method.

In the manufacturing method of the element substrate according to the present invention,
Between the steps (h) and (a),
The method may further include a step of removing a part of the resin molded body by immersing the first support substrate in an alkaline solution.

The element substrate according to the present invention is
A substrate having a through hole;
A metal layer formed inside the through hole;
A recess is formed on the upper surface of the metal layer.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

1. Element Substrate and Manufacturing Method Thereof FIGS. 1 to 17 are diagrams showing a method for manufacturing the element substrate 100 (see FIG. 18). In this embodiment, an element substrate is manufactured by applying electroless plating.

  (1) First, the first support substrate 10 is prepared. The surface of the first support substrate 10 preferably has no irregularities, and for example, the height of the irregularities is preferably less than 10 nm.

  Next, a resin molded body 22 c having a predetermined pattern is formed on the first support substrate 10. As a method of forming the resin molded body 22c, a known method can be used. For example, an interference exposure method or a nanoimprint technique can be used. In the present embodiment, a case where the resin molded body 22c is formed using the nanoimprint technique will be described.

  First, as shown in FIG. 1, a fluidized resin material 22 a is applied to the first support substrate 10. As the resin material 22a, a thermosetting resin, a thermoplastic resin, a photocurable resin, or the like can be used. As a coating method, a known method such as a spin coating method can be used.

  Next, a predetermined pattern is transferred to the resin material by pressing the nano stamper 12 in the direction of the first support substrate 10 (in the direction of the arrow in FIG. 2). Here, the predetermined pattern may be a periodic pattern of a plurality of lines arranged at regular intervals. When the resin material 22a is a photocurable resin, the nano stamper 12 may be a light transmissive material.

  Next, the resin molded body 22b is cured, and the nano stamper 12 is peeled from the resin molded body 22b (see FIG. 3). In this way, as shown in FIG. 4, a resin molded body 22b having a predetermined pattern can be formed.

  The resin molded body 22b may be used to proceed to step (2) to be described later. However, as shown in FIG. 5, a part of the resin molded body 22b in the gap of the predetermined pattern may be removed by etching back or the like. When the resin molded body 22b is made of a photoresist, a part thereof may be removed by ashing. Here, together with a part of the resin molded body 22b in the gap of the predetermined pattern, the upper part of the resin molded body 22b in the area of the predetermined pattern is also removed. The resin molded body 22c can be formed through this removal step.

  Although the method for forming the resin molded body 22c using the nanoimprint technique is as described above, the resin molded body 22c can also be formed using the interference exposure method as described above. When the interference exposure method is used, it is preferable to apply a photoresist as the resin material 22a and to provide an antireflection film on the first support substrate 10 in advance.

  (2) Next, the surfaces of the first support substrate 10 and the resin molded body 22c are cleaned. The cleaning of the surfaces of the first support substrate 10 and the resin molded body 22c may be dry cleaning or wet cleaning, but dry cleaning is more preferable. By performing dry cleaning, damage to the resin molded body 22c such as peeling can be prevented.

  As shown in FIG. 6, the dry cleaning is performed by irradiating the vacuum ultraviolet rays 20 for 30 seconds to 900 seconds in a nitrogen atmosphere using a vacuum ultraviolet lamp (wavelength 172 nm, output 10 mW, distance between samples 1 mm) 18. be able to. By cleaning the first support substrate 10, dirt such as oil and fat adhering to the surface of the first support substrate 10 can be removed. Moreover, the surface of the 1st support substrate 10 and the resin molding 22c can be changed from water repellency to hydrophilicity. In addition, if the surface potential in liquid of the first support substrate 10 is a negative potential, a uniform negative potential surface can be formed by cleaning the first support substrate 10.

  The wet cleaning can be performed, for example, by immersing the first support substrate 10 in ozone water (ozone concentration: 10 ppm to 20 ppm) at room temperature for about 5 minutes to 30 minutes.

  (3) Next, a release layer 24 containing a surfactant or a silane coupling agent is formed on the resin molded body 22c.

  First, as shown in FIG. 7, the first support substrate 10 is immersed in a catalyst adsorption solution 14 in which a surfactant or a silane coupling agent is dissolved. When the surface potential in liquid on the surface of the first support substrate 10 is negative, it is preferable to apply a cationic surfactant. This is because the cationic surfactant is more easily adsorbed to the first support substrate 10 than other surfactants.

  Examples of cationic surfactants include water-soluble surfactants containing aminosilane components and alkylammonium surfactants (eg, cetyltrimethylammonium chloride, cetyltrimethylammonium bromide, cetyldimethylammonium bromide, etc.). Can be used. As the silane coupling agent contained in the catalyst adsorption solution 14, for example, hexamethyldisilazane can be used. The immersion time can be set to, for example, about 1 minute to 15 minutes.

  Next, the first support substrate 10 is taken out from the catalyst adsorption solution 14 and washed with ultrapure water. Thereafter, the first support substrate 10 is naturally dried at room temperature, for example, or sprayed with compressed air to remove water droplets, and then left in an oven at 90 ° C. to 120 ° C. for about 10 minutes to 1 hour for drying. Let Through the above steps, the release layer 24 can be provided on the first support substrate 10 as shown in FIG. At this time, when a cationic surfactant is applied as the surfactant, the surface potential in liquid of the first support substrate 10 is shifted to the positive potential side than before the adsorption.

  Further, by immersing the first support substrate 10 in the catalyst adsorption solution 14, a part of the resin molded body 22c is removed, and the shape shown in FIG. 8 is obtained. Specifically, the resin molded body 22c is partially removed so that the outer portion that contacts the catalyst adsorption solution 14 is scraped. When the catalyst adsorption solution 14 is an alkaline solution, for example, when pH 11 to pH 12 is indicated, a part of the resin molded body 22c can be dissolved and partly removed. In this way, the size of the resin molded body 22c can be changed. Therefore, the size of the resin molded body 22c can be controlled by adjusting the immersion time and pH of the first support substrate 10 in the catalyst adsorption solution 14.

  (4) Next, the catalyst layer 31 is formed on the first support substrate 10. First, as shown in FIG. 9, the first support substrate 10 is immersed in the catalyst solution 30. The catalyst solution 30 includes a catalyst component that functions as a catalyst for electroless plating. As the catalyst component, for example, palladium can be used.

For example, the catalyst solution 30 can be produced by the following procedure.
(4a) Palladium pellets having a purity of 99.99% are dissolved in a mixed solution of hydrochloric acid, hydrogen peroxide solution, and water to obtain a palladium chloride solution having a palladium concentration of 0.1 to 0.5 g / l.
(4b) The palladium chloride solution is further diluted with water and hydrogen peroxide solution to adjust the palladium concentration to 0.01 to 0.05 g / l.
(4c) The pH of the palladium chloride solution is adjusted to 4.5 to 6.8 using an aqueous sodium hydroxide solution or the like.

  After immersing in the catalyst solution 30, the first support substrate 10 may be washed with water. The washing with water can be performed with pure water. This washing with water can prevent catalyst residues from being mixed into the electroless plating solution described later.

  Through the above steps, the catalyst layer 31 is formed. As shown in FIG. 10, the catalyst layer 31 is formed on the upper surfaces of the first support substrate 10 and the release layer 24 on the resin molded body 22.

  (5) Next, the metal layer 33 is formed on the substrate. The metal layer 33 is formed in a region where the catalyst layer 31 is formed. Specifically, as shown in FIG. 11, the metal layer 33 can be deposited by immersing the first support substrate 10 in an electroless plating solution 36 containing a metal. Here, the electroless plating solution 36 is preferably adjusted so that the average particle diameter of the plating particles is 20 nm to 50 nm when deposited as plating particles on the first support substrate 10. Such an electroless plating solution 36 can be adjusted by changing pH, temperature, adjustment time, and the like. In addition, when the immersion time of the first support substrate 10 in the electroless plating solution 36 is a certain time or more, the average particle diameter of the plating particles becomes larger than 50 nm, so that the immersion time may be within a certain time. preferable.

  The metal can be nickel, for example. The electroless plating solution 36 includes an acid type and an alkaline type. As an example of the electroless plating solution 36, an acid type is used. The electroless plating solution 36 includes the above-described metal, a reducing agent, a complexing agent, and the like. Specifically, as the electroless plating solution 36, a solution mainly composed of nickel sulfate hexahydrate or nickel chloride hexahydrate and containing sodium hypophosphite as a reducing agent can be used. For example, a nickel layer having a thickness of 20 nm to 100 nm is formed by immersing the first support substrate 10 for about 10 seconds to 10 minutes in an electroless plating solution (temperature 70 to 80 ° C.) containing nickel sulfate hexahydrate. Can be formed.

  Thus, as shown in FIG. 12, the metal layer 33 can be formed on the upper surface of the catalyst layer 31 on the first support substrate 10.

  After the immersion in the electroless plating solution, the first support substrate 10 may be washed with water. The washing with water may be performed with pure water, may be performed with steam, or may be performed with both pure water and steam. Further, after washing with water, the first support substrate 10 may be dried by heat treatment. As a result, the adhesion of the metal layer 33 to the first support substrate 10 can be improved. Through the above steps, the transfer substrate 130 can be formed as shown in FIG.

  Here, the transfer substrate 130 will be described. The metal layer 33 of the transfer substrate 130 is formed above and on the side surface of the resin molded body 22. The resin molded body 22 can function as a core of the metal layer 33. The metal layer 33 may be formed in a gap between the resin molded bodies 22, that is, in a region other than the predetermined pattern. In the manufacturing process of the transfer substrate 130 described above, the thickness of the metal layer 33 above the resin molded body 22 can be made larger than the thickness of the metal layer 33 in a region other than the predetermined pattern. Specifically, it is assumed as follows.

  In the manufacturing process of the transfer substrate 130, the metal layer 33 is deposited by immersing the first support substrate 10 in the electroless plating solution 36. The metal layer 33 is formed by an electroless plating reaction. The electroless plating reaction is a reduction reaction between a reducing agent and metal ions in the electroless plating solution, and is a reaction in which plated particles are deposited when the metal ions receive electrons from the reducing agent. Since this reaction is promoted by the catalyst contained in the catalyst layer 31, it mainly proceeds in the vicinity of the catalyst layer 31. In the electroless plating solution, since a plurality of metal ions are present as an aggregate, plating particles that are an aggregate of a plurality of metal atoms are deposited by a reduction reaction. The size of the aggregate of the plurality of metal ions can be controlled by the pH, temperature, time, etc. of the electroless plating solution.

  In the present embodiment, the plating particles in the electroless plating solution 36 enter between the resin molded bodies 22, thereby depositing the metal layer 33 in the gaps between the resin molded bodies 22, that is, regions other than the predetermined pattern. Can do. The electroless plating solution 36 present above the resin molded body 22 is richer in fluidity than the electroless plating solution 36 that has entered between the resin molded bodies 22. Therefore, the electroless plating solution 36 in the vicinity of the upper portion of the resin molded body 22 is rich in fluidity even when metal ions are used for deposition, so that the concentration of metal ions can be in a substantially constant state. . In contrast, the electroless plating solution 36 between the resin molded bodies 22 has a low metal ion concentration after the metal ions are deposited as the metal layer 33, and therefore the deposition rate of the metal layer 33 is low. Become. Therefore, according to the method for manufacturing the transfer substrate 130 according to the present embodiment, the film thickness of the metal layer 33 above the resin molded body 22 is made larger than the film thickness of the metal layer 33 in a region other than the predetermined pattern. Can do.

  (6) Next, the second support substrate 110 is disposed above the transfer substrate 130. As shown in FIG. 13, the second support substrate 110 is disposed above the first support substrate 10 with the metal layer 33 interposed therebetween. A spacer 112 is provided between the first support substrate 10 and the second support substrate 110. The spacer 112 is provided around the area where the resin molded body 22 is formed. By providing the spacer 112 in this way, a resin material 114a described later can be held on the first support substrate 10.

  Next, a fluidized resin material 114 a is poured between the first support substrate 10 and the second support substrate 110. The resin material 114a is preferably filled without a gap between the metal layer 33 and the second support substrate 110. As the resin material 114a, a thermosetting resin, a thermoplastic resin, a photocurable resin, or the like can be used. In this embodiment, the case where a photocurable resin is applied will be described below.

  (7) Next, the resin material 114a is cured to form the resin substrate 114. In this embodiment mode, the resin material 114a is irradiated with light to be cured. At this time, the metal layer 33, the catalyst layer 31, the release layer 24, and the resin molded body 22 are embedded in the resin substrate 114 (see FIG. 14).

  (8) Next, the peeling layer 24 is disassembled. The release layer 24 is decomposed by, for example, immersing the first support substrate 10 and the release layer 24 in an alkaline aqueous solution. The aqueous alkali solution used here is not particularly limited as long as it can dissolve the release layer 24, and may be, for example, an aqueous sodium hydroxide solution. In addition, the release layer 24 may be decomposed by irradiating the release layer 24 with vacuum ultraviolet (VUV) using a vacuum ultraviolet lamp 118. By setting the wavelength of the light of the vacuum ultraviolet ray 120 to, for example, 170 nm to 260 nm, an interatomic bond (for example, C—C, C═C, C—H, C—F, C—Cl, C—O, C— N, C = O, O = O, OH, HF, H-Cl, NH, etc.). By using this wavelength band, equipment such as a yellow room becomes unnecessary, and a series of steps according to the present embodiment can be performed under a white light, for example.

  By decomposing the release layer 24 in this manner, the metal layer 33 can be peeled from the first support substrate 10 as shown in FIG. At this time, the resin molded body 22 may be peeled off from the first support substrate 10. In such a case, the first element substrate 200 having the metal layer 33 with a predetermined pattern on the upper surface of the resin substrate 114 may be formed by removing the resin molded body 22 by dry etching using oxygen, for example. Yes (see FIG. 16).

  Here, the metal layer 33 may be formed not only in the hole 202 but also in a non-formation region. At this time, a recess 204 is further formed on the upper surface of the metal layer 33. As shown in FIG. 16, the recess 204 is formed in the upper portion of the hole 202 described above, and is smaller in both width and depth than the hole 202. The thickness of the metal layer 33 in the region where the hole 202 is not formed is smaller than the thickness of the metal layer 33 in the region where the hole 202 is formed.

  (9) Next, a part of the metal layer 33 may be removed by polishing the upper surface of the first support substrate 10 (see FIG. 17). Here, the part of the metal layer 33 is the upper part of the metal layer 33, for example, the metal layer 33 formed outside the hole 202. Polishing can be performed, for example, by CMP (Chemical Mechanical Polishing). Thus, by polishing the upper surface of the first support substrate 10, the metal layer 34 can be disconnected from the adjacent metal layer 34.

  Next, the back surface of the first support substrate 10 is polished. Here, the polishing is performed until the metal layer 34 is exposed. Thereby, the resin substrate 114 can be penetrated through the hole 202. Polishing can be performed by CMP in the same manner as the upper surface of the first support substrate 10.

  Through the above steps, the element substrate 100 can be formed as shown in FIG. The element substrate 100 includes a resin substrate 114 and a metal layer 34. The metal layer 34 is different from the metal layer 33 described above in that it is disconnected from the adjacent metal layer 34. That is, since the metal layer 34 is formed only in the hole 202 and embedded, it prevents the adjacent metal layers 34 from contacting each other when the element substrate 100 is bent. can do.

  The metal layer 34 is exposed on both the upper surface and the lower surface of the element substrate 100. Thereby, both the upper surface and the lower surface of the element substrate 100 can be electrically connected to an external wiring or the like, which can contribute to the realization of the miniaturization of the element.

  The metal layer 34 has a predetermined pattern. The predetermined pattern can be, for example, a one-dimensional or two-dimensional periodic pattern. The element substrate 100 can function as an optical element substrate such as a polarizing plate by having a predetermined pattern on the light transmissive substrate. For example, the element substrate 100 may be a one-dimensional periodic pattern (stripe shape) in which linear metal layers having a constant interval and a constant width are repeatedly provided. When the width in the periodic direction is less than or equal to the wavelength of visible light and the resin substrate 114 is made of a light transmissive substrate, the element substrate 100 can function as a polarizing plate.

2. Electronic Device FIG. 19 shows an example of an electronic device to which the element substrate 100 manufactured by the element substrate manufacturing method according to the present embodiment is applied. When the first support substrate 10 is an insulating substrate, the element substrate 100 can function as a wiring substrate. The electronic device 1000 includes an element substrate 100 as a wiring substrate, an integrated circuit chip 90, and another substrate 92.

  The wiring pattern formed on the element substrate 100 may be for electrically connecting electronic components. The element substrate 100 is manufactured by the manufacturing method described above. In the example shown in FIG. 19, an integrated circuit chip 90 is electrically connected to the element substrate 100, and one end of the element substrate 100 is electrically connected to another substrate 92 (for example, a display panel). Yes. The electronic device 1000 may be a display device such as a liquid crystal display device, a plasma display device, or an EL (Electro luminescence) display device.

  In addition, the element substrate 100 as an optical element substrate may function as a polarizing plate for a liquid crystal display device, a projector device, or the like.

3. Other Embodiments Next, a method for manufacturing an element substrate according to another embodiment will be described. In step (6) of the element substrate manufacturing method according to the present embodiment, a resin material 114a is poured between the first support substrate 10 and the second support substrate 110, and the resin material 114a is cured to be a resin. Although the substrate 114 is formed, instead of this, a sol-gel solution 115a may be applied to the upper surface of the transfer substrate 130 as shown in FIG.

  As the coating method, for example, a spin coating method can be applied. As the sol-gel solution 115a, a metal alkoxide containing tetraethoxysilane (TEOS), trimethoxysilane (TMS), titanium isopropoxide, or the like can be used.

  After the application of the sol-gel solution 115a, heat treatment is performed. Thereby, the solvent in the sol-gel solution 115a can be removed, and an inorganic substrate can be obtained. Here, the process of obtaining the glass substrate 115 (inorganic substrate) by heating the sol-gel solution 114a containing TEOS will be specifically described. The heat treatment is performed in two stages. First, the sol-gel solution 115a is heated to 150 ° C. Thereafter, by further heating to 400 ° C. or higher, the release layer 24 is decomposed, and the sol-gel solution 115a is baked to obtain the glass substrate 115.

  By disassembling the peeling layer 24 in this manner, the metal layer 33 can be peeled from the first support substrate 10 as shown in FIG. At this time, the metal layer 33 and the catalyst layer 31 are embedded in the glass substrate 115.

  After the formation of the glass substrate 115, the above-described step (9) is performed. Thereby, the element substrate concerning other embodiment can be manufactured. The element substrate includes a glass substrate 115 and a metal layer 34, and is the same as the element substrate 100 according to the present embodiment except that the glass substrate 115 is applied instead of the resin substrate 114. Description is omitted.

  The present invention is not limited to the above-described embodiments, and various modifications can be made.

  For example, in the above-described step (3), the resin molded body 22 is formed by immersing the first support substrate 10 in the catalyst adsorption solution 14 to change the shape of the resin molded body 22c. In addition, before the step (3), that is, before the first support substrate 10 is immersed in the catalyst adsorption solution 14, the first support substrate 10 may be separately immersed in an alkaline solution. Thereby, since the peeling layer 24 can be formed after forming the resin molded body 22 having a desired shape, a fine pattern can be formed with higher accuracy.

  In the above-described step (5), the metal layer 33 is formed above the resin molded body 22, but instead, the metal layer 33 may be formed in a non-formation region of the resin molded body 22. . Specifically, after the resin molded body 22c is formed, the release layer 24 and the catalyst layer 31 are provided by the method described above, and the resin molded body 22c is removed. As a result, the catalyst layer 31 is formed only in the non-formation region of the resin molded body 22c. Next, the first support substrate 10 is immersed in the electroless plating solution. Through the above steps, the metal layer 33 can be formed on the upper surface of the catalyst layer 31 (non-formation region of the resin molded body 22). Since the subsequent steps are as described above, description thereof will be omitted.

  Further, the invention includes substantially the same configuration (for example, a configuration having the same function, method, and result, or a configuration having the same purpose and result) as the configuration described in the embodiment. In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. The figure which shows the manufacturing method of the element substrate concerning this Embodiment. Sectional drawing which shows the element substrate concerning this Embodiment. The figure which shows an example of the electronic device to which the element substrate concerning this Embodiment is applied. The figure which shows the manufacturing method of the element substrate concerning other embodiment. The figure which shows the manufacturing method of the element substrate concerning other embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 1st support substrate, 12 nano stamper, 14 catalyst adsorption solution, 18 light source, 20 light, 22, 22b, 22c resin molding, 22a resin material, 24 peeling layer, 30 catalyst solution, 31 catalyst layer, 33, 34 metal Layer, 36 electroless plating solution, 90 integrated circuit chip, 92 other substrate, 100 element substrate, 112 spacer, 114a resin material, 114 resin substrate, 115 glass substrate, 115a sol-gel solution, 118 vacuum ultraviolet lamp, 120 vacuum ultraviolet ray, 130 Transfer substrate, 1000 Electronic device

Claims (11)

(A) forming a release layer on the first support substrate;
(B) forming a metal layer having a predetermined pattern on the release layer;
(C) disposing a second support substrate above the first support substrate so as to sandwich the metal layer;
(D) pouring a fluid resin material between the first support substrate and the second support substrate;
(E) curing the resin material to form a resin substrate;
(F) disassembling the release layer to release the metal layer from the first support substrate and transferring it to the surface of the resin substrate;
(G) polishing the back surface of the resin substrate;
A method for manufacturing an element substrate. (A) forming a release layer on the first support substrate;
(B) forming a metal layer having a predetermined pattern on the release layer;
(D) applying a sol-gel solution containing a raw material for the inorganic substrate on the first support substrate;
(E) removing the solvent of the sol-gel solution by performing a heat treatment to form an inorganic substrate;
(F) decomposing the release layer to release the metal layer from the first support substrate and transferring it to the surface of the inorganic substrate;
(G) polishing the back surface of the inorganic substrate;
A method for manufacturing an element substrate. In claim 1 or 2,
After step (f)
A method for manufacturing an element substrate, further comprising a step of polishing a surface of the resin substrate or the inorganic substrate. In any of claims 1 to 3,
In the step (b),
A method for manufacturing an element substrate, wherein the metal layer is formed using an electroless plating method. In claim 4,
In the step (a),
By immersing the first support substrate in a surfactant solution, a surfactant layer is formed as the release layer,
The step (b)
Forming a catalyst layer on the release layer by immersing the first support substrate in a catalyst solution;
Depositing a metal layer on the catalyst layer by immersing the first support substrate in an electroless plating solution;
A method for manufacturing an element substrate. In claim 5,
Before the step (a),
(H) further comprising the step of forming the resin molded body of the predetermined pattern on the first support substrate;
In the step (a),
A method for manufacturing an element substrate, wherein the release layer is formed on the resin molded body. In claim 6,
The step (h)
Applying a fluid resin material to the first support substrate;
Pressing a nanostamper having a concave pattern of a predetermined pattern onto the substrate, and transferring the predetermined pattern to the resin material;
Curing the resin material;
A method for manufacturing an element substrate. In claim 7,
Between the steps (h) and (a),
A method for manufacturing an element substrate, wherein the resin material in an upper portion of the cured resin material and a region other than the predetermined pattern is removed by ashing. In claim 6,
The resin molded body is made of a photoresist,
In the step (h), the element substrate is formed by using an interference exposure method. In any of claims 6 to 9,
Between the steps (h) and (a),
A method for manufacturing an element substrate, further comprising the step of removing a part of the resin molded body by immersing the first support substrate in an alkaline solution. A substrate having a through hole;
A metal layer formed inside the through hole;
An element substrate having a recess formed on the upper surface of the metal layer.

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