JP2007165791A - Light source device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To electrically connect a plurality of semiconductor light emitting chips in parallel or in series. <P>SOLUTION: The light source device 1 has a plurality of patterns 6, 6a and electrodes 66, 66a that are conducted from a plurality of the patterns 6, 6a. A plurality of the patterns 6, 6a are provided on the surface 3 of an insulative substrate 2 so as to allow a common polarity of a plurality of semiconductor light emitting device chips 7 to be electrically connected. A plurality of the electrodes 66, 66a are provided so as to be conducted from the patterns 6, 6a on the backside section 4 on the reverse side of the insulative substrate 2 where a plurality of the semiconductor light emitting device chips 7 are disposed. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  In the present invention, a plurality of semiconductor light emitting element chips having both positive and negative polarities on the same surface are placed in a plurality of patterns electrically connecting common polarities provided on an insulating substrate, and these semiconductor light emitting element chips are arranged. The present invention relates to a light source device capable of obtaining emitted light with high luminance by providing an electrode that conducts from a pattern on the opposite side.

As a conventional light source device, for example, a lead frame is insert-molded, and a plurality of semiconductor light-emitting element chips are placed in parallel in a linear shape and integrated with one or a plurality of light-emitting portions (openings). Things are known.
Japanese Patent Laid-Open No. 11-004022

  As the above-described conventional light source device, the one formed by integral molding cannot release Joule heat from the semiconductor light emitting element chip, and heat is trapped in the light source device. For example, white light is emitted by a fluorescent material. In some cases, the phosphor may be deteriorated by heat.

(Object of invention)
The present invention has been made to solve the above-described problems, and a plurality of patterns in which a plurality of semiconductor light-emitting element chips having both positive and negative electrodes on the same surface are provided on an insulating substrate made of ceramic or the like. Directly mechanically and electrically connected to parallel (parallel) or series (serial) by using gold bumps, eutectic, etc. without using bonding wires, etc., and provided on the opposite side to the semiconductor light-emitting element chip arranged in these patterns The electrode can obtain power from the outside by supplying power from the outside to obtain a large output light as the whole light source device, and in order to supply a large current from the electrode on the back side of the light source device, Joule heat from the semiconductor light emitting element chip is used. An object of the present invention is to provide a light source device capable of efficiently emitting to the outside.

  In the light source device according to claim 1 of the present invention, a plurality of patterns for electrically connecting the common polarities of the semiconductor light emitting element chips are provided on the insulating substrate, and conduction from the patterns to the opposite side on which the semiconductor light emitting element chips are arranged. An electrode is provided.

  The light source device according to claim 1 is provided with a plurality of patterns for electrically connecting the common polarities of the semiconductor light emitting element chips on the insulating substrate, and an electrode conducting from the pattern on the opposite side where the semiconductor light emitting element chips are arranged. Since it is provided, a plurality of semiconductor light emitting element chips can be electrically connected in parallel (parallel) or series (series). In addition, semiconductor light emitting element chips having different emission colors can be provided on one insulating substrate. And the electric power supplied to all these semiconductor light emitting element chips can be supplied from the electrode of the back surface part side of an insulating board | substrate. Therefore, Joule heat generated from the semiconductor light emitting element chip can be released to the outside.

  The light source device according to claim 2 is characterized in that the insulating substrate is made of ceramic.

  In the light source device according to the second aspect, since the insulating substrate is made of ceramic, Joule heat generated from a plurality of semiconductor light emitting element chips can be quickly conducted, and the mechanical strength is excellent.

  Furthermore, the light source device according to claim 3 is characterized in that the insulating substrate is made of a transparent material.

  In the light source device according to the third aspect, since the insulating substrate is made of a transparent material, the light emitting device has a light emitting device on the front surface side and back surface side of the insulating substrate (with a plurality of semiconductor light emitting element chips mounted thereon). The surface to be mounted and the opposite surface to be mounted). Moreover, the emitted light from the semiconductor light emitting element chip can be obtained from both surfaces of the insulating substrate.

  According to a fourth aspect of the present invention, there is provided the light source device according to claim 4, wherein the insulating substrate has a conductive through hole or a conductive body between the surface on which the semiconductor light emitting element chip is disposed and the back surface on the opposite side. To do.

  The light source device according to claim 4 has a conductive through hole or conductive body between the surface on which the semiconductor light emitting element chip is disposed and the back surface on the opposite side in the insulating substrate, and is thus conducted from the pattern. In addition to the electrodes, the back side can be energized. Further, the insulating substrate itself can be mechanically fixed using the passage hole.

  Further, the light source device according to claim 5 is characterized in that at least two or more electrodes are provided on the opposite side of the insulating substrate on which the semiconductor light emitting element chip is arranged.

  Since the light source device according to the fifth aspect is provided with at least two or more electrodes on the opposite side of the insulating substrate on which the semiconductor light emitting element chip is disposed, the light source device can be directly mounted on an electronic substrate or the like as it is. In addition, a plurality of semiconductor light emitting element chips having different emission colors can be mounted by corresponding to a plurality of patterns on the insulating substrate. Furthermore, by having each electrode, it is possible to adjust the current and voltage flowing through each semiconductor light emitting element chip.

  The light source device according to claim 6 is characterized in that a semiconductor light emitting element chip placed on an insulating substrate has both positive and negative electrodes on the same surface.

  In the light source device according to the sixth aspect, since the semiconductor light emitting element chip mounted on the insulating substrate has both positive and negative electrodes on the same surface, a plurality of semiconductor light emitting elements are provided in a plurality of patterns provided on the insulating substrate or the like. Chips can be directly mechanically and electrically connected by gold bumps, eutectics, etc. without using bonding wires or the like.

  Furthermore, the light source device according to claim 7 is characterized in that the semiconductor light emitting element chip emits red light, blue light, and green light, or emits red light, blue light, green light, or white light.

  In the light source device according to claim 7, since the semiconductor light emitting element chip emits red light, blue light, green light, or red light, blue light, green light, or white light, the light emission device has various light emission colors. Further, it is possible to emit white light emitted by red light emission, blue light emission, green light emission, or single white light emission (pseudo white color by a fluorescent material or a wavelength conversion material).

  As described above, the light source device according to claim 1 is provided with a plurality of patterns for electrically connecting the common polarities of the semiconductor light emitting element chips to the insulating substrate, and patterns on the opposite side where the semiconductor light emitting element chips are arranged. Since the electrode which conducts from is provided, a plurality of semiconductor light emitting element chips can be electrically connected in parallel (parallel) or series (series). In addition, semiconductor light emitting element chips having different emission colors can be provided on one insulating substrate. And the electric power supplied to all these semiconductor light emitting element chips can be supplied from the electrode of the back surface part side of an insulating board | substrate. Therefore, Joule heat generated from the semiconductor light emitting element chip can be released to the outside.

  Therefore, for example, the emitted light of the white light can be obtained by the light emission of the three primary colors of the semiconductor light emitting element chips for red light emission, green light emission, and blue light emission, and the light source device as a whole can obtain the emitted light of high luminance and large light emission. In addition, deterioration of the semiconductor light-emitting element chip due to heat can be prevented, and light having a long life and a stable wavelength can be emitted.

  In the light source device according to claim 2, since the insulating substrate is made of ceramic, Joule heat generated from a plurality of semiconductor light emitting element chips can be quickly conducted, and the mechanical strength is excellent.

  Therefore, Joule heat can be conducted to the outside and emitted to the outside, the semiconductor light emitting element chip can be prevented from being deteriorated, and light having a long life and a stable wavelength can be emitted. In addition, since a larger amount of current can be passed, high-luminance outgoing light can be obtained.

  In the light source device according to the third aspect, since the insulating substrate is made of a transparent material, the light emitting device has an emission surface on the front surface side and the back surface side of the insulating substrate (with a plurality of semiconductor light emitting element chips). The surface to be placed and the opposite surface to be placed) can be selected. Moreover, the emitted light from the semiconductor light emitting element chip can be obtained from both surfaces of the insulating substrate.

  Therefore, a light source device capable of bidirectional emission can be obtained. Further, for example, by connecting a blue light emitting semiconductor light emitting element chip on the pattern of the insulating substrate, and providing a yellow light emitting fluorescent material that is excited by the blue light emitting semiconductor light emitting element chip and emits a different wavelength, a fluorescent material is used. White light can be emitted by mixing the yellow light emission color and the blue light emission color of the semiconductor light emitting element chip.

  Further, the light source device according to claim 4 has a conductive through hole or a conductive body between the surface on which the semiconductor light emitting element chip is disposed and the back surface on the opposite side in the insulating substrate. In addition to the conducting electrode, the back side can be energized. Further, the insulating substrate itself can be mechanically fixed using the passage hole.

  Therefore, a larger amount of current can be flowed and high-luminance outgoing light can be obtained. In addition, by mechanically fixing the insulating substrate itself, Joule heat from the plurality of semiconductor light emitting element chips can be efficiently discharged to the outside by screws or the like of metal having good thermal conductivity.

  Furthermore, since the light source device according to claim 5 is provided with at least two electrodes on the opposite side of the insulating substrate on which the semiconductor light emitting element chip is disposed, the light source device can be directly mounted on an electronic substrate or the like as it is. . In addition, a plurality of semiconductor light emitting element chips having different emission colors can be mounted by corresponding to a plurality of patterns on the insulating substrate. In addition, by having each electrode, it is possible to adjust the current and voltage flowing through each semiconductor light emitting element chip.

  As a result, high-luminance outgoing light can be obtained. Furthermore, white light can be obtained by mounting semiconductor light emitting element chips that emit red light, blue light, and green light. Moreover, all emission colors (full color) can be obtained by controlling the semiconductor light emitting element chip of each emission color.

  In the light source device according to claim 6, since the semiconductor light-emitting element chip placed on the insulating substrate has both positive and negative electrodes on the same surface, a plurality of semiconductors in a plurality of patterns provided on the insulating substrate or the like The light-emitting element chips can be directly mechanically and electrically connected by gold bumps, eutectics, etc. without using bonding wires. Therefore, it is possible to emit light stably against mechanical vibration or the like.

  Furthermore, in the light source device according to claim 7, since the semiconductor light emitting element chip emits red light, blue light, and green light, or red light, blue light, green light, or white light, Light emission color, red light emission, blue light emission, white light by green light emission, or white light emission by itself (pseudo white color by a fluorescent material or a wavelength conversion material) can be emitted. Therefore, it can respond to the light source of various apparatuses.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
In the present invention, a plurality of conductive patterns are provided on an insulating substrate such as ceramic, and the plurality of patterns are extended to the back surface of the insulating substrate to form an electrode. A plurality of semiconductor light emitting device chips having both positive and negative electrodes are not used by bonding wires or the like by gold bumps or eutectic in parallel or in series on the same surface on a plurality of conductive patterns. Directly mechanically and electrically connected to each other, and extended to the back surface on the opposite side where the semiconductor light emitting element chip is arranged in these patterns, an electrode is provided to obtain power supply from the outside. As a result, the light source device can obtain a large output of emitted light as a whole light source device, and can efficiently emit Joule heat from the semiconductor light emitting element chip to the outside in order to supply a large current from the electrode of the light source device. Is provided.

  1 is a schematic perspective view of a light source device according to the present invention, FIG. 2 is a schematic perspective view from the back side of the light source device according to the present invention, and FIGS. 3, 5 to 7 are schematic diagrams of the light source device according to the present invention. FIG. 4, FIG. 8, FIG. 9 are schematic side sectional views of the light source device according to the present invention.

  As shown in FIG. 1, the light source device 1 is provided with a plurality of conductive patterns 6 (6a) on a surface 3 of an insulating substrate 2 such as ceramic. The plurality of patterns 6 (6a) extend from the side surface portion 5 to the back surface portion 4 of the insulating substrate 2 to form an electrode 66 (66a).

  The light source device 1 of this example includes a plurality of semiconductor light emitting element chips 7 obtained by inverting LED bear chips having both anode and cathode electrodes on the same surface as the conductive pattern 6 (6a). It is placed on a plurality of conductive patterns 6 (6a) in series, and is flip-chip bonded with gold bumps 9 or eutectic 9 to directly and mechanically and electrically without using bonding wires or the like. It is a connected configuration.

  2 shows a schematic perspective view from the back side of the light source device 1, and FIG. 4 shows a schematic side sectional view of the light source device 1. As shown in FIGS. 2 and 4, the back surface portion 4 of the insulating substrate 2 covers the side surface portion 5 with a plurality of conductive patterns 6 (6 a) provided on the front surface 3 of the insulating substrate 2, and further back surface The electrode 66 (66 a) is provided on the back surface portion 4 so as to extend to the portion 4.

  The substrate 2 is made of a material having insulating properties, mechanical strength, and good thermal conductivity. The substrate 2 can be formed of a ceramic substrate made of, for example, aluminum nitride, aluminum oxide such as alumina or sapphire, silicon carbide, gallium phosphide, or the like. Further, the substrate 2 may be made of a liquid crystal polymer resin, a glass cloth epoxy resin, or the like.

  And if the board | substrate 2 is comprised with an insulating ceramic etc., the jumbo heat | fever which generate | occur | produces from the some semiconductor light-emitting device chip | tip 7 can be transmitted rapidly. For this reason, more current can be passed through the semiconductor light emitting element 7, and high-luminance outgoing light can be obtained from the semiconductor light emitting element chip 7.

  Moreover, if the board | substrate 2 is comprised with a sapphire etc., it will have insulation, it has heat conductivity, and it has transparency. For this reason, the light emission surface of the light source device 1 is selected between the front surface 3 side and the back surface portion 4 side of the insulating substrate 2 (the surface on which the plurality of semiconductor light emitting element chips 7 are placed and the opposite surface to be placed). Can do. In addition, light emitted from the semiconductor light emitting element chip 7 can be obtained from both surfaces of the insulating substrate 2. Thereby, the light source device 1 capable of bidirectional emission can be obtained.

  As shown in FIG. 8, the substrate 2 includes a conductive pattern 6 (6 a) on the surface 3 on which the semiconductor light emitting element chip 7 is disposed and an electrode 66 on the back surface portion 4 on the opposite side of the surface on which the semiconductor light emitting element chip 7 is disposed. It is good also as a structure which provides the through-hole 10 which has electroconductivity between (66a).

  The through hole 10 having conductivity is formed through the back surface portion through the pattern 6 (6a) by forming a through hole between the conductive pattern 6 (6a) on the front surface 3 and the electrode 66 (66a) on the back surface portion 4 with solder or the like. It is possible to conduct directly to the four-side electrode 66 (66a), and more current can be efficiently conducted. Therefore, a larger amount of current can be flowed, and high-luminance outgoing light can be obtained.

  In addition, as shown in FIG. 9, the insulating substrate 2 itself may be mechanically fixed to the mounting substrate 12 or the like with a conductive body 11 such as a screw using the passage hole 10. Thereby, Joule heat from the plurality of semiconductor light emitting element chips 7 can be efficiently discharged to the outside by the conductive body 11 such as a screw such as a metal having good thermal conductivity.

  The conductive pattern 6 (6a) has a pattern shape that enables electrical connection on the surface 3 of the ceramic substrate 2 or the like by vacuum deposition, sputtering, ion plating, CVD (chemical vapor deposition), etching (wet, dry), or the like. In addition, metal plating is applied.

  Also, the conductive pattern 6 (6a) is provided with a plurality of conductive patterns 6 and conductive patterns 6a on the ceramic substrate 2 or the like, and semiconductor light emitting element chips 7 of the same color light emission or different color light emission are arranged in parallel (parallel) or series (series). ), A desired emission color and brightness can be obtained.

  After the electrode 66 (66a) is formed in the same manner as the conductive pattern 6 (6a), the side surface portion 5 and the back surface portion 4 are further plated with a noble metal such as gold or silver so as to increase the mechanical strength. Is preferred.

  The electrode 66 (66a) is provided with a plurality of electrodes 66 and 66a corresponding to the plurality of conductive patterns 6 and 6a.

  Thus, by providing a plurality of electrodes 66, 66a, etc., it is possible to adjust the current and voltage that flow through the semiconductor light emitting element chip 7 placed on each pattern 6 (6a).

  Furthermore, white light can be obtained by mounting the semiconductor light emitting element chip 7 that emits red light, blue light, and green light. Further, by controlling the current and voltage of the semiconductor light emitting element chip 7 that emits each color, all emission colors (full color) can be obtained.

  In addition, the emitted light can be adjusted by controlling the luminance of the semiconductor light emitting element chip 7, and the light source device 1 can also be directly mounted on an electronic substrate or the like (not shown).

  The semiconductor light-emitting element chip 7 has both the anode and cathode (+, −) electrodes on the same surface, and the two electrodes are inverted to perform the processing in the downward direction.

  Further, the semiconductor light emitting device chip 7 has a high emission of red light emission (R), blue light emission (B), green light emission (G), etc. made of a semiconductor chip of a compound such as a quaternary compound or InGaAlP, InGaAlN, or InGaN. It is a luminance light emitting element. In the case of white light, the semiconductor light emitting element chips 7 of three primary colors of red light emission (R), blue light emission (B), and green light emission (G) are provided very close to each other. Further, various emission colors can be emitted by combining RGB from the emission light of these single colors (R, G, B).

  In addition, a ceramic substrate having reflectivity such as aluminum nitride or alumina is provided with an adhesive in which a fluorescent material which is a wavelength conversion material for yellow light emission is mixed with a colorless and transparent adhesive, and further, a blue light emitting semiconductor light emitting element is provided thereon. The chip 7 may be provided. As a result, the blue light emitted from the blue light emitting semiconductor light emitting element chip 7 itself is directly emitted in the emission direction, and the light emitted from the blue light emitting semiconductor light emitting element chip 7 toward the ceramic substrate 2 reaches the wavelength conversion material. When yellow light emitted by the fluorescent material emitting yellow light is reflected by the ceramic substrate and is again emitted through the semiconductor light-emitting element chip 7 in the emission direction, the yellow emission color is excited by the blue light of the light-emitting element chip 7. White light can be emitted by mixing the light emission color with blue.

  Further, a transparent ceramic substrate 2 such as sapphire is provided with an adhesive in which a fluorescent material which is a wavelength conversion material for yellow light emission is mixed with a colorless transparent adhesive, and further a blue light emitting semiconductor light emitting element chip 7 is provided thereon. It is good also as a structure. As a result, the blue light emitted from the blue light emitting semiconductor light emitting element chip 7 itself is directly emitted in the emission direction, and the light emitted from the blue light emitting semiconductor light emitting element chip 7 toward the ceramic substrate 2 reaches the wavelength conversion material. Excited by the blue light of the light emitting element chip 7, the yellow light emitted by the yellow light emitting fluorescent material is transmitted through the ceramic substrate 2, and the blue light emission color from the semiconductor light emitting element chip 7 and the yellow light emission color by the fluorescent material are generated. The mixed white light can be emitted from the back surface of the transparent ceramic substrate 2.

  In addition, the positive and negative electrodes on the same surface of each semiconductor light emitting element chip 7 and the conductive patterns 6 and 6a can be electrically and mechanically connected by gold bumps 9, eutectic crystals 9 and the like.

  When the gold bump 9 is used, both the positive and negative electrodes on the same surface of each semiconductor light emitting element chip 7 and the conductive patterns 6 and 6a are welded while vibrating or pressurizing and heating fine gold particles.

  When eutectic 9 is used, a metal material (excellent in conductivity) is used in which both the positive and negative electrodes on the same surface of the semiconductor light emitting element chip 7 and the conductive patterns 6 and 6a are easily eutectic. It is welded by heating.

  In this manner, a plurality of conductive patterns 6 and the like are provided on the insulating substrate 2 such as ceramic, and the plurality of conductive patterns 6 and the like are extended to the back surface portion 4 of the insulating substrate 2 to form the electrodes 66 and the like. A plurality of semiconductor light emitting element chips 7 having both positive and negative electrodes on the same surface on a plurality of conductive patterns 6 and the like are directly machined in parallel or in series by gold bumps, eutectic crystal 9 or the like. Power is supplied from the outside by an electrode 66 or the like provided on the opposite side where the semiconductor light emitting element chip 7 is disposed in the pattern. Thereby, the output light of high output can be obtained as the whole light source device. Since a large current is supplied from the electrode 66 of the light source device or the like, Joule heat from the semiconductor light emitting element chip can be efficiently discharged to the outside.

  As a result, since Joule heat can be conducted to the outside and emitted to the outside, it is possible to prevent deterioration of the semiconductor light emitting element chip 7 and to emit light with a long wavelength and a stable wavelength. Furthermore, since a larger amount of current can be passed, high-luminance outgoing light can be obtained.

  Although not shown here, when the light source device 1 as shown in FIG. 1 is not directly mounted on an electronic substrate or the like and used as a single light source device 1, modified polyamide, polybutylene terephthalate, nylon 46 or aromatic polyelter is used. A light source device in a case in which a white powder such as titanium oxide is mixed with an insulating material such as a liquid crystal polymer, etc. mixed with white powder such as titanium oxide to improve light reflectivity and light shielding 1 is stored.

  Moreover, the case in that case has a light-emitting part (opening part) in the emission direction of the light source device 1, and has four side surfaces whose inner side is connected by an inclined part toward the bottom on the opposite side of the light-emitting part. .

  Then, the space between the four inclined portions and the bottom portion is filled with a transparent resin such as a colorless transparent epoxy resin or silicone resin, and the semiconductor light emitting element chip 7 is more strongly fixed and the light emitted from the semiconductor light emitting element chip 7 is fixed. The light is not exposed to the air layer and is emitted from the light emitting portion (opening) without being attenuated.

  Further, a clearer emission color is emitted by filling the space with a transparent resin such as a transparent epoxy resin or silicone resin adjusted to the same color as the emission light of the semiconductor light emitting element chip 7.

  Further, a resin in which a wavelength conversion material made of an inorganic fluorescent pigment, an organic fluorescent dye, or the like is mixed in a colorless and transparent resin is filled and excited by the emission color of the semiconductor light emitting element chip 7 itself and the semiconductor light emitting element chip 7. Then, light that is a mixture of the light emitting semiconductor light emitting element chip 7 and light of a different wavelength may be emitted.

  Here, the conductive pattern 6 (6a) provided in the light source device 1 is shown in FIG. 3 and FIGS. In the example of FIG. 3, two conductive patterns 6 and one conductive pattern 6a are provided on the surface 3 of the ceramic substrate 2 or the like, and the anode or cathode of the semiconductor light emitting element chip 7 is shared by using the conductive pattern 6a as a common circuit. To do. For example, the left and right anode sides of the semiconductor light emitting element chip 7 are connected to the conductive pattern 6a so as to face each other, and the cathode side of each semiconductor light emitting element chip 7 is connected to the conductive patterns 6 at both ends. The luminance and the like can be adjusted by controlling the current and the like supplied from the electrode 66 on the conductive pattern 6 side.

  FIG. 4 shows a cross section of FIG. FIG. 4A is a cross-sectional view taken along line A-A ′ of FIG. 3 and shows a state where the conductive pattern 6 a is cut at the center.

  As shown in FIG. 4 (a), the front surface 3 portion of the insulating substrate 2 and both ends of the side surface portion 5 and the back surface portion 4 are surrounded by a conductive pattern 6a, and in particular, noble metals such as gold and silver are disposed at both ends of the back surface portion 4. The electrode 66a is plated to increase the mechanical strength. Then, although not shown, the conductive pattern 6a has a conductive pattern 6 similar to the conductive pattern 6a on the front side and the back side, and the semiconductor light-emitting element chip so as to straddle the conductive pattern 6a and the conductive pattern 6 7 are electrically and mechanically connected by gold bumps 9 or eutectic crystals 9.

  FIG. 4B is a cross-sectional view taken along line B-B ′ of FIG. 3, and shows a state crossing the conductive pattern 6 and the conductive pattern 6 a.

  As shown in FIG. 4B, the conductive pattern 6 and the conductive pattern 6 are formed up to the front surface 3 portion and the side surface portion 5 of the insulating substrate 2 and in front of the back side and the back surface portion 4 but not to the back side. The electrode 66 or the electrode 66a is provided with a mechanical strength by being surrounded by a conductive pattern 6a, and in particular, a noble metal plating such as gold or silver is applied to both ends of the back surface portion 4. Then, the semiconductor light emitting element chip 7 is electrically and mechanically connected by the gold bumps 9 and the eutectic crystal 9 so as to straddle the conductive patterns 6 a and the conductive patterns 6.

  Next, in the example of FIG. 5, three conductive patterns 6 including a conductive pattern 6 partially separated on the surface 3 and one conductive pattern 6 a are provided on the surface 3 of the ceramic substrate 2 or the like. The anode or cathode of the semiconductor light emitting element chip 7 is shared by using the conductive pattern 6a as a common circuit. For example, the left and right anode sides of the semiconductor light emitting element chip 7 are connected to the conductive pattern 6a so as to face each other, and the cathode side of each semiconductor light emitting element chip 7 is connected to the conductive patterns 6 at both ends. The luminance and the like can be adjusted by controlling the current and the like supplied from the electrode 66 on the conductive pattern 6 side.

  Further, three types of semiconductor light emitting element chips 7 of red light emission, green light emission, and blue light emission are used as the semiconductor light emitting element chips 7 mounted on the three conductive patterns 6 and the conductive patterns 6a. This makes it possible to reproduce full-color colors as well as white light emission colors.

  Next, in the example of FIG. 6, three conductive patterns 6 and two conductive patterns 6a are provided on the surface 3 of the ceramic substrate 2 or the like, and one set of conductive patterns 6, the conductive patterns 6a, and two conductive patterns are provided. The common pattern 6 and one conductive pattern 6a are used as a common circuit, and the anode or the cathode of the semiconductor light emitting element chip 7 is shared. For example, the left and right anode sides of the semiconductor light emitting element chip 7 using a common circuit are connected to the conductive pattern 6 a so as to face each other, and the cathode side of each semiconductor light emitting element chip 7 is connected to the two conductive patterns 6. The luminance and the like can be adjusted by controlling the current and the like supplied from the electrode 66 on the conductive pattern 6 side. In FIG. 6, the anodes and cathodes of a plurality of semiconductor light emitting element chips 7 are connected to the pair of conductive patterns 6 and 6a.

  Further, the semiconductor light-emitting element chip 7 placed on one conductive pattern 6 and one conductive pattern 6a and two conductive patterns 6 and one conductive pattern 6a is made to emit red light, green light and blue light. A kind of semiconductor light emitting element chip 7 is used. This makes it possible to reproduce full-color colors as well as white light emission colors.

  FIG. 7 shows a modified pattern of the above-described circuit. Three conductive patterns 6 and one conductive pattern 6a are provided on the surface 3 of the ceramic substrate 2 or the like. An electrode 66 and an electrode 66a are provided from the side surface portion 5 to a part of the front surface 3, and from the side surface portion 5 to the back surface portion 4, respectively.

  The anode or cathode of the semiconductor light-emitting element chip 7 is shared by using the three conductive patterns 6 extending from the three side portions 5 and the one conductive pattern 6a extending from the one side portion 5 as a common circuit. For example, the anode side of the semiconductor light emitting element chip 7 is connected to the conductive pattern 6a, and the cathode side of each semiconductor light emitting element chip 7 is connected to the conductive patterns 6 at both ends. The luminance and the like can be adjusted by controlling the current and the like supplied from the electrode 66 on the conductive pattern 6 side.

  Further, three types of semiconductor light emitting element chips 7 of red light emission, green light emission, and blue light emission are used as the semiconductor light emitting element chips 7 placed on the three conductive patterns 6 and one conductive pattern 6a. This makes it possible to reproduce full-color colors as well as white light emission colors.

  As described above, a plurality of conductive patterns 6 and 6a are provided on a ceramic substrate 2 or the like having excellent insulation and thermal conductivity, and a plurality of semiconductor light emitting element chips 7 are directly mechanically and mechanically formed by gold bumps 9 or eutectic crystals 9 or the like. It can be electrically connected to emit high-luminance light and efficiently emit Joule heat from the semiconductor light-emitting element chip 7 to the outside.

  As a result, it is possible to obtain high-intensity emitted light and prevent the semiconductor light-emitting element chip 7 from being deteriorated, prevent deterioration of the semiconductor light-emitting element chip 7 due to heat, and emit light having a stable wavelength. The light source device 1 that can be provided can be provided.

  Further, for example, a blue light emitting semiconductor light emitting element chip 7 and a yellow light emitting color by a yellow light emitting fluorescent material that is excited by the blue light emitting semiconductor light emitting element chip 7 and emits a different wavelength, and a blue light emitting of the semiconductor light emitting element chip 7. When the white light is emitted by mixing with the color, it is possible to provide the light source device 1 that can prevent deterioration of the fluorescent material due to heat and emit light having a stable wavelength.

It is suitable for light sources for backlights of small mobile products to light sources for backlights of large liquid crystal display devices. In particular, since it is a semiconductor light emitting device, it has a wide operating temperature range and can sufficiently cope with the use environment such as a car navigation system.
In addition, a full-color display can be provided by arranging a large number of on-vehicle light sources and lighting devices as high-intensity light sources and arranging them in a matrix as a whole.

1 is a schematic perspective view of a light source device according to the present invention. It is a schematic perspective view from the back surface part side of the light source device which concerns on this invention. It is a substantially plane pattern figure of the light source device which concerns on this invention. (A), (b) It is a schematic sectional side view of the light source device according to the present invention. It is a substantially plane pattern figure of the light source device which concerns on this invention. It is a substantially plane pattern figure of the light source device which concerns on this invention. It is a substantially plane pattern figure of the light source device which concerns on this invention. It is a schematic side sectional view of a light source device according to the present invention. It is a schematic side sectional view of a light source device according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light source device 2 Insulating substrate 3 Front surface 4 Back surface part 5 Side surface part 6, 6a Conductive pattern 7 Semiconductor light emitting element chip 9 Gold bump, eutectic 10 Passing hole 11 Screw (conductive body)
12 Mounting substrate 12 'Mounting substrate conductive wiring pattern 66, 66a Electrode

Claims (7)

In a light source device in which a plurality of semiconductor light emitting element chips are arranged on an insulating substrate,
The insulating substrate is provided with a plurality of patterns that electrically connect common polarities of the semiconductor light emitting element chips, and an electrode that conducts from the patterns is provided on the opposite side of the semiconductor light emitting element chips. Light source device. The light source device according to claim 1, wherein the insulating substrate is made of ceramic. The light source device according to claim 1, wherein the insulating substrate is made of a transparent material. The light source device according to claim 1, wherein the insulating substrate has a conductive through hole or a conductive body between a surface on which the semiconductor light emitting element chip is disposed and a back surface on the opposite side. The light source device according to claim 1, wherein at least two electrodes are provided on the opposite side of the insulating substrate on which the semiconductor light emitting element chip is disposed. The light source device according to claim 1, wherein the semiconductor light emitting element chip placed on the insulating substrate has both positive and negative electrodes on the same surface. 2. The light source device according to claim 1, wherein the semiconductor light emitting element chip emits three types of red light emission, blue light emission, and green light emission, or any one of red light emission, blue light emission, green light emission, or white light emission.

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