JP2008059240A - Ic tag having interposer protecting structure, and rewritable sheet with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC tag packaging an interposer or a rewritable sheet with an IC tag which has a structure capable of preventing IC chip from bracking due to static pressure, or the like. <P>SOLUTION: In the IC tag 1 having the interposer protecting structure, an inlet 20 packaging the interposer 30 is stuck between front and rear base materials 4, 5 for holding the inlet 20 between them by double-sided adhesive tapes 6, 7, the double-sided adhesive tape 6 on the interposer side of the inlet 20 is a cushioned center layer base material, a mass part for storing the interposer 30 is compressed, the interposer 30 is stored in the compression part 8, and the cushioned double-sided adhesive tape 6 is stuck to the inlet 20. The rewritable sheet with the IC tag has the IC tag 1, on a part of the sheet and a recording area composed of a reversible heat sensitive recording material, is formed on the surface of the front base material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an IC tag having an interposer protection structure and a rewritable sheet with an IC tag. More specifically, the present invention relates to an IC tag having a structure for protecting an interposer portion from static pressure, impact, etc. in a non-contact IC tag mounted with an interposer, and also relates to a rewritable sheet using the IC tag.

The non-contact IC tag is also referred to as a non-contact type data carrier or RFID (Radio Frequency Identification), and includes an IC chip that holds information capable of identifying an individual, and this information can be read in a non-contact manner by wireless communication. Related to tags.
Such a non-contact type data carrier is used in fields such as transportation, distribution, warehouse, and handling of luggage.

  However, when a non-contact type IC tag is used as a physical distribution label, inevitable stress or static pressure is often applied from the outside during physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Therefore, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that the structure becomes complicated and cannot be manufactured at low cost.

  As an inevitable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the base film or the like. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 50 μm to 500 μm. Therefore, even if an antenna pattern is formed on the base film surface and an IC chip is mounted and the surface protection member is covered and flattened, the IC chip portion becomes bulky when the IC tag labels are stacked.

  This stacked state can be considered as a case where the IC chip is damaged. When non-contact IC tag labels are used, several to dozens are often stacked. To make it easier to use, it is normal to align the labels. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. When a heavy object is placed on the label in the stacked state, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is susceptible to impact.

In recent years, instead of directly mounting individual IC chips on an antenna as described above, an IC chip is formed in an interposer form to facilitate mounting on an antenna.
In this case, since the thickness of the base material is further added to the interposer, the thickness is increased as compared with the case of the IC chip alone. Further, since the IC chip is connected to the terminal in the interposer, there is a problem that the connection part is easily damaged by static pressure or the like.

  In recent years, in addition to the use of an IC tag alone, there are many applications that enable display printing in a label form having a larger area. Display printing is often made rewritable using a heat-reversible (rewritable) recording agent. In this case, it is preferable that the label itself is smooth and cushioning with respect to a thermal head as a recording apparatus.

Prior art related to the present application includes Patent Document 1 and Patent Document 2. Patent Document 1 relates to a manufacturing method of an IC tag label, and it is an object to realize a flat IC tag label. However, the layer configuration is different from that of the present application, and the manufacturing method is different in that a thermocompression bonding apparatus or the like is used.
Patent Document 2 is a content related to the prior application of the present application, but differs from the present application in that a protective member provided with a punched hole is inserted in the peripheral portion of the IC chip.

JP 2003-67708 A Japanese Patent Application No. 2005-051036

Even if an IC tag is mounted with an interposer, an IC tag that does not cause damage to the interposer or the IC chip due to external impact, static pressure, or the like in the usage environment is achieved.
Another object of the present invention is to realize a rewritable sheet with an IC tag that has excellent flatness and good thermal printing suitability.

  The first of the gist of the present invention that solves the above-mentioned problems is an IC tag in which an inlet mounted with an interposer is bonded with a double-sided adhesive tape between front and back substrates sandwiching the inlet. The double-sided pressure-sensitive adhesive tape is characterized in that the center layer base material is cushioned, the portion facing the interposer is compressed, the interposer is placed in the compression part, and the inlet and the double-sided pressure-sensitive adhesive tape are bonded. And an IC tag having an interposer protection structure.

  The second of the gist of the present invention that solves the above-mentioned problem is an IC tag in which an inlet mounted with an interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet, and the interposer of the inlet is Since the double-sided adhesive tape on the opposite side has a cushioning center layer base material, the part facing the interposer is compressed, and the protruding part due to the interposer is placed in the compressed part, and the inlet and the double-sided adhesive tape Is attached to an IC tag having an interposer protection structure.

  Third of the gist of the present invention for solving the above-mentioned problems is the rewritable sheet with an IC tag in which the inlet having the interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet. A recording layer made of a thermoreversible thermosensitive recording agent is formed on the surface of the base material, and the double-sided pressure-sensitive adhesive tape on the side surface of the interposer of the inlet has a center layer base material that is cushioned. The rewritable sheet with an IC tag is characterized in that the portion to be compressed is compressed, the interposer is accommodated in the compression portion, and the inlet and the double-sided adhesive tape are bonded.

  The fourth of the gist of the present invention for solving the above-mentioned problems is the rewritable sheet with an IC tag, in which the inlet having the interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet. A recording layer made of a thermoreversible thermosensitive recording agent is formed on the surface of the base material, and the double-sided pressure-sensitive adhesive tape on the side opposite to the interposer of the inlet has a cushioning property at the center layer base material. The rewritable sheet with an IC tag is characterized in that a portion facing the interposer is compressed, a protruding portion due to the interposer is accommodated in the compressed portion, and the inlet and the double-sided adhesive tape are bonded.

The IC tag having the interposer protection structure according to claim 1 is characterized in that the interposer compresses the cushioning double-sided adhesive tape in the layer structure and is accommodated in the compressed portion, so that the convex shape by the interposer is relaxed. Even when they are stacked, damage to the interposer, IC chip, or antenna circuit can be reduced due to external impact or static pressure.
In the IC tag having the interposer protection structure according to claim 2, the protruding portion caused by the interposer is stored in the compressed portion by compressing the cushioning double-sided adhesive tape in the layer structure. The shape is relaxed and the same effect is produced.

In the rewritable sheet with an IC tag according to claim 6, since the interposer compresses the cushioning double-sided adhesive tape in the layer configuration and is stored in the compressed portion, the convex shape caused by the interposer is relaxed, and the interposer is mounted The printability can be improved even in the portion.
In the rewritable sheet with an IC tag according to claim 7, the projecting portion caused by the interposer is compressed in the cushioning double-sided adhesive tape in the layer structure and stored in the compressed portion. Relaxes and produces a similar effect.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.
FIG. 1 is a diagram showing an IC tag having an interposer protection structure of the present invention, FIG. 2 is a sectional view showing another example of the IC tag, and FIG. 3 is a diagram showing a rewritable sheet with an IC tag of the present invention, FIG. 4 is a sectional view showing another example of the rewritable sheet, and FIGS. 5 and 6 are views showing examples of the interposer.

FIG. 1 is a view showing an IC tag (hereinafter also referred to as “the present IC tag”) 1 having an interposer protection structure of the present invention, in which FIG. 1 (A) is a plan view and FIG. Figure.
FIG. 1A shows a state in which the surface substrate 4 is seen through. In this IC tag 1, an interposer 30 is mounted on connection portions 2 a and 2 b of the left and right quarter-wave antennas 2 </ b> L and 2 </ b> R of the antenna 2 formed in the inlet 20. In the case of FIG. 1, the antenna is a half-wave dipole antenna and has a bent shape, but is not limited to this shape.
In the UHF band and the microwave band, a dipole antenna is often used, but a coiled planar antenna that transmits and receives radio waves in the 13.56 MHz band may of course be used.
The antenna 2 is made of metal foil or alloy foil such as aluminum, copper, copper alloy, phosphor bronze, SUS.

  In FIG. 1 (A), the hatched portion is a region where the double-sided pressure-sensitive adhesive tapes 6 and 7 for bonding the inlet 20 to either the front or back substrate exist, and the rectangular portion around the interposer 30 is It shows that the cushioning double-sided pressure-sensitive adhesive tape 6 is compressed. Since the size of the compression unit 8 is approximately the size of the interposer 30, the compression unit 8 has a shape that substantially matches the size of the interposer 30. Therefore, as shown in the figure, the rectangular shape enlarged from the interposer 30 is not actually realized.

The cross-sectional view of FIG. 1B shows a cross section taken along line AA of FIG. In FIG. 1B, the inlet 20 refers to an antenna in which the antenna 2 is formed on the inlet base material 21.
An interposer 30 is mounted (electrically connected) between the connection portions 2 a and 2 b of the antenna 2. The interposer 30 also has connection terminals on the interposer substrate surface, and an IC chip is mounted between the connection terminals.

  This IC tag 1 has a layer structure in which an interposer 30 is mounted on an inlet 20, and front and back base materials 4, 5 are laminated on both outer surfaces of the inlet 20 via double-sided adhesive tapes 6, 7. It has become. In the double-sided pressure-sensitive adhesive tape 6 on the side where the interposer 30 of the inlet 20 is mounted, the center layer base material is cushioning, and the portion with which the interposer 30 abuts is compressed by pressing. The double-sided pressure-sensitive adhesive tape 6 has a structure having pressure-sensitive adhesive layers on both sides of a cushioning central layer base material. Preferably, the center layer base material has a thickness greater than that of the interposer 30. The double-sided pressure-sensitive adhesive tape 7 on the side not in contact with the inlet 20 does not need to be cushioning and can be a normal one. Although the thickness may be thinner than the cushioning double-sided pressure-sensitive adhesive tape 6, the structure having the pressure-sensitive adhesive layer on both sides of the center layer base material is the same.

The cushioning double-sided pressure-sensitive adhesive tape 6 includes those having a central layer base material such as acrylic, polyurethane, and polyethylene. Usually, the base material is a foamed layer and the air content is increased. The density is about 0.02 to 0.5 g / cm ³ .
The center layer base material of the cushioning double-sided pressure-sensitive adhesive tape 6 is more preferably a low rebound elastic modulus foam. In the present invention, the thickness of the interposer 30 is compressed by pressing the cushion material, the thickness of the interposer 30 is stored in the compressed portion, and then the front and back substrates 5 and 6 are laminated, but the rebound resilience is high. This is because the foam material is restored after the front and back substrates 5 and 6 are laminated, and the convex portions are easily formed.

Generally, those having a rebound resilience (JISK6400-3) of 40 to 50% are general foams and 60% or more are high resilience foams, but for low rebound resilience foams, they are 15% or less to about 2%. Therefore, the cushioning double-sided pressure-sensitive adhesive tape recommended in the present invention refers to one using a center layer base material having a rebound resilience of 15% or less.
In general, what has both “elasticity” like a spring and “viscosity” like viscosity and gum is called a “viscoelastic foam”, but a low-resilience foam is also called a low-resilience foam. The foam is designed with a simple molecular structure and suppresses "elasticity" and increases "viscosity", and has the characteristics of a shock-absorbing foam with a large hysteresis loss rate (JISK6400-2). When the external force is removed after the bubbles are connected and compressed, they have a property of slowly returning to the original state, and have a characteristic that the rebound resilience is very small as compared with a general foam.

FIG. 2 is a cross-sectional view showing another example of the IC tag. Since the plan view is the same as FIG. 1, it is omitted. However, the compression unit 8 appears in a larger shape than that in FIG. 1 for reasons described later.
In the case of FIG. 2, the center layer base material of the double-sided pressure-sensitive adhesive tape 6 on the side surface opposite to the interposer 30 of the inlet 20 is made cushioning. The inlet base material 21 is in contact with the cushioning double-sided pressure-sensitive adhesive tape 6, and the interposer 30 faces the double-sided pressure-sensitive adhesive tape 7 that is not cushioning. As a result, the protruding portion 9 caused by the interposer 30 compresses the portion facing the inlet base material 21 in a slightly larger shape than in the case of FIG. Thereby, the inlet 20 and the said double-sided adhesive tape 6 are adhere | attached in the state in which the protrusion part 9 was stored in the said compression part 8, and the effect similar to the case of FIG. 1 is produced.

Here, the interposer 30 will be described. 5 and 6 are diagrams showing examples of an interposer, in which (A) is a plan view, (B) is a cross-sectional view, and (C) is a diagram showing a state connected to the antenna 2 of the inlet 20, It is.
As shown in FIG. 5A, the interposer 30 is formed with connection terminals 3a and 3b made of a metal foil conductive layer on the surface of the substrate 31, and the IC chip 3 is mounted on the connection terminals 3a and 3b.
The IC chip 3 is a normal one having a data storage unit (memory), an input / output function, a control function, and a non-contact communication function. The IC tag 1 functions as a non-contact IC tag even when the interposer 30 is mounted on the antenna 2 of the inlet 20, but the IC tag 1 has a structure in which a front surface base material 4 and a back surface base material 5 are further laminated as will be described below. And

The material and thickness of the interposer base 31 and the metal foil are the same as those of the inlet 20. For example, the substrate 31 may be a polyethylene terephthalate (PET) film having a thickness of about 15 μm to 50 μm, and the metal foil conductive layer may be an aluminum foil or a copper foil of about 15 μm to 30 μm. The bump (not shown) of the IC chip 3 is electrically connected to the connection terminals 3a and 3b by a conductive adhesive or the like (FIG. 5B).
When implementing the interposer 30 to the antenna 2, as shown in FIG. 5 (C), the connection terminals 3a, 3b is brought into contact with the antenna 2, from the opposite side of the substrate 31 (arrows y1, y2), with caulking blade Push it in forcibly and connect it at the point marked “x”. Such a technique is also described in Japanese Patent Application Laid-Open No. 2006-107418, which is a prior application of the applicant.

  As shown in FIG. 6A, an insulating film 32 may be provided on a part of the surface of the connection terminal 3b. In this case, as shown in FIG. 6C, the insulating film 32 is used so as to straddle the coiled antenna 2, and the antenna 2 is brought into contact with the connecting terminal 3a and the connecting terminal 3b where the insulating film 32 is not present. Then, from the opposite side surface (arrows y1, y2) of the base material 31, it is forcedly pushed in using a caulking blade and connected at the location indicated by “x”. In the case of this example, the function of the interposer 30 and the role of a bridge across the antenna 2 are performed. The size of the interposer 30 including the width of the substrate 31 can be, for example, about 3 mm × 8 mm, 5 mm × 20 mm, but varies depending on the application and function. In recent years, the interposer 30 is primarily processed so that the IC chip 3 that has been miniaturized can be easily connected to the antenna 2, so that the IC chip 3 can be easily and reliably mounted.

3A and 3B are views showing a rewritable sheet with an IC tag according to the present invention, in which FIG. 3A is a plan view, and FIG. 3B is a cross-sectional view taken along line BB in FIG. .
The basic structure of the rewritable sheet 10 with an IC tag of the present invention is the same as that of the present IC tag 1, but includes a recording area 11 formed of a thermoreversible thermosensitive recording agent, so that it is larger than the present IC tag 1. It is different in that it has an area. Therefore, either the inlet 20 or the double-sided adhesive tapes 6 and 7 has a structure that does not exist in the entire area of the rewritable sheet 10 with the IC tag. Of course, both the inlet 20 and the double-sided pressure-sensitive adhesive tapes 6 and 7 may have the same size as the entire area, but it is clear that the inlet base 21 and the double-sided pressure-sensitive adhesive tape 6 or 7 are wasted. In the case of FIG. 3, the double-sided pressure-sensitive adhesive tape 7 has an entire area of the rewritable sheet 10, but the cushioning double-sided adhesive tape 6 may have an entire area. In the right part of FIG. 3B, the back surface base material 4 and the double-sided pressure-sensitive adhesive tape 7 are shown as having a gap, but this is because the illustration is difficult and is actually in close contact. Although the reference numerals of the front and back base materials are opposite to those in FIG. 1, in FIG. 3, there is no essential difference just by using the surface on which the recording area 11 is provided as the front surface.

FIG. 3 shows that the inlet 20 of the coiled planar antenna 2 is used, unlike FIG. 1, but a dipole antenna may of course be used.
In FIG. 3 (A), the hatched part is an area where the double-sided adhesive tape 6 is present, but the rectangular part is a cushioning double-sided adhesive tape on the inlet 20 side as in FIG. 1 (A). 6 shows that the compression part 8 is formed.

  The rewritable sheet 10 with an IC tag shown in FIG. 3A can be, for example, a postcard size or a B6 size, and has an inlet 20 in one of the areas. In the case of the coiled planar antenna 2, the inlet 20 has various sizes, but the larger one is about the size of a business card. In the case of FIG. 3A, an interposer 30 is mounted between the outer peripheral end portion and the inner peripheral end portion of the antenna of the inlet 20. The rewritable sheet 10 has a recording area 11 on the surface of the rewritable sheet 10 with a wide area on the right side and a portion where the inlet 20 is provided.

  Since there is a slight level difference between the wide area on the right side and the area with the inlet, it may be better to avoid the recording area. The surface base material 5 on which the recording area 11 is provided is preferably white. For the surface base material 5, a material obtained by coating a white base material with a thermoreversible thermosensitive recording agent that develops black color is used. Although both sides of the rewritable sheet 10 may be the recording area 11, the printing performance is somewhat deteriorated on the back substrate 4 side where the interposer 30 is close to the surface layer. Of course, in addition to the recording area 11, there may be an area where fixed information is printed.

  As shown in the cross-sectional view of FIG. 3B, the rewritable sheet 10 with an IC tag has an interposer 30 mounted on an inlet 20, a cushioning double-sided adhesive tape 6 is used on the inlet 20 side, and a back surface base is formed on the outer surface thereof. The material 4 is laminated. The interposer 30 is housed in the compression part 8 of the cushioning double-sided adhesive tape 6. On the side of a normal double-sided pressure-sensitive adhesive tape 7 that is not cushioning, a surface structure 5 is laminated.

  FIG. 4 is a cross-sectional view showing another example of the rewritable sheet 10 with the IC tag. Since the plan view is the same as FIG. 3, it is omitted. However, the compression unit 8 appears in a larger shape than that in FIG. 3 for reasons described later. In the case of FIG. 4, the center layer base material of the double-sided pressure-sensitive adhesive tape 6 on the side surface opposite to the interposer 30 of the inlet 20 is made cushioning. The inlet base material 21 is in contact with the cushioning double-sided pressure-sensitive adhesive tape 6, and the interposer 30 faces the double-sided pressure-sensitive adhesive tape 7 that is not cushioning. As a result, the protruding portion 9 caused by the interposer 30 compresses the portion facing the inlet base material 21 in a slightly larger shape than in the case of FIG. Thereby, the protrusion part 9 is stored in the said compression part 8, and the inlet 20 and the cushioning double-sided adhesive tape 6 are adhere | attached.

  It is considered that the convex double-sided adhesive tape 6 on the interposer 20 side is more likely to absorb the convex shape, but in actual processing, the cushion-type double-sided adhesive tape 6 on the inlet base material 21 side is easier to process. become. In addition, since an external force is likely to be applied to the recording layer 11 side, the cushion layer closer to the recording layer 11 produces a preferable result for print recording.

  The rewritable sheet means a sheet having a reversible and rewriteable / erasable recording layer. As described above, when the IC tag is attached to the rewritable sheet 10, the contents of the IC tag can be read out by the thermal printer, and the contents can be immediately printed. Conversely, when the data received from the external processing device is printed. At the same time, it can be recorded in the memory of the IC tag. Furthermore, there is an advantage that there is no discrepancy between the data held by the IC and the information printed and recorded, and hence the data held by the IC and the article to which the rewritable sheet 10 is attached.

  For the front and back substrates 4 and 5, for example, white PET film, synthetic paper, coated paper, or the like can be used. The cushioning double-sided pressure-sensitive adhesive tape 6 on the side where the interposer 30 of the inlet 20 is mounted has the compression portion 8 as described above, and the interposer 30 is accommodated in the compression portion 8. In the recording area 11 on the right side, the double-sided pressure-sensitive adhesive tape 7 adheres between the front surface base material 5 and the back surface base material 4, but the cushioning double-sided pressure-sensitive adhesive tape 6 may be extended as described above. It is.

A recording layer 11 made of a thermoreversible thermosensitive recording agent is formed on the surface of the surface base material 5. The recording layer 11 is generally coated with a thermoreversible thermosensitive recording agent, but may be a laminate of a thin thermoreversible thermosensitive recording film. In general, a material that develops color at 180 ° C. or more and erases at an erasing temperature of 130 ° C. to 170 ° C. is often used.
When the recording layer 11 is applied, it is performed by gravure printing or the like on the surface base material 5 before processing the IC tag. An undercoat layer (in some cases, a primer layer) is applied to the surface substrate 5 to improve adhesion, and a reversible thermosensitive recording material comprising a leuco dye is applied to the surface of the surface base material 5 to form the recording layer 11. The thickness of the recording layer 11 is about 1 μm to 10 μm.

  A reversible thermosensitive recording material using a leuco dye is a reversible thermosensitive recording material that has a lactone ring in its molecular structure and exhibits color development by opening of the lactone ring upon electron emission. in use. There are various uses for this, but generally a developer having a color developing agent composed of a leuco dye and an acid / base compound as a main component and dispersed in a binder is generally used. This recording method uses an organic substance having a property capable of reversibly releasing hydrogen ions, having an acidic group consisting of a hydroxyl group or a carboxyl group and a basic group consisting of an amino group in the molecule as a developer / color reducing agent. A lactone ring of a leuco dye is reversibly developed and decolored by utilizing a change in which the lactone ring opens and closes due to a difference in thermal conditions. In order to improve the repetition frequency characteristics and the image stability, a protective layer is provided, and a dye and a color reducing agent are microencapsulated.

  Conventional recording materials composed of leuco dyes and developer / color-reducing agents have had problems such as reduced density over time and decoloration resulting in poor contrast and poor durability for repeated use. Has been improved, and materials having clear color, contrast, and durability have been obtained. In these materials, rather than having different lactone ring opening and ring closing temperatures, the color development reaction and decoloration reaction occur in parallel by heating, and the reaction rate of the color development reaction is faster than the reaction rate of the decolorization reaction. Therefore, only a color reaction is recognized by instantaneous heating. On the other hand, although it is in an equilibrium state when heated for a long time (several hundred milliseconds even if it is a long time), this equilibrium state is considered to be a decolored state. In the reversible thermosensitive recording material, it is necessary to set the heating condition of the thermal head in consideration of this characteristic.

  The leuco dye to be used is not particularly limited, but crystal violet lactone, 3- (4-diethylamino-2-ethoxyphenyl) -3- (1-ethyl-2-methylindol-3-yl) -4- Azaphthalides, phthalide compounds such as 3-indolino-3-p-dimethylaminophenyl-6-dimethylaminophthalide, 3-diethylamino-6-methyl-7-anilinofluorane, 3-dibutylamino-6-methyl-7 Fluorane compounds such as anilinofluorane and 3-diethylamino-6-methyl-7-xylidinofluorane can be used.

  As a color-developing agent, a compound having both an acidic group consisting of a phenolic hydroxyl group or a carboxyl group and a basic group consisting of an amino group, becomes acidic or basic due to the difference in thermal energy, and develops / decolors the leuco dye. A material that can be colored or a material that can realize the above-described equilibrium state can be used. Examples thereof include salts or complex salts of acids such as hydroxybenzoic acid, hydroxysalicylic acid, gallic acid and the like with bases such as aliphatic amines, phenylalkylamines and tolylalkylamines.

  Such a recording agent can use a polymer material that dissolves in water or an organic solvent as a binder. For example, acrylic resin, methacrylic resin, polyurethane resin, polyurea resin, polycarbonate resin, polyester resin, polyamide resin , Polyvinyl alcohol, gelatin, gum arabic, methyl cellulose, ethyl cellulose, cellulose acetate, polyvinyl butyral, polyvinyl chloride and the like. In order to improve the repeatability and heat resistance, it is preferable to use a thermosetting resin or a heat resistant resin.

The rewritable sheet can be printed by a thermal printer having a thermal head. With the thermal printer, the rewritable sheet first erases the original image written by scanning the entire surface or a part thereof at a predetermined heating temperature. In the case of erasing, a longer heating time (about several hundred milliseconds to 1 second at each erasing portion) is required than in the case of writing, and it is necessary to scan the thermal head somewhat slowly.
Writing to the rewritable display portion can be performed in a shorter time (several milliseconds to several tens of milliseconds) than erasing. Writing is performed by scanning the thermal head based on the data read by the non-contact reader / writer.

<Embodiments related to other materials>
(1) Inlet base material Various plastic films can be used for the inlet base material 21. For example, polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose Various materials such as triacetate, polystyrene, ABS, polyacrylate, polypropylene, polyethylene, and polyurethane can be used.
In the case of a plastic sheet, the thickness is preferably about 15 μm to 40 μm.

(2) Front and back base materials For the front and back base materials 4 and 5, water-resistant plastic films and papers can be used. For example, white polyethylene terephthalate (PET), polyvinyl chloride, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, polypropylene, polyethylene, fine paper, coated paper, card paper, resin impregnated paper, etc. The material can be used. In addition, polypropylene-based synthetic paper, specifically, “YUPO” manufactured by YUPO CORPORATION, “CARLE” manufactured by Chisso Corporation, and the like can also be suitably used.
In the case of a plastic sheet, the thickness is preferably about 100 μm to 150 μm.

  Next, a manufacturing method of the present IC tag will be described with reference to FIG. However, the manufacturing method is not limited to this example because various deformation processes can be adopted. The manufacturing method of the rewritable sheet is the same except for the step of providing the heat-sensitive recording layer on the substrate in advance, so that it can be easily manufactured with reference to the manufacturing method of the present IC tag.

First, the cushioning double-sided pressure-sensitive adhesive tape 6 is bonded to the surface substrate 4. The cushioning double-sided pressure-sensitive adhesive tape 6 does not include a release paper and is thicker than the interposer 30. In general, a thickness of about 150 μm to 250 μm is appropriate.
Next, the side opposite to the interposer 30 of the inlet 20 is bonded to the double-sided adhesive tape 7. The double-sided pressure-sensitive adhesive tape 7 may have a thickness of about 50 μm to 100 μm that does not include release paper. Furthermore, the bonded body of the double-sided pressure-sensitive adhesive tape 7 and the inlet 20 is bonded to the back substrate 5. Both of them are bonded in the same manner as described above using a pressure roller. Finally, the surface of the inlet 20 on the interposer 30 side is bonded to the cushioning double-sided adhesive tape 6.

(1) Example of IC tag manufacture <Preparation of interposer>
A material obtained by bonding a 20 μm thick aluminum foil to a 38 μm thick PET film (interposer base 31) was etched to form connection terminals 3a and 3b. An interposer 30 as shown in FIG. 5 was completed by attaching a non-contact IC chip (interposer type) 3 having a thickness of 120 μm and a 0.8 mm square to this connection terminal using a conductive adhesive. The planar size (base material size) of the interposer was about 3 mm × 8 mm.

<Preparing the inlet>
An antenna pattern is resist-printed on a material obtained by bonding a 20 μm thick aluminum foil to a 38 μm thick PET film (inlet base material 21), and then etched to form a half-wave dipole antenna 2 as shown in FIG. It formed in the material 21 surface with the spacing pitch of 30 mm. The terminals 3a and 3b of the interposer 30 prepared as described above were pushed in between the connecting portions 2a and 2b by using a caulking blade to be connected.

<Manufacture of IC tags>
A biaxially stretched white PET film (“Chrisper” manufactured by Toyobo Co., Ltd.) having a thickness of 100 μm was used for the front substrate 4 and the back substrate 5 (see FIG. 1).
Moreover, as the cushioning double-sided pressure-sensitive adhesive tape 6 used on the inlet 20 side, an acrylic double-sided pressure-sensitive adhesive tape (“TL-505-02W” manufactured by Lintec Corporation) having a film thickness of 200 μm was used. However, the central layer base material is acrylic having a thickness of 150 μm to 160 μm, and has an acrylic pressure-sensitive adhesive layer having a thickness of 20 μm to 25 μm on both sides thereof.
Rebound resilience of 30% to 150% of the center layer substrate is of the order of density ^{0.02g / cm 3 ~0.5g / cm 3} .
In addition, the material of the cushioning double-sided pressure-sensitive adhesive tape 6 can preferably use polyurethane or polyethylene-based materials in addition to acrylic.

  As the double-sided pressure-sensitive adhesive tape 7 used on the back substrate 5 side, a 75-μm-thick polyester double-sided pressure-sensitive adhesive tape (“TL-85F-25” manufactured by Lintec Corporation) was used. The center layer base material is a polyester having a thickness of 25 μm, and has a polyester-based pressure-sensitive adhesive layer having a thickness of 25 μm on both sides thereof. The double-sided pressure-sensitive adhesive tapes 6 and 7 are in a state where the front and back surfaces are protected by release paper.

Since the release paper of the cushioning double-sided pressure-sensitive adhesive tape 6 was not removed, it was adhered to the surface substrate 4 using a pressure roller. On the other hand, the back substrate 5 was bonded to the inlet 20 on which the interposer 30 was mounted while removing the release paper on one side via the double-sided adhesive tape 7.
Finally, while pressing the interposer 30 against the cushioning double-sided pressure-sensitive adhesive tape 6 on the backside base material 5 with the inlet 20 bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 with the surface base material 4 adhered, 5 was adhered. The interposer 30 was fixed in the compression unit 8. Thus, an IC tag connecting body in which the present IC tag 1 having the dipole antenna 2 was continuously formed was obtained.

(1) Example of IC tag manufacture <Preparation of interposer>
Using the same material as in Example 1 and manufacturing the interposer under the same conditions, an interposer 30 as shown in FIG. 5 was completed. The planar size (base material size) of the interposer was about 3 mm × 8 mm.

<Preparing the inlet>
Using the interposer prepared above, the same material as in Example 1 was used, and an inlet was manufactured under the same conditions.

<Manufacture of IC tags>
A biaxially stretched white PET film (“Chrisper” manufactured by Toyobo Co., Ltd.) having a thickness of 100 μm was used for the front substrate 4 and the back substrate 5 (see FIG. 1).
Moreover, as the cushioning double-sided pressure-sensitive adhesive tape 6 used on the inlet 20 side, an acrylic double-sided pressure-sensitive adhesive tape (“No. 7840” manufactured by Terraoka Co., Ltd.) having a film thickness of 160 μm was used.
However, the central layer base material is acrylic having a thickness of 100 μm, and has a pressure-sensitive adhesive layer having a thickness of 30 μm on both sides thereof. The center layer substrate has a rebound resilience of about 30% to 150% and a density of about 0.02 to 0.5 g / cm ³ .

  As the double-sided pressure-sensitive adhesive tape 7 used on the back substrate 5 side, a polyester double-sided pressure-sensitive adhesive tape (“TL-85F-25” manufactured by Lintec Corporation) having a film thickness of 75 μm was used in the same manner as in Example 1.

Since the release paper of the cushioning double-sided pressure-sensitive adhesive tape 6 was not removed, it was adhered to the surface substrate 4 using a pressure roller. On the other hand, the back substrate 5 was bonded to the inlet 20 on which the interposer 30 was mounted while removing the release paper on one side via the double-sided adhesive tape 7.
Finally, while pressing the interposer 30 against the cushioning double-sided pressure-sensitive adhesive tape 6 on the backside base material 5 with the inlet 20 bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 with the surface base material 4 adhered, 5 was adhered. The interposer 30 was fixed in the compression unit 8. Thus, an IC tag connecting body in which the present IC tag 1 having the dipole antenna 2 was continuously formed was obtained.

(1) Example of IC tag manufacture <Preparation of interposer>
Using the same material as in Example 1 and manufacturing the interposer under the same conditions, an interposer 30 as shown in FIG. 5 was completed. The planar size (base material size) of the interposer was about 3 mm × 8 mm.

<Preparing the inlet>
Using the interposer prepared above, the same material as in Example 1 was used, and an inlet was manufactured under the same conditions.

<Manufacture of IC tags>
A biaxially stretched white PET film (“Chrisper” manufactured by Toyobo Co., Ltd.) having a thickness of 100 μm was used for the front substrate 4 and the back substrate 5 (see FIG. 1).
Further, an acrylic double-sided adhesive tape (“No. 7840” manufactured by Terraoka Co., Ltd.) having a film thickness of 160 μm was used for the cushioning double-sided adhesive tape 6 used on the side opposite to the interposer 30 of the inlet 20. However, the central layer base material is an acrylic type having a thickness of 100 μm, and has an acrylic adhesive layer having a thickness of 30 μm on both sides thereof. The center layer substrate has a rebound resilience of about 30% to 150% and a density of about 0.02 to 0.5 g / cm ³ .

  As the double-sided pressure-sensitive adhesive tape 7 used on the back substrate 5 side, a polyester double-sided pressure-sensitive adhesive tape (“TL-85F-25” manufactured by Lintec Corporation) having a film thickness of 75 μm was used in the same manner as in Example 1.

Since the release paper of the cushioning double-sided pressure-sensitive adhesive tape 6 was not removed, it was adhered to the surface substrate 4 using a pressure roller. On the other hand, the back substrate 5 was bonded to the inlet 20 on which the interposer 30 was mounted while removing the release paper on one side via the double-sided adhesive tape 7.
Finally, while pressing the interposer 30 against the cushioning double-sided pressure-sensitive adhesive tape 6 on the backside base material 5 with the inlet 20 bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 with the surface base material 4 adhered, 5 was adhered. The interposer 30 was pressed and fixed in the compression unit 8. Thus, an IC tag connecting body in which the present IC tag 1 having the dipole antenna 2 was continuously formed was obtained.

(2) Example of manufacturing rewritable sheet with IC tag <Preparation of interposer>
The same material as in Example 1 was used and the interposer was manufactured under the same conditions, but the shape was such that the interposer 30 as shown in FIG. 6 was formed, and the insulating film 32 was formed by a coating film.
The planar size (base material size) of the completed interposer 30 was about 3 mm × 16 mm.

<Preparing the inlet>
An antenna pattern is resist printed on a material obtained by bonding a 25 μm thick aluminum foil to a PET film (inlet substrate 21) having a thickness of 38 μm, and then etched to form a coiled planar antenna as shown on the left side of FIG. 2 was formed. The antenna 2 was formed so as to have six turns with a line width of 1.0 mm, the outer shape of the antenna 2 was 45 mm × 75 mm, and the outer shape of the inlet 20 was 60 mm × 90 mm. The interposer 30 prepared as described above was mounted so as to straddle the intermediate winding of the coil over the outer peripheral end and the inner peripheral end of the antenna 2, and the terminals 3a and 3b were connected using a caulking blade.

<Manufacture of rewritable sheets with IC tags>
For the front substrate 5, a material obtained by coating a black color reversible thermosensitive recording material on a PET film having a thickness of 100 μm (“RECO-View 630BD” manufactured by Ricoh Co., Ltd.) is used. A material not coated with a heat-sensitive recording material with a PET film having a thickness of 100 μm (“RECO-View PET” manufactured by Ricoh Co., Ltd.) was used. The size of one rewritable sheet was such that the long side was 150 mm and the short side was 90 mm, and the inlet 20 was provided in the left region (see FIG. 3A).

Moreover, as the cushioning double-sided pressure-sensitive adhesive tape 6 used on the inlet 20 side, an acrylic double-sided pressure-sensitive adhesive tape (“TL-505-02W” manufactured by Lintec Corporation) having a film thickness of 200 μm was used. However, the central layer base material is acrylic having a thickness of 150 μm to 160 μm, and has an acrylic pressure-sensitive adhesive layer having a thickness of 20 μm to 25 μm on both sides thereof. Rebound resilience of 30% to 150% of the center layer substrate is of the order of density ^{0.02g / cm 3 ~0.5g / cm 3} . As the double-sided pressure-sensitive adhesive tape 7 used on the surface substrate 5 side, a 75-μm-thick polyester double-sided pressure-sensitive adhesive tape (“TL-85F-25” manufactured by Lintec Corporation) was used.
The center layer base material is a polyester having a thickness of 25 μm, and has a polyester-based pressure-sensitive adhesive layer having a thickness of 25 μm on both sides thereof. The double-sided pressure-sensitive adhesive tapes 6 and 7 are in a state where the front and back surfaces are protected by release paper.

After the cushioning double-sided pressure-sensitive adhesive tape 6 was cut to a size of 60 mm × 90 mm, the release paper on one side was not removed, and was bonded to the back substrate 4 using a pressure roller. On the other hand, the surface substrate 5 was bonded to the inlet 20 mounted with the interposer 30 and cut to a size of 60 mm × 90 mm through the double-sided adhesive tape 7 while removing the release paper on one side.
Finally, both the front and back substrates were bonded while pressing the interposer 30 of the surface substrate 5 to which the inlet 20 was bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 side. Thereby, the interposer 30 was accommodated in the compression part 8, and the rewritable sheet 10 with an IC tag which has the coiled planar antenna 2 was completed (refer FIG.3 (B)).

(2) Example of manufacturing rewritable sheet with IC tag <Preparation of interposer>
The same material as in Example 1 was used and the interposer was manufactured under the same conditions, but the shape was such that the interposer 30 as shown in FIG. 6 was formed, and the insulating film 32 was formed by a coating film.
The planar size (base material size) of the completed interposer 30 was about 3 mm × 16 mm.

<Preparing the inlet>
Using the interposer prepared above, the same material as in Example 4 was used, and an inlet was manufactured under the same conditions.

<Manufacture of rewritable sheets with IC tags>
For the front substrate 5, a material obtained by coating a black color reversible thermosensitive recording material on a PET film having a thickness of 100 μm (“RECO-View 630BD” manufactured by Ricoh Co., Ltd.) is used. A material not coated with a heat-sensitive recording material with a PET film having a thickness of 100 μm (“RECO-View PET” manufactured by Ricoh Co., Ltd.) was used. The size of one rewritable sheet was such that the long side was 150 mm and the short side was 90 mm, and the inlet 20 was provided in the left region (see FIG. 3A).

Moreover, as the cushioning double-sided pressure-sensitive adhesive tape 6 used on the inlet 20 side, an acrylic double-sided pressure-sensitive adhesive tape (“No. 7840” manufactured by Terraoka Co., Ltd.) having a film thickness of 160 μm was used.
However, the central layer base material is acrylic having a thickness of 100 μm, and has a pressure-sensitive adhesive layer having a thickness of 30 μm on both sides thereof. The center layer substrate has a rebound resilience of about 30% to 150% and a density of about 0.02 to 0.5 g / cm ³ .
For the double-sided pressure-sensitive adhesive tape 7 used on the surface base material 5 side, the same polyester double-sided pressure-sensitive adhesive tape as in Example 4 ("TL-85F-25" manufactured by Lintec Corporation) was used. The double-sided pressure-sensitive adhesive tapes 6 and 7 are in a state where the front and back surfaces are protected by release paper.

After the cushioning double-sided pressure-sensitive adhesive tape 6 was cut to a size of 60 mm × 90 mm, the release paper on one side was not removed, and was bonded to the back substrate 4 using a pressure roller. On the other hand, the surface substrate 5 was bonded to the inlet 20 mounted with the interposer 30 and cut to a size of 60 mm × 90 mm through the double-sided adhesive tape 7 while removing the release paper on one side.
Finally, both the front and back substrates were bonded while pressing the interposer 30 of the surface substrate 5 to which the inlet 20 was bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 side. Thereby, the interposer 30 was accommodated in the compression part 8, and the rewritable sheet 10 with an IC tag which has the coiled planar antenna 2 was completed (refer FIG.3 (B)).

(2) Example of manufacturing rewritable sheet with IC tag <Preparation of interposer>
The same material as in Example 1 was used and the interposer was manufactured under the same conditions, but the shape was such that the interposer 30 as shown in FIG. 6 was formed, and the insulating film 32 was formed by a coating film.
The planar size (base material size) of the completed interposer 30 was about 3 mm × 16 mm.

<Preparing the inlet>
Using the interposer prepared above, the same material as in Example 4 was used, and an inlet was manufactured under the same conditions.

<Manufacture of rewritable sheets with IC tags>
For the front substrate 5, a material obtained by coating a black color reversible thermosensitive recording material on a PET film having a thickness of 100 μm (“RECO-View 630BD” manufactured by Ricoh Co., Ltd.) is used. A material not coated with a heat-sensitive recording material with a PET film having a thickness of 100 μm (“RECO-View PET” manufactured by Ricoh Co., Ltd.) was used. The size of one rewritable sheet is such that the long side is 150 mm and the short side is 90 mm, and the inlet 20 is provided in the left region (see FIGS. 3A and 4). .

Moreover, the cushioning double-sided adhesive tape 6 used on the side opposite to the interposer 30 of the inlet 20 was the same acrylic double-sided adhesive tape ("No. 7840" manufactured by Terraoka Co., Ltd.) having a film thickness of 160 µm as in Example 5. .
For the double-sided pressure-sensitive adhesive tape 7 used on the back substrate 4 side, the same polyester double-sided pressure-sensitive adhesive tape as in Example 4 ("TL-85F-25" manufactured by Lintec Corporation) was used. The double-sided pressure-sensitive adhesive tapes 6 and 7 are in a state where the front and back surfaces are protected by release paper.

  After the cushioning double-sided pressure-sensitive adhesive tape 6 was cut to a size of 150 mm × 90 mm, the release paper on one side was not removed, and was adhered to the surface substrate 5 using a pressure roller. On the other hand, the back substrate 4 was bonded to the inlet 20 mounted with the interposer 30 and cut into a size of 60 mm × 90 mm through the double-sided adhesive tape 7 while removing the release paper on one side. Finally, both the front and back substrates were bonded while pressing the opposite side surface of the back substrate 4 to which the inlet 20 was bonded to the cushioning double-sided pressure-sensitive adhesive tape 6 side. Thereby, the protrusion part 9 resulting from the interposer 30 was accommodated in the compression part 8, and the rewritable sheet 10 with an IC tag which has the coiled planar antenna 2 was completed (refer FIG. 4).

  Since the IC tag 1 of Example 1, Example 2, and Example 3 uses the cushioning double-sided pressure-sensitive adhesive tape 6, the thickness of the interposer 30 is absorbed, and even if the IC tags 1 themselves are stacked, The interposer part did not become bulky. Further, by using the double-sided double-sided pressure-sensitive adhesive tape, cushioning properties can be produced, and external impacts and static pressure can be alleviated.

  The rewritable sheet 10 with an IC tag of Example 4, Example 5, and Example 6 had good printability by performing cushioning action with a cushioning double-sided adhesive tape interposed between the front and back substrates. Moreover, since the thickness of the portion where the interposer 30 is mounted is absorbed and the flatness is maintained, the print recording by the thermal printer is not impaired.

It is a figure which shows the IC tag which has the interposer protection structure of this invention. It is sectional drawing which shows the other example of the IC tag. It is a figure which shows the rewritable sheet | seat with an IC tag of this invention. It is sectional drawing which shows the other example of the rewritable sheet. It is a figure which shows the example of an interposer. It is a figure which shows the example of an interposer.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC tag which has interposer protection structure, this IC tag 2 Antenna 3 IC chip 4,5 Base material 6 Cushioning double-sided adhesive tape 7 Double-sided adhesive tape 8 Compression part 9 Protrusion part 10 Rewritable sheet 11 Recording area | region, recording layer 20 Inlet 30 Interposer

Claims (10)

In an IC tag in which an inlet mounted with an interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet, the double-sided adhesive tape on the side of the interposer side of the inlet has a central layer base material cushioned Therefore, an IC tag having an interposer protection structure, wherein a portion facing the interposer is compressed, the interposer is accommodated in the compression portion, and the inlet and the double-sided adhesive tape are bonded. In an IC tag in which an inlet with an interposer mounted is bonded with a double-sided adhesive tape between the front and back base materials sandwiching the inlet, the double-sided adhesive tape on the side opposite to the interposer of the inlet has a central layer base material with cushioning properties Therefore, the interposer protective structure is characterized in that the portion facing the interposer is compressed, the protruding portion due to the interposer is accommodated in the compressed portion, and the inlet and the double-sided adhesive tape are bonded. IC tag with. The IC tag having an interposer protection structure according to claim 1 or 2, wherein the center layer base material of the cushioning double-sided pressure-sensitive adhesive tape is a low-resilience elastic foam. 3. The IC tag having an interposer protection structure according to claim 1, wherein the inlet has a dipole planar antenna. The IC tag having an interposer protection structure according to claim 1 or 2, wherein the inlet has a coiled planar antenna. In an rewritable sheet with an IC tag in which an inlet mounted with an interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet, the surface of any of the substrates is recorded with a thermoreversible thermosensitive recording agent In the double-sided pressure-sensitive adhesive tape on the side surface of the interposer of the inlet, since the central layer base material is cushioned, the portion facing the interposer is compressed, and the interposer is placed in the compression portion. A rewritable sheet with an IC tag, wherein the inlet and the double-sided adhesive tape are bonded. In an rewritable sheet with an IC tag in which an inlet mounted with an interposer is bonded with a double-sided adhesive tape between the front and back substrates sandwiching the inlet, the surface of any of the substrates is recorded with a thermoreversible thermosensitive recording agent In the double-sided pressure-sensitive adhesive tape on the side opposite to the interposer of the inlet, since the center layer base material is cushioned, the portion facing the interposer is compressed, and the interposer is compressed in the compression portion. A rewritable sheet with an IC tag, wherein the inlet and the double-sided pressure-sensitive adhesive tape are bonded to each other with a protruding portion caused by the above-mentioned problem. The rewritable sheet with an IC tag according to claim 6 or 7, wherein the base layer base material of the cushioning double-sided pressure-sensitive adhesive tape is a low resilience foam. The rewritable sheet with an IC tag according to claim 6 or 7, wherein the inlet has a dipole planar antenna. 8. The rewritable sheet with an IC tag according to claim 6, wherein the inlet has a coiled planar antenna.

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