JP2008042087A - Working method for laminate substrate and manufacturing method for coil component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a working method for laminate substrate by which a laminate substrate is cut accurately and to provide a manufacturing method for coil component. <P>SOLUTION: The manufacturing method for a coil component 1 includes: a process wherein a first magnetic substrate 20 and a second magnetic substrate 30 that have same size substantially are prepared, and a first protruding part 22 for alignment is formed at an outer edge part of the first magnetic substrate 20 and a positioning second protruding part 23 for coil is formed inside the outer edge part, respectively; a process wherein a coil assembly 24 is arranged on the first magnetic substrate 20, and the first magnetic substrate 20 and the second magnetic substrate 30 are so overlaid as to cover the first protruding part 22 to bond with a resin member 11; a process wherein the part covering the first protruding part 22 in the second magnetic substrate 30 is removed to expose the first protruding part 22; and a process wherein the bonded magnetic substrate is cut with the exposed first protruding part 22 as reference. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for processing a bonded substrate and a method for manufacturing a coil component.

Conventionally, as a manufacturing method of a coil component, for example, there is a method described in Patent Document 1 below. In this method, a first magnetic member (substrate) and a second magnetic member (substrate) are produced, and a plurality of holes are formed at predetermined positions on a large sheet provided with a plurality of sheet-like coils. The step of disposing the uncured second magnetic member, the step of disposing the first magnetic member on the upper and lower surfaces of the sheet coil, the step of curing the first magnetic member and the second magnetic member, and cutting the large sheet And a step of performing.
JP 2003-257744 A

  However, the above-mentioned Patent Document 1 does not disclose that alignment is necessary when cutting a large sheet. In order to produce alignment marks, a method of bonding substrates of different sizes with a resin is usually used. However, since the size of the substrate is different, the substrate warpage often occurs due to the curing shrinkage of the resin when the resin is cured. As a result, it is difficult to accurately cut the bonded substrate with the alignment mark as a reference.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method for processing a bonded substrate and a method for manufacturing a coil component that can cut the bonded substrate with high accuracy.

  A method for processing a bonded substrate according to the present invention provides a step portion forming step of preparing a first substrate and a second substrate having substantially the same size, and forming a step portion on an outer edge portion of a main surface of the first substrate. The first substrate and the second substrate are overlapped so as to cover the stepped portion, the bonding step of bonding these substrates with a resin, the portion covering the stepped portion in the first substrate or the second substrate is removed, and the step And a cutting step of cutting the bonded first substrate and second substrate with the exposed stepped portion as a reference.

  In the method for processing a bonded substrate according to the present invention, since the first substrate and the second substrate having substantially the same size are overlapped and these substrates are bonded with a resin, the substrate warps due to the curing shrinkage of the resin when the resin is cured. Can be prevented. Further, in the stepped portion exposing step, a portion covering the stepped portion in the first substrate or the second substrate can be removed to expose the stepped portion formed in advance. Then, using the exposed stepped portion as an alignment mark, the first substrate and the second substrate bonded together with high accuracy can be cut using this as a reference.

  Preferably, in the step portion forming step, the step portion is also formed inside the outer edge portion of the first substrate. In this case, the step portion can be formed inside the outer edge portion and the outer edge portion, and these step portions can be regularly aligned on the main surface of the first substrate, and the bonded substrate can be easily cut. Can do.

  According to the coil component manufacturing method of the present invention, a first magnetic substrate and a second magnetic substrate having substantially the same size are prepared, and a plurality of alignment substrates are arranged on the outer edge portion of the main surface of the first magnetic substrate. Forming a first protrusion and a plurality of second protrusions for positioning the coil inside the outer edge, respectively, and a second protrusion formed on the main surface of the first magnetic substrate A bonding step in which a coil assembly is disposed in a portion, the first magnetic substrate and the second magnetic substrate are overlapped so as to cover the first protrusion and the coil assembly, and these magnetic substrates are bonded with resin. Removing the portion of the first magnetic substrate or the second magnetic substrate that covers the first protrusion, exposing the first protrusion, and using the exposed first protrusion as a reference, Cutting step of cutting the bonded first magnetic substrate and second magnetic substrate , Characterized in that it comprises a.

  In the method for manufacturing a coil component according to the present invention, the first magnetic substrate and the second magnetic substrate having substantially the same size are overlapped and these magnetic substrates are bonded with resin. Generation | occurrence | production of a magnetic substrate curvature can be prevented by hardening shrinkage | contraction. In addition, unlike the metal pattern, the first protrusion does not stretch or disappear even if it is shaved, so that the alignment mark can be formed reliably. Then, the portion of the first magnetic substrate or the second magnetic substrate that covers the first protrusion is removed, the first protrusion is exposed, and the first protrusion is exposed, and bonding is performed with high accuracy. In addition, the first magnetic substrate and the second magnetic substrate can be cut, and a highly accurate coil component can be manufactured.

  ADVANTAGE OF THE INVENTION According to this invention, the processing method of a bonded substrate and the manufacturing method of coil components which cut | disconnect a bonded substrate accurately can be provided.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a method for manufacturing a coil component according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a perspective view showing a coil component. In FIG. 1, a coil component 1 includes a rectangular parallelepiped core structure 4 having an upper ferrite core 2 and a lower ferrite core 3, and external electrodes 5A having a U-shaped cross section provided at both ends of the core structure 4. , 5B.

  As shown in FIG. 2, the upper ferrite core (second magnetic substrate) 2 includes a rectangular flat plate portion 6 and a pair of flat plate portions 6 provided so as to extend along both side edge portions of the flat plate portion 6. It has a rectangular parallelepiped leg 7. The lower ferrite core 3 has a rectangular flat plate portion (first magnetic substrate) 8 and a rectangular parallelepiped protrusion portion (second protrusion portion) 9 provided at the center of the flat plate portion 8. . In such a core structure 4 including the upper ferrite core 2 and the lower ferrite core 3, each leg portion 7 of the upper ferrite core 2 is abutted against the flat plate portion 8 of the lower ferrite core 3, so that the magnetic flux with less leakage magnetic flux is obtained. A circuit will be formed. The upper ferrite core 2 and the lower ferrite core 3 are bonded to each other via a resin member 11 provided therebetween.

  FIG. 3 is a perspective view showing a state in which the external electrode is removed from the coil component. As shown in FIG. 3, a coil 10 is disposed inside the core structure 4. The coil 10 is formed in a connected winding shape so as to surround the protruding portion 9, is placed in a gap formed by the upper ferrite core 2 and the lower ferrite core 3, and is sealed with a resin member 11. The coil 10 has a rectangular cross section, and both ends thereof reach the end surfaces 11a and 11b of the resin member 11 facing each other, and are electrically connected to the external electrodes 5A and 5B, respectively. The metal material for forming the coil 10 is preferably Cu in terms of conductivity and cost, but may be Ag, Ni, or the like.

  Next, the manufacturing method of the coil component 1 is demonstrated. FIG. 4 is a flowchart illustrating a method for manufacturing a coil component. 5-7 is process drawing explaining the manufacturing method of a coil component. In these drawings, a case where a plurality of coil parts 1 are manufactured simultaneously is shown.

  First, in the protruding portion forming step (step S1), protruding portions are formed on the main surface 21 of the first magnetic substrate 20 (FIG. 5A). The first magnetic substrate 20 is a base material of the flat plate portion 8 of the lower ferrite core 3, and both surfaces thereof are flattened. For example, the first magnetic substrate 20 is formed by cutting a ferrite wafer. As the bonded substrate, an epoxy resin substrate may be used instead of the first magnetic substrate 20 and the second magnetic substrate 30 described later.

  FIG. 8 is a perspective view showing an arrangement state of protrusions formed on the first magnetic substrate. As shown in FIG. 8, a plurality of protrusions are regularly arranged on the main surface 21 of the first magnetic substrate 20. A first protrusion 22 serving as an alignment mark is provided on the outer edge 21a of the main surface 21 (a portion other than the range surrounded by the two-dot chain line in FIG. 8), and the inner side of the outer edge 21a (two in FIG. 8). A second protrusion 23 for positioning the coil assembly is provided in a range surrounded by a dotted line. The first protrusion 22 and the second protrusion 23 are similarly formed in a rectangular parallelepiped shape, and are formed so that the heights protruding from the main surface 21 are the same. As described above, the first protrusion 22 and the second protrusion 23 are regularly aligned on the main surface 21, whereby the substrate can be easily cut.

  FIG. 9 is a perspective view showing the second magnetic substrate. The second magnetic substrate 30 is a base material of the upper ferrite core 2 and has substantially the same size as the first magnetic substrate 20. Like the first magnetic substrate 20, the ferrite wafer is cut. Is formed. A plurality of partition plates 32 are arranged at equal intervals on the main surface 31 of the second magnetic substrate 30. And the frame part 33 parallel to the partition plate 32 is provided in the both ends of the main surface 31, respectively. In addition, the frame part 33 and the partition plate 32 are formed so that the height which protrudes from the main surface 31 may become the same.

  Here, the substantially same size means that the first magnetic substrate 20 and the second magnetic substrate 30 are overlapped and bonded to each other on the first surface 21 of the first magnetic substrate 20. The protrusion 22 and the second protrusion 23 are covered with the second magnetic substrate 30, and the first magnetic substrate 20 and the second magnetic substrate 30 can be bonded to each other.

  In the resin application process (step S2) subsequent to the protrusion formation process (step S1), the resin member 11 is applied to the main surface 21 of the first magnetic substrate 20 (FIG. 5B). That is, the first protrusion 22 and the second protrusion 23 provided on the main surface 21 are covered with the resin member 11. As the resin member 11, for example, a thermosetting epoxy resin or the like is used.

  Next, the resin member 11 applied to the main surface 21 is allowed to stand, and the air mixed in the resin member 11 is defoamed (FIG. 5C).

  In the coil incorporation step (step S3) subsequent to the resin coating step (step S2), the coil assembly 24 is incorporated on the main surface 21 of the first magnetic substrate 20. In the coil assembly 24, a plurality of connected winding coils 10 are formed in a row, and the interval between adjacent coils 10 is the same as the interval between the second protrusions 23 formed on the first magnetic substrate 20. It is set to match.

  The coil assemblies 24 correspond to the individual second protrusions 23 along the arrangement direction of the second protrusions 23 arranged on the main surface 21, and are fitted into the second protrusions 23, respectively. At this time, it is preferable not to incorporate the coil assembly 24 into the first protrusion 22 disposed on the outer edge of the first magnetic substrate 20 (FIG. 6A). If it does in this way, it can identify reliably that it is the 1st projection part 22 for alignment in the 1st projection part exposure process mentioned below.

  At this time, since the resin member 11 overflows due to the incorporation of the coil assembly 24, the overflowing resin member 11 is squeezed after the assembly operation of the coil assembly 24 is completed (FIG. 6B).

  In the bonding step (step S4) subsequent to the coil incorporation step (step S3), the first magnetic substrate 20 and the second magnetic substrate 30 are overlaid and bonded by the resin member 11. Specifically, the second magnetic substrate 30 and the first magnetic substrate 20 are overlapped so as to cover the first protrusion 22 and the second protrusion 23 of the first magnetic substrate 20. Next, the resin member 11 is cured by a method such as heating or natural standing after being left to stand for several hours while applying pressure to the first magnetic substrate 20 and the second magnetic substrate 30 that are overlaid. Therefore, the first magnetic substrate 20 and the second magnetic substrate 30 are bonded and integrated by curing the resin member 11. The coil assembly 24 is sealed by the resin member 11 and fixed to the second protrusion 23 (FIG. 6C).

  In the first protrusion exposing step (step S5) subsequent to the bonding step (step S4), the first protrusion 22 is exposed by removing the portion of the second magnetic substrate 30 that covers the first protrusion 22. (FIG. 7A). Specifically, among the four sides of the second magnetic substrate 30, the substrate is removed little by little from any two parallel sides toward the center of the substrate to expose the first protrusion 22. As a method of removing the portion covering the first protrusion 22 in the second magnetic substrate 30, in addition to a method of mechanically cutting and removing using a grindstone or the like, when the second magnetic substrate 30 uses an epoxy resin, A method of dissolving and removing with a solvent or the like that does not affect the resin member 11 is also possible.

  In order to expose the first protrusion 22, it is not always necessary to remove the portion of the second magnetic substrate 30 that covers the first protrusion 22. In the first magnetic substrate 20 on which the first protrusion 22 is formed, The covering portion may be removed. In the bonding step, when the first protrusion 22 is completely sealed by the resin member 11, whichever of the first magnetic substrate 20 and the second magnetic substrate 30 is removed. However, when the first protrusion 22 is not completely sealed by the resin member 11, it is more work to remove the second magnetic substrate 30 than to remove the first magnetic substrate 20. Easy to do.

  In the cutting step (step S6) subsequent to the first protrusion exposing step (step S5), the first magnetic substrate 20 and the second magnetic substrate 30 are cut along the cut line L (FIG. 7B). . As a method for determining the cut line L, for example, as shown in FIG. 10, the exposed first protrusion 22 is used as an alignment mark, and the vertical direction is determined based on the arrangement interval of the second protrusion 23 and the arrangement interval of the coil assembly 24. And the cut line L of the horizontal direction is determined. Next, the first magnetic substrate 20 and the second magnetic substrate 30 are cut vertically and horizontally along the determined cut line L, respectively. Thereby, the core structure 4 as shown in FIG. 3 is obtained.

  In the external electrode formation step (step S7) subsequent to the cutting step (step S6), the external electrodes 5A and 5B are formed on the cut core structure 4. After the core structure 4 is polished and cleaned, a conductive paste is applied to each of the end surfaces of the core structure 4 so as to cover the opposing end surfaces that do not have the leg portions 7. Then, the core structure 4 to which the conductive paste is applied is subjected to heat treatment at about 200 ° C. in a neutral atmosphere or a reducing atmosphere to form the external electrodes 5A and 5B. The surface of the external electrodes 5A and 5B may be subjected to barrel plating as necessary. Thereby, the coil component 1 is completed.

  According to the present embodiment, the first magnetic substrate 20 and the second magnetic substrate 30 having substantially the same size are superposed and these magnetic substrates are bonded by the resin member 11, so that the resin member 11 is cured. Occurrence of warpage of the first magnetic substrate 20 and the second magnetic substrate 30 can sometimes be prevented by the curing shrinkage of the resin. Further, unlike the metal pattern, the first protrusion 22 does not stretch or disappear even if it is cut, so that the alignment mark can be formed reliably. And the part which covers the 1st projection part 22 in the 2nd magnetic substrate 30 was removed, the 1st projection part 22 was exposed, this exposed 1st projection part 22 was used as the alignment mark, and it bonded together with high precision. The first magnetic substrate 20 and the second magnetic substrate 30 can be cut, and the coil component 1 having high accuracy can be manufactured.

  The present invention is not limited to the above embodiment. For example, in the above-described embodiment, the first protrusion 22 and the second protrusion 23 have the same size and are formed in the same shape, but may be formed in different sizes or different shapes. In this case, the first protrusion for alignment and the second protrusion 23 for positioning the coil can be easily identified. In the above-described embodiment, the connected winding coil is used as the coil assembly 24. However, the present invention is not limited to this, and a spiral coil may be used.

It is a perspective view which shows a coil component. It is a disassembled perspective view of the core structure shown in FIG. It is a perspective view which shows the state which removed the external electrode from the coil components. It is a flowchart explaining the manufacturing method of coil components. It is process drawing explaining the manufacturing method of coil components. It is process drawing explaining the manufacturing method of coil components. It is process drawing explaining the manufacturing method of coil components. It is a perspective view which shows the arrangement | sequence state of the projection part formed in the 1st magnetic body board | substrate. It is a perspective view which shows a 2nd magnetic body board | substrate. It is explanatory drawing which shows a cut line.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Coil component, 2 ... Upper ferrite core (2nd magnetic substrate), 8 ... Flat plate part (1st magnetic substrate), 9 ... Projection part (2nd projection part), 11 ... Resin member, 20 ... 1st Magnetic substrate 21... Main surface 22. First protrusion (step) 23. Second protrusion (step) 24. Coil assembly 30. Second magnetic substrate.

Claims (3)

Preparing a first substrate and a second substrate having substantially the same size, and forming a stepped portion on an outer edge portion of the main surface of the first substrate;
Bonding the first substrate and the second substrate so as to cover the stepped portion, and bonding these substrates with a resin;
A stepped portion exposing step of removing the portion covering the stepped portion of the first substrate or the second substrate and exposing the stepped portion;
A cutting step of cutting the bonded first substrate and the second substrate on the basis of the exposed stepped portion,
A method for processing a bonded substrate, comprising:   2. The method for processing a bonded substrate according to claim 1, wherein in the step portion forming step, a step portion is also formed inside the outer edge portion of the first substrate. A first magnetic substrate and a second magnetic substrate having substantially the same size are prepared, a plurality of first protrusions for alignment on the outer edge of the main surface of the first magnetic substrate, and the outer edge A protrusion forming step of forming a plurality of second protrusions for positioning the coil inside each of the protrusions,
A coil assembly is disposed on the second protrusion formed on the main surface of the first magnetic substrate, and the first magnetic substrate and the second so as to cover the first protrusion and the coil assembly. Adhering step of superimposing magnetic substrates and bonding these magnetic substrates with resin;
Removing a portion of the first magnetic substrate or the second magnetic substrate that covers the first protrusion and exposing the first protrusion; and
A cutting step of cutting the bonded first magnetic substrate and the second magnetic substrate on the basis of the exposed first protrusion,
A method for manufacturing a coil component, comprising:

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