JP2008053411A - Probe inspection device and method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe inspection device and a probe inspection method allowing an operator to check displacement of a probe needle easily visually. <P>SOLUTION: A probe inspection device 1 carries out probe inspection by bringing a probe needle 42 of a probe card 40 into contact with an electrode pad on a semiconductor wafer 90, and comprises a monitor 10 (display unit) for displaying a picture of an electrode pad. The monitor 10 displays by superposing a target contact position of the probe needle 42 on the electrode pad computed on the data of the position coordinate of the probe needle 42 onto the picture of the electrode pad. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a probe inspection apparatus and a probe inspection method.

  As a conventional probe inspection apparatus, for example, there is one described in Patent Document 1. The probe inspection apparatus described in the document includes a stage on which a semiconductor wafer to be inspected is placed, a probe needle that is brought into contact with an electrode pad of the semiconductor wafer, and a needle trace confirmation member that is provided so as to be interlocked with the stage operation. ing.

In this apparatus, the position of the needle trace remaining on the needle trace confirmation member due to the contact of the probe needle is detected by the camera, and the deviation between the detected position and the target position is obtained. Then, when the probe needle is brought into contact with the electrode pad, the position correction is automatically performed based on the deviation.
JP 2005-123293 A

  However, in such a probe inspection apparatus that automatically performs position correction, probe inspection may be performed without sufficient correction. For example, the deviation between the actual needle trace and the target position may not be sufficiently improved even by the automatic correction due to an error of the apparatus, a variation of the probe needle, deterioration due to use, or the like.

  A probe inspection apparatus according to the present invention is an apparatus that performs probe inspection by bringing a probe needle into contact with an electrode pad on a semiconductor wafer, and includes a display unit that displays an image of the electrode pad, and the display unit includes the probe The target contact position of the probe needle on the electrode pad calculated based on the needle position coordinate data is displayed superimposed on the image of the electrode pad.

  In this probe inspection apparatus, the target contact position of the probe needle based on the position coordinate data of the probe needle is displayed superimposed on the electrode pad image. For this reason, the operator can easily visually confirm the deviation between the actual needle trace on the electrode pad and the target contact position. As a result of the confirmation, the operator may correct the position as necessary. In this way, it is possible to prevent the probe inspection from being performed without performing sufficient correction by leaving the determination regarding whether or not correction is necessary to the operator.

  ADVANTAGE OF THE INVENTION According to this invention, the probe test | inspection apparatus and probe test | inspection method with which an operator can confirm visually the position shift of a probe needle easily are implement | achieved.

  Hereinafter, preferred embodiments of a probe inspection apparatus and a probe inspection method according to the present invention will be described in detail with reference to the drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

  FIG. 1 is a front view showing an embodiment of a probe inspection apparatus according to the present invention. The probe inspection apparatus 1 is an apparatus for performing probe inspection by bringing a probe needle 42 of a probe card 40 into contact with an electrode pad (not shown) on a semiconductor wafer 90, and a monitor 10 (display) that displays an image of the electrode pad. Part). The monitor 10 displays the target contact position of the probe needle 42 on the electrode pad, calculated based on the position coordinate data of the probe needle 42, superimposed on the electrode pad image. In other words, the target contact position is an optimum contact position of the probe needle 42 with respect to the electrode pad. As the monitor 10, for example, a liquid crystal display can be used.

  The probe inspection apparatus 1 includes a main body 20 and a camera 30 in addition to the monitor 10. The main body 20 includes a stage 22 on which the semiconductor wafer 90 is placed and a loader 24 that transports the semiconductor wafer 90. The stage 22 is movable in the X direction (left-right direction in the figure), Y direction (same front-rear direction), Z direction (same vertical direction), and θ direction (rotation direction). The camera 30 acquires an image of the electrode pad on the semiconductor wafer 90 placed on the stage 22. As described above, the image is displayed on the screen of the monitor 10 together with the target contact position of the probe needle 42. As the camera 30, for example, a CCD camera can be used.

  A probe card 40 is disposed at a predetermined position of the probe inspection apparatus 1 so as to face the stage 22. The probe card 40 is provided with a plurality of probe needles 42 corresponding to the positions of the electrode pads on the semiconductor wafer 90. The position coordinate data of these probe needles 42 acquired at the time of manufacturing the probe card 40 is taken into the main body 20. Specifically, the data is stored in a memory such as a ROM built in the main body unit 20. Data can be taken in online via a communication line or via a storage medium.

  FIG. 2 is a diagram illustrating an example of a display image on the monitor 10. On the monitor 10, an image 82 of the electrode pad, a needle mark 84 remaining on the electrode pad due to contact with the probe needle 42, and a target contact position 86 are displayed. Further, a probing area 88 is displayed on the monitor 10. The probing area 88 is set based on the electrode pad data taken into the main body 20 and the position coordinate data. The probing area 88 corresponds to an allowable range of the contact position of the probe needle 42 on the electrode pad. Accordingly, the target contact position 86 is naturally included in the probing area 88.

  An embodiment of the probe inspection method according to the present invention will be described together with the operation of the probe inspection apparatus 1 with reference to the flowchart of FIG. First, the position coordinate data of the probe needle 42 is taken into the main body 20 (S31). However, this step can be omitted if preloaded. Next, the loader 24 transports the semiconductor wafer 90 into the apparatus. The semiconductor wafer 90 transported into the apparatus is placed on the stage 22. Subsequently, wafer alignment, that is, rough positioning of the semiconductor wafer 90 with respect to the probe card 40 is performed. Further, fine alignment between the probe needle 42 and the electrode pad is performed while confirming the needle tip of the probe needle 42 with the camera 30 (S32).

  Thereafter, the operator moves the stage 22 in the Z direction and brings the probe needle 42 into contact with the electrode pad (S33). Thereby, a needle mark is attached to the electrode pad. The needle trace is displayed on the monitor 10 (S34). At this time, the target contact position calculated from the position coordinate data of the probe needle 42 is displayed on the monitor 10 together with the needle trace of the electrode pad. The operator visually recognizes the needle trace remaining on the electrode pad and the target contact position on the monitor 10, and confirms whether the needle trace is at a desired position (S35).

  If the operator determines that position correction is necessary as a result of the confirmation, the operator adjusts the relative position between the probe needle 42 and the electrode pad so that the deviation is reduced. Specifically, the shift is reduced by moving the stage 22 in the X direction, the Y direction, or the θ direction. When the probing area 88 (see FIG. 2) is displayed on the monitor 10, the necessity of position correction may be mechanically determined based on whether or not the position of the needle trace is within the probing area 88. it can. That is, when the position of the needle trace is outside the probing area 88, the relative position between the probe needle 42 and the electrode pad may be adjusted.

  In the case of the example shown in FIG. 2, the needle mark 84 does not coincide with the target contact position 86 but is in the probing area 88. Therefore, according to the above-described determination criterion, position correction is not necessary. However, even in this case, the position correction may be executed so as to further reduce the deviation between the needle trace 84 and the target contact position 86 at the operator's discretion. After the position correction, the probe inspection is started (S36). Naturally, when the operator determines that position correction is not necessary, the probe inspection is started without this being performed.

  The effect of this embodiment will be described. In the probe inspection apparatus 1, the target contact position of the probe needle 42 based on the position coordinate data of the probe needle 42 is displayed superimposed on the electrode pad image 82. For this reason, the operator can easily visually confirm the deviation between the actual needle trace on the electrode pad and the target contact position. As a result of the confirmation, the operator may perform position correction as necessary as described above. In this way, it is possible to prevent the probe inspection from being performed without performing sufficient correction by leaving the determination regarding whether or not correction is necessary to the operator.

  Also, when it is necessary to separate the area where the probe needle can come into contact with the area where the bonding ball is formed within one electrode pad, it is difficult to determine where the needle mark should be attached within the electrode pad. There is. According to the present embodiment, since the probing area is displayed, the operator can easily determine visually whether or not the needle trace exists at the correct position. This makes it possible to determine the position of the needle in the probing area, which is impossible with the conventional technology. However, it is not essential to display the probing area on the monitor 10.

  The probe inspection apparatus and the probe inspection method according to the present invention are not limited to the above embodiment, and various modifications are possible.

It is a front view which shows one Embodiment of the probe test | inspection apparatus by this invention. It is a figure which shows an example of the display image of a display part. It is a flowchart for demonstrating one Embodiment of the probe test | inspection method by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe inspection apparatus 10 Monitor 20 Main body part 22 Stage 24 Loader 30 Camera 40 Probe card 42 Probe needle 82 Electrode pad image 84 Needle trace 86 Target contact position 88 Probing area 90 Semiconductor wafer

Claims (5)

An apparatus for performing a probe inspection by bringing a probe needle into contact with an electrode pad on a semiconductor wafer,
A display unit for displaying an image of the electrode pad;
The display unit displays the target contact position of the probe needle on the electrode pad, which is calculated based on the position coordinate data of the probe needle, superimposed on the image of the electrode pad. Probe inspection device. The probe inspection apparatus according to claim 1,
The probe inspection apparatus, in which the image of the electrode pad displayed on the display unit shows a needle mark remaining on the electrode pad by contact of the probe needle. In the probe inspection apparatus according to claim 1 or 2,
The probe inspection apparatus, wherein the display unit displays an allowable range of the contact position of the probe needle on the electrode pad together with the target contact position. A method for performing a probe inspection using the probe inspection apparatus according to claim 1,
Adjusting the relative position of the probe needle and the electrode pad so that the deviation between the position of the needle mark remaining on the electrode pad due to the contact of the probe needle and the target contact position is reduced. A characteristic probe inspection method. A method of performing probe inspection using the probe inspection apparatus according to claim 3,
Adjusting the relative position between the probe needle and the electrode pad when the position of the needle mark remaining on the electrode pad due to the contact of the probe needle is outside the allowable range. Probe inspection method.

Images