JP2008044043A - Ultrasonic vibration cutting tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly mount a blade body to an oscillator so that ultrasonic vibrations are suitably transmitted from the oscillator to the blade body. <P>SOLUTION: When a diamond blade 8 is fitted in a vibration converting part 4, after a solder 12 is nipped between the diamond blade 8 and an oscillator side mounting part 5, the diamond blade 8 and the oscillator side mounting part 5 are supported unseparated from each other via the solder 12. Under this condition, heat is applied to the solder 12 by a heater. When the solder 12 is molten by the applied heats, supply of the heat to the solder 12 is stopped, so that the solder 12 is cooled and hardened. In this process, because a metallic layer 11 of the diamond blade 8 and the oscillator side mounting part 5 are fixed to each other by the solder 12, the ultrasonic vibrations are suitably transmitted to the blade body, and the blade body is suitably mounted without damaging the oscillator. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an ultrasonic vibration cutting tool in which a diamond blade is appropriately attached to a resonator so that ultrasonic vibration is suitably transmitted from the resonator to the diamond blade.

In the ultrasonic vibration cutting tool, a diamond blade for cutting a workpiece by ultrasonic vibration is attached to a metal resonator that resonates with ultrasonic vibration with a screw (see Patent Document 1), or ultrasonic 2. Description of the Related Art A diamond blade for cutting a workpiece by vibration is grown by electrolytic plating on a metal resonator that resonates with ultrasonic vibration (see Patent Documents 2 to 4). However, the former has a structure in which ultrasonic vibration is suitably transmitted from the resonator to the diamond blade by tightening the screw with high torque, and the diamond blade may be damaged such as cracking or deformation. There are drawbacks. The latter is a structure in which the outer edge or all of the protrusion is removed after the diamond blade is grown by electrolytic plating using the protrusion of the resonator as a seed, so the thickness of the portion exposed by removal of the protrusion in the diamond blade Has the disadvantage that it may not be uniform. In addition, for cutting tools that do not use ultrasonic vibration, a structure in which a diamond blade is fixed to a tool base with a synthetic resin bonding agent is also known, but the resonator and the diamond blade are fixed with a synthetic resin bonding agent. In this case, since the ultrasonic vibration is absorbed by the synthetic resin bonding agent and is not suitably transmitted from the resonator to the diamond blade, it is difficult to adopt it.
Japanese Patent No. 3128508 Japanese Patent No. 3469516 Japanese Patent No. 3772162 JP 2003-285297 A

  The problem to be solved by the invention is that the diamond blade is not properly attached to the resonator so that ultrasonic vibrations are suitably transmitted from the resonator to the diamond blade.

  An ultrasonic vibration cutting tool according to the present invention includes a metal resonator that resonates with ultrasonic vibration, and a diamond blade for cutting a workpiece by ultrasonic vibration transmitted from the resonator, and the diamond blade resonates. The main feature is that it is fixed to the resonator side mounting portion for mounting the diamond blade of the ceramic by soldering.

  The ultrasonic vibration cutting tool according to the present invention suffers damage such as cracking and deformation when the diamond blade is attached to the resonator by fixing the diamond blade to the resonator-side attachment portion of the resonator with solder. The diamond blade can be made of a uniform thickness that is formed separately from the resonator, and the metal bonding agent does not absorb the ultrasonic vibration. There is an advantage that it is suitably transmitted to the diamond blade. If the metal bonding agent is made of solder, there is an advantage that the diamond blade can be easily replaced.

  1 to 3 show the best mode for carrying out the invention. FIG. 1A shows the appearance of a rotary cutting type ultrasonic vibration cutting tool 1. FIG. 1b shows a cross section in which the resonator 2, the diamond blade 8 and the solder 12 are disassembled and cut in the transmission direction X1 of ultrasonic vibration. FIG. 2 shows a structure in which the ultrasonic vibration cutting tool 1, the booster 14, and the vibrator 16 are combined. FIG. 3 shows a rotary ultrasonic vibration cutting device 20.

  In FIG. 1, 2 is a resonator, 3 is a resonance main body part, 4 is a vibration converting part, 5 is a resonator side mounting part, 6 is a tool fitting part, 7 is a screw hole, 8 is a diamond blade, and 9 is a mounting hole. Reference numeral 10 denotes diamond particles, 11 denotes a metal layer, 12 denotes solder, and 13 denotes a through hole.

  As shown in FIG. 1 a, the ultrasonic vibration cutting tool 1 is fixed around the mounting hole 9 in the diamond blade 8 to the resonator-side mounting portion 5 of the resonator 2 with solder 12 that is a metal bonding agent. Thus, the diamond blade 8 is attached to the resonator 2. Therefore, when the diamond blade 8 is attached to the resonator 2, there is no damage such as cracking or deformation, and the diamond blade 8 should have a uniform thickness formed separately from the resonator 2. Since the solder 12 does not absorb the ultrasonic vibration, there is an advantage that the ultrasonic vibration is suitably transmitted from the resonator 2 to the diamond blade 8, and the diamond blade 8 can be easily replaced. There are advantages. A commercially available product may be used for the diamond blade 8.

  As shown in FIG. 1 b, the resonator 2 constitutes an ultrasonic horn made of a metal such as aluminum having good acoustic characteristics, and includes a resonance main body portion 3, a vibration conversion portion 4, a resonator-side attachment portion 5, a tool. A fitting portion 6 and a screw hole 7 are provided. The resonance main body 3 has a length of ½ wavelength that resonates with ultrasonic vibration input from one end. At both ends of the resonance main body 3, there is a maximum vibration amplitude point f1; f3 of a vibration waveform W1 indicating an instantaneous displacement (vibration amplitude) that vibrates in the transmission direction X1 of the ultrasonic vibration. Has a minimum vibration amplitude point f2 of the vibration waveform W1.

  The vibration conversion unit 4 projects coaxially with the resonance main body 3 in the orthogonal direction Y orthogonal to the transmission direction X1 of the ultrasonic vibration from the outer peripheral surface of the resonance main body 3 at the position of the minimum vibration amplitude point f2 of the vibration waveform W1. Annular, having a diameter larger than that of the resonance main body 3 and a width equally distributed on both sides of the transmission direction X1 of the ultrasonic vibration around the minimum vibration amplitude point f2, and the transmission direction X1 of the ultrasonic vibration Is converted from the axial direction to the radial direction which is the orthogonal direction Y. The transmission direction X1 is the same as the direction in which the center line L of the resonator 2 extends. The instantaneous displacement (vibration amplitude) of the ultrasonic vibration converted in the orthogonal direction Y is a vibration waveform W2. The maximum vibration amplitude point f4; f5 in the vibration waveform W2 exists on the outer peripheral side of the vibration converting unit 4. The resonator-side mounting portion 5 has an annular shape that protrudes coaxially with the resonance main body portion 3 on the outer side in the orthogonal direction from the outer peripheral surface of the vibration converting portion 4. The tool fitting portion 6 is provided on the outer peripheral surface of the resonance main body portion 3 at a position where it does not interfere with the vibration converting portion 4. The screw hole 7 is formed inside the center of both end faces of the resonance main body portion 3 in order to couple a headless screw.

  The diamond blade 8 has a structure in which a large number of diamond particles 10 are bonded by a metal layer 11 made of nickel by a diamond electrolytic plating method, and has an outer diameter larger than the diameter of the resonator-side mounting portion 5 in the resonator 2. The mounting hole 9 is provided in the center portion of the diamond blade 8 as a hole penetrating in the transmission direction X1 so as to be fitted into the vibration converting portion 4.

  The solder 12 is a hard solid or a soft paste. When the solder 12 is solid, the solder 12 has the same inner diameter as the mounting hole 9 and the same outer diameter as the resonator-side mounting portion 5. When the solder 12 is paste-like, it is applied to the surface on the side of the diamond blade 8 in the resonator-side mounting portion 5 or the surface on the side of the resonator-side mounting portion 5 in the diamond blade 8. The through-hole 13 is provided in the center part of the solder 12 configured as a solid as a hole penetrating in the transmission direction X <b> 1 so as to be fitted into the vibration conversion unit 4.

  When the diamond blade 8 is fitted into the vibration converting portion 4, after the solder 12 is sandwiched between the diamond blade 8 and the resonator-side mounting portion 5, the diamond blade 8 and the resonator-side mounting portion 5 are soldered. Heat is applied to the solder 12 with a heater (not shown) in a state where it is supported so as not to separate while interposing 12, and when the solder 12 is melted by the applied heat, the supply of heat to the solder 12 is stopped. Thereby, the metal layer 11 of the diamond blade 8 and the resonator-side mounting portion 5 are fixed to each other by the solder 12 in the process of cooling and solidifying the solder 12. That is, the resonator-side mounting portion 5 and the diamond blade 8 are fixed to each other with the solder 12, the diamond blade 8 is mounted to the resonator 2, and the ultrasonic vibration cutting tool 1 is completed with the structure shown in FIG. . That is, the solder 12 remelts and bonds the diamond blade 8 and the resonator-side mounting portion 5 like a bonding agent such as hot melt.

  With reference to FIG. 2, the form in which the ultrasonic vibration cutting tool 1 is subjected to ultrasonic vibration cutting will be described. A booster 14 is coupled to one end of the resonator 2 by a headless screw 15, and a vibrator 16 is coupled to one end of the booster 14 by a headless screw 17. The booster 14 is made of a metal such as aluminum having good acoustic characteristics, and has a length of one wavelength that resonates with the ultrasonic vibration transmitted from the vibrator 16. At both ends of the booster 14, there are maximum vibration amplitude points f11 and f15 of the vibration waveform W1. When the resonator 2 and the booster 14 are coupled by the headless screw 15, one resonator is formed. The booster 14 includes front and rear support portions 18 and a tool fitting portion 19. The support portion 18 has an annular shape that protrudes radially outward from the outer surface of the booster 14 at the position of the minimum vibration amplitude point f12; f14 of the booster 14. The tool fitting portion 19 is provided on the outer peripheral surface of the booster 14 at a position where it does not interfere with the support portion 18.

  Then, in a state where the support portion 18 is supported by the ultrasonic vibration rotating mechanism 21 (see FIG. 3), when the vibrator 16 generates ultrasonic vibration with electric energy, the ultrasonic vibration causes the booster 14 to move from the vibrator 16. The resonator 2 resonates with the ultrasonic vibration transmitted from the vibrator 16, and the outer peripheral surface of the diamond blade 8 vibrates in the radial direction indicated by the arrow Y. The vibration of the outer peripheral surface of the diamond blade 8 in the radial direction is determined by the amount of protrusion from the vibration converting portion 4. If the diameter of the diamond blade 8 is too larger than the diameter of the vibration converting portion 4, the outer peripheral surface of the diamond blade 8 will also vibrate in the direction of arrow X 1, so the diameter of the diamond blade 8 is based on the diameter of the vibration converting portion 4. The blade edge is determined within a range in which the blade edge vibrates only in the arrow Y direction. In FIG. 2, the resonator 2 and the booster 14 may be formed of a single metal material without being coupled with the headless screw 15.

  With reference to FIG. 3, the cutting process using the ultrasonic vibration cutting tool 1 is demonstrated. A description will be given of an example of a cutting process in which a semiconductor wafer 23 including an IC as a member to be cut is cut into dice-like semiconductor chips called bare chips. The booster 14 and the vibrator 16 of FIG. 2 are coaxially incorporated inside the ultrasonic vibration rotating mechanism 21 of the ultrasonic vibration cutting device 20, and the support portions 18 of FIG. 2 before and after the booster 14 are the ultrasonic vibration rotating mechanism 21. The diamond blade 8 of FIG. 1 of the ultrasonic vibration cutting tool 1 is disposed outside the ultrasonic vibration rotating mechanism 21. Further, the semiconductor wafer 23 is fixed to the mounting table 22 of the ultrasonic vibration cutting device 20.

  Then, the ultrasonic vibration rotating mechanism 21, the three-axis drive mechanism 26, and the vibrator 16 shown in FIG. 2 operate, and the diamond blade 8 rotates in one direction and resonates with the ultrasonic vibration while moving linearly in the front, rear, left, and right directions. By drawing a square trajectory, the diamond blade 8 cuts the semiconductor wafer 23 in one direction once in the square trajectory. The semiconductor wafer 23 is cut into a plurality of strips by repeating the movement of drawing a square locus by the triaxial drive mechanism 26. When this strip-shaped cutting is completed, the mounting table 22 rotates 90 degrees horizontally and stops, and the orientation of the semiconductor wafer 23 relative to the ultrasonic vibration rotating mechanism 21 is changed 90 degrees in the horizontal plane. In this state, the operations of the ultrasonic vibration rotating mechanism 21, the triaxial drive mechanism 26, and the vibrator 16 of FIG. 2 are resumed, and the diamond blade 8 cuts the strip-shaped semiconductor wafer 23 into a plurality of dice shapes. The cutting operation for one semiconductor wafer 23 is completed.

  FIG. 4 shows an external appearance of a press-cut cutting type ultrasonic vibration cutting tool 31 according to a different first embodiment. In FIG. 4, the ultrasonic vibration cutting tool 31 has the diamond blade 32 attached to the resonator 34 by fixing the diamond blade 32 to the resonator-side attachment portion 35 of the square-bar resonator 34 with the solder 12. Structure. Therefore, when the diamond blade 32 is attached to the resonator 34, damage such as cracking or deformation is not caused, and the diamond blade 32 having a uniform thickness formed separately from the resonator 34 is used. Since the solder 12 does not absorb the ultrasonic vibration, there is an advantage that the ultrasonic vibration is suitably transmitted from the resonator 34 to the diamond blade 32. The diamond blade 32 is similar to the diamond blade 8 of FIG. 1, and has a structure in which a large number of diamond particles 10 are bonded to each other by a metal layer 11 made of nickel by a diamond electrolytic plating method as shown in FIG. The tip portion 36 of the diamond blade 32 has a triangular shape in which the amount of protrusion from the resonator-side mounting portion 35 gradually increases from one side to the other side. The resonator 34 resonates with the ultrasonic vibration input from the vibrator 16 of FIG. 6 and vibrates in the vertical direction, which is the transmission direction Z of the resonant ultrasonic vibration. Has a length of Z. The upper and lower ends of the resonator 34 are maximum vibration amplitude points. The resonator-side mounting portion 35 has a plate shape elongated in the lateral direction protruding downward from the lower end surface of the resonator 34. The screw hole 37 is formed to fasten a headless bolt at the center of the upper end of the resonator 34.

  FIG. 5 shows the appearance of a press-cut cutting type ultrasonic vibration cutting tool 41 according to a different second embodiment. In FIG. 5, the ultrasonic vibration cutting tool 41 has the diamond blade 42 attached to the resonator 44 by fixing the diamond blade 42 to the resonator-side attachment portion 45 of the round-bar resonator 44 with the solder 12. Structure. Therefore, when the diamond blade 42 is attached to the resonator 44, the diamond blade 42 is not damaged such as cracking or deformation, and the diamond blade 42 should have a uniform thickness formed separately from the resonator 44. Since the solder 12 does not absorb the ultrasonic vibration, there is an advantage that the ultrasonic vibration is suitably transmitted from the resonator 44 to the diamond blade 42. The diamond blade 42 is similar to the diamond blade 8 of FIG. 1, and has a structure in which a large number of diamond particles 10 are bonded with a metal layer 11 made of nickel by a diamond electrolytic plating method as shown in FIG. The tip 46 of the diamond blade 42 is an isosceles triangle in which the amount of protrusion from the resonator-side mounting portion 45 gradually decreases from the center toward both sides, so that the straight line of the mounting table 58 shown in FIG. Can be cut twice by one reciprocating movement. The resonator 44 resonates with the ultrasonic vibration input from the vibrator 16 of FIG. 6 and vibrates in the vertical direction, which is the transmission direction Z of the resonant ultrasonic vibration, and transmits at a half wavelength of the resonant frequency to resonate. Has a length of Z. The upper and lower ends of the resonator 44 are maximum vibration amplitude points. The resonator-side mounting portion 45 has a plate shape elongated in the lateral direction protruding downward from the lower end surface of the resonator 44. The screw hole 47 is formed for fastening a headless bolt to the center of the upper end of the resonator 44.

  FIG. 6 shows a push-cut ultrasonic vibration cutting device 51 according to a different third embodiment. As an example of the ultrasonic vibration cutting device 51, the ultrasonic vibration cutting tool 31 shown in FIG. 5 is used. One resonator configured by coaxially coupling the resonator 34 and the booster 53 with a headless screw (not shown) is attached to the holder 52 of the ultrasonic vibration cutting device 51. Specifically, when the support portion 54 of the booster 53 is inserted into the through hole 55 of the holder 52 from above or below, the bolt 56 is fastened, whereby the split groove 57 formed on the peripheral wall of the holder 52 is formed. By being narrowed, the diameter of the through hole 55 is reduced, and the holder 52 holds the support portion 54 to support the booster 53. The booster 53 has a rod shape that resonates at a predetermined resonance frequency with the ultrasonic vibration output from the vibrator 16 by a metal having good acoustic characteristics, and the vertical length of the booster 53 is, for example, 1 / resonance of the resonance frequency. The upper and lower ends of the booster 53 are the maximum vibration amplitude points, and the support portion 54 protrudes from the outer surface of the booster 53 at the center minimum vibration amplitude point of the booster 53. An output end which is the maximum vibration amplitude point of the vibrator 16 is coaxially coupled to the upper end of the booster 53 by a headless screw (not shown).

  Further, the semiconductor wafer 23 is mounted on the mounting table 58 of the ultrasonic vibration cutting device 51 and fixedly supported so as not to be laterally displaced. Then, by rotating and driving the motor 59 fixed to the support portion 65 of the ultrasonic vibration cutting device 51 in one direction, the screw rod 60 connected to rotate together with the output end of the motor 59 rotates. A support mechanism 63 having a nut 61 and an upper wall 62 fitted in the screw rod 60 is lowered while being guided by sliding contact between a guide mast 64 of the support mechanism 63 and a guide rail 66 fixed to the support portion 65, The diamond blade 32 of the resonator 34 stops from the solid line position shown in FIG. 6 to the virtual line position. This stop position is a position where the diamond blade 32 contacts the semiconductor wafer 23 but does not contact the mounting table 58. Until the diamond blade 32 stops, electrical energy is supplied to the vibrator 16 from an ultrasonic oscillator (not shown) to cause the vibrator 16 to generate ultrasonic vibration. The booster 53, the resonator 34, and the diamond blade 32 resonate with this ultrasonic vibration. The diamond blade 32 vibrates in the direction indicated by the arrow Z.

  Thereafter, the mounting table 58 is moved horizontally and linearly from the position indicated by the solid line to the position indicated by the alternate long and short dash line as indicated by the arrow X2 in the XY drive mechanism, so that the lower portion of the diamond blade 32 is positioned above the mounting table 58. The semiconductor wafer 23 is cut by receiving ultrasonic vibration from the diamond blade 32. Since the lower part of the diamond blade 32 has a triangular shape, the lower part of the diamond blade 32 contacts the semiconductor wafer 23 from a part, and the semiconductor wafer 23 is cut so as to gradually increase the contact area. The cutting is appropriately performed as compared with the case where all the lower portions are in contact with the semiconductor wafer 23 together. The reason is considered to be that the lower part of the diamond blade 32 acts on the semiconductor wafer 23 as if the food is cut with a knife.

  In FIG. 6, you may use the ultrasonic vibration cutting tool 1 of FIG.

  In addition to the semiconductor wafer 23, parts to be cut include sticky and soft materials such as gold, silver, aluminum, solder, and copper, hard and brittle materials such as ceramics, glass, quartz, silicon, and ferrite, circuit boards, and synthetic resins. A layered structure made of metal and metal, or a layered structure made of inorganic material, metal, and synthetic resin may be used.

  The diamond blades 8; 32; 42 may be ones in which a large number of diamond particles are attached to the outer edge of a disk-shaped metal substrate such as an iron plate. In this case, the metal substrate may be fixed to the resonator-side mounting portions 5; 35; 45 with the solder 12.

a figure is a front view of an ultrasonic vibration cutting tool, and b figure is a sectional view (best form) of a resonator and a diamond blade. The side view which combined the ultrasonic vibration cutting tool, the booster, and the vibrator | oscillator (best form). The front view (best form) of a rotary ultrasonic vibration cutting device. The perspective view (different 1st form) of an ultrasonic vibration cutting tool. The perspective view of an ultrasonic vibration cutting tool (different 2nd form). The front view of a press-cut-type ultrasonic vibration cutting device (different 3rd form).

Explanation of symbols

1; 31; 41 Ultrasonic vibration cutting tool 2; 34; 44 Resonator 5; 35; 45 Resonator-side mounting portion 8; 32; 42 Diamond blade 10 Diamond particle 11 Metal layer 12 Solder

Claims (1)

  A resonator provided with a metal resonator that resonates with ultrasonic vibration and a diamond blade for cutting a workpiece by ultrasonic vibration transmitted from the resonator, and the diamond blade is attached to the resonator diamond blade. An ultrasonic vibration cutting device characterized by being fixed to a mounting portion with solder.

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