JP2008078157A - Modular connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-speed transmission modular connector which reduces crosstalk elements and reflection elements across a broad frequency band in combination with a modular plug. <P>SOLUTION: The modular connector 1 has conductive paths in the inside of a housing 3 having an open plug insertion inlet 2, and capacitance elements that are composed of conductive patterns connected to each conductive path and that create capacitive connection between the conductive paths. A configuration is determined using a gap between the conductive paths in a contact lead portion in which the conductive paths are arranged in parallel and close to each other and a length of the contact lead portion as setting elements, and another configuration is determined by properly setting the length of the conductive path between the connection position of one conductive path and that of the plurality of capacitance elements. These configurations are used independently or in combination to correlate the frequency characteristics in size and phase of a crosstalk element generated at the modular connector 1 to the frequency characteristics of a crosstalk element generated at a modular plug so that crosstalk is reduced when the modular connector 1 is combined with the modular plug. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a modular connector mainly used for information communication.

  An example of a modular connector used for information communication is shown in FIG. The modular connector 1 includes a housing 3 provided with a plug insertion slot 2 into which a modular plug is inserted, and eight contact pins 6 that elastically contact a contact of the modular plug. The contact pins 6 are accommodated in the housing 3. Connected to the substrate 5. Here, the contact pin extends downward from the printed circuit board placed in the lower part in FIG. 14 in the back of the plug insertion slot 2, bends forward, passes through the lower part of the plug insertion slot 2, and bends upward in a U shape. The structure extends in parallel with each other upward from the vicinity of the entrance inside the plug insertion port 2 toward the back of the plug insertion port 2.

  However, the modular plug used in combination with such a modular connector and the modular connector has a structure in which a plurality of transmission lines are arranged in parallel and close to each other, and therefore, capacitance unbalance (hereinafter referred to as capacitance) between the lines. ) And cross-induction (hereinafter referred to as inductive coupling), a crosstalk component is likely to occur in a signal transmitted through a line. Here, the crosstalk component is an electric signal component defined by magnitude and phase, and its characteristics depend on the frequency. The crosstalk component includes a far-end crosstalk component that appears in the signal propagation direction and a near-end crosstalk component that appears in the opposite direction.

In order to realize further large-capacity high-speed communication, it is important to reduce crosstalk components and reflection components that hinder transmission in a signal. In order to reduce the total crosstalk component in a state where the modular connector and the modular plug are combined, it is conceivable to intentionally generate a crosstalk component in the modular connector that cancels the crosstalk component generated in the modular plug. Specifically, a method of incorporating a configuration for generating capacitive coupling or inductive coupling between transmission lines into a connecting portion between a modular and a cable is employed. For example, in the modular connector 1 shown in FIG. 14, the inductive coupling is generated by bringing the wirings on the substrate 5 close to each other as shown in FIG. Japanese Patent Application Laid-Open Nos. 6-243937 and 06-84562 disclose methods for reducing near-end crosstalk components by adding capacitance between transmission pairs and crossing conductors. This technique has a temporary effect in reducing the near-end crosstalk component.
JP-A-6-243937 Japanese Patent Laid-Open No. 06-84562

  However, the correction method using only inductive coupling has a problem that either the near-end crosstalk component or the far-end crosstalk component is reduced instead of reducing either one, and the method using only capacitive coupling is This is effective when applied only to one pair of pairs, but there is a problem in that when another pair combination is compensated, it affects another pair. Further, if the lengths of the conductors constituting the transmission pair are different or the distance between the conductors constituting the transmission pair is increased, the reflection component is also increased.

  In other words, the crosstalk characteristics of the modular connector are sufficiently matched to the frequency characteristics of the crosstalk components generated in the modular plug and the frequency characteristics of the phase (hereinafter referred to as crosstalk characteristics) over a wide frequency band, and the crosstalk in combination with the modular plug is effective. In some cases, it could not be reduced.

  The present invention has been made in view of the above-described reason, and the purpose of the present invention is to determine the magnitude and phase of the crosstalk component generated between the transmission pairs in the modular connector and the crosstalk component generated between the transmission pairs in the modular plug. An object of the present invention is to provide a modular connector that can cope with a size and a phase over a wide frequency band and can reduce crosstalk in combination with a modular plug.

  According to a first aspect of the present invention, there is provided a housing in which a plug insertion port for inserting a modular plug is opened, a substrate attached to an inner wall of the housing, and a plurality of transmission pairs disposed in the plug insertion port. A plurality of contact pins connected to a substrate and elastically contacting a contact of a modular plug; a plurality of terminal plates disposed on a terminal block provided in the housing and corresponding to each contact pin; and disposed on the substrate; A conductive path that electrically connects each of the contact pins and the corresponding terminal plate; an inductive coupling means that is connected to the conductive path and generates inductive coupling between the at least two conductive paths; Capacitive coupling means for generating capacitive coupling between the conductive paths, and a part of each conductive path is parallel to any other conductive path as the inductive coupling means In a modular connector provided with adjacent contact lead portions, the substrate is composed of a multilayer substrate having three or more conductor layers, and the contact lead portions are composed of conductive paths arranged on the same conductor layer. In addition, the conductive paths are arranged in any different conductor layer, and the capacitive coupling means is provided at a connection portion between the contact pin and the conductive path. .

  According to a first aspect of the present invention, there is provided a housing in which a plug insertion port for inserting a modular plug is opened, a substrate attached to an inner wall of the housing, and a plurality of transmission pairs disposed in the plug insertion port. A plurality of contact pins connected to a substrate and elastically contacting a contact of a modular plug; a plurality of terminal plates disposed on a terminal block provided in the housing and corresponding to each contact pin; and disposed on the substrate; A conductive path that electrically connects each of the contact pins and the corresponding terminal plate; an inductive coupling means that is connected to the conductive path and generates inductive coupling between the at least two conductive paths; Capacitive coupling means for generating capacitive coupling between the conductive paths, and a part of each conductive path is parallel to any other conductive path as the inductive coupling means In a modular connector provided with adjacent contact lead portions, the substrate is composed of a multilayer substrate having three or more conductor layers, and the contact lead portions are composed of conductive paths arranged on the same conductor layer. In addition, since it is composed of conductive paths arranged in any different conductor layers, both the magnitude and phase of crosstalk components generated between each transmission pair in the modular connector can be set. The crosstalk in combination with the modular plug can be reduced. In addition, since inductive coupling is formed between arbitrary layers of a multilayer substrate, by setting the interlayer dimensions independently of the overall thickness of the substrate, the degree of freedom of setting the inductive coupling amount can be increased, and the setting range can be increased. Can be wide. In addition, since the capacitive coupling means is provided at a connection portion between the contact pin and the conductive path, crosstalk in combination with the modular plug can be efficiently reduced near a place where crosstalk occurs.

(Embodiment 1)
The modular connector 1 of this embodiment is for 8 poles and 8 cores, and includes a housing 3 in which a plug insertion port 2 into which a modular plug (not shown) is inserted is opened as shown in FIGS. In the housing 3, a terminal block 4 is provided in the upper part on the back side of the plug insertion port 2, and a substrate 5 is disposed in the lower part of the terminal block 4. Inside the plug insertion slot 2 are provided four pairs of contact pins 6 that elastically contact a contact (not shown) of a modular plug. As shown in FIGS. 2 to 3, the contact pin 6 is supported by a contact pin support portion 7 provided on the substrate 5 on the back side of the plug insertion slot 2. On the terminal block 4, eight terminal plates 8 corresponding to the contact pins 6 are provided upright. The substrate 5 is provided with a via hole 12 electrically connected to each contact pin 6 and a via hole 13 electrically connected to each terminal board 8. In addition, a conductive path 9 that electrically connects the via hole 12 and the corresponding via hole 13 is formed in the substrate 5 by a conductor pattern. As shown in FIGS. 5 and 6, the conductive path 9 is formed separately on the front surface 5 </ b> A and the back surface 5 </ b> B of the substrate 5 in order to suppress the occurrence of undesirable inductive coupling. Furthermore, the substrate 5 is provided with a via hole 14 connected only to a part of the conductive paths 9.

  In the following description, the same reference numbers a, b, c, d, e, f, g, h are assigned to the contact pins 6, the conductive paths 9, the via holes 12, the via holes 13, and the via holes 14, respectively. It shall be attached later. Here, in the code | symbol attached | subjected after the number, a and b, c and f, d and e, and g and h comprise the transmission pair, respectively.

  As shown in FIGS. 1 to 4, one end of the contact pin 6 is fixed near the entrance of the plug insertion port 2, and extends in parallel toward the inside of the insertion port 2. Thereafter, the four contact pins 6a, 6c, 6e, 6g connected to the chip line among the contact pins 6 are bent once and supported by the contact pin support portion 7 and 90 degrees behind the contact pin support portion 7 by about 2 mm. Four contact pins 6b, 6d, 6f, and 6h that are bent downward and passed through the corresponding via holes 12a, 12c, 12e, and 12g and connected to the ring line among the contact pins 6 are bent and contacted twice. It is supported by the contact pin support 7 at a position lower than the pins 6a, 6c, 6e, 6g, bent 90 degrees downward in the vicinity of the contact pin support 7, and passed through the corresponding via holes 12b, 12d, 12f, 12h. . Therefore, the via holes 12 are arranged in a staggered manner when viewed from the side, and the via holes 12a, 12c, 12e, and 12g corresponding to the chip lines and the via holes 12b, 12d, 12f, and 12h corresponding to the ring lines are separated from each other in the front-rear direction. ing.

  As shown in FIGS. 5 and 6, the conductive path 9 has a contact lead portion 10 in which inductive coupling is caused by two or more conductive paths 9 being close to each other in parallel. 5 and 6, the hatched portion is the contact lead portion 10.

  Due to the presence of the contact lead portion 10, inductive coupling occurs between the conductive paths 9a and 9c and between the conductive paths 9f and 9h on the front surface 5A, and between the conductive paths 9b and 9e and between the conductive paths 9d and 9g on the back surface 5B. ing. This is a contact lead portion composed of conductive paths arranged on the same conductor layer. Further, in the pair of conductive paths 9c and 9f and the pair of conductive paths 9d and 9e, the two conductive paths 9 forming a pair are arranged on different upper and lower planes, and the chip corresponding to the chip line of the transmission pair. Conductive paths 9c and 9e which are conductors and conductive paths 9d and 9f which are ring conductors corresponding to the ring lines are guided in parallel between the pair of conductive paths 9 with the substrate 5 interposed therebetween. Sexual bond is occurring. This is a contact lead portion composed of conductive paths arranged in so-called different conductor layers.

  The substrate 5 is a multilayer substrate and has an inner layer surface 5C. On the inner surface 5C, as shown in FIG. 7, the conductive pattern connected to the via hole 12c and the conductive pattern connected to the via hole 12e form a capacitance element 11A, and the conductive pattern connected to the via hole 12a and the via hole 12c The connected conductive pattern forms a capacitance element 11C. The conductive pattern connected to the via hole 14c and the conductive pattern connected to the via hole 14d form a capacitance element 11B. That is, capacitive coupling occurs between the conductive paths 9c, 9e, between the conductive paths 9c, 9d, and between the conductive paths 9a, 9c by the capacitance elements 11A, 11B, 11C. At this time, the capacitance element 11 </ b> A is formed by a conductor pattern directly from the via hole 12 c and the via hole 12 e which are connection portions between the contact pin 6 and the conductive path 9. The capacitance element 11C is formed by a conductor pattern directly from the via hole 12c and the via hole 12a. By doing so, it is possible to intentionally generate a crosstalk component that cancels out the crosstalk component generated by the plug at a portion closer to the modular plug in the modular connector, and the crosstalk component generated by the plug and the crosstalk component that cancels this out. Therefore, the crosstalk in combination with the modular plug can be efficiently reduced.

  The length of the conductive path 9c between the connection positions is selected using the phase delay generated in the conductive path 9c from the connection position between the capacitance element 11A and the conductive path 9c to the connection position between the capacitance element 11B and the conductive path 9c. As a result, the frequency characteristics of the phase of the crosstalk component generated in the modular connector 1 can be set, so that the crosstalk in combination with the modular plug can be reduced.

  Further, the size and phase of the crosstalk component in the modular connector 1 are generated in the modular plug by appropriately selecting the length of the contact lead portion 10 and the distance between the conductive paths 9 in the contact lead portion 10 as design parameters. It is possible to cope with the crosstalk component, and therefore, the crosstalk in the state combined with the modular plug can be reduced.

  Further, the crosstalk generated in the modular connector 1 is obtained by using the combination of the capacitive coupling adjustment by the design of the capacitance elements 11A, 11B, and 11C described above and the adjustment of the inductive coupling by the design of the contact lead portion 10 in combination. The magnitude and phase of the component can be made to correspond to the crosstalk component generated in the modular plug over a wide frequency band, and thus the crosstalk in the state combined with the modular plug can be reduced.

  The combination of the conductive paths 9a to 9f that generate capacitive coupling or inductive coupling is not particularly limited as long as it is effective in reducing the crosstalk component or the reflection component. Capacitance elements 11A, 11B, and 11C may be replaced with other elements having the same function.

(Embodiment 2)
In the present embodiment, in addition to the same configuration as that of the first embodiment, the substrate 5 has a second inner layer surface 5D. As shown in FIG. 8, on the inner layer surface 5D, the conductive pattern connected to the via hole 12d and the conductive pattern connected to the via hole 12f form a capacitance element 11D, and the conductive pattern connected to the via hole 12e and the via hole 12f. And the conductive pattern connected to each other form a capacitance element 11E. The conductive pattern connected to the via hole 14f and the conductive pattern connected to the via hole 14h form a capacitance element 11F. That is, capacitive coupling is generated between the conductive paths 9d, 9f, the conductive paths 9e, 9f, and the conductive paths 9f, 9h by the capacitance elements 11D, 11E, and 11F.

  Here, in the capacitance element 11A that generates capacitive coupling between the conductive paths 9c and 9e and the capacitance element 11D that generates capacitive coupling between the conductive paths 9d and 9f, the conductor pattern connected to the via hole 12c. And the conductor pattern connected to the via hole 12f at a position corresponding to the printed circuit board, and the conductor pattern connected to the via hole 12e and the conductor pattern connected to the via hole 12d corresponding to the printed circuit board. It is in. Similarly, in the capacitance elements 11B and 11E, the conductor pattern connected to the via hole 14c and the conductor pattern connected to the via hole 14f are in positions corresponding to each other with the printed circuit board interposed therebetween, and the conductor pattern and the via hole connected to the via hole 14e. The conductor pattern connected to 14d is at a position corresponding to the substrate.

  Capacitive coupling occurs in parallel between the conductive paths 9c and 9f forming the transmission pair and between the conductive paths 9e and 9d, and the characteristics of the transmission pair including the conductive paths 9c and 9f and the transmission pair including the conductive paths 9e and 9d Since the impedance matching effect is produced, reflection can be reduced over a wide frequency band.

  Further, the phase delay generated in the conductive path 9c from the via hole 12c, which is a connection position between the capacitance element 11A and the conductive path 9c, to the connection position between the via hole 14c connected to the capacitance element 11B and the conductive path 9c, and the capacitance element 11D And the phase delay generated in the conductive path 9f from the via hole 12f that is the connection position of the conductive path 9f to the connection position of the via hole 14f connected to the capacitance element 11E and the conductive path 9f, By setting the length of the conductive paths 9c and 9f or the connection positions of the corresponding via holes 14c and 14f with the conductive paths 9c and 9f, the frequency characteristic of the phase of the crosstalk component generated in the modular connector 1 can be set. Thus reducing crosstalk in combination with modular plugs It becomes possible.

  The combination of the conductive paths 9a to 9f to which the capacitive coupling means or the inductive coupling means is added is not particularly limited as long as it is effective in reducing the crosstalk component or the reflection component.

(Embodiment 3)
In the present embodiment, the substrate 5 is not a multilayer substrate but a normal printed circuit board having no inner layer surface, and no via hole 14 is provided. The thickness of the substrate 5 used in this example is thinner than that of the substrate 5 in the first embodiment, and the arrangement of the conductive paths 9a to 9f is adjusted so that the crosstalk generated by the inductive coupling is the same as that in the first embodiment. It is. FIG. 9 shows the arrangement of the conductive paths 9a to 9f formed in the two layers of the substrate 5 in this embodiment in a single view. Other configurations are the same as those of the first embodiment.

  Comparing FIG. 9 with FIG. 5 and FIG. 6, the parallel wiring length of the contact lead portion 10 is shortened instead of the distance between the two planes being shortened. As a result, the phase of the crosstalk component generated by the inductive coupling in the contact lead portion 10 changes even though the magnitude of the crosstalk component generated by the inductive coupling in the contact lead portion 10 is the same.

  Thus, by adjusting the distance between the conductive paths 9 in the contact lead portion 10 and the length of the contact lead portion 10, only the phase can be changed without changing the magnitude of the crosstalk signal generated by inductive coupling. . That is, the degree of freedom in crosstalk characteristics of the modular plug that can be accommodated in the design is high.

  Capacitive coupling means may be provided between the conductive paths 9a to 9f. Further, the combination of the conductive paths 9a to 9f forming the contact lead portion 10 is not particularly limited as long as it is effective in reducing the crosstalk component or the reflection component.

(Embodiment 4)
The present embodiment is an example in which the substrate 5 is a multilayer substrate composed of three or more conductor layers, and the contact lead portions are composed of conductive paths arranged on the same conductor layer and in any different conductor layers. Is shown. In the first embodiment, contact lead portions made of so-called different conductor layers are provided in the thickness direction of the substrate on the front surface 5A and the back surface 5B of the substrate 5, but in this embodiment, as shown in FIGS. Contact lead portions made of different conductor layers are provided in the thickness direction of the substrate on the conductor layer surfaces 50B and 50C of the multilayer substrate 50 composed of four conductor layer surfaces 50A, 50B, 50C and 50D. Here, the four conductor layer surfaces are designated as the first layer surface in order from 50A. 10 to 13 use plate-like conductor patterns having the same action as the capacitance elements 11A of the first and second embodiments as capacitance elements. Further, a portion indicated by hatching is the contact lead portion 10.

  Due to the presence of the contact lead portion 10, inductive coupling between the conductive paths 9a and 9c and between the conductive paths 9f and 9h on the conductor layer surface 50B, and between the conductive paths 9b and 9e and between the conductive paths 9d and 9g on the conductor layer surface 50C. Has occurred. This is a contact lead portion composed of conductive paths arranged on the same conductor layer. Further, in the pair of conductive paths 9c and 9f and the pair of conductive paths 9d and 9e, the two conductive paths 9 forming a pair are arranged on different upper and lower conductor layer surfaces, and correspond to the chip line of the transmission pair. The conductive paths 9c and 9e that are the chip conductors and the conductive paths 9d and 9f that are the ring conductors corresponding to the ring lines are close to each other in parallel with the conductor layer interposed therebetween, so Inductive binding has occurred. This is a contact lead portion composed of conductive paths arranged in so-called different conductor layers. Here, the contact lead portions 10 made of the different conductor layers are closer to each other than the contact lead portions 10 provided on the same conductor layer. That is, the conductive paths 9c and 9e that are chip conductors will be described as an example. The contact lead portions 10 made of different conductive layers are electrically connected to the corresponding terminal plates 8 from the vicinity of the via holes 12c and 12e in the conductive paths. It is provided so that it may extend over the substantially full length until it reaches the bending part which goes to the via holes 13c and 13e for connecting. This is because, by providing contact lead portions on different conductor layers spatially, the length can be set more freely than the contact lead portions on the same substrate, and thus the degree of freedom in setting the inductive coupling amount is increased. Can be increased. In addition, since inductive coupling is formed between arbitrary layers of a multilayer substrate, by setting the interlayer dimensions independently of the overall thickness of the substrate, the degree of freedom of setting the inductive coupling amount can be increased, and the setting range can be increased. Can be wide.

It is the partially broken top view which shows Embodiment 1 of this invention. It is side surface sectional drawing same as the above. It is a side view of the principal part same as the above. It is a top view of the principal part same as the above. It is a top view of the surface of the board | substrate used for Embodiment 1 of this invention. It is the top view which saw through the back surface of the board | substrate used for the same from the surface side. It is the top view which saw through the inner layer figure of the board | substrate used for the same from the surface side. It is the top view which saw through the inner layer figure of the board | substrate used for Embodiment 2 of this invention from the surface side. It is the top view which synthesize | combined the conductive path used for the back surface and surface of a board | substrate used for Embodiment 3 of this invention. It is a top view of the 1st layer surface of the board | substrate used for Embodiment 4 of this invention. It is the top view which saw through from the surface side the 2nd layer surface of the board | substrate used for the same as the above. It is the top view which saw through the 3rd layer surface of the board | substrate used for the same from the surface side. It is the top view which saw through the 4th layer surface of the board | substrate used for the same from the surface side. It is side surface sectional drawing of a prior art example. It is a top view of the principal part same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Modular connector 2 Plug insertion port 3 Housing 5 Board | substrate 6, 6a-6h Contact pin 8 Terminal board 9, 9a-9h Conductive path 10 Contact lead part 11A-11F Capacitance element

Claims (1)

  A housing in which a plug insertion port for inserting a modular plug is opened, a substrate attached to the inner wall of the housing, a plurality of transmission pairs arranged in the plug insertion port, connected to the substrate, and connected to the substrate. A plurality of contact pins elastically contacting the contacts, a plurality of terminal plates disposed on a terminal block provided in the housing and corresponding to the contact pins, respectively, and the terminal plates disposed on the substrate and corresponding to the contact pins A conductive path electrically connected to each other, inductive coupling means connected to the conductive path to generate inductive coupling between the at least two conductive paths, and capacitive between the at least two conductive paths A capacitive coupling means for generating coupling, and a part of each of the conductive paths is contacted in parallel with one of the other conductive paths as the inductive coupling means. In the modular connector provided with the lead portion, the substrate is composed of a multilayer substrate having three or more conductor layers, and the contact lead portion is composed of conductive paths arranged on the same conductor layer. A modular connector comprising conductive paths arranged in any different conductor layer, wherein the capacitive coupling means is provided at a connection portion between the contact pin and the conductive path.

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