JP2007220512A - Connector, conductive connection structure and probe member - Google Patents

Abstract

An object of the present invention is to provide a porous resin base material in which a functional part having an electrode and / or a circuit is provided on a porous resin film, without impairing the elasticity, stress relaxation function, conduction function, etc. of the porous base material. To provide a connector that can be attached in an electrically connectable state to an electronic component, a circuit board, or an inspection board of an inspection apparatus.
A connector comprising a porous resin base material provided with a functional part having an electrode and / or a circuit in a porous resin film, wherein the function is provided in a peripheral part surrounding the functional part of the porous resin film. A connector having a structure in which a stepped portion having a height lower than the height of the portion is formed, and an adhesive layer having a thickness smaller than the height of the stepped portion is provided on the surface of the stepped portion; A conductive connection structure fixed to the apparatus; and a probe member formed by fixing the connector to an inspection substrate of the inspection apparatus.
[Selection] Figure 1

Description

  The present invention relates to a connector comprising a porous resin base material having a functional part in which electrodes and / or circuits are formed, and having an adhesive layer provided on a step part around the functional part. Here, “electrode and / or circuit” means “electrode or circuit or electrode and circuit”. The connector of the present invention has elasticity and stress relaxation function, and can provide a conduction function in the film thickness direction by providing a plurality of cylindrical electrodes penetrating the porous resin film.

  The connector of the present invention can be attached to an electronic component (IC chip, LSI chip, etc.) or circuit board (printed circuit board, etc.) in an electrically connectable state to form a conductive connection structure. Moreover, the connector of this invention can form the probe member for a test | inspection by affixing on the test | inspection board | substrate of the test | inspection apparatus used for electrical test | inspection of an electronic component etc. in the state which can be electrically connected.

  In Japanese Patent Application Laid-Open No. 2004-265844 (Patent Document 1), an electrically insulating porous resin film is used as a base film, and a plurality of parts penetrating in a thickness direction from a first surface to a second surface at a plurality of locations of the base film. An anisotropic conductive film is disclosed in which a conductive portion is formed by attaching a conductive metal to a resin portion on the inner wall surface of each through hole.

  In the anisotropic conductive film described in Patent Document 1, a plurality of conductive portions are independently formed in the thickness direction of the electrically insulating porous resin film, and can be conducted in the film thickness direction. There is no conduction or short circuit between the conductive parts.

  The conducting portion is obtained by attaching a conductive metal to the resin portion constituting the porous structure of the inner wall surface of the through hole by electroless plating or the like, and can be called a “tubular electrode” because of its shape. By adjusting the adhesion amount of the conductive metal, the conductivity in the film thickness direction of the cylindrical electrode can be controlled. Normally, a load in the film thickness direction is applied to the anisotropic conductive film to compress the entire anisotropic conductive film including the cylindrical electrode, thereby making the contact state between the conductive metals of the cylindrical electrode dense. Is conducting.

  This anisotropic conductive film is elastic in the film thickness direction and can conduct in the film thickness direction with a low compressive load. In addition, the anisotropic conductive film can refine the size and pitch of each conductive portion. The anisotropic conductive film is, for example, an anisotropic conductive film for inspection of electronic components such as semiconductor integrated circuit devices, and can provide electrical conduction in the film thickness direction with a low compressive load. However, the film thickness is restored by elasticity, and can be used repeatedly for inspection. Furthermore, since the anisotropic conductive film is excellent in heat resistance, it can withstand temperature conditions in a burn-in test or a heat cycle test.

  More specifically, in order to perform electrical inspection of circuit devices such as electronic components (semiconductor integrated circuit devices, etc.) and circuit boards (printed circuit boards, etc.), each electrode of these circuit devices, each electrode of the inspection device, It is necessary to connect each correctly. However, since each electrode of the inspection device is arranged on a rigid substrate, it is difficult to accurately connect each electrode of the circuit device and each electrode of the inspection device, or due to temperature change There has been a problem that mismatching occurs in connection, and that each electrode is easily damaged by contact between the electrodes.

  Therefore, a method is adopted in which an elastic anisotropic conductive film is interposed between the electrode region of the circuit device and the electrode region of the inspection device, and the electrodes are electrically connected through the anisotropic conductive film. Has been. For example, JP 2002-324600 A (Patent Document 2) discloses an anisotropic conductive elastomer sheet in which a plurality of conductive portions are formed by orienting magnetic conductive particles in a thickness direction at predetermined intervals, and an electronic component. It is disclosed that an anisotropic conductive connector is disposed between the circuit board and the circuit board.

  The anisotropic conductive film disclosed in Patent Document 1 can be used, for example, as an anisotropic conductive film for electrical inspection of a circuit device. In this case, the anisotropic conductive film has a positional relationship of the anisotropic conductive film so that the electrical connection is accurately made to each electrode of the circuit device and each electrode of the inspection circuit board of the inspection device. Must be set and fixed.

  When the anisotropic conductive film is disposed between an electronic component (for example, a semiconductor chip) and a circuit board (for example, a printed circuit board), it functions as a kind of connector having a stress relaxation function and a conduction function. be able to. Even when used in such applications, it is necessary to fix the anisotropic conductive film in a predetermined positional relationship.

  As a method of fixing the anisotropic conductive film, there is a method of sandwiching it between an electronic component and a circuit board, but the structure for that is complicated, the operation is complicated, and stable fixing is difficult. It is. As other methods, for example, a mechanical method such as pinning or adhesion by an adhesive is conceivable. For pinning, a plurality of pin holes are provided in the peripheral portion of the anisotropic conductive film, and the anisotropic conductive film is passed through the pin holes by a pin to a predetermined location such as a circuit board (including a circuit board for inspection). Secure to.

  However, an anisotropic conductive film based on a porous resin film is very flexible, so if it is pinned, it deforms during use or breaks from the periphery of the pin hole and is fixed first. It may become impossible to hold the position. Further, when the anisotropic conductive film is fixed to the circuit board using an adhesive, it is difficult to replace the anisotropic conductive film.

  On the other hand, a method of fixing an anisotropic conductive film to an electronic component or a circuit board using an adhesive is conceivable, but in order to stably fix an adhesive using an adhesive, an adhesive layer having a certain thickness is provided. There is a need. However, when a thick pressure-sensitive adhesive layer is formed on the surface of the anisotropic conductive film, it becomes difficult to conduct the conduction part or it is necessary to increase the load for conduction.

  Patent Document 2 discloses a method in which a frame plate is embedded in a peripheral portion of an anisotropic conductive elastomer sheet and is fixed to an electronic component or a circuit board by a fixing member using a hole provided in the frame plate. . However, an anisotropic conductive film having a porous resin film as a base film cannot embed a frame plate. When the frame plate is fixed to the surface of the anisotropic conductive film, it becomes difficult to conduct the conduction portion or increase the load for conduction depending on the thickness of the frame plate.

  In general, the above problems are caused by using as a connector a porous resin base material in which a functional part having an electrode and / or a circuit is provided on a porous resin film, and an electronic component (IC chip, LSI chip, etc.) or circuit board ( Such as a printed circuit board) and a circuit board for inspection of an inspection apparatus.

JP 2004-265844 A JP 2002-324600 A

  An object of the present invention is to use, when a porous resin base material provided with a functional part having an electrode and / or circuit on a porous resin film is used as a connector, the elasticity, stress relaxation function, and electrical conductivity of the porous base material. Provided is a connector comprising a porous base material having a novel structure that can be attached in an electrically connectable state to an electronic component, a circuit board, or an inspection board of an inspection apparatus without impairing the function or the like. There is.

  Another object of the present invention is to provide a conductive connection structure in which the connector is attached and fixed in an electrically connectable state with an electronic component or a circuit board. Furthermore, the subject of this invention is providing the probe member which affixed this connector on the test | inspection board | substrate of the test | inspection apparatus used for electrical test | inspection of an electronic component etc. in the state which can be electrically connected.

  As a result of intensive studies to solve the above problems, the present inventors have found that the peripheral portion surrounding the functional portion of the porous resin base material on which the functional portion having electrodes and / or circuits is formed, The inventors have conceived a connector having a structure in which a step portion having a height lower than the height is formed, and an adhesive layer having a thickness smaller than the height of the step is formed on the surface of the step portion.

  In order to form the stepped portion on the porous resin base material, for example, a heat pressing method can be employed. Unlike the anisotropic conductive elastomer sheet, the porous resin base material can easily form a step by heating and pressing. When the peripheral part of the anisotropic conductive elastomer sheet is hot-pressed, the elastomer present in the peripheral part is moved to the central part, so that the thickness of the functional part is likely to fluctuate or deform easily. On the other hand, the porous resin base material has a dense porous structure at the place where the heat pressing is performed, but the thickness of the functional part where the electrode and / or the circuit is formed is changed by forming a step by the heat pressing. Or deforming the shape. Moreover, the step part which has a desired level | step difference can be provided by controlling heating press conditions.

  The pressure-sensitive adhesive layer is provided on the stepped portion of the porous resin base material. By making the thickness of the pressure-sensitive adhesive layer smaller than the height of the step, the upper surface of the functional unit is positioned above the upper surface of the pressure-sensitive adhesive layer. Therefore, the elasticity and continuity in the functional part are not impaired. Since the functional part in which the electrode and / or the circuit are formed protrudes upward, the contact between the electrode and / or the circuit of the functional part and the electrode or the circuit of the circuit device or the inspection device is not hindered.

  The connector of the present invention can be fixed on a circuit board or the like by placing it on the circuit board or the like on the pressure-sensitive adhesive layer side and applying pressure. At this time, since the protruding functional part is compressed, the surface of the pressure-sensitive adhesive layer and the surface of the functional part form substantially the same surface. When the connector includes a plurality of conducting portions (cylindrical electrodes) penetrating in the film thickness direction, conduction is facilitated by compression of the functional portion. By using the adhesive layer, when a problem occurs in the connector, the connector can be peeled off and easily replaced with a new connector. The present invention has been completed based on these findings.

  According to the present invention, there is provided a connector comprising a porous resin base material in which a functional part having an electrode and / or a circuit is provided on a porous resin film, and the peripheral part surrounding the functional part of the porous resin film. A connector having a structure in which a step portion having a height lower than the height of the functional portion is formed and an adhesive layer having a thickness smaller than the height of the step is provided on the surface of the step portion. Provided.

  Further, according to the present invention, the connector can be electrically connected to an electronic component or circuit board having electrodes disposed on the surface thereof, and the electrode and / or circuit of the connector and the electrode of the electronic component or circuit board. In such a state, a conductive connection structure fixed by the pressure-sensitive adhesive layer is provided.

  Further, according to the present invention, the connector is provided on an inspection circuit board of an inspection apparatus used for electrical inspection of an electronic component or a circuit board, and on the electrode and / or circuit of the connector and the surface of the inspection circuit board. A probe member fixed by the pressure-sensitive adhesive layer is provided in a state where it can be electrically connected to the arranged inspection electrode.

  According to the present invention, a porous resin base material on which electrodes and / or circuits are formed is fixed to a circuit board or the like without impairing the performance of the porous resin base material such as elasticity, stress relaxation function, and conduction. A connector provided with a pressure-sensitive adhesive layer is provided. The connector of the present invention can be easily fixed by being affixed to an electronic component, a circuit board or the like. In addition, when a failure occurs in the connector, the connector is peeled off and easily replaced with a new connector. be able to.

  For example, when the connector of the present invention is disposed between an electronic component and a circuit board, the connector functions as a connector having a stress relaxation function and a conduction function. Moreover, if the connector of this invention sticks and fixes to a circuit board etc., a compact conductive connection structure can be obtained. Similarly, the connector of the present invention can provide a probe member having a stress relaxation function and a conduction function if it is stuck and fixed to an inspection circuit board of an inspection device used for electrical inspection of electronic components and the like.

1. Porous resin membrane (base membrane):
In the present invention, a porous resin film formed from an electrically insulating rigid resin is used as a base film. When the connector of the present invention is used by being fixed to an inspection circuit board of an inspection device used for electrical inspection (for example, continuity inspection) of an electronic component or a circuit board, the porous resin film has a burn-in test condition. It is required to have heat resistance enough to withstand.

  As a preferable synthetic resin material for forming the porous resin film, for example, polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer ( Fluororesin such as PFA), polyvinylidene fluoride (PVDF), polyvinylidene fluoride copolymer, ethylene / tetrafluoroethylene copolymer (ETFE resin); polyimide (PI), polyamideimide (PAI), polyamide (PA ), Modified polyphenylene ether (mPPE), polyphenylene sulfide (PPS), polyetheretherketone (PEEK), polysulfone (PSU), polyethersulfone (PES), and engineering engineers such as liquid crystal polymer (LCP) Plastic; and the like.

  Among these synthetic resin materials, fluororesins are more preferable, and polytetrafluoroethylene (PTFE) is particularly preferable from the viewpoints of heat resistance, processability, mechanical properties, dielectric properties, and the like.

  Examples of a method for producing a porous resin film made of a synthetic resin include a pore making method, a phase separation method, a solvent extraction method, a stretching method, and a laser irradiation method. Among these, the stretching method is preferable in that the average pore diameter and the porosity can be easily controlled. By forming a porous resin film using a synthetic resin, elasticity can be given in the film thickness direction, and the dielectric constant can be further lowered.

  The porous resin film used as the base film preferably has a porosity of about 20 to 80%. The porous resin film preferably has an average pore diameter of 10 μm or less or a bubble point of 2 kPa or more. From the viewpoint of fine pitching of the conducting part, the average pore diameter is preferably 5 μm or less, and more preferably 1 μm or less. The lower limit value of the average pore diameter is about 0.05 μm. The bubble point of the porous resin film is preferably 5 kPa or more, more preferably 10 kPa or more. The upper limit of the bubble point is about 300 kPa, but is not limited to this.

  Although the film thickness of a porous resin film can be suitably selected according to a use purpose or a use location, it is 20-3000 micrometers normally, Preferably it is 25-2000 micrometers, More preferably, it is 30-1000 micrometers. Therefore, the thickness of the porous resin film includes regions of a film (less than 250 μm) and a sheet (250 μm or more). If the thickness of the porous resin film is too thin, it becomes difficult to form a stepped portion having a step enough to dispose the pressure-sensitive adhesive layer.

  Among the porous resin membranes, porous polytetrafluoroethylene membranes (stretched porous PTFE membranes) obtained by the stretching method are excellent in heat resistance, workability, mechanical properties, dielectric properties, etc. and have a uniform pore size distribution Since it is easy to obtain a porous resin film having the above, it is the most excellent material as a base film. In addition, the stretched porous PTFE membrane has a fine network structure composed of a large number of fibrils and nodes, and a conductive metal such as plating particles is easily attached to the fibrils.

  The expanded porous PTFE membrane used in the present invention can be produced, for example, by the method described in Japanese Examined Patent Publication No. 42-13560. First, a liquid lubricant is mixed with the unsintered powder of PTFE and extruded into a tube shape or a plate shape by ram extrusion. When a thin sheet is desired, the plate is rolled by a rolling roll. After the extrusion rolling process, the liquid lubricant is removed from the extruded product or the rolled product as necessary. When the extruded product or rolled product thus obtained is stretched at least in a uniaxial direction, unsintered stretched porous PTFE is obtained in the form of a film. An unsintered stretched porous PTFE membrane is heated to a temperature of 327 ° C. or higher, which is the melting point of PTFE, while being fixed so that shrinkage does not occur. A porous PTFE membrane is obtained. When the stretched porous PTFE membrane has a tube shape, a flat membrane can be obtained by cutting the tube.

  The stretched porous PTFE membrane has a fine network composed of very thin fibrils formed by PTFE and nodes connected to each other by the fibrils. In the stretched porous PTFE membrane, this fine network structure forms a porous structure.

2. Porous resin substrate with electrodes and / or circuits formed:
When the porous resin base material on which the electrode is formed is used as an anisotropic conductive film, the second surface from the first surface to the second portion of the base film made of an electrically insulating porous resin film formed from a synthetic resin. A through-hole penetrating in the thickness direction is formed over the surface, and then a conductive metal is attached to a porous resin portion (for example, fibril) on the inner wall surface of each through-hole to impart conductivity in the film thickness direction. It is preferable that a plurality of conductive portions (cylindrical electrodes) that can be formed are formed independently. In general, the conductive metal can be attached by a method in which plating particles are attached to the resin portion of the porous structure on the inner wall surface of each through hole by electroless plating or a combination of electroless plating and electroplating.

  The method of providing a plurality of through holes in the thickness direction of the porous resin film and the method of forming a conductive portion (cylindrical electrode) by adhesion of conductive metal on the inner wall surface of the through holes are not particularly limited. The method described below can be illustrated.

For example, the following steps 1 to 5:
(A) Step 1 of laminating a resin layer as a mask layer on both surfaces of the porous resin film to form a three-layer laminate;
(B) Step 2 of forming a plurality of through holes penetrating in the thickness direction in the laminate;
(C) Step 3 of attaching a catalyst that promotes a reduction reaction of metal ions to the surface of the laminate including the inner wall surface of the through hole;
(D) Step 4 of peeling the mask layer from the porous resin film; and (e) Step 5 of attaching a conductive metal to the resin portion of the inner wall surface of the through hole using the catalyst.
The manufacturing method of the porous resin base material containing this can be mentioned.

  A resin material is preferably used as the material of the mask layer. When a porous fluororesin film is used as the porous resin film, it is preferable to use the same type of porous fluororesin film as the mask layer, but it is made of a fluororesin nonporous film or a resin material other than fluororesin. A non-porous resin film or a porous resin film can also be used. From the viewpoint of the balance between fusibility between layers and peelability, it is preferable to use a porous resin film having the same quality as the porous resin film as the material of the mask layer.

  Mask layers are arranged on both sides of the porous resin film, and generally the three layers are integrated by fusion. When an expanded porous PTFE film is used as the porous resin film, it is preferable to use the same expanded porous PTFE film as the mask layer. These three layers can be formed into a laminate in which the respective layers are fused by thermocompression bonding. This laminate can be easily peeled off in a later step.

  A plurality of through holes are formed in the laminated body in the thickness direction. As a method of forming the through hole, i) a mechanical drilling method, ii) a method of etching by a photoablation method, iii) an ultrasonic head having at least one vibrator at the tip, and the vibration For example, a method of punching by applying ultrasonic energy by pressing the tip of the child is used.

  For mechanical drilling, for example, a machining method such as pressing, punching, or drilling can be employed. According to the machining method, for example, a through hole having a relatively large diameter of 100 μm or more, in many cases 200 μm or more, and further 300 μm or more can be formed at low cost. Through holes with smaller diameters can also be formed by machining.

  When the through-hole is formed by the light ablation method, light is applied to the surface of the laminate through a light shielding sheet (mask) having a plurality of light transmission parts (openings) that are independent in a predetermined pattern. Therefore, it is preferable to employ a method of forming a patterned through hole. Light is transmitted through a plurality of openings of the light shielding sheet, and the irradiated portion of the laminate is etched to form a through hole. According to this method, for example, a through hole having a relatively small diameter of 10 to 200 μm, in many cases 15 to 150 μm, and further 20 to 100 μm can be formed. Examples of irradiation light in the photoablation method include synchrotron radiation light and laser light.

  In the ultrasonic method, a patterned through-hole is formed by applying ultrasonic energy to the laminate using an ultrasonic head having at least one vibrator at the tip. Ultrasonic energy is applied only to the vicinity where the tip of the vibrator contacts, and the temperature rises locally due to the vibrational energy generated by the ultrasonic wave, and the resin is easily cut and removed to form a through hole.

  The shape of the through hole is arbitrary such as a circle, an ellipse, a star, an octagon, a hexagon, a quadrangle, and a triangle. The diameter of the through hole can be reduced to 5 to 100 μm, and further to 5 to 30 μm in an application field where a small diameter through hole is suitable. On the other hand, in a field where a relatively large through-hole is suitable, the diameter of the through-hole can be increased to usually 100 to 3000 μm, in many cases 150 to 2000 μm, and further to 200 to 1500 μm. A plurality of through holes are preferably formed in a predetermined pattern according to the distribution of electrodes of a circuit device such as a semiconductor integrated circuit device or a printed circuit board.

  In order to attach a catalyst that promotes the reduction reaction of metal ions (also referred to as “plating catalyst”) to the surface of the laminate including the inner wall surface of the through-hole, the laminate is sufficiently applied to, for example, a palladium-tin colloid catalyst application liquid. What is necessary is just to immerse, stirring. A conductive metal is selectively attached to the inner wall surface by utilizing the catalyst remaining on the inner wall surface of the through hole. An electroless plating method is suitable as a method for attaching the conductive metal.

  Before performing electroless plating, the catalyst (for example, palladium-tin) remaining on the inner wall surface of the through hole is activated. Specifically, by immersing in a commercially available organic acid salt or the like for activating the plating catalyst, tin is dissolved and the catalyst is activated. By immersing the porous resin film provided with the catalyst on the inner wall surface of the through hole in the electroless plating solution, the conductive metal (plating particles) can be deposited only on the inner wall surface of the through hole to which the catalyst is attached. By this method, a cylindrical electrode is formed. Examples of the conductive metal include copper, nickel, silver, gold, and a nickel alloy. However, when high conductivity is required, it is preferable to use copper.

  When using the stretched porous PTFE membrane, the plating particles are deposited so as to be entangled with the resin portion (mainly fibrils) exposed on the inner wall surface of the through-hole of the stretched porous PTFE membrane at first, so that the plating time is controlled. It is possible to control the adhesion state of the conductive metal. By setting an appropriate plating amount, a conductive metal layer is formed while maintaining a porous structure, and it is possible to provide elasticity in the film thickness direction as well as elasticity.

  The thickness of the resin portion in the porous structure (for example, the thickness of the fibril of the stretched porous PTFE membrane) is preferably 50 μm or less. The particle diameter of the conductive metal is preferably about 0.001 to 5 μm. The amount of conductive metal deposited is preferably about 0.01 to 4.0 g / ml in order to maintain the porous structure and elasticity.

  The conductive part (cylindrical electrode) produced as described above preferably uses an antioxidant or is coated with a noble metal or an alloy of noble metal in order to improve oxidation prevention and electrical contact. As the noble metal, palladium, rhodium, and gold are preferable from the viewpoint of low electric resistance. The thickness of the coating layer is preferably 0.005 to 0.5 μm, more preferably 0.01 to 0.1 μm. For example, when the conductive part is coated with gold, a method of performing displacement gold plating after coating the conductive metal layer with nickel of about 8 nm is effective.

  When an expanded porous PTFE membrane is used as the porous resin membrane, a cylindrical electrode having a structure in which conductive metal particles adhere to fibrils is formed on the inner wall surface of the through hole. When a stress in the thickness direction is applied to the porous fluororesin substrate, the distance between the fibrils is reduced, so that the stress is relaxed and the structure of the cylindrical electrode is maintained without being destroyed. Therefore, even if a compressive force is repeatedly applied to the stretched porous PTFE base material, the cylindrical electrode is unlikely to deteriorate.

  The cylindrical electrode usually has a structure in which a conductive metal adheres only to the inner wall surface of a through-hole provided in the thickness direction of the porous fluororesin film. By performing electroplating in addition to electrolytic plating, one or both of the two open ends of the cylindrical electrode may be closed to form a lid made of a conductive metal. When the amount of plating is increased, plating particles grow from the edge of the opening end, and the alignment end is closed. Further, as a method for closing the opening end without increasing the amount of conductive metal attached to the inner wall surface of the through hole, there is a method of applying a high-viscosity paste containing conductive metal particles to the opening end. . By such a method, when the lid is formed by closing the opening end of the cylindrical electrode with a conductive material, the cylindrical electrode of the porous fluororesin base material, the electronic component, the circuit board, the circuit board for inspection, etc. The contact area with the electrode can be increased.

  In addition to the cylindrical electrode as described above, various structures of electrodes and circuits can be formed on the porous resin substrate used in the present invention. For example, there is a method in which a substrate in which a copper foil is bonded to the surface of a porous resin film is prepared, and electrodes and / or circuits are formed on the copper foil layer using a photolithography technique. Also, a plating catalyst is applied to the porous resin film in the same pattern as the electrode or circuit shape, and the electrode or circuit is formed by using the plating catalyst by electroless plating or a combination of electroless plating and electrolytic plating. There is a way. Furthermore, there is a method in which a conductive metal plating layer is formed on one surface or both surfaces of a porous resin substrate, and electrodes and / or circuits are formed using a photolithography technique.

  The porous resin base material is provided with a functional part having an electrode and / or a circuit, but in order to provide an adhesive layer, no electrode and / or circuit is formed in the peripheral part of the functional part. Has a place.

3. connector:
In the connector of the present invention, a step portion is formed on a porous resin base material in which a functional portion having electrodes and / or circuits is provided on a porous resin base film, and an adhesive layer is provided on the surface of the step portion. It has a structure.

  A manufacturing process of an example of the connector of the present invention is shown in FIG. A porous resin substrate 1 shown in FIG. 1 has a plurality of through-holes 102 formed in a porous resin film 101, and a conductive portion is attached to a resin portion on the inner wall surface of the through-hole. ) 103 is formed. This porous resin base material 1 can be conducted by the conducting portion 103 in the film thickness direction, and in the lateral direction, each conducting portion is insulated by the porous resin. Can be used.

  The conducting portions 103, 103... Of the porous resin base material 1 constitute a functional portion. A step portion having a height lower than the height of the functional portion is formed in a peripheral portion surrounding the functional portion of the porous resin film. A method for forming the stepped portion is not particularly limited, but a method of hot pressing is preferable. The heating temperature at the time of hot pressing is a temperature lower than the thermal decomposition temperature of the resin material constituting the porous resin substrate, and can be appropriately set depending on the type of the resin material. When the base membrane is an expanded porous PTFE membrane, it is usually 200 to 320 ° C. The pressure and pressurizing time can be appropriately set according to the type of the resin material under the condition that the shape of the stepped portion is fixed.

  In order to form the step portion, a method other than the hot press method may be employed. Examples of other methods include machining such as cutting, but generally, it is difficult to cut a thin porous resin substrate with an accurate film thickness, which is not efficient. Further, although the step portion can be formed by the photoablation method, it is not necessarily suitable for efficiently etching a wide region.

  By forming the stepped portion in the porous resin base material 1, the protruding functional portion 105 and the porous resin base material 2 having the stepped portion 104 in the peripheral portion of the functional portion 105 are obtained. Next, the pressure-sensitive adhesive layer 106 is formed on the surface of the step portion of the porous resin substrate 2.

  Examples of the pressure sensitive adhesive include rubber pressure sensitive adhesive, acrylic pressure sensitive adhesive, and silicone pressure sensitive adhesive. Rubber-based adhesives include solvent-based adhesives such as natural rubber, styrene-butadiene, polyisobutylene, and isoprene; styrene-isoprene block copolymers, styrene-butadiene block copolymers, and styrene-ethylene-butylene. And hot-melt adhesives such as block copolymers and ethylene-vinyl acetate thermoplastic elastomers. Acrylic adhesives include a solution type and an emulsion type.

  In order to provide a pressure-sensitive adhesive layer on the surface of the stepped portion, for example, a method of applying a pressure-sensitive adhesive on the surface of the stepped portion, and after sticking an adhesive tape having a release liner disposed on one side on the surface of the stepped portion. A method of removing the release liner, a method of bonding a dry film of an adhesive onto the surface of the stepped portion, a method of bonding onto the surface of the stepped portion with one pressure-sensitive adhesive layer of the double-sided adhesive tape, etc. may be adopted. Among these, the method of applying the pressure-sensitive adhesive is preferable because a part of the pressure-sensitive adhesive enters the porous structure of the porous resin film, so that the pressure-sensitive adhesive layer can be fixed to the step portion by the anchor effect. Examples of the method for applying the pressure-sensitive adhesive include a method for applying a solution or an emulsion of the pressure-sensitive adhesive.

  FIG. 2 shows a cross-sectional view of the connector of the present invention. If the height of the functional part 105 of the porous resin substrate is a and the height of the step part 104 is b, then a> b, and the difference c (ab = c) represents the height of the step. . When the thickness of the pressure-sensitive adhesive layer 106 is d, c> d, and the difference e (cd = e) indicates the difference in height between the upper surface of the pressure-sensitive adhesive layer 106 and the upper surface of the functional part 105.

  The height b of the stepped portion is usually 20 to 90%, preferably 30 to 85%, more preferably 40 to 80% of the thickness a of the porous resin substrate. If the height b of the step portion is too high, the thickness d of the pressure-sensitive adhesive layer cannot be sufficiently increased. If the height b of the stepped portion is too low, the elasticity of the entire porous resin substrate may be impaired, or deformation may occur during hot pressing.

  The height difference e between the upper surface of the functional part 105 and the upper surface of the pressure-sensitive adhesive layer 106 depends on the thickness of the porous resin substrate, but is usually 2 to 500 μm, preferably 3 to 450 μm, more preferably 5 to 400 μm. It is. If the difference e is too short, the elasticity of the functional unit 105 is impaired, or connection with an electronic component or an electrode of a circuit board becomes difficult. If this difference e is too long, an excessive compressive force may be applied to the function unit 105. Since the functional part 105 protrudes moderately, electrical connection with an electronic component, a circuit board, etc. can be achieved with a low load.

  When the thickness of the porous resin substrate is large, step portions may be provided on both surfaces, and an adhesive layer may be provided on each step portion. When the thickness of the porous resin substrate is 300 μm or more, preferably 400 μm or more, heat press from both sides to form stepped portions on both sides, and a thickness smaller than the step height on the surface of each stepped portion. It is possible to provide an adhesive layer having A connector in which an adhesive layer is formed on both sides can be disposed, for example, between an electronic component and a circuit board, and these can be simultaneously fixed by the adhesive layer.

4). Conductive connection structure:
The connector of the present invention is an electronic component or circuit board having an electrode disposed on the surface thereof, in a state where the electrode and / or circuit of the connector and the electrode of the electronic component or circuit board can be electrically connected. By fixing with an agent layer, a conductive connection structure can be produced.

  Electronic components include IC chips, LSI chips, IC chips or packages containing LSI chips, active components made of semiconductor devices such as transistors, diodes, and multichip modules; passive components such as resistors, capacitors, and crystal units; Can be mentioned. Among these, a semiconductor device is preferable, and a semiconductor integrated circuit device is more preferable.

  Examples of the circuit board include a single-sided or double-sided printed circuit board and a multilayer printed circuit board. The circuit board includes a flexible board, a rigid board, and a flex / rigid board obtained by combining these.

  3 and 4 are sectional views showing an example of a conductive connection structure in which the connector of the present invention is fixed to a circuit board. As shown in FIG. 3, the connector 3 of the present invention is disposed on a circuit board 4. The circuit board 4 has an electrode 302 disposed on one surface of a circuit board body 301 and an external terminal (external electrode) 304 such as a solder ball disposed on the other surface. 303 is connected.

  When the circuit board 4 is fixed and pressurized or heated and pressurized from the upper surface of the connector 3, as shown in FIG. 4, the protruding functional portion 105 of the connector is compressed and closely contacts the electrode area of the circuit board. The connector is fixed to the surface of the circuit board by the adhesive layer 106 of the connector. The conductive portion (cylindrical electrode) of the connector is brought into strong contact with the electrode of the circuit board by the compression of the functional portion, so that reliable electrical connection is achieved. That is, the conductive connection structure 5 having a structure in which the connector and the circuit board are fixed by the adhesive layer is obtained. For example, an electronic component can be placed on the surface of the connector portion of the conductive connection structure. Both are arranged by adjusting the positional relationship so that each conductive portion (electrode) of the connector and each electrode of the electronic component can conduct. The electronic component is protected from impact and the like by the elasticity and stress relaxation function of the connector, and is electrically connected to the circuit board by the conduction function of the connector.

  The connector is fixed to the electronic component such as an IC chip by the adhesive layer in a state where the electrode and / or circuit of the connector and the electrode of the electronic component can be electrically connected to each other. Can also be produced.

5). Probe member:
The connector of the present invention is provided on an inspection circuit board of an inspection apparatus used for electrical inspection of an electronic component or a circuit board, and an electrode for the connector and / or a circuit and an inspection electrode disposed on the surface of the inspection circuit board. And the probe member can be manufactured by fixing with the pressure-sensitive adhesive layer in a state where can be electrically connected.

  In general, an inspection apparatus has an inspection electrode according to a pattern corresponding to a pattern of an inspection target electrode of an electronic component to be inspected (for example, a semiconductor integrated circuit device such as an IC chip) or a circuit board (for example, a printed circuit board). An inspection circuit board is formed on the surface. However, there is a case where a pitch conversion board is arranged between the electronic component electrode and the circuit board for inspection corresponding to the fine pitch of the electrode. In such a case, the electrode of the inspection melting furnace substrate is arranged. The pattern may have a pitch different from the pattern of the electronic component to be inspected or the inspected electrode of the circuit board.

  FIG. 5 is a cross-sectional view showing an example of the probe member of the present invention. An inspection device 504 used for an electrical test of electronic components or the like includes an inspection circuit board 501. An inspection electrode 502 is disposed on the surface of the inspection circuit board 501, and the inspection electrode 502 is electrically connected to an inspection apparatus by a lead wire or a bonding wire 503. When the connector of the present invention is placed on the surface of the circuit board 501 for inspection and the connector of the present invention is pressed or heated and pressed, the protruding functional portion 105 of the connector is compressed and the adhesive layer 106 causes the connector to be connected. Fixed to the surface of the circuit board for inspection. Thereby, the probe member 6 of the present invention is obtained. The probe member 6 is electrically connected to the inspection device 504.

  Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

[Example 1]
It consists of an expanded porous PTFE membrane having a porosity (ASTM-D-792) of 60%, an average pore diameter of 0.1 μm, a bubble point (measured in accordance with ASTM-F-316-76 using isopropyl alcohol) of 150 kPa and a thickness of 600 μm. A stretched porous PTFE sheet having a porosity of 60%, an average pore diameter of 0.1 μm, and a thickness of 30 μm is superposed on both surfaces of the base film, and sandwiched between two 3 mm thick stainless steel plates, and a load from the stainless steel plate is applied. At the same time, heat treatment was performed at 350 ° C. for 30 minutes. After heating, it was quenched with water from the top of the stainless steel plate to obtain a laminate of porous PTFE membranes fused in three layers.

  The porous PTFE substrate obtained as described above was cut into a 10 mm square. A plurality of conducting portions were designed in advance so as to be arranged at the center of a sample cut into a 10 mm square. This sample was heated and pressed (heating temperature 250 ° C., pressure 5 MPa, pressing time 10 minutes) to form a step portion having a height of 400 μm and a width of 2 mm.

  Next, a tungsten sheet (mask) having an aperture ratio of 9%, an aperture diameter of 15 μmφ, and a pitch of 80 μm, arranged in a uniform arrangement is stacked on one side of the laminate, and irradiated with synchrotron radiation to have a hole diameter of 15 μmφ in the film thickness direction. A plurality of through holes arranged uniformly at a pitch of 80 μm were formed.

  The laminate with 15 μmφ through-holes made hydrophilic by immersing in ethanol for 1 minute, and then immersed in Melplate PC-321 made by Meltex for 4 minutes at a temperature of 60 ° C. diluted to 100 ml / L. Degreasing treatment was performed. Further, after immersing the laminate in 10% sulfuric acid for 1 minute, as a pre-dip, immersed in 0.8% hydrochloric acid for 2 minutes in a solution of Meltex Co., Ltd. Enplate PC-236 dissolved at a rate of 180 g / L. did.

  Further, the laminate was prepared by adding 150% of Enplate PC-236 manufactured by Meltex Co., Ltd. in an aqueous solution prepared by dissolving 3% of Enplate Activator 444 manufactured by Meltex Co., Ltd., 1% of Enplate Activator Additive, and 3% of hydrochloric acid. The catalyst particles were adhered to the surface of the laminate and the wall surface of the through hole by immersing in a solution dissolved with the inclusion of L for 5 minutes. Next, the laminate was immersed in a 5% solution of Enplate PA-360 manufactured by Meltex Co., Ltd. for 5 minutes to activate the palladium catalyst nucleus. Thereafter, the first and third mask layers were peeled off to obtain a porous PTFE membrane having catalytic palladium particles attached only to the inner wall surface of the through hole.

  Meltex Co., Ltd. Melplate Cu-3000A, Melplate Cu-3000B, Melplate Cu-3000C, Melplate Cu-3000D are each 5%, and Melplate Cu-3000 Stabilizer is 0.1%. The porous PTFE membrane was immersed in an electrolytic copper plating solution for 20 minutes with sufficient air stirring, and only the wall surface of the 15 μmφ through hole was made conductive with copper particles (electrode outer diameter = 25 μm). Furthermore, it was immersed in Entex Cu-56 manufactured by Meltex Co., Ltd., which was built at 5 ml / L for 30 seconds, treated to prevent rust, and a conductive part (through a porous PTFE film as a base film) penetrating in the film thickness direction ( A porous PTFE base material on which a cylindrical electrode) was formed was obtained.

  In the plating process, after immersion in each liquid other than between the pre-dip process and the catalyst application process of electroless steel plating, the plate was washed with distilled water for about 30 seconds to 1 minute. The temperature of each solution was all normal temperature (20-30 degreeC) except the degreasing process.

  Applying an ethyl acetate solution (70% solvent) of acrylic pressure-sensitive adhesive (2-ethylhexyl acrylate / methyl acrylate / maleic anhydride copolymer = 78/20/2 weight ratio) to the stepped part to a thickness of 100 μm And dried to form an adhesive layer having a thickness of 20 to 30 μm.

  It was confirmed that the connector made of the stretched porous PTFE base material thus obtained was compressed when a load was applied to the functional part, and elastically recovered to the original shape when the load was removed. This connector is placed on the inspection electrode area formed on the surface of the inspection circuit board of the inspection apparatus, and the positional relationship is established so that each inspection electrode and each conductive portion (tubular electrode) of the connector are connected. Adjust, pressurize and crimp.

  With the inspection apparatus having the probe member thus obtained, the semiconductor chip continuity inspection was repeated 50 times or more, but no dropout, breakage, or deformation of the connector was observed. Further, when the connector was peeled off from the probe member, no problems such as damage were found in the underlying circuit board for inspection.

  Since the connector of the present invention has a stress relaxation function and an electrical connection function (for example, anisotropic conductivity), it can be used by being disposed between an electronic component and a circuit device, for example. Moreover, the connector of this invention can comprise the probe member which has a stress relaxation function and an electrical connection function by fixing to the circuit board for a test | inspection of test | inspection apparatuses, such as an electronic component.

It is a flowchart which shows the manufacturing process of an example of the connector of this invention. It is explanatory drawing which shows the relationship between the height of the function part in the connector of this invention, the height of a level | step-difference part, and the thickness of an adhesive layer. It is sectional drawing which shows the fixing method to the circuit board of the connector of this invention. It is sectional drawing which shows an example of the conductive connection structure which fixed the connector of this invention to the circuit board. It is sectional drawing which shows an example of the probe member which fixed the connector of this invention to the circuit board for an inspection of an inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Porous resin base material 2 Porous resin base material which has a level difference part 3 Porous resin base material (connector) by which the adhesive layer was provided on the surface of the level difference part
DESCRIPTION OF SYMBOLS 4 Circuit board 5 Conductive connection structure which consists of connector and circuit board 6 Probe member which consists of connector and circuit board for a test | inspection 101 Porous resin film 102 Through-hole 103 Conducting part (tubular electrode)
104 Step part 105 Function part 106 Adhesive layer 301 Circuit board 302 External electrode 303 Circuit 304 External terminal (external electrode)
501 Circuit board for inspection 502 Electrode for inspection 503 Lead wire 504 Inspection device

Claims (5)

  A connector comprising a porous resin base material in which a functional part having an electrode and / or a circuit is provided on a porous resin film, wherein the peripheral part surrounding the functional part of the porous resin film has a height higher than the functional part. A connector having a structure in which a step portion having a low height is formed and an adhesive layer having a thickness smaller than the height of the step is provided on the surface of the step portion.   The connector according to claim 1, wherein the porous resin base material is a porous fluororesin base material in which a functional part having an electrode and / or a circuit is provided on a porous fluororesin film.   The porous fluororesin base material is provided with a plurality of through holes in the thickness direction of the porous fluororesin film, and an anisotropic conductive material in which a cylindrical electrode is formed on the inner wall surface of the through holes by adhesion of a conductive metal. The connector according to claim 2, wherein the connector is a membrane.   The connector according to any one of claims 1 to 3, wherein an electrode and / or circuit of the connector and an electrode of the electronic component or circuit board are electrically connected to an electronic component or circuit board having electrodes disposed on the surface. The conductive connection structure fixed by the pressure-sensitive adhesive layer in a state in which connection is possible.   The connector according to any one of claims 1 to 3, wherein an electrode and / or circuit of the connector and a circuit for inspection are provided on a circuit board for inspection of an inspection device used for electrical inspection of an electronic component or a circuit board. A probe member fixed by the pressure-sensitive adhesive layer in a state where it can be electrically connected to an inspection electrode disposed on the surface of the substrate.

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