JP2008084938A - Method for teaching various setting values to substrate processing apparatus, teachingapparatus, and calibration jig thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a teaching apparatus for obtaining excellent teaching accuracy and also provide a teaching method. <P>SOLUTION: First, a wafer flexure check carrier 15 and a teaching jig 11 provided with a plurality of displacement sensors 10a to 10e for measuring distance L to a plurality of reflection plates of a substrate 5 for calibration are set to a carrier stage 6. Teaching of parallelism and substrate accommodation height position of the carrier stage 6 is executed by accommodating the substrate 5 for calibration to the predetermined calibration start position within the wafer flexure check carrier 15 with a robot hand 3 for alignment of distance read from the displacement sensors 10a to 10e of the teaching jig 11. Finally, the robot hand 3 is moved to the axes θ and X to execute calibration of the substrate accommodation position with detection of wafer edge with the displacement sensors 10a to 10d and teaching of inserting height position of the robot hand with measurement of flexure by the displacement sensor 10e. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for teaching various set values for a substrate processing apparatus, a teaching apparatus, and a calibration jig therefor, and more particularly, a substrate processing apparatus provided with a robot hand for taking in and out a substrate from a carrier accommodating a plurality of substrates. The present invention relates to a teaching method of various setting values, a teaching device, and a calibration jig thereof.

  As a typical facility having a robot hand (arm) for extracting and storing a semiconductor wafer from a carrier (container), there is an apparatus that performs processing such as sheet peeling and back surface grinding. Other substrate processing apparatuses that perform various types of processing on substrates such as glass substrates for liquid crystal display devices, glass substrates for photomasks, and glass substrates for optical disks are also known that include a robot hand (arm).

  FIG. 10 shows a configuration of a substrate processing apparatus in which a plurality of wafers (for example, 25 sheets) set on a carrier are extracted by a robot and subjected to various processes (sheet peeling, back surface grinding, etc.) and then stored in the same carrier. It is a figure showing the flow of a wafer. This type of apparatus is different in only the processing unit shown in the figure, and the structure in which the robot is installed in the center and the carrier stage is provided on both sides of the robot is almost the same.

  FIG. 11 is a diagram showing an operation until the robot hand pulls out the wafer from the carrier in the substrate processing apparatus. A carrier 4 in which a plurality of wafers 5 a are stored is set on a carrier stage 6. After the robot 2 has moved to the position where the wafer is picked by the moving means in the Z-axis direction (for example, in the example of FIG. 11, the first wafer in the carrier is below the first wafer) ((a) of FIG. 11), It moves in the axial direction and enters the carrier ((b) of FIG. 11). Further, after the robot 2 moves up in the Z-axis direction and sucks the wafer 5a (FIG. 11 (c)), the robot hand 3 moves in the X-axis direction and takes out the wafer 5a from the carrier 4 ((d) in FIG. )), And rotated in the θ-axis direction and conveyed to the orientation flat aligner (OF aligner in FIG. 10). Then, the wafer 5a processed by the processing unit is stored in the carrier 4 by the reverse operation to the above.

  In the substrate processing apparatus described above, prior to actually moving the substrate, teaching (teaching) is performed to teach (learn) the position of the carrier to the control unit of the robot hand holding the wafer by the person in charge of equipment maintenance. ing.

  Various teaching jigs for performing the teaching (teaching) operation with high accuracy and in a short time have been proposed. For example, Patent Document 1 discloses a method in which a centering jig is set in a carrier, a pin on the centering jig is detected by a sensing jig installed on an arm, and an arm position deviation amount is acquired to perform teaching. Is disclosed.

  Also, in Patent Document 2, a teaching jig having a conical shape portion at the center is installed on a carrier, and a Z-direction is detected based on the cross-sectional diameter of the conical portion by a transmission type sensor provided at the tip of a robot hand. A method is disclosed.

Further, Patent Documents 3 and 4 disclose techniques for detecting the tilt and deflection of the wafer on the arm. The former detects the tilt state of the wafer on the arm using a distance measurement sensor fixed downward, and the latter is detected by arranging a wafer warp height detection sensor on the side of the arm. The height correction at the time of wafer storage is performed using the wafer warp amount.
Japanese Patent Laid-Open No. 11-163084 JP 2004-193333 A JP 2005-26667 A JP 2005-260010 A

  In order to explain the problems of the above prior art, a conventional teaching flow in the wafer processing apparatus will be described with reference to FIGS. As preparation for teaching, since the suction position of the robot hand and the wafer is used as a reference, a normal wafer processing operation is once performed and stopped when the robot turns to the carrier side. Here, the carrier is removed, and the robot hand is moved in the X-axis direction and stopped on the carrier stage.

  In this state, the robot hand and the carrier stage are leveled. As shown in FIG. 12, leveling is performed by adjusting the level of the carrier stage 6 so that the scale 9 is applied to the four positions of the wafer 5a adsorbed to the robot hand 3 and the heights of the four positions with the carrier are the same scale. Adjust with screw 7.

  Subsequently, Z-axis teaching is performed on the position control unit of the robot hand. After the leveling, the robot hand 3 is moved in the X-axis direction, removed from the carrier stage 6, and then the carrier is placed on the carrier stage 6. Then, the robot hand 3 is moved again in the X-axis direction and stopped at a position where it does not come into contact with the carrier. Here, the robot 5 moves in the Z-axis direction so that the wafer 5a adsorbed by the robot hand 3 comes to the center of the groove (wafer insertion portion) of the carrier and aligns it visually. This numerical value is taught as Z-axis wafer storage position data.

  Subsequently, teaching of the X-axis and the θ-axis is performed on the position control unit of the robot hand. First, the robot hand is moved in the X-axis direction and stopped before the center of the wafer hits the carrier. Here, the θ direction of the robot is moved and aligned visually so that the carrier grooves (wafer insertion portion) and the gaps A and A ′ (see FIG. 13) between the wafers are equal to each other. This numerical value is taught to the position control unit of the robot hand as θ-axis data.

  Further, as shown in FIG. 13, the robot hand is moved in the X-axis direction, and is stopped at a position where it does not contact the back of the carrier groove and a clearance B while visually confirming. This numerical value is taught to the position control unit of the robot hand as X-axis data.

  Finally, the wafer suction of the robot hand 3 is cut, the robot hand is lowered in the Z-axis direction, and the robot hand is stopped by a predetermined distance downward (for example, 0.5 mm) from a position away from the wafer while visually confirming. This position is taught to the position control unit of the robot hand as the robot hand insertion position.

  Through the above adjustment, teaching in the Z-axis direction, the X-axis direction, and the θ-axis direction is completed.

  However, since the substrate to be handled itself is thin and the groove pitch of the carrier for storing it is also narrow, the above scale and visual method depend on the skill level and technical skill of the teaching worker. In addition to the work time, there is a problem in that the accuracy also varies.

  In addition, the devices and jigs described in Patent Documents 1 and 2 realize teaching to a robot hand (arm) based on the amount of displacement acquired by various sensors, but the level of the carrier itself is not guaranteed. There is a problem. Leveling of the carrier base on which the carrier is placed is performed by a visual method using the scale or the like. However, if leveling with sufficient accuracy is not possible, the wafer comes into contact with the groove of the carrier, It is also possible that cracking will occur.

  Further, Patent Document 4 discloses a transfer method that measures the deflection of a wafer at the time of transfer (at the time of arm suction) and considers the amount of the bend. However, since the suction is not performed when the carrier is stored, the amount of bend is larger. There is a problem of becoming. Of course, in the devices and jigs of Patent Documents 1 and 2, bending is not taken into consideration at all.

  According to a first aspect of the present invention, there is provided a teaching apparatus applied to a substrate processing apparatus including a robot hand for taking in and out a substrate from a carrier that accommodates a plurality of substrates. A teaching carrier that allows measurement of the distance from the displacement sensor, and a teaching jig that includes a plurality of displacement sensors that measure the distance from the calibration substrate, and is disposed above the teaching carrier, The carrier base on which the carrier is placed is leveled by adjusting the distance read from the displacement sensor in a state where the calibration substrate is held at a predetermined teaching start position in the teaching carrier by the robot hand. There is provided a teaching apparatus characterized in that teaching of various set values for the robot hand can be executed after execution.

  According to a second aspect of the present invention, there is provided a teaching method of various set values for a substrate processing apparatus provided with a robot hand that takes in and out a substrate from a carrier that accommodates a plurality of substrates, and is disposed above. A teaching carrier that allows distance measurement from the displacement sensor, and a plurality of displacement sensors that measure the distance from the calibration substrate, and a teaching jig disposed above the teaching carrier, A step of setting the carrier base to be placed; a step of holding the calibration substrate at a predetermined teaching start position in the teaching carrier by the robot hand; and a distance read from the displacement sensor of the teaching jig. A step of performing leveling of the carrier base on which the carrier is placed, and operating the robot hand to Teaching method of various set values for the substrate processing apparatus may include a step of executing the teachings of the various setting values, and characterized that is provided.

  According to the present invention, since the mechanism for realizing the leveling of the carrier base is incorporated in the teaching jig, it is possible to achieve the required teaching accuracy regardless of the experience and skill of the person in charge of equipment maintenance. It becomes. As a result, teaching misalignment is eliminated, and wafer scratches and cracks due to teaching misalignment can be prevented. Furthermore, it is possible to improve the operation rate of various substrate processing apparatuses such as a sheet peeling apparatus and a back surface grinding apparatus and to improve the product yield.

  Next, the best mode for carrying out the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic plan view (a) and a schematic side view (b) of a teaching device (teaching device) used when a teaching method according to an embodiment of the present invention is performed in a sheet peeling apparatus. .

  A schematic plan view (a) of FIG. 1 shows a state in which a calibration wafer 5 used as teaching equipment is moved by a robot hand 3 into a wafer deflection amount check carrier 15 installed on a carrier stage 6. In FIG. 1A, the housing of the teaching jig (teaching jig) 11 included in the teaching device is omitted, and the teaching jig 11 has a housing inside the housing. Only the arrangement of five LED displacement sensors 10a, 10b, 10c, 10d, and 10e arranged in a cross shape is shown.

  Referring to the schematic side view (b) of FIG. 1, the LED displacement sensors 10 a, 10 b, 10 c, 10 d, and 10 e are fixed downward in the layout described above, and an opening that allows the calibration wafer 5 to be taken in and out by the robot hand 3 is provided. The teaching jig 11 which has, the display unit 13 provided with the digital meter 14 for displaying the output signal of LED displacement sensor 10a, 10b, 10c, 10d, 10e, and the cable 12 which connects these are shown.

  Further, in the schematic side view (b) of FIG. 1, a wafer deflection amount check carrier 15 and a teaching jig 11 are placed on a carrier stage 6 that can be horizontally adjusted by a level adjustment screw 7 on a stage base 8. Thus, the distance L between the LED displacement sensors 10a to 10e and the reflecting plate installed on the calibration wafer 5 can be measured.

  In practice, the distance is displayed on the digital meter 14 by adding a plus / minus sign to the target value set in advance by “0” calibration described later.

  FIG. 2 is a front view (a) and a plan view (b) of the wafer deflection amount check carrier 15 installed on the carrier stage 6. The wafer deflection amount check carrier 15 has an open shape in which a carrier normally used in a sheet peeling apparatus or the like is cut at the center of the first carrier groove from the bottom surface, and inside the carrier guide on the carrier stage 6. Set without clearance. Although not shown in the figure, the teaching jig 11 is also set outside the wafer deflection amount check carrier 15 without a clearance.

  FIG. 3 is a diagram for explaining the configuration of the calibration wafer 5 and the principle of horizontal detection by the LED displacement sensor 10. As shown in the figure, the calibration wafer 5 is a reflecting plate having a predetermined diameter (10 mm in the example of FIG. 3) on the wafer before grinding, etc., in a cross-shaped layout similar to the LED displacement sensor 10 described above. 18 is pasted. Black circles in the figure are visible light spots emitted by the LED displacement sensor 10 of the teaching jig 11. For example, as shown in FIG. 3A, when the distance between the reflector 18 and each LED displacement sensor 10 is the target value L, the digital meter 14 of the display unit 13 is all “0” is displayed. Further, as shown in FIG. 3B, when the distance between the reflector 18 and each LED displacement sensor 10 does not reach the target value L (the robot hand 3 or the carrier stage 6 is not level). The digital meter 14 of the display unit 13 becomes a numerical display.

  The reason why the wafer before grinding is used as the calibration wafer 5 in this embodiment is that the influence of bending can be excluded by separately measuring the amount of bending as will be described later. It can also be used as an industrial wafer.

  FIG. 4 is a diagram illustrating an arrangement example of the LED displacement sensors 10 a to 10 e on the teaching jig 11. The black circle in the figure is a spot display of visible light emitted from the LED displacement sensor, and indicates the positions of the LED displacement sensors 10a to 10e. In the example of FIG. 4, a position where the clearances A and A ′ of the wafer deflection amount check carrier 15 and the calibration wafer 5 are the same, and a clearance B between the wafer deflection amount check carrier 15 and the calibration wafer 5 (example: 1 mm). The position where is provided is the optimum position in the carrier. In this case, the LED displacement sensors 10a to 10d corresponding to the reflection plate 18 disposed on the peripheral edge of the calibration wafer 5 are divided into four equal parts on the wafer circumference, and a predetermined distance from each wafer edge (example: 5 mm) is fixed to the teaching jig 11 on the inner side. The LED displacement sensor 10e corresponding to the reflecting plate 18 arranged at the center of the calibration wafer 5 is fixed to the teaching jig 11 at the center position of the wafer set on the carrier.

  FIG. 5 is a plan view (a) and a side view (b) of the calibration jig 16 for calibrating the teaching jig 11 described above. The calibration jig 16 holds the calibration wafer 5 on the base plate large enough to horizontally place the teaching jig 11 at the same height as the first groove of the wafer deflection amount check carrier 3. A reference unit 17 of the book is erected. The usage will be described in detail later.

  Then, the teaching method performed using each above-mentioned apparatus is demonstrated. FIG. 6 is a diagram showing the flow of the teaching method according to the present invention. First, an approximate flow from step 0 to step 5 in FIG. 6 will be described. Referring to FIG. 6, first, as a teaching preparation stage, the calibration jig 16 and the calibration wafer 5 are used to perform “0” display calibration of the digital meter 14 on which the LED displacement sensor output value of the teaching jig 11 is displayed. Perform (Step 0).

  Subsequently, after setting the wafer deflection amount check carrier 15 and the teaching jig 11 on the carrier stage 6 (step 1), the calibration wafer 5 is placed on the wafer deflection amount check carrier 15 and a series of transfer operations are performed. At this time, the X-axis and the θ-axis are adjusted as appropriate, and the reflecting plate 18 of the calibration wafer 5 is stopped so that the spot of the LED displacement sensor 10 of the teaching jig 11 hits (step 2).

  While referring to the display of the digital meter 14, the angle of the carrier stage 6 and the robot hand 3 is adjusted (leveling of the carrier stage) (step 3).

  Subsequently, teaching on the robot hand side (step 4) and teaching of the robot hand insertion position based on a value corrected based on the deflection amount of the calibration wafer 5 are performed (step 5).

  Next, step 0 to step 5 will be described in detail step by step. Step 0 is a calibration process of the teaching jig 11 performed in order to perform teaching quickly and accurately.

  In step 0, as shown in FIG. 7, the teaching jig 11 is placed on the calibration jig 16, the display unit 13 is reset, and the adjustment on the teaching jig 11 side so that the display of the digital meter 14 becomes “0”. I do. Thus, by setting the display of the digital meter 14 to “0”, the distance between the calibration wafer 5 on the calibration jig 16 and the LED displacement sensor 10 is calibrated in a state where it is placed on the robot hand. This is matched with the target value L, which is the distance between the wafer 5 and the LED displacement sensor 10, and the teaching accuracy thereafter is maintained.

  In step 1, the teaching jig 11 calibrated as described above and the wafer deflection amount check carrier 15 are set on the carrier stage 6.

  In the subsequent step 2, the calibration wafer 5 is placed on the wafer deflection amount check carrier 15 by the robot hand 3. Prior to teaching, since the suction position between the robot hand 3 and the calibration wafer 5 is used as a reference, a normal wafer processing operation is once performed (see FIG. 10), and when the robot hand 3 turns to the carrier side. Stop. From this state, the robot hand 3 is moved in the X-axis direction, and the display of the LED displacement sensors 10a, 10b, 10c, 10d, and 10e is stopped at a position where all numerical values are displayed (see FIG. 4). At this time, the θ-axis is also adjusted as appropriate, so that the reflecting plate 18 of the calibration wafer 5 and the spot of the LED displacement sensor 10 of the teaching jig 11 come into contact with each other.

  In the subsequent step 3, the carrier stage 6 is leveled and the robot hand 3 is taught in the Z-axis direction. FIG. 8 shows a state where Step 2 is completed and the carrier stage is tilted. In the example of FIG. 8, the carrier stage 6 is not parallel to each other with respect to the robot hand 3, but is inclined at an angle θ (or also in the left-right direction) in the front-rear direction. At this time, the distance from the calibration wafer 5 placed on the robot hand 3 detected by the LED displacement sensors 10a, 10b, 10c, and 10d is m, n, and o (m <n <o). This can be confirmed by the display on the meter 14.

  The person in charge of equipment maintenance adjusts the leveling with the level adjusting screw 7 of the carrier stage 6 so that all the display values of the digital meter 14 become “0” (= target value L). At this time, since the target value L is set at the wafer storage position, the height is taught to the position control unit (not shown) of the robot hand simultaneously with the leveling of the carrier stage 6 and the teaching jig 11. Then, teaching of the wafer storage position in the robot hand Z-axis direction is completed.

  In the subsequent step 4, teaching on the robot hand 3 side is performed. First, teaching in the θ-axis direction is performed. For example, movement by the position control unit of the robot hand 3 is performed, and teaching in the + direction (or − direction) of the θ-axis direction in FIG. 4 is performed.

  The robot hand 3 is manually moved in the + direction (or-direction) of the θ axis, and the position at which the LED displacement sensor 10b (or 10d) does not display a numerical value, for example, the numerical value display displays "0" from "0" display. The movement is stopped at the position, and the θ-axis numerical value displayed on the position display device (not shown) on the robot side is read. Here, the display of the LED displacement sensor 10b (or 10d) changes from “0” display to “−” to indicate that the spot of the LED displacement sensor 10b (or 10d) has moved out of the wafer edge. Yes. At this time, the display on the robot side is displayed in mm units (for example, numerical display “10.99”). Teach the robot hand's position controller as the optimum position in the θ-axis direction on the robot side, the position moved from this position in the θ-axis-direction (or + direction) inward by a predetermined distance (eg, 5 mm in the example of FIG. 4) Let For example, when the display on the robot side is “10.99” and the optimum position in the θ-axis direction is determined to be “5 mm” inside the wafer edge, the optimum position in the θ-axis direction is 10.99-5.00. = 5.99.

  Similarly, in the X-axis direction, the robot hand 3 is manually moved in the X-axis + direction, and the position at which the LED displacement sensor 10c does not display a numerical value, for example, the numerical value display from “0” to “−” is displayed. The movement is stopped by reading the X-axis numerical value displayed on the position display device (not shown) on the robot side. The position moved from the position inward in the X-axis direction by a predetermined distance (eg, 5 mm in the example of FIG. 4) is taught to the position control unit of the robot hand as the optimum position in the X-axis direction on the robot side. For example, when the display on the robot side is “100.04” and the optimum position in the X-axis direction is determined to be “5 mm” inside the wafer edge, the optimum position in the X-axis direction is 100.04-5.00. = 95.04.

  With the above adjustment, the positioning of the robot hand 3 in the θ-axis direction and the X-axis direction is completed.

  In the subsequent step 5, teaching of the carrier insertion position of the robot hand 3 is performed. First, the suction of the robot hand 3 is cut, the robot hand 3 is lowered in the Z-axis direction, the calibration wafer 5 is placed in the groove of the wafer deflection amount check carrier 15, and the calibration wafer 5 is separated from the robot hand 3. Stop moving at the position and read the Z-axis direction value displayed on the robot side. Thereafter, the robot hand 3 is released downward in the Z-axis direction.

  Further, the calibration wafer 5 is removed, and the wafer 5 a (200 μ thick wafer) after back grinding that is actually handled is placed on the wafer deflection amount check carrier 15. Here, the numerical value of the LED displacement sensor 10e is read, and the value obtained by subtracting the numerical value (deflection amount) and the play amount of the LED displacement sensor 10e from the previously read value in the Z-axis direction on the robot side is used as the robot hand insertion position. Instruct the hand position control unit. For example, when the display of the numerical value in the Z-axis direction on the robot side is “100.00”, the display value of the LED displacement sensor 10e is “0.40”, and the specified play value is “0.50”, the robot hand 3 The insertion position is 100.00−0.40−0.50 = 99.10.

  With the above adjustment, the alignment of the insertion position of the robot hand 3 in the Z-axis direction is completed.

  As described above, the required teaching accuracy can be achieved with leveling and three axes in the X, Z, and θ directions, regardless of the experience and skill of the person in charge of equipment maintenance. In particular, in the conventional method, leveling by an expert is indispensable in order to perform accurate teaching, but in this embodiment, alignment is performed after leveling and leveling are easily completed with a digital meter. It can be performed. Further, in the present embodiment, it is possible to teach a position reflecting the bending of the wafer (particularly, the bending when the carrier is accommodated) as the robot hand insertion position.

  The preferred embodiments of the present invention applied to the wafer sheet peeling apparatus have been described above. Needless to say, various modifications can be made without departing from the scope of the present invention. The present invention can be applied to various substrate processing apparatuses including a robot that takes in and out a substrate from a carrier that accommodates a plurality of substrates, as well as a back surface grinding device having a similar structure, for example.

  In addition, the wafer peeling machine is also used for the calibration wafer, teaching jig, wafer deflection check carrier (teaching carrier), configuration and shape of the calibration jig, and the type and arrangement of the displacement sensor used in the above embodiment. An example suitable for the above is shown, and it is needless to say that appropriate changes can be made in accordance with the type of substrate processing apparatus and the type of substrate to be handled.

It is the plane schematic diagram (a) and the side surface schematic diagram (b) of the teaching apparatus (teaching apparatus) used when implementing the teaching method which concerns on one Embodiment of this invention. It is the front view (a) and plan view (b) of the wafer deflection amount check carrier used when implementing the teaching method according to one embodiment of the present invention. It is a figure for demonstrating the structure of the wafer for a calibration used when implementing the teaching method which concerns on one Embodiment of this invention, and the horizontal detection principle by an LED displacement sensor. It is an example of arrangement | positioning of the LED displacement sensor to the teaching jig | tool used when implementing the teaching method which concerns on one Embodiment of this invention. It is the top view (a) and side view (b) of the calibration jig | tool for calibrating the teaching jig | tool which concerns on one Embodiment of this invention. It is a figure showing the flow of the teaching method which concerns on one Embodiment of this invention. It is a figure for demonstrating the usage method of the calibration jig used with the teaching method which concerns on one Embodiment of this invention. It is a figure for demonstrating the teaching method which concerns on one Embodiment of this invention. It is a figure for demonstrating the measuring method of the bending of the board | substrate in the teaching method which concerns on one Embodiment of this invention. The configuration of the substrate processing apparatus and the flow of wafers that are stored in the same carrier after the robot pulls out each of a plurality of wafers (for example, 25) set on the carrier and performs various processes (sheet peeling, back surface grinding, etc.) FIG. It is a figure showing operation | movement until a robot hand extracts a wafer from a carrier in a substrate processing apparatus. It is a figure for demonstrating the conventional teaching method. It is a figure for demonstrating the conventional teaching method.

Explanation of symbols

1 Equipment housing 2 Robot 3 Robot hand (arm)
4 Carrier (substrate container)
5 Calibration wafer (calibration substrate)
5a Wafer 6 Carrier stage 7 Level adjustment screw 8 Stage mount 9 Scale 10, 10a, 10b, 10c, 10d, 10e LED displacement sensor 11 Teaching jig (teaching jig)
12 Cable 13 Display unit 14 Digital meter 15 Wafer deflection check carrier (teaching carrier)
16 Calibration jig 17 Reference unit 18 Reflector

Claims (10)

A teaching apparatus applied to a substrate processing apparatus having a robot hand for taking in and out of a substrate from a carrier containing a plurality of substrates,
A teaching carrier that allows distance measurement from a displacement sensor disposed above;
A teaching jig comprising a plurality of displacement sensors for measuring the distance to the calibration substrate, and disposed above the teaching carrier,
The carrier base on which the carrier is placed is leveled by adjusting the distance read from the displacement sensor in a state where the calibration substrate is held at a predetermined teaching start position in the teaching carrier by the robot hand. After executing, it was possible to execute teaching of various set values for the robot hand,
A teaching apparatus characterized by the above. The teaching start position is set so that the teaching of the substrate accommodation height position of the robot hand is completed by adjusting the distance read from the displacement sensor;
The teaching device according to claim 1. The displacement sensor is disposed corresponding to a plurality of reflectors provided on the calibration substrate;
The teaching apparatus according to claim 1, wherein: The displacement sensor of the teaching jig is disposed at a position corresponding to a plurality of calibration reflectors disposed on the peripheral edge of the calibration substrate, and can be used for detecting the edge of the substrate.
The teaching apparatus according to claim 1, wherein: Displacement sensors are disposed inside a plurality of displacement sensor groups disposed at positions corresponding to the plurality of calibration reflectors disposed on the peripheral edge of the calibration substrate so that the amount of deflection of the substrate can be detected. ,
The teaching device according to claim 4.   6. A calibration jig for horizontally laying the teaching jig and the calibration substrate of the teaching apparatus according to claim 1 and calibrating the plurality of displacement sensors of the teaching jig. . A method for teaching various set values for a substrate processing apparatus provided with a robot hand for taking in and out a substrate from a carrier containing a plurality of substrates,
A teaching jig provided with a teaching carrier that allows distance measurement from a displacement sensor disposed above and a plurality of displacement sensors that measure the distance between the calibration substrate and disposed above the teaching carrier. And setting the carrier base on which the carrier is placed;
Holding the calibration substrate at a predetermined teaching start position in the teaching carrier by the robot hand;
Performing leveling of the carrier base on which the carrier is placed by adjusting the distance read from the displacement sensor of the teaching jig;
Operating the robot hand and executing teaching of various setting values for the robot hand,
A method for teaching various set values for a substrate processing apparatus. The teaching start position is set so that the teaching of the substrate accommodation height position of the robot hand is completed by adjusting the distance read from the displacement sensor;
The teaching method of various setting values with respect to the substrate processing apparatus of Claim 7 characterized by these. The robot hand is operated, and the edge of the calibration substrate is moved by a displacement sensor of the teaching jig disposed at a position corresponding to a plurality of calibration reflectors disposed on the peripheral edge of the calibration substrate. By performing the teaching of the substrate accommodation position by detecting,
The teaching method of various setting values with respect to the substrate processing apparatus of Claim 7 or 8 characterized by these. Correction by measuring the amount of bending of the substrate using a displacement sensor for detecting the bending of the substrate disposed in the teaching jig, and reducing the insertion height position of the robot hand by the amount of bending of the substrate. To do the
A teaching method of various set values for the substrate processing apparatus according to claim 7.

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