JP2008021779A - Stacked semiconductor package, and optical signal transmitter - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a stacked semiconductor package or the like each consisting of a substrate with a semiconductor element mounted thereon, stacked and electrically connected to each other, and capable of coping with high-speed transmission while keeping a high degree of freedom in system design and an easiness in testing abnormality. <P>SOLUTION: Out of stacked three semiconductor packages 11, 12, and 13, the second semiconductor package 12 in the intermediate layer in the laminate is mounted with a photoelectric conversion element 22 which receives and transmits optical signals by a receiving and transmitting plane 22a faced upwards in the laminate, and converts optical signals to electrical signals as a semiconductor element. The third semiconductor package 3 has an optical signal transmitter with a through-hole 13a wherein the optical signals passes through in the vertical direction in the laminate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a stacked semiconductor package in which semiconductor packages each having a semiconductor element mounted on a substrate are stacked and electrically connected, and an optical signal transmission apparatus provided with such a stacked semiconductor package.

  In recent years, with the miniaturization and high functionality of electronic devices, reduction of the number of parts and miniaturization of parts are required.

  As a technology that meets these requirements, a stack is formed by stacking semiconductor packages in which logic ICs or memories that implement various functions are mounted on a substrate, and electrically connecting a plurality of stacked semiconductor packages. A type semiconductor package technology (so-called package-on-package) is known.

  In general, the stacked semiconductor package is formed by stacking independent semiconductor packages having different functions from each other. Therefore, the stacked semiconductor package has advantages such as high flexibility in combination and high versatility when stacking semiconductor packages. Have. In addition, since each semiconductor package can be tested in the operation test of each semiconductor element, there are advantages that it is easy to verify an abnormality and contribute to a reduction in yield loss.

  By the way, in recent years, semiconductor device manufacturing techniques have improved, and semiconductor devices with higher integration have been manufactured. By mounting a highly integrated semiconductor element on an electronic device, it is possible to increase information processing capacity, increase storage capacity, and reduce the size and weight of the device. However, if electrical wiring is used for connection between semiconductor elements, the performance of the entire system due to problems inherent in electrical transmission such as increased transmission loss due to higher speeds and occurrence of crosstalk between lines due to increased input / output pins. There is a problem that is restricted.

  Optical wiring technology is being developed as a method for solving such problems inherent in electrical transmission. In this optical wiring technology, generally, an optical fiber or optical fiber that carries light (signal light) is transmitted between a light emitting element that converts an electrical signal into an optical signal and a light receiving element that converts an optical signal into an electrical signal. They are connected by a signal light propagation medium such as a waveguide.

  This optical wiring technology has advantages that there is no signal delay due to impedance, no EMI (Electro-Magnetic Interference) noise from the wiring, and no inter-wiring interference occurs. Problems inherent to electrical transmission such as increased transmission loss and occurrence of crosstalk can be solved.

  As such an optical wiring technology, for example, a photoelectric conversion element is mounted on a side surface of a structure in which an electronic integrated element bare chip such as an optical element driving IC is mounted on a substrate or a peripheral portion of the electronic integrated element bare chip. And an electronic integrated device have been proposed (see, for example, Patent Document 1).

An optical module including an optical element and a semiconductor chip for driving the optical element, in which the semiconductor chip is electrically connected to the optical element and a light input / output optical fiber is mounted in a package. Has also been proposed (see, for example, Patent Document 2).
JP 2001-36197 A JP 2001-59923 A

  However, the techniques proposed in Patent Document 1 and Patent Document 2 described above are obtained by integrating only an optical element and an optical element driving IC in the same package.

  In general, input / output to / from a signal processing LSI (Large Scale Integration) on a board uses electrical wiring. The signal speed that can be transmitted as an electrical signal in the board is normally about 600 Mb / s, and even about a very short distance is about 2.5 Gb / s. An signal called SerDes (Serializer / Deserializer) is used for signals exceeding this speed It is broken down into parallel signals and transmitted at a reduced speed. Therefore, not only the photoelectric conversion element and the driving IC are integrated as in Patent Document 1 and Patent Document 2 described above, but also the SerDes IC is integrated to shorten the transmission distance of the high-speed electrical signal as much as possible. Is desirable.

  Furthermore, even if the SerDes LSI is mounted on the semiconductor element portion in the above-described Patent Document 1 and Patent Document 2, if an abnormality is detected in the operation test of the semiconductor element, the photoelectric conversion element, the driving IC, and the SerDes Since the IC is integrated, there is a problem that it is difficult to identify an abnormal part.

  In view of the above circumstances, the present invention provides a stacked semiconductor package that supports high-speed transmission while maintaining a high degree of freedom in system design and ease of abnormality verification, and an optical signal transmission provided with such a stacked semiconductor package. The object is to provide an apparatus.

The stacked semiconductor package of the present invention that achieves the above object is
In a stacked semiconductor package formed by stacking semiconductor packages in which semiconductor elements are mounted on a substrate and electrically connecting a plurality of stacked semiconductor packages,
At least one semiconductor package excluding the uppermost semiconductor package in the stack of the plurality of semiconductor packages receives and / or transmits an optical signal as the semiconductor element on the receiving / transmitting surface facing upward in the stack. An optical signal transmission package on which a photoelectric conversion element responsible for conversion between a signal and its optical signal is mounted,
Each semiconductor package located in an upper layer in the stack than the optical signal transmission package has an optical signal passage portion through which the optical signal passes in the vertical direction in the stack.

  Here, the “optical signal passage portion” referred to in the present invention has a through hole through which the optical signal passes, a light transmissive member through which the optical signal propagates, and the propagation of the optical signal. One having a through hole into which the signal light propagation medium is inserted may be considered.

  According to the stacked semiconductor package of the present invention, by using the photoelectric conversion element mounted on the optical signal transmission package for high-speed signal input / output, the high-frequency transmission loss, crosstalk, etc. High-speed transmission that avoids this problem is possible. Therefore, it is possible to obtain a stacked semiconductor package that supports high-speed transmission while maintaining a high degree of freedom in system design and ease of abnormality verification, which are advantages of the stacked semiconductor package. In the stacked semiconductor package of the present invention, a signal obtained by multiplexing a plurality of electrical signals is transmitted as an optical signal by a signal light propagation medium that is optically connected to the transmitting / receiving surface and carries the propagation of the optical signal. As a result, the number of input / output pins can be reduced as compared with a stacked semiconductor package using electrical transmission, and a high-density circuit device can be realized.

  In the stacked semiconductor package of the present invention, the optical signal transmission package on which the photoelectric conversion element is mounted is at least one semiconductor package excluding the uppermost semiconductor package in the stacked layer, and faces upward in the stacked layer. A photoelectric conversion element that receives and / or transmits an optical signal on the transmitting / receiving surface is mounted.

  Therefore, in the stacked semiconductor package of the present invention, when the optical signal transmission package is an intermediate layer semiconductor package in the stack, high-speed signal transmission is possible with each of the upper and lower semiconductor packages of the optical signal transmission package. is there.

  Here, in general, the upper limit of the operating temperature of the photoelectric conversion element is usually about 80 ° C. while the upper limit of the operating temperature of an LSI (Large Scale Integration) such as a CPU or a memory is usually about 100 ° C. Low. Although the photoelectric conversion element itself mounted on the optical signal transmission package does not generate heat strongly, if the semiconductor element mounted on another semiconductor package generates heat strongly, and the photoelectric conversion element is strongly heated, the light emission amount changes and the signal is changed. There is a risk of adversely affecting delivery.

  In contrast, in the stacked semiconductor package of the present invention, when the optical signal transmission package is the lowermost semiconductor package in the stacked layer, when the stacked semiconductor package is mounted on a substrate, Since heat radiation from the optical signal transmission package is promoted through the substrate, it is avoided that the photoelectric conversion element is strongly heated.

  In the stacked semiconductor package of the present invention, each semiconductor package positioned above the optical signal transmission package has the optical signal passage portion. Such an optical signal passing portion has a simple structure and is easy to be molded, and alignment in optical connection is also easy.

  Further, in the stacked semiconductor package of the present invention, each semiconductor package located in an upper layer in the stacked layer has a through hole through which the optical signal passes as the optical signal passing portion. It is preferable that it has an optical signal passage part.

  Since the diameter of the through hole may be a small diameter of about 100 μm, it does not hinder the arrangement of the electrical connection portion.

  Furthermore, in the stacked semiconductor package according to the present invention, the uppermost semiconductor package is optically directly or indirectly connected to the transmitting / receiving surface, and a signal light propagation medium for propagating the optical signal is detachable. It is also a preferable form to have a mounting portion that is mounted on.

  Here, the “signal light propagation medium” in the present invention refers to, for example, an optical waveguide film or an optical fiber.

  According to the stacked semiconductor package having such a mounting portion, for example, since the signal light propagation medium having a desired length can be selected and assembled, the degree of freedom of combination is high and versatility is high. .

  According to another aspect of the present invention, there is provided an optical signal transmission device comprising: a stacked semiconductor package according to claim 1 mounted on a substrate; and a photoelectric conversion element mounted on the optical signal transmission package in the stacked semiconductor package; The optical signal transmission medium that carries the propagation of the optical signal is optically connected.

  According to the optical signal transmission device of the present invention, similarly to the advantages of the stacked semiconductor package of the present invention described above, the photoelectric conversion element mounted on the optical signal transmission package for input / output of high-speed signals, and the optical signal By using the signal light propagation medium optically connected to the transmission package, high-speed transmission that avoids problems inherent in electrical transmission such as increase in high-frequency transmission loss and occurrence of crosstalk becomes possible.

  According to the present invention, there is provided a stacked semiconductor package that supports high-speed transmission while maintaining a high degree of freedom in system design and ease of abnormality verification, and an optical signal transmission device including such a stacked semiconductor package. Is done.

  Embodiments of the present invention will be described below with reference to the drawings.

  In this embodiment, as the semiconductor element referred to in the present invention, a photoelectric conversion element responsible for conversion between an electric signal and an optical signal, a driving IC that controls this photoelectric conversion element, and a signal processing responsible for signal processing A description will be given by taking three semiconductor elements of a general IC as an example.

  In the present embodiment, an optical fiber will be described as an example of the signal light propagation medium referred to in the present invention.

  FIG. 1 is a schematic configuration diagram showing a first embodiment of a stacked semiconductor package of the present invention.

  A stacked semiconductor package 10 shown in FIG. 1 includes a first semiconductor package 11 in which a signal processing IC 21 is mounted on a first intermediate substrate 31 and sealed with a mold resin 50, and a photoelectric conversion element on a second intermediate substrate 32. 22 is mounted and sealed with a mold resin 50, and the third semiconductor package 13 is mounted with a driving IC 23 mounted on the third intermediate substrate 33 and sealed with the mold resin 50. Yes. The stacked semiconductor package 10 has a structure in which a second semiconductor package 12 is stacked on top of a first semiconductor package 11, and a third semiconductor package 13 is stacked on top of the second semiconductor package 12. Here, The stacked semiconductor package 10 is mounted on the substrate 30. Further, the second semiconductor package 12 is fixed to the first semiconductor package 11 via the adhesive 40, and the third semiconductor package 13 is fixed to the second semiconductor package 12 via the adhesive 40. The photoelectric conversion element 22 mounted on the second semiconductor package 12 in the intermediate layer in the stack of these three semiconductor packages 11, 12, and 13 receives and transmits optical signals on the transmitting / receiving surface 22 a facing upward in the stack. It performs transmission and is responsible for conversion between the electrical signal and its optical signal. The second semiconductor package 12 corresponds to an example of the optical signal transmission package referred to in the present invention.

  The first intermediate substrate 31 is provided with a plurality of bonding pads 311 appropriately interconnected by electrical wiring embedded in the first intermediate substrate 31, and signal processing mounted on the first semiconductor package 11. The IC 21 is electrically connected to the bonding pad 311 via the bonding wire 41.

  The second intermediate substrate 32 is also provided with a plurality of bonding pads 321 appropriately interconnected by electric wiring embedded in the second intermediate substrate 32, and the photoelectric conversion mounted on the second semiconductor package 12. The element 22 is electrically connected to the bonding pad 321 through the bonding wire 41.

  The third intermediate substrate 33 is also provided with a plurality of bonding pads 331 that are appropriately interconnected by electric wiring embedded in the third intermediate substrate 33, and is mounted on the third semiconductor package 13. The IC 23 is electrically connected to the bonding pad 331 via the bonding wire 41.

  Here, the mold resin 50 of the second semiconductor package 12, the adhesive 40 that fixes the second semiconductor package 12 and the third semiconductor package 13, the third intermediate substrate 33 of the third semiconductor package 13, and the mold resin 50 has an optical signal passage portion in which a through hole 13a through which the optical signal passes in the vertical direction in the stack is vacant. In addition, since the diameter of this through-hole 13a should just be a small diameter of about 100 micrometers, arrangement | positioning of the electrical connection parts, such as the bonding pads 311,321,331, the bonding wire 41, is not disturbed.

  Such an optical signal passage portion with a through hole 13a is simple in structure, and molding of the mold resin 50 is easy, and alignment in optical connection is also easy.

  Here, the optical fiber 60 is inserted into the through-hole 13a, is abutted against the light receiving / transmitting surface 22a of the photoelectric conversion element 22, and is fixed to the mold resin 50 of each of the second semiconductor package 12 and the third semiconductor package 13. Thus, the optical fiber 60 is optically connected to the light receiving / transmitting surface 22 a of the photoelectric conversion element 22.

  Further, the bonding pads 311 provided on the first intermediate substrate 31 and the bonding pads 321 provided on the second intermediate substrate 32 are connected via the solder 42, so that the first semiconductor package 11 The second semiconductor package 12 stacked on the upper part is electrically connected. Further, the bonding pad 321 provided on the second intermediate substrate 32 and the bonding pad 331 provided on the third intermediate substrate 33 are connected via the solder 42, whereby the second semiconductor package 12 and The third semiconductor package 13 stacked on the upper part is electrically connected.

  As described above, in the stacked semiconductor package 10 of the first embodiment, the second semiconductor package 12 on which the photoelectric conversion element 22 is mounted is directly connected to both the first semiconductor package 11 and the third semiconductor package 13. Therefore, high-speed signals can be transmitted to both the first semiconductor package 11 and the third semiconductor package 13.

  Further, the bonding pad 301 is also provided on the substrate 30, and the bonding pad 301 provided on the substrate 30 and the bonding pad 311 provided on the first intermediate substrate 31 are connected via the solder 42. Thus, the substrate 30 and the stacked semiconductor package 10 are electrically connected.

  In the stacked semiconductor package 10 according to the first embodiment, a signal obtained by multiplexing a plurality of electrical signals is transmitted as an optical signal through the optical fiber 60. Therefore, the bonding pad for the stacked semiconductor package 10 to exchange signals with the outside. The number of 311 and 301 is small, and a high-density circuit device can be realized.

  FIG. 2 is a perspective view showing an embodiment of the optical signal transmission device of the present invention in which two stacked semiconductor packages 10 shown in FIG. 1 are mounted on a substrate 30.

  As shown in FIG. 2, two stacked semiconductor packages 10 are mounted on a substrate 30, and these are optically connected by an optical fiber 60. According to the optical signal transmission device 100 shown in FIG. 2, high-frequency transmission is performed by using the photoelectric conversion element 22 and the optical fiber 60 incorporated in each of the two stacked semiconductor packages 10 for high-speed signal input / output. High-speed transmission that avoids problems inherent in electrical transmission such as increased loss and occurrence of crosstalk becomes possible. Therefore, the optical signal transmission device is capable of high-speed transmission while maintaining the high degree of freedom of system design and the ease of abnormality verification, which are advantages of the stacked semiconductor package.

  Next, a second embodiment of the present invention will be described.

  In the second embodiment described below, the same elements as those in the first embodiment described above are denoted by the same reference numerals.

  FIG. 3 is a schematic configuration diagram showing a second embodiment of the stacked semiconductor package of the present invention.

  In the stacked semiconductor package 20 shown in FIG. 3, the photoelectric conversion element 22 is mounted on the lower surface of the fourth intermediate substrate 34 and sealed with a mold resin 50, and the driving IC 23 is mounted on the upper surface of the fourth intermediate substrate 34. The fourth semiconductor package 14 is sealed with the resin 50, and the fifth semiconductor package 15 is mounted with the signal processing IC 21 mounted on the upper surface of the fifth intermediate substrate 35 and sealed with the mold resin 50. The stacked semiconductor package 20 is obtained by stacking a fifth semiconductor package 15 on top of a fourth semiconductor package 14, and here the stacked semiconductor package 20 is mounted on a substrate 30. The fourth semiconductor package 14 is fixed to the fifth semiconductor package 15 with an adhesive 40. Note that the photoelectric conversion element 22 mounted on the lower surface of the fourth intermediate substrate 34 in the lowermost fourth semiconductor package 14 in the stack of these two semiconductor packages 14 and 15 has a transmitting / receiving surface 22a facing upward in the stack. The optical signal is received and transmitted by and is responsible for conversion between the electrical signal and the optical signal. The fourth semiconductor package 14 corresponds to an example of the optical signal transmission package referred to in the present invention.

  The fourth intermediate substrate 34 is provided with a plurality of bonding pads 341 appropriately interconnected by electric wiring embedded in the fourth intermediate substrate 34, and the photoelectric conversion mounted on the fourth semiconductor package 14. The element 22 is electrically connected to the bonding pad 341 via the bonding wire 41. Further, the driving IC 23 mounted on the fourth semiconductor package 14 is also electrically connected to the bonding pad 341 through the bonding wire 41.

  The fifth intermediate substrate 35 is also provided with a plurality of bonding pads 351 that are appropriately interconnected by electric wiring embedded in the fifth intermediate substrate 35, and the signal processing mounted on the fifth semiconductor package 15. The IC 21 is electrically connected to the bonding pad 351 through the bonding wire 41.

  Here, the fourth intermediate substrate 34 of the fourth semiconductor package 14, the mold resin 50 sealing the driving IC 23 of the fourth semiconductor package 14, and the fourth semiconductor package 14 and the fifth semiconductor package 15 are fixed. The adhesive 40, the fifth intermediate substrate 35 and the mold resin 50 of the fifth semiconductor package 15 have an optical signal passage portion in which the through hole 15a through which the optical signal passes in the vertical direction in the stack is vacant. is doing. Since the diameter of the through hole 15a may be a small diameter of about 100 μm, it does not hinder the arrangement of electrical connection portions such as the bonding pads 341 and 351 and the bonding wire 41.

  Such an optical signal passage portion with a through hole 15a is simple in structure, and molding of the mold resin 50 is easy, and alignment in optical connection is also easy.

  Here, the optical fiber 70 is inserted into the through-hole 15a, is abutted against the light receiving / transmitting surface 22a of the photoelectric conversion element 22, and is fixed to the mold resin 50 of each of the fourth semiconductor package 14 and the fifth semiconductor package 15. Thus, the optical fiber 70 is optically connected to the light receiving / transmitting surface 22 a of the photoelectric conversion element 22.

  In addition, the bonding pads 341 provided on the fourth intermediate substrate 34 and the bonding pads 351 provided on the fifth intermediate substrate 35 are connected via the solder 42, so that the fourth semiconductor package 14 The fifth semiconductor package 15 stacked on the upper part is electrically connected.

  Furthermore, the bonding pad 301 is also provided on the substrate 30, and the bonding pad 301 provided on the substrate 30 and the bonding pad 341 provided on the fourth intermediate substrate 34 are connected via the solder 42. As a result, the substrate 30 and the stacked semiconductor package 20 are electrically connected.

  Here, the upper limit of the operating temperature of the photoelectric conversion element 22 mounted on the lower surface of the fourth intermediate substrate 34 in the fourth semiconductor package 14 is the driving IC 23 mounted on the upper surface of the fourth intermediate substrate 34 in the fourth semiconductor package 14. In addition, the upper limit of the operating temperature of the signal processing IC 21 mounted on the fifth semiconductor package 15 is normally about 100 ° C., but is usually as low as about 80 ° C. Although the photoelectric conversion element 22 itself does not generate heat strongly, the driving IC 23 and the signal processing IC 21 generate heat strongly. As a result, if the photoelectric conversion element 22 is strongly heated, the light emission amount may change and adversely affect signal exchange. In the second embodiment, since the fourth semiconductor package 14 on which the photoelectric conversion element 22 is mounted is located at the lowest layer in the stack, heat dissipation from the stacked semiconductor package 20 mounted on the substrate 30 is prevented. It is promoted through the substrate 30, and it is avoided that the photoelectric conversion element 22 is heated strongly.

  Next, a third embodiment of the present invention will be described.

  Note that the third embodiment described below has substantially the same configuration as the configuration described in the second embodiment described above, and thus pays attention to the differences from the second embodiment described above, and the same reference numerals are used for the same elements. A description thereof will be omitted.

  FIG. 4 is a schematic configuration diagram showing a third embodiment of the stacked semiconductor package of the present invention.

  In the stacked semiconductor package 30 shown in FIG. 4, the photoelectric conversion element 22 is mounted on the lower surface of the fourth intermediate substrate 34 and sealed with a mold resin 50, and the driving IC 23 is mounted on the upper surface of the fourth intermediate substrate 34. The fourth semiconductor package 14 is sealed with a resin 50, and the sixth semiconductor package 16 is mounted with a signal processing IC 21 mounted on the upper surface of a fifth intermediate substrate 35 and sealed with a mold resin 51. The fourth semiconductor package 14 corresponds to an example of the optical signal transmission package referred to in the present invention.

  Here, the fourth intermediate substrate 34 of the fourth semiconductor package 14, the mold resin 50 sealing the driving IC 23 of the fourth semiconductor package 14, and the fourth semiconductor package 14 and the sixth semiconductor package 16 are fixed. The adhesive 40, the fifth intermediate substrate 35 and the mold resin 51 of the sixth semiconductor package 16 have an optical signal passage portion in which the through hole 16a through which the optical signal passes in the vertical direction in the stack is vacant. is doing. Since the diameter of the through-hole 16a may be a small diameter of about 100 μm, the arrangement of the electrical connection portions such as the bonding pads 341 and 351 and the bonding wire 41 is not hindered.

  Such an optical signal passage portion with a through hole 16a is simple in structure, and molding of the mold resins 50 and 51 is easy, and alignment in optical connection is also easy.

  Further, the mold resin 51 of the sixth semiconductor package 16 has protrusions 51a provided at both ends of the through hole 16a. Here, the optical connector 81 provided in the optical fiber 80 with the concave portion 81a fitted into the projection 51a and the end portion 80a of the optical fiber 80 projecting is fitted into the projection 51a. It is connected accurately and detachably. In the optical fiber 80 thus connected, the end 80a is inserted into the through-hole 16a and is abutted against and aligned with the transmission / reception surface 22a of the photoelectric conversion element 22, and the optical fiber 80 is photoelectrically aligned. It is optically connected to the transmitting / receiving surface 22a of the conversion element 22. The protrusion 51a corresponds to an example of the mounting portion according to the present invention.

  According to the stacked semiconductor package 30 of the third embodiment having such a protrusion 51a, it is possible to select and assemble an optical fiber 80 having a desired length, so that the degree of freedom of combination is high and versatility is achieved. Is expensive.

  In each of the above-described embodiments, an example in which two or three semiconductor packages are stacked on a substrate has been described. However, the stacked semiconductor package of the present invention is not limited to this, and four or more semiconductors are used. The present invention can also be applied to a package laminated on a substrate.

  In each of the above-described embodiments, the example in which the semiconductor element according to the present invention is a photoelectric conversion element, a driving IC, and a signal processing IC has been described. However, the semiconductor element according to the present invention is limited to this. If the semiconductor element mounted on at least one semiconductor package other than the uppermost semiconductor package in the stack of a plurality of semiconductor packages is a photoelectric conversion element, what kind of semiconductor element is the other semiconductor element? There may be.

  Moreover, although each embodiment mentioned above demonstrated the example in which the through-hole by which an optical fiber is inserted is vacated as an optical signal passage part said to this invention, the optical signal passage part said to this invention is this. For example, it may be a through-hole through which an optical signal propagates or a light transmissive member through which an optical signal propagates.

  In each of the above-described embodiments, the example in which the signal light propagation medium according to the present invention is an optical fiber has been described. However, the signal light propagation medium according to the present invention is not limited to this, for example, an optical waveguide film. Etc.

  In the third embodiment described above, an example in which the mounting portion according to the present invention is a protrusion has been described. However, the mounting portion according to the present invention is not limited to this, and may be, for example, a concave portion.

1 is a schematic configuration diagram showing a first embodiment of a stacked semiconductor package of the present invention. FIG. 2 is a perspective view showing an embodiment of the optical signal transmission device of the present invention in which two stacked semiconductor packages shown in FIG. 1 are mounted on a substrate. It is a schematic block diagram which shows 2nd Embodiment of the laminated semiconductor package of this invention. It is a schematic block diagram which shows 3rd Embodiment of the laminated semiconductor package of this invention.

Explanation of symbols

10, 20, 30 Stacked semiconductor package 11 First semiconductor package 12 Second semiconductor package 13 Third semiconductor package 13a, 15a, 16a Through hole 14 Fourth semiconductor package 15 Fifth semiconductor package 16 Sixth semiconductor package 21 For signal processing IC
22 photoelectric conversion element 22a light receiving and transmitting surface 23 driving IC
22a Optical connecting surface 30 Substrate 31 First intermediate substrate 32 Second intermediate substrate 33 Third intermediate substrate 34 Fourth intermediate substrate 35 Fifth intermediate substrate 301, 311, 321, 331, 341, 351 Bonding pad 40 Adhesive 41 Bonding Wire 42 Solder 50, 51 Mold resin 51a Protrusion 60, 70, 80 Optical fiber 80a End portion 81 Optical connector 81a Recessed portion 100 Optical signal transmission device

Claims (4)

In a stacked semiconductor package formed by stacking semiconductor packages in which semiconductor elements are mounted on a substrate and electrically connecting a plurality of stacked semiconductor packages,
At least one semiconductor package other than the uppermost semiconductor package in the stack of the plurality of semiconductor packages receives and / or transmits an optical signal as the semiconductor element on the receiving / transmitting surface facing upward in the stack. An optical signal transmission package on which a photoelectric conversion element responsible for conversion between a signal and the optical signal is mounted,
Each of the semiconductor packages located in an upper layer in the stack than the optical signal transmission package has an optical signal passage portion through which the optical signal passes in the vertical direction in the stack. package.   Each semiconductor package located in an upper layer in the stack than the optical signal transmission package has an optical signal passage portion having a through hole through which the optical signal passes as the optical signal passage portion. The stacked semiconductor package according to claim 1.   The uppermost semiconductor package has a mounting portion that is optically directly or indirectly connected to the transmitting / receiving surface and on which a signal light propagation medium that carries the propagation of the optical signal is detachably mounted. The stacked semiconductor package according to claim 1.   The stacked semiconductor package according to claim 1 is mounted on a substrate, a photoelectric conversion element mounted on an optical signal transmission package in the stacked semiconductor package, and a signal light propagation medium for propagating the optical signal are optically provided. An optical signal transmission device connected to the optical signal transmission device.

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