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JP2008084990A - Light-emitting apparatus and illumination appliance - Google Patents

Light-emitting apparatus and illumination appliance Download PDF

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Publication number
JP2008084990A
JP2008084990A JP2006261512A JP2006261512A JP2008084990A JP 2008084990 A JP2008084990 A JP 2008084990A JP 2006261512 A JP2006261512 A JP 2006261512A JP 2006261512 A JP2006261512 A JP 2006261512A JP 2008084990 A JP2008084990 A JP 2008084990A
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light
solid
unit
led chips
mounting
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Kenichiro Tanaka
健一郎 田中
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Panasonic Electric Works Co Ltd
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Matsushita Electric Works Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting apparatus capable of suppressing color irregularity while decreasing a manufacturing cost, and to provide an illumination appliance. <P>SOLUTION: Since a mounting surface 11a of a mounting portion 11 is inclined to the bottom surface, optical axes L of LED chips 10 are not parallel to each other, but cross to each other in a substantial center of a thickness direction of a cover 14. With this configuration, color irregularity is suppressed by enhancing a range where lights to be emitted from each of the LED chips 10, compared to a conventional case where a plurality of LED chips are arranged and mounted on a planar mounting substrate. Further, since a light illumination range is small as a whole, a dispersion portion 16 for dispersing lights to be emitted from the LED chips 10 is provided on only the apex of the cover 14, and the small dispersion portion 16 is required because a dispersion portion 16a is not mixed into the entire of the cover 14, and thus, a manufacturing cost can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、発光ダイオードのような固体発光素子を光源とする発光装置及び照明器具に関するものである。   The present invention relates to a light emitting device and a lighting fixture using a solid light emitting element such as a light emitting diode as a light source.

従来、白色光を得る発光装置として、例えば、青色光、赤色光、緑色光を各々放射する3種類の固体発光素子(LEDチップ)と、これら3種類のLEDチップが実装される平板状の実装基板と、透光性材料によりガラスビーズのような拡散部材とともにLEDチップを封止してなる封止部とを備え、拡散部材で拡散された青色光、赤色光、緑色光を混色することで白色光を外部に照射するものがある(特許文献1参照)。
特開2002−280617号公報
Conventionally, as a light emitting device that obtains white light, for example, three types of solid light emitting elements (LED chips) that emit blue light, red light, and green light, respectively, and a plate-like mounting on which these three types of LED chips are mounted By including a substrate and a sealing part formed by sealing an LED chip together with a diffusing member such as a glass bead by a translucent material, by mixing blue light, red light, and green light diffused by the diffusing member Some irradiate white light to the outside (see Patent Document 1).
JP 2002-280617 A

ところで、上記従来例のように複数の固体発光素子(LEDチップ)が平板状の実装基板に並べて実装された構造においては、各固体発光素子の光軸が概ね平行となるために各色の光を混色する範囲が狭くなって色むらが生じやすくなってしまう。そのために上記従来例のようにLEDチップを封止する封止部にガラスビーズのような拡散部材を均一に配置しなければならず、多量の拡散部材が必要となってしまうために製造コストが高くなるという問題があった。   By the way, in the structure in which a plurality of solid state light emitting elements (LED chips) are mounted side by side on a flat mounting board as in the conventional example, the light axes of the respective solid state light emitting elements are substantially parallel, so The range of color mixing becomes narrow and color unevenness is likely to occur. Therefore, a diffusion member such as a glass bead must be uniformly disposed in the sealing portion for sealing the LED chip as in the above-described conventional example, and a large amount of the diffusion member is required. There was a problem of becoming higher.

本発明は上記事情に鑑みて為されたものであり、その目的は、製造コストを下げつつ色むらが抑制できる発光装置及び照明器具を提供することにある。   This invention is made | formed in view of the said situation, The objective is to provide the light-emitting device and lighting fixture which can suppress color unevenness, reducing manufacturing cost.

請求項1の発明は、上記目的を達成するために、互いに波長の異なる光を放射する複数の固体発光素子と、これら複数の固体発光素子が実装される実装部と、透光性材料により固体発光素子を封止してなる封止部と、封止部に設けられて固体発光素子から放射される光を拡散させる拡散部とを備え、実装部は、複数の固体発光素子の光軸が互いに交差するように少なくとも1つの固体発光素子が他の固体発光素子に対して傾けて実装されることを特徴とする。   In order to achieve the above object, a first aspect of the present invention provides a plurality of solid light emitting elements that emit light having different wavelengths, a mounting portion on which the plurality of solid light emitting elements are mounted, and a light-transmitting material. A sealing part formed by sealing the light emitting element; and a diffusion part provided in the sealing part for diffusing light emitted from the solid light emitting element. The mounting part has an optical axis of the plurality of solid light emitting elements. At least one solid state light emitting device is mounted to be inclined with respect to another solid state light emitting device so as to cross each other.

請求項2の発明は、請求項1の発明において、複数の固体発光素子から放射される光を拡散部に集光する集光部を備えたことを特徴とする。   According to a second aspect of the present invention, in the first aspect of the present invention, the light emitting device includes a condensing unit that condenses the light emitted from the plurality of solid state light emitting elements on the diffusing unit.

請求項3の発明は、請求項1または2の発明において、封止部は、拡散部で拡散された光を配光する配光部が一体に設けられてなることを特徴とする。   According to a third aspect of the present invention, in the first or second aspect of the present invention, the sealing portion is integrally provided with a light distribution portion that distributes the light diffused by the diffusion portion.

請求項4の発明は、上記目的を達成するために、請求項1〜3の何れか1項の発光装置と、1乃至複数の発光装置を支持する器具本体とを備えたことを特徴とする。   In order to achieve the above object, a fourth aspect of the invention includes the light-emitting device according to any one of the first to third aspects and an instrument body that supports one or more light-emitting devices. .

請求項1並びに請求項4の発明によれば、複数の固体発光素子の光軸が互いに交差するように少なくとも1つの固体発光素子が他の固体発光素子に対して傾けて実装部に実装されるので、従来例のように平板状の実装基板に並べて複数の固体発光素子が実装される場合と比較して、各固体発光素子が放射する光を混色する範囲が広くなって色むらが抑制でき、しかも、全体としては光の照射範囲が狭まることから拡散部が小さくて済むために製造コストを下げることができる。   According to the first and fourth aspects of the present invention, at least one solid light emitting element is mounted on the mounting portion so as to be inclined with respect to the other solid light emitting elements so that the optical axes of the plurality of solid light emitting elements intersect each other. Therefore, compared to the case where a plurality of solid state light emitting elements are mounted side by side on a flat mounting board as in the conventional example, the range of color mixing of light emitted by each solid state light emitting element is widened and color unevenness can be suppressed. In addition, since the light irradiation range as a whole is narrowed, the diffusion portion can be made small, so that the manufacturing cost can be reduced.

請求項2の発明によれば、集光部によって拡散部に光を集光するので、効率よく混色することができるとともに、拡散部を小型化することができて配光制御が容易になる。   According to the second aspect of the present invention, since the light is condensed on the diffusing portion by the condensing portion, it is possible to efficiently mix colors, and the diffusing portion can be miniaturized and the light distribution control becomes easy.

請求項3の発明によれば、混色された光を配光部によって配光するので、別に配光部材を設ける必要がなく、発光装置を使った照明器具等の小型化が図れる。   According to the invention of claim 3, since the mixed light is distributed by the light distribution section, it is not necessary to provide a separate light distribution member, and the size of the lighting fixture using the light emitting device can be reduced.

以下、図面を参照して本発明に係る発光装置と照明器具の実施形態について詳細に説明する。   Hereinafter, embodiments of a light emitting device and a lighting fixture according to the present invention will be described in detail with reference to the drawings.

図1(a)は本実施形態の発光装置の一部破断した斜視図、同図(b)は断面図をそれぞれ示している。   FIG. 1A is a partially broken perspective view of the light emitting device of the present embodiment, and FIG.

本実施形態の発光装置は、互いに波長の異なる光を放射する複数(図示例では3つ)のLEDチップ10と、これら3つのLEDチップ10が実装された実装部11と、実装部11が載置され且つ固定される基台12と、各LEDチップ10および個々のLEDチップ10に接続されたボンディングワイヤ(図示せず)を封止する封止部13とを備えている。なお,3つのLEDチップ10は、青色、赤色、緑色の3種類の光をそれぞれ放射するGaN系青色LEDチップ、GaAs系赤色LEDチップ、GaP系緑色LEDチップである。   The light emitting device of this embodiment includes a plurality of (three in the illustrated example) LED chips 10 that emit light having different wavelengths, a mounting unit 11 on which these three LED chips 10 are mounted, and a mounting unit 11. A base 12 that is placed and fixed, and a sealing portion 13 that seals each LED chip 10 and a bonding wire (not shown) connected to each LED chip 10. The three LED chips 10 are a GaN-based blue LED chip, a GaAs-based red LED chip, and a GaP-based green LED chip that respectively emit three types of light of blue, red, and green.

実装部11は、直角三角形の鋭角となる頂点から離間した位置を通る中心線の回りに当該直角三角形を回転させてできる回転体の形状を有し、基台12に載置される底面が平坦面であって、当該底面に対してLEDチップ10が実装される実装面11aが傾斜している。3つのLEDチップ10は、実装部11の実装面11a上に等間隔に並べて実装され、実装面11a上に形成されている導電パターン(図示せず)にアノード電極とカソード電極が各々図示しないボンディングワイヤで接続される。   The mounting portion 11 has a shape of a rotating body formed by rotating the right triangle around a center line passing through a position away from the acute vertex of the right triangle, and the bottom surface placed on the base 12 is flat. The mounting surface 11a on which the LED chip 10 is mounted is inclined with respect to the bottom surface. The three LED chips 10 are mounted on the mounting surface 11a of the mounting part 11 at equal intervals, and an anode electrode and a cathode electrode are not shown on the conductive pattern (not shown) formed on the mounting surface 11a. Connected with wires.

封止部13は、LEDチップ10と実装部11を内側に収納する形で基台12に固定されるドーム状のカバー14の内側に透明樹脂材料を充填して形成される。カバー14は、シリコーン樹脂のような透明材料の成形品によってドーム形状に形成されており、内側に実装部11を収める形で開口部の周縁が基台12に対して接着される。そして、シリコーン樹脂やアクリル樹脂などの透明樹脂材料15がカバー14内に充填されることで封止部13が形成される。   The sealing portion 13 is formed by filling a transparent resin material inside a dome-shaped cover 14 fixed to the base 12 so as to accommodate the LED chip 10 and the mounting portion 11 inside. The cover 14 is formed in a dome shape by a molded product of a transparent material such as silicone resin, and the periphery of the opening is bonded to the base 12 so as to accommodate the mounting portion 11 inside. The sealing portion 13 is formed by filling the cover 14 with a transparent resin material 15 such as silicone resin or acrylic resin.

また、カバー14の天頂部分(3つのLEDチップ10の光軸Lが交差する点を中心とした円形の部分)にはガラスビーズ等の拡散部材16aが混入されており、拡散部材16aが混入されている前記天頂部分がLEDチップ10から放射される光を拡散する拡散部16となる。但し、図1(c)に示すように拡散部材16aを混入する代わりにカバー14の天頂部分における外側表面に断面形状略三角形の凹凸を形成することで拡散部16を設けてもよい。なお、カバー14の材料として用いる透明材料は、シリコーン樹脂に限らず、例えば、アクリル樹脂、エポキシ樹脂、ガラスなどを採用してもよい。   Further, a diffusing member 16a such as glass beads is mixed in the zenith portion of the cover 14 (a circular portion around the point where the optical axes L of the three LED chips 10 intersect), and the diffusing member 16a is mixed. The zenith portion is a diffusion portion 16 that diffuses light emitted from the LED chip 10. However, as shown in FIG. 1C, the diffusing portion 16 may be provided by forming irregularities having a substantially triangular cross-section on the outer surface of the zenith portion of the cover 14 instead of mixing the diffusing member 16 a. The transparent material used as the material of the cover 14 is not limited to the silicone resin, and for example, an acrylic resin, an epoxy resin, glass, or the like may be employed.

而して、図1(a),(b)に示すように各LEDチップ10の光軸Lは、実装部11の実装面11aが底面に対して傾斜していることで平行とならず、カバー14の厚み方向におけるほぼ中央で互いに交差することになる。このように実装部11の実装面11aに実装された3つのLEDチップ10の光軸Lがカバー14の天頂部分に設けられた拡散部16の位置で互いに交差するので、従来例のように平板状の実装基板に並べて複数のLEDチップが実装される場合と比較して、各LEDチップ10が放射する光を混色する範囲が広くなって色むらが抑制できる。しかも、全体としては光の照射範囲が狭まるため、LEDチップ10から放射される光を拡散するための拡散部16をカバー14の天頂部分にだけ設ければよく、従来例のようにカバー14全体に拡散部材16aを混入する必要がないことから拡散部16が小さくて済むために製造コストを下げることができる。   Thus, as shown in FIGS. 1A and 1B, the optical axis L of each LED chip 10 is not parallel because the mounting surface 11a of the mounting part 11 is inclined with respect to the bottom surface. The covers 14 cross each other at substantially the center in the thickness direction. As described above, the optical axes L of the three LED chips 10 mounted on the mounting surface 11a of the mounting portion 11 intersect each other at the position of the diffusion portion 16 provided at the zenith portion of the cover 14, so Compared with the case where a plurality of LED chips are mounted side by side on a solid mounting board, the range in which the colors emitted by the LED chips 10 are mixed is widened, and color unevenness can be suppressed. In addition, since the light irradiation range as a whole is narrowed, a diffusion portion 16 for diffusing the light emitted from the LED chip 10 may be provided only at the zenith portion of the cover 14, and the entire cover 14 as in the conventional example. Since it is not necessary to mix the diffusing member 16a, the diffusing portion 16 can be made small, so that the manufacturing cost can be reduced.

ここで、図2(a)に示すように3つのLEDチップ10から放射される光を各々拡散部16に集光する3つの集光部17を封止部13に設けてもよい。これら3つの集光部17は、カバー14の天頂部分における内側より突出し、LEDチップ10と対向する入射面が凸曲面状に形成された凸レンズからなり、LEDチップ10から放射される光を各々拡散部16に集光する。このように集光部17を設けることによって効率よく混色することができるとともに、拡散部16を小型化することができて配光制御が容易になるという利点がある。   Here, as shown in FIG. 2A, three condensing units 17 that condense light emitted from the three LED chips 10 onto the diffusing unit 16 may be provided in the sealing unit 13. These three condensing parts 17 protrude from the inner side of the zenith portion of the cover 14 and are formed of a convex lens whose incident surface facing the LED chip 10 is formed in a convex curved surface, and each diffuses light emitted from the LED chip 10. Condensed on the part 16. Thus, by providing the condensing part 17, there exists an advantage that while being able to mix colors efficiently, the spreading | diffusion part 16 can be reduced in size and light distribution control becomes easy.

さらに、図2(b)に示すように拡散部16で拡散された光を配光する配光部18を封止部13と一体に設けても構わない。図示例の配光部18は、カバー14の天頂部分(拡散部16)の外側に突出し且つ先端面が凸曲面状に形成された凸レンズからなる。このように拡散部16を通して混色された光(白色光)を配光部18によって配光すれば、別途配光部材を設ける必要がなく、発光装置を使った照明器具等の小型化が図れるという利点がある。   Furthermore, as shown in FIG. 2B, a light distribution unit 18 that distributes the light diffused by the diffusion unit 16 may be provided integrally with the sealing unit 13. The light distribution unit 18 in the illustrated example is formed of a convex lens that protrudes outside the zenith portion (diffusion unit 16) of the cover 14 and has a tip surface formed into a convex curved surface. If the light (white light) mixed through the diffusing unit 16 is distributed by the light distributing unit 18 in this way, it is not necessary to provide a separate light distribution member, and it is possible to reduce the size of a lighting fixture using a light emitting device. There are advantages.

なお、実装部11の形状は本実施形態のものに限定されるものではなく、複数のLEDチップ10の光軸Lが互いに交差するように実装可能であれば、どのような形状であっても構わない。また、実装部11に実装されるLEDチップ10の個数並びに発光色の種類も3つに限定されるものではなく、2つあるいは4つ以上のLEDチップ10を実装部11に実装しても良いし、青色、赤色、緑色に加えて橙色や黄色の光を放射するLEDチップ10を実装しても良い。   Note that the shape of the mounting portion 11 is not limited to that of the present embodiment, and any shape is possible as long as mounting is possible so that the optical axes L of the plurality of LED chips 10 intersect each other. I do not care. Further, the number of LED chips 10 mounted on the mounting unit 11 and the type of emission color are not limited to three, and two or four or more LED chips 10 may be mounted on the mounting unit 11. The LED chip 10 that emits orange or yellow light in addition to blue, red, and green may be mounted.

図3は本実施形態の照明器具を示す一部省略した斜視図である。この照明器具は所謂ダウンライトであって、有底円筒形の器具本体100の底面100aに、上述した複数の発光装置1が取り付けられ、ガラスや透明樹脂材料からなる保護カバー(図示せず)によって器具本体100の開口面が閉塞されて構成される。但し、本発明に係る照明器具はダウンライトに限定されるものではない。   FIG. 3 is a partially omitted perspective view showing the lighting apparatus of the present embodiment. The lighting fixture is a so-called downlight, and the plurality of light emitting devices 1 described above are attached to the bottom surface 100a of the bottomed cylindrical fixture body 100, and a protective cover (not shown) made of glass or transparent resin material. The opening surface of the instrument body 100 is configured to be closed. However, the lighting fixture according to the present invention is not limited to a downlight.

本発明に係る発光装置の実施形態を示し、(a)は一部破断した斜視図、(b)は断面図、(c)は拡散部の他の構造を示す部分断面図である。1 shows an embodiment of a light emitting device according to the present invention, where (a) is a partially broken perspective view, (b) is a cross-sectional view, and (c) is a partial cross-sectional view showing another structure of a diffusion portion. (a)は集光部を設けた場合の同上の断面図、(b)は集光部と配光部を設けた場合の同上の断面図である。(A) is sectional drawing same as the above at the time of providing a condensing part, (b) is sectional drawing same as the above at the time of providing a condensing part and a light distribution part. 本発明に係る照明器具の実施形態を示す要部の斜視図である。It is a perspective view of the principal part which shows embodiment of the lighting fixture which concerns on this invention.

符号の説明Explanation of symbols

10 LEDチップ
11 実装部
11a 実装面
13 封止部
14 カバー
16 拡散部
DESCRIPTION OF SYMBOLS 10 LED chip 11 Mounting part 11a Mounting surface 13 Sealing part 14 Cover 16 Diffusion part

Claims (4)

互いに波長の異なる光を放射する複数の固体発光素子と、これら複数の固体発光素子が実装される実装部と、透光性材料により固体発光素子を封止してなる封止部と、封止部に設けられて固体発光素子から放射される光を拡散させる拡散部とを備え、
実装部は、複数の固体発光素子の光軸が互いに交差するように少なくとも1つの固体発光素子が他の固体発光素子に対して傾けて実装されることを特徴とする発光装置。
A plurality of solid-state light-emitting elements that emit light having different wavelengths, a mounting portion on which the plurality of solid-state light-emitting elements are mounted, a sealing portion formed by sealing the solid-state light-emitting elements with a translucent material, and a sealing A diffusion unit that is provided in the unit and diffuses light emitted from the solid state light emitting device,
The mounting unit is mounted with at least one solid-state light-emitting element tilted with respect to another solid-state light-emitting element so that the optical axes of the plurality of solid-state light-emitting elements intersect each other.
複数の固体発光素子から放射される光を拡散部に集光する集光部を備えたことを特徴とする請求項1記載の発光装置。   The light-emitting device according to claim 1, further comprising a condensing unit that condenses light emitted from the plurality of solid-state light-emitting elements on the diffusion unit. 封止部は、拡散部で拡散された光を配光する配光部が一体に設けられてなることを特徴とする請求項1または2記載の発光装置。   The light-emitting device according to claim 1, wherein the sealing unit is integrally provided with a light distribution unit that distributes light diffused by the diffusion unit. 請求項1〜3の何れか1項の発光装置と、1乃至複数の発光装置を支持する器具本体とを備えたことを特徴とする照明器具。   An illumination fixture comprising: the light-emitting device according to any one of claims 1 to 3; and a fixture main body that supports one or more light-emitting devices.
JP2006261512A 2006-09-26 2006-09-26 Light-emitting apparatus and illumination appliance Pending JP2008084990A (en)

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JP2010015700A (en) * 2008-07-01 2010-01-21 Fujifilm Corp Lighting system, and image capturing apparatus
JP2011034760A (en) * 2009-07-31 2011-02-17 Toshiba Lighting & Technology Corp Luminaire
JP2011253158A (en) * 2010-06-04 2011-12-15 Mitsubishi Electric Corp Display unit and image display device using the same
JP2012004973A (en) * 2010-06-18 2012-01-05 Toshiba Corp Television apparatus and electronic apparatus
JP2012009723A (en) * 2010-06-28 2012-01-12 Nichia Chem Ind Ltd Optical semiconductor device and method of manufacturing the same
JP2012151145A (en) * 2011-01-14 2012-08-09 Panasonic Corp Illumination light source
JP2012182117A (en) * 2011-02-07 2012-09-20 Advan Lighting:Kk Tubular lighting fixture, casing for tubular lighting fixture and both-side inner illumination-type signboard
JP2014146612A (en) * 2009-07-13 2014-08-14 Rohm Co Ltd Led lighting device
US9273830B2 (en) 2007-06-14 2016-03-01 Cree, Inc. Light source with near field mixing
US9287469B2 (en) 2008-05-02 2016-03-15 Cree, Inc. Encapsulation for phosphor-converted white light emitting diode
CN106549088A (en) * 2015-09-17 2017-03-29 光宝光电(常州)有限公司 Light emitting display device
EP3518298A4 (en) * 2016-09-23 2020-05-20 Shenzhen Keweitian Eco-Lighting Co., Ltd. PEARL STRUCTURE OF AN LED LAMP WITH A SUN-LIKE SPECTRUM
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size

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US9273830B2 (en) 2007-06-14 2016-03-01 Cree, Inc. Light source with near field mixing
US11114594B2 (en) 2007-08-24 2021-09-07 Creeled, Inc. Light emitting device packages using light scattering particles of different size
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JP2009302202A (en) * 2008-06-11 2009-12-24 Panasonic Electric Works Co Ltd Light-emitting apparatus
JP2010015700A (en) * 2008-07-01 2010-01-21 Fujifilm Corp Lighting system, and image capturing apparatus
JP2014146612A (en) * 2009-07-13 2014-08-14 Rohm Co Ltd Led lighting device
JP2011034760A (en) * 2009-07-31 2011-02-17 Toshiba Lighting & Technology Corp Luminaire
JP2011253158A (en) * 2010-06-04 2011-12-15 Mitsubishi Electric Corp Display unit and image display device using the same
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JP2012182117A (en) * 2011-02-07 2012-09-20 Advan Lighting:Kk Tubular lighting fixture, casing for tubular lighting fixture and both-side inner illumination-type signboard
CN106549088A (en) * 2015-09-17 2017-03-29 光宝光电(常州)有限公司 Light emitting display device
CN106549088B (en) * 2015-09-17 2018-11-16 光宝光电(常州)有限公司 Light emitting display device
EP3518298A4 (en) * 2016-09-23 2020-05-20 Shenzhen Keweitian Eco-Lighting Co., Ltd. PEARL STRUCTURE OF AN LED LAMP WITH A SUN-LIKE SPECTRUM

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