JP2008088354A - Resin composition and cast molding method - Google Patents
Resin composition and cast molding method Download PDFInfo
- Publication number
- JP2008088354A JP2008088354A JP2006273132A JP2006273132A JP2008088354A JP 2008088354 A JP2008088354 A JP 2008088354A JP 2006273132 A JP2006273132 A JP 2006273132A JP 2006273132 A JP2006273132 A JP 2006273132A JP 2008088354 A JP2008088354 A JP 2008088354A
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- Prior art keywords
- group
- meth
- acrylate
- resin composition
- linear
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000000465 moulding Methods 0.000 title abstract description 16
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 82
- -1 amine compound Chemical class 0.000 claims abstract description 54
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229920000728 polyester Polymers 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 23
- 125000000217 alkyl group Chemical group 0.000 claims description 22
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 15
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 13
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 13
- 239000003999 initiator Substances 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 7
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 claims description 6
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 238000002156 mixing Methods 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000005577 anthracene group Chemical group 0.000 claims description 3
- 238000005266 casting Methods 0.000 claims description 3
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 claims description 3
- 125000001624 naphthyl group Chemical group 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 230000007062 hydrolysis Effects 0.000 abstract description 9
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 9
- 238000013329 compounding Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 239000000047 product Substances 0.000 description 26
- 229920001971 elastomer Polymers 0.000 description 18
- 239000000203 mixture Substances 0.000 description 12
- 239000000806 elastomer Substances 0.000 description 11
- 229920005906 polyester polyol Polymers 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 238000001723 curing Methods 0.000 description 10
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 7
- 239000005060 rubber Substances 0.000 description 7
- 229920002725 thermoplastic elastomer Polymers 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000178 Acrylic resin Polymers 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 6
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- RLHGFJMGWQXPBW-UHFFFAOYSA-N 2-hydroxy-3-(1h-imidazol-5-ylmethyl)benzamide Chemical compound NC(=O)C1=CC=CC(CC=2NC=NC=2)=C1O RLHGFJMGWQXPBW-UHFFFAOYSA-N 0.000 description 5
- 244000043261 Hevea brasiliensis Species 0.000 description 5
- 238000010276 construction Methods 0.000 description 5
- 230000001678 irradiating effect Effects 0.000 description 5
- 229920003052 natural elastomer Polymers 0.000 description 5
- 229920001194 natural rubber Polymers 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 5
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 4
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 4
- VDVUCLWJZJHFAV-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1 VDVUCLWJZJHFAV-UHFFFAOYSA-N 0.000 description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 4
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000007795 chemical reaction product Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- QVASUALUCOYWST-UHFFFAOYSA-N tetramethyl butane-1,2,3,4-tetracarboxylate Chemical compound COC(=O)CC(C(=O)OC)C(C(=O)OC)CC(=O)OC QVASUALUCOYWST-UHFFFAOYSA-N 0.000 description 4
- 238000007666 vacuum forming Methods 0.000 description 4
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 229920000578 graft copolymer Polymers 0.000 description 3
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 229910052724 xenon Inorganic materials 0.000 description 3
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 3
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 2
- CEXQWAAGPPNOQF-UHFFFAOYSA-N 2-phenoxyethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOC1=CC=CC=C1 CEXQWAAGPPNOQF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 0 C[N+]([N-])[N+]([O-])O* Chemical compound C[N+]([N-])[N+]([O-])O* 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- LFOXEOLGJPJZAA-UHFFFAOYSA-N [(2,6-dimethoxybenzoyl)-(2,4,4-trimethylpentyl)phosphoryl]-(2,6-dimethoxyphenyl)methanone Chemical compound COC1=CC=CC(OC)=C1C(=O)P(=O)(CC(C)CC(C)(C)C)C(=O)C1=C(OC)C=CC=C1OC LFOXEOLGJPJZAA-UHFFFAOYSA-N 0.000 description 2
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 description 2
- RSOILICUEWXSLA-UHFFFAOYSA-N bis(1,2,2,6,6-pentamethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 RSOILICUEWXSLA-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
- 229920005558 epichlorohydrin rubber Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- WUPCFMITFBVJMS-UHFFFAOYSA-N tetrakis(1,2,2,6,6-pentamethylpiperidin-4-yl) butane-1,2,3,4-tetracarboxylate Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OC(=O)CC(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)C(C(=O)OC1CC(C)(C)N(C)C(C)(C)C1)CC(=O)OC1CC(C)(C)N(C)C(C)(C)C1 WUPCFMITFBVJMS-UHFFFAOYSA-N 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- YEYCMBWKTZNPDH-UHFFFAOYSA-N (2,2,6,6-tetramethylpiperidin-4-yl) benzoate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)C1=CC=CC=C1 YEYCMBWKTZNPDH-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- NNOZGCICXAYKLW-UHFFFAOYSA-N 1,2-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC=C1C(C)(C)N=C=O NNOZGCICXAYKLW-UHFFFAOYSA-N 0.000 description 1
- JIHQDMXYYFUGFV-UHFFFAOYSA-N 1,3,5-triazine Chemical compound C1=NC=NC=N1 JIHQDMXYYFUGFV-UHFFFAOYSA-N 0.000 description 1
- AZYRZNIYJDKRHO-UHFFFAOYSA-N 1,3-bis(2-isocyanatopropan-2-yl)benzene Chemical compound O=C=NC(C)(C)C1=CC=CC(C(C)(C)N=C=O)=C1 AZYRZNIYJDKRHO-UHFFFAOYSA-N 0.000 description 1
- XSCLFFBWRKTMTE-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCCC(CN=C=O)C1 XSCLFFBWRKTMTE-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- WGYZMNBUZFHYRX-UHFFFAOYSA-N 1-(1-methoxypropan-2-yloxy)propan-2-ol Chemical compound COCC(C)OCC(C)O WGYZMNBUZFHYRX-UHFFFAOYSA-N 0.000 description 1
- XUIXZBXRQFZHIT-UHFFFAOYSA-N 1-[1-(1-hydroxypropan-2-yloxy)propan-2-yloxy]-3-methoxypropan-2-ol Chemical compound COCC(O)COC(C)COC(C)CO XUIXZBXRQFZHIT-UHFFFAOYSA-N 0.000 description 1
- GYSCBCSGKXNZRH-UHFFFAOYSA-N 1-benzothiophene-2-carboxamide Chemical compound C1=CC=C2SC(C(=O)N)=CC2=C1 GYSCBCSGKXNZRH-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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Landscapes
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Abstract
【課題】注型成形方法に好適な、瞬時に硬化可能で、適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れた光硬化性の樹脂組成物を提供する。
【解決手段】(1)(A)分子内にポリエステル骨格を有し、分子量が5,000〜100,000の範囲にあるウレタン(メタ)アクリレートオリゴマー、(B)単官能(メタ)アクリレート、さらに、(C)ヒンダードアミン化合物を含有し、(A)成分と(B)成分の配合比が、質量比で5:95〜95:5の範囲であり、(C)成分が(A)成分と(B)成分の合量100質量部に対して、0.01〜10質量部含有する樹脂組成物であることを特徴とする樹脂組成物。
【選択図】なしProvided is a photocurable resin composition that is suitable for a cast molding method, can be instantly cured, exhibits an appropriate elastic modulus and excellent elongation, and is excellent in hydrolysis resistance.
(1) (A) a urethane (meth) acrylate oligomer having a polyester skeleton in the molecule and having a molecular weight in the range of 5,000 to 100,000, (B) a monofunctional (meth) acrylate, , (C) a hindered amine compound, the compounding ratio of the component (A) and the component (B) is in the range of 5:95 to 95: 5 by mass ratio, and the component (C) is the component (A) and ( B) A resin composition containing 0.01 to 10 parts by mass with respect to 100 parts by mass of the total component.
[Selection figure] None
Description
本発明は、紫外線、可視光線等のエネルギー線照射(以下、単に「光照射」ともいう。)により硬化可能な光硬化性の樹脂組成物および硬化体に関し、詳しくは、光照射により瞬時に硬化可能で、適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れた光硬化性の樹脂組成物およびその硬化体に関し、更に、該樹脂組成物をエネルギー線の透過可能な材料で作成された型中に注入し、該型の外側より紫外線、可視光線等のエネルギー線照射することにより硬化させ、成形体を形成することを特徴とする注型成形方法に関する。 The present invention relates to a photocurable resin composition and a cured product that can be cured by irradiation with energy rays such as ultraviolet rays and visible rays (hereinafter, also simply referred to as “light irradiation”). The present invention relates to a photocurable resin composition and a cured product thereof, which exhibit an appropriate elastic modulus and excellent elongation, and also have excellent hydrolysis resistance. Further, the resin composition is capable of transmitting energy rays. It is related to a casting method characterized in that it is injected into the mold prepared in step (b) and cured by irradiation with energy rays such as ultraviolet rays and visible rays from the outside of the mold to form a molded body.
一般に柔軟性、伸縮性、弾性といった、所謂ゴム特性を与える組成物は、エラストマーと呼ばれ、柔軟性、伸び性が他の高分子素材と比較し抜きんでて優れており、さらに適度な弾性率を示すことから、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用部材、携帯電話用キーシート等のシート部材、防振材料、各種機構部材等として適用されている。 In general, a composition that imparts so-called rubber properties such as flexibility, stretchability, and elasticity is called an elastomer, which is superior in flexibility and elongation compared to other polymer materials, and has an appropriate elastic modulus. As shown, automobile members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, vibration-proof materials, various types It is applied as a mechanism member.
エラストマー(以下、記号Rで示す)としては、天然ゴム、変性天然ゴム、グラフト天然ゴム、環化天然ゴム、塩素化天然ゴム、スチレン−ブタジエンゴム、クロロプレンゴム、アクリロニトリル−ブタジエンゴム、カルボキシル化ニトリルゴム、アクリロニトリル−塩化ビニルゴム、アクリロニトリル−EPDMゴムのブレンド、ブチルゴム、臭素化ブチルゴム、塩素化ブチルゴム、エチレン−酢酸ビニルゴム、アクリルゴム、エチレン−アクリルゴム、クロロスルホン化ポリエチレン、塩素化ポリエチレン、エピクロルヒドリンゴム、エピクロルヒドリン−エチレンオキシドゴム、メチルシリコーンゴム、ビニル−メチルシリコーンゴム、フェニル−メチルシリコーンゴム、フッ化シリコーンゴム等のゴム材料、ポリスチレン系熱可塑性エラストマー、ポリ塩化ビニル系熱可塑性エラストマー、ポリオレフィン系熱可塑性エラストマー、ポリウレタン系熱可塑性エラストマー、ポリエステル系熱可塑性エラストマー、ポリアミド系熱可塑性エラストマー、塩化ビニル系熱可塑性エラストマー、フッ素ゴム系熱可塑性エラストマー、塩素化ポリエチレン系エラストマー等の熱可塑性エラストマー材料が知られている。 As elastomers (hereinafter denoted by symbol R), natural rubber, modified natural rubber, grafted natural rubber, cyclized natural rubber, chlorinated natural rubber, styrene-butadiene rubber, chloroprene rubber, acrylonitrile-butadiene rubber, carboxylated nitrile rubber , Acrylonitrile-vinyl chloride rubber, acrylonitrile-EPDM rubber blend, butyl rubber, brominated butyl rubber, chlorinated butyl rubber, ethylene-vinyl acetate rubber, acrylic rubber, ethylene-acrylic rubber, chlorosulfonated polyethylene, chlorinated polyethylene, epichlorohydrin rubber, epichlorohydrin- Rubber materials such as ethylene oxide rubber, methyl silicone rubber, vinyl-methyl silicone rubber, phenyl-methyl silicone rubber, fluorosilicone rubber, polystyrene-based thermoplastics Lastomer, Polyvinyl chloride thermoplastic elastomer, Polyolefin thermoplastic elastomer, Polyurethane thermoplastic elastomer, Polyester thermoplastic elastomer, Polyamide thermoplastic elastomer, Vinyl chloride thermoplastic elastomer, Fluoro rubber thermoplastic elastomer, Chlorination Thermoplastic elastomer materials such as polyethylene-based elastomers are known.
一般にエラストマー(R)の成形体を得る方法としては、硬化剤および他の添加剤を配合したエラストマー原料を充分に混練する混練り工程、そして、練り生地を真空成形法、圧空成形法、上型下型を一組とする成形型(以下、上下型という)による加熱加圧成形法、射出成形法等により成型し、加熱、加圧により加硫または硬化させる硬化工程(加硫工程)を経て、目的の成形体が得られている。 In general, as a method for obtaining a molded body of elastomer (R), a kneading step for sufficiently kneading an elastomer raw material containing a curing agent and other additives, and a kneaded dough for a vacuum forming method, a pressure forming method, an upper die After a curing process (vulcanizing process) in which the lower mold is molded by a heating mold and an injection molding process using a molding mold (hereinafter referred to as an upper and lower mold), vulcanized or cured by heating and pressing. The desired molded body is obtained.
しかしながら、前記の真空成形法、圧空成形法、上下型による加熱加圧成形法などでは、材料の融点付近まで金型温度を上げる必要があり、加熱のために膨大なエネルギーを必要とする。また、金型を冷却して取り出す必要があるので、成形サイクルに長時間費やすことになる。 However, in the vacuum forming method, the pressure forming method, the heat pressing method using the upper and lower molds, etc., it is necessary to raise the mold temperature to near the melting point of the material, and enormous energy is required for heating. Moreover, since it is necessary to cool and take out the metal mold, it takes a long time for the molding cycle.
射出成形法では、溶融した樹脂が温度差のある金型に接触した直後に冷却され流動性が極端に低下するので、薄肉の成型体を得ることが困難であり、加熱、射出、保圧等の工程上、設備も高額となる。また、熱可塑性材料を融点近くまで加熱するので、加熱エネルギーが膨大である。 In the injection molding method, the melted resin is cooled immediately after coming into contact with a mold having a temperature difference, and the fluidity is extremely reduced. Therefore, it is difficult to obtain a thin molded body, and heating, injection, holding pressure, etc. This makes the equipment expensive. Further, since the thermoplastic material is heated to near the melting point, the heating energy is enormous.
成形材料は、前記の真空成形法、圧空成形法、上下型による加熱加圧成形法などでは、目的の部品寸法より略大きな平面材料を成形した後、部品部分を切り出して使用することとなるため、廃棄物が多く発生し、環境的、経済的に好ましくない。 In the above-mentioned vacuum forming method, pressure forming method, heating and press forming method using upper and lower molds, etc., the molding material is formed by molding a planar material that is substantially larger than the target part size, and then cutting out the part part for use. A lot of waste is generated, which is not preferable environmentally and economically.
真空成形法、圧空成形法、上下型による加熱成形の上記構成材料は、一般的には均一な厚さの材料であるため、成形後は各部分で同じ厚さとなり、同一材料からは各部分の厚さを変えることが困難である。 The above-mentioned constituent materials of vacuum forming method, pressure forming method, and heat forming by upper and lower molds are generally materials of uniform thickness, so after forming, each part has the same thickness, and from the same material each part It is difficult to change the thickness.
加えて、工業的に製造されている厚さは限られており、それ以外の厚さの材料を得ることは、通常困難である。成形時の延伸などの処理により、厚さを変える方法も提案されているが、成形後の内部応力歪みが大きくなる等の問題が発生する。 In addition, the thickness produced industrially is limited, and it is usually difficult to obtain materials with other thicknesses. A method of changing the thickness by a process such as stretching at the time of molding has also been proposed, but problems such as increased internal stress distortion after molding occur.
上記の様な成形法の課題を解決する手段として、特許文献1〜3に記載されているようなエネルギー線透過可能な材料で作成した型中にエネルギー線硬化性液状物質を注入または充填し、紫外線、可視光線等のエネルギー線照射することにより硬化させ、成形体を形成する光硬化注型成形法が挙げられる。
特に特許文献3に記載の成型法は、上型と下型を用いることにより、型を破壊することなく成形体を得ることができ、同じ型で繰り返し成形体を製造することができる。 In particular, the molding method described in Patent Document 3 can obtain a molded body without destroying the mold by using an upper mold and a lower mold, and can repeatedly produce a molded body with the same mold.
より詳しくは、上型、下型よりなる一組の成形型の少なくともいずれか一方を光が透過する材料にて形成し、かつ光照射により硬化可能な樹脂をセットして型を閉じ、光を透過する型の外側から光を照射し、樹脂を硬化させて目的形状の硬化体を得る方法であり、この方法により、少ないエネルギーおよび少ない工数で、任意の厚みの成形体を容易かつ安価に製造することが可能となる。 More specifically, at least one of a pair of molds composed of an upper mold and a lower mold is formed of a material that transmits light, and a resin that can be cured by light irradiation is set to close the mold, This is a method of irradiating light from the outside of the mold to transmit and curing the resin to obtain a cured body of the desired shape. By this method, a molded body of any thickness can be easily and inexpensively produced with less energy and fewer man-hours. It becomes possible to do.
しかしながら、上記の光硬化注型成形法に適する成形性を有し、得られる硬化体が従来のエラストマーに要求される適度な弾性率、且つ伸び性を満たす樹脂組成物は知られていない。光硬化可能なエラストマーまたはゴム弾性を示す樹脂組成物として、特許文献4〜6が開示されているが、特許文献4および特許文献5に記載のシーリング材用樹脂組成物、また、特許文献6に記載の光学的立体造形用樹脂組成物は、上記の光硬化注型成形に要求される成形性とエラストマーに要求される適度な弾性率と伸び性とを満足するものではなかった。
本発明は、公知技術の事情に鑑みてなされたもので、紫外線、可視光線等の光照射により硬化可能な光硬化性の樹脂組成物および硬化体に関し、詳しくは、光照射により瞬時に硬化可能で、適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れた光硬化性の樹脂組成物およびその硬化体を提供し、更に、該樹脂組成物をエネルギー線の透過可能な材料で作成された型中に注入し、該型の外側より紫外線、可視光線等のエネルギー線照射することにより硬化させ、成形体を形成することを特徴とする注型成形方法を提供するものである。 The present invention has been made in view of the state of the art, and relates to a photocurable resin composition and a cured body that can be cured by irradiation with light such as ultraviolet rays and visible light, and more specifically, can be instantaneously cured by irradiation with light. The present invention provides a photo-curable resin composition and a cured product thereof, which exhibit an appropriate elastic modulus and excellent elongation, and are further excellent in hydrolysis resistance, and are capable of transmitting energy rays through the resin composition. A casting molding method is characterized in that it is injected into a mold made of a material and cured by irradiating energy rays such as ultraviolet rays and visible light from the outside of the mold to form a molded body. is there.
(1)(A)分子内に下記化式〔1〕で表されるポリエステル骨格を有し、分子量が5,000〜100,000の範囲にあるウレタン(メタ)アクリレートオリゴマー、
(式中、R1は炭素数1〜30の直鎖もしくは分岐もしくは環状のアルキル基、または、炭素数1〜30の直鎖もしくは分岐もしくは環状のアルコキシ基もしくはポリアルコキシ基であり、R2は炭素数1〜10の直鎖もしくは分岐もしくは環状のアルキル基、または、ベンゼン環、ナフタレン環、アントラセン環、又はフルオレン環から選ばれる芳香環を含む基であり、mは重合度を表す。)
(B)単官能(メタ)アクリレート、
さらに、
(C)下記化式〔2〕で表される基を有するヒンダードアミン化合物
を含有し、(A)成分と(B)成分の配合比が、質量比で5:95〜95:5の範囲であり、(C)成分が(A)成分と(B)成分の合量100質量部に対して、0.01〜10質量部含有する樹脂組成物であることを特徴とする樹脂組成物である。
(1) (A) a urethane (meth) acrylate oligomer having a polyester skeleton represented by the following chemical formula [1] in the molecule and having a molecular weight in the range of 5,000 to 100,000.
(Wherein R 1 is a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, or a linear, branched or cyclic alkoxy group or polyalkoxy group having 1 to 30 carbon atoms, and R 2 is C 1-10 linear or branched or cyclic alkyl group, or a group containing an aromatic ring selected from a benzene ring, naphthalene ring, anthracene ring, or fluorene ring, and m represents the degree of polymerization.)
(B) monofunctional (meth) acrylate,
further,
(C) A hindered amine compound having a group represented by the following chemical formula [2]
The mixing ratio of the component (A) and the component (B) is in the range of 5:95 to 95: 5 by mass ratio, and the component (C) is the total amount of the components (A) and (B). It is a resin composition containing 0.01 to 10 parts by mass with respect to 100 parts by mass.
(2)(B)単官能(メタ)アクリレートが下記化式〔3〕または〔4〕で表される単官能(メタ)アクリレートであることを特徴とする(1)に記載の樹脂組成物である。
(式中、R3は水素原子またはメチル基であり、R4は、炭素数1〜22である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基である。)
(式中、R3は水素原子またはメチル基であり、R5は、炭素数1〜4である直鎖もしくは分岐アルキル基、R6は、炭素数1〜4である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基であり、nは1〜12の整数である。)
(2) The resin composition according to (1), wherein the (B) monofunctional (meth) acrylate is a monofunctional (meth) acrylate represented by the following chemical formula [3] or [4]: is there.
(In the formula, R 3 is a hydrogen atom or a methyl group, and R 4 is substituted with a linear or branched alkyl group having 1 to 22 carbon atoms, a cyclohexyl group, or a linear or branched alkyl group having 1 to 4 carbon atoms. Cyclohexyl group, phenyl group, phenyl group substituted by a linear or branched alkyl group having 1 to 4 carbon atoms, dicyclopentanyl group, dicyclopentenyl group, bornyl group, isobornyl group, adamantyl group, methyladamantyl group Or an allyl group.)
(Wherein R 3 is a hydrogen atom or a methyl group, R 5 is a linear or branched alkyl group having 1 to 4 carbon atoms, and R 6 is a linear or branched alkyl group having 1 to 4 carbon atoms. A cyclohexyl group, a cyclohexyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a phenyl group, a phenyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a dicyclopentanyl group A dicyclopentenyl group, a bornyl group, an isobornyl group, an adamantyl group, a methyladamantyl group, or an allyl group, and n is an integer of 1 to 12.)
(3)(D)成分として、光重合開始剤を含有することを特徴とする(1)に記載の樹脂組成物である。 (3) The resin composition as described in (1), which contains a photopolymerization initiator as the component (D).
(4)(D)光重合開始剤がアシルホスフィンオキサイド化合物であることを特徴する(3)に記載の樹脂組成物である。 (4) The resin composition according to (3), wherein the photopolymerization initiator (D) is an acylphosphine oxide compound.
(5)(1)〜(4)のいずれかに記載の樹脂組成物からなる硬化体である。 (5) A cured product comprising the resin composition according to any one of (1) to (4).
(6)引張弾性率が1〜100MPaであり、しかも引張破壊伸びが200%以上である(5)の硬化体である。 (6) The cured product of (5) having a tensile modulus of 1 to 100 MPa and a tensile fracture elongation of 200% or more.
(7)(1)〜(4)のいずれかに記載の樹脂組成物を、エネルギー線の透過可能な材料で作成された型中に注入し、該型の外側よりエネルギー線照射することにより硬化させ、成形体を形成することを特徴とする注型成形方法である。 (7) The resin composition according to any one of (1) to (4) is injected into a mold made of a material capable of transmitting energy rays, and cured by irradiating energy rays from the outside of the mold. And forming a molded body.
本発明の樹脂組成物は、紫外線または可視光線等の光照射により極めて短時間に硬化し、その硬化体は適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れるという特性を有しているので、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用、携帯電話用キーシート等のシート部材、部材、防振材料、各種機構部材等に好適に使用できる。また、本発明の樹脂組成物は、土木、建築等の構造用シーリング剤、金属、マグネット、セラミックス、ガラス、プラスチック用の接着剤にも適用できる。 The resin composition of the present invention is cured in an extremely short time by irradiation with light such as ultraviolet rays or visible light, and the cured product exhibits an appropriate elastic modulus and excellent elongation, and further has excellent hydrolysis resistance. Because it has, automotive members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, members, vibration isolation It can be suitably used for materials and various mechanism members. The resin composition of the present invention can also be applied to structural sealants for civil engineering and construction, and adhesives for metals, magnets, ceramics, glass, and plastics.
本明細書において用いられる「分子量」なる用語は、特に説明がない場合、重量平均分子量を意味する。 As used herein, the term “molecular weight” means weight average molecular weight unless otherwise specified.
本明細書において用いられる「Tg」なる用語は、特に説明がない場合、ガラス転移温度を意味する。 As used herein, the term “Tg” means glass transition temperature unless otherwise specified.
本明細書において用いられる「アルキル」なる用語は、特に説明がない場合、直鎖、分岐および環状飽和炭化水素基を意味する。 The term “alkyl” as used herein refers to straight chain, branched and cyclic saturated hydrocarbon groups, unless otherwise specified.
本明細書において用いられる「粘度」なる用語は、特に説明がない場合「絶対粘度」を意味し、流速勾配とそれに対して発生する剪断応力との比例係数として定義され、一般的にはB型粘度計、E型粘度計、レオメーター等の粘度計により測定でき、本発明に於いてはE型粘度計で測定した値をもって示す。 The term “viscosity” as used herein means “absolute viscosity” unless otherwise specified, and is defined as a proportional coefficient between a flow velocity gradient and a shear stress generated against the gradient, and is generally B type. It can be measured with a viscometer such as a viscometer, an E-type viscometer, a rheometer, etc. In the present invention, it is shown with a value measured with an E-type viscometer.
本発明の樹脂組成物は、光照射を受けて硬化体を形成する光硬化性樹脂組成物である。ここでいう光とは、紫外線、可視光線等に代表されるエネルギー線をいう。 The resin composition of the present invention is a photocurable resin composition that is irradiated with light to form a cured product. The light here refers to energy rays typified by ultraviolet rays and visible rays.
本発明の目的を達成するにあたり、樹脂組成物としては、特定な組成のウレタン(メタ)アクリレートオリゴマーと単官能(メタ)アクリレートモノマーとを含有する。 In achieving the object of the present invention, the resin composition contains a urethane (meth) acrylate oligomer having a specific composition and a monofunctional (meth) acrylate monomer.
本発明の樹脂組成物に用いられるウレタン(メタ)アクリレートオリゴマーとして、分子内に下記化式〔5〕で表されるポリエステル骨格を有するポリエステルポリオール系ウレタン(メタ)アクリレートオリゴマーを単官能(メタ)アクリレートと特定なヒンダードアミン化合物と共に用いることで、速硬化、且つ、適度な弾性率と優れた伸び性を示す硬化体を得ることができ、さらに低硬化収縮率、耐熱性、耐薬品性、耐UV性に優れた硬化体を得ることができるため好ましい。
本発明の樹脂組成物に用いられるポリエステルポリオール系ウレタン(メタ)アクリレートオリゴマーとは、分子内に下記化式〔6〕で表されるポリエステル骨格を有するポリエステルポリオール化合物(以後、「X」で表す)と有機ポリイソシアネート化合物(以後、「Y」で表す)とヒドロキシ(メタ)アクリレート(以後、「Z」で表す)とを反応させてなる、ウレタン(メタ)アクリレートオリゴマーをいう。
(式中、R1は炭素数1〜30の直鎖もしくは分岐もしくは環状のアルキル基、または、炭素数1〜30の直鎖もしくは分岐もしくは環状のアルコキシ基もしくはポリアルコキシ基であり、R2は炭素数1〜10の直鎖もしくは分岐もしくは環状のアルキル基、または、ベンゼン環、ナフタレン環、アントラセン環、又はフルオレン環から選ばれる芳香環を含む基であり、mは重合度を表す。)
The polyester polyol urethane (meth) acrylate oligomer used in the resin composition of the present invention is a polyester polyol compound having a polyester skeleton represented by the following chemical formula [6] in the molecule (hereinafter referred to as “X”). And a urethane (meth) acrylate oligomer obtained by reacting an organic polyisocyanate compound (hereinafter represented by “Y”) and hydroxy (meth) acrylate (hereinafter represented by “Z”).
(Wherein R 1 is a linear, branched or cyclic alkyl group having 1 to 30 carbon atoms, or a linear, branched or cyclic alkoxy group or polyalkoxy group having 1 to 30 carbon atoms, and R 2 is C 1-10 linear or branched or cyclic alkyl group, or a group containing an aromatic ring selected from a benzene ring, naphthalene ring, anthracene ring, or fluorene ring, and m represents the degree of polymerization.)
ポリエステルポリオール化合物(X)の具体例としては、エチレングリコール、ジエチレングリコール、トリエチレングリコール、テトラエチレングリコール、ポリエチレングリコール、プロピレングリコール、ジプロピレングリコール、ポリプロピレングリコール、ブチレングリコール、1,4−ブタンジオール、ポリブチレングリコール、1,5−ペンタンジオール、1,6−ヘキサンジオール、1,8−オクタンジオール、1,9−ノナンジオール、3−メチル−1,5−ペンタンジオール、2,4−ジエチル−1,5−ペンタンジオール、2,2−ブチルエチル−1,3−プロパンジオール、ネオペンチルグリコール、シクロヘキサンジメタノール、水素化ビスフェノールA、ポリカプロラクトン、ポリテトラメチレングリコール等から選ばれる2価以上のアルコールを1種以上と、マレイン酸、フマル酸、イタコン酸、アジピン酸、フタル酸、テレフタル酸、イソフタル酸等のポリカルボン酸、またはその酸無水物1種以上との縮合物であるポリエステルポリオールが挙げられる。 Specific examples of the polyester polyol compound (X) include ethylene glycol, diethylene glycol, triethylene glycol, tetraethylene glycol, polyethylene glycol, propylene glycol, dipropylene glycol, polypropylene glycol, butylene glycol, 1,4-butanediol, and polybutylene. Glycol, 1,5-pentanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 3-methyl-1,5-pentanediol, 2,4-diethyl-1,5 -Pentanediol, 2,2-butylethyl-1,3-propanediol, neopentyl glycol, cyclohexanedimethanol, hydrogenated bisphenol A, polycaprolactone, polytetramethylene glycol, etc. And at least one alcohol selected from the group consisting of maleic acid, fumaric acid, itaconic acid, adipic acid, phthalic acid, terephthalic acid and isophthalic acid, or one or more acid anhydrides thereof. The polyester polyol which is a condensate is mentioned.
ポリエステルポリオールの分子量は、200〜100,000であることが好ましく、より好ましくは500〜50,000、更に好ましくは1,000〜10,000である。分子量が200以上ならば好適な伸び性を得ることができるし、100,000以内であれば適度な弾性率が得られ、また、硬化性が低下することもなく、好ましい。 The molecular weight of the polyester polyol is preferably 200 to 100,000, more preferably 500 to 50,000, and still more preferably 1,000 to 10,000. If the molecular weight is 200 or more, suitable elongation can be obtained, and if it is within 100,000, an appropriate elastic modulus can be obtained, and the curability is not lowered, which is preferable.
有機ポリイソシアネート化合物(Y)としては、芳香族系、脂肪族系、環式脂肪族系、脂環式系等のポリイソシアネートが挙げられ、具体例としては、トリレンジイソシアネート(TDI)、ジフェニルメタンジイソシアネート(MDI)、水添化ジフェニルメタンジイソシアネート(H−MDI)、ポリフェニルメタンポリイソシアネート(クルードMDI)、変性ジフェニルメタンジイソシアネート(変性MDI)、水添化キシリレンジイソシアネート(H−XDI)、キシリレンジイソシアネート(XDI)、ヘキサメチレンジイソシアネート(HMDI)、トリメチルヘキサメチレンジイソシアネート(TMXDI)、テトラメチルキシリレンジイソシアネート(m−TMXDI)、イソホロンジイソシアネート(IPDI)、ノルボルネンジイソシアネート(NBDI)、1,3−ビス(イソシアナトメチル)シクロヘキサン(H6XDI)等のポリイソシアネート或いはこれらポリイソシアネートの三量体化合物、これらポリイソシアネートとポリオールの反応生成物等が好適に用いられ、中でも水添化キシリレンジイソシアネート(H−XDI)、イソホロンジイソシアネート(IPDI)が耐光性に優れるため好ましい。ポリイソシアネート化合物(Y)の分子量は500以下が好ましい。500以下であればジオールとの反応性が低下することもない。 Examples of the organic polyisocyanate compound (Y) include aromatic, aliphatic, cycloaliphatic, and alicyclic polyisocyanates. Specific examples include tolylene diisocyanate (TDI) and diphenylmethane diisocyanate. (MDI), hydrogenated diphenylmethane diisocyanate (H-MDI), polyphenylmethane polyisocyanate (crude MDI), modified diphenylmethane diisocyanate (modified MDI), hydrogenated xylylene diisocyanate (H-XDI), xylylene diisocyanate (XDI) ), Hexamethylene diisocyanate (HMDI), trimethylhexamethylene diisocyanate (TMXDI), tetramethylxylylene diisocyanate (m-TMXDI), isophorone diisocyanate (IPDI), nor Polyisocyanates such as runene diisocyanate (NBDI) and 1,3-bis (isocyanatomethyl) cyclohexane (H6XDI) or trimer compounds of these polyisocyanates, reaction products of these polyisocyanates and polyols, etc. are preferably used. Of these, hydrogenated xylylene diisocyanate (H-XDI) and isophorone diisocyanate (IPDI) are preferred because of excellent light resistance. The molecular weight of the polyisocyanate compound (Y) is preferably 500 or less. If it is 500 or less, the reactivity with a diol will not fall.
ヒドロキシ(メタ)アクリレート(Z)としては、例えば、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレート、2−ヒドロキシエチルアクリロイルホスフェート、4−ブチルヒドロキシ(メタ)アクリレート、2−(メタ)アクリロイロキシエチル−2−ヒドロキシプロピルフタレート、グリセリンジ(メタ)アクリレート、2−ヒドロキシ−3−アクリロイロキシプロピル(メタ)アクリレート、カプロラクトン変性2−ヒドロキシエチル(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールペンタ(メタ)アクリレート、カプロラクトン変性2−ヒドロキシエチル(メタ)アクリレート等が挙げられ、中でも2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、2−ヒドロキシブチル(メタ)アクリレートが好適に用いられる。 Examples of the hydroxy (meth) acrylate (Z) include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 2-hydroxyethyl acryloyl phosphate, and 4-butyl. Hydroxy (meth) acrylate, 2- (meth) acryloyloxyethyl-2-hydroxypropyl phthalate, glycerin di (meth) acrylate, 2-hydroxy-3-acryloyloxypropyl (meth) acrylate, caprolactone modified 2-hydroxyethyl (Meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, caprolactone-modified 2-hydroxyethyl (meth) acrylate, etc. Of these 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate is preferably used.
ウレタン(メタ)アクリレートオリゴマーにおける、分子中の(メタ)アクリロイル基の数は、分子の末端又は側鎖に1個以上6個以下、より好ましくは2個以上4個以下の(メタ)アクリロイル基を有するものが好ましい。(メタ)アクリロイル基がない場合、前記(B)成分である単官能(メタ)アクリレートと共重合できず、6個より多い場合は、得られる硬化体が硬くなりすぎて、優れた伸び性が得られないことがある。 In the urethane (meth) acrylate oligomer, the number of (meth) acryloyl groups in the molecule is 1 or more and 6 or less, more preferably 2 or more and 4 or less (meth) acryloyl groups at the end or side chain of the molecule. What has is preferable. When there is no (meth) acryloyl group, it cannot be copolymerized with the monofunctional (meth) acrylate as the component (B), and when it is more than 6, the resulting cured product becomes too hard and has excellent elongation. It may not be obtained.
ウレタン(メタ)アクリレートオリゴマーの分子量については5,000以上100,000以下であることが好ましく、より好ましくは10,000以上80,000以下である。分子量が5,000以上ならば、得られる硬化体が硬くなりすぎたり、硬化収縮率が高くなったりすることもなく優れた伸び性を示し、100,000以下であれば、硬化性が悪くなることもなく好適な弾性率を示す。 The molecular weight of the urethane (meth) acrylate oligomer is preferably 5,000 or more and 100,000 or less, more preferably 10,000 or more and 80,000 or less. If the molecular weight is 5,000 or more, the resulting cured product is not too hard, and exhibits excellent elongation without increasing the cure shrinkage, and if it is 100,000 or less, the curability is poor. It shows a suitable elastic modulus without any problem.
ウレタン(メタ)アクリレートオリゴマーを単独で重合した硬化体のTgは0℃以下であることが好ましい。さらに好ましくはTgが−10℃以下、特に好ましくは−20℃以下である。Tgが0℃以下であれば、得られる硬化体は優れた伸び性を示す。尚、本発明の樹脂組成物のTgについては、例えばDSCや動的粘弾性等の公知の方法で測定される。 The Tg of a cured product obtained by polymerizing a urethane (meth) acrylate oligomer alone is preferably 0 ° C. or lower. More preferably, Tg is −10 ° C. or lower, particularly preferably −20 ° C. or lower. When Tg is 0 ° C. or lower, the obtained cured product exhibits excellent elongation. In addition, about Tg of the resin composition of this invention, it measures by well-known methods, such as DSC and dynamic viscoelasticity, for example.
前記(B)成分である単官能(メタ)アクリレートは、分子内に1つの(メタ)アクリロイル基を含有するものであれば特に限定されないが、下記式〔7〕または〔8〕で表される単官能(メタ)アクリレートを含有する樹脂組成物が適度な弾性率、優れた伸び性の硬化体を得ることができるため特に好ましい。
(式中、R3は水素原子またはメチル基であり、R4は、炭素数1〜22である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基である。)
(式中、R3は水素原子またはメチル基であり、R5は、炭素数1〜4である直鎖もしくは分岐アルキル基、R6は、炭素数1〜4である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基であり、nは1〜12の整数である。)
The monofunctional (meth) acrylate as the component (B) is not particularly limited as long as it contains one (meth) acryloyl group in the molecule, but is represented by the following formula [7] or [8]. A resin composition containing a monofunctional (meth) acrylate is particularly preferable because a cured product having an appropriate elastic modulus and excellent elongation can be obtained.
(In the formula, R 3 is a hydrogen atom or a methyl group, and R 4 is substituted with a linear or branched alkyl group having 1 to 22 carbon atoms, a cyclohexyl group, or a linear or branched alkyl group having 1 to 4 carbon atoms. Cyclohexyl group, phenyl group, phenyl group substituted by a linear or branched alkyl group having 1 to 4 carbon atoms, dicyclopentanyl group, dicyclopentenyl group, bornyl group, isobornyl group, adamantyl group, methyladamantyl group Or an allyl group.)
(Wherein R 3 is a hydrogen atom or a methyl group, R 5 is a linear or branched alkyl group having 1 to 4 carbon atoms, and R 6 is a linear or branched alkyl group having 1 to 4 carbon atoms. A cyclohexyl group, a cyclohexyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a phenyl group, a phenyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a dicyclopentanyl group A dicyclopentenyl group, a bornyl group, an isobornyl group, an adamantyl group, a methyladamantyl group, or an allyl group, and n is an integer of 1 to 12.)
具体的には、メチル(メタ)アクリレート、エチル(メタ)アクリレート、プロピル(メタ)アクリレート、n−ブチル(メタ)アクリレート、イソブチル(メタ)アクリレート、tert−ブチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、イソデシル(メタ)アクリレート、ラウリル(メタ)アクリレート、ステアリル(メタ)アクリレート、イソステアリル(メタ)アクリレート、トリデシル(メタ)アクリレート、ベヘニル(メタ)アクリレート、メトキシエチル(メタ)アクリレート、エトキシエチル(メタ)アクリレート、プロピオキシエチル(メタ)アクリレート、ブトキシエチル(メタ)アクリレート、メトキシジエチレングリコール(メタ)アクリレート、メトキシトリエチレングリコール(メタ)アクリレート、メトキシテトラエチレン(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、フェノキシジエチレングリコール(メタ)アクリレート、フェノキシテトラエチレングリコール(メタ)アクリレート、フェノキシヘキサエチレングリコール(メタ)アクリレート、メトキシジプロピレングリコール(メタ)アクリレート、メトキシトリプロピレングリコール(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、tert−ブチルシクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、フェノキシエチル(メタ)アクリレート、ジシクロペンタニル(メタ)アクリレート、ジシクロペンテニル(メタ)アクリレート、ボルニル(メタ)アクリレート、イソボルニル(メタ)アクリレート、2−メチル−2−アダマンチル(メタ)アクリレート、アリル(メタ)アクリレート等が例示できる。尚、アクリレートとメタクリレートとではメタクリレートの方がより好適な弾性率と伸び性を示す。 Specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, tert-butyl (meth) acrylate, 2-ethylhexyl (meta ) Acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, isostearyl (meth) acrylate, tridecyl (meth) acrylate, behenyl (meth) acrylate, methoxyethyl (meth) acrylate, ethoxyethyl ( (Meth) acrylate, propoxyethyl (meth) acrylate, butoxyethyl (meth) acrylate, methoxydiethylene glycol (meth) acrylate, methoxytriethylene glycol (meta) Acrylate, methoxytetraethylene (meth) acrylate, phenoxyethyl (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, phenoxytetraethylene glycol (meth) acrylate, phenoxyhexaethylene glycol (meth) acrylate, methoxydipropylene glycol (meth) acrylate , Methoxytripropylene glycol (meth) acrylate, cyclohexyl (meth) acrylate, tert-butylcyclohexyl (meth) acrylate, benzyl (meth) acrylate, phenoxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (Meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate 2-methyl-2-adamantyl (meth) acrylate, allyl (meth) acrylate and the like. Of acrylate and methacrylate, methacrylate shows more preferable elastic modulus and elongation.
(B)単官能(メタ)アクリレートは、当該ホモポリマーのTgが20℃以上の単官能(メタ)アクリレートを1種以上含有することが好ましい。さらに好ましくはTgが50℃以上、特に好ましくは80℃以上である。Tgが20℃以上であれば、得られる硬化体は適度な弾性率を示し、硬化性が悪くなったりすることもない。 (B) The monofunctional (meth) acrylate preferably contains at least one monofunctional (meth) acrylate having a homopolymer Tg of 20 ° C. or higher. More preferably, Tg is 50 ° C. or more, and particularly preferably 80 ° C. or more. When Tg is 20 ° C. or higher, the obtained cured product exhibits an appropriate elastic modulus and does not deteriorate the curability.
本発明の樹脂組成物において、(A)成分と(B)成分の配合比が、質量比で5:95〜95:5の範囲、好ましくは10:90〜80:20の範囲、特に好ましくは20:80〜70:30の範囲にあるとき、光照射により得られる硬化体は、速硬化、且つ適度な弾性率と優れた伸び性を示す樹脂組成物を得ることができる。 In the resin composition of the present invention, the blending ratio of the component (A) and the component (B) is in the range of 5:95 to 95: 5, preferably in the range of 10:90 to 80:20, particularly preferably in mass ratio. When it exists in the range of 20: 80-70: 30, the hardening body obtained by light irradiation can obtain the resin composition which shows quick hardening, moderate elastic modulus, and the outstanding elongation.
本発明者は、ポリエステルポリオール系ウレタン(メタ)アクリレートを上記配合比で含有するとき、分子内にエステル結合を多く含むため、高温多湿という条件下で使用した場合に、エステル結合の加水分解による分子量の低下に伴う機械的特性が十分でないことを見いだし、この改良を行うべくいろいろ検討を重ねた結果、上記(A)成分と(B)成分を含有する樹脂組成物に加えて、(C)下記化式〔9〕で表される基を有するヒンダードアミン化合物を含有させることにより、光照射により極めて短時間に硬化し、その硬化体が適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れる樹脂組成物を得るという本発明の目的を達成するに至った。
(C)成分であるヒンダートアミン化合物は、前記化式〔9〕で表される基を有する化合物であり、具体例としては、
ビス(2,2,6,6−テトラメチル−4−ピペリジニル)セバケート、
ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)セバケート、
4−ベンゾイルオキシ−2,2,6,6−テトラメチルピペリジン、
1,2,2,6,6−ペンタメチル−4−ピペリジニル−(メタ)アクリレート、
2,2,6,6−テトラメチル−4−ピペリジニル−(メタ)アクリレート、
1−〔2−〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ〕エチル〕−4−〔3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオニルオキシ〕−2,2,6,6−テトラメチルピペリジン、
ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)〔3,5−ジ−tert−ブチル−4−ヒドロキシフェニルメチル〕ブチルマロネート、
デカンニ酸ビス〔2,2,6,6−テトラメチル−1(オクチルオキシ)−4−ピペリジニル〕エステル、1,1−ジメチルエチルヒドロキシペルオキシドとオクタンの反応生成物、
N,N′,N″,N″′−テトラキス−〔4,6−ビス−〔ブチル−(N−メチル−2,2,6,6−テトラメチルピペリジン−4−イル)アミノ〕−トリアジン−2−イル〕−4,7−ジアザデカン−1,10−ジアミン、
ジブチルアミン・1,3,5−トリアジン・N,N′−ビス(2,2,6,6−テトラメチル−4−ピペリジル)−1,6−ヘキサメチレンジアミンとN−(2,2,6,6−テトラメチル−4−ピペリジル)ブチルアミンの重縮合物、
ポリ〔〔6−(1,1,3,3−テトラメチルブチル)アミノ−1,3,5−トリアジン−2,4−ジイル〕〔(2,2,6,6−テトラメチル−4−ピペリジル)イミノ〕ヘキサメチレン〔(2,2,6,6−テトラメチル−4−ピペリジル)イミノ〕〕、
コハク酸ジメチルと4−ヒドロキシ−2,2,6,6−テトラメチル−1−ピペリジンエタノールの重合物、
2,2,4,4−テトラメチル−7−オキサ−3,20−ジアザジスピロ−〔5・1・11・2〕−ヘネイコサン−21−オン、
β−アラニン,N,−(2,2,6,6−テトラメチル−4−ピペリジニル)−ドデシルエステル/テトラデシルエステル、
N−アセチル−3−ドデシル−1−(2,2,6,6−テトラメチル−4−ピペリジニル)ピロリジン−2,5−ジオン、2,2,4,4−テトラメチル−7−オキサ−3,20−ジアザジスピロ〔5,1,11,2〕ヘネイコサン−21−オン、
2,2,4,4−テトラメチル−21−オキサ−3,20−ジアザジシクロ−〔5,1,11,2〕−ヘネイコサン−20−プロパン酸ドデシルエステル/テトラデシルエステル、
プロパンニ酸,〔(4−メトキシフェニル)−メチレン〕−ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)エステル、
2,2,6,6−テトラメチル−4−ピペリジノールの高級脂肪酸エステル、
1,3−ベンゼンジカルボキシアミド,N,N′−ビス(2,2,6,6−テトラメチル−4−ピペリジニル)、
1,2,3,4−ブタンテトラカルボン酸テトラキス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)エステル、
1,2,3,4−ブタンテトラカルボン酸と2,2,6,6−テトラメチル−4−ピペリジニルおよびトリデシルの混合物のテトラエステル、
1,2,3,4−ブタンテトラカルボン酸と1,2,2,6,6−ペンタメチル−4−ピペリジニルおよびトリデシルの混合物のテトラエステル、
1,2,3,4−ブタンテトラカルボン酸テトラメチルエステルと2,2,6,6−テトラメチル−4−ピペリジノールおよびβ,β,β‘,β’−テトラメチル−2,4,8,10−テトラオキサスピロ〔5・5〕ウンデカン−3,9−ジエタノールとの反応物、
1,2,3,4−ブタンテトラカルボン酸テトラメチルエステルと2,2,6,6−テトラメチル−4−ピペリジノールとβ,β,β‘,β’−テトラメチル−2,4,8,10−テトラオキサスピロ〔5・5〕ウンデカン−3,9−ジエタノールとの反応物、
1,2,3,4−ブタンテトラカルボン酸ポリマー2,2−ビス(ヒドロキシメチル)−1,3−プロパンジオールと3−ヒドロキシ−2,2−ジメチルプロパナール、
1,2,2,6,6−ペンタメチル−4−ピペリジニルエステル、
1,2,3,4−ブタンテトラカルボン酸テトラメチルエステル1,2,6,6−ペンタメチル−4−ピペリジノールおよびβ,β,β‘,β’−テトラメチル−2,4,8,10−テトラオキサスピロ〔5・5〕ウンデカン−3,9−ジエタノール、
等が挙げられる。
The hindered amine compound as component (C) is a compound having a group represented by the chemical formula [9]. As a specific example,
Bis (2,2,6,6-tetramethyl-4-piperidinyl) sebacate,
Bis (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate,
4-benzoyloxy-2,2,6,6-tetramethylpiperidine,
1,2,2,6,6-pentamethyl-4-piperidinyl- (meth) acrylate,
2,2,6,6-tetramethyl-4-piperidinyl- (meth) acrylate,
1- [2- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionyloxy] ethyl] -4- [3- (3,5-di-tert-butyl-4-hydroxyphenyl) ) Propionyloxy] -2,2,6,6-tetramethylpiperidine,
Bis (1,2,2,6,6-pentamethyl-4-piperidinyl) [3,5-di-tert-butyl-4-hydroxyphenylmethyl] butyl malonate,
Decanoic acid bis [2,2,6,6-tetramethyl-1 (octyloxy) -4-piperidinyl] ester, reaction product of 1,1-dimethylethylhydroxyperoxide and octane,
N, N ', N ", N"'-tetrakis- [4,6-bis- [butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino] -triazine- 2-yl] -4,7-diazadecane-1,10-diamine,
Dibutylamine, 1,3,5-triazine, N, N'-bis (2,2,6,6-tetramethyl-4-piperidyl) -1,6-hexamethylenediamine and N- (2,2,6 , 6-tetramethyl-4-piperidyl) butylamine polycondensate,
Poly [[6- (1,1,3,3-tetramethylbutyl) amino-1,3,5-triazine-2,4-diyl] [(2,2,6,6-tetramethyl-4-piperidyl ) Imino] hexamethylene [(2,2,6,6-tetramethyl-4-piperidyl) imino]],
Polymer of dimethyl succinate and 4-hydroxy-2,2,6,6-tetramethyl-1-piperidineethanol,
2,2,4,4-tetramethyl-7-oxa-3,20-diazadispiro- [5 · 1 · 11 · 2] -heneicosane-21-one,
β-alanine, N,-(2,2,6,6-tetramethyl-4-piperidinyl) -dodecyl ester / tetradecyl ester,
N-acetyl-3-dodecyl-1- (2,2,6,6-tetramethyl-4-piperidinyl) pyrrolidine-2,5-dione, 2,2,4,4-tetramethyl-7-oxa-3 , 20-diazadispiro [5,1,11,2] heneicosan-21-one,
2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11,2] -heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester,
Propannic acid, [(4-methoxyphenyl) -methylene] -bis (1,2,2,6,6-pentamethyl-4-piperidinyl) ester,
Higher fatty acid esters of 2,2,6,6-tetramethyl-4-piperidinol,
1,3-benzenedicarboxamide, N, N′-bis (2,2,6,6-tetramethyl-4-piperidinyl),
1,2,3,4-butanetetracarboxylic acid tetrakis (1,2,2,6,6-pentamethyl-4-piperidinyl) ester,
A tetraester of a mixture of 1,2,3,4-butanetetracarboxylic acid and 2,2,6,6-tetramethyl-4-piperidinyl and tridecyl;
Tetraester of a mixture of 1,2,3,4-butanetetracarboxylic acid and 1,2,2,6,6-pentamethyl-4-piperidinyl and tridecyl;
1,2,3,4-butanetetracarboxylic acid tetramethyl ester and 2,2,6,6-tetramethyl-4-piperidinol and β, β, β ′, β′-tetramethyl-2,4,8, A reaction product with 10-tetraoxaspiro [5.5] undecane-3,9-diethanol,
1,2,3,4-butanetetracarboxylic acid tetramethyl ester and 2,2,6,6-tetramethyl-4-piperidinol and β, β, β ′, β′-tetramethyl-2,4,8, A reaction product with 10-tetraoxaspiro [5.5] undecane-3,9-diethanol,
1,2,3,4-butanetetracarboxylic acid polymer 2,2-bis (hydroxymethyl) -1,3-propanediol and 3-hydroxy-2,2-dimethylpropanal,
1,2,2,6,6-pentamethyl-4-piperidinyl ester,
1,2,3,4-butanetetracarboxylic acid tetramethyl ester 1,2,6,6-pentamethyl-4-piperidinol and β, β, β ′, β′-tetramethyl-2,4,8,10- Tetraoxaspiro [5.5] undecane-3,9-diethanol,
Etc.
本発明の樹脂組成物における(C)成分の含有割合は、(A)成分と(B)成分の合量100質量部に対して、0.01〜10質量部含有する組成とするとき、得られる硬化体は、特に優れた耐加水分解性を有する。0.01質量部以上であれば優れた耐加水分解性を付与でき、10質量部以下であれば硬化性を低下させることもない。 The content ratio of the component (C) in the resin composition of the present invention is obtained when the composition contains 0.01 to 10 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). The resulting cured product has particularly excellent hydrolysis resistance. If it is 0.01 mass part or more, the outstanding hydrolysis resistance can be provided, and if it is 10 mass parts or less, curability will not be lowered.
本発明の樹脂組成物に於いては、(D)成分である光重合開始剤を含有することが好ましく、光重合開始剤としてはベンゾイン系、ベンゾフェノン系、アセトフェノン系、アシルホスフィンオキサイド系、チオキサントン系、メタロセン系、キノン系、ボロン系等の紫外線重合開始剤や可視光重合開始剤が挙げられる。 In the resin composition of the present invention, it is preferable to contain a photopolymerization initiator as component (D). As the photopolymerization initiator, benzoin-based, benzophenone-based, acetophenone-based, acylphosphine oxide-based, thioxanthone-based , Metallocene-based, quinone-based, boron-based ultraviolet polymerization initiators and visible light polymerization initiators.
光重合開始剤の具体例としては、例えば、ベンゾフェノン、4−フェニルベンゾフェノン、ベンゾイル安息香酸、2,2−ジエトキシアセトフェノン、ビスジエチルアミノベンゾフェノン、ベンジル、ベンゾイン、ベンゾイルイソプロピルエーテル、ベンジルジメチルケタール、1−ヒドロキシシクロヘキシルフェニルケトン、チオキサントン、1−(4−イソプロピルフェニル)2−ヒドロキシ−2−メチルプロパン−1−オン、1−(4−(2−ヒドロキシエトキシ)−フェニル)−2−ヒドロキシ−2−メチル−1−プロパン−1−オン、2−ヒドロキシ−2−メチル−1−フェニルプロパン−1−オン、カンファーキノン、2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド、2−メチル−1−(4−(メチルチオ)フェニル)−2−モルフォリノプロパン−1−オン、2−ベンジル−2-ジメチルアミノ−1−(4−モルフォリノフェニル)−1−ブタノン−1、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキサイド等が挙げられるが、中でも、可視光で硬化可能で特に反応性に優れている2,4,6−トリメチルベンゾイルジフェニルホスフィンオキサイド、ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド、ビス(2,6−ジメトキシベンゾイル)−2,4,4−トリメチル−ペンチルホスフィンオキサイド等のアシルホスフィンオキサイド化合物が好ましい。 Specific examples of the photopolymerization initiator include, for example, benzophenone, 4-phenylbenzophenone, benzoylbenzoic acid, 2,2-diethoxyacetophenone, bisdiethylaminobenzophenone, benzyl, benzoin, benzoylisopropyl ether, benzyldimethyl ketal, 1-hydroxy Cyclohexyl phenyl ketone, thioxanthone, 1- (4-isopropylphenyl) 2-hydroxy-2-methylpropan-1-one, 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl- 1-propan-1-one, 2-hydroxy-2-methyl-1-phenylpropan-1-one, camphorquinone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzo L) -Phenylphosphine oxide, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) Examples include -1-butanone-1, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, among which curable with visible light and particularly excellent in reactivity 2 , 4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide, bis (2,6-dimethoxybenzoyl) -2,4,4-trimethyl-pentylphosphine oxide, etc. Acylphosphine oxide compounds are preferred.
さらに本発明の樹脂組成物において、優れた振動疲労耐久性を付与するためにゴム組成物を配合することができる。 Furthermore, in the resin composition of the present invention, a rubber composition can be blended in order to impart excellent vibration fatigue durability.
ゴム組成物としては、前記のエラストマー(R)が例示できるが、その中でも樹脂組成物への相溶性の面から特に好ましくは、(メタ)アクリル酸エステル化合物、ビニル系化合物、及びオレフィン系炭化水素化合物からなる群から選ばれる単量体からなる共重合体であるゴム組成物が好ましい。 Examples of the rubber composition include the elastomer (R) described above, and among these, (meth) acrylic acid ester compounds, vinyl compounds, and olefin hydrocarbons are particularly preferable from the viewpoint of compatibility with the resin composition. A rubber composition that is a copolymer comprising a monomer selected from the group consisting of compounds is preferred.
本発明に於いては、必要に応じて、本発明の効果を阻害しない範囲において、顔料(チタン白、シアニンブルー、ウォッチングレッド、ベンガラ、カーボンブラック、アニリンブラック、マンガンブルー、鉄黒、ウルトラマリンブルー、ハンザレッド、クロームイエロー、クロームグリーン等)、無機充填剤(炭酸カルシウム、カオリン、クレー、タルク、マイカ、硫酸バリウム、リトポン、石コウ、ステアリン酸亜鉛、パーライト、石英、石英ガラス、溶融シリカ、球状シリカ等のシリカ粉等や、球状アルミナ、破砕アルミナ、酸化マグネシウム、酸化ベリリウム、酸化チタン等の酸化物類、窒化ホウ素、窒化ケイ素、窒化アルミニウム等の窒化物類、炭化ケイ素等の炭化物類、水酸化アルミニウム、水酸化マグネシウム等の水酸化物類、銅、銀、鉄、アルミニウム、ニッケル、チタン等の金属類や合金類、ダイヤモンド、カーボン等の炭素系材料等)、熱可塑性樹脂および熱硬化性樹脂(ナイロン−6、ナイロン−6,6等のポリアミド系樹脂、塩化ビニル系樹脂、ニトロセルロース系樹脂、塩化ビニリデン系樹脂、アクリル系樹脂、アクリルアミド系樹脂、スチレン系樹脂、ビニルエステル系樹脂、ポリエステル系樹脂、フッ素系樹脂、アクリルゴム、ウレタンゴムなどの各種エラストマー樹脂、メタクリル酸メチル−ブタジエン−スチレン系グラフト共重合体やアクリロニトリル−ブタジエン−スチレン系グラフト共重合体などのグラフト共重合体等)、補強剤(ガラス繊維、炭素繊維等)、垂れ止め剤(水添ヒマシ油、微粒子無水硅酸等)、艶消し剤(微粉シリカ、パラフィンワックス等)、研削剤(ステアリン酸亜鉛等)を配合することも可能である。 In the present invention, if necessary, pigments (titanium white, cyanine blue, watching red, bengara, carbon black, aniline black, manganese blue, iron black, ultramarine blue are used as long as the effects of the present invention are not impaired. , Hansa Red, Chrome Yellow, Chrome Green, etc.), inorganic fillers (calcium carbonate, kaolin, clay, talc, mica, barium sulfate, lithopone, gypsum, zinc stearate, perlite, quartz, quartz glass, fused silica, spherical Silica powder such as silica, etc., oxides such as spherical alumina, crushed alumina, magnesium oxide, beryllium oxide and titanium oxide, nitrides such as boron nitride, silicon nitride and aluminum nitride, carbides such as silicon carbide, water Hydroxides such as aluminum oxide and magnesium hydroxide, , Silver, iron, aluminum, nickel, titanium and other metals and alloys, diamond, carbon and other carbon-based materials), thermoplastic resins and thermosetting resins (nylon-6, nylon-6,6, etc. polyamides) Resin, vinyl chloride resin, nitrocellulose resin, vinylidene chloride resin, acrylic resin, acrylamide resin, styrene resin, vinyl ester resin, polyester resin, fluorine resin, acrylic rubber, urethane rubber, etc. Various elastomer resins, methyl methacrylate-butadiene-styrene graft copolymers and graft copolymers such as acrylonitrile-butadiene-styrene graft copolymers), reinforcing agents (glass fibers, carbon fibers, etc.), anti-sagging agents (Hydrogenated castor oil, fine particulate succinic anhydride, etc.), matting agents (fine silica, para Inwakkusu etc.), it is also possible to blend the abrasive (zinc stearate).
又、上記の成分以外にも、フェノール系酸化防止剤、キノン系酸化防止剤、リン系酸化防止剤、アミン系酸化防止剤、ラクトン系酸化防止剤、イオウ系酸化防止剤等の酸化防止剤、紫外線吸収剤、消泡剤、難燃剤、帯電防止剤、可塑剤、熱重合開始剤、シランカップリング剤、密着性付与剤等を併用することも可能である。 In addition to the above components, phenolic antioxidants, quinone antioxidants, phosphorus antioxidants, amine antioxidants, lactone antioxidants, sulfur antioxidants and other antioxidants, It is also possible to use an ultraviolet absorber, an antifoaming agent, a flame retardant, an antistatic agent, a plasticizer, a thermal polymerization initiator, a silane coupling agent, an adhesion imparting agent and the like in combination.
以上の様にして得られる本発明の樹脂組成物に、光等のエネルギー線を照射することで、短時間に硬化し、従来のエラストマー樹脂に要求される適度な弾性率と優れた伸び性を示す硬化体を得ることができる。 By irradiating energy rays such as light to the resin composition of the present invention obtained as described above, it cures in a short time, and has an appropriate elastic modulus and excellent elongation required for conventional elastomer resins. The cured product shown can be obtained.
本発明の樹脂組成物の硬化体は、JIS K7113(プラスチックの引張試験方法)に準拠して引張試験測定を実施したとき、引張弾性率が1〜100MPa、特に好ましくは3〜70MPaであり、しかも引張破壊伸びが200%以上であることを特徴とする。硬化体の引張弾性率が1MPa以上であれば、得られる硬化体が柔らかすぎて目的の形状を保持できないという問題を生じることもない。また、硬化体の引張弾性率が100MPa以下で、しかも引張破壊伸びが200%以上であれば、優れた振動疲労耐久性を得ることができる。 The cured product of the resin composition of the present invention has a tensile elastic modulus of 1 to 100 MPa, particularly preferably 3 to 70 MPa, when a tensile test measurement is performed according to JIS K7113 (plastic tensile test method). The tensile elongation at break is 200% or more. When the tensile elastic modulus of the cured body is 1 MPa or more, there is no problem that the obtained cured body is too soft to maintain the target shape. Moreover, if the tensile elastic modulus of the cured body is 100 MPa or less and the tensile fracture elongation is 200% or more, excellent vibration fatigue durability can be obtained.
また、本発明の樹脂組成物の硬化体を成形する場合、その手段は種々の方法を採用することができるが、特に次の2つの方法が好ましい。(1)上型、下型よりなる一組の成形型の少なくともいずれか一方を光等のエネルギー線が透過する材料にて形成し、硬化前の樹脂組成物を所定量配置する。次に上型と下型を圧着して、型閉じし、エネルギー線を透過する材料からなる型の外側からエネルギー線を照射し、樹脂を硬化させて目的の硬化体を得る方法、或いは、(2)上型、下型よりなる一組の成形型の少なくともいずれか一方をエネルギー線が透過する材料にて形成し、次に上型と下型を圧着して、型閉じし、次に型に予め形成しておいた注入口より、硬化前の樹脂組成物を所定量注入する。そして、エネルギー線を透過する材料からなる型の外側から光を照射し、樹脂を硬化させて目的の硬化体を得る方法。 Further, when molding the cured product of the resin composition of the present invention, various methods can be adopted as the means, and the following two methods are particularly preferable. (1) At least one of a set of molds including an upper mold and a lower mold is formed of a material that transmits energy rays such as light, and a predetermined amount of the resin composition before curing is disposed. Next, the upper mold and the lower mold are pressure-bonded, the mold is closed, the energy beam is irradiated from the outside of the mold made of a material that transmits the energy beam, and the resin is cured to obtain a desired cured body, or ( 2) At least one of a pair of molds consisting of an upper mold and a lower mold is formed of a material that transmits energy rays, and then the upper mold and the lower mold are pressure-bonded, and the mold is closed. A predetermined amount of the resin composition before curing is injected from an injection port formed in advance. And the method of irradiating light from the outer side of the type | mold which consists of a material which permeate | transmits an energy ray, and hardening a resin and obtaining the target hardening body.
エネルギー線を透過する型に用いられる材料としては、例えば石英、石英ガラス、硼珪酸ガラス、ソーダガラス等のガラス材料、アクリル樹脂、ポリカーボネート樹脂、ポリスチレン樹脂、ポリエステル樹脂、ポリエチレン樹脂、ポリプロピレン樹脂、フッ素樹脂、セルロース樹脂、スチレン−ブタジエン共重合体、メタクリル酸メチル−スチレン共重合体、シリコーン樹脂、ポリシクロオレフィン樹脂等の樹脂材料が例示できる。中でも透明性、耐久性に優れ、且つ安価に型を製造できることから、ポリメタクリル酸メチル等のアクリル樹脂が特に好ましく、アクリル樹脂を使用することで本発明の樹脂組成物が示す優れた成形性を最大に発揮することができる。 Examples of materials used for the mold that transmits energy rays include glass materials such as quartz, quartz glass, borosilicate glass, and soda glass, acrylic resin, polycarbonate resin, polystyrene resin, polyester resin, polyethylene resin, polypropylene resin, and fluorine resin. And resin materials such as cellulose resin, styrene-butadiene copolymer, methyl methacrylate-styrene copolymer, silicone resin, and polycycloolefin resin. Among them, an acrylic resin such as polymethyl methacrylate is particularly preferable because it is excellent in transparency, durability, and can be manufactured at low cost, and the excellent moldability exhibited by the resin composition of the present invention by using the acrylic resin. It can be maximized.
エネルギー線源としてはハロゲンランプ、メタルハライドランプ、ハイパワーメタルハライドランプ(インジウム等を含有する)、低圧水銀ランプ、高圧水銀ランプ、超高圧水銀ランプ、キセノンランプ、キセノンエキシマランプ、キセノンフラッシュランプ等が挙げられる。 Energy ray sources include halogen lamps, metal halide lamps, high power metal halide lamps (containing indium, etc.), low pressure mercury lamps, high pressure mercury lamps, ultra high pressure mercury lamps, xenon lamps, xenon excimer lamps, xenon flash lamps, etc. .
各々放射波長、エネルギー分布が異なるため、上記エネルギー線源(以下、単に光源という。)は例えば光重合開始剤の反応波長などにより選択される。また、自然光(太陽光)も反応開始光源になり得る。 Since the radiation wavelength and energy distribution are different, the energy ray source (hereinafter simply referred to as a light source) is selected depending on, for example, the reaction wavelength of the photopolymerization initiator. Natural light (sunlight) can also be a reaction initiation light source.
上記光源は、直接照射、反射鏡等により集光照射、ファイバー等による集光照射をすることができ、低波長カットフィルター、熱線カットフィルター、コールドミラー等も用いることもできる。 The light source can be directly irradiated, focused with a reflecting mirror or the like, or focused with a fiber or the like, and a low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like can also be used.
また、上記の成形方法により本発明の樹脂組成物の硬化体を成形する場合、樹脂組成物の硬化収縮率は0%〜5%であることが好ましい。0%未満(硬化により膨張すること表す)であったり、5%を越えたりすると、型の寸法と硬化体の寸法に差が生じるため目的形状の硬化体が得られ難いためである。 Moreover, when shape | molding the hardening body of the resin composition of this invention with said shaping | molding method, it is preferable that the cure shrinkage rate of a resin composition is 0%-5%. This is because if it is less than 0% (represents expansion due to curing) or exceeds 5%, a difference between the dimension of the mold and the dimension of the cured body will occur, making it difficult to obtain a cured body of the desired shape.
また、樹脂組成物の粘度は、25℃で100〜100,000mPa・s、特に好ましくは、3,000〜90,000mPa・sであることが好ましい。100mPa・s未満であると、型からの液漏れ等を起こし目的の形状の成型体が得られないことがあるし、100,000mPa・sを越えると、型内に充填しにくく、また、型を押し上げてしまう等して、目的の形状の硬化体が得られなくなることがあるためである。 Moreover, it is preferable that the viscosity of a resin composition is 100-100,000 mPa * s at 25 degreeC, Most preferably, it is 3,000-90,000 mPa * s. If it is less than 100 mPa · s, liquid leakage from the mold may occur, and a molded product of the desired shape may not be obtained. If it exceeds 100,000 mPa · s, it is difficult to fill the mold. This is because the cured product having the desired shape may not be obtained.
〈実施例1〜14、および比較例1〜3〉
表1〜2に示す種類の各成分を表中に示す組成で混合して光硬化性の樹脂組成物を調整した。尚、表1〜2に記載の各成分には以下の化合物を選択した。
<Examples 1 to 14 and Comparative Examples 1 to 3>
Each type of component shown in Tables 1-2 was mixed with the composition shown in the table to prepare a photocurable resin composition. In addition, the following compounds were selected for each component described in Tables 1-2.
(A)ウレタン(メタ)アクリレートオリゴマーとしては、下記を用いた。尚、下記に記載の分子量とは、ゲルパーミネーションクロマトグラフィー(GPC)(溶剤:テトラヒドロフラン(THF))で測定した、標準ポリスチレン換算の重量平均分子量である。
(a1)ポリエステルポリオール系ウレタンアクリレート(1)(日本合成化学工業社製 「UV−3000B」分子量:18,000)
(a2)ポリエステルポリオール系ウレタンアクリレート(2)(根上工業社製「KHP−11」分子量:25,000)
(a3)ポリエステルポリオール系ウレタンアクリレート(3)(根上工業社製「KHP−17」分子量:40,000)
(a4)ポリエステルポリオール系ウレタンアクリレート(4)(根上工業社製「SD−7」分子量:3,500)
(A) The following was used as a urethane (meth) acrylate oligomer. In addition, the molecular weight as described below is a weight average molecular weight in terms of standard polystyrene measured by gel permeation chromatography (GPC) (solvent: tetrahydrofuran (THF)).
(A1) Polyester polyol-based urethane acrylate (1) (manufactured by Nippon Synthetic Chemical Industry “UV-3000B” molecular weight: 18,000)
(A2) Polyester polyol urethane acrylate (2) (“KHP-11” molecular weight: 25,000, manufactured by Negami Kogyo Co., Ltd.)
(A3) Polyester polyol urethane acrylate (3) (“KHP-17” molecular weight: 40,000 manufactured by Negami Kogyo Co., Ltd.)
(A4) Polyester polyol urethane acrylate (4) (“SD-7” molecular weight: 3,500, manufactured by Negami Kogyo Co., Ltd.)
(B)成分の単官能(メタ)アクリレートとしては、下記(b1)〜(b4)を用いた。
(b1)ジシクロペンタニルメタクリレート(日立化成工業社製「ファンクリルFA−513M」)
(b2)n−ブチルメタクリレート(共栄社化学社製「ライトエステルNB」)
(b3)フェノキシエチルメタクリレート(共栄社化学社製「ライトエステルPO」)
(b4)4−ヒドロキシブチルメタクリレート(共栄社化学社製「ライトエステルHOB」)
The following (b1) to (b4) were used as the monofunctional (meth) acrylate of the component (B).
(B1) Dicyclopentanyl methacrylate (“Fancryl FA-513M” manufactured by Hitachi Chemical Co., Ltd.)
(B2) n-Butyl methacrylate (“Light Ester NB” manufactured by Kyoeisha Chemical Co., Ltd.)
(B3) Phenoxyethyl methacrylate (“Light Ester PO” manufactured by Kyoeisha Chemical Co., Ltd.)
(B4) 4-Hydroxybutyl methacrylate (“Eye ester HOB” manufactured by Kyoeisha Chemical Co., Ltd.)
(C)成分のヒンダートアミン化合物としては、下記(c1)〜(c8)を用いた。
(c1)ビス(2,2,6,6−テトラメチル−4−ピペリジル)セバケート(三共ライフテック社製「サノールLS−770」)
(c2)ビス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)セバケート(三共ライフテック社製「サノールLS−765」)
(c3)1,2,2,6,6−ペンタメチル−4−ピペリジニル−(メタ)アクリレート(三共ライフテック社製「サノールLS−3410」)
(c4)1,2,3,4−ブタンテトラカルボン酸テトラキス(1,2,2,6,6−ペンタメチル−4−ピペリジニル)エステル(アデカ社製「アデカスタブLA−52」)
(c5)1,2,3,4−ブタンテトラカルボン酸と2,2,6,6−テトラメチル−4−ピペリジニルおよびトリデシルの混合物のテトラエステル(アデカ社製「アデカスタブLA−62」)
(c6)1,2,3,4−ブタンテトラカルボン酸と1,2,2,6,6−ペンタメチル−4−ピペリジニルおよびトリデシルの混合物のテトラエステル(アデカ社製「アデカスタブLA−67」)
(c7)1,2,3,4−ブタンテトラカルボン酸テトラメチルエステルと2,2,6,6−テトラメチル−4−ピペリジノールおよびβ,β,β‘,β’−テトラメチル−2,4,8,10−テトラオキサスピロ〔5・5〕ウンデカン−3,9−ジエタノールとの反応物(アデカ社製「アデカスタブLA−63P」)
(c8)2,2,4,4−テトラメチル−21−オキサ−3,20−ジアザジシクロ−〔5,1,11,2〕−ヘネイコサン−20−プロパン酸ドデシルエステル/テトラデシルエステル(クラリアントジャパン社製「ホスタビンN24」)
As the hindered amine compound of component (C), the following (c1) to (c8) were used.
(C1) Bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate (“Sanol LS-770” manufactured by Sankyo Lifetech Co., Ltd.)
(C2) Bis (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate (“Sanol LS-765” manufactured by Sankyo Lifetech Co., Ltd.)
(C3) 1,2,2,6,6-pentamethyl-4-piperidinyl- (meth) acrylate (“Sanol LS-3410” manufactured by Sankyo Lifetech Co., Ltd.)
(C4) 1,2,3,4-butanetetracarboxylic acid tetrakis (1,2,2,6,6-pentamethyl-4-piperidinyl) ester (“Adeka Stub LA-52” manufactured by Adeka)
(C5) Tetraester of a mixture of 1,2,3,4-butanetetracarboxylic acid, 2,2,6,6-tetramethyl-4-piperidinyl and tridecyl ("Adeka Stub LA-62" manufactured by Adeka)
(C6) Tetraester of a mixture of 1,2,3,4-butanetetracarboxylic acid, 1,2,2,6,6-pentamethyl-4-piperidinyl and tridecyl (“ADEKA STAB LA-67” manufactured by Adeka)
(C7) 1,2,3,4-butanetetracarboxylic acid tetramethyl ester and 2,2,6,6-tetramethyl-4-piperidinol and β, β, β ′, β′-tetramethyl-2,4 , 8,10-tetraoxaspiro [5.5] undecane-3,9-diethanol (“Adeka Stab LA-63P” manufactured by Adeka)
(C8) 2,2,4,4-tetramethyl-21-oxa-3,20-diazadicyclo- [5,1,11,2] -heneicosane-20-propanoic acid dodecyl ester / tetradecyl ester (Clariant Japan Ltd.) "Hostabin N24")
(D)成分の光重合開始剤としては、
ビス(2,4,6−トリメチルベンゾイル)−フェニルホスフィンオキサイド(チバ・スペシャルティー・ケミカルズ社製「IRGACURE819」)を用いた。
As the photopolymerization initiator of component (D),
Bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (“IRGACURE819” manufactured by Ciba Specialty Chemicals) was used.
各種物性は、次のように測定した。 Various physical properties were measured as follows.
〔光照射条件〕
光照射に際しては、無電極放電ランプ(Dバルブ)を搭載したフュージョン社製ベルトコンベアー式紫外線硬化装置を用い、樹脂組成物への積算照射量が4,000mJ/cm2(365nm)となる条件にて硬化させた。
[Light irradiation conditions]
At the time of light irradiation, a belt conveyor type ultraviolet curing device manufactured by Fusion equipped with an electrodeless discharge lamp (D bulb) is used, and the total irradiation amount to the resin composition is 4,000 mJ / cm 2 (365 nm). And cured.
〔硬化体試験片の調整〕
上型として200mm×200mm×5mm厚のアクリル樹脂板と、上型と同じ形状のアクリル樹脂板の片面の中央部に目的の形状の凹部を象った下型とからなる一組の成形型を作成し、硬化前の樹脂組成物を下型の凹部に必要量滴下した。次に上型を下型に被せて、圧着、型閉じし、上型の外側から前記の照射条件で光を照射し、樹脂を硬化させて目的の硬化体試験片を得た。
[Adjustment of cured specimen]
A set of molds consisting of an acrylic resin plate of 200 mm × 200 mm × 5 mm thickness as the upper mold and a lower mold that imitates a concave portion of the desired shape at the center of one side of the acrylic resin plate having the same shape as the upper mold The required amount of the resin composition before curing was dropped onto the lower mold recess. Next, the upper mold was put on the lower mold, and was pressure-bonded and closed. The light was irradiated from the outside of the upper mold under the irradiation conditions described above, and the resin was cured to obtain a desired cured body test piece.
〔樹脂引張試験〕
(1)初期
JIS K7113(プラスチックの引張試験方法)に準拠し、2(1/2)号ダンベル形状(標点間距離12mm)で1mm厚の試験片を上記の条件で調整し、温度23℃、湿度50%の環境下で、引張速度50mm/minで測定した。引張破壊強さ、引張弾性率、引張破壊伸びの各値については、JIS K7113に準拠して求めた。
(Resin tensile test)
(1) In accordance with the initial JIS K7113 (plastic tensile test method), a 2 (1/2) dumbbell shape (distance between gauge points 12 mm) and a 1 mm thick test piece were adjusted under the above conditions, and the temperature was 23 ° C. In a 50% humidity environment, the measurement was performed at a tensile speed of 50 mm / min. Each value of tensile fracture strength, tensile elastic modulus, and tensile fracture elongation was determined according to JIS K7113.
(2)高温多湿試験
(1)と同様の条件で調整した試験片を、温度60℃、湿度90%の環境下に10日間暴露した。暴露後の試験片を(1)と同様の環境下で、引張速度50mm/minで測定し、樹脂物性保持率を(樹脂物性保持率(%))={(高温多湿暴露後の樹脂物性)/(初期の樹脂物性)}×100として計算した。
(2) High temperature and humidity test
A test piece prepared under the same conditions as in (1) was exposed to an environment of a temperature of 60 ° C. and a humidity of 90% for 10 days. The test specimen after exposure was measured at a tensile speed of 50 mm / min in the same environment as in (1), and the resin physical property retention ratio (resin physical property retention ratio (%)) = {(resin physical property after high temperature and high humidity exposure) / (Initial resin properties)} × 100.
得られた樹脂組成物の硬化体の樹脂引張試験及び高温多湿試験の結果をまとめて表1〜2に示す。 Tables 1 and 2 collectively show the results of the resin tensile test and the high-temperature and high-humidity test of the cured product of the obtained resin composition.
本発明の樹脂組成物は、紫外線または可視光線等の光照射により瞬時に硬化し、その硬化体は適度な弾性率と優れた伸び性を示し、さらに耐加水分解性に優れるという特性を有しているので、タイヤ等の自動車部材、土木、建築等の構造物用シール部材、Oリング等のパッキング部材、スピーカー等の音響用、携帯電話用キーシート等のシート部材、部材、防振材料、各種機構部材等に好適に使用でき、また、本発明の樹脂組成物は、土木、建築等の構造用シーリング剤、金属、マグネット、セラミックス、ガラス、プラスチック用の接着剤にも適用可能であるため、産業上に非常に有用である。 The resin composition of the present invention is instantly cured by irradiation with light such as ultraviolet rays or visible light, and the cured product has characteristics such as an appropriate elastic modulus and excellent elongation, and further excellent hydrolysis resistance. Therefore, automobile members such as tires, sealing members for structures such as civil engineering and construction, packing members such as O-rings, acoustic members such as speakers, sheet members such as key sheets for mobile phones, members, vibration-proof materials, The resin composition of the present invention can be suitably used for various mechanism members and the like, and can also be applied to structural sealants for civil engineering and construction, and adhesives for metals, magnets, ceramics, glass and plastics. Very useful on the industry.
Claims (7)
(B)単官能(メタ)アクリレート、
さらに、
(C)下記化式〔2〕で表される基を有するヒンダードアミン化合物
を含有し、(A)成分と(B)成分の配合比が、質量比で5:95〜95:5の範囲であり、(C)成分が(A)成分と(B)成分の合量100質量部に対して、0.01〜10質量部含有する樹脂組成物。 (A) a urethane (meth) acrylate oligomer having a polyester skeleton represented by the following chemical formula [1] in the molecule and having a molecular weight in the range of 5,000 to 100,000;
(B) monofunctional (meth) acrylate,
further,
(C) A hindered amine compound having a group represented by the following chemical formula [2]
The mixing ratio of the component (A) and the component (B) is in the range of 5:95 to 95: 5 by mass ratio, and the component (C) is the total amount of the components (A) and (B). The resin composition which contains 0.01-10 mass parts with respect to 100 mass parts.
(式中、R3は水素原子またはメチル基であり、R4は、炭素数1〜22である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基である。)
(式中、R3は水素原子またはメチル基であり、R5は、炭素数1〜4である直鎖もしくは分岐アルキル基、R6は、炭素数1〜4である直鎖もしくは分岐アルキル基、シクロヘキシル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたシクロヘキシル基、フェニル基、炭素数1〜4の直鎖もしくは分岐アルキル基により置換されたフェニル基、ジシクロペンタニル基、ジシクロペンテニル基、ボルニル基、イソボルニル基、アダマンチル基、メチルアダマンチル基、又はアリル基であり、nは1〜12の整数である。) (B) The monofunctional (meth) acrylate is a monofunctional (meth) acrylate represented by the following chemical formula [3] or [4].
(In the formula, R 3 is a hydrogen atom or a methyl group, and R 4 is substituted with a linear or branched alkyl group having 1 to 22 carbon atoms, a cyclohexyl group, or a linear or branched alkyl group having 1 to 4 carbon atoms. Cyclohexyl group, phenyl group, phenyl group substituted by a linear or branched alkyl group having 1 to 4 carbon atoms, dicyclopentanyl group, dicyclopentenyl group, bornyl group, isobornyl group, adamantyl group, methyladamantyl group Or an allyl group.)
(Wherein R 3 is a hydrogen atom or a methyl group, R 5 is a linear or branched alkyl group having 1 to 4 carbon atoms, and R 6 is a linear or branched alkyl group having 1 to 4 carbon atoms. A cyclohexyl group, a cyclohexyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a phenyl group, a phenyl group substituted with a linear or branched alkyl group having 1 to 4 carbon atoms, a dicyclopentanyl group A dicyclopentenyl group, a bornyl group, an isobornyl group, an adamantyl group, a methyladamantyl group, or an allyl group, and n is an integer of 1 to 12.)
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JP2010037411A (en) * | 2008-08-04 | 2010-02-18 | Mitsubishi Rayon Co Ltd | Resin cured product and key sheet |
KR101255661B1 (en) | 2009-12-22 | 2013-04-17 | 제일모직주식회사 | Photocurable resin composition showing good wear-resistance and optical film manufactured therefrom |
JP2013185097A (en) * | 2012-03-08 | 2013-09-19 | Hitachi Chemical Co Ltd | Photocurable resin composition, device for image display using the same, and method of manufacturing device for image display |
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JP2015117265A (en) * | 2013-12-17 | 2015-06-25 | スリーボンドファインケミカル株式会社 | Photocurable composition |
JP2015189942A (en) * | 2014-03-28 | 2015-11-02 | ブラザー工業株式会社 | Photocurable resin composition, container, three-dimensional model manufacturing apparatus, and three-dimensional model manufacturing method |
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