JP2007265801A - Conductive powder and forming method of conductive powder - Google Patents
Conductive powder and forming method of conductive powder Download PDFInfo
- Publication number
- JP2007265801A JP2007265801A JP2006089499A JP2006089499A JP2007265801A JP 2007265801 A JP2007265801 A JP 2007265801A JP 2006089499 A JP2006089499 A JP 2006089499A JP 2006089499 A JP2006089499 A JP 2006089499A JP 2007265801 A JP2007265801 A JP 2007265801A
- Authority
- JP
- Japan
- Prior art keywords
- conductive powder
- fatty acid
- conductive
- ester compound
- methyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 51
- 238000000034 method Methods 0.000 title claims abstract description 25
- -1 fatty acid ester compound Chemical class 0.000 claims abstract description 38
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 32
- 229930195729 fatty acid Natural products 0.000 claims abstract description 32
- 239000000194 fatty acid Substances 0.000 claims abstract description 32
- 239000002245 particle Substances 0.000 claims abstract description 31
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000013585 weight reducing agent Substances 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 235000019387 fatty acid methyl ester Nutrition 0.000 claims description 4
- 238000007561 laser diffraction method Methods 0.000 claims description 3
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 3
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 3
- 239000000314 lubricant Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 230000005494 condensation Effects 0.000 abstract 1
- 238000009833 condensation Methods 0.000 abstract 1
- 125000005907 alkyl ester group Chemical group 0.000 description 31
- FLIACVVOZYBSBS-UHFFFAOYSA-N Methyl palmitate Chemical compound CCCCCCCCCCCCCCCC(=O)OC FLIACVVOZYBSBS-UHFFFAOYSA-N 0.000 description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- QYDYPVFESGNLHU-UHFFFAOYSA-N elaidic acid methyl ester Natural products CCCCCCCCC=CCCCCCCCC(=O)OC QYDYPVFESGNLHU-UHFFFAOYSA-N 0.000 description 8
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 7
- QYDYPVFESGNLHU-KHPPLWFESA-N methyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OC QYDYPVFESGNLHU-KHPPLWFESA-N 0.000 description 7
- 229940073769 methyl oleate Drugs 0.000 description 7
- 230000002776 aggregation Effects 0.000 description 6
- 239000003638 chemical reducing agent Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000004220 aggregation Methods 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 238000006722 reduction reaction Methods 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 4
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 4
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 3
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 3
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000005642 Oleic acid Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 3
- 238000010298 pulverizing process Methods 0.000 description 3
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- LVGKNOAMLMIIKO-UHFFFAOYSA-N Elaidinsaeure-aethylester Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC LVGKNOAMLMIIKO-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ZKHOYAKAFALNQD-UHFFFAOYSA-N Octacosanoic acid methyl ester Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(=O)OC ZKHOYAKAFALNQD-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 235000021314 Palmitic acid Nutrition 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 150000008431 aliphatic amides Chemical class 0.000 description 2
- JAZBEHYOTPTENJ-JLNKQSITSA-N all-cis-5,8,11,14,17-icosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O JAZBEHYOTPTENJ-JLNKQSITSA-N 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- YZXBAPSDXZZRGB-DOFZRALJSA-N arachidonic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCCC(O)=O YZXBAPSDXZZRGB-DOFZRALJSA-N 0.000 description 2
- GLYJVQDYLFAUFC-UHFFFAOYSA-N butyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCCCC GLYJVQDYLFAUFC-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 229960005135 eicosapentaenoic acid Drugs 0.000 description 2
- 235000020673 eicosapentaenoic acid Nutrition 0.000 description 2
- JAZBEHYOTPTENJ-UHFFFAOYSA-N eicosapentaenoic acid Natural products CCC=CCC=CCC=CCC=CCC=CCCCC(O)=O JAZBEHYOTPTENJ-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- RGXWDWUGBIJHDO-UHFFFAOYSA-N ethyl decanoate Chemical compound CCCCCCCCCC(=O)OCC RGXWDWUGBIJHDO-UHFFFAOYSA-N 0.000 description 2
- JIZCYLOUIAIZHQ-UHFFFAOYSA-N ethyl docosenyl Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCC JIZCYLOUIAIZHQ-UHFFFAOYSA-N 0.000 description 2
- XIRNKXNNONJFQO-UHFFFAOYSA-N ethyl hexadecanoate Chemical compound CCCCCCCCCCCCCCCC(=O)OCC XIRNKXNNONJFQO-UHFFFAOYSA-N 0.000 description 2
- MMXKVMNBHPAILY-UHFFFAOYSA-N ethyl laurate Chemical compound CCCCCCCCCCCC(=O)OCC MMXKVMNBHPAILY-UHFFFAOYSA-N 0.000 description 2
- MMKRHZKQPFCLLS-UHFFFAOYSA-N ethyl myristate Chemical compound CCCCCCCCCCCCCC(=O)OCC MMKRHZKQPFCLLS-UHFFFAOYSA-N 0.000 description 2
- MVLVMROFTAUDAG-UHFFFAOYSA-N ethyl octadecanoate Chemical compound CCCCCCCCCCCCCCCCCC(=O)OCC MVLVMROFTAUDAG-UHFFFAOYSA-N 0.000 description 2
- KEMQGTRYUADPNZ-UHFFFAOYSA-N heptadecanoic acid Chemical compound CCCCCCCCCCCCCCCCC(O)=O KEMQGTRYUADPNZ-UHFFFAOYSA-N 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- QSQLTHHMFHEFIY-UHFFFAOYSA-N methyl behenate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OC QSQLTHHMFHEFIY-UHFFFAOYSA-N 0.000 description 2
- YRHYCMZPEVDGFQ-UHFFFAOYSA-N methyl decanoate Chemical compound CCCCCCCCCC(=O)OC YRHYCMZPEVDGFQ-UHFFFAOYSA-N 0.000 description 2
- UQDUPQYQJKYHQI-UHFFFAOYSA-N methyl laurate Chemical compound CCCCCCCCCCCC(=O)OC UQDUPQYQJKYHQI-UHFFFAOYSA-N 0.000 description 2
- ZAZKJZBWRNNLDS-UHFFFAOYSA-N methyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OC ZAZKJZBWRNNLDS-UHFFFAOYSA-N 0.000 description 2
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000510 noble metal Inorganic materials 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- GWHCXVQVJPWHRF-KTKRTIGZSA-N (15Z)-tetracosenoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-KTKRTIGZSA-N 0.000 description 1
- WRJRVEBUZGQDMO-SNPVRQPZSA-N (5Z,8Z,11Z,14Z)-2-butylicosa-5,8,11,14-tetraenoic acid Chemical compound C(CCC)C(C(=O)O)CC\C=C/C\C=C/C\C=C/C\C=C/CCCCC WRJRVEBUZGQDMO-SNPVRQPZSA-N 0.000 description 1
- DSQFSRAJFCOGKA-GKFVBPDJSA-N (5z,8z,11z,14z)-2-ethylicosa-5,8,11,14-tetraenoic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCC(CC)C(O)=O DSQFSRAJFCOGKA-GKFVBPDJSA-N 0.000 description 1
- ZEBIJPXNSBSHGD-ZKWNWVNESA-N (5z,8z,11z,14z)-2-methylicosa-5,8,11,14-tetraenoic acid Chemical compound CCCCC\C=C/C\C=C/C\C=C/C\C=C/CCC(C)C(O)=O ZEBIJPXNSBSHGD-ZKWNWVNESA-N 0.000 description 1
- KTPJUDRZVMRTFF-GJDCDIHCSA-N (6Z,9Z,12Z,15Z)-2-methyloctadeca-6,9,12,15-tetraenoic acid Chemical compound CC(C(=O)O)CCC\C=C/C\C=C/C\C=C/C\C=C/CC KTPJUDRZVMRTFF-GJDCDIHCSA-N 0.000 description 1
- CUXYLFPMQMFGPL-UHFFFAOYSA-N (9Z,11E,13E)-9,11,13-Octadecatrienoic acid Natural products CCCCC=CC=CC=CCCCCCCCC(O)=O CUXYLFPMQMFGPL-UHFFFAOYSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- 239000001149 (9Z,12Z)-octadeca-9,12-dienoate Substances 0.000 description 1
- WTTJVINHCBCLGX-UHFFFAOYSA-N (9trans,12cis)-methyl linoleate Natural products CCCCCC=CCC=CCCCCCCCC(=O)OC WTTJVINHCBCLGX-UHFFFAOYSA-N 0.000 description 1
- LNTRHPGGUOWBBM-KHPPLWFESA-N (Z)-2-methyltetracos-15-enoic acid Chemical compound CC(C(=O)O)CCCCCCCCCCCC\C=C/CCCCCCCC LNTRHPGGUOWBBM-KHPPLWFESA-N 0.000 description 1
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 description 1
- DJHVICOPLAQAGI-UHFFFAOYSA-N 18-methylnonadecan-1-amine Chemical compound CC(C)CCCCCCCCCCCCCCCCCN DJHVICOPLAQAGI-UHFFFAOYSA-N 0.000 description 1
- XUQBFMJGHHYFCP-UHFFFAOYSA-N 2-(2-chloroethyl)-3,4,5,6-tetrahydro-1h-2-benzazocine;hydrochloride Chemical compound Cl.C1N(CCCl)CCCCC2=CC=CC=C21 XUQBFMJGHHYFCP-UHFFFAOYSA-N 0.000 description 1
- LNJCGNRKWOHFFV-UHFFFAOYSA-N 3-(2-hydroxyethylsulfanyl)propanenitrile Chemical compound OCCSCCC#N LNJCGNRKWOHFFV-UHFFFAOYSA-N 0.000 description 1
- KOJYENXGDXRGDK-ZUGARUELSA-N 9(Z),11(E),13(E)-Octadecatrienoic Acid methyl ester Chemical compound CCCC\C=C\C=C\C=C/CCCCCCCC(=O)OC KOJYENXGDXRGDK-ZUGARUELSA-N 0.000 description 1
- LVGKNOAMLMIIKO-VAWYXSNFSA-N 9-Octadecenoic acid, ethyl ester Chemical compound CCCCCCCC\C=C\CCCCCCCC(=O)OCC LVGKNOAMLMIIKO-VAWYXSNFSA-N 0.000 description 1
- YWWVWXASSLXJHU-UHFFFAOYSA-N 9E-tetradecenoic acid Natural products CCCCC=CCCCCCCCC(O)=O YWWVWXASSLXJHU-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 235000021357 Behenic acid Nutrition 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- NDKYEUQMPZIGFN-UHFFFAOYSA-N Butyl dodecanoate Chemical compound CCCCCCCCCCCC(=O)OCCCC NDKYEUQMPZIGFN-UHFFFAOYSA-N 0.000 description 1
- GIXDXHXNKIMPGR-QXMHVHEDSA-N C(C)C(C(=O)O)CCCCCCCCCCCC\C=C/CCCCCCCC Chemical compound C(C)C(C(=O)O)CCCCCCCCCCCC\C=C/CCCCCCCC GIXDXHXNKIMPGR-QXMHVHEDSA-N 0.000 description 1
- CWKFRJBZHHXVDT-SEYXRHQNSA-N C(CCC)C(C(=O)O)CCCCCCCCCCCC\C=C/CCCCCCCC Chemical compound C(CCC)C(C(=O)O)CCCCCCCCCCCC\C=C/CCCCCCCC CWKFRJBZHHXVDT-SEYXRHQNSA-N 0.000 description 1
- MCLJLXPQIZSNLW-KUXGPOOQSA-N C(CCC)C(C(=O)O)CCC\C=C/C\C=C/C\C=C/C\C=C/CC Chemical compound C(CCC)C(C(=O)O)CCC\C=C/C\C=C/C\C=C/C\C=C/CC MCLJLXPQIZSNLW-KUXGPOOQSA-N 0.000 description 1
- HHVGFXQQBNQVIO-UHFFFAOYSA-N C(CCC)OC(C=CC=CC=CC=CC=CC=CCCCCCCCCC)=O Chemical compound C(CCC)OC(C=CC=CC=CC=CC=CC=CCCCCCCCCC)=O HHVGFXQQBNQVIO-UHFFFAOYSA-N 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- 229920000064 Ethyl eicosapentaenoic acid Polymers 0.000 description 1
- PTEYJUIKYIKULL-UHFFFAOYSA-N Ethyl pentadecanoate Chemical compound CCCCCCCCCCCCCCC(=O)OCC PTEYJUIKYIKULL-UHFFFAOYSA-N 0.000 description 1
- OPGOLNDOMSBSCW-CLNHMMGSSA-N Fursultiamine hydrochloride Chemical compound Cl.C1CCOC1CSSC(\CCO)=C(/C)N(C=O)CC1=CN=C(C)N=C1N OPGOLNDOMSBSCW-CLNHMMGSSA-N 0.000 description 1
- DCXXMTOCNZCJGO-UHFFFAOYSA-N Glycerol trioctadecanoate Natural products CCCCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCCCC DCXXMTOCNZCJGO-UHFFFAOYSA-N 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 235000021353 Lignoceric acid Nutrition 0.000 description 1
- CQXMAMUUWHYSIY-UHFFFAOYSA-N Lignoceric acid Natural products CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCC1=CC=C(O)C=C1 CQXMAMUUWHYSIY-UHFFFAOYSA-N 0.000 description 1
- QYDYPVFESGNLHU-ZHACJKMWSA-N Methyl (9E)-9-octadecenoate Chemical compound CCCCCCCC\C=C\CCCCCCCC(=O)OC QYDYPVFESGNLHU-ZHACJKMWSA-N 0.000 description 1
- PKIXXJPMNDDDOS-UHFFFAOYSA-N Methyl linoleate Natural products CCCCC=CCCC=CCCCCCCCC(=O)OC PKIXXJPMNDDDOS-UHFFFAOYSA-N 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- XJXROGWVRIJYMO-SJDLZYGOSA-N Nervonic acid Natural products O=C(O)[C@@H](/C=C/CCCCCCCC)CCCCCCCCCCCC XJXROGWVRIJYMO-SJDLZYGOSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000021319 Palmitoleic acid Nutrition 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000021322 Vaccenic acid Nutrition 0.000 description 1
- UWHZIFQPPBDJPM-FPLPWBNLSA-M Vaccenic acid Natural products CCCCCC\C=C/CCCCCCCCCC([O-])=O UWHZIFQPPBDJPM-FPLPWBNLSA-M 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- CUXYLFPMQMFGPL-SUTYWZMXSA-N all-trans-octadeca-9,11,13-trienoic acid Chemical compound CCCC\C=C\C=C\C=C\CCCCCCCC(O)=O CUXYLFPMQMFGPL-SUTYWZMXSA-N 0.000 description 1
- DTOSIQBPPRVQHS-PDBXOOCHSA-N alpha-linolenic acid Chemical compound CC\C=C/C\C=C/C\C=C/CCCCCCCC(O)=O DTOSIQBPPRVQHS-PDBXOOCHSA-N 0.000 description 1
- 235000020661 alpha-linolenic acid Nutrition 0.000 description 1
- 229940114079 arachidonic acid Drugs 0.000 description 1
- 235000021342 arachidonic acid Nutrition 0.000 description 1
- OFIDNKMQBYGNIW-UHFFFAOYSA-N arachidonic acid methyl ester Natural products CCCCCC=CCC=CCC=CCC=CCCCC(=O)OC OFIDNKMQBYGNIW-UHFFFAOYSA-N 0.000 description 1
- 229940116226 behenic acid Drugs 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- SVGGKWILBMPIJV-UTJQPWESSA-N butyl (9z,12z)-octadeca-9,12-dienoate Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(=O)OCCCC SVGGKWILBMPIJV-UTJQPWESSA-N 0.000 description 1
- QQNROWCMALTXCD-XQOKXTRKSA-N butyl (9z,12z,15z)-octadeca-9,12,15-trienoate Chemical compound CCCCOC(=O)CCCCCCC\C=C/C\C=C/C\C=C/CC QQNROWCMALTXCD-XQOKXTRKSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-OUKQBFOZSA-N butyl (e)-octadec-9-enoate Chemical compound CCCCCCCC\C=C\CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-OUKQBFOZSA-N 0.000 description 1
- YWDFWMANHUYCIY-KHPPLWFESA-N butyl (z)-hexadec-9-enoate Chemical compound CCCCCC\C=C/CCCCCCCC(=O)OCCCC YWDFWMANHUYCIY-KHPPLWFESA-N 0.000 description 1
- LFMBHXDRHWERDI-HJWRWDBZSA-N butyl (z)-tetradec-9-enoate Chemical compound CCCCOC(=O)CCCCCCC\C=C/CCCC LFMBHXDRHWERDI-HJWRWDBZSA-N 0.000 description 1
- ZRNCNTSXSYXHOW-UHFFFAOYSA-N butyl decanoate Chemical compound CCCCCCCCCC(=O)OCCCC ZRNCNTSXSYXHOW-UHFFFAOYSA-N 0.000 description 1
- SLUTZBDOCDXRSH-UHFFFAOYSA-N butyl docosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCC(=O)OCCCC SLUTZBDOCDXRSH-UHFFFAOYSA-N 0.000 description 1
- WZRBMKGXBAVSQL-UHFFFAOYSA-N butyl icosanoate Chemical compound CCCCCCCCCCCCCCCCCCCC(=O)OCCCC WZRBMKGXBAVSQL-UHFFFAOYSA-N 0.000 description 1
- SFKAGUQNIDQIQI-UHFFFAOYSA-N butyl octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCCC SFKAGUQNIDQIQI-UHFFFAOYSA-N 0.000 description 1
- KRMLKIYWYMUWHP-UHFFFAOYSA-N butyl pentadecanoate Chemical compound CCCCCCCCCCCCCCC(=O)OCCCC KRMLKIYWYMUWHP-UHFFFAOYSA-N 0.000 description 1
- AKFTUIYQTXLHIH-UHFFFAOYSA-N butyl tetracosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCCCC AKFTUIYQTXLHIH-UHFFFAOYSA-N 0.000 description 1
- DHAZIUXMHRHVMP-UHFFFAOYSA-N butyl tetradecanoate Chemical compound CCCCCCCCCCCCCC(=O)OCCCC DHAZIUXMHRHVMP-UHFFFAOYSA-N 0.000 description 1
- SECPZKHBENQXJG-UHFFFAOYSA-N cis-palmitoleic acid Natural products CCCCCCC=CCCCCCCCC(O)=O SECPZKHBENQXJG-UHFFFAOYSA-N 0.000 description 1
- GWHCXVQVJPWHRF-UHFFFAOYSA-N cis-tetracosenoic acid Natural products CCCCCCCCC=CCCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-UHFFFAOYSA-N 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229940090949 docosahexaenoic acid Drugs 0.000 description 1
- 235000020669 docosahexaenoic acid Nutrition 0.000 description 1
- VCDLWFYODNTQOT-UHFFFAOYSA-N docosahexaenoic acid methyl ester Natural products CCC=CCC=CCC=CCC=CCC=CCC=CCCC(=O)OC VCDLWFYODNTQOT-UHFFFAOYSA-N 0.000 description 1
- 229940066279 eicosapentaenoate Drugs 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- WFZQLUSOXHIVKL-QXMHVHEDSA-N ethyl (13Z)-docosenoate Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(=O)OCC WFZQLUSOXHIVKL-QXMHVHEDSA-N 0.000 description 1
- ITNKVODZACVXDS-YATCGRJWSA-N ethyl (4e,7e,10e,13e,16e,19e)-docosa-4,7,10,13,16,19-hexaenoate Chemical compound CCOC(=O)CC\C=C\C\C=C\C\C=C\C\C=C\C\C=C\C\C=C\CC ITNKVODZACVXDS-YATCGRJWSA-N 0.000 description 1
- SSQPWTVBQMWLSZ-AAQCHOMXSA-N ethyl (5Z,8Z,11Z,14Z,17Z)-icosapentaenoate Chemical compound CCOC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CC SSQPWTVBQMWLSZ-AAQCHOMXSA-N 0.000 description 1
- XZMSLYSQJNCDQH-MDZDMXLPSA-N ethyl (e)-octadec-11-enoate Chemical compound CCCCCC\C=C\CCCCCCCCCC(=O)OCC XZMSLYSQJNCDQH-MDZDMXLPSA-N 0.000 description 1
- FARYTWBWLZAXNK-WAYWQWQTSA-N ethyl (z)-3-(methylamino)but-2-enoate Chemical compound CCOC(=O)\C=C(\C)NC FARYTWBWLZAXNK-WAYWQWQTSA-N 0.000 description 1
- SVEDZEIUAKXCCX-FPLPWBNLSA-N ethyl 9Z-tetradecenoate Chemical compound CCCC\C=C/CCCCCCCC(=O)OCC SVEDZEIUAKXCCX-FPLPWBNLSA-N 0.000 description 1
- YBKSMWBLSBAFBQ-UHFFFAOYSA-N ethyl arachidate Chemical compound CCCCCCCCCCCCCCCCCCCC(=O)OCC YBKSMWBLSBAFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- KNXMUFRWYNVISA-UHFFFAOYSA-N ethyl heptadecanoate Chemical compound CCCCCCCCCCCCCCCCC(=O)OCC KNXMUFRWYNVISA-UHFFFAOYSA-N 0.000 description 1
- FMMOOAYVCKXGMF-MURFETPASA-N ethyl linoleate Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(=O)OCC FMMOOAYVCKXGMF-MURFETPASA-N 0.000 description 1
- 229940031016 ethyl linoleate Drugs 0.000 description 1
- JYYFMIOPGOFNPK-AGRJPVHOSA-N ethyl linolenate Chemical compound CCOC(=O)CCCCCCC\C=C/C\C=C/C\C=C/CC JYYFMIOPGOFNPK-AGRJPVHOSA-N 0.000 description 1
- 229940090028 ethyl linolenate Drugs 0.000 description 1
- JYYFMIOPGOFNPK-UHFFFAOYSA-N ethyl linolenate Natural products CCOC(=O)CCCCCCCC=CCC=CCC=CCC JYYFMIOPGOFNPK-UHFFFAOYSA-N 0.000 description 1
- BAIGIFRMHRSNIM-UHFFFAOYSA-N ethyl octacosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(=O)OCC BAIGIFRMHRSNIM-UHFFFAOYSA-N 0.000 description 1
- LVGKNOAMLMIIKO-QXMHVHEDSA-N ethyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC LVGKNOAMLMIIKO-QXMHVHEDSA-N 0.000 description 1
- 229940093471 ethyl oleate Drugs 0.000 description 1
- 229940067592 ethyl palmitate Drugs 0.000 description 1
- JELGPLUONQGOHF-KTKRTIGZSA-N ethyl palmitoleate Chemical compound CCCCCC\C=C/CCCCCCCC(=O)OCC JELGPLUONQGOHF-KTKRTIGZSA-N 0.000 description 1
- AKXFYSSXNQQBNT-UHFFFAOYSA-N ethyl tetracosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(=O)OCC AKXFYSSXNQQBNT-UHFFFAOYSA-N 0.000 description 1
- ZYNDJIBBPLNPOW-UHFFFAOYSA-N eurucic acid methyl ester Natural products CCCCCCCCC=CCCCCCCCCCCCC(=O)OC ZYNDJIBBPLNPOW-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229960002600 icosapent ethyl Drugs 0.000 description 1
- FMMOOAYVCKXGMF-UHFFFAOYSA-N linoleic acid ethyl ester Natural products CCCCCC=CCC=CCCCCCCCC(=O)OCC FMMOOAYVCKXGMF-UHFFFAOYSA-N 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- PVVODBCDJBGMJL-CMDGGOBGSA-N methyl (e)-octadec-11-enoate Chemical compound CCCCCC\C=C\CCCCCCCCCC(=O)OC PVVODBCDJBGMJL-CMDGGOBGSA-N 0.000 description 1
- QGBRLVONZXHAKJ-UHFFFAOYSA-N methyl arachidate Chemical compound CCCCCCCCCCCCCCCCCCCC(=O)OC QGBRLVONZXHAKJ-UHFFFAOYSA-N 0.000 description 1
- ZYNDJIBBPLNPOW-KHPPLWFESA-N methyl erucate Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(=O)OC ZYNDJIBBPLNPOW-KHPPLWFESA-N 0.000 description 1
- HUEBIMLTDXKIPR-UHFFFAOYSA-N methyl heptadecanoate Chemical compound CCCCCCCCCCCCCCCCC(=O)OC HUEBIMLTDXKIPR-UHFFFAOYSA-N 0.000 description 1
- RWIPSJUSVXDVPB-SREVYHEPSA-N methyl myristoleate Chemical compound CCCC\C=C/CCCCCCCC(=O)OC RWIPSJUSVXDVPB-SREVYHEPSA-N 0.000 description 1
- IZFGRAGOVZCUFB-HJWRWDBZSA-N methyl palmitoleate Chemical compound CCCCCC\C=C/CCCCCCCC(=O)OC IZFGRAGOVZCUFB-HJWRWDBZSA-N 0.000 description 1
- XIUXKAZJZFLLDQ-UHFFFAOYSA-N methyl pentadecanoate Chemical compound CCCCCCCCCCCCCCC(=O)OC XIUXKAZJZFLLDQ-UHFFFAOYSA-N 0.000 description 1
- XUDJZDNUVZHSKZ-UHFFFAOYSA-N methyl tetracosanoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCCC(=O)OC XUDJZDNUVZHSKZ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- MOFOBJHOKRNACT-UHFFFAOYSA-N nickel silver Chemical compound [Ni].[Ag] MOFOBJHOKRNACT-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 150000004671 saturated fatty acids Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- BSWGGJHLVUUXTL-UHFFFAOYSA-N silver zinc Chemical compound [Zn].[Ag] BSWGGJHLVUUXTL-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- JIWBIWFOSCKQMA-UHFFFAOYSA-N stearidonic acid Natural products CCC=CCC=CCC=CCC=CCCCCC(O)=O JIWBIWFOSCKQMA-UHFFFAOYSA-N 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- UWHZIFQPPBDJPM-BQYQJAHWSA-N trans-vaccenic acid Chemical compound CCCCCC\C=C\CCCCCCCCCC(O)=O UWHZIFQPPBDJPM-BQYQJAHWSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009692 water atomization Methods 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
本発明は、導電性粉末及び導電性粉末の作製方法に関するものである。 The present invention relates to a conductive powder and a method for producing a conductive powder.
導電性の粉末を有機バインダーに分散した導電性ペーストは、電子部品等の電極や回路の形成、プリント配線基板のスルーホール接続、配線クロスオーバー用、半導体素子の接着、ヒートシンクなどの放熱部材の接着、さらには電磁波シールド用など多岐にわたる用途で使用されている。このような導電性ペーストに使用される導電性粉末は化学還元法、電解法、アトマイズ法などで得られた導電性粒子をスタンプミル、アトライター、ボールミルなどの粉砕機を使用して粉砕(フレーク化)して用いることが一般的である。ここでフレーク化工程においては導電性粒子同士の凝集を防ぐ目的で脂肪酸、脂肪酸塩、高級脂肪族アルコール、高級脂肪族アルコールのエステル、高級脂肪族アミン、高級脂肪族アミド、ポリエチレンワックスなどが滑剤として使用されている(例えば特許文献1〜3参照)。また、導電性を確保するため、フレーク化工程後に滑剤を除去している。(例えば特許文献3参照)
近年導電性ペーストに対する要求も一段と厳しくなってきており、特に環境対応としての鉛フリー化に伴う半田代替用、電極の極小化、回路の微細化などによりこれまで以上に良好な導電性が求められてきているが、従来から使用されてきた脂肪酸などからなる滑剤は金属表面と強固に結合し得られた導電性粉末の表面に残存し、導電性の更なる向上を困難なものにしていた。
In recent years, the demand for conductive pastes has become more stringent. In particular, better electrical conductivity is required than ever, due to solder replacement, electrode miniaturization, circuit miniaturization, etc., as a lead-free product for the environment. However, conventionally used lubricants such as fatty acids remain on the surface of the conductive powder obtained by being firmly bonded to the metal surface, making it difficult to further improve the conductivity.
本発明は、導電性ペーストとして用いた場合に良好な導電性を示すことが可能な導電性粉末及びその作製方法を提供するものである。 The present invention provides a conductive powder capable of exhibiting good conductivity when used as a conductive paste, and a method for manufacturing the same.
このような目的は、下記[1]〜[8]に記載の本発明により達成される。
[1]導電性粒子と脂肪酸エステル化合物を含むことを特徴とする導電性粉末。
[2]前記脂肪酸エステル化合物が炭素数10以上30以下の脂肪酸のアルキルエステル化合物である[1]項に記載の導電性粉末。
[3]前記脂肪酸エステル化合物が脂肪酸のメチルエステル化合物である[1]又は[2]項に記載の導電性粉末。
[4]前記脂肪酸エステル化合物が不飽和脂肪酸のエステル化合物である[1]〜[3]項のいずれか1項に記載の導電性粉末。
[5]前記導電性粒子が銀である[1]〜[4]項のいずれか1項に記載の導電性粉末。
[6]示唆熱天秤(TGA)にて測定した重量減少率が0.05重量%以上2重量%以下である[1]〜[5]項のいずれか1項に記載の導電性粉末。
[7]レーザー回折法による50%平均粒径が1μm以上50μm以下である[1]〜[6]項のいずれか1項に記載の導電性粉末。
[8][1]〜[7]項のいずれか1項に記載の導電性粉末の製造方法であって、導電性粒子のフレーク化工程において脂肪酸エステル化合物を使用することを特徴とする導電性粉末の作製方法。
Such an object is achieved by the present invention described in the following [1] to [8].
[1] A conductive powder comprising conductive particles and a fatty acid ester compound.
[2] The conductive powder according to item [1], wherein the fatty acid ester compound is an alkyl ester compound of a fatty acid having 10 to 30 carbon atoms.
[3] The conductive powder according to item [1] or [2], wherein the fatty acid ester compound is a fatty acid methyl ester compound.
[4] The conductive powder according to any one of [1] to [3], wherein the fatty acid ester compound is an ester compound of an unsaturated fatty acid.
[5] The conductive powder according to any one of [1] to [4], wherein the conductive particles are silver.
[6] The conductive powder according to any one of [1] to [5], wherein a weight reduction rate measured by a suggested thermobalance (TGA) is 0.05% by weight or more and 2% by weight or less.
[7] The conductive powder according to any one of [1] to [6], wherein the 50% average particle size by laser diffraction method is 1 μm or more and 50 μm or less.
[8] A method for producing a conductive powder according to any one of items [1] to [7], wherein a fatty acid ester compound is used in the flaking step of the conductive particles. Powder production method.
本発明の導電性粉末は、導電性ペーストに用いた場合にこれまで以上に良好な導電性を発揮する導電性粉末を得ることができる。 When the conductive powder of the present invention is used in a conductive paste, a conductive powder that exhibits better conductivity than ever can be obtained.
本発明の導電性粉末は、導電性粒子と脂肪酸エステル化合物を含む導電性粉末であり、得られた導電性粉末を使用した導電性ペーストは特に良好な導電性を示すものである。
以下、本発明について詳細に説明する。
The conductive powder of the present invention is a conductive powder containing conductive particles and a fatty acid ester compound, and a conductive paste using the obtained conductive powder exhibits particularly good conductivity.
Hereinafter, the present invention will be described in detail.
本発明で用いる導電性粒子としては導電性を有するものであれば使用可能であるが、金属粒子が好ましい。好ましい金属粒子としては銀、金、白金、パラジウムなどの貴金属粒子、銅、銅合金、ニッケルなどの非貴金属粒子が挙げられるが、特に好ましいものは銀である。ここで銀とは純銀又は銀合金である。銀合金としては銀を50重量%以上、好ましくは70重量%以上含有する銀−銅合金、銀−パラジウム合金、銀−錫合金、銀−亜鉛合金、銀−マグネシウム合金、銀−ニッケル合金などが挙げられる。銀が好ましいのは良好な導電性、熱伝導性を有する上に酸化されにくく加工性にも優れるからである。
導電性粒子の平均粒径は0.5μm以上30μm以下のものが好ましく、より好ましい平均粒径は0.5μm以上10μm以下である。この範囲内であると、凝集が発生しにくく、導電性が良好である。
The conductive particles used in the present invention can be used as long as they have conductivity, but metal particles are preferred. Preferred metal particles include noble metal particles such as silver, gold, platinum, and palladium, and non-noble metal particles such as copper, copper alloy, and nickel, with silver being particularly preferred. Here, silver is pure silver or a silver alloy. Examples of the silver alloy include silver-copper alloy, silver-palladium alloy, silver-tin alloy, silver-zinc alloy, silver-magnesium alloy, silver-nickel alloy containing 50% by weight or more, preferably 70% by weight or more of silver. Can be mentioned. Silver is preferable because it has good electrical conductivity and thermal conductivity, and is difficult to be oxidized and has excellent workability.
The average particle diameter of the conductive particles is preferably from 0.5 μm to 30 μm, and the more preferable average particle diameter is from 0.5 μm to 10 μm. Within this range, aggregation is unlikely to occur and the conductivity is good.
本発明で用いる脂肪酸エステル化合物は、導電性粒子のフレーク化処理の滑剤として用いるものである。これは一般的に使用されている脂肪酸を使用した場合に比べて得られた導電性粉末を導電性ペーストとして評価した場合良好な導電性を示すためである。脂肪酸エステル化合物としては炭素数が10以上30以下の脂肪酸のアルキルエステル化合物が好ましい。さらに好ましいのは炭素数が14以上20以下の脂肪酸のアルキルエステル化合物である。上限値より少ない場合にはフレーク化処理後の乾燥工程で揮発してしまい凝集の原因となり、下限値より多い場合にはフレーク化処理中の分散が悪く効果的にフレーク化できないからである。 The fatty acid ester compound used in the present invention is used as a lubricant for flaking conductive particles. This is for showing favorable electroconductivity, when the electroconductive powder obtained compared with the case where the fatty acid generally used is used is evaluated as an electroconductive paste. The fatty acid ester compound is preferably an alkyl ester compound of a fatty acid having 10 to 30 carbon atoms. More preferred are alkyl ester compounds of fatty acids having 14 to 20 carbon atoms. This is because if it is less than the upper limit value, it volatilizes in the drying step after the flaking process and causes aggregation, and if it exceeds the lower limit value, the dispersion during the flaking process is poor and the flakes cannot be effectively flaked.
このような化合物としては、例えば、飽和脂肪酸のアルキルエステル化合物として、カプリン酸メチル、カプリン酸エチル、カプリン酸ブチル、カプリン酸のその他アルキルエステル、ラウリン酸メチル、ラウリン酸エチル、ラウリン酸ブチル、ラウリン酸のその他アルキルエステル、ミリスチン酸メチル、ミリスチン酸エチル、ミリスチン酸ブチル、ミリスチン酸のその他アルキルエステル、ペンタデシル酸メチル、ペンタデシル酸エチル、ペンタデシル酸ブチル、ペンタデシル酸のその他アルキルエステル、パルミチン酸メチル、パルミチン酸エチル、パルミチン酸ブチル、パルミチン酸のその他アルキルエステル、マーガリン酸メチル、マーガリン酸エチル、マーガリン酸ブチル、マーガリン酸のその他アルキルエステル、ステアリン酸メチル、ステアリン酸エチル、ステアリン酸ブチル、ステアリン酸のその他アルキルエステル、アラキジン酸メチル、アラキジン酸エチル、アラキジン酸ブチル、アラキジン酸のその他アルキルエステル、ベヘン酸メチル、ベヘン酸エチル、ベヘン酸ブチル、ベヘン酸のその他アルキルエステル、リグノセリン酸メチル、リグノセリン酸エチル、リグノセリン酸ブチル、リグノセリン酸のその他アルキルエステル、セロチン酸メチル、セロチン酸エチル、セロチン酸ブチル、セロチン酸のその他アルキルエステル、モンタン酸メチル、モンタン酸エチル、モンタン酸ブチル、モンタン酸のその他アルキルエステル、メリシン酸メチル、メリシン酸エチル、メリシン酸ブチル、メリシン酸のその他アルキルエステルなどが挙げられ、不飽和脂肪酸のアルキルエステルとして、ミリストレイン酸メチル、ミリストレイン酸エチル、ミリストレイン酸ブチル、ミリストレイン酸のその他アルキルエステル、パルミトレイン酸メチル、パルミトレイン酸エチル、パルミトレイン酸ブチル、パルミトレイン酸のその他アルキルエステル、オレイン酸メチル、オレイン酸エチル、オレイン酸ブチル、オレイン酸のその他アルキルエステル、エライジン酸メチル、エライジン酸エチル、エライジン酸ブチル、エライジン酸のその他アルキルエステル、バクセン酸メチル、バクセン酸エチル、バクセン酸ブチル、バクセン酸のその他アルキルエステル、ガドレイン酸メチル、ガドレイン酸エチル、ガドレイン酸ブチル、ガドレイン酸のその他アルキルエステル、エルカ酸メチル、エルカ酸エチル、エルカ酸ブチル、エルカ酸のその他アルキルエステル、ネルボン酸メチル、ネルボン酸エチル、ネルボン酸ブチル、ネルボン酸のその他アルキルエステル、リノール酸メチル、リノール酸エチル、リノール酸ブチル、リノール酸のその他アルキルエステル、リノレン酸メチル、リノレン酸エチル、リノレン酸ブチル、リノレン酸のその他アルキルエステル、エレオステアリン酸メチル、エレオステアリン酸エチル、エレオステアリン酸ブチル、エレオステアリン酸のその他アルキルエステル、ステアリドン酸メチル、ステアリドン酸エチル、ステアリドン酸ブチル、ステアリドン酸のその他アルキルエステル、アラキドン酸メチル、アラキドン酸エチル、アラキドン酸ブチル、アラキドン酸のその他アルキルエステル、エイコサペンタエン酸メチル、エイコサペンタエン酸エチル、エイコサペンタエン酸ブチル、エイコサペンタエン酸のその他アルキルエステル、イワシ酸メチル、イワシ酸エチル、イワシ酸ブチル、イワシ酸のその他アルキルエステル、ドコサヘキサエン酸メチル、ドコサヘキサエン酸エチル、ドコサヘキサエン酸ブチル、ドコサヘキサエン酸のその他アルキルエステルなどが挙げられ、これらは単独でも複数種を併用してもかまわない。 Examples of such compounds include saturated fatty acid alkyl ester compounds such as methyl caprate, ethyl caprate, butyl caprate, other alkyl esters of capric acid, methyl laurate, ethyl laurate, butyl laurate, and lauric acid. Other alkyl esters, methyl myristate, ethyl myristate, butyl myristate, other alkyl esters of myristic acid, methyl pentadecylate, ethyl pentadecylate, butyl pentadecylate, other alkyl esters of pentadecyl acid, methyl palmitate, ethyl palmitate , Butyl palmitate, other alkyl esters of palmitic acid, methyl margarate, ethyl margarate, butyl margarate, other alkyl esters of margaric acid, stearin Methyl, ethyl stearate, butyl stearate, other alkyl esters of stearic acid, methyl arachidate, ethyl arachidate, butyl arachidate, other alkyl esters of arachidic acid, methyl behenate, ethyl behenate, butyl behenate, behenic acid Other alkyl esters, methyl lignocerate, ethyl lignocerate, butyl lignocerate, other alkyl esters of lignoceric acid, methyl serotic acid, ethyl serotic acid, butyl serotic acid, other alkyl esters of serotic acid, methyl montanate, ethyl montanate , Butyl montanate, other alkyl esters of montanic acid, methyl melicinate, ethyl melicinate, butyl melicinate, other alkyl esters of melicic acid, etc. As the alkyl ester of acid, methyl myristoleate, ethyl myristoleate, butyl myristoleate, other alkyl esters of myristoleic acid, methyl palmitoleate, ethyl palmitoleate, butyl palmitoleate, other alkyl esters of palmitoleic acid, oleic acid Methyl, ethyl oleate, butyl oleate, other alkyl esters of oleic acid, methyl elaidate, ethyl elaidate, butyl elaidate, other alkyl esters of elaidic acid, methyl vaccenate, ethyl vaccenate, butyl vacceate, vaccenic acid Other alkyl esters such as methyl gadrate, ethyl gadrate, butyl gadrate, other alkyl esters of gadrate, methyl erucate, ethyl erucate, Butyl lucate, other alkyl esters of erucic acid, methyl nervonic acid, ethyl nervonic acid, butyl nervonic acid, other alkyl esters of nervonic acid, methyl linoleate, ethyl linoleate, butyl linoleate, other alkyl esters of linoleic acid, linolenic Methyl acid, ethyl linolenate, butyl linolenate, other alkyl esters of linolenic acid, methyl eleostearate, ethyl eleostearate, butyl eleostearate, other alkyl esters of eleostearic acid, methyl stearidonic acid, stearidone Ethyl ester, butyl stearidonic acid, other alkyl esters of stearidonic acid, methyl arachidonic acid, ethyl arachidonic acid, butyl arachidonic acid, other alkyl esters of arachidonic acid, eicosapentaenoic acid , Ethyl eicosapentaenoate, butyl eicosapentaenoate, other alkyl esters of eicosapentaenoic acid, methyl sardate, ethyl sardate, butyl sardate, other alkyl esters of sardate, methyl docosahexaenoate, ethyl docosahexaenoate, butyl docosahexaenoate And other alkyl esters of docosahexaenoic acid, and these may be used alone or in combination.
好ましいものとしては、脂肪酸のメチルエステル化合物であり、パルミチン酸メチル、パルミトレイン酸メチル及びオレイン酸メチルのなかから選ばれる少なくとも1種であり、パルミチン酸メチル、パルミトレイン酸メチル及びオレイン酸メチルのなかから選ばれる少なくとも1種とその他の飽和脂肪酸のメチルエステル化合物との併用である。さらに好ましいものとしては、不飽和脂肪酸のメチルエステル化合物であるパルミトレイン酸メチル及びオレイン酸メチルのなかから選ばれる少なくとも1種であり、パルミトレイン酸メチル及びオレイン酸メチルのなかから選ばれる少なくとも1種と飽和脂肪酸のメチルエステル化合物との併用である。また脂肪酸、脂肪酸塩、高級脂肪族アルコール、高級脂肪族アルコールのエステル、高級脂肪族アミン、高級脂肪族アミド、ポリエチレンワックスなどとの併用も可能である。 Preferred is a methyl ester compound of a fatty acid, at least one selected from methyl palmitate, methyl palmitate and methyl oleate, and selected from methyl palmitate, methyl palmitate and methyl oleate In combination with at least one selected from the above and other saturated fatty acid methyl ester compounds. More preferably, it is at least one selected from methyl palmitate and methyl oleate which are methyl ester compounds of unsaturated fatty acids, and saturated with at least one selected from methyl palmitate and methyl oleate. It is a combined use with a fatty acid methyl ester compound. Further, fatty acids, fatty acid salts, higher aliphatic alcohols, esters of higher aliphatic alcohols, higher aliphatic amines, higher aliphatic amides, polyethylene wax and the like can be used in combination.
導電性粒子と脂肪酸エステル化合物を含む導電性粉末の製造方法は、機械的粉砕法、化学還元法、電解法、アトマイズ法などの方法により得られた導電性粒子をスタンプミル、アトライター、ボールミルなどの粉砕機を使用して粉砕(フレーク化)するフレーク化工程において脂肪酸エステル化合物を滑剤として使用するものである。
導電性粒子は、機械的粉砕法等でも得ることは可能であるが、導電性粒子の種類によっては目的とする粒径が得られない等不具合が発生する場合があり、化学還元法、電解法、アトマイズ法のいずれかにより得られることが好ましい。
特に10μmより小さい銀粒子が必要な場合には、溶融金属を水中に噴霧する水アトマイズ法又は硝酸銀溶液を還元剤により還元する化学還元法が適している。
The method for producing the conductive powder containing the conductive particles and the fatty acid ester compound is obtained by using a mechanical milling method, a chemical reduction method, an electrolytic method, an atomizing method, etc. The fatty acid ester compound is used as a lubricant in the flaking process for pulverizing (flaking) using a pulverizer.
Conductive particles can be obtained by mechanical pulverization, etc., but there may be problems such as the target particle size not being obtained depending on the type of conductive particles, chemical reduction method, electrolytic method It is preferably obtained by any of the atomizing methods.
In particular, when silver particles smaller than 10 μm are required, a water atomization method in which molten metal is sprayed into water or a chemical reduction method in which a silver nitrate solution is reduced with a reducing agent is suitable.
脂肪酸エステル化合物は得られる導電性粉末の表面積1m2あたり0.005g以上0.5g以下となるように使用することが好ましい。この範囲内であればフレーク化工程中に凝集が発生せず、良好な導電性を得ることができる。これより少ないとフレーク化工程中に凝集が発生しやすく、これより多いと得られた導電性粉末に残存する脂肪酸エステル化合物が多くなりすぎ導電性ペーストとした時に導電性の悪化に繋がる恐れがあるからである。
フレーク化は乾式でも湿式でも可能であるが湿式で行うほうが品質安定の観点から好ましい。湿式で行う場合の溶媒はメタノール、エタノール、プロパノール、ブタノール、ペンタノール、ジメチルケトン、ジエチルケトン、ジメチルエーテル、ジエチルエーテル、ジフェニルエーテル、トルエン、キシレンが挙げられ、これらは単独でも複数種を併用してもかまわない。
The fatty acid ester compound is preferably used in an amount of 0.005 g to 0.5 g per 1 m 2 of the surface area of the obtained conductive powder. Within this range, aggregation does not occur during the flaking process, and good conductivity can be obtained. If it is less than this, agglomeration is likely to occur during the flaking process, and if it is more than this, the amount of fatty acid ester compound remaining in the obtained conductive powder becomes too much, which may lead to deterioration in conductivity when a conductive paste is obtained. Because.
Flaking can be done either dry or wet, but it is preferable to carry out flaking from the viewpoint of quality stability. Solvents used in the wet process include methanol, ethanol, propanol, butanol, pentanol, dimethyl ketone, diethyl ketone, dimethyl ether, diethyl ether, diphenyl ether, toluene, and xylene. These may be used alone or in combination. Absent.
フレーク化処理後ろ過することにより凝集物、粗大粒子を取り除いた後、乾燥することにより導電性粉末を得ることができる。得られた導電性粉末は示唆熱天秤(TGA)にて窒素雰囲気中、室温と室温から500℃まで昇温して500℃にて1時間保持した後での重量減少率が0.05重量%以上2重量%以下であることが好ましい。より好ましい重量減少率は0.05重量%以上1重量%以下である。下限値より少ないと乾燥後に徐々に凝集が進む恐れがあり、上限値より多いと残存する滑剤量が多くなりすぎ導電性ペーストとした時に導電性の悪化に繋がる恐れがある。得られた導電性粉末はレーザー回折法による50%平均粒径が1μm以上50μm以下であることが好ましい。より好ましい50%平均粒径は1μm以上15μm以下であり、さらに好ましいのは3μm以上10μm以下である。下限値より小さいと導電性ペーストとした時に粘度が高くなりすぎ十分な導電性を得るだけの導電性粉末を配合できなくなり、上限値より大きいと導電性ペーストとした時に微細加工ができなくなるためである。
以下実施例を用いて本発明を具体的に説明するが、これらに限定されるものではない。
A conductive powder can be obtained by removing the aggregates and coarse particles by filtration after flaking and then drying. The obtained conductive powder has a weight reduction rate of 0.05% by weight after being heated at room temperature and from room temperature to 500 ° C. and held at 500 ° C. for 1 hour in a nitrogen atmosphere by a suggestive thermobalance (TGA). The content is preferably 2% by weight or less. A more preferable weight loss rate is 0.05% by weight or more and 1% by weight or less. If the amount is less than the lower limit value, aggregation may proceed gradually after drying. If the amount is more than the upper limit value, the amount of the remaining lubricant may increase so much that the conductive paste may be deteriorated. The obtained conductive powder preferably has a 50% average particle diameter of 1 μm or more and 50 μm or less by a laser diffraction method. A more preferable 50% average particle diameter is 1 μm or more and 15 μm or less, and further preferably 3 μm or more and 10 μm or less. If it is smaller than the lower limit, the viscosity becomes too high when it is made into a conductive paste, and it becomes impossible to mix conductive powder sufficient to obtain sufficient conductivity, and if it is larger than the upper limit, fine processing becomes impossible when it is made into a conductive paste. is there.
EXAMPLES The present invention will be specifically described below using examples, but is not limited thereto.
[実施例1]
半径が15cmで高さが30cmの円筒容器と、この円筒容器内に配置された攪拌翼(半径14cm)とを備えた攪拌ボールミルを準備した。
硝酸銀を化学還元することで得られた平均粒径約5μm、比表面積0.2m2/gの還元銀粒子10kg及び30kgのチタン製ボール(直径0.8mm)を攪拌ボールミルの円筒容器内に仕込み、さらにエタノール8kg、オレイン酸メチル0.1kg、パルミチン酸メチル0.1kgを添加した。攪拌翼の回転数を500rpmに設定して、攪拌ボールミルを始動させてフレーク化を開始した。攪拌ボールミルを2時間運転した後に回転を停止した。その後円筒容器の内容物をろ過しろ液を乾燥することで導電性粉末を得た。
以下の方法により評価した特性値を表1に示す。
[Example 1]
A stirring ball mill provided with a cylindrical container having a radius of 15 cm and a height of 30 cm and a stirring blade (radius 14 cm) disposed in the cylindrical container was prepared.
10 kg of reduced silver particles having an average particle diameter of about 5 μm and a specific surface area of 0.2 m 2 / g obtained by chemical reduction of silver nitrate and 30 kg of titanium balls (0.8 mm in diameter) are charged into a cylindrical container of a stirring ball mill. Further, 8 kg of ethanol, 0.1 kg of methyl oleate and 0.1 kg of methyl palmitate were added. The rotation speed of the stirring blade was set to 500 rpm, the stirring ball mill was started, and flaking was started. After the stirring ball mill was operated for 2 hours, the rotation was stopped. Thereafter, the contents of the cylindrical container were filtered and the filtrate was dried to obtain a conductive powder.
Table 1 shows characteristic values evaluated by the following methods.
・タップ密度:導電性粉末100gをメスシリンダーに入れ振とうを加えた後容量を読み取ることにより算出した。
・比表面積:BET法により測定した。
・50%平均粒径:レーザー回折粒度測定装置((株)島津製作所製、SALD−3000J)にて測定した。50%平均粒径が1μm以上50μm以下のものを合格とした。
・重量減少率:示唆熱天秤(TGA)に50mgの導電性粉末をセットし、窒素雰囲気中で室温と室温から500℃まで昇温して500℃にて1時間保持した後での重量減少率を測定した。重量減少率が0.05重量%以上2重量%以下のものを合格とした。
・導電性:表2に示す配合比で原料を準備し、これらの原料が15重量%、導電性粉末が85重量%になるように配合し、3本ロールを用いて混練して、脱泡することで導電性ペーストを得た。導電性ペーストを幅4mm、長さ約50mm、厚み0.04mmとなるようにガラス板上に印刷し175℃60分間硬化した。硬化後長さ方向40mmの抵抗値を測定し体積抵抗率を算出した。体積抵抗率が5×10-5Ω・cm以下のものを合格とした。
-Tap density: It calculated by reading the capacity | capacitance after putting 100 g of electroconductive powders into a measuring cylinder, adding shake.
Specific surface area: measured by the BET method.
-50% average particle diameter: Measured with a laser diffraction particle size measuring apparatus (SALD-3000J, manufactured by Shimadzu Corporation). A sample having a 50% average particle diameter of 1 μm or more and 50 μm or less was regarded as acceptable.
Weight reduction rate: Weight reduction rate after setting 50 mg of conductive powder on a suggestive thermobalance (TGA), raising the temperature from room temperature to room temperature in a nitrogen atmosphere and holding at 500 ° C. for 1 hour. Was measured. A weight reduction rate of 0.05% to 2% by weight was regarded as acceptable.
Conductivity: Raw materials are prepared at a blending ratio shown in Table 2, these raw materials are blended so that the amount is 15% by weight, and the conductive powder is 85% by weight, kneaded using three rolls, and defoamed. As a result, a conductive paste was obtained. The conductive paste was printed on a glass plate so as to have a width of 4 mm, a length of about 50 mm, and a thickness of 0.04 mm, and cured at 175 ° C. for 60 minutes. After curing, the resistance value in the length direction of 40 mm was measured and the volume resistivity was calculated. A sample having a volume resistivity of 5 × 10 −5 Ω · cm or less was accepted.
[実施例2]
実施例1と同様にして導電性粉末を作製し、実施例1と同様に評価した。なお実施例2ではオレイン酸メチル0.1kg、パルミチン酸メチル0.1kgのかわりにパルミチン酸メチル0.2kgを添加した。
[Example 2]
Conductive powder was produced in the same manner as in Example 1 and evaluated in the same manner as in Example 1. In Example 2, 0.2 kg of methyl palmitate was added instead of 0.1 kg of methyl oleate and 0.1 kg of methyl palmitate.
[比較例1及び2]
実施例1と同様にして導電性粉末を作製し、実施例1と同様に評価した。なお比較例1ではオレイン酸メチル0.1kg、パルミチン酸メチル0.1kgのかわりにパルミチン酸0.2kgを、比較例2ではオレイン酸0.15kg、N,N−ジメチルステアリルアミド0.05kgを添加した。
[Comparative Examples 1 and 2]
Conductive powder was produced in the same manner as in Example 1 and evaluated in the same manner as in Example 1. In Comparative Example 1, 0.1 kg of methyl oleate and 0.2 kg of palmitic acid instead of 0.1 kg of methyl palmitate were added, and in Comparative Example 2, 0.15 kg of oleic acid and 0.05 kg of N, N-dimethylstearylamide were added. did.
本発明の導電性粉末は、導電性ペーストとした場合に特に導電性に優れるため、導電材料として好適に用いることができる。 Since the conductive powder of the present invention is particularly excellent in conductivity when a conductive paste is used, it can be suitably used as a conductive material.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089499A JP2007265801A (en) | 2006-03-28 | 2006-03-28 | Conductive powder and forming method of conductive powder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006089499A JP2007265801A (en) | 2006-03-28 | 2006-03-28 | Conductive powder and forming method of conductive powder |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007265801A true JP2007265801A (en) | 2007-10-11 |
Family
ID=38638588
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006089499A Pending JP2007265801A (en) | 2006-03-28 | 2006-03-28 | Conductive powder and forming method of conductive powder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2007265801A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013001966A (en) * | 2011-06-16 | 2013-01-07 | Ulvac Japan Ltd | Metal fine particle dispersion liquid and method for producing the same |
WO2023176402A1 (en) * | 2022-03-16 | 2023-09-21 | Dowaエレクトロニクス株式会社 | Block-like silver powder and manufacturing method thereof, and electrically conductive paste |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01108277A (en) * | 1987-10-20 | 1989-04-25 | Mitsui Mining & Smelting Co Ltd | Copper powder for electrically conductive coating material and manufacture of said powder |
JPH10330714A (en) * | 1997-05-28 | 1998-12-15 | Sumitomo Bakelite Co Ltd | Conductive resin paste and semiconductor device produced by using the same |
WO2000003823A1 (en) * | 1998-07-15 | 2000-01-27 | Toho Titanium Co., Ltd. | Metal powder |
JP2000038510A (en) * | 1998-07-09 | 2000-02-08 | Dow Corning Corp | Electrically conductive silicone composition |
JP2003055701A (en) * | 2001-08-10 | 2003-02-26 | Fukuda Metal Foil & Powder Co Ltd | Silver powder for conductive paste and its manufacturing method and conductive paste using the silver powder |
-
2006
- 2006-03-28 JP JP2006089499A patent/JP2007265801A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01108277A (en) * | 1987-10-20 | 1989-04-25 | Mitsui Mining & Smelting Co Ltd | Copper powder for electrically conductive coating material and manufacture of said powder |
JPH10330714A (en) * | 1997-05-28 | 1998-12-15 | Sumitomo Bakelite Co Ltd | Conductive resin paste and semiconductor device produced by using the same |
JP2000038510A (en) * | 1998-07-09 | 2000-02-08 | Dow Corning Corp | Electrically conductive silicone composition |
WO2000003823A1 (en) * | 1998-07-15 | 2000-01-27 | Toho Titanium Co., Ltd. | Metal powder |
JP2003055701A (en) * | 2001-08-10 | 2003-02-26 | Fukuda Metal Foil & Powder Co Ltd | Silver powder for conductive paste and its manufacturing method and conductive paste using the silver powder |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013001966A (en) * | 2011-06-16 | 2013-01-07 | Ulvac Japan Ltd | Metal fine particle dispersion liquid and method for producing the same |
WO2023176402A1 (en) * | 2022-03-16 | 2023-09-21 | Dowaエレクトロニクス株式会社 | Block-like silver powder and manufacturing method thereof, and electrically conductive paste |
JP2023135706A (en) * | 2022-03-16 | 2023-09-29 | Dowaエレクトロニクス株式会社 | Block-shaped silver powder, method for producing the same and conductive paste |
JP7436544B2 (en) | 2022-03-16 | 2024-02-21 | Dowaエレクトロニクス株式会社 | Block-shaped silver powder and its manufacturing method, and conductive paste |
EP4494783A4 (en) * | 2022-03-16 | 2025-06-25 | Dowa Electronics Materials Co., Ltd. | SILVER POWDER BLOCK, PROCESS FOR PRODUCING SAME, AND ELECTRICALLY CONDUCTIVE PASTE |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5937730B2 (en) | Method for producing copper powder | |
JP6423139B2 (en) | Flake silver powder, method for producing the same, and conductive paste | |
JP6976597B2 (en) | Copper particle mixture and its production method, copper particle mixture dispersion, copper particle mixture-containing ink, copper particle mixture storage method and copper particle mixture sintering method | |
WO2018043681A1 (en) | Silver-coated alloy powder, conductive paste, electronic component, and electrical device | |
JP2017150086A (en) | Silver coated copper alloy powder and manufacturing method therefor | |
JP3874634B2 (en) | Flake-like silver powder for conductor paste and conductor paste using the same | |
WO2014155834A1 (en) | Flake-shaped microparticles | |
JP2008013837A (en) | Fine copper powder and its manufacturing method | |
JP2015021143A (en) | Silver-coated copper alloy powder and method for producing the same | |
JP2012062531A (en) | Flake-shaped silver powder, method for producing the same, resin curing type conductive paste, and method for forming conductive film | |
JP2019183268A (en) | Silver powder and manufacturing method therefor | |
JP2010236039A (en) | Flaky silver powder, its production method and conductive paste | |
KR20130060364A (en) | Silver particle-containing composition, dispersion liquid, paste, and production method for each | |
JP6258616B2 (en) | Silver-coated copper alloy powder and method for producing the same | |
JPH10162646A (en) | Conductive resin composition | |
JP2007265801A (en) | Conductive powder and forming method of conductive powder | |
JP2011208278A (en) | Flaky silver powder and method for producing the same | |
JP2011060519A (en) | Conductive paste, and wiring board using the same | |
JP6194166B2 (en) | Method for producing silver-coated copper alloy powder | |
JP2020196928A (en) | Silver-coated alloy powder, alloy powder, metal-powder producing method, silver-coated metal powder producing method, conductive paste, and conductive-paste producing method | |
KR20230151101A (en) | Conductive composition for bonding, bonding structure using the same, and method for manufacturing the same | |
JP4857441B2 (en) | Conductive paste and manufacturing method thereof | |
JP4089368B2 (en) | Conductive paste | |
WO2017179524A1 (en) | Silver-coated copper powder and method for producing same | |
WO2023042771A1 (en) | Method for producing silver powder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080929 |
|
A977 | Report on retrieval |
Effective date: 20101019 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
A131 | Notification of reasons for refusal |
Effective date: 20101026 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20101220 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20110201 |