JP2007318075A - OPTICAL DEVICE, OPTICAL DEVICE MANUFACTURING METHOD, OPTICAL PICKUP DEVICE, AND OPTICAL DISK DRIVE DEVICE - Google Patents

Abstract

An object of the present invention is to improve heat dissipation and reduce the size.
A semiconductor laser resonator length of an optical device is provided by providing an internal wiring terminal 6 on a protruding portion 5a on a flexible substrate 5 protruding on both sides of the semiconductor laser element so as to avoid the direction of the resonator of the semiconductor laser element. The length of the direction can be suppressed. In addition, by forming the external wiring terminal 8 connected to the internal wiring terminal 6 via the wiring pattern 10 on the flexible substrate 5, it becomes possible to form the frame body and the external wiring terminal 8 separately, and the frame body. Even if a sufficient thickness is provided to ensure heat dissipation, downsizing of the optical device can be realized.
[Selection] Figure 2

Description

  The present invention relates to an optical device in which an optical element such as a semiconductor laser element or a light receiving element is mounted on a mounting substrate, an optical device manufacturing method, an optical pickup device, and an optical disk drive device.

  In recent years, optical disk drives mounted on DVD recorders, DVD players, personal computers, etc. have rapidly spread, and optical pickup devices, which are key components of optical disk drives, can be manufactured at low cost and high speed recording to meet market prices. There has been a strong demand for higher output for compatibility, higher functionality for compatibility with both CD and DVD standards, and miniaturization with thinner optical disk drives. In response to these demands, the optical device used in the optical pickup device has improved the heat dissipation of the package in order to achieve higher output, and the laser resonator length has increased with higher laser output. It has become indispensable to realize a package structure that can mount a laser chip and can be downsized at low cost. Therefore, recently, optical devices (for example, frame lasers) provided with semiconductor laser elements are widely used.

Hereinafter, the configuration of the conventional optical device will be described with reference to FIGS.
FIG. 9 is a plan view showing a conventional optical device. FIG. 10 is a cross-sectional view of a conventional optical device, and is a cross-sectional view taken along the line AA ′ of FIG.

9 and 10, in the optical device 101, a light receiving element 103 is installed on a support member 102, and a semiconductor laser element 104 is further installed on the light receiving element 103. As shown in FIG. 9, a U-shaped resin frame 108 is provided around the semiconductor laser element 104 so as to be opened only in the laser beam emission direction in a plan view and to surround the other direction. . The support member 102 and the leads 105, 106, and 107 are each formed by die pressing a metal plate such as copper or iron, and the resin frame 108 is formed by transferring the support member 102 and the leads 105, 106, and 107 by transfer molding. It is formed so as to be sandwiched and fixed vertically. Thereby, electrically insulated leads 105, 106, and 107 are formed. Further, the pad electrode 104a of the semiconductor laser element 104 and the lead 105 are electrically connected through a fine metal wire 109 by wire bonding. Further, the pad electrode 103a and the lead 106 of the light receiving element 103 are electrically connected by a thin metal wire 110, and the pad electrode 103b and the lead 107 are electrically connected by a thin metal wire 111 (for example, patents). Reference 1).
JP 2001-308437 A

  However, there are two problems when trying to cope with high output and miniaturization of the optical pickup device by the optical device 101 having the above configuration. One is to improve heat dissipation with higher output, and the other is to realize miniaturization while mounting a semiconductor laser element whose resonator length increases in proportion to higher output. In recent years, high-speed recording optical disks have been required to have a high output of 300 mW or more as an optical output from a semiconductor laser unit. As a result, the drive current of the semiconductor laser element increases, and the temperature of the semiconductor laser element itself increases, so that the reliability decreases. Therefore, it is indispensable to efficiently dissipate the heat generated in the semiconductor laser element in order to drive the laser stably against changes in the environmental temperature. In the conventional optical device 101, the support member 102 on which the semiconductor laser element 104 is mounted and the leads 105, 106, 107 are insulated and fixed, and the resin frame 108 is provided so as to protect the semiconductor laser element 104. However, since the resin frame 108 is made of a resin having a low thermal conductivity (0.5 W / m / deg), the area that can be used for heat dissipation in the support member 102 is reduced, and the resin frame 108 is mounted on the support member 102. There is a problem that the heat generated from the semiconductor laser element 104 that is present cannot be efficiently released.

  In addition, although there are restrictions on the dimensions on which an optical device can be mounted in an optical pickup device, the semiconductor laser element has a longer resonator length as the output is increased. In order to realize the above, a package is required in which the extension of the length in the resonator length direction accompanying the extension of the resonator length is suppressed. However, in the above-described conventional optical device 101, the support member 102 and the leads 105, 106, and 107 are each formed by die pressing a metal plate such as copper or iron. In general, the distance 119 between the inner lead portion and the support member 102 needs to have a dimension equivalent to the thickness of the metal plate due to the problem of formability during press working. For example, when the plate thickness of the support member 102 and the lead is 0.4 mm, the distance 119 between the support member 102 and the inner lead needs to be 0.4 mm or more. At this time, in consideration of the heat dissipation of the semiconductor laser element, the thicker the support member 102 is, the better the heat conduction to the entire support member 102 and the heat dissipation area can be increased. The distance 119 between the support member 102 and the inner lead is also increased, and the length dimension of the package is increased.

  Further, as shown in FIG. 10, the resin frame 108 has a function of sandwiching and fixing the support member 102 and the leads 105, 106, 107 up and down, and the package strength increases as the width dimension 112 of the resin frame increases. In order to secure sufficient strength, the length of the package becomes long.

  In order to electrically connect the semiconductor laser element and the light receiving element to the inner lead, a thin metal wire is installed by wire bonding. When performing wire bonding to the inner lead, the wire bonding tip tool 113 and the resin frame 108 are provided. In order to prevent the interference, it is necessary to increase the length 114 of the inner lead, which increases the package length.

  Further, as a method of mounting the above-described conventional optical device on an optical pickup, it is common to perform soldering by inserting the leads 105, 106, 107 into the through holes of the glass epoxy substrate, but in this case, the resin frame 108 is used. The length L of the leads 105, 106, 107 protruding from the head needs to be about 2 mm, which is disadvantageous for miniaturization of the optical pickup device.

  Therefore, it is difficult for the above-mentioned conventional optical device to achieve both improvement of heat dissipation with higher output and miniaturization of an optical pickup device equipped with a semiconductor laser element that becomes longer with higher output. is there.

  In order to solve the above problems, an object of the present invention is to improve heat dissipation and reduce the size.

  In order to achieve the above object, an optical device according to claim 1 is an optical device for emitting and receiving laser light, wherein a plate having a flat plate shape is formed by bending a plate with heat dissipation into a U-shape. A frame body formed with side frame plates sandwiching the center frame plate, a substrate mounted in contact with the center frame plate, and the resonator length direction of the side frame plate and the resonator are parallel to each other on the substrate. And a flexible substrate installed on the central frame plate so as to protrude from the frame body in a direction opposite to the light emitting direction, with a protruding portion surrounding the substrate by opening the light emitting direction. For connection between an internal wiring terminal group formed on the flexible substrate including a plurality of internal wiring terminals electrically connected to the semiconductor laser element and the base, and an external device An external wiring terminal group formed on the flexible substrate composed of a plurality of external wiring terminals used, a wiring pattern for connecting between the internal wiring terminals and the corresponding external wiring terminals, the semiconductor laser element, and the semiconductor laser device It has a metal fine wire which electrically connects the pad electrode of a board | substrate and the said internal wiring terminal corresponding.

  3. The optical device according to claim 2, wherein the optical device emits and receives laser light, and a plate having a flat plate shape and a side frame sandwiching the central frame plate by bending a plate having heat dissipation into a U-shape. A frame body on which a plate is formed; a cutout portion formed on one of the side frame plates; a substrate mounted in contact with the central frame plate; and the side frame plate on the substrate. A semiconductor laser element mounted so that the resonator length direction is parallel, a flexible substrate installed on the central frame plate through the notch, and electrically connected to the semiconductor laser element and the base The flexi circuit comprising an internal wiring terminal group formed on the flexible substrate comprising a plurality of internal wiring terminals and a plurality of external wiring terminals used for connection to an external device. An external wiring terminal group formed on a wiring board, a wiring pattern connecting the external wiring terminals corresponding to the internal wiring terminals, and the internal wiring terminals corresponding to the semiconductor laser element and the pad electrodes of the substrate And a thin metal wire that electrically connects the two.

  The optical device according to claim 3 is the optical device according to claim 2, wherein the flexible substrate is installed on the central frame plate through the notch in a direction perpendicular to the light emitting direction of the semiconductor laser element. Features.

An optical device according to a fourth aspect is the optical device according to the first or second aspect, wherein the base comprises a light receiving element.
The optical device according to claim 5 is the optical device according to any one of claims 1 to 4, wherein the flexible substrate is bendable, and the flexible substrate protruding from the frame body is bent to suppress the total length. It is possible to do.

An optical device according to a sixth aspect is the optical device according to any one of the first to fifth aspects, wherein the flexible substrate is made of a glass epoxy substrate.
An optical device according to a seventh aspect is the optical device according to any one of the first to sixth aspects, wherein a notch portion is provided at an end portion in the light emitting direction of the frame body.

  The optical device according to claim 8 is the optical device according to any one of claims 1 to 7, wherein a metal cap is attached so as to cover the frame body on which the semiconductor laser element is mounted. Features.

An optical device according to a ninth aspect is the optical device according to the eighth aspect, characterized in that a light transmissive member is installed in an outgoing light passage portion of the metal cap.
The method of manufacturing an optical device according to claim 10 includes a first step of forming a side frame plate by bending one or both ends of a metal frame body, and a second step of installing a flexible substrate on the frame body. A third step of installing the base and the semiconductor laser element on the central frame plate of the frame body, and a fourth step of electrically connecting the semiconductor laser element and the pad electrode of the base to the internal wiring terminal of the flexible substrate. It has the process of this.

  The method for manufacturing an optical device according to claim 11 includes a first step of forming a side frame plate by bending one or both ends of a metal frame body, and a second step of installing a flexible substrate on the frame body. A third step of installing the base and the semiconductor laser element on the central frame plate of the frame body, and a fourth step of electrically connecting the semiconductor laser element and the pad electrode of the base to the internal wiring terminal of the flexible substrate. And a fifth step of attaching a metal cap so as to sandwich the side frame plate.

  The optical device manufacturing method according to claim 12 includes the sixth step of attaching an optically transparent member in front of the emitting direction of the semiconductor laser of the metal cap in the optical device manufacturing method according to claim 11. It is characterized by.

  An optical device manufacturing method according to a thirteenth aspect is the optical device manufacturing method according to any one of the tenth to twelfth aspects, wherein the flexible substrate is a glass epoxy substrate.

  The optical pickup device according to claim 14 is an optical pickup device that emits laser light to an optical disc and receives reflected light from the optical disc, and includes a housing that holds component parts, and is held by the housing. The optical device according to any one of claims 1 to 9, which emits and receives the laser light, an objective lens that is held by the housing and narrows the laser light onto the optical disc, and the housing A rising mirror that holds the light emitted from the optical device in the direction of the optical disc, a beam splitter that branches the reflected light that is held by the housing and reflected by the optical disc, and is held by the housing. And a light receiving element for receiving the branched reflected light.

  15. The optical disk drive device according to claim 15, wherein the optical disk drive device reads and writes data on the optical disk by emitting laser light to the optical disk and receiving reflected light from the optical disk. An optical pickup device, a traverse mechanism that can move the optical pickup device in a radial direction of the optical disc, and a drive mechanism that rotates the optical disc.

  As described above, improvement in heat dissipation and miniaturization can be realized.

  As described above, according to the present invention, the internal wiring terminal group of the flexible substrate is provided adjacent to the direction perpendicular to the resonator length direction of the semiconductor laser device of the substrate, thereby generating heat generated from the semiconductor laser device. In addition, it is possible to realize an optical device that can be miniaturized even if a semiconductor laser element having a long resonator length is mounted. Further, by mounting this optical device, it is possible to reduce the size of the optical pickup device and the optical disk drive device.

A first embodiment of the present invention will be described below with reference to FIGS.
FIG. 1 is a perspective view showing an optical device according to the first embodiment. FIG. 2 is a plan view showing the optical device according to the first embodiment.

  As shown in FIG. 1, the optical device 1 includes a frame 4 having a heat dissipation function, a base 4, a semiconductor laser element 3 mounted on the base 4, and a flexible substrate 5 that can be bent. The material of the frame body 2 is preferably a material having high thermal conductivity such as copper and other metals having high thermal conductivity. The frame body 2 is formed in a U-shape having a flat central frame plate 2a and a pair of side frame plates 2c bent at local portions 2b on both sides of the central frame plate 2a. The base 4 on which the semiconductor laser element 3 is mounted has a resonator length direction of the semiconductor laser element 3 such that the laser beam emission direction of the semiconductor laser element 3 is a direction in which the side frame plate 2c is not formed. It is mounted in contact with the surface of the central frame plate 2a so as to be parallel to the side frame plate 2c. The base 4 may be a light receiving element that receives laser light and converts it into an electrical signal.

  As shown in FIG. 2, the flexible substrate 5 is used to connect an internal wiring terminal group 7 including a plurality of internal wiring terminals 6 connected to the semiconductor laser element 3 and the base 4 and an optical pickup device. An external wiring terminal group 9 including a plurality of external wiring terminals 8 and a wiring pattern 10 for electrically connecting each internal wiring terminal 6 and the corresponding external wiring terminal 8 are formed. The flexible substrate 5 may be a glass epoxy substrate. The flexible substrate 5 has a protruding portion 5a protruding so as to surround the periphery of the semiconductor laser element 3 and the base 4 by opening the front in the emission direction of the laser light emitted from the semiconductor laser element 3. The internal wiring terminal group 7 is disposed on the protruding portion 5a. The flexible substrate 5 has a part including the external wiring terminal group 9 protruding from the frame body 2 and fixed to the surface of the central frame plate 2a.

  Further, the pad electrode 3a of the semiconductor laser element 3 and the internal wiring terminal 6 are electrically connected through a fine metal wire 11 by wire bonding. Further, the pad electrode 4a of the base 4 and the internal wiring terminal 6 are electrically connected through a fine metal wire 12 by wire bonding.

  The internal wiring terminal group 7 is arranged on both sides of the semiconductor laser element 3 so as to avoid the resonator length direction, and the length 14 on which the internal wiring terminal group 7 is formed is shorter than the resonator length 13, so that it is an optical device. Does not affect the length.

  Further, the length 15 of the frame body may be shortened to a dimension that the semiconductor laser element 3 and the base 4 do not protrude from the length 15 of the frame body in consideration of the mounting accuracy of the semiconductor laser element 3 and the base 4. it can. Furthermore, the length of the flexible substrate 5 that protrudes beyond the length 15 of the frame body can be bent along the frame body 2 when mounted on the optical pickup device, so that the length dimension can be suppressed. Can be realized.

  Further, since the frame body 2 has a simple structure in which a flat metal plate is bent, it can be easily processed even if the thickness of the metal plate is increased. As a result, the heat generated from the semiconductor laser element 3 can be efficiently transmitted from the central frame plate 2a to the side frame plate 2c, so that the heat dissipation area can be increased and the heat dissipation is excellent.

  As described above, the length of the optical device in the semiconductor laser resonator length direction can be reduced by providing the internal wiring terminal on the flexible substrate protruding from both sides of the semiconductor laser element while avoiding the resonator direction of the semiconductor laser device. Can be suppressed. Also, by forming the external wiring terminals connected to the internal wiring terminals via the wiring pattern on the flexible substrate, it becomes possible to form the frame body and the external wiring terminals separately, and the frame body has a sufficient thickness. Even if heat dissipation is ensured, the optical device can be downsized. Furthermore, by making the frame body U-shaped, the surface area of the frame body can be increased without affecting the size of the optical device, so that the heat dissipation efficiency can be further improved. Further, by making the flexible substrate bendable, it is possible to further reduce the size of the optical device.

Next, a second embodiment of the present invention will be described with reference to FIG.
FIG. 3 is a perspective view showing the optical device according to the second embodiment, and is a perspective view showing the optical device having a notch with respect to the optical device according to the first embodiment.

  As shown in FIG. 3, the optical device according to the present embodiment has a V-shaped notch 17 on the front end surface of the center frame plate 2a in the laser emission direction as compared with the optical device according to the first embodiment. By forming the optical device, the positioning device is pressed against the notch 17 in the manufacturing process of the optical device of the present invention, so that the optical device can be positioned with high accuracy by a very simple mechanism, and the semiconductor laser element. Since the mounting accuracy of the frame 3 and the base 4 on the frame body 2 can be improved, the length 15 of the frame body can be shortened by the amount that the mounting accuracy is improved. The shape of the notch 17 may be U-shaped instead of V-shaped. Further, by using the notch portion 17 when mounting on the optical pickup device, the optical device can be easily positioned and the mounting accuracy can be improved.

Next, a third embodiment of the present invention will be described with reference to FIG.
FIG. 4A is a perspective view illustrating a state in which a metal cap is attached to the optical device, and FIG. 4B is a perspective view illustrating a state in which the metal cap is attached to the optical device.

  As shown in FIGS. 4A and 4B, a metal cap 18 is attached so as to be fitted into a frame body having a length 15 and a width 16 of the optical device 1. The metal cap may be fixed by welding or bonding, or only by tightening force by fitting the metal cap and the frame body.

  The metal cap 18 is provided with an opening window 19 so as not to block the laser light emitted from the semiconductor laser element. Thus, by attaching the metal cap 18, the semiconductor laser element 3 and the fine metal wire can be protected, and the optical device can be easily handled.

Further, by attaching a light transmissive member (not shown) to the opening window 19, the airtightness can be improved.
Here, the configuration in which the metal cap is attached to the optical device described in the first embodiment has been described. Similarly, the metal cap can be attached to the optical device described in the second embodiment. is there.

Next, a fourth embodiment of the present invention will be described with reference to FIG.
FIG. 5 is a perspective view showing an optical device according to the fourth embodiment. One of the side frame plates 2c, which is a part of the frame body 2, with respect to the optical devices according to the first and second embodiments. It is a perspective view which shows the optical device which formed the notch so that a part might remain.

  As shown in FIG. 5, the optical device according to the present embodiment forms a notch so as to leave one part of the side frame plate 2c with respect to the optical device according to the first and second embodiments. ing. Further, the protruding portion of the flexible substrate 5 is not shaped so as to surround the base 4, but is formed so that it can be bonded and fixed to a portion adjacent to the base 4 of the central frame plate 2 a through the notched portion of the side frame plate 2 c. Yes. Then, the flexible substrate 5 is provided in the cutout portion so that the internal wiring terminal group 7 and the external wiring terminal group 9 of the flexible substrate 5 are arranged in either the right or left direction with respect to the laser emission direction of the semiconductor laser element 3. It is attached to the frame plate 2.

  As a result, the flexible substrate 5 can be disposed avoiding the direction of the resonator of the semiconductor laser element, so that the total length 15 of the frame body 2 can be minimized with respect to the increase in the length of the resonator accompanying the increase in the output of the semiconductor laser. It becomes possible.

  In this example, the flexible board is arranged so that the external wiring terminal group is provided in a direction perpendicular to the laser emission direction. However, the flexible board is made larger than the width of the frame plate and protrudes at the notch. The arrangement of the external wiring terminals may be arbitrary, and the direction of the external wiring terminal group is arbitrary.

  Further, even in this configuration, a part of the side frame plate 2c remains, so that the metal cap 18 according to the third embodiment can be attached as shown in FIGS. 6 (a) and 6 (b). It has become.

Next, the manufacturing method of the optical device in the first embodiment will be described with reference to FIGS.
First, in the first step, the frame 2 is formed by bending a metal plate at two local portions 2b. Next, in the second step, as shown in FIG. 1, a portion including the external wiring terminal group 9 of the flat flexible substrate 5 is protruded from the frame body 2 and bonded and fixed to the central frame plate 2a. At this time, alignment is performed so that the internal wiring terminal group 7 does not protrude from the frame body 2 and is placed on the central frame plate 2a. Next, the third process includes a pre-process and a post-process. In the pre-process, the semiconductor laser element 3 is bonded onto the base 4. Then, as shown in FIG. 2, in a later step, the base 4 on which the semiconductor laser element 3 is mounted is directly placed on the surface of the central frame plate 2a between the protruding portions 5a of the flexible substrate 5, and an adhesive (silver) Fix with paste etc.)

  Next, in the fourth step, the pad electrode 3a of the semiconductor laser element 3 and one of the internal wiring terminals 6 of the flexible substrate 5 are electrically connected through the fine metal wires 11 by wire bonding, An optical device is completed by electrically connecting the pad electrodes 4a and 4b of the base 4 and the internal wiring terminals 6 via the thin wires 12, respectively.

Next, an optical device manufacturing method according to the third embodiment will be described with reference to FIG.
The steps from the first step to the fourth step are steps for manufacturing an optical device by the method for manufacturing an optical device in the first embodiment, and description thereof is omitted. Next, in the fifth step, as shown in FIG. 4, a metal cap 18 is put on the outside of the width 16 between the side frame plates 2c, and the metal cap side portion 18a and the side frame plate 2c are fixed by spot welding. To complete the optical device.

Furthermore, as a sixth step, a light transmissive member may be attached to the opening of the metallic cap 18.
Next, an optical pickup device according to a fifth embodiment of the present invention will be described with reference to FIG.

  FIG. 7A is a schematic cross-sectional view showing an optical pickup device according to a fifth embodiment of the present invention, and shows an optical pickup device 21 equipped with the optical device 1 shown in the first to third embodiments. A side view is shown. FIG. 7B is a schematic plan view showing an optical pickup device according to the fifth embodiment of the present invention.

  As shown in FIG. 7, the optical pickup device 21 has a housing 22 that supports optical components, and laser light 20 emitted from a semiconductor laser element (not shown) of the optical device 1 is collimated by a collimator lens 23. Then, the optical path is bent by 90 ° by the rising mirror 24, and then the object lens 25 focuses on the pit recorded on the optical disk 26. The laser beam 20 that has read the signal on the pit is reflected by the optical disk 26, returns to the same path, branches off by the beam splitter 27, enters the light receiving element 28, and reads the signal recorded on the optical disk. The rotating shaft 29 of the optical disk 26 is rotated by being rotated by a spindle motor. In the optical pickup device 21 configured as described above, the length 30 of the housing 22 is limited due to the dimensional constraints of the optical disk drive device, and the length 31 of the optical device 1 is also limited. However, if the miniaturized optical device shown in the first to fourth embodiments is mounted, the optical pickup device can be miniaturized even if the output is increased.

Next, an optical disk drive according to a sixth embodiment of the present invention will be described with reference to FIG.
FIG. 8 is a schematic configuration diagram showing an optical disk drive device on which the optical pickup device shown in the fifth embodiment is mounted.

  As shown in FIG. 8, the optical disk drive 32 drives a rotating shaft 29 by a drive mechanism that rotates the optical disk 26. In order to record and reproduce signals on the optical disk 26, the optical pickup device 21 is supported by support shafts 33 and 34 of a traverse mechanism that is movable in the radial direction of the disk and moves in the direction of movement 35. Since the optical pickup device 21 is mounted with the downsized optical pickup device of the fourth embodiment of the present invention, the optical disc drive 32 can also be reduced in size.

  INDUSTRIAL APPLICABILITY The present invention can realize improvement in heat dissipation and miniaturization, and an optical device in which an optical element such as a semiconductor laser element or a light receiving element is mounted on a mounting substrate, an optical device manufacturing method, an optical pickup device, and an optical disc Useful for drive devices and the like.

The perspective view which shows the optical device in 1st Embodiment The top view which shows the optical device in 1st Embodiment The perspective view which shows the optical device in 2nd Embodiment (A) The perspective view explaining the state which attaches a metal cap to an optical device (b) The perspective view which shows the state where the metal cap was attached to the optical device The perspective view which shows the optical device in 4th Embodiment (A) The perspective view explaining the state which attaches a metal cap to the optical device of 4th Embodiment (b) The perspective view which shows the state where the metal cap was attached to the optical device of 4th Embodiment (A) Schematic sectional view showing an optical pickup device in a fifth embodiment of the present invention (b) Schematic plan view showing an optical pickup device in a fifth embodiment of the present invention Schematic configuration diagram showing an optical disk drive device equipped with the optical pickup device shown in the fifth embodiment of the present invention. Plan view showing a conventional optical device Sectional view showing a conventional optical device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical device 2 Frame body 2a Central frame board 2b Local part 2c Side frame board 3 Semiconductor laser element 3a Pad electrode 4 Base 4a Pad electrode 4b Pad electrode 5 Flexible board 5a Protrusion part 6 Internal wiring terminal 7 Internal wiring terminal group 8 External wiring Terminal 9 External Wiring Terminal Group 10 Wiring Pattern 11 Metal Wire 12 Metal Wire 13 Resonator Length 14 Length of External Wiring Terminal Group 15 Length of Frame Body 16 Width 17 Notch 18 Metal Cap 18a Metal Cap Side 19 Opening Window 20 Laser light 21 Optical pickup device 22 Case 23 Collimating lens 24 Rising mirror 25 Objective lens 26 Optical disc 27 Beam splitter 28 Light receiving element 29 Rotating shaft 30 Length of housing 31 Length of optical device 32 Optical disc drive 33 Support shaft 34 Support shaft 35 Moving direction 101 Optical device 102 Support member 103 Light receiving element 103a Pad electrode 103b Pad electrode 104 Semiconductor laser element 104a Pad electrode 105 Lead 106 Lead 107 Lead 108 Resin frame 109 Metal fine wire 110 Metal fine wire 111 Metal fine wire 112 Width dimension 113 Wire Bonding tip tool 114 Inner lead length 119 Distance

Claims (15)

An optical device for emitting and receiving laser light,
A frame body in which a plate having a heat dissipation property is bent into a U-shape to form a flat central frame plate and a side frame plate sandwiching the central frame plate;
A substrate mounted in contact with the central frame plate;
A semiconductor laser device mounted on the substrate so that the side frame plate and the resonator length direction are parallel;
A flexible board that is provided on the central frame plate so as to protrude in a direction opposite to the light emitting direction from the frame body, and having a protruding portion that surrounds the board by opening the light emitting direction;
A group of internal wiring terminals formed on the flexible substrate comprising a plurality of internal wiring terminals electrically connected to the semiconductor laser element and the base;
A group of external wiring terminals formed on the flexible substrate comprising a plurality of external wiring terminals used for connection with an external device;
A wiring pattern for connecting between the internal wiring terminal and the corresponding external wiring terminal;
An optical device comprising: the semiconductor laser element; and a thin metal wire that electrically connects the pad electrode of the substrate and the corresponding internal wiring terminal. An optical device for emitting and receiving laser light,
A frame body in which a plate having a heat dissipation property is bent into a U-shape to form a flat central frame plate and a side frame plate sandwiching the central frame plate;
A notch formed in one of the side frame plates;
A substrate mounted in contact with the central frame plate;
A semiconductor laser device mounted on the substrate so that the side frame plate and the resonator length direction are parallel;
A flexible substrate installed on the central frame plate through the notch,
A group of internal wiring terminals formed on the flexible substrate comprising a plurality of internal wiring terminals electrically connected to the semiconductor laser element and the base;
A group of external wiring terminals formed on the flexible substrate comprising a plurality of external wiring terminals used for connection with an external device;
A wiring pattern for connecting between the internal wiring terminal and the corresponding external wiring terminal;
An optical device comprising: the semiconductor laser element; and a thin metal wire that electrically connects the corresponding pad electrode of the substrate and the corresponding internal wiring terminal.   3. The optical device according to claim 2, wherein the flexible substrate is installed on the central frame plate through the cutout in a direction perpendicular to the light emitting direction of the semiconductor laser element.   The optical device according to claim 1, wherein the base includes a light receiving element.   The optical device according to any one of claims 1 to 4, wherein the flexible substrate is bendable, and the flexible substrate protruding from the frame body can be bent to suppress a total length.   The optical device according to claim 1, wherein the flexible substrate is made of a glass epoxy substrate.   The optical device according to any one of claims 1 to 6, wherein a notch portion is provided at an end portion in the light emitting direction of the frame body.   8. The optical device according to claim 1, wherein a metal cap is attached so as to cover the frame body on which the semiconductor laser element is mounted.   The optical device according to claim 8, wherein a light transmissive member is installed in an outgoing light passage portion of the metal cap. A first step of bending one end or both ends of a metal frame body to form a side frame plate;
A second step of installing a flexible substrate on the frame body;
A third step of installing a base and a semiconductor laser element on the central frame plate of the frame body;
And a fourth step of electrically connecting the semiconductor laser element and the pad electrode of the base to the internal wiring terminal of the flexible substrate. A first step of bending one end or both ends of a metal frame body to form a side frame plate;
A second step of installing a flexible substrate on the frame body;
A third step of installing a base and a semiconductor laser element on the central frame plate of the frame body;
A fourth step of performing electrical connection between the semiconductor laser element and the pad electrode of the base and the internal wiring terminal of the flexible substrate;
And a fifth step of attaching a metal cap so as to sandwich the side frame plate.   The method of manufacturing an optical device according to claim 11, further comprising: a sixth step of attaching a light transmitting member in front of the metal cap in the emission direction of the semiconductor laser.   The method of manufacturing an optical device according to claim 10, wherein the flexible substrate is a glass epoxy substrate. An optical pickup device that emits laser light to an optical disc and receives reflected light from the optical disc,
A housing that holds the components;
The optical device according to any one of claims 1 to 9, wherein the optical device is held by the casing and emits and receives the laser light;
An objective lens that is held in the housing and narrows the laser light onto the optical disc;
A rising mirror that is held in the housing and bends the light emitted from the optical device in the direction of the optical disc;
A beam splitter for branching the reflected light held by the housing and reflected by the optical disc;
An optical pickup device comprising: a light receiving element that is held by the housing and receives the branched reflected light. An optical disk drive device that emits laser light to an optical disk and receives reflected light from the optical disk to read / write data on the optical disk,
An optical pickup device according to claim 14,
A traverse mechanism for moving the optical pickup device in the radial direction of the optical disc;
An optical disc drive apparatus comprising: a drive mechanism for rotating the optical disc.

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