JP2007207122A - Non-contact type data carrier device, data carrier device disposal member disposed therewith, and production method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact non-contact type data carrier device using a non-contact type data carrier not more than a square area size of 10 mm × 10 mm, having a base material of a hard insulative board such as a glass epoxy board or a paper phenol board, provided with a sticking adhesive layer inside an area of the non-contact type data carrier, and to provide a data carrier device disposal member integrally provided with a plurality of the data carrier devices, and to provide a production method for them. <P>SOLUTION: In this non-contact type data carrier device, the adhesive layer is disposed on the surface of the compact non-contact type data carrier not more than the square area size of 10 mm × 10 mm using the hard and insulative board-like base material directly or through another layer, and a disposal area of the adhesive layer is inside the non-contact type data carrier area. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention particularly relates to a data carrier device using a small non-contact type data carrier of 10 mm × 10 mm square or less using a hard, insulating plate-like base material, and a data carrier device provided with a plurality of the data carrier devices. It is related with a member and these manufacturing methods.

In recent years, IC cards have been gradually spread from the aspect of information confidentiality, and in recent years, non-contact type IC cards that exchange information without contacting a reader / writer have been proposed. A system in which signal exchange with an apparatus or signal exchange and power supply is performed by electromagnetic waves is being put into practical use.
Under such circumstances, various types of non-contact IC tags in the form of sheets or bills, in which an IC chip carrying data is connected to an antenna coil, have recently been proposed and attached to products, packaging boxes, etc. for shoplifting. It has come to be used for prevention, logistics system, product management, etc.
Of course, a simple resonance tag having no IC is also used to detect the presence of an article.

Thus, in recent years, the use of data carriers such as non-contact type IC cards and IC tags (hereinafter also referred to as data carrier devices) has been increasing in order to improve security and convenience. For example, the non-contact type data carrier 321 of the unit as shown in FIG. 13 is a separate paper (hereinafter also referred to as a release paper) as shown in a plan view in FIG. 14A and a cross-sectional view in FIG. 450) and the cover paper 430 that also serves for printing, the non-contact type data carrier 420 of the unit is installed, and the non-contact type data carrier 420 of the unit is bonded to the separate paper 450 at a predetermined position. Thus, it is produced, stored and supplied as a state of being held and arranged.
The non-contact type data carrier here is a general term for components having an antenna circuit part and an IC chip on a base material. Here, the non-contact type data carrier is actually used as a data carrier using the non-contact type data carrier. Those in the form are collectively referred to as non-contact data carrier devices.
A member in which a plurality of unit non-contact type data carrier devices 440 are attached to a separate paper (release paper) 450 in this manner is referred to as a data carrier device arrangement member 400 here.
14A is a plan view of a conventional non-contact type data carrier device arrangement member 400, and FIG. 14B is a cross-sectional view taken along D1-D2 of FIG. 14A.
In addition, since printing is usually performed on the surface portion of the cover paper 430, this is also referred to as printing paper.
As the data carrier device arrangement member 400, a form in which the cover paper 430 is not used may be used.

Conventionally, such a data carrier device mounting member has been manufactured by creating an antenna coil on a flexible insulating substrate that can be bent in a sheet shape or a roll shape, and then mounting an IC chip on the antenna coil. Manufactures a data carrier inlet member in which a plurality of data carrier inlets containing data carriers with IC chips are connected, and affixes a sheet-like (roll-shaped) double-sided tape to the data carrier inlet member, which is the product size It was done by punching into
However, if the insulating substrate is a hard insulating substrate such as glass epoxy (also called glass epoxy), paper phenol, etc., after manufacturing a data carrier inlet member in a state where a plurality of data carrier inlets are connected, the data carrier inlet member in a state where a plurality of data carrier inlets are connected Although a double-sided tape can be attached to the back of the substrate, the substrate is too hard to be punched.
In addition, with a double-sided tape affixed to the back of the data carrier inlet member that is connected in plural, the insulating substrate can be cut into pieces by using a cutting machine, but the double-sided tape was attached. If it is separated into individual pieces, the double-sided tape will stick to the cutting machine, it will be caught, burrs will be generated, the release paper for the cover will be removed, and the data carrier cannot be separated with the double-sided tape attached. is there.
In addition, when the insulating substrate is a hard insulating substrate such as glass epoxy or paper phenol, after separating the data carrier inlet member in a state where a plurality of data carrier inlets are connected into individual data carrier inlets, a double-sided tape is attached, Unnecessary double-sided tape can be cut off, but in this case, the non-contact type data carrier having a size of 10 mm × 10 mm square area or smaller is too small and the data carrier device is arranged by the double-sided tape cutting operation. There is a problem that the installation member cannot be mass-produced.

For this reason, there is no small data carrier device with a double-sided tape attached using a non-contact type data carrier of 10 mm × 10 mm square area size or less of a hard insulating substrate such as glass epoxy, paper phenol, etc. Each time a small data carrier device is attached to the target object, it is attached with an adhesive such as Aron Alpha on one side, or such a small non-contact data carrier is molded and held in the resin. It is made to be screwed to resin, or is made into a price tag shape by being sandwiched between a predetermined base material such as paper or a card base material, and a hole is made in the base material and hung with a string, or it is used in a small case.
That is, when a non-contact type data carrier of 10 mm × 10 mm square or less which is a hard insulating substrate such as glass epoxy or paper phenol is used, the structure of the data carrier device becomes complicated, and it is necessary to make such a structure. There was a problem that it took time.
In spite of the use of a small non-contact type data carrier, there is a problem that the size of the form finally used becomes large.
Japanese Patent Application No. 2005-368747 Japanese Patent Application No. 2006-13037

As described above, recently, a non-contact type data carrier device using a unit non-contact type data carrier is a form of a data carrier device arrangement member in which a plurality of such non-contact type data carrier devices are arranged on separate paper (release paper). Insulated substrates that are manufactured, stored, and used in non-contact data carrier antenna coils and base materials for mounting IC chips are made of hard insulating substrates such as glass epoxy and paper phenol In particular, in the case of a non-contact type data carrier having a square area size of 10 mm × 10 mm or less, because of the problem of workability when using an insulating substrate and the non-contact type data carrier itself is too small, 10 mm × A non-contact type data carrier having a square area size of 10 mm or less is used, and a small non-contact type is provided with an adhesive layer on the surface thereof in the non-contact type data carrier area. The tactile data carrier device could not be mass-produced, and this was required.
The present invention corresponds to this, using a non-contact type data carrier whose base material is a hard insulating substrate such as glass epoxy or paper phenol and having a square area size of 10 mm × 10 mm or less, and using the non-contact adhesive layer as a non-contact type The present invention is intended to provide a small non-contact type data carrier device provided in a data carrier area and a data carrier device arrangement member in which a plurality of them are integrated.
At the same time, it is intended to provide a method for producing them.

The non-contact type data carrier device of the present invention has a surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like base material, or other layer is directly attached. The adhesive layer is disposed on the surface, and the region where the adhesive layer is disposed is in the non-contact data carrier region.
And it is said non-contact-type data carrier apparatus, Comprising: The said contact bonding layer is arrange | positioned on both surfaces.
Then, in any one of the non-contact type data carrier devices, a double-sided tape composed of a first adhesive layer, a base material, and a second adhesive layer is bonded in order with the first adhesive layer of the double-sided tape. And the second adhesive layer is exposed.
In any one of the non-contact type data carrier devices, the adhesive layer disposed on the surface is a thermosetting type.
According to another aspect of the present invention, there is provided a non-contact type data carrier device comprising: a release paper covering an adhesive layer disposed on a surface of the non-contact type data carrier device according to any one of claims 1 to 4; It is characterized by being adhered by a layer.
As described above, here, the non-contact type data carrier is a general term for parts having an antenna circuit portion and an IC chip on a base material, and is actually used as a data carrier using the non-contact type data carrier. Those used in the above are collectively referred to as a non-contact type data carrier device.
Further, here, the hard and insulating plate-like base material is a hard insulating substrate such as glass epoxy or paper phenol, and is rigid and can maintain a planar shape.

The data carrier device arrangement member of the present invention is provided with a direct or other layer on the surface of a small non-contact data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate. A plurality of non-contact type data carrier devices each having an adhesive layer disposed on the surface, and a region where the adhesive layer is disposed within the non-contact type data carrier region. It is characterized in that it is adhered to the release paper with an adhesive layer on the surface and integrated with the release paper.
And it is said data carrier apparatus arrangement | positioning member, Comprising: As mentioned above, the adhesive layer and the peeling layer are provided in both surfaces, It is characterized by the above-mentioned.
Or it is said data carrier apparatus arrangement | positioning member, Comprising: An adhesive layer and a release paper are provided as mentioned above on one surface side, and this is further enclosed so that each said non-contact-type data carrier may not drop | omit The cover paper is provided by being held on the release paper.
A double-sided tape having a laminated structure in which the first adhesive layer, the base material, and the second adhesive layer are laminated in this order as one of the above data carrier device-arranged members, and one adhesive layer of the double-sided tape. The other adhesive layer is used as an adhesive layer for adhering to the release paper or cover paper (printing paper).
In any of the above data carrier device arrangement members, the adhesive layer for adhering to the release paper or the cover paper is a thermosetting type.
Also, any one of the above data carrier device arrangement members, wherein the non-contact type data carrier device is plural, and the release paper is a single sheet (consisting of a single sheet). To do.
Also, any one of the data carrier device arrangement members described above, wherein the non-contact type data carrier device is plural, and the release paper is release paper continuous in a strip shape.
Also, any one of the data carrier device arrangement members described above, wherein the non-contact type data carrier devices are arranged separated by a distance that does not interfere with each other.

The manufacturing method of the data carrier device-arranged member of the present invention can be applied directly to the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate, or other A first double-sided tape having a laminated structure in which a first adhesive layer, a base material, and a second adhesive layer are laminated in this order is disposed on the surface, and the second adhesive Adhering a plurality of non-contact type data carrier devices having a layer arrangement area within the non-contact type data carrier region to a release paper with a second adhesive layer on the surface of each non-contact type data carrier device, and peeling A method for manufacturing a data carrier device arrangement member for manufacturing a data carrier device arrangement member integrated with paper, in order, a first release paper, a first adhesive layer, a substrate, A laminated structure in which two adhesive layers and a second release paper are laminated in this order. Using the second double-sided tape, the first release paper is peeled off, and the second release paper is left with a punching die from the first adhesive layer side, so that the first adhesive layer, the substrate, the second Forming the first double-sided tape to be disposed on each of the non-contact data carriers, half-cut processing, and unnecessary first adhesive layer, base material, first Removing the adhesive layer of 2 and forming only the first double-sided tape on the second release paper, and aligning the non-contact data carrier with the first double-sided tape, An adhering step of adhering and holding the non-contact type data carrier with a first adhesive layer is performed.
Alternatively, the manufacturing method of the data carrier device arrangement member of the present invention directly on the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate, Or the 1st double-sided tape of the laminated structure which laminated | stacked the 1st contact bonding layer, the base material, and the 2nd contact bonding layer in this order via other layers is arrange | positioned on the surface, and said 2nd A plurality of non-contact type data carrier devices in which the adhesive layer is disposed in the non-contact type data carrier region are adhered to the release paper by a second adhesive layer on the surface of each non-contact type data carrier device. A method for producing a data carrier device arrangement member for producing a data carrier device arrangement member integrated with release paper, in order, a first release paper, a first adhesive layer, and a base material , Second adhesive layer and second release paper are laminated in this order Using the second double-sided tape having a laminated structure, and leaving the second release paper with a punching die from the first release paper side, the first release paper, the first adhesive layer, the substrate, Forming a second adhesive layer and forming the first double-sided tape for disposing on each non-contact data carrier, half-cut processing, unnecessary first release paper, first Removing the adhesive layer, the base material, and the second adhesive layer, and forming only the first double-sided tape on the second release paper, and the non-contact data carrier, An adhesion step is performed in which the non-contact data carrier is adhered and held by the first adhesive layer in alignment with the double-sided tape.
And in the manufacturing method of any one of the above data carrier device arrangement members, after the bonding step, the second release paper is further peeled off from the second adhesive layer of the first double-sided tape, It is characterized in that a release paper pasting step is performed in which the third release paper is adhered by the second adhesive layer of the double-sided tape.
In addition, in any of the above-described methods for manufacturing a data carrier device-arranged member, the alignment in the bonding step is performed using a positioning mask.
Furthermore, the manufacturing method of the data carrier device-arranged member of the present invention is directly applied to the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate. Or a plurality of non-contact type data carrier devices in which an adhesive layer is arranged on the surface via another layer, and an arrangement area of the adhesive layer is in the non-contact type data carrier area, A method for manufacturing a data carrier device mounting member for manufacturing a data carrier device mounting member that is bonded to a release paper with an adhesive layer on the surface of each non-contact type data carrier device and integrated with the release paper. In order, an alignment mask having the same thickness as that of the small non-contact type data carrier is disposed on one surface of the insulating sheet in order, and the small non-contact type data carrier is opened at the opening of the alignment mask. A positioning arrangement step of holding the adhesive sheet on one surface of the insulating sheet, and mask printing of the adhesive using a printing mask on one surface of each non-contact data carrier exposed from the opening of the alignment mask, Forming an adhesive layer on one surface of the small non-contact data carrier, removing the mask for printing, the mask for printing and the alignment mask, and releasing the release paper through the adhesive layer on the adhesive layer forming side And a release paper disposing step in which the insulating sheet is removed, and the masking printing using the printing mask in the masking printing step is silk printing. It is characterized by being.

(Function)
According to the non-contact type data carrier device of the present invention, a small non-contact type data carrier device can be simply structured with a simple structure and an adhesive layer disposed on the non-contact type data carrier device. In particular, when sticking to an object with an adhesive layer, it is possible to prevent the adhesive layer from sticking out of the non-contact data carrier region and reduce adhesion of dust and the like.
Specifically, the surface of the adhesive layer is directly or via another layer on the surface of a small non-contact data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate. This is achieved by providing the adhesive layer in the non-contact data carrier region.
By adopting the form of the invention of claim 2 in which such an adhesive layer is provided on both sides, it is possible to affix cover paper (also referred to as printing paper) on one side.
That is, a printing layer or printed matter can be attached to one side.
Also, in order, a double-sided tape comprising a first adhesive layer, a base material, and a second adhesive layer is adhered to the surface by the first adhesive layer of the double-sided tape, and the second adhesive layer is exposed. By adopting the form of the invention of claim 3, the structure can be simplified by using a general-purpose double-sided tape.
Further, by adopting the form of the invention of claim 4 in which the adhesive layer disposed on the surface is a thermosetting type, it can be made more practical.
According to the non-contact type data carrier device of the present invention, the adhesive layer on the surface can be prevented from being exposed and dirt and other unintended adhesion to the adhesive layer can be prevented by adopting the form of the invention of claim 5. It can be carried individually.
Of course, in use, the release paper covering the adhesive layer is peeled off and attached to the target object with the adhesive layer. In this case, the adhesive layer can be prevented from protruding from the non-contact data carrier area, Etc. can be reduced.

According to the sixth aspect of the present invention, the data carrier device arrangement member according to the present invention can supply the data carrier device arrangement member according to any one of claims 1 to 5 at a mass production level in practice. To do.
With the release paper, the entire data carrier device mounting member can be carried as a unit, and the adhesiveness of the adhesive layer can be kept from decreasing.
And by making it the form of invention of Claim 7 which has provided the contact bonding layer and the peeling layer as mentioned above on both surfaces, affixing a cover paper can also be carried out and the freedom degree is made large. In addition, the adhesive layer and release paper are provided on one side as described above, and further, a cover paper that surrounds the non-contact data carrier is provided by holding the release paper so that it does not fall off. According to the eighth aspect of the invention, it is possible to prevent each non-contact data carrier from dropping out.
In addition, a double-sided tape having a laminated structure in which the first adhesive layer, the base material, and the second adhesive layer are laminated in this order is disposed by being adhered by one adhesive layer of the double-sided tape, and the other adhesive layer is disposed as described above. By adopting the form of the invention of claim 9, which is an adhesive layer for adhering to release paper or cover paper (printing paper), its manufacture is simplified.
Moreover, it can be made into a practical thing by setting it as the form of invention of Claim 10 whose adhesive layer for adhere | attaching the said release paper or the said cover paper is a thermosetting type.
The non-contact type data carrier device includes a plurality of pieces, and the release paper is a single-sheet release paper (consisting of a single sheet). Only a desired number of non-contact data carrier devices can be placed on the release paper, making it easier to organize and manage the number of non-contact data carrier devices.
It may be easier to use than a non-contact data carrier device, one by one.
A specific example is the form of the invention of claim 12 in which there are a plurality of the non-contact type data carrier devices, and the release paper is a release paper continuous in a strip shape.
In this case, it is possible to automatically supply the data carrier when inspecting, issuing, or manufacturing the secondary processed product by placing it on the release paper in the form of a roll.
Further, the non-contact type data carrier devices are arranged apart from each other by a distance that does not interfere with each other, so that the reading inspection, reading and / or writing in this state is performed. Is possible.

The manufacturing method of the data carrier device-arranged member of the present invention is a 10 mm × using a hard, insulating plate-like substrate by adopting the form of the invention of claim 14 or the form of the invention of claim 15. A laminated structure in which a first adhesive layer, a base material, and a second adhesive layer are laminated in this order directly or via another layer on the surface of a small non-contact data carrier having a square area size of 10 mm or less. One or more non-contact type data carrier devices each having a first double-sided tape disposed on the surface and a region where the second adhesive layer is disposed within the non-contact type data carrier region. It is possible to manufacture a data carrier device-arranged member that is adhered to the release paper with an adhesive layer on the surface of the contact type data carrier device and integrated with the release paper.
In particular, mass production is possible.
Then, after the bonding step, the second release paper is further peeled off from the second adhesive layer of the first double-sided tape, and the third release paper is bonded by the second adhesive layer of the first double-sided tape. The release paper pasting step is performed, so that the embodiment of the invention of claim 16 is used, so that the degree of freedom is higher.
In the above, the alignment in the bonding step is performed using the alignment mask, so that the alignment can be surely and easily performed.
Further, according to the method of manufacturing the data carrier device arrangement member of the present invention, by adopting the form of the invention of claim 18, a small size of 10 mm × 10 mm square area size or less using a hard, insulating plate-like substrate. The adhesive layer is disposed on the surface of the non-contact type data carrier directly or via another layer, and the region where the adhesive layer is disposed is within the non-contact type data carrier region. Adhering one or more non-contact type data carrier devices to release paper with an adhesive layer on the surface of each non-contact type data carrier device, and manufacturing a data carrier device arrangement member integrated with the release paper Is possible.
In particular, mass production is possible.
Specifically, in the masking printing process, the masking printing using a printing mask is silk printing, and the form of the invention of claim 19 can be mentioned.

  As described above, the present invention uses a non-contact type data carrier whose base material is a hard insulating substrate such as glass epoxy or paper phenol and has a square area size of 10 mm × 10 mm or less, and the attached adhesive layer is not attached to the non-contact type data carrier. It is possible to provide a small non-contact type data carrier device provided in the contact type data carrier region, a data carrier device arrangement member in which a plurality of them are integrated, and a manufacturing method thereof.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a cross-sectional view of a first example of an embodiment of a non-contact type data carrier device of the present invention, and FIG. 1B is a diagram in which a release paper is attached to the adhesive layer on the surface of the first example. 1C is a cross-sectional view showing a state of being attached to an object, and FIG. 2A is a second example of an embodiment of a non-contact type data carrier device according to the present invention. FIG. 2B is a cross-sectional view of a form in which a release paper is attached to the adhesive layer on the surface of the second example, and FIG. 2C is a cross-sectional view showing a state of being attached to an object. FIG. 3A is a sectional view of a third example of the embodiment of the non-contact type data carrier device of the present invention, and FIG. 3B is peeled off from the adhesive layer on one surface of the third example. FIG. 3C is a cross-sectional view showing a state in which paper is attached and a cover paper is attached to the adhesive layer on the other surface, FIG. 3C is a cross-sectional view showing a state of being attached to an object, and FIG. Non-contact 4B is a cross-sectional view of a fourth example of the embodiment of the mold data carrier device, and FIG. 4B is a cross-sectional view of the fourth example in which a release paper is attached to the adhesive layer on the surface, and FIG. FIG. 5 is a schematic sectional view of a first example of the data carrier device mounting member of the present invention, and FIG. 6 (a) is a data carrier device of the present invention. FIG. 6B is a schematic cross-sectional view of the second example of the arrangement member, and FIG. 6B is a configuration in which a cover film is further provided on each non-contact type data carrier device in the second example shown in FIG. 6A. FIGS. 7A to 7G are cross-sectional views of the data carrier device arrangement member, and FIGS. 7A to 7G are views showing a manufacturing process of the data carrier device arrangement member of the first example shown in FIG. FIG. 7 (h) is a cross-sectional view showing a state where the release paper is pasted, and FIGS. 8 (a) to 8 (e) are diagrams for explaining another manufacturing process. FIGS. 9A to 9C are diagrams showing a part of the steps, and FIGS. 9A to 9C show the manufacture of a data carrier device arrangement member in which a plurality of data carrier devices of the fourth example shown in FIG. 4A are arranged. FIG. 10A to FIG. 10G are diagrams showing a part of the steps for explaining the steps. FIG. 10A to FIG. 10G are data carriers in which a plurality of data carrier devices of the second example shown in FIG. FIG. 11 is a diagram showing a part of the process for manufacturing the device mounting member, and FIG. 11 is a diagram showing the IC chip and its connection state seen through from one surface of the non-contact data carrier. These are the figures which showed the cross section in A1-A2 of FIG. 11 simply.
7 (a) to 7 (g), FIG. 8, and FIG. 9 show only one non-contact type data carrier device for convenience, but in reality, a plurality of non-contact type data carrier devices are provided. Thus, a data carrier device arrangement member is produced.
1 to 12, 10, 10A to 10C, 10Aa to 10Ca are non-contact type data carrier devices, 20 is a non-contact type data carrier, 21 is an IC chip, 22 is a wiring substrate, 23 is a sealing resin, 30 , 30a to 30c are double-sided tapes, 31 is a substrate, 32 is a first adhesive layer (also simply referred to as an adhesive layer), 33 is a second adhesive layer (also simply referred to as an adhesive layer), 35 is an adhesive layer, and 40 is an adhesive layer. Release paper, 50 is an object, 60 is a cover paper (also called printing paper), 70 is an insulating layer, 80, 81 and 82 are data carrier device arrangement members, 90 is a cover paper (also called a cover film), 111 and 115 Is a release paper, 112 and 114 are adhesive layers, 113 is a base material, 111a and 115a are release papers, 112a and 114a are adhesive layers, 113a is a base material, 120, 120A, and 120B are punched portions (also referred to as processing grooves) 1 1, 121b is a necessary part, 122, 122a, 122b are unnecessary parts, 130 is an alignment mask, 131 is an opening, 140 is release paper, 150 is release paper, 180 is an insulating sheet, 185 is an alignment mask, 186 Is an opening, 190 is a printing mask, 195 is a release paper, 220 is a non-contact data carrier, 241 is an IC chip, 242 is an antenna circuit (also referred to as an antenna coil), 243a and 243b are chip terminals, 245 and 245a 246d is a through hole portion, 246a and 246b are chip connection terminals, 247 is a chip mounting pad, 248 is a bonding wire, 249 is a sealing resin, 250 is a solder resist, 251 is a substrate (for wiring), 252 is An adhesive layer 260 is a laminated wiring substrate (also simply referred to as a wiring substrate).

First, a first example of an embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
The non-contact type data carrier device 10 of the first example has a structure of 10 mm × 10 mm in which an antenna circuit unit 242 and an IC chip 241 are connected, as shown in FIG. A small non-contact type data carrier 220 (corresponding to 20 in FIG. 1) using a hard, insulating wiring substrate (corresponding to 22 in FIG. 1) having a square area size or less as the substrate is used. As shown to (a), the double-sided tape 30 is affixed on the surface of the non-contact type data carrier 20 on the wiring substrate 22 side, and the adhesive layer 33 of the double-sided tape 30 is exposed on the surface. is there.
The area where the adhesive layer 33 is disposed is within the area of the non-contact data carrier 20.
1st example removes the release paper 40 from the form which attached the release paper 40 to the contact bonding layer 33 of the surface of the non-contact-type data carrier apparatus 10 of a 1st example as shown in FIG.1 (b), for example. As shown in FIG. 1C, the adhesive layer 33 is attached to the object 50 and used.
By adopting such a configuration, the small non-contact data carrier device 10 can be easily attached to an object with a simple structure and the adhesive layer 33 disposed thereon. In particular, when sticking to an object with the adhesive layer 33, the adhesive layer can be prevented from sticking out from the non-contact data carrier region, and adhesion of dust and the like can be reduced.

Here, the non-contact type data carrier 20 (corresponding to 220 in FIGS. 11 and 12) used in the first example will be briefly described with reference to FIGS.
As shown in the cross section of FIG. 12, the non-contact type data carrier 220 is simply provided on a laminated wiring substrate 260 in which a substrate in which a part of the antenna circuit portion is formed is laminated on the surface of each substrate 251. Each of the layers is electrically connected through the through-hole 245 to form an antenna circuit unit, an IC chip 241 is mounted on the surface portion of the laminated wiring substrate 260, and the antenna circuit The portion 242 is electrically connected.
Here, the non-contact type data carrier 220 has rigidity as a whole and can maintain a planar shape.
Here, the antenna circuit portion 242 has a four-layer spiral shape in which the number of turns of each layer is about nine.
Examples of the size of the non-contact type data carrier 220 include a 5 mm square and a thickness of about 150 μm.
This size is much smaller than 54 mm × 85.6 mm which is a standard size for a card-type RFID tag (IC card).
The IC chip 241, the bonding wire 248, and the antenna circuit portion 242 on the surface are covered and protected by the solder resist 250 and the sealing resin 249.
The antenna coil portion of the antenna circuit portion 242 has a line width of about 80 μm, a line width of about 70 μm, and a line thickness of about 18 μm, and can be formed in such a laminated structure by a known additive method or semi-additive method.
The IC chip 241 mainly includes a ROM, a RAM, a logic circuit, and a CPU.
As the IC chip 241, a chip that is commercially available as a chip for a 13.56 MHz band RFID tag, such as an I-CODE SLI chip from Phillips, a my-d chip from Infineon Technology, or the like is appropriately selected according to the application. Use.
In this example, the size of the non-contact data carrier 220 is not so large with respect to the size of the IC chip 241 to be mounted.
The shape does not necessarily have to be a square, but is rectangular in order to facilitate the production of multiple pieces.
In addition, by making the laminated wiring substrate 260 laminated into a substantially square shape, it becomes easy to secure the inner area of the antenna while reducing the size, and the inductance value of the coil can be improved.
The laminated wiring substrate 260 has, for example, a hard insulating substrate made of glass epoxy or paper phenol having a thickness of 0.1 mm as a substrate 251, and a copper foil having a thickness of 18 μm laminated on one or both sides. Using the single-sided copper-clad substrate and the double-sided copper-clad substrate, the antenna circuit part 42 having a desired shape is formed by etching using the photoetching method for the outer layer and the inner layer, respectively, and each layer is formed as an insulating adhesive layer. The film is laminated by heating and pressurizing, and further, through holes are formed.
Here, through-holes are used for connection between layers, but it is also possible to apply an interlayer connection method called B2it (registered trademark) that breaks through the interlayer insulation layer with a substantially conical conductor bump. It is.
Thereby, it is possible to reduce the total number of manufacturing steps.

The double-sided tape 30 is not particularly limited as long as it can be affixed practically. Usually, the first adhesive layer 32, the base material 31, and the second adhesive layer 33 as shown in FIG. A layered structure in which are stacked in this order is used.
As the base material 31, a polyethylene terephthalate film (PET film) or the like is used, and as the first adhesive layer 32 and the second adhesive layer 33, an acrylic adhesive layer, a silicon adhesive layer, or the like is used. An adhesive layer made of a curable resin is preferable.
As the release paper, those having good peelability and strong internal strength so as not to be broken by the force at the time of peeling are used. For example, a high-quality paper or a film coated with a silicone polymer is used.
As a modified example of the non-contact type data carrier device 10 shown in FIG. 1A, and as a modified example of the non-contact type data carrier device 10a shown in FIG. There is a configuration in which a pressure-sensitive adhesive layer having only one layer without a material is used and the front and back surfaces of the one-layer pressure-sensitive adhesive layer are respectively adhesive layers.

Next, a second example of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
The non-contact type data carrier device 10A of the second example is the same as that used in the first example, and is a hard, insulating wiring substrate (corresponding to 22 in FIG. 1) having a square area size of 10 mm × 10 mm or less. ) Using a small non-contact data carrier 220 (corresponding to 20 in FIG. 2) as the base material, as shown in FIG. 2A, the wiring base 22 side of the non-contact data carrier 20 The adhesive layer 35 is provided on the surface, and the adhesive layer 35 is exposed to the surface as it is.
And the arrangement | positioning area | region of the contact bonding layer 33 is made into the non-contact-type data carrier 20 area | region.
In the second example, for example, the release paper 40 is removed from the form in which the release paper 40 is attached to the adhesive layer 35 on the surface of the non-contact type data carrier device 10A of the second example as shown in FIG. As shown in FIG. 2 (c), the adhesive layer 35 is used.
By adopting such a configuration, the small non-contact data carrier device 10A can be easily attached to an object with an adhesive layer 35 disposed on the object with a simple structure, In particular, when sticking to an object with the adhesive layer 35, the adhesive layer can be prevented from protruding from the non-contact data carrier region, and adhesion of dust and the like can be reduced.
As the adhesive layer 35, an acrylic adhesive layer, a silicon adhesive layer, or the like is used, and in particular, a thermosetting resin is preferable from a practical aspect.

Next, a third example of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
The non-contact type data carrier device 10B of the third example is the same as that used in the first example, and is a hard, insulating wiring substrate (corresponding to 22 in FIG. 3) having a square area size of 10 mm × 10 mm or less. ) Using a small non-contact data carrier (corresponding to 20 in FIG. 3) as a base material, and as shown in FIG. Double-sided tape 30a is affixed to the other surface, and adhesive layers are respectively disposed on the surface.
And the arrangement | positioning area | region of each contact bonding layer arrange | positioned on the surface is made into the non-contact-type data carrier 20 area | region.
In the third example, for example, the release paper 40 is attached to the adhesive layer on one surface of the non-contact type data carrier device 10B of the third example as shown in FIG. A sheet with a cover paper 60 is prepared, the release paper 40 is removed therefrom, and the exposed adhesive layer is used by being attached to the object 50 as shown in FIG.
Alternatively, the release paper 40 is removed from the form in which the release paper 40 is attached to the adhesive layers on both surfaces of the non-contact type data carrier device 10B of the third example, and as shown in FIG. The cover paper 60 is attached to the object with the adhesive layer on the surface side and the adhesive layer on the other surface side. As described above, in the third example, the cover paper (also referred to as print paper) can be attached to one surface side by disposing the adhesive layers on both surfaces and the surface.
Each part is basically the same as in the first example, and the description thereof is omitted here.
As a modified example of the non-contact type data carrier device 10B shown in FIG. 3A, and as a modified example of the non-contact type data carrier device 10Ba shown in FIG. 3B, double-sided tapes 30 and 30a are respectively provided. There is a configuration in which a pressure-sensitive adhesive layer having only one layer is used without using a base material, and the front and back surfaces of the single pressure-sensitive adhesive layer are used as adhesives.

Next, a fourth example of the embodiment of the non-contact type data carrier device of the present invention will be described with reference to FIG.
The non-contact type data carrier device 10C of the fourth example is the same as that used in the first example, and is a hard, insulating wiring substrate (corresponding to 22 in FIG. 1) having a square area size of 10 mm × 10 mm or less. ) Using a small non-contact type data carrier (corresponding to 20 in FIG. 3) as a base material, as shown in FIG. 4 (a), a double-sided tape 30b on one side of the non-contact type data carrier 20, The insulating layer 70 and the double-sided tape 30c are attached in this order, and the adhesive layer is disposed on the surface.
And the arrangement | positioning area | region of the contact bonding layer arrange | positioned on the surface is made into the non-contact-type data carrier 20 area | region.
In the fourth example, for example, the release paper 40 is removed from the form in which the release paper 40 is attached to the adhesive layer on the surface of the non-contact type data carrier device 10C of the fourth example as shown in FIG. 4B. Then, as shown in FIG. 4 (c), it is used by being attached to the object 50 with an adhesive layer.
In the case of the fourth example, the distance of the non-contact type data carrier 20 from the object 50 can be controlled by the thickness of the insulating layer 70, and a non-contact type data carrier device corresponding to metal can be obtained.
As a modification of the non-contact type data carrier device 10C shown in FIG. 4A, and as a modification of the non-contact type data carrier device 10Ca shown in FIG. 4B, double-sided tapes 30b and 30c are respectively provided. There is a configuration in which a pressure-sensitive adhesive layer having only one layer is used without using a base material, and the front and back surfaces of the single pressure-sensitive adhesive layer are used as adhesives.

Next, a first example of the embodiment of the data carrier device arrangement member of the present invention will be described with reference to FIG.
The data carrier device arrangement member 80 of the first example includes a plurality of non-contact type data carrier devices 10 of the first example shown in FIG. 1A and an adhesive layer on the surface of each non-contact type data carrier device 10. Are adhered to the release paper 41, and the release paper 41 holds them together.
The data carrier device arrangement member 80 of the first example can carry the entire data carrier device arrangement member 80 as a whole by the release paper 41 and can suppress the adhesiveness of the adhesive layer 33 from being lowered.
In the first example, the non-contact type data carrier devices are arranged apart from each other by a distance that does not interfere with each other, so that reading inspection, reading and / or writing in this state is possible. It is.

Next, a second example of the embodiment of the data carrier device arrangement member of the present invention will be described with reference to FIG.
The data carrier device disposing member 81 of the second example includes a plurality of non-contact type data carrier devices 10 of the fourth example shown in FIG. 4A and an adhesive layer on the surface of each non-contact type data carrier device 10C. Is adhered to the release paper 42, and these are integrated and held by the release paper 42.
In the case of the data carrier device arrangement member 81 of the second example, as in the case of the first example, the entire data carrier device arrangement member 81 can be carried by the release paper 42 and the adhesive layer on the surface can be adhered. Sexual decline can be suppressed.
Also in the second example, the non-contact data carrier devices are arranged apart from each other by a distance that does not interfere with each other, and thus, it is possible to perform a read check, read, and / or write in this state. .

Next, a third example of the embodiment of the data carrier device arrangement member of the present invention will be described with reference to FIG.
The data carrier device arrangement member 82 of the third example is a cover paper that surrounds the non-contact type data carrier so that the non-contact data carrier can be prevented from falling off in the data carrier device arrangement member 81 of the second example. A (cover film) 90 is provided by being held on the release paper 42.
By doing so, it is possible to prevent the non-contact data carrier 20 from dropping off.
Also in the third example, the non-contact data carrier devices are arranged apart from each other by a distance that does not interfere with each other, and thus, it is possible to perform the reading inspection, reading, and / or writing in this state. .

  The data carrier device arrangement member of the present invention is not limited to the above. For example, the non-contact type data carrier device 10B of the third example shown in FIG. The form which makes each surface hold | maintain on a release paper with the contact bonding layer provided in both surfaces, respectively, and is united is also mentioned.

Next, the manufacturing method of the data carrier device mounting member of the present invention and the manufacturing method of the non-contact type data carrier device of the present invention will be briefly described based on the drawings.
First, the manufacturing method of the data carrier device arrangement member for producing the data carrier device arrangement member 80 of the first example shown in FIG. 5 and the non-contact type data carrier device of the first example shown in FIG. The manufacturing method 10 will be briefly described with reference to FIG.
First, a second double-sided tape having a laminated structure in which a first release paper 111, a first adhesive layer 112, a base material 113, a second adhesive layer 114, and a second release paper 115 are laminated in this order is used (see FIG. 7 (a)), the first release paper 111 is peeled off (FIG. 7 (b)), and the second release paper 114 is left with a punch from the first adhesive layer side 112 so that the first adhesive The first double-sided tape 30 for processing the outer shape of the layer 112, the base material 113, and the second adhesive layer 114 and disposing them on each non-contact data carrier (corresponding to 20 in FIG. 1A). A half-cut processing process is performed. (Fig. 7 (c))
Next, the first adhesive layer 112, the base material 113, and the second adhesive layer 114 of the unnecessary portion 122 are removed, and the first double-sided tape 30 (corresponding to the main portion 121) on the second release paper 115 is removed. An unnecessary portion removing step for forming only the film is performed. (Fig. 7 (d))
The removal of the unnecessary portion 122 is to peel off the first adhesive layer 112, the base material 113, and the second adhesive layer 114 as one body.
Next, an adhesion process is performed in which the non-contact type data carrier 20 is aligned with the first double-sided tape 30 and the non-contact type data carrier 20 is adhered and held by the first adhesive layer 111. (Fig. 7 (e), Fig. 7 (f))
Positioning in the bonding process is performed using a positioning mask 130.
Thereafter, the alignment mask 130 is removed. (Fig. 7 (g))
In this way, the data carrier device arrangement member 80 of the first example shown in FIG. 5 is obtained.
Next, the second release paper 115 is further peeled from the second adhesive layer of the first double-sided tape 30, and the third release paper 140 is adhered by the second adhesive layer 114 of the first double-sided tape 30. A release paper pasting step is performed. (Fig. 7 (f))
Thereby, the non-contact type data carrier device 10a with the release paper 40 shown in FIG. 1B is obtained.
Further, in FIG. 7H, the release paper 140 (corresponding to 40 in FIG. 1) is peeled off to obtain the non-contact type data carrier device 10 shown in FIG.

Next, another manufacturing method for manufacturing the data carrier device arrangement member 80 of the first example shown in FIG. 5 and a manufacturing method of the first non-contact type data carrier device 10 will be briefly described based on FIG. To do.
First, a second double-sided tape having a laminated structure in which a first release paper 111, a first adhesive layer 112, a base material 113, a second adhesive layer 114, and a second release paper 115 are laminated in this order is used (see FIG. 8 (a)), from the first release paper 111 side, the second release paper 115 is left with a punching die so that the first release paper 111, the first adhesive layer 112, the base material 113, Half-cut processing is performed to form the first double-sided tape 30 for outer shape processing of the two adhesive layers 114 and to be disposed on each non-contact data carrier 10. (Fig. 8 (b))
Next, the first release paper 111, the first adhesive layer 112, the base material 113, and the second adhesive layer 114 of the unnecessary portion 122a are removed, and the first double-sided tape 30 is placed on the second release paper 115. An unnecessary portion removing step for forming only (corresponding to 121) is performed. (FIG. 8 (c) to FIG. 8 (e))
In this case, first, the first release paper 111, the first adhesive layer 112, the base material 113, and the second adhesive layer 114 are peeled and removed in a region that is not the double-sided tape region. (Fig. 8 (c))
Next, a release paper 150 is attached to the first release paper 111 in the double-sided tape area in order to release it. (Fig. 8 (d))
Next, only the release paper 111 is peeled off with the first release paper 111 attached to the release paper 150. (Fig. 8 (e))
It should be noted that the adhesive strength between the adhesive layer of the double-sided tape 30 and the adhesive layer of the release paper is adjusted in advance so as to peel off in this way.
FIG. 8 (e) corresponds to FIG. 7 (d). Thereafter, processing is performed as shown in FIG. 7 (e) to FIG. 7 (g), and the data carrier device of the first example shown in FIG. An arrangement member 80 is obtained.
Further, the steps shown in FIGS. 7G to 7H are performed to obtain the non-contact type data carrier device 10a with the release paper 40 shown in FIG. 1B. (Fig. 7 (h))
Further, in FIG. 7H, the release paper 140 (corresponding to 40 in FIG. 1) is peeled off to obtain the non-contact type data carrier device 10 shown in FIG.

Next, a method for manufacturing the data carrier device arrangement member 81 for producing the data carrier device arrangement member 81 of the second example shown in FIG. 6A and a non-example of the fourth example shown in FIG. A method for manufacturing the contact-type data carrier device 10C will be briefly described with reference to FIG.
A laminated body having a layer configuration shown in FIG. 9A is prepared in advance, and the release paper 111a is peeled off from the laminated body, and the outer shape is processed by a punching die in the same manner as described above, and the non-contact type data carrier 20 All layers to be attached to are integrally formed on the release paper 115a. (Fig. 9 (b))
Then, unnecessary layers other than the release paper 115a are peeled off and removed. (Fig. 9 (c))
Similarly to the above, FIG. 9 (c) is considered to correspond to FIG. 7 (d), and thereafter processing is performed in the same manner as FIG. 7 (e) to FIG. 7 (g), as shown in FIG. 6 (a). A data carrier device arrangement member 81 of the second example is obtained.
Further, the steps shown in FIGS. 7G to 7H are performed to obtain a non-contact type data carrier device 10Ca with the release paper 40 shown in FIG. 4B. (Fig. 7 (h))
Further, in FIG. 7H, the release paper 140 (corresponding to 40 in FIG. 4) is peeled off to obtain the non-contact type data carrier device 10C shown in FIG. 4A.

Next, a method of manufacturing a data carrier device arrangement member in which a plurality of non-contact type data carrier devices 10A of the second example are integrally provided on release paper and the non-contact type data carrier device 10A of the second example are shown. A manufacturing method will be briefly described with reference to FIG.
First, an alignment mask 185 having the same thickness as that of the non-contact type data carrier 20 is arranged on one surface of the insulating sheet 180 (FIG. 10A) (FIG. 10B), and the alignment mask 185 is arranged. In the opening 186, an alignment arrangement process is performed in which the non-contact type data carrier 20 is held on one surface of the insulating sheet 180. (Fig. 10 (c))
Next, an adhesive is masked and printed on one surface of each non-contact type data carrier exposed in the opening region of the alignment mask 185 using a printing mask 190, and the one surface of the small non-contact type data carrier is formed. A masking printing process for forming an adhesive layer is performed. (Fig. 10 (d), Fig. 10 (e))
Here, the adhesive is printed by screen printing in a range smaller than the non-contact type data carrier region.
Next, the printing mask 190 and the alignment mask 185 are removed (FIG. 10 (f)), a release paper 195 is disposed on the adhesive layer 35 forming side via the adhesive layer 35, and the insulating sheet A release paper disposing step is performed in which 180 is removed. (Fig. 10 (g))
As a result, a data carrier device arrangement member in which a plurality of non-contact type data carrier devices 10A of the second example are integrally provided on the release paper is produced.
Further, the release paper pasting process shown in FIGS. 7 (g) to 7 (h) is performed to obtain a non-contact type data carrier device 10Aa attached with the release paper 40 shown in FIG. 2 (b).
Alternatively, an individual release paper is arranged through the adhesive layer 35 from the state shown in FIG. 10 (f) to obtain a non-contact type data carrier device 10Aa with the release paper 40 shown in FIG. 2 (b). You can also.
Then, it is peeled off from the release paper 195 from the state shown in FIG. 10 (f), or the release paper 40 is peeled off from the non-contact type data carrier device 10Aa, and the non-contact type data carrier device 10A shown in FIG. obtain.

In addition, the manufacturing method of the said data carrier apparatus arrangement | positioning member and the manufacturing method of the said non-contact-type data carrier apparatus are examples, and this invention is not limited to these.

FIG. 1A is a cross-sectional view of a first example of an embodiment of a non-contact type data carrier device of the present invention, and FIG. 1B is a diagram in which a release paper is attached to the adhesive layer on the surface of the first example. FIG. 1C is a cross-sectional view showing a state of being attached to an object and used. FIG. 2A is a cross-sectional view of a second example of the embodiment of the non-contact type data carrier device of the present invention, and FIG. 2B is a diagram in which release paper is attached to the adhesive layer on the surface of the second example. FIG. 2C is a cross-sectional view showing a state of being attached to an object and used. FIG. 3A is a cross-sectional view of the third example of the embodiment of the non-contact type data carrier device of the present invention, and FIG. 3B is a diagram showing a release paper applied to the adhesive layer on one surface of the third example. FIG. 3C is a cross-sectional view showing a state in which a cover paper is attached to the adhesive layer on the other surface, and FIG. FIG. 4A is a cross-sectional view of a fourth example of the embodiment of the non-contact type data carrier device of the present invention, and FIG. 4B is a diagram in which release paper is attached to the adhesive layer on the surface of the fourth example. FIG. 4C is a cross-sectional view showing a state of being attached to an object and used. It is a schematic sectional drawing of the 1st example of the data carrier apparatus arrangement | positioning member of this invention. FIG. 6A is a schematic cross-sectional view of a second example of the data carrier device arrangement member of the present invention, and FIG. 6B further shows each non-contact type data in the second example shown in FIG. It is sectional drawing of the data carrier apparatus arrangement | positioning member made into the form which provided the cover film in the carrier apparatus. 7 (a) to 7 (g) are diagrams showing a manufacturing process of the data carrier device arrangement member of the first example shown in FIG. 6 (a), and FIG. It is sectional drawing which showed the state. FIG. 8A to FIG. 8E are diagrams showing a part of steps for explaining another manufacturing process. FIGS. 9A to 9C are partial processes for explaining a manufacturing process of a data carrier device-arranged member in which a plurality of data carrier devices of the fourth example shown in FIG. 4A are arranged. FIG. FIGS. 10A to 10G are views showing a part of the steps for explaining a manufacturing process of a data carrier device-arranged member in which a plurality of data carrier devices of the second example are arranged. It is the figure which looked through and showed the IC chip and its connection state from one surface of the non-contact type data carrier. It is the figure which simplified and showed the cross section in A1-A2 of FIG. It is a figure for demonstrating a normal non-contact-type data carrier. It is a figure for demonstrating the conventional data carrier apparatus arrangement | positioning member.

Explanation of symbols

10, 10A to 10C, 10Aa to 10Ca Non-contact type data carrier device 20 Non-contact type data carrier 21 IC chip 22 Wiring base material 23 Sealing resin 30, 30a to 30c Double-sided tape 31 Base material 32 First adhesive layer (simply Also called adhesive layer)
33 Second adhesive layer (also simply referred to as adhesive layer)
35 Adhesive layer 40 Release paper 50 Object 60 Cover paper (also called printing paper)
70 Insulating layers 80, 81, 82 Data carrier device arrangement member 90 Cover paper (also called cover film)
111, 115 Release paper 112, 114 Adhesive layer 113 Base material 111a, 115a Release paper 112a, 114a Adhesive layer 113a Base material 120, 120A, 120B Punched part (also called processed groove)
121, 121b Necessary portion 122, 122a, 122b Unnecessary portion 130 Positioning mask 131 Opening portion 140 Release paper 150 Release paper 180 Insulating sheet 185 Positioning mask 186 Opening 190 Printing mask 195 Release paper 220 Non-contact data carrier 241 IC Chip 242 Antenna circuit (also referred to as antenna coil)
243a, 243b Chip terminals 245, 245a to 246d Through-hole portions 246a, 246b Chip connection terminals 247 Chip mounting pads 248 Bonding wire 249 Sealing resin 250 Solder resist 251 Base material 252 (for wiring) Adhesive layer 260 Multilayer wiring base Material (also simply called wiring substrate)
321 Non-contact type data carrier 381 Base material 382 Antenna coil 383, 384 Terminal portion 385, 385a Connection portion 386 Capacitance portion 387 Connection wiring 388 IC chip 400 Data carrier device arrangement member 420 Non-contact type data carrier 430 (Unit Cover paper 440 unit data carrier device 450 separate paper (also called release paper)
470 Mark 490 Object

Claims (19)

  An adhesive layer is disposed on the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate, either directly or via another layer. A non-contact type data carrier device characterized in that the region where the adhesive layer is disposed is in the non-contact type data carrier region.   2. The non-contact type data carrier device according to claim 1, wherein the adhesive layer is disposed on both sides. 3. The non-contact type data carrier device according to claim 1, wherein a double-sided tape comprising a first adhesive layer, a base material, and a second adhesive layer is sequentially formed on the double-sided tape. A non-contact type data carrier device characterized in that the first adhesive layer is adhered and disposed on the surface, and the second adhesive layer is exposed.   4. The non-contact type data carrier device according to claim 1, wherein the adhesive layer disposed on the surface is a thermosetting type.   The non-contact type data carrier device according to any one of claims 1 to 4, wherein a release paper covering an adhesive layer disposed on a surface is adhered by the adhesive layer. Non-contact data carrier device.   An adhesive layer is disposed on the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like substrate, either directly or via another layer. In addition, a plurality of non-contact type data carrier devices in which the adhesive layer is disposed in the non-contact type data carrier region are bonded to the release paper by using an adhesive layer on the surface of each non-contact type data carrier device. And a data carrier device arrangement member characterized by being integrated with release paper.   7. The data carrier device arrangement member according to claim 6, wherein the adhesive layer and the release layer are provided on both sides as described above.   7. The data carrier device disposing member according to claim 6, wherein the adhesive layer and the release paper are provided on one surface side as described above, and further, the non-contact data carrier is prevented from falling off. A data carrier device disposing member, characterized in that a cover paper that surrounds is provided on the release paper.   The data carrier device arrangement member according to any one of claims 6 to 8, wherein a double-sided tape having a laminated structure in which a first adhesive layer, a base material, and a second adhesive layer are laminated in this order, Data carrier device arrangement characterized in that one adhesive layer of a double-sided tape is adhered and disposed, and the other adhesive layer is an adhesive layer for adhering to the release paper or cover paper (printing paper) Element.   10. A data carrier device arranging member according to claim 6, wherein an adhesive layer for bonding to the release paper or the cover paper is a thermosetting type. Device arrangement member.   11. The data carrier device arrangement member according to any one of claims 6 to 10, wherein the non-contact type data carrier device is a plurality, and the release paper is a single sheet (consisting of a single sheet). A data carrier device arrangement member, which is paper.   10. The data carrier device disposing member according to claim 6, wherein a plurality of the non-contact data carrier devices are provided, and the release paper is a strip of release paper. Carrier device arrangement member.   10. The data carrier device arrangement member according to claim 6, wherein the non-contact data carrier devices are arranged apart from each other by a distance that does not interfere with each other. Carrier device arrangement member.   The first adhesive layer and the base material directly or through another layer on the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like base material The first double-sided tape having a laminated structure in which the second adhesive layers are laminated in this order is arranged on the surface, and the arrangement area of the second adhesive layer is in the non-contact data carrier area A plurality of non-contact type data carrier devices are bonded to release paper with a second adhesive layer on the surface of each non-contact type data carrier device, and the data carrier device arrangement member integrated with the release paper is integrated, A method for manufacturing a data carrier device arrangement member for manufacturing, wherein a first release paper, a first adhesive layer, a substrate, a second adhesive layer, and a second release paper are laminated in this order. Using the second double-sided tape with the laminated structure, peel off the first release paper. Then, the first adhesive layer, the base material, and the second adhesive layer are trimmed so as to leave the second release paper with a punching die from the exposed first adhesive layer side, and each of the non-contact data Forming the first double-sided tape to be disposed on the carrier, removing the half-cut processing, unnecessary first adhesive layer, base material, and second adhesive layer on the second release paper Only the first double-sided tape is formed, an unnecessary portion removing step, and the non-contact type data carrier is aligned with the first double-sided tape, and the non-contact type data carrier is placed on the first adhesive layer. A method of manufacturing a data carrier device-arranged member, wherein an adhering step of adhering and holding is performed.   The first adhesive layer and the base material directly or through another layer on the surface of a small non-contact type data carrier having a square area size of 10 mm × 10 mm or less using a hard, insulating plate-like base material The first double-sided tape having a laminated structure in which the second adhesive layers are laminated in this order is arranged on the surface, and the arrangement area of the second adhesive layer is in the non-contact data carrier area A plurality of non-contact type data carrier devices are bonded to release paper with a second adhesive layer on the surface of each non-contact type data carrier device, and the data carrier device arrangement member integrated with the release paper is integrated, A method for manufacturing a data carrier device arrangement member for manufacturing, wherein a first release paper, a first adhesive layer, a substrate, a second adhesive layer, and a second release paper are laminated in this order. Using the second double-sided tape with the laminated structure The outer shape of the first release paper, the first adhesive layer, the base material, and the second adhesive layer is processed so as to leave the second release paper with a punching die, and is disposed on each non-contact data carrier. Forming the first double-sided tape to remove, and removing the unnecessary first release paper, first adhesive layer, base material, and second adhesive layer, and second peeling Forming only the first double-sided tape on paper, aligning the non-contact type data carrier with the second double-sided tape, and removing the unnecessary part, and bonding the non-contact type data carrier to the first adhesive A method for producing a data carrier device-arranged member, comprising performing an adhesion step of adhering and holding with a layer.   16. The method for manufacturing a data carrier device arranging member according to claim 14, further comprising a second release paper from the second adhesive layer of the first double-sided tape after the bonding step. A method for manufacturing a data carrier device-arranged member, comprising: performing a release paper pasting step of peeling off and attaching a third release paper with a second adhesive layer of the first double-sided tape.   17. The data carrier manufacturing method according to claim 14, wherein the alignment in the bonding step is performed using a positioning mask. Manufacturing method of apparatus arrangement member.   An adhesive layer is disposed on the surface of a small non-contact type data carrier having a square area size of 10 mm x 10 mm or less using a hard, insulating plate-like substrate, either directly or via another layer. A plurality of non-contact type data carrier devices in which the adhesive layer is disposed in the non-contact type data carrier region, and a plurality of non-contact type data carrier devices are attached to the release paper by the adhesive layer on the surface of each non-contact type data carrier device. A method for manufacturing a data carrier device arrangement member for manufacturing a data carrier device arrangement member that is bonded and integrated with release paper, in order, on the one surface of the insulating sheet, the small non-contact type An alignment arrangement step of arranging an alignment mask having substantially the same thickness as the data carrier, and holding the small non-contact data carrier on one surface of the insulating sheet at the opening of the alignment mask; An adhesive is masked and printed on one surface of each non-contact data carrier exposed from the opening of the alignment mask using a printing mask, and an adhesive layer is formed on one surface of the small non-contact data carrier. Removing the mask for printing, the printing mask and the alignment mask, disposing the release paper on the adhesive layer forming side via the adhesive layer, and removing the insulating sheet, A method for manufacturing a data carrier device-arranged member. 19. The method of manufacturing a data carrier device arrangement member according to claim 18, wherein the masking printing using a printing mask in the masking printing step is silk printing. Manufacturing method.

Images