JP2007234705A - Double-sided cream soldering printer, and printing method of double-sided cream soldering - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To dispense with manpower without stopping a production work time in changing-over printing on the front and rear surfaces of a board. <P>SOLUTION: A double-sided cream soldering printer comprises: a stage 106 where a printed board 105 is placed, having different recognition marks on the front and rear surfaces; a screen 112 where opening patterns 113, 114 are respectively formed inside two adhesive parts 161, 162 for the adherence of the front and rear surfaces of the printed board, and to which the recognition marks are given; a stage driver 107 for driving the stage to the adhesive parts of a movement destination, and sticking the printed board placed on the stage to the adhesive parts; a first camera 100 for imaging the recognition marks of the printed board placed on the stage; a second camera 101 for imaging the recognition marks of the screen; and a control unit 108 for determining the adhesive parts of the movement destination, based on imaging information of the first camera and imaging information of the second camera, driving the stage driving part to the determined adhesive parts, sticking the printed board placed on the stage to the adhesive parts, and allowing stage printing to be performed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a double-sided cream solder printer that performs cream solder printing on both sides of a printed circuit board. In particular, the present invention relates to a double-sided cream solder printing machine and a double-sided cream solder printing method for switching the printing surface according to the front and back surfaces of a printed board to facilitate the work.

  Conventionally, double-sided cream solder printers that perform double-sided board printing are well known. In a conventional double-sided cream solder printing machine, an opening pattern is provided for only one side of a screen. In the production of a double-sided board, when switching the front and back of the double-sided board, operations such as screen exchange, removal of cream solder, supply, and exchange of a printing program are required. For this reason, there was a problem that working time was stopped during production.

Furthermore, even if an opening pattern for both sides of the substrate is provided on the screen, the printing machine does not have a function for discriminating the printing surface and a function for automatically switching the printing position on the screen, so it must be switched manually. There is a problem that the work should be facilitated.
There are the following prior arts related to such a double-sided cream solder printer.
Conventionally, two metal masks are usually required for printing cream solder, one for the front side and the other for the back side. , A sufficiently wide metal mask is prepared for the printed circuit board, an opening for the surface of the printed circuit board is provided above the center line TT ′ in the same direction as the flow of the mounting process, and the center line T There is a type in which an opening for the back surface of the printed circuit board is provided upside down with respect to −T ′ (for example, see Patent Document 1).

However, in Patent Document 1, an opening for the front surface of the printed board and an opening for the back surface are provided in the metal mask, but this does not facilitate the operation by switching the printing surface according to the front and back surfaces of the printed board.
Further, conventionally, a printing apparatus for a semiconductor device, comprising: a stage on which the semiconductor device is set; and a squeegee that forms a pattern by supplying a printing liquid onto the substrate for the semiconductor device from a pattern hole provided in a mask. And a reversing device that has a chuck portion that holds the semiconductor device on the stage and a rotating portion that rotates the chuck portion, and that moves forward and backward with respect to the stage. There is a printer for printing (see, for example, Patent Document 2).

However, in Patent Document 2 described above, a printing liquid is supplied from a pattern hole onto a substrate for a semiconductor device to form a pattern. As described above, the printing surface is switched according to the front and back surfaces of the printed board. It does not facilitate.
Conventionally, the front surface of the first printed wiring board and the back surface of the second printed wiring board are arranged on the front surface, and the back surface of the first printed wiring board and the front surface of the second printed wiring board are arranged on the back surface. A printing medium, and a screen provided with a first pattern and a second pattern, screen-printing the first pattern and the second pattern on the surface of the printing medium using the screen, 2. Description of the Related Art There is a double-sided screen printing machine that performs screen printing of a first pattern and a second pattern (see, for example, Patent Document 3).

However, in Patent Document 3, screen printing is performed on the front and back surfaces of the printed wiring board. However, as described above, the printing surface is not switched according to the front and back surfaces of the printed circuit board to facilitate the work.
Conventionally, in order to improve the productivity of the double-sided printed wiring board electronic component mounting method, a combination of double-sided printed wiring boards is used as a standard single product, and a metal mask corresponding to this is produced. The printed wiring board is fixed in the normal state, and the other double-sided printed wiring board is fixed in the state of “inside-out” and “left-right reversed” from the normal state. Therefore, the metal mask is two double-sided printed wiring boards at a time. Cream solder can be applied to the front and back surfaces of the circuit board. After applying the cream solder, a predetermined electronic component is mounted on this surface and heat-treated in a reflow oven. When the component mounting is completed, and then the wiring board is “turned over” and the same processing is performed on the other side of the wiring board, two double-sided printed wiring boards P are completed (see, for example, Patent Document 4). ).

However, in Patent Document 4, cream solder is applied to the front and back surfaces of two double-sided printed wiring boards at one time. As described above, the printing surface is switched according to the front and back surfaces of the printed circuit board. It does not facilitate.
Conventionally, in order to enable solder to be printed on both lands of the printed wiring board at the same time and to reduce the size of the electronic component mounting system, a transport mechanism that transports the printed wiring board 2 in a substantially vertical state; A pair of screen mechanisms disposed to face the printed wiring board supported by the transport mechanism, the screen being provided so as to move in a direction approaching and separating from the printed wiring board; A squeegee mechanism provided corresponding to each screen mechanism and having a squeegee that slides on the screen and pushes cream solder onto the printed circuit board when the screen is close to the printed circuit board, and the squeegee mechanism slides on the screen mechanism. Some have a drive mechanism that moves them to move them (see, for example, Patent Document 5).

  However, in Patent Document 5, solder is printed on both lands of the printed wiring board at the same time. However, as described above, the printing surface is not switched according to the front and back surfaces of the printed board to facilitate the work. .

JP 05-165220 A JP 59-214293 A Japanese Utility Model Publication No. 02-041477 Japanese Patent Application Laid-Open No. 07-273411 JP 2001-310443 A

  Therefore, in view of the above problems, the present invention facilitates work by switching the printing surface according to the front and back surfaces of the printed circuit board, does not stop working time during production, and does not require manual labor during switching. An object is to provide a solder printer and a double-sided cream solder printing method.

  In order to solve the above problems, the present invention provides a double-sided cream solder printing machine that performs cream solder printing by driving a squeegee, a stage on which printed boards with different recognition marks on the front and back surfaces are placed, An opening pattern is formed inside each of the two contact portions that closely contact the front surface and the back surface of the printed circuit board, the screen to which the recognition mark is attached, the stage is driven to the contact portion of the moving destination, and the stage A stage driving unit for bringing the printed circuit board placed on the contact portion into close contact with the contact portion, a first camera for taking an image of the recognition mark on the printed circuit board placed on the stage, and an image of the recognition mark on the screen. The recognition mark on the front surface or the back surface of the printed circuit board is determined from the imaging information of the second camera and the first camera, and the determined The contact portion determined by comparing the recognition mark on the front or back surface of the lint substrate with the recognition mark attached to the screen from the imaging information of the second camera, and determining the contact portion of the movement destination from the matching recognition mark A double-sided cream solder printing machine comprising: a control unit that drives the stage driving unit to bring the printed circuit board placed on the stage into close contact with the determined contacted part and performs squeegee printing To do.

Further, on the stage, the printed circuit board in which the recognition marks are arranged in the upper right corner and the lower left corner of the front surface or the printed circuit board in which the recognition marks are arranged in the upper left corner and the lower right corner of the back surface is placed. Recognition marks are arranged at the upper right corner and the lower left corner of the close contact portion, and recognition marks are disposed at the upper left corner and the lower right corner of the contact portion where the back surface of the printed circuit board is in close contact.
Further, the printed circuit board in which the front surface barcode is disposed on the stage or the printed circuit board in which the rear surface barcode is disposed is placed, and the front surface barcode is attached to the contact portion where the surface of the printed circuit board is in close contact, A barcode for the back surface is arranged at the contact portion where the back surface of the printed circuit board is in close contact.

  Furthermore, the present invention provides a double-sided cream solder printing method in which cream solder printing is performed by driving a squeegee, a step of placing a printed circuit board with different recognition marks on the front and back surfaces on a stage, and the printed circuit board on a screen Forming an opening pattern in each of the two contact portions where the front surface and the back surface are in close contact with each other, and attaching a recognition mark; and a recognition mark on the printed circuit board placed on the stage A step of imaging with a camera, a step of imaging a recognition mark on the screen with a second camera, and a recognition mark on the front or back surface of the printed circuit board from the imaging information of the first camera, and the discriminated print The recognition mark on the front surface or the back surface of the substrate is compared with the recognition mark attached to the screen based on the imaging information of the second camera. A step of determining a close contact portion of the movement destination from the recognition mark, and a step of driving the stage to the determined movement destination of the close contact portion and bringing the printed circuit board placed on the stage into close contact with the determined close contact portion And a step of performing squeegee printing on the contact portion where the printed circuit board placed on the stage is in close contact with each other.

  As described above, according to the present invention, a printed circuit board with different recognition marks on the front surface and the back surface is placed on the stage, and each of the two contact portions that adhere the front surface and the back surface of the printed circuit board to the screen. An opening pattern is formed inside, a recognition mark is attached, a recognition mark on the printed circuit board placed on the stage is picked up by the first camera, a recognition mark on the screen is picked up by the second camera, The recognition mark on the front or back surface of the printed circuit board is discriminated from the imaging information of the first camera, and the recognition mark on the front or back surface of the printed circuit board is compared with the recognition mark attached to the screen from the imaging information of the second camera. Then, the contact portion of the movement destination is determined from the matching recognition mark, the stage is driven to the movement destination of the determined contact portion, and the printed circuit board placed on the stage is determined. Since squeegee printing is performed on the close contact portion where the printed circuit board placed on the stage is in close contact with the close contact portion, both the front and back surface opening patterns and the back opening pattern are provided on the screen. Since it is formed, it is not necessary to replace the screen when changing the front and back of the printed circuit board as in the prior art.

Furthermore, since screen replacement is not required as in the prior art, it is not necessary to take out cream solder that occurs simultaneously with screen replacement, screen cleaning, and cream solder supply operations.
The front and back sides are identified by the recognition mark on the front or back side of the printed circuit board, the opening pattern on the front side of the screen and the opening pattern on the back side are selected, and the print position switching operation on the screen is automatically performed. The operation by is unnecessary.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a schematic configuration of a double-sided cream solder printing machine according to the present invention. As shown in the figure, a printed circuit board 105 to be subjected to cream solder printing is placed on a stage 106. A screen 112 is installed above the stage 106, and the screen 112 is attached to a screen frame 111. The frame 111 is fixed to the screen holder 141. When the printed circuit board 105 is placed on the stage 106, a distance L1 between the stage 106 and the screen 112 is secured to facilitate the placing work.

In the screen 112, a front surface opening pattern 113 is formed in a surface contact portion 161 where the front surface side of the printed circuit board 105 is in close contact, and a back surface opening pattern 114 is formed in a back surface contact portion 162 where the back surface side of the printed circuit board 105 is in close contact. .
The opening pattern 113 for the front surface is used for cream solder printing on the printed circuit board 105 on the front surface side and is an opening pattern for the screen 112, and the opening pattern 114 for the back surface is used for printing cream solder on the printed circuit board 105 on the back surface side. It is an opening pattern.

The stage driving unit 107 is capable of three-dimensional movement, calculates current coordinates X, Y, Z, and θ along with the movement, and moves the printed circuit board 105 placed on the stage 106 to a predetermined position on the screen 112. It has the function to make it adhere to.
A squeegee driving unit 109 is provided on the screen 112. The squeegee driving unit 109 drives squeegees 121 and 122. The squeegees 121 and 122 reciprocate in the Y direction during solder printing, and in the Z direction on the forward and return sides. The cream solder 103 on the screen 112 is used while being switched between the squeegee 121 and the squeegee 122 and has a function of performing solder printing on the printed circuit board 105 in close contact with the screen 112.

The camera 100 is used to image the front surface or the back surface of the printed circuit board 105, and the camera 101 is used to image the screen 112 and select the front surface opening pattern 113 or the back surface opening pattern 114 of the screen 112.
The control unit 108 inputs the imaging data of the camera 100 and the camera 101, drives the stage driving unit 107, discriminates the front or back surface of the printed circuit board 105, and selects the front surface opening pattern 113 or the back surface opening pattern 114 of the screen 112. Then, the front or back surface of the printed circuit board 105 is brought into close contact with the front surface opening pattern 113 or the back surface opening pattern 114 of the selected screen 112, and one of the squeegees 121 and 122 is lowered onto the screen 112, and the squeegee driving unit 109. Is driven to move in the Y-axis direction to perform cream solder printing. Detailed description will be given below.

FIG. 2 is a schematic diagram showing an example of the screen 112 in FIG. 1 as viewed from the camera 101 side. As shown by the dotted line in the figure, the screen 112 has the surface adhesion portion 161 where the front surface side of the printed circuit board 105 is in close contact and the back surface adhesion portion 162 where the back surface side of the printed circuit board 105 is in close contact as described above. Is set.
A surface opening pattern 113 is formed in the surface contact portion 161, and a plurality of surface contact portion recognition marks 115, 116 are attached to the side facing the stage driving unit 107.

A back surface opening pattern 114 is formed in the back surface contact portion 162, and a plurality of back surface contact portion recognition marks 117 and 118 are attached to the side facing the stage drive unit 107.
The coordinates of the center portions of the front surface close contact portion 161 and the back surface close contact portion 162 are (a1, b1, c1) and (a2, b2, c2).
The printed circuit board 105 selectively selects the close contact portion 161 and the close contact portion 162 for close contact with the close contact portion recognition marks 115 and 116 for the front surface and the close contact portion recognition marks 117 and 118 for the back surface by using different arrangements. used.

As an example, the close contact recognition mark 115 for the surface is round and disposed in the upper right corner of the close contact portion 161, and the close contact recognition mark 116 for the surface is circular and disposed in the lower left corner of the close contact portion 161.
Further, the back surface contact portion recognition mark 117 is round and arranged in the upper left corner of the back surface contact portion 162, and the back surface contact portion recognition mark 118 is round and placed in the lower right corner of the back surface contact portion 162.

Although the opening pattern 113 for the front surface and the opening pattern 114 for the back surface are shown in simple shapes, they are actually different complicated shapes.
FIG. 3 is a diagram showing an outline of an example of the printed circuit board 105 in FIG. 1 viewed from the screen 112 side. As shown in FIG. 5A, a plurality of front side substrate recognition marks 151 and 152 are provided on the surface side of the printed circuit board 105 in close contact with the screen 112, and a front side substrate land pattern 155 is provided. As shown in b), a plurality of back side substrate recognition marks 153 and 154 are attached to the back side of the printed circuit board 105 that is in close contact with the screen 112, and a back side substrate land pattern 156 is provided.

The front surface side substrate recognition marks 151 and 152 and the back surface side substrate recognition marks 153 and 154 are used to determine the front surface or the back surface of the printed circuit board 105.
The plurality of front-side substrate recognition marks 151 and 152 have the same shape and arrangement as the plurality of front-surface contact portion recognition marks 115 and 116 of the screen 112, respectively, and the plurality of back-side substrate recognition marks 153 and 154 The shape and arrangement of the back surface contact portion recognition marks 117 and 118 are made to coincide with each other.

As an example, on the front surface side of the printed circuit board 105, the front surface side substrate recognition mark 151 is round and arranged in the upper right corner, and the front surface side substrate recognition mark 152 is round and arranged in the lower left corner.
Further, on the back side of the printed circuit board 105, the back side substrate recognition mark 153 is round and arranged at the upper left corner, and the back side substrate recognition mark 154 is round and arranged at the lower right corner.
When the surface of the printed circuit board 105 is in close contact with the surface contact portion 161 of the screen 112, the surface side substrate land pattern 155 matches the surface opening pattern 113.

Similarly, when the back surface of the printed circuit board 105 is in close contact with the back surface contact portion 162 of the screen 112, the back surface side substrate land pattern 156 matches the back surface opening pattern 114.
Each of the back-side substrate land pattern 155 and the back-side substrate 156 is shown in a simple shape, but the front-side opening pattern 113 and the back-side opening pattern 114 are actually different from each other in a complicated shape. It is a complicated shape.

  FIG. 4 is a block diagram showing a schematic configuration of the control unit 108 in FIG. As shown in this figure, the control unit 108 is provided with a substrate recognition mark detection unit 201. The substrate recognition mark detection unit 201 inputs a signal imaged by the camera 100 and is on the surface side of the surface of the printed circuit board 105 on the stage 106. Images of the substrate recognition marks 151 and 152 or the back side substrate recognition marks 153 and 154 are detected.

  A substrate recognition mark determination unit 202 is connected to the substrate recognition mark detection unit 201, and the substrate recognition mark determination unit 202 stores the front side substrate recognition marks 151 and 152 and the back side substrate recognition marks 153 and 154 to detect the substrate recognition mark. The front side substrate recognition marks 151 and 152 or the back side substrate recognition marks 153 and 154 detected by the unit 201 are compared with the stored front side substrate recognition marks 151 and 152 and the back side substrate recognition marks 153 and 154. Based on the comparison result, the front-side substrate recognition marks 151 and 152 or the back-side substrate recognition marks 153 and 154 attached to the printed board 105 placed on the stage 106 are discriminated and placed on the stage 106 at the same time. The front and back surfaces of the printed circuit board 105 are discriminated.

Further, the control unit 108 is provided with a screen recognition mark detection unit 203. The close contact recognition mark detection unit 203 inputs a signal imaged by the camera 101 and receives the close contact recognition marks 115 and 116 for the front surface on the screen 112, and for the back surface. The images of the close contact recognition marks 117 and 118 are detected.
Both the substrate recognition mark determination unit 202 and the contact part recognition mark detection unit 203 are connected to a contact part determination unit 204 as a movement destination, and the contact part determination part 204 as a movement destination is detected by the contact part recognition mark detection unit 203. The front surface contact recognition marks 115 and 116 or the back contact contact recognition marks 117 and 118, and the front substrate recognition marks 151 and 152 or the back substrate recognition marks 153 and 154 determined by the substrate recognition mark determination unit 203. And the close contact portion 161 or the close contact portion 162 of the screen 112 is determined as the movement destination based on the comparison result.

  The stage drive control unit 205 is connected to the close contact portion determination unit 204 of the movement destination, and the stage drive control unit 205 determines the close contact portion 161 or the back surface contact of the screen 112 determined as the movement destination by the close contact portion determination unit 204 of the movement destination. Information on the portion 162 is notified to the stage drive control unit 205, the stage drive control unit 205 is driven, and the stage 106 placed on the stage 106 is brought into close contact with the determined front surface close contact portion 161 or back surface close contact portion 162. A drive completion notification is received from the drive control unit 205.

  A squeegee drive control unit 206 is connected to the stage drive control unit 205. The squeegee drive control unit 206 receives a print start instruction from the stage drive control unit 205, notifies the squeegee drive unit 109 of a print start instruction, and drives the squeegee drive. In the portion 109, the cream solder 103 is applied to the printed circuit board 105 placed on the stage 106 by the squeegees 121 and 122 via the front surface opening pattern 113 of the front surface contact portion 161 or the back surface opening pattern 114 of the back surface contact portion 162. When printing is performed and a print completion notification is received, the stage drive control unit 205 is notified of the print completion.

FIG. 5 is a flowchart for explaining an operation example of the stage driving unit 107 in FIG. As shown in the figure, in step S301, the coordinates of the surface close contact portion 161 of the screen 112 are input. As an example, the coordinates of the surface contact portion 161 are the center coordinates of the surface contact portion 161, and are (a1, b1, c1) as shown in FIG.
In step S302, the coordinates of the back contact portion 162 of the screen 112 are input. As an example, the coordinates of the back contact portion 162 are the center coordinates of the back contact portion 162, and are (a2, b2, c2) as shown in FIG.

In step S303, the notification of the contact portion 161 or the contact portion 162 determined as the movement destination is received from the stage drive control unit 205 of the control unit 108.
In step S304, it is determined whether the notified contact portion is the surface contact portion 161 or not. If the close contact portion is the back contact portion 162, the process proceeds to step S311.
In step S305, when the close contact portion is the surface close contact portion 161, the coordinates (x, y, z) of the current position of the stage drive unit 107 are calculated. The coordinates (x, y, z) are coordinates of the center position of the printed circuit board 105 placed on the stage.

In step S306, the movement amounts (Δx, Δy, Δz) are calculated as follows using the surface contact portion 161 as the movement destination.
Δx = (x−a1)
Δy = (y−b1)
Δz = (z−c1)
In step S307, the stage drive unit 107 moves based on the movement amount.

In step S308, it is determined whether or not the stage drive unit 107 has moved to the destination position. If the position of the stage drive unit 107 is not the movement destination, the process returns to step S305, and the above process is repeated for the new current position. When Δx = 0, Δy = 0, and Δz = 0, it is determined that the position of the stage driving unit 107 is the destination.
In step S309, when the position of the stage drive unit 107 is the destination, the drive of the stage drive unit 107 is stopped.

In step S310, a drive completion notification is transmitted to the stage drive control unit 205 of the control unit 108, and the process ends.
In step S311, when the close contact portion is the back contact portion 162, the coordinates (x, y, z) of the current position of the stage drive unit 107 are calculated.
In step S312, the movement amounts (Δx, Δy, Δz) are calculated as follows using the back contact portion 162 as the movement destination.

Δx = (x−a2)
Δy = (y−b2)
Δz = (z−c2)
In step S313, the stage drive unit 107 moves based on the movement amount.
In step S314, it is determined whether or not the stage driving unit 107 has moved to the destination position. If the position of the stage drive unit 107 is not the movement destination, the process returns to step S311 and the above process is repeated for the new current position. When Δx = 0, Δy = 0, and Δz = 0, it is determined that the position of the stage driving unit 107 has become the movement destination, and the process proceeds to step S309.

FIG. 6 is a flowchart for explaining a series of operations of the double-sided cream solder printer in FIG. As shown in the figure, in step S321, the printed circuit board 105 on the stage 106 is imaged by the camera 100, and the front surface side substrate recognition marks 151 and 152 or the back surface side substrate recognition marks 153 and 154 are detected.
If the front side substrate recognition marks 151 and 152 are detected in step S322, it is determined that the printed board 105 is on the front side. If the rear side substrate recognition marks 153 and 154 are detected, the printed board 105 is on the back side. Judging by the side.

In step S323, the screen 101 is imaged by the camera 101, and the front surface contact portion recognition marks 115 and 116 and the back surface contact portion recognition marks 117 and 118 are detected.
In step S324, the control unit 108 detects the detected front-side contact portion recognition marks 115 and 116 or the back-side contact portion recognition marks 117 and 118, and the determined front-side substrate recognition marks 151 and 152 or the back-side substrate recognition mark. 153 and 154 are compared, and the front surface close contact portion 161 or the back surface close contact portion 162 of the screen 112 is determined as the movement destination of the stage drive unit 107 based on the comparison result.

In step S325, the control unit 108 notifies the stage drive unit 107 of information on the determined front surface close contact portion 161 or back surface close contact portion 162.
In step S 326, the drive completion notification is received from the stage driving unit 107 to the control unit 108.
In step S327, the control unit 108 notifies the squeegee driving unit 109 of a print start instruction.

  The squeegee driving unit 109 moves the squeegees 121 and 122 to the start position for printing with respect to the screen 112 of the front surface close-contact portion 161 or the back surface close-contact portion 162 that has been instructed to start printing. Is transferred onto the screen 112 and moved in the Y-axis forward direction, whereby the cream solder 103 is printed on the front surface or the back surface of the printed circuit board 105 via the front surface opening pattern 113 or the back surface opening pattern 114.

When the printing is completed, the stage drive control unit 205 causes the stage drive unit 107 to lower the stage 106, take out the printed board 105 that has been printed, and place the next printed board 105 on the stage 106.
At the time of printing the second printed board 105 on the same front side or back side, the squeegee drive control unit 206 attaches the printed board 105 to the screen 112 and then moves the other of the squeegees 121 and 122 to the squeegee drive unit 109. Control is performed so that the cream solder 103 is printed on the front surface or the back surface of the printed circuit board 105 via the front surface opening pattern 113 or the back surface opening pattern 114 by moving down in the Y-axis backward direction on the screen 112.

When printing on the printed circuit board 105 on the different front side or back side, the squeegee drive control unit 206 moves the squeegees 121 and 122 to the start position for printing and controls the same operation as described above.
In step S328, when notification of printing completion is received from the squeegee driving unit 109 to the control unit 108, the series of operations is terminated.

Therefore, according to the present invention, both the front and back surface opening patterns 113 and the back surface opening pattern 114 are provided on the screen 112, so that the screen can be replaced when changing the front and back of the printed circuit board as in the prior art. It becomes unnecessary.
Furthermore, since screen replacement is not required as in the prior art, it is not necessary to take out cream solder that occurs simultaneously with screen replacement, screen cleaning, and cream solder supply operations.

  The front side and the back side recognition marks 151 and 152 and the back side substrate recognition marks 153 and 154 of the printed circuit board 105 are discriminated from each other, and the front surface opening pattern 113 and the back surface opening pattern 114 are selected. Since the printing position switching operation is performed automatically, no manual operation is required during production.

  In the above description, the close contact recognition marks 115 and 116 for the front surface, the close contact recognition marks 117 and 118 for the back surface, the substrate recognition marks 151 and 152, and the back substrate recognition marks 153 and 154 are round recognition marks. However, instead of this, a front surface barcode or a back surface barcode may be used as a recognition mark for recognizing the surface adhesion portion 161, the surface adhesion portion 162 of the screen 112, and the front and back surfaces of the printed circuit board 105. This increases the versatility of the present invention.

It is a figure which shows schematic structure of the double-sided cream solder printer which concerns on this invention. It is a figure which shows the outline of the example which looked at the screen 112 in FIG. 1 from the camera 101 side. It is a figure which shows the outline of the example which looked at the printed circuit board 105 in FIG. 1 from the screen 112 side. It is a block diagram which shows schematic structure of the control part 108 in FIG. 2 is a flowchart for explaining an operation example of a stage drive unit 107 in FIG. 1. It is a flowchart explaining a series of operation | movement of the double-sided cream solder printer in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Camera 101 ... Camera 103 ... Cream solder 105 ... Printed circuit board 106 ... Stage 107 ... Stage drive part 108 ... Control part 109 ... Squeegee drive part 111 ... Screen frame 112 ... Screen 113 ... Front surface opening pattern 114 ... Back surface opening pattern 115, 116... Close contact recognition mark for front surface 117, 118... Close contact recognition mark for back surface 121, 122... Squeegee 141. Screen holder 151, 152. Side substrate land pattern 156... Back side substrate land pattern 161... Front contact portion 162. Back contact portion 201. Substrate recognition mark detection portion 202. Decision unit 205 ... Over-di-drive control unit 206 ... squeegee drive control unit

Claims (4)

In a double-sided cream solder printing machine that performs cream solder printing by driving a squeegee,
A stage on which printed circuit boards with different recognition marks on the front and back surfaces are placed;
An opening pattern is formed inside each of the two contact portions that closely contact the front and back surfaces of the printed circuit board, and the screen to which the recognition mark is attached;
A stage driving unit that drives the stage to a close contact portion of the moving destination, and closes the printed circuit board placed on the stage to the close contact portion;
A first camera that images a recognition mark of the printed circuit board placed on the stage;
A second camera for imaging a recognition mark on the screen;
A recognition mark on the front or back surface of the printed circuit board is determined from the imaging information of the first camera, and is attached to the screen from the determined recognition mark on the front or back surface of the printed circuit board and the imaging information of the second camera. Compared with the recognized recognition mark, the contact portion of the movement destination is determined from the matching recognition mark, the stage driving unit is driven to the determined contact portion, and the printed circuit board placed on the stage is determined. A double-sided cream solder printing machine, comprising: a control unit that is in close contact with the squeegee and performs squeegee printing. The printed circuit board in which recognition marks are arranged in the upper right corner and the lower left corner of the surface or the printed circuit board in which recognition marks are arranged in the upper left corner and the lower right corner of the back surface is placed on the stage, and the surface of the printed circuit board is in close contact The recognition mark is disposed at an upper right corner and a lower left corner of the contact portion, and a recognition mark is disposed at an upper left corner and a lower right corner of the contact portion to which the back surface of the printed circuit board is adhered. Double-sided cream solder printing machine as described. The printed circuit board on which the front surface barcode is arranged on the stage or the printed circuit board on which the rear surface barcode is arranged is placed, and the front surface barcode is attached to the contact portion where the surface of the printed circuit board is in close contact with the printed circuit board. The double-sided cream solder printing machine according to claim 1, wherein a back-surface barcode is arranged at the contact portion where the back surface of the substrate is in close contact. In a double-sided cream solder printing method that performs cream solder printing by driving a squeegee,
Placing a printed circuit board with different recognition marks on the front and back surfaces on the stage;
Forming an opening pattern in each of the two contact portions where the front and back surfaces of the printed circuit board are in close contact with the screen, and attaching a recognition mark;
Imaging a recognition mark of the printed circuit board placed on the stage with a first camera;
Imaging a recognition mark on the screen with a second camera;
A recognition mark on the front or back surface of the printed circuit board is determined from the imaging information of the first camera, and is attached to the screen from the determined recognition mark on the front or back surface of the printed circuit board and the imaging information of the second camera. Comparing the recognized recognition mark and determining the close contact portion of the movement destination from the matching recognition mark;
Driving the stage to the determined movement destination of the contact portion, and contacting the printed circuit board placed on the stage to the determined contact portion;
And a step of performing squeegee printing on the contact portion where the printed circuit board placed on the stage is in close contact with the printed circuit board.

Images