JP2007174588A - Headphone - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide high shock-proof structure while investigating design nature with high degree of freedom, miniaturization and acoustic characteristic, in a headphone. <P>SOLUTION: In the headphone 100, a speaker unit 103 is stored in a base 102 which functions as an internal housing, a substrate 104 is held on the unit 103, and furthermore the base 102 is held and fixed with a rubber 101 constituted of rubber as an elastic outer chassis. An inside trench 106b of a dome 106 which is a hard outer chassis and made from acrylic is engaged with a protruded part 102b of the base 102, and forcing and fixing are performed by elasticity of the rubber 101. As a result, the dome 106 is movably fixed to the base 102. If shock is applied to the dome 102, the rubber 101 is deformed, the dome 102 moves for the base 102, and the shock is absorbed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a technology applicable to a wireless headphone using infrared communication, Bluetooth standard communication, or the like, and particularly relates to a headphone having high impact resistance.

  Wireless headphones using infrared communication or Bluetooth standard communication are known. Wireless headphones are becoming smaller and lighter, and for example, earphones that integrate a receiving system and an acoustic system have been put into practical use. Such a small and lightweight device has the advantage that it is easy to carry and handle, but since it is small and lightweight, it is easy to be shocked by falling or hitting somewhere during handling. Particularly, in the wireless headphones, since the receiving circuit and the amplifier circuit are integrated in the headphone portion, there is a problem that an electronic component is dropped from the circuit board due to an impact or a crack is generated in the circuit board. In order to avoid this problem, it is known that the outside of the product is covered with an elastic material. In addition, there is a product in which a foam cushion material is disposed between the substrate and the outer case so that an impact is not directly applied to the substrate. A structure in which a product is covered with an elastic material is described in Patent Document 1, for example.

Special table 2004-508787

  However, the structure in which the outside of the product is covered with an elastic material has a problem that there is no degree of freedom in terms of design. In addition, the structure in which the cushion material is disposed between the substrate and the outer case has a problem that an adverse effect on the acoustic characteristics occurs. Headphones are being reduced in size, but on the other hand, a space (back air layer) is required behind an acoustic transducer such as a speaker in order to ensure acoustic characteristics. Since the cushion material is a porous material such as sponge, the volume of the back air layer is reduced acoustically. For this reason, the structure which arrange | positions a cushioning material in a product becomes an acoustically disadvantageous structure to the place where it is difficult to ensure a back air layer only by pursuing size reduction.

  Therefore, the present invention aims to provide a structure having high impact resistance while pursuing a high degree of freedom in design, miniaturization, and acoustic characteristics in a small-sized headphone represented by an earphone. And

  The headphone of the present invention has a circuit board, an inner casing that supports the circuit board, and an outer casing for protecting the inner casing and the circuit board, and the outer casing is made of an elastic member. Formed by a formed elastic outer casing and a hard outer casing formed by a hard member, and the hard outer casing is movably attached to the inner casing and covers the circuit board. The elastic outer casing is fixed to the inner casing, and the hard outer casing is urged by elasticity.

  The structure that is movably attached refers to an attached state in which a relative movement can be achieved when a predetermined force is applied, although it is in a fixed state without moving unless a force is applied. In the present invention, since the hard outer casing is movably attached to the inner casing due to the elasticity of the elastic outer casing, if a force is applied to the hard outer casing, the hard outer casing exhibits a repulsive force. The part moves relative to the internal housing. According to this structure, when an impact is applied to the hard outer casing, the impact is received by the elastic outer casing that elastically supports the hard outer casing, and is absorbed by deformation of the elastic outer casing. . That is, the hard outer casing moves relative to the inner casing so as to receive an impact, and the displacement is allowed by elastically deforming the elastic outer casing. According to this impact mitigating mechanism, the impact is indirectly transmitted to the inner casing via the elastic outer casing, so that the impact transmitted to the circuit board is greatly mitigated. The impact becomes a problem because of the acceleration at the moment when the impact occurs, and the acceleration at the initial stage of the impact is absorbed by the deformation of the elastic outer casing. It is possible to avoid a situation that causes the occurrence of cracks. Further, when an impact is directly applied to the elastic outer casing, the impact is absorbed by the elasticity of the elastic outer casing itself.

  Further, according to the present invention, since the hard outer casing can be made of an acrylic resin or the like, it is possible to ensure a design with a high degree of freedom. Moreover, since it is not necessary to arrange a cushion material inside the external housing, it becomes easy to secure an internal space necessary for pursuing acoustic characteristics. For this reason, necessary acoustic characteristics can be obtained while pursuing downsizing.

  In the present invention, it is preferable that a clearance is provided between the hard outer casing and the circuit board. According to this aspect, it is possible to secure a width (movable width) in which the hard outer casing that receives the impact moves with respect to the inner casing by this clearance. In this case, the hard outer casing can move relative to the circuit board (inner casing) within the clearance range, and the shock can be effectively absorbed. In addition, even when the hard outer casing moves due to an impact, the hard outer casing does not come into contact with the circuit board, and the impact is not directly transmitted to the circuit board.

  In the present invention, the elastic outer casing is preferably formed of rubber. By forming the elastic outer casing with rubber, it is possible to pursue various conditions such as shock absorption capacity, elasticity to hold the hard outer casing, strength, flexibility in moldability, low cost, and durability. it can. Other than rubber, an elastic resin material, hard foaming urethane, silicone resin, thermoplastic elastomer material, or the like can be used.

  In the present invention, it is preferable that a speaker that outputs sound is disposed on the side where the elastic outer casing is disposed. According to this aspect, when the headphones are worn, the elastic outer casing comes into contact with the ear, so that the elastic outer casing can be made to function as a cushion material (ear pad) for the portion that contacts the ear.

  According to the present invention, the external casing is divided into an elastic outer casing and a hard outer casing, and the hard outer casing is movably attached to the inner casing via the elastic outer casing, thereby receiving an impact. In this case, the hard outer casing can be displaced relative to the inner casing, and the impact applied to the hard outer casing is displaced with respect to the inner casing, and the elastic outer casing allows the displacement. It can be absorbed by elastic deformation. As a result, it is possible to obtain a structure having high impact resistance while pursuing a high degree of freedom in design, miniaturization, and acoustic characteristics in a small headphone such as an earphone.

(1) Configuration of Headphone FIG. 1 is an exploded perspective view showing the structure of a headphone using the present invention. As shown in FIG. 1, a headphone 100 has a structure in which a speaker unit 103 is housed in a resin base 102 that functions as an internal housing, and a circuit board 104 is held and fixed thereon. The base 102 is held and fixed to a rubber 101 made of rubber which is an elastic outer casing, and an acrylic dome 106 which is a hard outer casing moves relative to the base 102 so as to cover it. It is fixed in a state where it can.

  That is, the base 102 has a substantially disk shape with a circular recess having two steps, and a flange portion 102a around the outer periphery thereof. The base 102 has a female screw hole 102d. In a state where the speaker unit 103 is housed in the center of the concave portion of the base 102, the circuit board 104 is arranged from above, and the screw 104c is screwed into the female screw hole 102d. To be held fixed. The speaker unit 103 includes a drive unit 103a including a magnetic circuit unit configured by a yoke or the like formed of a magnet or iron (not shown) and a spring electrode terminal 103b. The electrode pattern on the back side of the circuit board 104 is in contact with the spring electrode terminal 103b, and the circuit board 104 and the speaker unit 103 are electrically connected. On the circuit board 104, an infrared light receiving unit 104b and a battery holder 104a are arranged, and an electronic circuit (not shown) is formed. An electronic circuit is also formed on the back side of the circuit board 104. A battery 105 serving as a power source is attached to the battery holder 104a.

  In a state where the speaker unit 103 and the circuit board 104 are held and fixed to the base 102, the base 102 is fixed to the rubber 101 by fitting the flange portion 102 a of the base 102 into the groove 101 a inside the substantially annular rubber 101. The The size of the rubber 101 in the Z-axis direction is such that when the dome 106 is fixed to the base 102, the dome 106 can be pressed in the Z-axis direction by an elastic repulsive force with the flange 102a and the groove 101a as fulcrums. It is slightly larger than the contact position with 106 (upward in the Z-axis direction in FIG. 4). In this state, the substantially dome-shaped dome 106 is movably attached to the base 102. This movable mounting structure will be described later.

  FIG. 2 is a perspective view showing the external appearance of the headphone 100. 2A shows a state viewed from an oblique direction on the dome 106 side, and FIG. 2B shows a state viewed from an oblique direction on the base 102 side. FIG. 3 is a top view (A), side views (B), and (C) showing the external appearance of the headphone 100. The side view (B) is an external view of the top view (A) viewed in the X-axis direction, and the side view (C) is an external view of the top view (A) viewed in the Y-axis direction. As shown in FIGS. 2 and 3, the external housing of the headphone 100 is composed of a rubber 101 and a dome 106. A rectangular opening 107 is formed in the dome 106. The opening 107 is connected to a back air layer behind the speaker unit 103 shown in FIG. The concave portion having a flat bottom indicated by reference numeral 106a is a portion for applying a design seal.

  FIG. 4 is a cross-sectional view of the headphone 100. 4A is a YY cross section of FIG. 3A, FIG. 4B is an XX cross section of FIG. 3B, and FIG. It is an expanded sectional view of a part. As shown in FIG. 4, the base 102 has recesses formed in two stages, and the speaker unit 103 is arranged in the first stage. The speaker unit 103 is fixed to the base 102 by a double-sided tape 109 that also serves as a gasket for preventing sound waves from wrapping around the back surface. The base 102 is provided with a female screw hole 102d. The circuit board 104 is fixed to the base 102 by screws 104c using the female screw holes 102d. At the time of fixing, the spring electrode terminal 103b comes into contact with the electrode pattern of the audio signal output terminal on the back surface of the circuit board 104, and the circuit board 104 and the speaker unit 103 are electrically connected.

  An air layer 108 behind the speaker unit 103 is provided between the speaker unit 103 and the circuit board 104. The back air layer 108 is connected to an opening 107 formed in the dome 106. The acoustic characteristics of the speaker unit 103 are tuned by the volume of the back air layer 108, the opening area of the opening 107, the depth dimension of the opening 107, and the like.

  A battery holder 104a is provided on the circuit board 104, and a battery 105 is mounted thereon. An infrared light receiving unit 104 b is disposed on the circuit board 104. The dome 106 is made of acrylic. Since acrylic transmits infrared rays, the infrared light receiving unit 104b can receive infrared signals through the dome 106.

  As shown in FIG. 4B, the base 102 is fixed (attached) to the rubber 101 by fitting the flange 102a of the base 102 into the groove 101a inside the rubber 101.

  FIG. 4C shows a movable fixing structure of the dome 106 to the base 102. That is, as shown in FIG. 4C, a groove 106b having a substantially L-shaped pattern along the inner periphery is formed inside the dome 106. On the other hand, a convex portion 102b is provided on the edge side surface on the base 102 side. When the dome 106 is pressed against the base 102 in a state in which the positions of the convex portions 102b and the grooves 106b are aligned, and then the dome 106 is rotated with respect to the base 102, the convex portions 102b are projected along the grooves 106b having a substantially L-shaped pattern. The part 102b moves and both engage. At this time, the dome 106 pushes the rubber 101 and slightly deforms it, so that it is urged in the Z-axis direction by the repulsive force. For this reason, the upper surface of the convex portion 106 c protruding inward of the edge portion of the dome 106 is pressed against the lower surface of the convex portion 102 b on the base 102 side by the elastic repulsive force of the rubber 101. The dome 106 is fixed to the base 102 by the pressing force from the base 102 side.

  In this structure, since the dome 106 is urged in the Z-axis direction by the repulsive force of the rubber 101, a clearance 110 is formed above the convex portion 102b. Moreover, the clearance 110 is also formed in the side surface direction of the convex part 102b by setting the internal dimension of the groove 106b. Further, a clearance 110 a is also formed between the convex portion 106 c protruding inside the edge portion of the dome 106 and the base 102. When the dome 106 is pushed from the Z-axis direction, the clearance 110 exists, and the rubber 101 has elasticity, so that the dome 106 moves in the pushed direction. And if the force which pushes the dome 106 is removed, it will return to the original position with the repulsive force of the rubber 101. FIG. In this way, the dome 106 is movably attached to the base 102.

  Furthermore, in this structure, the gap dimension between the end side surface of the circuit board 104 fixed to the base 102 and the dome 106 is larger than the gap dimension in the side surface direction of the convex portion 102b and the clearance dimension of the clearance 110a. 110b is set larger. For this reason, even if the dome 106 moves in the X-axis direction due to an impact, the dome 106 does not contact the circuit board 104 and the impact is not directly transmitted to the circuit board 104. In addition, the clearance dimension 110c between the upper surface of the end portion of the circuit board 104 and the dome 106 is set larger than the clearance dimension in the upper surface direction of the convex portion 102b of the clearance 110. For this reason, even if the dome 106 moves in the Z-axis direction due to an impact, the dome 106 does not contact the circuit board 104 and the impact is not directly transmitted to the circuit board 104. That is, even if the dome 106 moves greatly with respect to the base 102 due to a large impact, the dome 106 does not directly contact the circuit board 104.

  Since the dome 106 is made of a material having a high degree of design freedom such as acrylic, its shape, color, gloss, texture, etc. can be freely selected. Therefore, the designability of the headphones 100 can be pursued. Further, a simple and low cost structure can be obtained. Note that the communication method of the headphones 100 is not limited to infrared rays, and may be one using microwaves such as the Bluetooth standard. The communication method may be an optical fiber or wired communication.

(2) Headphone Operation An example of the electrical operation of the headphone 100 shown in FIGS. The audio signal transmitted by infrared rays passes through the dome 106 made of acrylic and is received by the infrared light receiving unit 104b. The output of the infrared light receiving unit 104b is amplified as a low frequency signal by an electronic circuit provided on the circuit board 104. The amplified low frequency signal is transmitted to the speaker unit 103 via the spring electrode terminal 103b, and operates the driving unit 103a. Sound waves generated by the operation of the drive unit 103a are radiated out of the headphones through the speaker opening 102c.

(3) Function of Headphones when Impacted The impact resistance of the headphones 100 will be described with reference to FIG. When an impact is applied to the dome 106 from the Z-axis direction in the drawing, the dome 106 pushes the rubber 101 and the rubber 101 is deformed. At this time, since there is a clearance 110, the dome 106 can approach the base 102 by that size. In this movable range, the rubber 101 is deformed and the impact is absorbed. This prevents an impact from being transmitted directly to the base 102. Even if an impact is transmitted to the base 102, the impact is greatly mitigated. Further, since the clearance 110 a is provided, the dome 106 can also move in the X-axis direction with respect to the base 102. For this reason, even if the dome 106 receives an impact from the lateral direction (X-axis direction), the dome 106 moves in the X-axis direction and elastically deforms the base 101 at that time (the base 101 moves the dome 106 to the Z-axis. Therefore, when the dome 106 tries to move in the X-axis direction, the base 101 is caused to be displaced elastically at the contact surface between the two and the impact is absorbed.

  Further, since the impact received by the dome 106 is absorbed by the deformation of the rubber 101, it is possible to prevent the dome 106 from being cracked or cracked by the impact. For this reason, the dome 106 can be made thin and can be formed of a low-cost material. This is advantageous in pursuing weight reduction, cost reduction, and high durability.

(4) Example of ear-mounted headphones Here, an example of ear-mounted headphones using the headphones shown in FIGS. FIG. 5 is a perspective view showing an example of an earphone. An ear-mounted headphone 400 shown in FIG. 5 includes a headphone 100 and an ear-hooking portion 401 that is hooked on the ear. The headphone 100 has the structure shown in FIGS. The ear-mounted headphone 400 functions as an ear pad portion where the rubber 101 portion hits the ear, and thus high wearability can be obtained. That is, the rubber 101 can function as an impact absorbing means for absorbing an impact on the dome 106 and can function as an elastic ear pad.

(5) Modification of Embodiment The structure for movably attaching the dome 106 to the base 102 may be a fitting structure or a screw-attached structure. However, when the dome 106 is pushed in the direction of the base 102, it is necessary to ensure a margin that the dome 106 can move relative to the base 102.

  As the fitting type, for example, in the structure shown in FIG. 4C, an example in which the cross-sectional shape of the convex portion 102b is a substantially triangular shape can be given. In this case, when the dome 106 is pressed against the base 102, the protrusion 102b on the base 102 side gets over the protrusion 106c protruding inward of the edge portion of the dome 106, and the protrusion 102b enters the groove 106b. Thus, both engage. At this time, the rubber 101 is pushed downward by the dome 106 to be deformed, and the dome 106 is urged upward (Z-axis direction) by the repulsive force. Also in this structure, the clearance 110 is formed, and when the dome 106 is pushed from the Z-axis direction, the rubber 101 is elastically deformed, and the dome 106 can move with respect to the base 102. When the applied force is removed, the dome 106 returns to the original position due to the repulsive force of the rubber 101. Thus, a structure in which the dome 106 is movably attached to the base 102 by a fitting structure is realized.

  As a mounting structure using screws, for example, in the structure shown in FIG. 4C, a screw hole is provided in the dome 106 and a female screw portion is formed at a corresponding position of the base 102. Then, there is a clearance between the dome 106 and the base 102, and the screw is tightened so that the rubber 101 urges the dome 106 away from the base 102. Also in this structure, when the dome 106 is pushed from the Z-axis direction, the rubber 101 is elastically deformed, and the dome 106 can move with respect to the base 102.

  The structure of the headphone 100 can be used as an external speaker of a mobile phone or a personal computer. For example, a wireless speaker is prepared in which the acoustic characteristics of the speaker unit 103 of the headphone 100 are changed to those suitable for an external speaker. On the other hand, a rectangular plastic plate was bent into a deformed L shape with an inner angle of about 75 °, one surface was brought into contact with the installation surface (for example, a desk surface), and an opening for attaching the wireless speaker was formed on the other surface. Prepare an external speaker stand. The wireless speaker is fitted into the opening of the external speaker stand and placed in an appropriate place. Then, using the infrared communication function of the mobile phone or personal computer, the voice is skipped to the wireless speaker and the voice is output.

  The present invention can be used for wireless headphones, for example.

It is a disassembled perspective view which shows the structure of the headphones using invention. It is a perspective view which shows the external appearance of the headphones using invention. It is the top view (A), side view (B), and (C) of the headphones using the invention. It is sectional drawing of the headphones using invention. An ear-mounted headphone utilizing the invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Headphone, 101 ... Rubber (elastic outer casing), 101a ... Groove, 102 ... Base (inner casing), 102a ... Flange part, 102b ... Convex part, 102c ... Speaker opening, 102d ... Female screw hole, 103 ... Speaker unit, 104 ... circuit board, 104a ... battery holder, 104b ... infrared light receiving unit, 104c ... screw, 105 ... battery, 106 ... dome, 106a ... recess, 106b ... groove inside dome, 106c ... inside dome edge , 107 ... opening, 108 ... back air layer, 109 ... gasket and double-sided tape, 110 ... clearance, 110a ... clearance.

Claims (4)

A circuit board;
An internal housing that supports the circuit board;
An outer casing for protecting the inner casing and the circuit board;
In headphones having
The outer casing is formed of an elastic outer casing formed of an elastic member and a hard outer casing formed of a hard member,
The hard outer casing is movably attached to the inner casing, and protects the circuit board so as to cover it.
The headphone according to claim 1, wherein the elastic outer casing is fixed to the inner casing and elastically biases the hard outer casing.   The headphone according to claim 1, wherein a clearance is provided between the hard outer casing and the circuit board.   The headphone according to claim 1, wherein the elastic outer casing is made of rubber.   The headphone according to claim 1, wherein a speaker that outputs sound is disposed on a side where the elastic outer casing portion is disposed.

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