JP2007221369A - Manufacturing method of frequency selective surfaces - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a frequency selective surfaces which make it possible to easily perform a high precision arrangement in which no deviation of an arrangement pitch of conductor elements is generated between frequency selective surfaces when performing pasting work of a plurality of frequency selective surfaces. <P>SOLUTION: At an outside position of 1/2 pitch of the arrangement pitch P of the conductor elements 3 (P/2) from the center line CL of the conductor elements 3 which are arranged at the most outside on a dielectric substrate 2, a trim line 4 which is parallel to the center line CL is simultaneously formed at the same time of formation of the conductor elements 3 by the same conductor material of the conductor elements 3. An end line of FSS1 (Frequency Selective Surfaces) after cutting is kept in a constant distance of 1/2 pitch (P/2) outside of the center line CL of the conductor elements 3 of the most outside by cutting a margin of the FSS1 along the trim line 4. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a frequency selection plate, and more particularly, when a plurality of frequency selection plates are continuously arranged, high-precision arrangement that does not cause a deviation in the arrangement pitch of conductor elements between the frequency selection plates is easy. The present invention relates to a method of manufacturing a frequency selection plate that can be performed in the following manner.

  Frequency selective surfaces (Frequency Selective Surfaces) function as an electromagnetic wave filter by reflecting or transmitting electromagnetic waves of a specific frequency, and for the purpose of preventing others from detecting their presence by radar. Used for aircraft, ships, vehicles, buildings, etc.

  The frequency selection plate is formed so that a large number of conductor elements having a predetermined shape are arranged vertically and horizontally at a predetermined pitch on a substrate. As a method of manufacturing the frequency selection plate, for example, a conductive paint is applied to a resin film or paper as a substrate so as to form a conductor element having a predetermined shape by various printing methods such as silk screen printing and gravure printing. (For example, refer to Patent Document 1). In addition, it can be manufactured by forming a conductor element by a method according to a method for manufacturing a circuit pattern of a printed board.

  The frequency selection plates manufactured in this way are affixed to a mounting surface of an aircraft or the like so as to be continuous with each other so as to have a required area using a plurality of sheets. At this time, if a deviation occurs in the arrangement pitch of the conductor elements between the adjacent frequency selection plates, the frequency selection characteristics change to adversely affect the performance of the frequency selection plate. Therefore, it is necessary to accurately arrange a plurality of frequency selection plates without shifting the arrangement pitch of the conductor elements.

Conventionally, as a countermeasure against the above-mentioned problem, when performing the pasting operation after manufacturing the frequency selection plates, the margins are measured and cut so as to conform to the specified dimensions, and the arrangement pitch of the conductor elements is set to the frequency selection plates. I was working to connect them so that they would not slip. Therefore, there is a problem that the pasting work takes a lot of time and the productivity is remarkably lowered.
JP 2005-142748 A

  An object of the present invention is to provide a frequency selection plate that can easily perform a high-precision arrangement without causing a deviation in the arrangement pitch of conductor elements between the frequency selection plates when a plurality of frequency selection plates are attached. It is to provide a manufacturing method.

  In order to achieve the above object, a method for manufacturing a frequency selection plate according to the present invention is a method for manufacturing a frequency selection plate in which a number of conductor elements having a predetermined shape are formed on a dielectric substrate at a predetermined arrangement pitch in the vertical and horizontal directions. In the method, a trim line parallel to the center line is formed on the same conductive material as the conductor element at a position outside the center line of the outermost conductor elements arranged on the substrate by a half pitch of the arrangement pitch. Thus, the conductor element is formed simultaneously with the formation of the conductor element.

  According to the method for manufacturing a frequency selective plate of the present invention, the distance between the center line of the conductor elements arranged on the outermost side of the dielectric substrate on the outer side by a distance of half the arrangement pitch (1/2 pitch) Since the trim line is formed parallel to the center line, the outer edge of the frequency selection plate after manufacture is cut along the trim line so that the pitch between the outermost conductor elements can be accurately adjusted in the connection work between the frequency selection plates. Can be aligned at a predetermined distance.

  In addition, since the trim line is formed simultaneously with the formation of the conductor element using the same conductive material as that of the conductor element, no special material is required, and the working time and manufacturing cost can be suppressed.

  Hereinafter, the manufacturing method of the frequency selection board (henceforth FSS) of this invention is demonstrated based on embodiment shown in the figure.

  As illustrated in FIGS. 1 and 2, the FSS 1 manufactured by the manufacturing method of the present invention is a so-called patch type FSS, and the same cross shape is formed on a dielectric substrate 2 made of a resin film or paper. The plurality of conductor elements 3 are formed so as to be arranged at the same arrangement pitch P in the vertical direction and the horizontal direction.

  The FSS 1 can be manufactured by printing the conductor element 3 on the dielectric substrate 2 by various printing methods. For example, a conductive paint containing metal particles, carbon particles, or the like is applied on the substrate 2 by a method such as silk screen printing or gravure printing so that the conductor elements 3 have a constant arrangement pitch P, and FSS1 Can be manufactured.

  Moreover, after laminating a conductive material such as a metal foil on the substrate 2 so as to manufacture a circuit pattern of a printed circuit board, it is masked so as to become a predetermined pattern and etched, or a photoresist or the like By using an existing method, the FSS 1 can be manufactured.

  In the manufacturing method described above, the FSS 1 of the present invention is centered on the outer side of the center line CL of the conductor element 3 located on the outermost side on the substrate 2 by a half pitch (P / 2) of the arrangement pitch P. A trim line 4 parallel to the line CL is formed. A formation region in which a large number of conductor elements 3 are arranged in the vertical direction and the horizontal direction at a predetermined arrangement pitch P is surrounded on four sides by the four trim lines 4.

  When the FSS 1 is manufactured by various printing methods, a trimming portion 4 is formed on the printing instrument (screen, printing roll, etc.) side along with the conductor element 3 forming portion. If the FSS 1 is to be manufactured by etching, masking with the conductor element 3 and the pattern of the trim line 4 is performed.

  By processing the manufacturing tool in this way, the trim line 4 can be formed simultaneously with the formation of the conductor element 3 by using the same conductive material as that of the conductor element 3. Therefore, it is not necessary to prepare a special material for the trim line 4 again, and the FSS 1 can be manufactured while suppressing the working time and manufacturing cost.

  Since the FSS 1 after manufacture has a margin at the periphery, the edge of the FSS 1 is separated from the center line CL of the outermost conductor element 3 by cutting the margin by aligning a guide such as a ruler with the trim line 4. Can be accurately set to a fixed distance of 1/2 pitch (P / 2). In this case, cutting is performed along the inside of the trim line 4 so that the trim line 4 does not remain on the FSS 1 side.

  When a plurality of FSSs 1 manufactured in this way are attached on the base panel 7 on the surface to be mounted as shown in FIG. The two conductor elements 3 and 3 can be arranged with high accuracy and easily so that the pitch between them is the same as the arrangement pitch P. Thereby, even if it is a big area, the frequency selection surface with the constant frequency selection characteristic can be formed using several sheets of FSS1.

  The thickness of the trim line 4 is preferably set to 0.05 mm or more and 2.0 mm or less in order to easily match a ruler or the like serving as a guide at the time of cutting and to ensure visibility.

  Moreover, the trim line 4 does not need to be a continuous line, and may be formed so as to be intermittently divided into a plurality in the longitudinal direction as illustrated in FIG. By dividing the trim line 4, the ruler or the like used as a guide when cutting may be aligned with the two trim lines 4 that are separated from each other. The interval between the divided trim lines 4 corresponds to, for example, the length of a ruler used when cutting, for example, about 25 cm to 30 cm.

  Further, as illustrated in FIG. 4, in addition to the trim line 4 described above, an auxiliary trim line 5 may be formed along the longitudinal direction on the trim line 4. The auxiliary trim line 5 may be formed at the same time when the conductor element 3 is formed by the same method as the trim line 4 and using the same conductive material as that of the conductor element 3.

  The auxiliary trim lines 5 are formed on the trim line 4 so as to be orthogonal to the outside of the trim line 4 and are arranged adjacent to each other at the same arrangement pitch P as the arrangement pitch P of the conductor elements 3. The element 3 is intermittently formed at an intermediate position at a distance of 1/2 pitch (P / 2) from each center line CL, CL.

  By forming the auxiliary trim line 5 in this way, by cutting the two auxiliary trim lines 5 facing each other across the formation region of the conductor element 3 with a ruler or the like, the edge of the cut FSS 1 is The distance between the center line CL of the conductor elements 3 arranged on the outermost side and the arrangement pitch P is ½ pitch (P / 2). Thereby, even when the FSS 1 is cut so as to correspond to a required size, a plurality of FSSs 1 can be arranged without shifting the arrangement pitch P of the conductor elements 3 between the FSSs 1.

  The number of the auxiliary trim lines 5 is not particularly limited, and only two to three may be provided at the end of the trim line 4 or may be provided over the entire length of the trim line 4. The auxiliary trim line 5 may be formed so as not to protrude inward from the trim line 4 and may be formed outside without contacting the trim line 4.

  The conductor element 3 is not limited to the cross shape exemplified in the embodiment, and may have various shapes. The present invention can be applied not only to the so-called patch type FSS but also to the slot type FSS.

It is a top view which illustrates the frequency selection board manufactured by the manufacturing method of the present invention. FIG. 2 is a partially enlarged view of the frequency selection plate in FIG. 1. FIG. 4 is a partially enlarged view of a frequency selection plate showing a modification of the trim line in FIG. 2. FIG. 10 is a partially enlarged view of a frequency selection plate showing another modification of the trim line of FIG. It is explanatory drawing which shows the state which arrange | positions a some frequency selection board adjacently.

Explanation of symbols

1 Frequency selection plate (FSS)
2 Substrate 3 Conductor element 4 Trim line 5 Auxiliary trim line 7 Base panel CL Center line of conductor element

Claims (4)

  In a method of manufacturing a frequency selection plate, in which a plurality of conductor elements having a predetermined shape are formed on a dielectric substrate at a predetermined arrangement pitch in the vertical direction and the horizontal direction, the centers of the conductor elements arranged on the outermost side on the substrate A method of manufacturing a frequency selective plate, wherein a trim line parallel to the center line is formed at the position outside the line by a half pitch of the arrangement pitch simultaneously with the formation of the conductor element using the same conductive material as the conductor element .   The method for manufacturing a frequency selection plate according to claim 1, wherein the trim line is formed intermittently by dividing the trim line continuously or in a plurality in the longitudinal direction.   The manufacturing method of the frequency selection board according to claim 1 or 2 which made thickness of said trim line 0.05 mm or more and 2.0 mm or less.   In the trim line, the auxiliary trim line perpendicular to the trim line at the same pitch as the arrangement pitch protrudes to the outside of the trim line at an intermediate position between the center lines of the conductor elements arranged adjacent to each other. The method for manufacturing a frequency selection plate according to claim 1, wherein the frequency selection plate is formed simultaneously with the formation of the conductor element by a conductive material.

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