JP2007165367A - Sheet-fed work conveyance system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet-fed work conveyance system which can improve waiting efficiency of a conveyance device that waits before a processing device for a previous step to convey a work to the processing device of the following step and enhance throughput (processing capacity) of entire system as a result. <P>SOLUTION: The conveyance system is provided with a plurality of shuttles 11a-11n which reciprocate among adjoining work processing devices 3a-3n to individually convey a work 7 to the work processing devices 3a-3n, wherein the work 7 is processed according to a sequence of processing steps, and a transfer device which is mounted to the shuttles 11a-11n and transfers the work between the shuttles 11a-11n and the work processing devices 3a-3n. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a workpiece transfer system for sequentially processing a workpiece such as a semiconductor wafer or a glass plate for a plasma display panel (PDP) by transferring the workpiece to a plurality of process processing apparatuses. The present invention relates to a single wafer conveyance system for conveying single wafers.

  Conventionally, a batch type system is known as an example of this type of workpiece transfer system. This system is a system that takes out a case or cassette containing, for example, about 5 to 25 workpieces from a workpiece stocker and transports the workpiece to each workpiece carrying-in section of a plurality of workpiece processing apparatuses by a carriage. Known transport vehicles include AGV (Automated Guided Vehicle), RGV (Rail Guided Vehicle), and OHT (Over Head Transfer System).

  In addition, as the work processing apparatus, a transfer robot that transfers the work transferred to the work carry-in section to the processing apparatus main body section and transfers the processed work processed by the processing apparatus main body to the work carry-out section. What each has is known.

  Then, the workpiece processed by the required workpiece processing device is accommodated in the case by the transfer robot in the workpiece unloading section of the workpiece processing device, and after the predetermined number of workpieces are fully loaded in the case, the case Is again transferred and loaded onto the waiting transport vehicle by the transfer robot. Thereafter, the transported vehicle is batch transported to the work loading / unloading section of the work processing apparatus in the next process. A series of these operations is repeated until the final process, and the workpiece is sequentially transferred to the workpiece processing apparatus in all the steps, thereby completing predetermined machining of the workpiece.

As such a conveyance system that conveys a workpiece sequentially and intermittently to a workpiece processing apparatus in all steps by a conveyance vehicle, for example, those described in Patent Documents 1 and 2 below are known.
JP 2000-98920 A JP-A-11-49345

  However, in such a conventional transport system, since a batch processing method for processing a plurality of workpieces at the same time is adopted, in order to adjust the difference in throughput (processing capability) between the workpiece processing devices, Many buffer stockers need to be installed. Further, when these workpieces are, for example, glass plates for PDP, it is difficult to ensure the uniformity of the processing due to the increase in size.

  Therefore, it is conceivable that the workpiece processing apparatus side is configured as a single wafer processing. However, in this case, when the workpiece conveyance is still a batch method, the workpiece processed by the single wafer processing for each process is placed in a case or cassette in a predetermined manner. Since a plurality of workpieces are stored and then unloaded to the unloading unit, the unloading of the workpieces to the unloading unit is delayed for the time that each of these multiple workpieces is stored in the case or cassette. There is a problem that the waiting time of the waiting transport vehicle becomes long.

  As a result, even if the processing time (throughput) per workpiece on the workpiece processing device side is the same, the time from when the workpiece is received to the workpiece warehousing side until it is released as a product becomes long, and a small amount of product In order to deliver the product in a short time, it is necessary to stock the in-process stock using a buffer stocker. For this reason, there is a problem that the required number of buffer stockers increases, the process inventory becomes excessive, and the cost is increased. In addition, when product inspection is performed by the work processing apparatus in each process, it is transported after processing for one case (cassette) is completed. Therefore, when a defective product occurs due to a failure of the processing apparatus, one case (cassette) ) There is also a problem that all of the products become defective and the yield of the product decreases.

  The present invention has been made in consideration of such circumstances, and its purpose is to improve the standby efficiency of a transfer device that waits in front of a processing device in the previous process in order to transfer the workpiece to the processing device in the next process. Another object of the present invention is to provide a workpiece single wafer transfer system capable of improving the throughput (processing capacity) of the entire system.

  The invention according to claim 1 includes a plurality of workpiece transfer devices that respectively reciprocate between adjacent workpiece processing devices in order to transfer a workpiece into a plurality of workpiece processing devices that respectively process the workpiece according to a series of processing steps; A workpiece single-wafer transfer system comprising a transfer device mounted on each of these workpiece transfer devices and transferring a workpiece between the workpiece transfer device and the workpiece processing device. It is.

  According to a second aspect of the present invention, the work processing apparatus includes: a work carry-in unit into which a work is carried in by the transfer device of the work transfer device; a processing apparatus main body unit that processes the work from the work carry-in unit; A workpiece unloading unit for unloading the workpiece processed by the processing apparatus main body, and the transfer device is configured to hold the workpiece and to hold the workpiece and to drive the workpiece holding device. The workpiece single wafer transfer system according to claim 1, further comprising an apparatus.

  The invention according to claim 3 is characterized in that the work holding device driving device is configured to be able to move the work holding device in at least one of a horizontal direction and a vertical direction. This is a single wafer transfer system.

  According to a fourth aspect of the present invention, the work holding device is a non-contact holding device that sprays a fluid onto the work and holds the work in a non-contact manner. It is a transport system.

  The invention according to claim 5 is the workpiece single wafer transfer system according to any one of claims 1 to 4, wherein the workpiece processing apparatus is arranged in the order of processing steps of the workpiece. .

  The invention according to claim 6 is provided with a warehousing work stocker for storing the work so that the workpiece can be taken out by the transfer device of the work transporting device. It is a workpiece single wafer conveyance system given in the paragraph.

  The invention according to claim 7 includes an unloading-side work stocker that stores the work so as to be able to carry in a single sheet by the transfer device of the work conveying device. It is a workpiece single wafer conveyance system given in the paragraph.

  According to an eighth aspect of the present invention, the moving path along which the workpiece transfer device moves includes a traveling platform that is formed such that a holding height when the workpiece transfer device holds the workpiece is a predetermined height from the floor. The workpiece single wafer transfer system according to any one of claims 1 to 7, wherein the workpiece single wafer transfer system is provided.

  The invention according to claim 9 is characterized in that the work transfer device is configured to reciprocate on a track disposed above the work processing device. It is a workpiece single wafer conveyance system given in the paragraph.

  According to the present invention, since the workpiece transfer device that transfers the processed workpiece to the workpiece processing device of the next step can be kept waiting in accordance with the throughput of the workpiece processing device of the previous step, batch processing is possible. In addition, it is possible to omit the time for accommodating each case in a plurality of cases as in batch conveyance. For this reason, the standby efficiency of this workpiece conveyance apparatus can be improved. For this reason, it is possible to shorten the waiting time of the work transfer device and thereby improve the throughput of the entire system.

  In addition, since the work transfer device is equipped with a transfer device for transferring (loading / unloading) the workpiece to / from the work processing device, it is not necessary to install the transfer device on each work processing device side. Therefore, the installation space of each work processing apparatus can be reduced. Since there are a large number (for example, 400) of these work processing apparatuses corresponding to the work processing steps, it is possible to increase the saving space accompanying the downsizing of the work processing apparatuses. For this reason, it is possible to reduce the construction cost of a clean room in which these work processing apparatuses are installed and the construction cost per unit area is very high.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, the same code | symbol is attached | subjected to the same or an equivalent part in these several accompanying drawings.

  FIG. 1 is a partially cutaway plan view of a workpiece single wafer transfer system 1 according to a first embodiment of the present invention. In the clean room 2, the workpiece single wafer transfer system 1 includes first, second,..., Nth work processing apparatuses 3 a, 3 b,..., 3 n, a warehousing stocker 4, an unloading stocker 5, and a movement path of the work conveying apparatus. , 6n are provided. The first, second, third,..., Nth carriages 6a, 6b, 6c,.

  The first,..., Nth work processing apparatuses 3a to 3n are apparatuses for processing the work 7 such as a rectangular glass plate for PDP, for example, according to a predetermined process order, and are sequentially arranged in a predetermined process order. Yes.

  These work processing apparatuses 3a to 3n are an inlet load lock 8 which is a work carry-in part, an outlet load lock 9 which is a work carry-out part, first, second,..., N-th processing apparatus main body parts 10a, 10b,. , 10n, and first and second shuttles 11a, 11b, 11c,..., 11n are each provided with a position sensor such as an optical sensor for detecting arrival at a predetermined position.

  The inlet load lock 8 and the outlet load lock 9 are disposed on the entrance side of the work 7 on the traveling platforms 6a to 6n, and can be opened and closed, and can be opened and closed, and the shutters 8a and 9a can be opened and closed. Inner shutters 8b and 9b that are disposed on the entrance / exit side of the workpiece 7 on the processing apparatus main body 10a to 10n side and that can open and close the vacuum on the processing apparatus main body 10a to 10n side, and these outer shutters 8a and 9a, Temporary workpiece placement sections 8c and 9c for temporarily placing the workpiece 7 between the inner shutters 8b and 9b are provided. The outer and inner shutters 8a, 9a, 8b, and 9b are opened and closed by a control device that receives a position detection signal from the position sensor.

  Each processing apparatus main body 10a to 10n is a device that performs a predetermined process on the work 7 according to the processing process, and carries the unprocessed work 7 from the work temporary storage part 8c of the load lock 8 for the inlet to the processing process. On the other hand, a transfer device (not shown) for transferring the processed workpiece 7 to the workpiece temporary placement portion 9c of the outlet load lock 9 is provided.

  The warehousing side stocker 4 is disposed at a predetermined height on the warehousing side of the first work processing apparatus 3a, and a plurality of works 7 are transferred from the outside into the warehousing side stocker 4, and a predetermined number of works 7 are transferred. Is provided with a warehousing side transfer device (not shown).

  The unloading side stocker 5 is arranged at a predetermined height on the unloading side of the n-th work processing apparatus 3n in the final process, and the work 7 stored in the unloading side stocker 5 is transferred to the outside of the next process or the like. A loading / unloading device is provided.

  The first to n-th traveling platforms 6a to 6n are formed in a required shape such as an L-shape or a U-shape, for example, and a workpiece is conveyed on a traveling surface r higher than the floor 2a of the clean room 2 by a predetermined height. The first to n-th shuttles 11a to 11n, which are examples of the apparatus, are placed so as to be able to reciprocate. That is, in the first to n-th travel platforms 6a to 6n, when the first to n-th shuttles 11a to 11n respectively hold the workpiece 7 and travel on the traveling surface r, the holding height of the workpiece 7 is the floor 2a or the like. The height of the workpiece 7 is set to a level at which contamination such as particle contamination or chemical contamination of the workpiece 7 can be prevented or reduced.

  Each of the traveling platforms 6a to 6n includes a plurality of casters for moving on the floor 2a and a lock device for locking the rotation of the casters. Each of the carriages 6a to 6n is provided with guide rails and guide grooves (not shown) for guiding the travel of the shuttles 11a to 11n, a guide magnetic tape, and a power supply rail for supplying power to the power receiving devices of the shuttles 11a to 11n. Yes. The power receiving device and the power supply rail may employ a contact type or a non-contact power supply method.

  The first traveling platform 6a has a traveling surface r that communicates the work unloading side of the warehousing side stocker 4 and the inlet load lock 8a that is the work loading side of the first work processing apparatus 3a adjacent to the warehousing side stocker 4. Forming.

  The second traveling platform 6b includes an outlet load lock 9a that is a work carry-out portion of the first work processing device 3a, and an inlet load lock 8 that is a work carry-in portion of the second work processing device 3b adjacent thereto. A traveling surface r to be communicated is formed.

  Hereinafter, similarly, the third to n-th traveling platforms 6c to 6n are respectively traveling surfaces that connect the outlet load lock 9 and the inlet load lock 8 of the third to n-th work processing apparatuses 3c to 3n adjacent to each other. r is sequentially formed.

  The shuttles 11a to 11n reciprocate on the traveling surfaces r of the first to n-th traveling platforms 6a to 6n while holding the workpiece 7 in a single sheet.

  That is, as shown in FIGS. 2 to 6, each of the shuttles 11 a to 11 n has the transfer device 13 mounted on the self-propelled shuttle body 12.

  The shuttle main body 12 is provided with four or three traveling wheels 12a, 12a,... At the lower end thereof, and a drive device 12b including a motor for driving the traveling wheels 12a, 12a,. Yes. The machine room 12 c is formed in the shuttle body 12.

  The shuttle body 12 is configured to reciprocate at a predetermined speed on the traveling surface r of each of the traveling platforms 6a to 6n by being guided by a guard rail (not shown) or an induction magnetic tape, and its control device is disposed in the machine room 12c. Has been.

  In the machine room 12c, a power receiving device that receives power from the power supply rails of the first to n-th traveling platforms 6a to 6n, a power supply device that receives power from the power receiving device and supplies power to a required power-supplied part, and the power supply device An air supply device including a compressor 12d that receives power from the air and supplies air of a predetermined pressure is disposed, and a heavy-weight compressor 12d is disposed at the center of the inner bottom surface of the machine room 12c to lower the center of gravity and to improve running stability. We are trying to improve. The drive device 12b is configured to be shared as a drive source for the traveling wheels 12a, 12a,.

  The transfer device 13 carries the workpieces 7 one by one from the warehousing stacker 4 or the outlet load locks 9 of the first to n-th processing devices 3a to 3n, that is, takes out the single wafer and holds and conveys it. The first to n-th workpiece processing apparatuses 3a to 3n are respectively transferred to the workpiece 7 temporary placement portion 8c of the inlet load lock 8.

  The transfer device 13 is arranged at the center of the top end of the shuttle main body 12 so as to be movable up and down and rotatable about an axis, and the upper and lower rotary shafts 14 in FIG. And a chuck driving device 15 disposed therein.

  The elevating rotary shaft 14 is configured to be adjustable in the height direction (vertical direction in FIG. 2) and rotatable about the axis by the drive device 12b. The work 7 is moved up and down and delivered.

  As shown in FIG. 3, the chuck driving device 15 has an upper end in FIG. 2 fixed to the center of the outer bottom surface of the bottom plate 16, and an example of a non-contact holding device is provided on the bottom plate 16. The Bernoulli chuck plate 17 is arranged so as to be able to reciprocate and slide in the horizontal direction. That is, the bottom plate 16 is integrally formed with a pair of U-shaped guide rails 16a and 16b slidably sandwiching both end portions in the width direction of the Bernoulli chuck plate 17 at both end portions in the width direction. 17 is configured to be reciprocally movable in the horizontal direction by the chuck driving device 15. 2 and 3, the chuck driving device 15 causes the Bernoulli chuck plate 17 on the bottom plate 16 to protrude outward in the horizontal direction, while returning to the original position on the bottom plate 16 as shown in FIG. Can be made.

  The Bernoulli chuck plate 17 has a plurality of air nozzles 17a, 17b,... Arranged in a matrix, for example, on the upper surface of FIG. Is connected to an air supply device including a compressor (not shown) in the machine chamber 12c so as to communicate with each other. Thereby, air of a predetermined pressure is ejected from these air nozzles 17a, 17b,. That is, the upper surfaces of the Bernoulli chuck plates 17 on the air nozzles 17a, 17b,... Are brought close to the surface of the work 7 and air of a predetermined pressure is blown onto the work 7 from the air nozzles 17a, 17b,. A positive pressure and a negative pressure are generated between the opposing surfaces, and the work 7 is held in a non-contact manner above the balance as shown in FIG. 5 by the balance between the positive pressure and the negative pressure. However, you may comprise so that a part of workpiece | work 7 may be contact-held by the stopper which is not shown in figure which prevents displacement, such as a horizontal movement of the workpiece | work 7. FIG.

  Then, each shuttle 11a to 11n detects the position of the warehousing stacker 4 and the positions of the inlet load lock 8 and the outlet load lock 9 of the first to nth work processing apparatuses 3a to 3n in the shuttle main body 12. When a position detection signal detected by the optical sensor is input, the optical sensor and a control device that controls the travel and stop of the shuttle main body 12 and the driving of the transfer device 13 according to a required job program are provided. . The control device is composed of, for example, a microprocessor and the like, and a job program for controlling driving of the shuttle main body 12 such as running and stopping and driving of the transfer device 13 is stored in a memory such as a ROM in advance. Is executed by the CPU.

  Next, the operation of the workpiece single wafer transfer system 1 configured as described above will be described.

  First, a plurality of workpieces 7 such as a glass plate for PDP are transferred from the outside and stored in the warehousing stacker 4 by a warehousing transfer device (not shown).

  Thereafter, when the operation of the first shuttle 11a on the traveling surface r of the first platform 6a is started, the first shuttle 11a is not shown in the drawing to a predetermined position at the work exit of the warehousing stacker 4. Travels along the guide rail while receiving power from the power supply rail. Thereby, the optical sensor (not shown) of the first shuttle 11a detects the predetermined position. Then, the detection signal is given to the control device.

  For this purpose, the control device stops the shuttle 12 by stopping the driving of the traveling wheels 12a, 12a of the shuttle 12. Next, the transfer device 13 and the air supply device are driven to drive the Bernoulli chuck plate 17 so as to protrude outward in the horizontal direction as shown in FIG. 4, and below the work 7 of the warehousing stacker 4. They are placed opposite each other with a slight gap.

  As a result, air of a predetermined pressure is blown from the plurality of air nozzles 17 b, 17 b of the Bernoulli chuck plate 17 to the opposing surface of the workpiece 7.

  For this purpose, as shown in FIG. 5, areas of positive and negative pressure of air are respectively formed on the opposing surface of one workpiece 7, and the workpiece 7 is Bernoulli chuck plate 17 by the balance between these positive and negative pressures. Is held in a non-contact manner with a required minute gap.

  Next, after the elevating rotary shaft 14 is lowered by a predetermined amount by the control device, the Bernoulli chuck plate 17 is moved back to the original position on the bottom plate 16 of the chuck driving device 15, and one workpiece 7 is moved to the Bernoulli chuck as shown in FIG. The plate 17 is held in a non-contact state. Thereafter, the first shuttle 11a travels on the traveling surface r of the first traveling platform 6a along the guard rail while receiving power from a power supply rail (not shown) while the workpiece 7 is being held. The workpiece 7 is conveyed to a predetermined position of the load lock 8 for inlets.

  Thus, when the position sensor of the first workpiece processing device 3a detects the predetermined position, the detection signal is given to the control device. Then, the inner shutter 8a on the atmosphere side of the first workpiece processing device 3a is opened by this control device. On the other hand, while the first shuttle 11 stops traveling, the transfer device 13 is driven again, and the Bernoulli chuck plate 17 protrudes outward in the horizontal direction and protrudes into the inlet load lock 8 as shown in FIG. The

  Then, the elevating rotary shaft 14 is lowered, the work 7 is moved onto the work temporary placement portion 8c in the inlet load lock 8, and the ejection of air from the air nozzles 17b of the Bernoulli chuck plate 17 is stopped, so that the work 7 The holding state is released. Thereby, the workpiece 7 is placed on the workpiece temporary placement portion 8c.

  After the workpiece 7 is thus transported to the first workpiece processing device 3a, the first shuttle 11a remains empty and is again guided by the guide rail while receiving power from the power supply rail by the power receiving device, and again to a predetermined position of the warehousing side stacker 4. Returning, similarly, the workpieces 7 are taken out from the warehousing stacker 4 one by one, and the single-wafer conveyance of the workpieces 7 to the first workpiece processing apparatus 3a is repeated.

  On the other hand, the placement of the workpiece 7 placed in the workpiece temporary placement portion 8c of the inlet load lock 8 is detected by the optical sensor of the first workpiece processing portion 3a. Then, the outer shutter 8a of the inlet load lock 8 is shut off, and the atmosphere is shut off. Thereafter, when the inner shutter 8b is opened, the workpiece 7 is transferred into the processing apparatus main body 10 by an installation transfer device (not shown) of the first workpiece processing apparatus 3a.

  Thereby, the processing apparatus main body 10 performs a predetermined process on the workpiece 7. Thereafter, the inner shutter 9b of the outlet load lock 9 is opened, and the processed workpiece 7 is transferred onto the workpiece temporary placement portion 9c therein by an installation transfer device (not shown). Thereafter, the inner shutter 9b is shut off, and the atmospheric state outer shutter 9a is opened after the vacuum state of the first processing apparatus main body 10a is maintained. For this purpose, the transfer device 13 of the empty second shuttle 11b waiting in front of the inner shutter 9b holds the workpiece 7 in a non-contact manner and transfers it to the second shuttle 11b. Thereafter, the outer shutter 9a is shut off, and the vacuum state of the first processing apparatus main body 10a is maintained.

  Next, the second shuttle 11b travels on the traveling surface r of the second traveling platform 6b along the guide rail while receiving power from the power supply rail by a power receiving device (not shown). It transports to the front of the inlet load lock 8 and stops at a predetermined position.

  When the arrival of the second shuttle 11b is detected by the optical sensor on the second workpiece processing device 3b side, the outer shutter 8a of the inlet load lock 8 is opened, so that the transfer device 13 of the second shuttle 11b is moved to the workpiece. 7 is temporarily placed on the temporary placement portion 8c.

  Thereafter, the second shuttle 11b remains empty and returns to the front of the outlet load lock 9 of the first work processing device 3a again along the guide rail. The workpiece 7 in the outlet load lock 9 is transferred by the transfer device 13. It is transferred again and returned to the load lock 8 for inlet of the second work processing apparatus 3b again in a non-contact state and waits. By repeating this, the workpiece 7 processed by the first workpiece processing device 3a is repeatedly conveyed to the second workpiece processing device 3b for each sheet and processed.

  The second processing device main body 10b further performs a required second process on the processed workpiece 7 processed by the first processing device main body 10a. The workpiece 7 that has been subjected to the second process is further conveyed by the third shuttle 11c to the adjacent third workpiece processing apparatus 3c to be subjected to the third process. The n-th work processing apparatus 3n performs n-th processing. The workpiece 7 after the n-th processing is conveyed to the delivery stacker 5 by the n-th shuttle 11n, transferred, and stocked.

  Then, the work 7 transferred into the unloading side stacker 5 is further transferred to another process by an unillustrated unloading side transfer device or shipped to the outside.

  Therefore, according to the workpiece single wafer transfer system 1, between the warehousing side stacker 4 and the first workpiece processing device 3 a adjacent to each other and between the first to n-th workpiece processing devices 3 a to 3 n, Since the 1st to nth shuttles 11a to 11n reciprocate, the workpieces 7 are conveyed by a single sheet, and these workpieces 7 are processed by the first to nth workpiece processing devices 3a to 3n. The single-wafer conveyance of each of the shuttles 11a to 11n can be controlled at a timing suitable for the throughput (processing capability) of the devices 3a to 3n.

  For this reason, the buffer stocker installed for adjusting the difference in throughput of the work processing apparatuses 3a to 3n can be reduced. For this reason, work-in-progress (process inventory) temporarily stored in the buffer stocker can be reduced, and the total cost can be reduced. This cost reduction effect becomes more prominent as the number of processing steps of the workpiece 7 is larger.

  Further, since each shuttle 11a to 11n holds the workpiece 7 in a non-contact manner, the workpiece 7 is damaged by scratching, cracking, cracking, particle contamination, chemical contamination, electrostatic charging damage, vibration, impact, etc. due to contact holding. Can be greatly reduced. For this reason, the yield of work processing can be improved.

  Furthermore, since the transfer device 13 is mounted on each of the shuttles 11a to 11n itself, the inlet load lock 8 and the outlet load lock of each of the work processing devices 3a to 3n as in the conventional workpiece single wafer transfer system. There is no need to install an installation transfer device in each of the nine. For example, in the semiconductor manufacturing process, since there are at least about 400 processes, for example, at least about 400 transfer devices are required. According to the present embodiment, these 400 transfer devices are installed. Can be deleted.

  For this reason, since the installation space of the installation transfer device can be omitted, it is possible to reduce the size of the clean room having a high construction cost, and to reduce the construction cost.

  In addition, the height of the running surface r of each of the carriages 6a to 6n on which the shuttles 11a to 11n run is set to a height that can prevent or reduce contamination of the workpiece 7 such as particle contamination and chemical contamination, and electrostatic charging. Therefore, contamination of the workpiece 7 such as particle contamination and chemical contamination and electrostatic charging damage can be reduced.

  Further, the floor 2a on which the worker walks and the traveling surfaces r of the traveling platforms 6a to 6n on which the shuttles 11a to 11n travel are separated in the height direction. For this reason, since the worker does not travel on the traveling platforms 6a to 6n, it is possible to prevent a personal accident such as the shuttles 11a to 11n colliding with the worker, thereby improving the safety of the work. .

  In addition, since each of the traveling platforms 6a to 6n is movable, the order of processing steps by the first to nth work processing apparatuses 3a to 3n can be appropriately modified by appropriately changing the positions of the traveling platforms 6a to 6n. Can do.

  FIG. 7 shows a first modification 13A of the transfer device 13 mounted on the shuttles 11a to 11n. This transfer device 13A is characterized in that the air nozzles 17b, 17b,... Of the Bernoulli chuck plate 17 shown in FIG.

  When the transfer device 13A is provided, the shuttles 11a to 11n may run with the Bernoulli chuck plate 17 protruding outward in the horizontal direction by the chuck driving device 15 as shown in FIG. Alternatively, the Bernoulli chuck plate 17 may be traveled in a state of being housed in the drive device 15. In any case, according to the transfer device 13A, the work 7 can be held downward and can be put in and out.

  FIG. 8 is a front view of a transfer device 13B according to a second modification. This transfer device 13B has the Bernoulli chuck plate 17 raised in the direction of gravity (vertical direction in FIG. 8), and the chuck driving device 15. Thus, the workpiece 7 can be held and conveyed in a single sheet state in a state where it is raised in the direction of gravity.

  That is, when the work 7 is an isometric rectangular glass plate for PDP, when the work 7 is held in a plane as shown in FIG. 6, a distortion occurs in which the substantially central portion of the glass plate hangs down due to gravity. However, when the work 7 is held upright in the longitudinal direction as shown in FIG. 8, the elastic coefficient of the work 7 increases, so that the distortion can be reduced.

  FIG. 9 is a side view of an essential part of a transfer device 13C according to a third modification. This transfer device 13C is characterized in that the articulated arm 18 is attached to the shuttle main body 12 in place of the chuck drive device 15 and the elevating rotary shaft 14.

  That is, the multi-joint arm 18 is formed by connecting a plurality of hollow arm elements 18a, 18a so as to be rotatable in multiple directions by joints 18b, 18b of universal joints such as a universal joint and a ball joint. The central portion of the back surface of the Bernoulli chuck plate 17 is fixed, and is driven by an arm driving device (not shown) disposed in the machine chamber 12c of the shuttle main body 12.

  The articulated arm 18 has an air hose (not shown) disposed in a hollow portion thereof, and one end of the air hose is connected to an air supply device disposed in the shuttle body 12 while the other end of the air hose is connected to Bernoulli. It is connected to the chuck plate 17 and air of a predetermined pressure is ejected from the air nozzles 17b, 17b,.

  As shown in FIG. 9, the articulated arm 18 has a Bernoulli chuck plate on the outer surface of the outermost workpiece 7 among the plurality of workpieces 7 leaning on the workpiece mounting table 19 which is an example of the warehousing stacker 4. 17 are sequentially brought close to each other, held one by one in a non-contact manner, and transferred to the shuttles 11a to 11n. Or, conversely, the held work 7 is transferred and placed on the work placing table 19 from the shuttles 11a to 11n.

  As shown in FIG. 9, the work mounting table 19 is erected at a substantially central portion on the bottom plate 19a in a state where the support table 19b is erected almost vertically, and both left and right sides of the support table 19b in FIG. A plurality of works 7 are placed on the surface by leaning.

  The work 7 is made of, for example, a rectangular glass plate for PDP, and is placed on the mounting table 19 with its longitudinal direction set to the vertical direction while the longitudinal direction is set to the horizontal direction. You may form the protective film for making it easy to peel, without plates adhering.

  According to this articulated arm 18, even if the work 7 is a large glass plate and is placed on the placing table 19 shown in FIG. 9, it can be easily transferred to the shuttles 11a to 11n reversibly. Can do.

  FIG. 10 is a perspective view of a main part of a workpiece single wafer transfer system 1A according to the second embodiment, and FIG. 11 is a side view thereof. The workpiece single wafer transfer system 1A is mainly characterized in that the shuttles 11a to 11n are replaced with, for example, a linear motor car type moving body 20.

  That is, the workpiece single wafer transfer system 1A includes a workpiece transfer path between the warehousing side stacker 4 and the first workpiece processing device 3a, a plurality of adjacent workpiece processing devices 3a to 3n, and a plurality of workpiece transfer paths. A traveling platform 21 adapted to the required shape is disposed on the work processing path. The traveling table 21 has an inclined surface inclined at a required angle θ such as 75 ° or 88 ° on the traveling surface r. A linear motor car reaction rail (not shown) is disposed on the traveling surface r, and its stator. The moving body 20 as a linear motor car is reciprocated on the reaction rail to convey the workpiece 7 one by one. Other than this, the configuration is the same as that of the shuttles 11a to 11n. However, the moving body 20 does not include the transfer device.

  On the outer surface of the moving body 20, the Bernoulli chuck plate 17 is fixed, and an air supply device (not shown) including a compressor for supplying air of a predetermined pressure to the Bernoulli chuck plate 17 is built in the moving body 20.

  Accordingly, the moving body 20 can hold the workpiece 7 in a non-contact manner by the Bernoulli chuck plate 17 in a state where the workpiece 7 is substantially erected in the short direction, and can convey the workpiece 7 along the traveling table 21 in the held state. . In addition, when the workpiece 7 is a large and thin glass plate, the glass plate is erected and transported in a horizontally long state, so that it is possible to reduce distortion or the like that the center of the plane hangs down when transported in a flat state. it can. The driving method of the moving body 20 may not be a linear motor car method, and may be a ball screw method, for example.

  In other words, a ball screw may be disposed on the traveling base 21, and a moving body 20 may be moved along the traveling base 21 by fixing a nut screwed to the ball screw to the moving body 20.

  In each of the above embodiments, a case has been described in which an air supply device that supplies air to the Bernoulli chuck plate 17 is provided for each shuttle 11a to 11n and each moving body 20, but the present invention is limited to this. Instead, for example, an air supply device is not provided for each of the shuttles 11a to 11n and each moving body 20, but is provided on the floor 2a of the clean room 2, and each shuttle 11a to 11n is moved to the air supply device via an air hose. Each may be connected to the Bernoulli chuck plate 17 of the body 20.

  Moreover, although the said embodiment demonstrated the case where a control apparatus was provided for every shuttle 11a-11n and every moving body 20, and the control apparatus was controlled for every shuttle 11a-11n or every moving body 20, center of a host computer etc. You may comprise so that driving | operation thru | or driving | operation for every shuttle 11a-11n and every moving body 20 may be controlled intensively by the computer for control.

In addition to the glass plate (including quartz plate) for PDP (plasma display panel), etc., the workpiece 7 is a precision component such as automobile parts, medical treatment as shown in the industry-specific workpiece in Table 1 below. Including containers that are restricted from direct contact by human hands.

  In the present invention, the shuttles 11a to 11n may be configured as the OHT transport device. That is, a track is disposed above the travel path r of each of the platform 6a to 6n, and the shuttles 11a to 11n are configured as a straddle type straddling on the track or a suspended type suspended from the track, You may comprise so that it may reciprocate along this track | orbit, and the workpiece | work 7 may each be conveyed to each workpiece | work processing apparatus 3a-3n from the upper direction. For example, even if a monorail is installed as a track on the ceiling or the like in the clean room 2 and each shuttle 11a to 11n is reciprocated on the monorail and replaced with a straddle-type or suspension-type gondola that conveys the workpiece 7 one by one. Good. In this case, the workpiece 7 is held in a non-contact manner downward by the Bernoulli chuck plate 17. However, the Bernoulli chuck plate 17 does not drop the workpiece 7 even when it is faced down, can hold it in a non-contact manner, and can hold the workpiece 7 in a non-contact manner even when it is vertical. The track may include a plurality of tracks, and may be configured to hold the workpiece 7 upward. According to this OHT shuttle, it is possible to prevent a personal accident such as a collision with a worker working on the floor 2a of the clean room 2, and to improve the conveyance effect.

The partially notched top view of the workpiece | work single wafer conveyance system which concerns on 1st Embodiment of this invention. The side view of the shuttle shown in FIG. The top view of the transfer apparatus of the shuttle shown in FIG. The side view of the shuttle which shows the state which the Bernoulli chuck plate of the transfer apparatus shown in FIG. The side view of the shuttle which shows the state which hold | maintained the workpiece | work non-contact with the Bernoulli chuck plate of the transfer apparatus shown in FIG. The side view of the shuttle which shows the state which mounted the workpiece | work. The side view of the shuttle carrying the transfer apparatus which concerns on a 1st modification. The side view of the shuttle carrying the transfer apparatus which concerns on a 2nd modification. The principal part side view of the transfer apparatus which concerns on a 3rd modification. The principal part perspective view of the workpiece | work single wafer conveyance system which concerns on 2nd Embodiment. The side view of the workpiece | work single wafer conveyance system shown in FIG.

Explanation of symbols

1 single wafer transfer system 2 clean room 3a-3n 1st to nth work processing device 4 warehousing side stocker 5 unloading side stocker 6a-3n first to nth platform 7 work 8 inlet load lock 9 outlet load locks 10a-10n 1 to n-th processing device main body portions 11a to 11n 1st to n-th shuttle 12 shuttle main body 13 transfer device 14 lifting rotary shaft 15 chuck drive device 17 Bernoulli chuck plate air nozzle 18 articulated arm 19 mounting table

Claims (9)

A plurality of workpiece transfer devices that respectively reciprocate between adjacent workpiece processing devices to transfer workpieces to a plurality of workpiece processing devices that respectively process workpieces according to a series of processing steps;
Each of these workpiece transfer devices, a transfer device for transferring a workpiece between these workpiece transfer device and the workpiece processing device, respectively,
A workpiece single wafer transfer system comprising: The workpiece processing device is processed by the workpiece loading unit into which the workpiece is loaded by the transfer device of the workpiece conveyance device, the processing device main unit that processes the workpiece from the workpiece loading unit, and the processing device main unit. A work unloading part for unloading the work,
The workpiece transfer system according to claim 1, wherein the transfer device includes a workpiece holding device that holds the workpiece and a workpiece holding device driving device that drives the workpiece holding device. . 3. The workpiece single wafer transfer system according to claim 1, wherein the workpiece holding device driving device is configured to be able to move the workpiece holding device in at least one of a horizontal direction and a vertical direction. 4. The workpiece single wafer transfer system according to claim 2, wherein the workpiece holding device is a non-contact holding device that sprays fluid onto the workpiece and holds the workpiece in a non-contact manner. The workpiece single wafer transfer system according to any one of claims 1 to 4, wherein the workpiece processing device is arranged in the order of processing steps of the workpiece. A warehousing work stocker that stores a workpiece so that it can be taken out by the transfer device of the workpiece conveying device;
The workpiece single wafer transfer system according to any one of claims 1 to 5, wherein: Unloading-side work stocker that stores workpieces so that they can be carried into a single sheet by the transfer device of the work transfer device,
The workpiece single wafer transfer system according to any one of claims 1 to 6, wherein the workpiece single wafer transfer system is provided. The moving path along which the workpiece transfer device moves is a traveling platform that is formed so that the holding height when the workpiece transfer device holds a workpiece is a predetermined height from the floor.
The workpiece single wafer transfer system according to claim 1, wherein the workpiece single wafer transfer system is provided. 8. The workpiece single wafer conveyance according to claim 1, wherein the workpiece conveyance device is configured to be capable of reciprocating on a track disposed above the workpiece processing device. system.

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