JP2008004834A - Wiring forming apparatus, wiring forming method, electro-optical device, and electronic apparatus - Google Patents

Abstract

Provided are a wiring forming apparatus and a wiring forming method capable of forming wiring with high throughput by a droplet discharge technique, and an electro-optical device and an electronic apparatus provided with the wiring.
A wiring forming apparatus according to the present embodiment includes a laser beam irradiation unit 2 that irradiates an object to be processed 10 with a laser beam L1 and forms a microstructure having a plurality of grooves arranged on the object 10 to be processed. Droplet discharge means 3 for discharging droplets containing a conductive material on the microstructure of the processing body 10.
[Selection] Figure 1

Description

  The present invention relates to a wiring forming apparatus and a wiring forming method for forming wiring by, for example, an ink jet technique, and an electro-optical device and an electronic apparatus including the wiring.

  As a method for forming the wiring, a method using an ink jet technique is known. When wiring is formed using an ink jet technique, when droplets overlap each other, local droplet aggregation occurs, and the width and thickness of the wiring become non-uniform, which may cause disconnection.

In order to avoid the occurrence of problems due to droplet aggregation, droplets are ejected at intervals on the substrate, and after the droplets are dried, the droplets are ejected into the gap between the droplets applied for the first time. And the wiring is formed by drying the said droplet (refer patent document 1).
JP 2005-95849 A Naoki Yasumaru et al., "Nanostructure formation and control of hard thin film surface by femtosecond laser", Laser Research, Vol.33, No.8, p.519-524 Hiroshi Sawada, “Application of periodic structure formed by femtosecond laser”, Laser Research, Vol.33, No.8, p.525-529 Keita Asuka et al., 53rd Joint Conference on Applied Physics, 2006, p.1209, 25p-L-14

  In the above wiring formation process, in order to form one wiring pattern, two droplet discharge steps and two drying steps are required. Therefore, a lot of time is required for the wiring formation process. This is one of the factors that impede practicality. When the wiring pattern is simply formed continuously, a problem due to the above-described aggregation occurs. As described above, there is a high demand for forming a uniform pattern in a single droplet discharge process.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a wiring forming apparatus and a wiring forming method capable of forming wiring with high throughput by a droplet discharge technique. Another object of the present invention is to provide an electro-optical device and an electronic apparatus which are formed by using the wiring forming device.

  In order to achieve the above object, a wiring forming apparatus according to the present invention includes a laser beam irradiation means for irradiating a target object with a laser beam to form a microstructure having a plurality of grooves arranged on the target object, and the target object. Droplet discharge means for discharging droplets containing a conductive material on the fine structure of the processing body.

  In the present invention described above, when the laser beam is irradiated onto the object to be processed by the laser beam irradiation means, a fine structure in which a plurality of grooves are arranged in the laser beam irradiation region is formed. A droplet containing a conductive material is discharged onto the fine structure by the droplet discharge means. Compared to the case where the surface of the object to be processed is smooth, the droplets are fixed to the surface of the object to be processed by the fine structure. As a result, it is possible to draw droplets by connecting droplets, and wiring can be formed with high throughput.

  The laser beam irradiation unit irradiates a linearly polarized laser beam as the laser beam. Thereby, the direction of the groove in the fine structure is controlled to be parallel or orthogonal to the linearly polarized light. Accordingly, by causing the direction in which the grooves are arranged to coincide with the wiring width direction, the spread of droplets in the wiring width direction is suppressed, and wiring with a uniform width can be obtained.

  The laser beam irradiation unit irradiates a pulse laser beam as the laser beam. Thereby, a fine structure can be formed by irradiating a pulse laser.

  The apparatus further includes moving means for relatively moving the object to be processed, and the laser beam irradiation means irradiates the linearly polarized laser beam having a polarization azimuth parallel or perpendicular to the moving direction of the object to be processed. The moving direction of the object to be processed finally becomes the wiring direction (longitudinal direction). By making the polarization direction of the laser beam perpendicular or parallel to the moving direction of the object to be processed, a fine structure suitable for the wiring direction is formed.

  The laser beam irradiation means includes a light source that emits the laser beam and a deflection azimuth adjusting element that adjusts the deflection azimuth of the laser beam. Thus, the polarization direction of the laser beam can be adjusted by following the moving direction of the object to be processed.

  In order to achieve the above object, a wiring forming apparatus according to the present invention includes a laser beam irradiation means for irradiating a target object with a laser beam to form a microstructure having a plurality of grooves arranged on the target object, and the target object. A droplet discharge means for discharging a droplet containing a conductive material on the fine structure of a processing body; and irradiating the droplet attached on the object to be processed with a laser beam different from the laser beam, Sintering means for drying the droplets and sintering the conductive material.

In the present invention described above, when the laser beam is irradiated onto the object to be processed by the laser beam irradiation means, a fine structure in which a plurality of grooves are arranged in the laser beam irradiation region is formed. A droplet containing a conductive material is discharged onto the fine structure by the droplet discharge means. Compared to the case where the surface of the object to be processed is smooth, the droplets are fixed to the surface of the object to be processed by the fine structure. Immediately after ejecting the droplets, a laser beam is irradiated from the sintering means to dry the droplets and sinter the conductive material.
As a result, the liquid droplets can be drawn and connected, and the liquid droplets can be dried and sintered immediately after the liquid droplets are discharged, so that wiring can be formed with high throughput.

  In order to achieve the above object, the wiring forming method of the present invention includes a first step of irradiating a target object with a laser beam to form a fine structure in which a plurality of grooves are arranged in the target object, and the target object. A second step of discharging the droplets onto the fine structure of the body and drawing a wiring pattern; and a third step of drying the liquid wiring pattern and sintering the conductive material.

  In the present invention, when a laser beam is irradiated on the object to be processed, a fine structure in which a plurality of grooves are arranged in the irradiation region of the laser beam is formed. A droplet containing a conductive material is discharged onto this fine structure. Compared to the case where the surface of the object to be processed is smooth, the droplets are fixed to the surface of the object to be processed by the fine structure. As a result, it is possible to draw a wiring pattern by connecting droplets. Wiring having sufficient conductivity can be obtained by drying the liquid wiring pattern and sintering the conductive materials. By forming a fine structure on the base of the wiring pattern, it is possible to connect the droplets and draw the wiring pattern, so that the wiring can be formed with high throughput.

  Wiring is formed on the target object by continuously performing the first to third steps while moving the target object. By performing the first process to the third process continuously along the trace of the wiring, the throughput of wiring formation can be improved.

  In the third step, the liquid wiring pattern attached to the object to be processed is irradiated with a laser beam different from the laser beam to dry the wiring pattern and sinter the conductive material. As a result, the droplets can be dried and the conductive material can be sintered immediately after the droplets are discharged, and a high throughput can be realized.

  In the first step, the fine structure in which a plurality of grooves are arranged in the width direction of the wiring is formed. Thereby, the spread of droplets in the width direction of the wiring is suppressed, and a wiring having a uniform width can be obtained.

  The electro-optical device of the present invention includes a wiring formed by the wiring forming method according to the seventh aspect. As a result, the wiring reliability of the electro-optical device can be improved and the manufacturing cost can be reduced. Here, the electro-optical device is an element that emits light by an electrical action or changes the state of light from the outside, and includes both a device that emits light by itself and a device that controls the passage of light from the outside. For example, examples of the electro-optical device include a liquid crystal display device, an electrophoretic display device, an organic EL (electroluminescence) display device, and a plasma display.

  The electronic apparatus of the present invention includes the above electro-optical device. Thereby, the improvement of the wiring reliability of an electronic device and the reduction of manufacturing cost can be aimed at. Here, the electronic device refers to a general device having the above-described electro-optical device and other elements and having a certain function, and the configuration thereof is not particularly limited. Examples of such electronic devices include an IC card, a mobile phone, a video camera, a personal computer, a head-mounted display, a rear or front projector, a television (TV), a roll-up TV, and a fax machine with a display function. Examples include digital camera finders, portable TVs, electronic notebooks, electronic bulletin boards, and advertising displays.

(First embodiment)
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic cross-sectional view of the wiring forming apparatus according to the first embodiment.

  The wiring forming apparatus 1 according to the present embodiment includes a laser beam irradiation unit 2 that irradiates a target object 10 with a laser beam L1, a droplet discharge unit 3 that discharges a droplet containing a conductive material to the target object 10, and The stage 4 for moving the object 10 to be processed and the control unit 6 for controlling the operation of the entire apparatus.

  The laser beam irradiation means 2 irradiates the object to be processed 10 with the laser beam L1, thereby forming a fine structure in which a plurality of streak-like grooves are arranged on the surface of the object to be processed 10. It is known that when a laser beam is irradiated on a target object under appropriate conditions, a fine structure is formed on the surface (see Non-Patent Document 1), and various applications of this fine structure are being studied ( Non-patent document 2). The laser beam is preferably a pulsed laser. Further, it has been reported that in order to form a fine structure, it is not necessary to irradiate a single pulse, and it is necessary to irradiate at least two or more pulses to the same place (see Non-Patent Document 3). However, it cannot be said that the fine structure is not formed by the energy and material of the laser, and it can be said that it belongs to the scope of the present invention as long as a laser capable of generating a fine structure is used. In this embodiment, a fine structure formation phenomenon by laser irradiation is applied to wiring formation. The laser beam irradiation means 2 includes a laser light source 21, a mirror 22, a polarization direction adjusting element 23, and a lens 24.

  The laser light source 21 emits an ultrashort pulse laser beam as the laser beam L1. The polarization of the pulse laser beam is linearly polarized light. The irradiation intensity of the pulse laser beam is set to be slightly higher than the processing threshold of the workpiece. The ultrashort pulse laser beam has, for example, a pulse width of 10 fs (femtosecond) to 10 ps (picosecond), a wavelength of 800 nm, and a diameter (spot diameter) of 10 μm to 100 μm.

  The mirror 22 reflects the laser beam L1 emitted from the laser light source 21 toward the object 10 to be processed.

  The polarization direction adjusting element 23 adjusts the polarization direction of the laser beam L 1 reflected from the mirror 22. The polarization azimuth adjusting element 23 is made of a rotatable half-wave plate, for example. When the optical axis of the half-wave plate is an angle θ with respect to the polarization direction of the incident light, the emitted light rotates by 180 ° −2θ. When the half-wave plate is rotated by an angle α, the polarization direction of the emitted light can be rotated by 2α. Thus, by adjusting the angle of the optical axis of the half-wave plate with respect to the polarization direction of the incident beam, the polarization direction of the outgoing beam can be adjusted.

  The lens 24 condenses the laser beam L1 that has passed through the polarization direction adjusting element 23 onto the object 10 to be processed.

The droplet discharge means 3 discharges droplets of the solution using a solution containing a conductive material. Examples of the conductive material include silver particles, gold particles, and nickel particles. The solvent limitation is not, for example, an organic solvent consisting of _C 14 _{H 30.} The droplet discharge means 3 is, for example, an electrostatic drive type, piezoelectric drive type or heat ejection type droplet discharge head. Although not shown, in the case of an electrostatic drive type, the droplet discharge means 3 includes a diaphragm in contact with a cavity filled with a solution and two electrodes. When a voltage is applied between the two electrodes, the diaphragm is displaced, the liquid in the cavity is pressurized, and a droplet is ejected from the nozzle. Note that any solution containing a conductive material may be used. In addition to the case where the solution contains conductive particles, the case where the solvent itself has conductivity is also included.

  The stage 4 is configured to be able to move the workpiece 10. The stage 4 moves the object to be processed 10 so as to pass through the irradiation region by the laser beam irradiation unit 2 and the droplet dropping region by the droplet discharge unit 3. As a result, droplets containing a conductive material are ejected by the droplet ejection means 3 onto the region of the object to be processed 10 irradiated with the laser beam L1. The stage 4 is an embodiment of the moving means of the present invention. The moving means includes moving the laser beam and moving both the stage and the laser beam in addition to moving the object to be processed.

  The control unit 6 outputs drive signals to the laser light source 21, the polarization direction adjusting element 23, the droplet discharge means 3, and the stage 4, and controls the operation of the entire apparatus. Thereby, for example, the number of pulse repetitions of the laser beam L1 emitted from the laser light source 21, the polarization direction D of the laser beam L1 by the polarization direction adjusting element 23, the droplet discharge amount from the droplet discharge means 3, and the movement of the stage 4 Speed is controlled.

  The object 10 is made of a flexible substrate made of plastic, for example. In the present embodiment, a fine structure, which will be described later, is formed on the workpiece 10 by laser irradiation, and wiring is formed on the fine structure. Note that various materials such as glass, metal, and semiconductor can be used for the object to be processed 10. This is because a fine structure can be formed on any material by selecting the laser irradiation conditions.

  In the wiring forming apparatus 1 described above, the laser beam L1 emitted from the laser light source 21 is reflected by the mirror 22, the polarization azimuth is adjusted by the polarization azimuth adjusting element 23, is condensed by the lens 24, and is processed. Is irradiated.

  When the object 10 is irradiated with the laser beam L1 under appropriate conditions, a fine structure 11 (stripe-shaped uneven structure) is formed on the surface of the object 10 in the irradiation spot of the laser beam L1. Appropriate conditions include that the laser beam L1 is linearly polarized light, and that two or more laser beams L1 that are pulse beams are irradiated to the same portion of the workpiece 10. When the irradiation intensity of the laser beam L1 is increased, the fine structure 11 is formed with a certain value (processing threshold) as a boundary. For example, the irradiation intensity of the laser beam L1 is set to be slightly higher than the processing threshold value of the workpiece 10.

  2A and 2B are images of the fine structure 11 taken using an electron microscope. In FIG. 2A, it can be seen that a plurality of stripe-like grooves extending in the horizontal direction are arranged in the vertical direction. In FIG. 2 (b), it can be seen that a plurality of streak-like grooves extending in the vertical direction are arranged in the horizontal direction. In addition, the groove | channel of the fine structure 11 formed using the laser is not perfect linear form, and the width | variety of a groove | channel is not uniform. The width of the groove in the fine structure 11 is about 100 nm, and the depth of the groove is about several tens of nm.

  The relationship between the fine structure 11 and the polarization direction D of the laser beam L1 will be described with reference to FIG. The direction of the groove of the fine structure 11 is either parallel to the polarization direction D as shown in FIG. 3A or orthogonal to the polarization direction D as shown in FIG. Which case occurs depends on the material of the fine structure 11 and the laser irradiation intensity.

  Therefore, as shown in FIG. 3A, when the groove is formed in parallel with the polarization direction D, the polarization direction D of the laser beam L1 is parallel to the moving direction of the stage. The polarization direction D is adjusted by the polarization direction adjusting element 23. Further, the number of pulse repetitions of the laser beam L1 and the moving speed of the workpiece 10 are set so that the fine structures 11 are connected to each other.

  Alternatively, as shown in FIG. 3B, when the grooves are formed orthogonal to the polarization direction D, the polarization is performed so that the polarization direction D of the laser beam L1 is orthogonal to the moving direction of the stage. The polarization direction D is adjusted by the direction adjustment element 23. Further, the number of pulse repetitions of the laser beam L1 and the moving speed of the workpiece 10 are set so that the fine structures 11 are connected to each other.

  Next, a wiring forming method using the wiring forming apparatus according to the present embodiment will be described with reference to FIG.

  When the object 10 is irradiated with the laser beam L1, the fine structure 11 shown in FIG. 2 is formed on the object 10 to be processed. At this time, the polarization direction D of the laser beam L1 is adjusted so that the groove of the fine structure 11 is formed along the moving direction of the workpiece 10. Thereby, as shown in FIG. 5, the fine structure 11 is formed continuously in the wiring pattern forming region. The longitudinal direction of the grooves in the fine structure 11 coincides with the longitudinal direction of the wiring pattern, and the arrangement direction of the grooves in the fine structure 11 coincides with the width direction of the wiring pattern.

  As shown in FIG. 4, a droplet 12a containing a conductive material is ejected by the droplet ejection means 3 onto the microstructure 11 formed by irradiation with the laser beam L1. When the arrangement direction of the grooves of the fine structure 11 and the width direction of the wiring pattern 12b are matched, the periodic uneven shape of the fine structure 11 acts to suppress the spread of the droplets 12a in the wiring width direction. . Further, even when the wiring pattern 12b is drawn by connecting the droplets 12a, aggregation between the liquid enemies can be suppressed. As a result, as shown in FIG. 5, a thin and almost straight wiring pattern 12b can be formed.

  Further, as shown in FIG. 6, it is possible to form a bent wiring pattern 12b. In this case, it is necessary to set the direction of the grooves of the fine structure 11 in accordance with the drawing direction of the wiring pattern 12b. For this purpose, the polarization azimuth adjusting element 23 shown in FIG. 1 may be used to maintain the polarization azimuth D orthogonal or parallel to the moving direction of the stage.

  For example, by firing (sintering) the object 10 on which the wiring pattern 12b is formed in a furnace, the solvent contained in the droplets is vaporized (dried), and the conductive materials are sintered together. . Thereby, the conductive materials in the wiring pattern 12b are sufficiently fused together, and a wiring having a low resistivity is obtained. The firing temperature is, for example, 200 ° C to 400 ° C.

  Next, the effect of providing the fine structure 11 will be described. FIG. 7 shows an image of the spread of the droplet 12a when the conductive material-containing droplet is dropped on the substrate. FIG. 7A shows a state where the fine structure 11 is not present on the substrate, and FIG. 7B shows a state where the fine structure 11 is present on the substrate.

  As shown in FIG. 7A, when the fine structure 11 is not present, it can be seen that the droplet 12a spreads uniformly around the periphery. On the other hand, as shown in FIG. 7B, when the fine structure 11 is formed, the droplet 12a spreads in the longitudinal direction B of the groove, but the groove arrangement direction A (periodically). It can be seen that the spread of the droplets 12a is suppressed in the direction in which the irregularities are formed. For this reason, even when the wiring pattern 12b is drawn by connecting the droplets 12a by aligning the arrangement direction A of the grooves of the fine structure 11 with the width direction of the wiring pattern to be formed, it is caused by aggregation between liquid enemies. It is possible to prevent the line width from becoming uneven. As a result, as shown in FIG. 5, the width of the wiring pattern 12b can be made substantially uniform, and a thin and substantially straight wiring pattern 12b can be formed.

  As described above, according to the wiring forming apparatus and the wiring forming method according to the present embodiment, the fine structure 11 is formed on the workpiece 10 by irradiating the laser beam L1, and the droplets are formed on the fine structure 11. By discharging 12a, a wiring pattern 12b having a stable wiring width can be obtained even when the droplets 12a are connected. Wiring is obtained by drying the liquid wiring pattern 12b.

  Since a wiring pattern can be drawn at a time, a reliable wiring can be formed with high throughput. Further, since the configuration of the laser beam irradiation means 2 for forming the fine structure 11 is simple, the cost for forming the wiring can be reduced.

(Second Embodiment)
FIG. 8 is a diagram showing the configuration of the wiring forming apparatus according to the second embodiment. In addition, the same code | symbol is attached | subjected to the component similar to 1st Embodiment, The description is abbreviate | omitted.

  In the present embodiment, the sintering means 5 for drying and firing (sintering) the liquid wiring pattern 12b includes a laser light source 51 that emits a laser beam L2 and a mirror 52.

  The laser light source 51 emits a laser beam L2 for drying and sintering the liquid wiring pattern 12b. The wavelength band of the laser light source 51 is determined by the type of conductive material and is not particularly limited. For example, in the case of silver particles, it is preferable to use a continuous wave laser beam having a wavelength band of 300 nm to 600 nm. . More specifically, a second harmonic (wavelength 532 nm), a third harmonic (355 nm), a sapphire laser (wavelength 488 nm), or the like of an Nd: YAG laser can be used. Other irradiation conditions of the laser beam L2 are not particularly limited as long as the conductivity (low resistivity) effective as wiring is obtained. However, the irradiation spot diameter of the laser beam L2 is preferably larger than the width of the wiring pattern 12b. This is because it is possible to irradiate the entire width direction of the wiring pattern 12b by one irradiation, and the drying / sintering time can be shortened. The operation of the laser light source 51 is controlled by the control unit 6.

  Next, a wiring forming method using the wiring forming apparatus according to the present embodiment will be described with reference to FIG.

  When the object 10 is irradiated with the laser beam L1, the fine structure 11 shown in FIG. 2 is formed on the object 10 to be processed. At this time, the polarization direction D of the laser beam L1 is adjusted so that the groove of the fine structure 11 is formed along the moving direction of the workpiece 10. As a result, as shown in FIGS. 5 and 6, the fine structure 11 is formed continuously in the wiring pattern formation region. The longitudinal direction of the grooves in the fine structure 11 coincides with the longitudinal direction of the wiring pattern, and the arrangement direction of the grooves in the fine structure 11 coincides with the width direction of the wiring pattern.

  As shown in FIG. 9, a droplet 12a containing a conductive material is discharged by the droplet discharge means 3 onto the fine structure 11 formed by irradiation with the laser beam L1. When the arrangement direction of the grooves of the fine structure 11 and the width direction of the wiring pattern 12b are matched, the periodic uneven shape of the fine structure 11 acts to suppress the spread of the droplets 12a in the wiring width direction. . Further, even when the wiring pattern 12b is drawn by connecting the droplets 12a, aggregation between the liquid enemies can be suppressed. As a result, as shown in FIGS. 5 and 6, a wiring pattern 12b having a substantially uniform wiring width can be formed.

  Next, by irradiating the wiring pattern 12b with the laser beam L2, the solvent contained in the droplets is vaporized to sinter the conductive materials. Thereby, the conductive materials in the wiring pattern 12b are sufficiently fused together, and a wiring having a low resistivity is obtained.

  As described above, according to the wiring forming apparatus and the wiring forming method according to the present embodiment, immediately after the droplet 12a is dropped on the microstructure 11 of the object to be processed 10, the laser beam L2 is irradiated and the liquid is formed. Since the drying of the droplets and the sintering of the conductive material are performed, a higher throughput than in the first embodiment can be realized. Moreover, the same effect as 1st Embodiment can be show | played.

(Electro-optical device)
Using the wiring forming method according to the present embodiment, drive circuits and the like for various electro-optical devices are formed. An electro-optical device is an element that emits light by an electric action or changes the state of light from the outside, and includes both a device that emits light and a device that controls the passage of light from the outside. For example, examples of the electro-optical device include a liquid crystal display device, an electrophoretic display device, an organic EL (electroluminescence) display device, and a plasma display.

FIG. 10 is a schematic plan view showing an organic EL display device as an example of the electro-optical device according to this embodiment.
The organic EL display device is arranged on a transparent substrate 101 made of glass or the like in a matrix form with cross wirings in which a plurality of power supply lines (row direction lines) 102 and a plurality of scanning lines (column direction lines) 103 intersect. The organic EL element 104 which is a display element thus formed is formed. A driving circuit 105 for supplying signals and power is formed on the flexible wiring substrate 109, and the driving circuit 105 is connected to the power supply line 102 and the scanning line 103 on the transparent substrate 101 via the outer wiring 108. The transparent substrate 101 and the flexible wiring substrate 109 are fixed to each other with an adhesive or the like.

  The organic EL element 104 is provided at each intersection of the power supply line 102 and the scanning line 103. The organic EL element 104 is connected to the power supply line 102 and the scanning line via a thin film transistor or a storage capacitor (not shown) at each intersection. 103 is connected. Although only 20 pixels are shown here, for example, 1 million pixels or more are arranged.

  The power supply line 102, the scanning line 103, and the outer wiring 108 are formed by using the wiring forming method according to the present embodiment. Note that an insulating layer is interposed between the power supply line 102 and the scanning line 103, and both are insulated.

  By manufacturing the electro-optical device using the wiring forming apparatus according to the present embodiment, it is possible to improve the wiring reliability of the electro-optical device and reduce the manufacturing cost.

(Electronics)
Examples of various electronic devices using the electro-optical device will be described.
FIG. 11A shows an application example to a mobile phone. The mobile phone 230 includes an antenna unit 231, an audio output unit 232, an audio input unit 233, an operation unit 234, and the electro-optical device 100 according to the present embodiment.

  FIG. 11B shows an application example to a video camera. The video camera 240 includes an image receiving unit 241, an operation unit 242, an audio input unit 243, and the electro-optical device 100 according to the present embodiment.

  FIG. 11C shows an application example to a portable personal computer (so-called PDA). The computer 250 includes a camera unit 251, an operation unit 252, and the electro-optical device 100 according to the present embodiment.

  FIG. 11D shows an application example to a head mounted display. The head mounted display 260 includes a band 261, an optical system storage unit 262, and the electro-optical device 100 according to the present embodiment.

  FIG. 12A shows an application example to a television, and the television 300 includes the electro-optical device 100. The electro-optical device according to the present embodiment can be similarly applied to a monitor device used in a personal computer or the like.

  FIG. 12B shows an application example to a roll-up type television. The roll-up television 310 includes the electro-optical device 100 according to the present embodiment.

  The electronic device according to the present embodiment is not limited to the example described above. For example, electronic devices include a fax machine with a display function, a digital camera finder, a portable TV, an electronic notebook, an electric bulletin board, and a display for advertisement.

The present invention is not limited to the description of the above embodiment.
In the above embodiment, an ultrashort pulse laser with a wavelength of 800 nm is used as the laser beam L1, but its harmonics can also be used. It is also possible to use an excimer laser having a wavelength of around 200 nm, for example, KrF or ArF.
In addition, various modifications can be made without departing from the scope of the present invention.

It is a schematic block diagram of the wiring formation apparatus which concerns on 1st Embodiment. It is an image of a fine structure. It is a figure which shows the relationship between the moving direction of a stage, and a polarization direction. It is a figure for demonstrating the wiring formation method which concerns on 1st Embodiment. It is a top view which shows the example which forms a linear wiring. It is a top view which shows the example which forms the wiring which bent. It is an image demonstrating the shape fixing effect of the droplet by a fine structure. It is a schematic block diagram of the wiring formation apparatus which concerns on 2nd Embodiment. It is a figure for demonstrating the wiring formation method which concerns on 2nd Embodiment. It is a figure which shows an example of the electro-optical apparatus which concerns on this embodiment. It is a figure which shows an example of the electronic device which concerns on this embodiment. It is a figure which shows an example of the electronic device which concerns on this embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Wiring formation apparatus, 2 ... Laser beam irradiation means, 3 ... Droplet discharge means, 4 ... Stage, 5 ... Sintering means, 6 ... Control part, 10 ... To-be-processed object, 11 ... Fine structure, 12a ... Droplet , 12b ... wiring pattern, 12c ... wiring, 21 ... laser light source, 2 ... mirror, 23 ... polarization orientation adjusting element, 24 ... lens, 51 ... laser light source, 52 ... mirror, L1 ... laser beam, L2 ... laser beam, D ... polarization orientation

Claims (12)

A laser beam irradiating means for irradiating the object to be processed with a laser beam to form a fine structure in which a plurality of grooves are arranged on the object to be processed;
Droplet discharge means for discharging droplets containing a conductive material on the microstructure of the object to be processed;
A wiring forming apparatus having: The laser beam irradiation means irradiates a linearly polarized laser beam as the laser beam.
The wiring forming apparatus according to claim 1. The laser beam irradiation means irradiates a pulse laser beam as the laser beam.
The wiring forming apparatus according to claim 1. A moving means for relatively moving the object to be processed;
The laser beam irradiation means irradiates the linearly polarized laser beam having a polarization direction parallel or orthogonal to the moving direction of the object to be processed.
The wiring forming apparatus according to claim 1. The laser beam irradiation means includes
A light source for emitting the laser beam;
A deflection azimuth adjusting element for adjusting the deflection azimuth of the laser beam;
The wiring formation apparatus of Claim 4 which has these. A laser beam irradiating means for irradiating the object to be processed with a laser beam to form a fine structure in which a plurality of grooves are arranged on the object to be processed;
Droplet discharge means for discharging droplets containing a conductive material on the microstructure of the object to be processed;
Sintering means for irradiating the droplets deposited on the object to be processed with a laser beam different from the laser beam, drying the droplets, and sintering the conductive material;
A wiring forming apparatus having: A first step of irradiating the object to be processed with a laser beam to form a microstructure in which a plurality of grooves are arranged in the object to be processed;
A second step of drawing a wiring pattern by discharging the droplet onto the microstructure of the object to be processed;
A third step of drying the liquid wiring pattern and sintering the conductive material;
A method for forming a wiring. The wiring forming method according to claim 7, wherein wiring is formed on the object to be processed by continuously performing the first to third processes while moving the object to be processed. In the third step, the liquid wiring pattern attached to the object is irradiated with a laser beam different from the laser beam, the wiring pattern is dried, and the conductive material is sintered.
The wiring formation method according to claim 7. Forming the fine structure in which a plurality of grooves are arranged in the width direction of the wiring in the first step;
The wiring formation method according to claim 7. A wiring formed by the wiring forming method according to claim 7 is provided.
Electro-optic device. The electro-optical device according to claim 11,
Electronics.

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