JP2007165628A - Apparatus for mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting a substrate capable of stably and easily grounding the ground pattern of the substrate to a cabinet, and capable of easily fixing the substrate to the cabinet. <P>SOLUTION: A mounting member 12 has a leg 14 provided on the cabinet 60, an elastic portion 16 which is connected to the leg 14 and will be in contact with the ground pattern P, and a fixture 18 connected to the elastic portion 16 for holding the substrate 50 between it and the elastic portion 16 by being inserted through a slit 52 of the substrate 50 and bent. The substrate 50 is fixed and grounded to the cabinet 60 by the mounting member 12. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a board mounting apparatus for fixing and grounding a printed wiring board having a ground pattern to a housing (frame ground).

  As measures for strengthening the grounding (ground) of electronic devices, measures such as connecting a ground pattern of a substrate to a housing (frame ground) are generally taken. That is, in many cases, a method of strengthening the ground (GND) by connecting the ground pattern and the housing with screws for fixing the substrate or a dedicated component is used.

  However, if the number of screws or parts are added to strengthen the connection between the board and the case, the assembly (ease of assembly) will not be good. In addition, some structures have been proposed that use spring-like protrusions to enhance the electrical coupling between the substrate and the housing.

  For example, a protruding spring is provided on the housing so as to face a planar ground pattern formed on the back side of the printed wiring board, and the printed wiring board is attached to the housing with a screw so that the ground pattern is There is a configuration in which the degree of adhesion between the two is strengthened by pressing (see, for example, Patent Document 1).

  In addition, for example, when a conductive member having a leaf spring-like contact portion is soldered on a ground pattern formed on the back side of the printed wiring board, and the printed wiring board is fixed to the housing with a screw or the like, it is elastic. There is a configuration in which the ground pattern is pressed against the housing by the repulsive force of the contact portion of the deformed conductive member (see, for example, Patent Document 2).

  Furthermore, for example, in a printed wiring board, when a plate spring is soldered to a through hole formed in an inner layer ground pattern near a noise source such as an LSI or a CPU, and the printed wiring board is fixed to the housing with a screw or the like There is a configuration in which the ground pattern is pressed against the housing by the repulsive force of the spring (see, for example, Patent Document 3).

However, all of these methods use the repulsive force of the spring when fixing the substrate with a screw or the like, so that the substrate bends when contacting a plurality of points, and the more apart from where it is fixed with the screw, There is a problem that the contact pressure becomes weak and the original function is not performed. This is a problem that is difficult to solve even if the elasticity of the protruding spring is weakened in order to reduce the warping and bending of the substrate.
JP-A-5-136578 JP 2004-311531 A Japanese Patent No. 2806902

  SUMMARY OF THE INVENTION In view of the above problems, the present invention has an object to provide a substrate mounting device that can stably and easily ground a substrate ground pattern to a housing and can easily fix the substrate to the housing. To do.

  In order to achieve the above object, a substrate mounting apparatus according to claim 1 of the present invention is a substrate mounting apparatus that fixes and grounds a substrate having a ground pattern and having a slit formed on a housing. A leg portion provided in the housing, an elastic portion connected to the leg portion and contacting the ground pattern, and connected to the elastic portion, and inserted into the slit and bent. And a fixing part that holds the substrate between the elastic part.

  According to the first aspect of the present invention, the portion that is brought into contact with the ground pattern of the substrate is an elastic portion that is connected to the leg portion provided on the housing (frame ground), so that the ground pattern can be easily and stably provided. Can be grounded to the housing. In addition, since the fixed portion connected to the elastic portion is inserted into the slit and the fixed portion inserted through the slit is bent, the substrate is sandwiched between the fixed portion and the elastic portion. Mounting and fixing to can be done easily.

  The substrate mounting apparatus according to claim 2 is characterized in that, in the substrate mounting apparatus according to claim 1, a surface of the fixing portion that is brought into contact with the substrate is an arc surface.

  According to the second aspect of the present invention, when the substrate is sandwiched between the fixing portion and the elastic portion, there is no possibility that the fixing portion damages the substrate.

  According to a third aspect of the present invention, there is provided a substrate mounting device according to the present invention, which is a substrate mounting device for fixing and grounding a substrate having a ground pattern and having a slit formed on the housing. A mounting member having a leg portion, a support portion that is connected to the leg portion and is inserted into the slit and is in contact with the ground pattern, and is attached to the support portion that is inserted through the slit. And a fixing member for holding the substrate between the support portion.

  According to the third aspect of the present invention, the portion that is brought into contact with the ground pattern of the substrate is a support portion that is connected to a leg portion provided in the housing (frame ground), and the support portion is formed in the slit of the substrate. Since the fixing member is attached to the support portion inserted through the slit and the substrate is sandwiched between the fixing member and the support portion, the ground pattern is easily and stably grounded to the housing. In addition, the substrate can be easily attached and fixed to the housing.

  According to a fourth aspect of the present invention, there is provided the substrate mounting apparatus according to the third aspect, wherein a surface of the fixing member that is brought into contact with the substrate is an arc surface.

  According to the fourth aspect of the present invention, when the substrate is held between the fixing member and the support portion, there is no possibility that the fixing member damages the substrate.

  Further, the substrate mounting device according to claim 5 according to the present invention is a substrate mounting device for fixing and grounding a substrate having a ground pattern to the housing, wherein the leg portion provided on the housing; It is characterized by comprising an attachment member that is connected to the leg portion and has a support portion that contacts the ground pattern, and a fixing member that holds the substrate and the support portion together.

  According to the fifth aspect of the present invention, the portion that is brought into contact with the ground pattern of the substrate is a support portion that is connected to a leg portion provided in the housing (frame ground), and the support portion and the substrate are fixed. Since the members are held together, the ground pattern can be easily and stably grounded, and the substrate can be easily attached and fixed to the housing.

  According to a sixth aspect of the present invention, there is provided a substrate mounting apparatus for fixing and grounding a substrate having a ground pattern and having a first through hole formed thereon. A mounting member comprising: a leg portion provided on a body; and a support portion that is connected to the leg portion and is in contact with the ground pattern and has a second through hole that communicates with the first through hole; A fixing member in which a third through-hole communicating with the first through-hole and the second through-hole is formed, and the first through-hole communicated with the second through-hole and the second through-hole are sandwiched between the substrate and the support portion. And a fixing pin inserted through the third through hole.

  According to a seventh aspect of the present invention, there is provided a substrate mounting apparatus according to the sixth aspect, wherein the fixing pin is provided with a drop-off preventing means.

  According to invention of Claim 6 and Claim 7, the site | part made to contact the ground pattern of a board | substrate is a support part provided in a row by the leg part provided in a housing | casing (frame ground), The support part and While holding the board together with the fixing member, the fixing pin is inserted into the through holes formed in the fixing member, the board, and the support part so that it cannot fall out, so that the ground pattern can be grounded easily and stably. In addition, the substrate can be easily and firmly attached to the housing.

  Further, the substrate mounting apparatus according to claim 8 is the substrate mounting apparatus according to any one of claims 1 to 7, wherein the leg portion is mounted to the housing by a fixing means. It is characterized by.

  According to invention of Claim 8, a leg part can be attached and fixed to the arbitrary positions of a housing | casing.

  As described above, according to the present invention, it is possible to provide a substrate mounting apparatus that can stably and easily ground the substrate ground pattern to the housing and can easily fix the substrate to the housing.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS The best mode for carrying out the present invention will be described below in detail based on the embodiments shown in the drawings. The substrate mounting apparatus according to the present invention uses elasticity (spring repulsive force) or the like for connection (grounding) between the ground pattern of the substrate and the frame (frame ground) and for mounting and fixing the substrate to the frame. And it can be done at the same time. In each figure, a direction perpendicular to the front surface (back surface) of the substrate is defined as a vertical direction, and a direction perpendicular thereto is defined as a horizontal direction.

[First embodiment]
First, the first embodiment will be described. 1 to 3 show a first embodiment of a substrate mounting apparatus according to the present invention. That is, the attachment device 10 is composed only of an attachment member 12 formed by bending a metal plate member having conductivity.

  The attachment member 12 includes a leg portion 14 erected on the inner wall of the housing 60 via the bracket 13, a spring portion (elastic portion) 16 that is bent and formed in an arc shape when viewed from the side, and is horizontally provided. It has a substantially inverted “L” -shaped fixing portion 18 that holds the substrate 50 between the spring portion 16 by twisting (bending) in the direction.

  The bracket 13 is provided with a mounting hole 13A. A screw 58 as a fixing means is inserted into the mounting hole 13A and is fixed to the housing 60, whereby the leg portion 14 can be freely attached to the housing 60. Easily mounted at the position of Note that the fixing means is not limited to the screw 58.

  Further, the lower edge portion of the protruding piece 18A protruding in the horizontal direction of the fixed portion 18 is bent and formed in an arc shape when viewed from the side, and serves as a pressing surface 18B that holds the substrate 50 from the surface. The distance between the pressing surface 18B of the fixing portion 18 and the upper arc surface 16A of the spring portion 16 is slightly smaller than the thickness of the substrate 50.

  In the mounting apparatus 10 of the first embodiment, the ground pattern P (see FIG. 3) formed on the back surface of the substrate 50 as follows by using only the mounting member 12 having such a configuration (only one component). And the housing (frame ground) 60 are connected (grounded) and the substrate 50 is fixed to the housing 60.

  That is, as shown in FIG. 1, first, the fixing portion 18 is inserted into the slit or the through-hole 52 formed adjacent to the ground pattern P of the substrate 50 from the back surface side and protrudes to the front surface side. Then, as shown in FIG. 2, the protruding piece 18 </ b> A of the fixing portion 18 is manually twisted (bent) clockwise by about 90 degrees, in this case, in plan view.

  At this time, since the distance between the arc surface 16A of the spring portion 16 and the pressing surface 18B of the fixing portion 18 is slightly smaller than the thickness of the substrate 50, as shown in FIG. 3, the arc surface 16A of the spring portion 16 and the fixing portion The substrate 50 can be held between the 18 pressing surfaces 18B, and the arc surface 16A of the spring portion 16 can be reliably brought into contact with the ground pattern P formed on the substrate 50.

  That is, as a result, the connection (grounding) between the ground pattern P formed on the back surface of the substrate 50 and the housing (frame ground) 60 can be performed stably and easily. Fixing can be done easily without using screws. Moreover, since the contact surfaces of the spring portion 16 and the substrate 50 of the fixing portion 18 are both arcuate surfaces, there is no risk of damaging the front and back surfaces of the substrate 50 when the substrate 50 is held.

[Second Embodiment]
Next, a second embodiment will be described. 4 to 6 show a second embodiment of the board mounting apparatus according to the present invention. That is, the attachment device 10 is formed by forming a conductive metal plate-like member into a substantially “U” shape in a side view and a substantially “M” shape in a side view. And a fixing member 25.

  The mounting member 20 includes a leg portion 22 that is erected on the inner wall of the housing 60 via a bracket 23, and a support portion 24 that is formed in a substantially “U” shape with an upper side opening in a side view. In the vicinity of the upper ends of the support portions 24 facing each other, rectangular long holes 24A that are long in the horizontal direction are formed.

  A mounting hole 23A is formed in the bracket 23, and a screw 58 as a fixing means is inserted into the mounting hole 23A and screwed to the housing 60, whereby the leg portion 22 can be arbitrarily attached to the housing 60. Easily mounted at the position of Note that the fixing means is not limited to the screw 58.

  Further, as shown in FIG. 6, the position where the elongated hole 24 </ b> A is formed can be held between the fixing member 25 and the support portion 24 with a predetermined pressure when the fixing member 25 is attached to the support portion 24. It is a position. The upper surface of the support portion 24 is a support surface 24 </ b> B that contacts the ground pattern P formed on the back surface of the substrate 50.

  On the other hand, the fixing member 25 includes a spring portion 26 that is bent and formed in an arc shape when viewed from the side, and a pair of operation portions 28 that are connected to both ends of the spring portion 26 in the vertical direction, and its operation. A locking piece 28 </ b> A extending in the horizontal direction is provided at the lower edge of the portion 28, and the spring portion 26 and the operation portion 28 have a substantially “M” shape in side view. The lower arc surface of the spring portion 26 is a pressing surface 26A that presses the substrate 50 from the surface.

  In the mounting device 10 of the second embodiment, the ground pattern P (see FIG. 6) formed on the back surface of the substrate 50 by the two components of the mounting member 20 and the fixing member 25 configured as described above. ) And the housing (frame ground) 60 (ground) and the substrate 50 is fixed to the housing 60.

  That is, first, as shown in FIG. 4, slits and through-holes 52 formed in parallel on the both sides of the ground pattern P of the substrate 50 in correspondence with the distance between the support portions 24 of the mounting member 20 from the back side. The support part 24 is inserted and protruded to the surface side. Then, as shown in FIG. 5, the operation portion 28 of the fixing member 25 is pressed toward the spring portion 26 to bend the fixing member 25 against the urging force of the spring portion 26, and is drilled in the support portion 24. The locking piece 28A is inserted into the long hole 24A.

  At this time, since the distance between the pressing surface 26A of the spring portion 26 and the supporting surface 24B of the supporting portion 24 is slightly smaller than the thickness of the substrate 50, the pressing surface 26A of the spring portion 26 is shown in FIG. The support surface 24B of the support portion 24 can be held in contact with the ground pattern P formed on the substrate 50.

  That is, as a result, the connection (grounding) between the ground pattern P formed on the back surface of the substrate 50 and the housing (frame ground) 60 can be performed stably and easily. Fixing can be done easily without using screws. In addition, since the contact surface of the spring portion 26 with the substrate 50 is an arc surface, there is no possibility of damaging the surface of the substrate 50 when the substrate 50 is held.

[Third embodiment]
Next, a third embodiment will be described. 7 and 8 show a third embodiment of the board mounting apparatus according to the present invention. That is, the attachment device 10 is formed by forming a metal plate member having conductivity into a substantially inverted “L” shape when viewed from the side, and a substantially “Ω” shape when viewed from the side. And a fixing member 35.

  The attachment member 30 includes a leg portion 32 erected on the inner wall of the housing 60 via a bracket 33, and a support portion 34 bent in the horizontal direction (bent at 90 degrees). The upper surface of 34 is a support surface 34 </ b> A that contacts the ground pattern P formed on the back surface of the substrate 50.

  An attachment hole 33A is formed in the bracket 33, and a screw 58 as a fixing means is inserted into the attachment hole 33A and is fixed to the housing 60, whereby the leg portion 32 is arbitrarily attached to the housing 60. Easily mounted at the position of Note that the fixing means is not limited to the screw 58.

  On the other hand, the fixing member 35 is provided with a pair of holding portions 38 that hold the substrate 50 and the support portion 34 together, and the pair of holding portions 38, and the holding portion 38 is provided with elasticity. And a spring portion 36. The sandwiching portions 38 are bent inward toward each other so as to have a generally “<” shape when viewed from the side, and the minimum interval is made smaller than the combined thickness of the substrate 50 and the support portion 34. The inner surface of the holding portion 38 is a pressing surface 38 </ b> A that contacts the surface of the substrate 50 and the lower surface of the support portion 34.

  In the mounting apparatus 10 of the third embodiment, the ground pattern P (see FIG. 8) formed on the back surface of the substrate 50 by two parts of the mounting member 30 and the fixing member 35 configured as described above. ) And the housing (frame ground) 60 (ground) and the substrate 50 is fixed to the housing 60.

  That is, first, as shown in FIG. 7, the end portion side of the substrate 50 is placed on the support portion 34 of the attachment member 30. That is, the support surface 34 </ b> A of the support portion 34 is brought into contact with the ground pattern P of the substrate 50. Then, the spring portion is extended so that the holding portion 38 of the fixing member 35 is expanded against the urging force of the spring portion 36 and the substrate 50 stacked on the support portion 34 is held together with the support portion 34. The inner surface 36 is inserted until it contacts the end surface 50 </ b> A of the substrate 50.

  At this time, since the minimum interval between the holding portions 38 (pressing surfaces 38A) is smaller than the combined thickness of the substrate 50 and the support portion 34, as shown in FIG. 8, between the pressing surfaces 38A of the holding portions 38. The substrate 50 and the support portion 34 can be held, and the support surface 34 </ b> A of the support portion 34 can be reliably brought into contact with the ground pattern P formed on the substrate 50.

  That is, as a result, the connection (grounding) between the ground pattern P formed on the back surface of the substrate 50 and the housing (frame ground) 60 can be performed stably and easily. Fixing can be done easily without using screws. In the third embodiment, depending on the mounting direction of the fixing member 35 with respect to the substrate 50, the fixing member 35 is detached from the substrate 50 and the support portion 34 due to vibration or the like, and the substrate 50 is fixed to the attachment member 30 (support portion 34). It may not be possible.

[Fourth embodiment]
Next, a fourth embodiment will be described. 9 and 10 show a fourth embodiment of the board mounting apparatus according to the present invention. That is, the attachment device 10 is formed by forming a conductive metal plate-like member into a substantially inverted “L” shape in a side view and a substantially “Ω” shape in a side view. And a fixing pin 49 inserted therethrough.

  The mounting member 40 includes a leg portion 42 erected on the inner wall of the housing 60 via a bracket 43, and a support portion 44 bent in the horizontal direction (bent 90 degrees). The upper surface of 44 is a support surface 44 </ b> A that contacts the ground pattern P formed on the back surface of the substrate 50. A circular through hole (second through hole) 44B through which the fixing pin 49 is inserted is formed in the support surface 44A.

  A mounting hole 43A is formed in the bracket 43, and a screw 58 as an adhering means is inserted into the mounting hole 43A and is fixed to the housing 60, whereby the leg portion 42 can be arbitrarily attached to the housing 60. Easily mounted at the position of Note that the fixing means is not limited to the screw 58.

  On the other hand, the fixing member 45 is provided with a pair of holding portions 48 for holding the substrate 50 and the support portion 44 together, and the pair of holding portions 48, and gives elasticity to the holding portion 48. And a spring portion 46. The sandwiching portions 48 are bent inward so as to have a substantially “<” shape when viewed from the side, and the minimum interval is made smaller than the combined thickness of the substrate 50 and the support portion 44. The inner surface of the holding portion 48 is a pressing surface 48 </ b> A that contacts the surface of the substrate 50 and the lower surface of the support portion 44.

  In addition, a circular through hole (third through hole) 48B through which the fixing pin 49 is inserted is disposed in the pair of holding portions 48 so as to be in the same position as the through hole 44B in plan view (so as to communicate with each other). It has been drilled. The fixing pin 49 is formed in a bolt shape, and an insertion portion 49B having a slightly smaller diameter than the through holes 44B and 48B, and a head 49A having a larger diameter than the through holes 44B and 48B for preventing falling off. And have. Further, as shown in FIG. 10, it is preferable to provide means for preventing dropout such as a ring-shaped member 47 having a diameter larger than that of the through hole 48 </ b> B, as shown in FIG.

  In the mounting device 10 of the fourth embodiment, the mounting member 40, the fixing member 45, and the fixing pin 49 configured as described above, and further including four parts including a drop-off preventing means such as the ring-shaped member 47, In the following manner, connection (grounding) between the ground pattern P (see FIG. 10) formed on the back surface of the substrate 50 and the housing (frame ground) 60 and fixing of the substrate 50 to the housing 60 are performed. The substrate 50 is also provided with a circular through hole (first through hole) 54 through which the insertion portion 49B of the fixing pin 49 can be inserted.

  First, as shown in FIG. 9, the end portion side of the substrate 50 is placed on the support portion 44 of the mounting member 40. That is, the support surface 44 </ b> A of the support portion 44 is brought into contact with the ground pattern P of the substrate 50. At this time, the through hole 44B formed in the support portion 44 and the through hole 54 formed in the substrate 50 are communicated.

  Then, the spring portion is extended so that the holding portion 48 of the fixing member 45 is expanded against the urging force of the spring portion 46 and the substrate 50 stacked on the support portion 44 is held together with the support portion 44. 46 until the inner surface 46 abuts against the end surface 50A of the substrate 50. At this time, the through hole 48B formed in the holding portion 48, the through hole 44B formed in the support portion 44, and the through hole 54 formed in the substrate 50 are communicated.

  Thus, the holding portion 48 is mounted on the substrate 50 and the support portion 44. Since the minimum distance between the holding portions 48 (the pressing surfaces 48A) is smaller than the combined thickness of the substrate 50 and the support portion 44, FIG. As shown in FIG. 5, the substrate 50 and the support portion 44 can be held between the pressing surfaces 48A of the holding portion 48, and the support surface 44A of the support portion 44 is reliably in contact with the ground pattern P formed on the substrate 50. Can be made.

  Thereafter, the fixing pin 49 is inserted from above so that the fixing member 45 does not come off the substrate 50 and the support portion 44. That is, the insertion portion 49B of the fixing pin 49 is inserted into the through hole 48B of the upper holding portion 48, the through hole 54 of the substrate 50, the through hole 44B of the support portion 44, and the through hole 48B of the lower holding portion 48. To do. Further, the ring-shaped member 47 is fitted to the fixing pin 49 from below, so that the fixing pin 49 is reliably prevented from falling off.

  Thereby, the connection (grounding) between the ground pattern P formed on the back surface of the substrate 50 and the housing (frame ground) 60 can be stably and easily performed, and the substrate 50 can be attached and fixed to the housing 60. Can be made easily and firmly without using screws.

  As described above, according to the substrate mounting apparatus 10 of the present invention, the ground pattern P of the substrate 50 can be grounded to the housing (frame ground) 60 stably and easily. Therefore, it is possible to reduce radiation noise generated from a printed wiring board on which electronic components are mounted. Further, the board 50 can be easily fixed to the housing 60 with a small number of parts without using screws or the like.

The schematic perspective view which shows the mode before attaching a board | substrate to the attachment apparatus which concerns on 1st Example. The schematic perspective view which shows the mode after attaching a board | substrate to the attachment apparatus which concerns on 1st Example. The schematic sectional side view which shows the mode after attaching a board | substrate to the attachment apparatus which concerns on 1st Example. The schematic perspective view which shows the mode before attaching a board | substrate to the attachment apparatus which concerns on 2nd Example. The schematic perspective view which shows the mode after attaching a board | substrate to the attachment apparatus which concerns on 2nd Example. Schematic side sectional view showing a state after the substrate is attached to the attachment device according to the second embodiment The schematic perspective view which shows the mode before attaching a board | substrate to the attachment apparatus which concerns on 3rd Example. Schematic side sectional view showing a state after the substrate is attached to the attachment device according to the third embodiment The schematic perspective view which shows the mode before attaching a board | substrate to the attachment apparatus which concerns on 4th Example. Schematic side sectional view showing a state after the substrate is attached to the attachment device according to the fourth embodiment

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Attachment apparatus 12 Attachment member 14 Leg part 16 Spring part (elastic part)
18 Fixing part 20, 30, 40 Mounting member 22, 32, 42 Leg part 24, 34, 44 Support part 25, 35, 45 Fixing member 26, 36, 46 Spring part 28 Operation part 38, 48 Nipping part 47 Ring shape Member (Means to prevent falling out)
49 Fixing pin 50 Substrate 52 Through hole (slit)
58 Screw (fixing means)
60 Housing P Ground pattern

Claims (8)

A substrate mounting device for fixing and grounding a substrate having a ground pattern and having a slit formed thereon,
Legs provided in the housing;
An elastic portion that is connected to the leg portion and contacts the ground pattern;
A fixed portion that is connected to the elastic portion, and is inserted into the slit and bent to hold the substrate between the elastic portion;
An apparatus for mounting a board, comprising:   The board mounting apparatus according to claim 1, wherein a surface of the fixing portion that contacts the board is an arc surface. A substrate mounting device for fixing and grounding a substrate having a ground pattern and having a slit formed thereon,
Legs provided in the housing;
A support portion connected to the leg portion, inserted through the slit, and in contact with the ground pattern;
A mounting member having
A fixing member that holds the substrate between the support portion by being attached to the support portion inserted through the slit,
An apparatus for mounting a board, comprising:   The board fixing device according to claim 3, wherein the fixing member has a circular arc surface as a surface to be brought into contact with the board. A substrate mounting device for fixing and grounding a substrate having a ground pattern to a housing,
Legs provided in the housing;
A support portion that is connected to the leg portion and contacts the ground pattern;
A mounting member having
A fixing member that holds the substrate and the support portion together;
An apparatus for mounting a board, comprising: A substrate mounting device for fixing and grounding a substrate having a ground pattern and having a first through hole formed thereon,
Legs provided in the housing;
A support portion that is provided in a continuous manner with the leg portion and has a second through hole that is in contact with the ground pattern and communicates with the first through hole;
A mounting member having
A fixing member in which a third through hole communicating with the first through hole and the second through hole is formed while holding the substrate and the support portion together.
A fixing pin that is inserted into the first through hole, the second through hole, and the third through hole that communicate with each other;
An apparatus for mounting a board, comprising:   The board mounting apparatus according to claim 6, wherein a drop prevention means is provided on the fixing pin.   The substrate mounting apparatus according to claim 1, wherein the leg portion is attached to the housing by a fixing unit.

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