JP2007173643A - Led package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve arrangement density to a base member whose mounting face is circular. <P>SOLUTION: An LED package P is provided with a mounting substrate 20 on which an LED chip 10 is mounted, and a color conversion member 70 fixed to the mounting face-side of the LED chip 10 in the mounting substrate 20 in such a form that the LED chip 10 is stored between the mounting substrates 20. The outer peripheral shape of the mounting substrate 20 is trapezoidal. When an angle formed of two sides among four sides of the trapezoidal mounting substrate 20 is set as θ, the angle θ is set to a value (namely, θ=360÷n) obtained by dividing 360° by the number (n) of LED packages P mounted on the mounting face. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an LED package that houses an LED chip (light emitting diode chip).

  Conventionally, LED chips emit light by combining LED chips and wavelength conversion materials (for example, fluorescent pigments, fluorescent dyes, etc.) that are excited by light emitted from the LED chips and emit light of a different emission color from the LED chips. Research and development of light-emitting devices that emit light of a color different from the color are being conducted in various places. As this type of light-emitting device, for example, a white light-emitting device (generally called a white LED) that obtains white light (white light emission spectrum) by combining an LED chip that emits blue light or ultraviolet light and a phosphor. Has been commercialized.

  Here, not only white LEDs but also light emitting devices using LEDs have advantages in that they can be reduced in size, weight, and power saving compared to conventional incandescent bulbs and fluorescent lamps. It is widely used as a light source for display, an alternative light source for small light bulbs (incandescent light bulbs, halogen light bulbs, etc.), and a light source for liquid crystal panels for mobile phones (backlight for liquid crystal panels).

  In addition, with the recent increase in output of white light emitting devices, research and development for expanding the use of white light emitting devices for lighting applications has become active. When used for an application that requires output, a single white light emitting device cannot obtain a desired light output. Therefore, an LED unit having a plurality of white light emitting devices mounted on one wiring board is configured. Generally, a desired light output is ensured as a whole (see, for example, Patent Document 1).

  By the way, in an LED unit in which a plurality of light emitting devices are mounted on one wiring board, although the amount of heat generated by each light emitting device is relatively small when each light emitting device is turned on, the number of light emitting devices increases. As the amount of heat generated increases, heat tends to accumulate on the wiring board, and the temperature of the entire LED unit tends to rise.

Therefore, as an LED package for storing LED chips, a ceramic mounting board having a storage recess for storing LED chips formed on one surface improves heat dissipation, and the junction temperature of each LED chip is reduced. It is considered that the maximum junction temperature is not exceeded (see, for example, Patent Document 2). In Patent Document 2, a laminated structure of a heat dissipating metal plate and a printed wiring board is provided on the side opposite to the surface on which the housing recess for housing the LED chip is formed on the mounting board. Also disclosed is a structure in which a mounting board and a metal plate are joined through an opening provided in the board.
JP 2003-59331 A JP 2005-135983 A

  By the way, in order to improve the light output of the entire LED unit without increasing the size of the LED unit, it is necessary to increase the arrangement density of the LED package. However, in the LED unit disclosed in Patent Document 1, the LED package is not provided. Whereas the wiring board, which is a base member to be mounted, has a circular shape that matches the shape of the lamp body, the LED package disclosed in Patent Document 2 has a mounting board on which an LED chip is mounted, a metal plate, and a printed board. Since the outer peripheral shape of the laminated structure with the wiring board is rectangular, useless space between the LED packages is increased, and it is difficult to increase the arrangement density of the LED packages.

  This invention is made | formed in view of the said reason, The objective is to provide the package for LED which can raise the arrangement | positioning density to the base member whose mounting surface is circular shape.

  The invention of claim 1 includes a mounting substrate on which the LED chip is mounted, and a cover member that is fixed to the mounting surface side of the LED chip in the mounting substrate so that the LED chip is accommodated between the mounting substrate, The outer peripheral shape of the substrate is trapezoidal.

  According to the present invention, it is possible to increase the arrangement density on the base member whose mounting surface is circular.

  According to a second aspect of the present invention, in the first aspect of the invention, the mounting substrate is made of a heat conductive material, the heat transfer plate on which the LED chip is mounted, and the LED chip on the surface opposite to the heat transfer plate side. And a pair of lead patterns that are electrically connected to each of the electrodes, and a window hole is provided in a portion corresponding to the LED chip, and an insulating substrate laminated on a heat transfer plate. .

  According to this invention, the heat generated in the LED chip can be efficiently radiated through the heat transfer plate.

  The invention of claim 3 is the invention of claim 2, wherein the LED chip is formed in a flat plate shape that is larger than the outer size of the LED chip and smaller than the opening size of the window hole, and between the LED chip and the heat transfer plate. It is a submount member that is interposed, and includes a submount member that relieves stress acting on the LED chip due to a difference in linear expansion coefficient between them.

  According to the present invention, the heat generated in the LED chip can be efficiently radiated through the submount member and the heat transfer plate, and is caused by the difference in linear expansion coefficient between the LED chip and the heat transfer plate. Thus, the stress acting on the LED chip can be relaxed.

  According to a fourth aspect of the present invention, in the third aspect of the present invention, the submount member is provided with a reflective film that reflects light emitted from the side surface of the LED chip around the bonding portion of the LED chip. The thickness dimension is set so that the surface of the film is located farther from the heat transfer plate than the edge of the cover member on the insulating substrate side.

  According to the present invention, the light emitted from the side surface of the LED chip can be prevented from being absorbed by the insulating substrate, and the light extraction efficiency to the outside can be improved. The light emitted from the side surface of the chip can be prevented from being emitted through the joint between the cover member and the insulating substrate, and the cover member is excited by the light emitted from the LED chip and is When a phosphor that emits light of a color different from the emission color of the LED chip is contained, color unevenness can be reduced.

  According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, the transparent resin is molded so as to surround the window hole on the surface side of the insulating substrate opposite to the heat transfer plate side. And a frame body filled with a sealing resin for sealing the LED chip.

  According to this invention, since the frame is provided, the size of the sealing portion made of the sealing resin for sealing the LED chip can be determined by the size of the frame, and the mounting substrate can be downsized. Since the frame body is made of a transparent resin molded product, the difference in linear expansion coefficient between the frame body and the sealing portion can be reduced as compared with the case where the frame body is formed of a metal material. Thus, it is possible to suppress the occurrence of light reflection loss.

  According to a sixth aspect of the present invention, in the first to fifth aspects of the present invention, the cover member is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip. It is a molded product obtained by molding a phosphor together with a translucent material and is formed in a dome shape.

  According to this invention, it is possible to obtain mixed color light of light emitted from the LED chip and light emitted from the phosphor.

  In the invention of claim 1, there is an effect that it is possible to increase the arrangement density on the base member whose mounting surface is circular.

  Hereinafter, an LED unit including a plurality of light emitting devices having the LED package of the present invention will be described with reference to FIGS.

  The LED unit 1 of this embodiment includes a power supply plate A in which a pair of first power supply conductor patterns 101 are formed on an insulating substrate (first insulating substrate) 100 made of a circular glass epoxy substrate, and a power supply. The conductor pattern 201 for wiring that defines the connection relationship of a plurality (eight in this embodiment) of light emitting devices B arranged in parallel along the circumferential direction of the plate A and the group of light emitting devices B having the above connection relationship A pair of second power supply conductor patterns 203 serving as power supply paths is provided with a wiring board C formed on an insulating substrate (second insulating substrate) 200 made of a ring-shaped glass epoxy substrate. Here, the wiring board C surrounds the power feeding plate A on the same plane as the power feeding plate A, and is arranged in a form in which a gap is formed between the wiring board C and the power feeding plate A.

  As shown in FIGS. 3 and 4, the light emitting device B includes the LED chip 10, the mounting substrate 20 mounted on the one surface side of the LED chip 10, and the LED chip 10 on the mounting surface side of the LED chip 10 in the mounting substrate 20. A frame body 40 that surrounds the LED chip 10, and an LED chip 10 and bonding wires 14 and 14 connected to the LED chip 10 that are formed by filling a sealing resin inside the frame body 40 and have elasticity Unit 50, lens 60 disposed on sealing unit 50, and light emitted from LED chip 10 and excited by light transmitted through sealing unit 50 to emit light of a color different from the emission color of LED chip 10 A molded product obtained by molding a fluorescent material together with a transparent material, covers the lens 60 on the light emitting surface 60 b side of the lens 60, and an air layer 80 is formed between the light emitting surface 60 b and the frame body 40. And a dome-shaped color conversion member 70 which is disposed in that form. In the present embodiment, the color conversion member 70 constitutes a cover member that is fixed to the mounting surface side of the LED chip 10 in the mounting substrate 20 so that the LED chip 10 is accommodated between the color conversion member 70 and the mounting substrate 20. Basically, the mounting substrate 20 and the color conversion member 70 constitute the LED package P, but the LED package P in the present embodiment has an additional configuration other than the mounting substrate 20 and the color conversion member 70. As elements, the frame 40 described above and a submount member 30 described later are provided.

  The mounting substrate 20 includes a metal plate 21 and an insulating substrate (third insulating substrate) 22 made of a glass epoxy substrate laminated on the metal plate 21, and the metal plate 21 in the insulating substrate 22. A pair of lead patterns 23 that are electrically connected to both electrodes (not shown) of the LED chip 10 are provided on the surface opposite to the side, and the below-described sub is interposed between the metal plate 21 and the LED chip 10. A window hole 24 that exposes the mount member 30 is provided in the thickness direction of the insulating substrate 22 so that heat generated in the LED chip 10 can be transferred to the metal plate 21 without passing through the insulating substrate 22. ing. Here, Cu is employed as the material of the metal plate 21, but any metal material having a relatively high thermal conductivity may be used, and not only Cu but Al or the like may be employed. In the present embodiment, the metal plate 21 is made of a heat conductive material and constitutes a heat transfer plate on which the LED chip 10 is mounted. Further, the metal plate 21 and the insulating substrate 22 are fixed through a bonding metal layer 25 made of a metal material (here, Cu) formed on the surface of the insulating substrate 22 facing the metal plate 21. Yes. Each lead pattern 23 is formed of a laminated film of a Cu film, a Ni film, and an Ag film, and a portion provided on the inner side of the frame body 40 forms an inner lead portion 23a, and is a color conversion member. A portion formed in a circular shape outside 70 constitutes the outer lead portion 23b.

  The LED chip 10 is a GaN-based blue LED chip that emits blue light, and is a conductive substrate composed of an n-type SiC substrate having a lattice constant and a crystal structure close to GaN as a crystal growth substrate and having conductivity compared to a sapphire substrate. The light-emitting portion 12 is formed of a GaN-based compound semiconductor material on the main surface side of the conductive substrate 11 and formed of a laminated structure portion having a double hetero structure, for example, by an epitaxial growth method (for example, MOVPE method or the like). ), A cathode electrode (n electrode) which is a cathode side electrode (not shown) is formed on the back surface of the conductive substrate 11, and is shown on the surface of the light emitting unit 12 (the outermost surface on the main surface side of the conductive substrate 11). An anode electrode (p electrode) which is an electrode on the anode side that is not to be formed is formed. In short, the LED chip 10 has an anode electrode formed on one surface side and a cathode electrode formed on the other surface side. The cathode electrode and the anode electrode are composed of a laminated film of a Ni film and an Au film, but the material of the cathode electrode and the anode electrode is not particularly limited, and a material capable of obtaining good ohmic characteristics For example, Al or the like may be employed. Note that the LED chip 10 has a square planar shape.

  In addition, the LED chip 10 is formed on the above-described metal plate 21 in a rectangular plate shape (in this case, a flat plate having a square planar shape) that is larger than the chip size of the LED chip 10 and smaller than the metal plate 21. The LED chip 10 and the metal plate 21 are mounted via the above-described submount member 30 that relieves stress acting on the LED chip 10 due to a difference in linear expansion coefficient. The submount member 30 has not only a function of relieving the stress, but also a heat conduction function of transferring heat generated in the LED chip 10 to a range wider than the chip size of the LED chip 10 on the metal plate 21. . In the present embodiment, AlN having a relatively high thermal conductivity and insulation is used as the material of the submount member 30, and the LED chip 10 has the cathode electrode on the LED chip 10 side of the submount member 30. One (on the right side in FIG. 5) lead pattern via a conductor wire 31 provided on the surface and connected to the cathode electrode (see FIG. 7) and a bonding wire 14 made of a fine metal wire (for example, a gold fine wire, an aluminum fine wire, etc.) (Cathode-side lead pattern) 23 is electrically connected, and the anode electrode is electrically connected to the other (left side in FIG. 5) lead pattern (anode-side lead pattern) 23 via the bonding wire 14. Here, in the light emitting device B in the present embodiment, as shown in FIG. 5, the bonding wires 14 and 14 electrically connected to the LED chip 10 extend in a direction along one diagonal line of the LED chip 10. The light emitted from each side surface of the LED chip 10 is less likely to be blocked by the bonding wires 14, 14, and a decrease in the light extraction efficiency of the entire apparatus due to the bonding wires 14, 14 can be suppressed.

  The LED chip 10 and the submount member 30 may be joined using, for example, solder such as SnPb, AuSn, SnAgCu, or silver paste, but may be joined using lead-free solder such as AuSn, SnAgCu. preferable. In addition, the submount member 30 is formed with a reflective film (for example, a laminated film of an Ni film and an Ag film, an Al film) 32 that reflects light emitted from the side surface of the LED chip 10 around the conductor pattern 31. Has been. That is, the submount member 30 is provided with the reflective film 32 that reflects the light emitted from the side surface of the LED chip 10 around the conductor pattern 31 that becomes the bonding portion of the LED chip 10.

  The material of the submount member 30 is not limited to AlN, and any material may be used as long as the linear expansion coefficient is relatively close to 6H—SiC that is the material of the conductive substrate 11 and the heat conductivity is relatively high. Si or the like may be employed.

  As the sealing resin of the sealing portion 50 described above, a silicone resin is used, but not limited to a silicone resin, an acrylic resin or the like may be used.

  On the other hand, the frame 40 has a cylindrical shape and is formed of a transparent resin molded product, and a silicone resin is used as the transparent resin used in the molded product. In short, in the present embodiment, the frame body 40 is formed of a translucent material having a linear expansion coefficient equivalent to that of the sealing resin of the sealing portion 50. Here, in this embodiment, after the frame body 40 is fixed to the mounting substrate 20, the sealing resin 50 is filled (potted) with the sealing resin of the sealing section 50 inside the frame body 40 and is thermally cured. Is formed. In addition, when using acrylic resin instead of silicone resin as sealing resin of the sealing part 50, it is desirable to comprise the frame 40 with the molded article of acrylic resin. In addition, the frame body 40 is disposed so as to surround the LED chip 10 and the submount member 30 on the side opposite to the metal plate 21 side in the insulating substrate 22.

  The lens 60 is composed of a biconvex lens in which each of the light incident surface 60a and the light emitting surface 60b on the sealing portion 50 side is formed in a convex curved surface shape. Here, the lens 60 is formed of a molded product of silicone resin, and the refractive index is the same as that of the sealing portion 50. However, the lens 60 is not limited to the molded product of silicone resin. You may comprise by the molded article of resin.

  Further, the lens 60 has a light emitting surface 60b formed in a convex curved surface shape that does not totally reflect light incident from the light incident surface 60a at the boundary between the light emitting surface 60b and the air layer 80 described above. Here, the lens 60 is disposed so that the optical axis of the lens 60 is positioned on the center line of the light emitting unit 12 along the thickness direction of the LED chip 10. The light emitted from the side surface of the LED chip 10 propagates through the sealing portion 50 and the air layer 80 to reach the color conversion member 70 and does not excite the phosphor of the color conversion member 70 or collide with the phosphor. Or the color conversion member 70 is transmitted.

  The color conversion member 70 is a particulate yellow phosphor that emits broad yellow light when excited by the light-transmitting material such as silicone resin and the blue light emitted from the LED chip 10 and transmitted through the sealing portion 50. It is comprised by the molded article of the mixture which mixed. Therefore, in the light emitting device B in the present embodiment, the blue light emitted from the LED chip 10 and the light emitted from the yellow phosphor are emitted through the outer surface 70b of the color conversion member 70 to obtain white light. Can do. Note that the transparent material used as the material of the color conversion member 70 is not limited to the silicone resin, and for example, an acrylic resin, an epoxy resin, glass, or the like may be employed. Further, the phosphor mixed with the transparent material used as the material of the color conversion member 70 is not limited to the yellow phosphor. For example, white light can be obtained by mixing a red phosphor and a green phosphor.

  Here, the color conversion member 70 has an inner surface 70 a formed in a shape along the light emitting surface 60 b of the lens 60. Therefore, the distance between the light emitting surface 60b and the inner surface 70a of the color conversion member 70 in the normal direction is a substantially constant value regardless of the position of the light emitting surface 60b of the lens 60.

  In addition, the color conversion member 70 is formed so that the thickness along the normal direction is uniform regardless of the position, and the periphery of the opening is on the surface side of the insulating substrate 22 in the mounting substrate 20. For example, it is fixed through a joint (not shown) made of an adhesive (for example, silicone resin, epoxy resin, etc.). Here, in the LED package P and the light emitting device B in the present embodiment, the submount member 30 is formed in a flat plate shape having a planar size larger than the LED chip 10 and smaller than the opening size of the window hole 24 as described above. At the same time, a reflective film 32 that reflects light emitted from the side surface of the LED chip 10 is provided around the conductor pattern 31 that is a bonding portion of the LED chip 10, and the surface of the reflective film 32 is the surface of the color conversion member 70. Since the thickness dimension is set so as to be located farther from the metal plate 21 than the edge on the insulating substrate 22 side, the light emitted from the side surface of the LED chip 10 is absorbed by the insulating substrate 22. The light extraction efficiency to the outside can be improved, and the light emitted from the side surface of the LED chip 10 is converted into the color conversion unit. 70 and is the the it is possible to prevent the emission through the junction between the mounting substrate 20, it is possible to reduce the color unevenness, thereby improving the light output by improving the external light coupling efficiency.

  Further, the LED chip 10 is arranged at the center of the submount member 30 such that each side in plan view intersects one of the diagonal lines of the submant member 30. The light emitted from the respective side surfaces toward the submount member 30 can be efficiently reflected by the reflection film 32, and the light output can be improved by improving the light extraction efficiency to the outside. In the present embodiment, the LED chip 10 and the submant member 30 have substantially the same center axis along the thickness direction, and each side in the plan view of the LED chip 10 is the one diagonal line of the submount member 30. And an angle of about 45 degrees.

  Further, in the LED package P and the light emitting device B in the present embodiment, since the frame body 40 is provided, the size of the sealing portion 50 made of the sealing resin that seals the LED chip 10 is changed to the size of the frame body 40. Since the mounting substrate 20 can be reduced in size and the frame body 40 is formed of a transparent resin molded product, the frame body 40 and the sealing portion can be compared with the case where the frame body 40 is formed of a metal material. The difference in linear expansion coefficient from 50 can be reduced, and the occurrence of light reflection loss in the frame 40 can be suppressed.

  Further, in the LED package P and the light emitting device B in the present embodiment, the color conversion member 70 is disposed in such a manner that an air layer 80 is formed between the light emitting surface 60 b of the lens 60 and the frame body 40. Since the color conversion member 70 does not need to be in close contact with the lens 60 and the frame body 40, it is possible to suppress a decrease in yield due to the dimensional accuracy and positioning accuracy of the color conversion member 70.

  Further, in the LED package P and the light emitting device B in the present embodiment, since the air layer 80 is formed between the color conversion member 70 and the lens 60 as described above, an external force is applied to the color conversion member 70. When the color conversion member 70 is deformed and the contact with the lens 60 is reduced, the stress generated in the color conversion member 70 due to the external force passes through the lens 60 and the sealing portion 50, and the LED chip 10 and the bonding wires 14, 14 can be suppressed, and the variation in the light emission characteristics of the LED chip 10 due to the external force and the disconnection of the bonding wires 14 and 14 are less likely to occur, thereby improving the reliability. In addition, since the air layer 80 is formed between the color conversion member 70 and the lens 60, there is an advantage that moisture in the external atmosphere hardly reaches the LED chip 10.

  In addition, since the air layer 80 is formed between the color conversion member 70 and the lens 60, the color conversion member 70 is emitted from the LED chip 10 and enters the color conversion member 70 through the sealing portion 50 and the lens 60. 70 of the light scattered by the yellow phosphor particles in 70, the amount of light scattered toward the lens 60 and transmitted through the lens 60 can be reduced, and the light extraction efficiency as a whole of the light emitting device B can be improved. There are advantages.

  Incidentally, in the light emitting device B of the present embodiment, the outer peripheral shape of the mounting substrate 20 in the LED package P is trapezoidal, and on the one surface side of the mounting substrate 20, the wide width portion side (in FIG. 5). The LED chip 10 is mounted on a portion that does not overlap the wiring board A and the power supply board B, while the upper side overlaps with the wiring board A and the narrow width part side (lower side in FIG. 5) overlaps the power supply board C. Has been. Further, the mounting substrate 20 is electrically connected to the wiring conductor pattern 201 at a portion which is a pair of lead patterns 23 and 23 electrically connected to the respective electrodes of the LED chip 10 and overlaps the wiring board C. The pair of lead patterns 23, 23 can be electrically connected to the first power supply conductor pattern 101 at a portion overlapping the power supply plate A and electrically connected to the second power supply conductor pattern 203 at a portion overlapping the wiring board C. And a connecting conductor pattern 26 that can be connected to the conductor.

  Here, the power supply plate A has a pair of first power supply conductor patterns 101 formed on the surface opposite to the mounting substrate 20 side, and each of the power supply conductor patterns 101 is connected to the power supply wires. Two wire connection through-hole wirings 111 for electrical connection using a material (for example, solder), each of the power supply conductor patterns 101, and each of the contact conductor patterns 26 of one LED package P Two power supply through-hole wirings 112 are formed to electrically connect the one connection portion 26a to the first connection portion 26a using a brazing material (for example, solder). That is, in the power feeding plate A, the power feeding through-hole wiring 112 is formed in each portion overlapping the one connection portion 26a of the connecting conductor pattern 26 of each of the two LED packages P. Here, each through-hole wiring 111, 112 is formed across the inner surface of the circular through-hole penetrating in the thickness direction of the insulating substrate 100 and the peripheral portion of the through-hole on both surfaces of the insulating substrate 100. Yes. Therefore, in the LED unit 1 of this embodiment, the brazing material is filled inside the through hole in a state where the power supply plate A and the mounting substrate 20 in the LED package P of each light emitting device B are overlapped. The connecting portion 26a has a circular planar shape.

  In the above-described power supply plate A, two through-hole wirings 111 for connecting electric wires are formed in the central part of the insulating substrate 100, and two through-hole wirings 112 for power supply are separated in the circumferential direction at the peripheral part of the insulating substrate 100. Is formed. In the LED unit 1 of the present embodiment, the high potential side of the two power supply wires is electrically connected to the first power supply conductor pattern 101 on the right side in FIG. Is electrically connected to the first power supply conductor pattern 101 on the left side in FIG.

  The wiring board C has a wiring conductor pattern 201 and a pair of second power feeding conductor patterns 203 formed on the surface of the light emitting device B opposite to the mounting substrate 20 side of the LED package P. A through-hole wiring 202 for connection is formed in each portion overlapping each outer lead portion 23b of each lead pattern 23 of each LED package P, and the other connection portion of the contact conductor pattern 26 of each LED package P is formed. A connecting through-hole wiring 204 is formed in each part overlapping with 26b. Here, each of the through-hole wirings 202 and 204 is formed across the inner surface of the circular through-hole penetrating in the thickness direction of the insulating substrate 200 and the peripheral portion of the through-hole on both surfaces of the insulating substrate 200. Yes. Therefore, in the LED unit 1 of the present embodiment, a brazing material (for example, solder) is filled inside the through hole in a state where the wiring board C and the mounting substrate 20 of the LED package P in each light emitting device B are overlapped. The connecting through-hole wiring 202 and the outer lead portion 23b are electrically connected, and the connecting through-hole wiring 204 and the connecting portion 26b are electrically connected. The connecting portion 26b has a circular planar shape.

  Therefore, in the LED unit 1 of this embodiment, the space | interval of the mounting board | substrate 20 in each LED package P of each light-emitting device B, the electric power feeding board A, and the wiring board C can be narrowed, and it radiates | emits from each light-emitting device B. Light can be efficiently extracted outside, and the entire unit can be made thinner. Each LED package P has a window hole 24 in the insulating substrate 22 formed between the inner lead portion 23a of each of the pair of lead patterns 23 and a part of the portion between the connection portions 26a and 26b in the connecting conductor pattern 26. The planar shapes of the patterns 23 and 26 are set so as to surround the entire circumference.

  The LED unit 1 of the present embodiment includes a plurality of (eight in the present embodiment) surface mount type Zener diodes (chip Zener diodes) that are connected in parallel to the respective light emitting devices B, although not shown. On the surface of the wiring board C opposite to the mounting substrate 20 side of each light emitting device B, a parallel connection conductor pattern 205 for connecting each zener diode to each light emitting device B in parallel is formed. In short, in the LED unit 1 of the present embodiment, a plurality of Zener diodes connected in parallel with the LED chips 10 are mounted on the surface side of the wiring board C opposite to the mounting board 20 side, so that each heat source The zener diode and the LED chip 10 can be separated from each other, the temperature rise of the LED chip 10 due to the heat generated by the zener diode can be suppressed, and the temperature rise of the zener diode due to the heat generated by the LED chip 10 can be suppressed. Can be suppressed.

  Further, in the LED unit 1 of the present embodiment, a plurality of cutout portions 200a are formed on the inner peripheral edge of the insulating substrate 200 in the wiring board C along the outer peripheral shape of each color conversion member 70 of each light emitting device B. The size of each color conversion member 70 can be increased without increasing the outer diameter of the wiring board C, and the lens diameter of the lens 60 can be increased.

  The LED unit 1 described above can be used as a light source of a lighting fixture (here, a spotlight) as shown in FIG. Here, in the example shown in FIG. 10, the LED unit 1 is made of an insulating layer made of, for example, a green sheet on the front surface of a cylindrical lamp body 310 formed of a metal having high thermal conductivity (for example, Al, Cu, etc.). (Not shown).

  The lighting fixture having the configuration shown in FIG. 10 uses a plurality of (two in the illustrated example) mounting screws 304 in contact with the construction surface 400a formed by the lower surface of the peripheral portion of the mounting hole 401 provided in the ceiling material 400. The fixture part 300 in which the flange part 302 fixed to the ceiling member 400 and the embedded part 303 arranged in a form embedded in the attachment hole 401 are continuously formed integrally, and the upper part of the fixture part 300 is An arm 301 to be attached and a lamp body 310 connected to the lower end of the arm 301 are provided. Here, the lamp body 310 is coupled to the lower end portion of the arm 301 by using a shaft screw 313, and the lamp body 310 can swing up and down with respect to the arm 301 by this configuration. In addition, a first connector provided at the tip of a power supply line led out from a separate power supply unit (not shown) is detachably connected to the upper surface side of the embedded portion 303 of the fixture body 300. A second connector (not shown) is provided, and an insertion hole 311 in which an electric wire electrically connected to the second connector is formed along the inner space of the arm 301 and the center line of the lamp body 310. The power supply plate A of the LED unit 1 is connected to the pair of first power supply conductor patterns 101.

  Further, in the lighting fixture having the configuration shown in FIG. 10, a metal cover 320 holding a lens 330 that distributes light emitted from each light emitting device B of the LED unit 1 is attached to the front surface side of the lamp body 310. ing.

  In the LED unit 1 including a plurality of light emitting devices B each having the LED package P of the present embodiment, a plurality of mounting boards 20 whose outer peripheral shape is trapezoidal are overlapped with the wiring board C on the wide width side and fed on the narrow width side. Since it is arranged side by side along the circumferential direction of the power supply plate A so as to overlap the plate A, it is possible to reduce a useless space between the mounting boards 20 and to reduce the diameter of the entire unit as compared with the conventional one. Since the power supply plate A and the wiring board C are arranged on the one surface side on which the LED chip 10 is mounted on the mounting substrate 20, when used in a lighting fixture as described above, from the LED chip 10 to the lamp body 310. The heat resistance of the LED chip 10 can be reduced, the temperature rise of the junction temperature of each LED chip 10 can be suppressed, the input power can be increased, and the light output can be increased. Further, since the power supply plate A is arranged at the center of the LED unit 1, there is no need to provide a space for routing the electric wire drawn through the insertion hole 311 provided at the center of the lamp body 310, and the lamp body 310. Can be miniaturized.

  In the LED package P of the present embodiment described above, the outer peripheral shape of the mounting substrate 20 is trapezoidal, so that it is possible to increase the arrangement density on the lamp body 310 whose mounting surface is circular. Here, if the angle formed by two oblique sides of the four sides of the trapezoidal mounting substrate 20 is θ, the angle θ is 360 ° divided by the number n of LED packages P mounted on the mounting surface. It is desirable to set the value (that is, θ = 360 ÷ n). Here, in the LED unit 1 of this embodiment, since eight LED packages P are mounted on a circular mounting surface, θ = 360 ÷ 8 = 45 °. In addition, although the package P for LEDs of the above-described embodiment includes the frame body 40, a structure that does not include the frame body 40 may be employed. In the above example, the lamp body 310 having a circular mounting surface constitutes a base member for mounting the LED package P. However, the base member is limited to a columnar shape like the lamp body 310 described above. For example, the mounting surface may be a disk shape or a bottomed cylindrical shape with a circular mounting surface. Further, even when the mounting surface is an elongated rectangular shape, if the wide and narrow portions of the mounting substrate 20 are alternately arranged along the longitudinal direction of the mounting surface (that is, a trapezoidal shape) If the upper base and the lower base are alternately arranged in parallel, the arrangement density can be increased.

  In the light emitting device B in the above-described embodiment, a blue LED chip whose emission color is blue is adopted as the LED chip 10, and a SiC substrate is adopted as the conductive substrate 11, but instead of the SiC substrate. A GaN substrate may be used. When a SiC substrate or a GaN substrate is used, the crystal growth substrate has a higher thermal conductivity than the case where a sapphire substrate, which is an insulator, is used as the crystal growth substrate. The thermal resistance of the growth substrate can be reduced. Further, the light emission color of the LED chip 10 is not limited to blue, and may be, for example, red or green. That is, the material of the light-emitting portion 12 of the LED chip 10 is not limited to the GaN-based compound semiconductor material, and a GaAs-based compound semiconductor material, a GaP-based compound semiconductor material, or the like may be employed according to the emission color of the LED chip 10. Further, the conductive substrate 11 is not limited to the SiC substrate, and may be appropriately selected from, for example, a GaAs substrate and a GsP substrate according to the material of the light emitting unit 12.

It is a schematic plan view which shows the LED unit in embodiment. It is a principal part schematic plan view of the LED unit in the same as the above. It is a general | schematic disassembled perspective view of the light-emitting device same as the above. It is a schematic sectional drawing of the light-emitting device in the same as the above. It is a principal part schematic plan view of the light-emitting device same as the above. The 3rd insulating board | substrate in the same as the above is shown, (a) is a schematic plan view, (b) is a schematic side view, (c) is a schematic bottom view. It is a schematic perspective view of the submount member in the same as the above. The electric power feeding board in the same as above is shown, (a) is a schematic plan view, (b) is a schematic side view, and (c) is a schematic bottom view. The wiring board in the same as above is shown, (a) is a schematic plan view, (b) is a schematic side view, and (c) is a schematic bottom view. The lighting fixture using the LED unit in the same as above is shown, (a) is a schematic front view, (b) is a schematic side view partly broken.

Explanation of symbols

A power supply plate B light emitting device C wiring board P LED package 1 LED unit 10 LED chip 20 mounting substrate 21 metal plate 22 insulating substrate (third insulating substrate)
23 lead pattern 26 contact conductor pattern 30 submount member 32 reflective film 40 frame 70 color conversion member 100 insulating substrate (first insulating substrate)
DESCRIPTION OF SYMBOLS 101 1st electric power feeding conductor pattern 111 Through-hole wiring for electric wire connection 112 Through-hole wiring for electric power feeding 200 Insulating board (2nd insulating board)
201 Conductive pattern for wiring 202 Through-hole wiring for connection 203 Second conductive pattern for power feeding 204 Through-hole wiring for connection

Claims (6)

  A mounting substrate on which the LED chip is mounted, and a cover member that is fixed to the mounting surface side of the LED chip in the mounting substrate so that the LED chip is accommodated between the mounting substrate, and the outer peripheral shape of the mounting substrate is trapezoidal The package for LED characterized by becoming.   The mounting substrate is made of a heat conductive material, and a pair of leads electrically connected to both electrodes of the LED chip on a surface opposite to the heat transfer plate side on which the LED chip is mounted. 2. The LED package according to claim 1, further comprising: an insulating substrate provided with a pattern and having a window hole at a portion corresponding to the LED chip and laminated on a heat transfer plate.   A submount member formed in a flat plate shape larger than the outer size of the LED chip and smaller than the opening size of the window hole and interposed between the LED chip and the heat transfer plate, and a difference in linear expansion coefficient between the two The LED package according to claim 2, further comprising a submount member that relieves stress acting on the LED chip due to the above.   The submount member is provided with a reflective film that reflects light emitted from the side surface of the LED chip around the bonding portion of the LED chip, and the surface of the reflective film is on the insulating substrate side of the cover member. The LED package according to claim 3, wherein a thickness dimension is set so as to be positioned farther from the heat transfer plate than an edge.   A transparent resin molded product disposed in a form surrounding the window hole on the surface opposite to the heat transfer plate side of the insulating substrate, and filled with a sealing resin for sealing the LED chip inside The LED package according to any one of claims 2 to 4, further comprising a frame body.   The cover member is a molded product in which a phosphor that is excited by light emitted from the LED chip and emits light of a color different from the emission color of the LED chip is molded together with a translucent material, and is formed in a dome shape. The LED package according to claim 1, wherein the LED package is formed.

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