JP2007155500A - Capacitance type pressure sensor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an excellent capacitance type pressure sensor device that can be used at high temperatures, be miniaturized, be easily assembled, and reduce the total cost. <P>SOLUTION: This pressure sensor device comprises a capacitance type sensor 2 for sensing the pressure of gas, a heater H for heating the sensor 2, a circuit section 3 for generating an output signal showing the pressure of gas in an external chamber based on the value of the sensor 2, a case 4 having a sensor storage section 4a for storing the sensor 2 and heater H, a circuit storage section 4b for storing the circuit section 3, and a heat transfer preventing section 4c that partitions each storage section and prevents heat generated by the heater H from transferring to the circuit storage section 4b, and a connector 5 has at least one of a function as a structure for electrically connecting the sensor 2 to the circuit section 3 and stably supporting the sensor 2 and the circuit section 3 and a function as a heat transfer preventing body for preventing heat transfer between storage sections to at least the same extent as the heat transfer preventing section 4c. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a capacitance-type pressure sensor device that measures a vacuum degree from a change in capacitance generated between a diaphragm that deforms according to a degree of vacuum (gas pressure) and a fixed electrode, and in particular, a sensor portion. The present invention relates to a high-temperature capacitive pressure sensor device that is temperature-controlled.

  Conventionally, in a manufacturing apparatus such as a plasma etching apparatus or a sputtering apparatus for manufacturing a semiconductor, a capacitance type pressure sensor device is used to measure a vacuum degree of a vacuum chamber, but depending on the type of gas, a diaphragm surface is used. In order to prevent the sensor part from malfunctioning due to a change in the amount of deflection caused by the adhesion of the sensor, a sensor part configured to have a high temperature is provided.

Specifically, this type of capacitive pressure sensor device includes, for example, a lower case and an upper case that are separated into upper and lower parts and connected by a heat insulating member. The lower case has a thermal shell, a sensor which is arranged in the thermal shell and senses the pressure of the gas present in the connection port connected to the vacuum chamber, and the pressure sensor is operated in a predetermined manner. The upper case is provided with a circuit unit that senses the value of the capacitance between the output terminals of the sensor and generates an output signal representing the gas pressure at the connection port from the capacitance. In addition, a thin plate-like radiation fin having high thermal conductivity is provided between the upper and lower cases so that heat generated by the heater is prevented from being transferred to the circuit unit. (For example, refer to Patent Document 1).
Special table 2000-515967 (FIG. 4)

  However, in the conventional configuration, in order to make it difficult for heat to be transmitted between the sensor and the circuit unit, the upper case and the lower case are separated and a space is provided between them. In addition, high costs are a problem.

  Accordingly, the main object of the present invention is to provide an excellent capacitive pressure sensor device that can be used for high temperatures but can be reduced in size and ease of assembly and can reduce the total cost. It is.

  That is, the capacitance type pressure sensor device according to the present invention is a capacitance type sensor that senses the pressure of gas in an external chamber, a heater that heats the sensor to a predetermined operating temperature, and the sensor. A circuit unit that generates an output signal representing the gas pressure in the external chamber from the capacitance value, a sensor housing unit that houses the sensor and the heater, a circuit housing unit that houses the circuit unit, and each of these housings A case having a heat transfer preventing portion that partitions the portion and prevents heat generated by the heater from being transferred to the circuit housing portion; and electrically connecting the sensor and the circuit portion; and Among the functions as a structure that stably supports the circuit portion and the heat transfer prevention body that prevents heat transfer between the accommodating portions at least as much as the heat transfer prevention portion. Even Ku characterized by comprising comprises a connector having one of the functions.

  According to such a configuration, the heat transfer prevention unit can prevent heat transfer, convection, and heat radiation from the sensor housing unit to the circuit housing unit, thereby preventing malfunction of the circuit unit. Contributes to longer life. In addition, since the sensor housing part and the circuit housing part are separated by the heat transfer prevention part and are provided in a common case without being separated, the apparatus can be made compact and assembled. Ease of use can also be improved, and furthermore, the total cost can be reduced.

  That is, it is possible to provide an excellent capacitive pressure sensor device that can be used for high temperatures but can be reduced in size and ease of assembly and can reduce the total cost.

  The connector comprises an outer conductor that is substantially cylindrical and used as a shielding material, and an inner conductor that is disposed in the inner space of the outer conductor and used as a signal line. Both of these conductors are connected to the structure. The distance between the outer conductor and the inner conductor can be constant. Therefore, since the electrostatic capacitance in the meantime does not change, it contributes to suitably preventing malfunction of the circuit unit.

  If the circuit portion side of the outer conductor or the circuit portion side of the inner conductor is formed in a gradually tapered shape, heat transfer from the sensor to the circuit portion can be effectively prevented by the tip shape. it can.

  If a heat dissipation promotion hole is provided on the peripheral wall of the outer conductor to promote the heat radiated from the inner conductor to the outer space of the outer conductor, heat is transferred from the sensor to the circuit section via the inner conductor. Since the heat to be radiated is radiated from the heat radiation promotion hole, it is possible to effectively prevent the heat on the sensor side from being transferred to the circuit portion side.

  If a stainless steel material is used for the main part of the connector, heat transfer from the sensor to the circuit part can be effectively prevented because, for example, the heat conductivity is lower than that of copper.

  If the connector is provided with heat radiating fins, a greater heat radiating effect can be obtained, so that the overall length of the connector can be shortened, contributing to the compactness of the apparatus.

  As a desirable mode of the connector of the present invention, it is preferable that the connector is configured to exhibit the function as the structure of the case.

  If the sensor housing portion is formed in an inner case provided at a position offset inward from the outer case, which is a peripheral wall of the case, the heater is formed by a double structure of the outer case and the inner case. It is possible to effectively prevent the heat generated in the heat transfer to the outside.

  In order to reduce the radiant heat radiated to the outside of the inner case, it is desirable that the inner case be formed of a glossy metal.

  A sensor side convection promoting hole is provided in the peripheral wall of the outer case to promote convection between the air in the inner space formed between the outer case and the inner case and the air in the outer space of the outer case. For example, the surface of the inner case can be cooled using air flowing in and out of the sensor side convection promoting hole.

  If the circuit side convection promoting hole that promotes convection between the air in the internal space of the circuit housing portion and the air in the external space of the circuit housing portion is provided on the peripheral wall forming the circuit housing portion, The surface of the connector exposed in the circuit housing portion and the surface of the circuit portion can be cooled using air flowing in and out from the circuit side convection promoting hole.

  If the circuit unit includes a plurality of substrates arranged in a plurality of stages through an air layer in a direction contacting and separating from the sensor, for example, among the plurality of substrates, the sensor unit is far from the sensor housing unit. Placing a component with relatively low heat resistance on the substrate at the position contributes to extending the life of the component.

  As described above, the capacitance type pressure sensor device according to the present invention prevents heat transfer, convection, and heat radiation from the sensor housing portion to the circuit housing portion by the heat transfer preventing portion, thereby preventing malfunction of the circuit portion. Can contribute to extending the life of electronic components. In addition, since the sensor housing part and the circuit housing part are separated by the heat transfer prevention part and are provided in a common case without being separated, the apparatus can be made compact and assembled. Ease of use can also be improved, and furthermore, the total cost can be reduced.

  That is, it is possible to provide an excellent capacitive pressure sensor device that can be used for high temperatures but can be reduced in size and ease of assembly and can reduce the total cost.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  The capacitive pressure sensor device A of the present embodiment is a vacuum chamber (corresponding to an “external chamber” of the present invention) (not shown) in a manufacturing apparatus such as a plasma etching apparatus or a sputtering apparatus for manufacturing a semiconductor. As shown in FIG. 1, a connection port 1 connected to the vacuum chamber and a capacitance for sensing the pressure of the gas in the vacuum chamber using the connection port 1 are used. A sensor 2 of the formula, a heater H that heats the sensor 2 to a predetermined operating temperature, a circuit unit 3 that generates an output signal representing the pressure of the gas in the vacuum chamber from the capacitance value sensed by the sensor 2, A sensor accommodating portion 4a that accommodates the sensor 2 and the heater H, a circuit accommodating portion 4b that accommodates the circuit portion 3, a partition between the accommodating portions and the heater H The sensor 4 and the circuit unit 3 are electrically connected to the case 4 including the heat transfer prevention unit 4c that prevents the generated heat from being transferred to the circuit housing unit 4b, and the sensor 2 A connector having both a function as a structure that stably supports the circuit portion 3 and a function as a heat transfer prevention body that prevents heat transfer between the accommodating portions at least as much as the heat transfer prevention portion 4c. 5. Hereinafter, each part will be specifically described. For convenience of explanation, the upper and lower sides of the capacitive pressure sensor device A are described with the side including the connection port 1 as the lower side and the side including the connector 4p described later as the upper side. Proceed.

  The connection port 1 has a substantially cylindrical shape provided with a connection portion (not shown) that can be attached to and detached from the vacuum chamber, and is made of stainless steel in this embodiment, but is not limited thereto. is not.

  As shown in FIG. 2, the sensor 2 includes a reference chamber 2 b that is partitioned by a thin metal diaphragm 2 a to which tension is applied and is maintained at a high vacuum, and a vacuum measurement chamber that is connected to the connection port 1. 2c, and the capacitance variation of d between the diaphragm 2a and the fixed electrode 2d provided in the reference chamber 2b, which is generated when the diaphragm 2a is displaced by the pressure on the vacuum measuring chamber 2c side, The pressure signal (electric signal) indicating the value is converted and output.

  The heater H heats the sensor 2 so as to be around 200 ° C. which is a predetermined operating temperature. The operating temperature is configured to be adjustable by a temperature control unit (not shown).

  The circuit unit 3 includes three substrates 31 a to 31 c (hereinafter collectively referred to as a substrate 31), and these substrates 31 are spaced apart from each other by a predetermined distance in a direction in which they are in contact with and separated from the sensor 2, and a plurality of air layers are sandwiched therebetween. Arranged to be stepped. In the present embodiment, among the plurality of substrates 31, components having relatively low heat resistance are arranged on the substrate 31a located far from the sensor housing portion 4a. It can be changed.

  The case 4 includes an outer case 41, an inner case 42 provided at a position offset inward from the outer case 41, and a heat transfer prevention portion 4c arranged at a position for partitioning the outer case 41 and the inner case 42. And a pair of support members 43 for supporting the circuit unit 3 attached to the circuit unit 3 side of the heat transfer prevention unit 4c.

  The outer case 41 includes an outer case peripheral wall 411 having a substantially arcuate part 411a and a straight part 411b in cross-sectional view in two locations, each having a substantially cylindrical shape as a whole, and upper and lower ends of the outer case peripheral wall 411. An outer case top wall 412 and an outer case bottom wall 413 are provided to close the respective parts, and these parts are integrally formed of stainless steel.

  The lower end side of the outer case peripheral wall 411 and the outer case bottom wall 413 include air in the internal space formed between the outer case 41 and the inner case 42 and air in the outer space of the outer case 41. A plurality of sensor-side convection promoting holes 41x that promote convection are provided. In addition, on the upper end side of the outer case peripheral wall 411 (corresponding to the “periphery wall forming the circuit housing portion 4b” of the present invention), there is air in the internal space of the circuit housing portion 4b and the external space of the circuit housing portion 4b. A circuit-side convection promoting hole 41y that promotes convection with air is provided. In the present embodiment, the shape of each of the promotion holes 41x and 41y is a long hole, but is not limited to a round hole, for example. Further, the outer case top wall 412 is provided with a connector 4p connected to the circuit unit 3 and an adjustment operation unit 4q of the circuit unit 3, and the connection port 1 is inserted through a substantially central portion of the outer case bottom wall 413. An outer port insertion hole 41z is provided.

  The inner case 42 includes an inner case peripheral wall 421 having a substantially cylindrical shape, and an inner case top wall 422 and an inner case bottom wall 423 that respectively close upper and lower ends of the inner case peripheral wall 421. It is integrally formed of a certain stainless steel material. The inner case top wall 422 is provided with a connector insertion hole 42x through which the connector 5 is inserted, and an inner port insertion hole 42y through which the connection port 1 is inserted is provided at a substantially central portion of the inner case bottom wall 423. Yes. In the present embodiment, a heat insulating material 4D such as a silicon sponge is disposed in the internal space of the inner case 42.

  The heat transfer preventing portion 4c is a thin plate, and is made of stainless steel in the present embodiment. A through hole 4c1 that penetrates in the thickness direction and allows the connector 5 to be inserted is provided in the central portion.

  The support member 43 has a substantially U shape in a sectional view, and is made of metal in this embodiment.

  As shown in FIGS. 3 and 4, the connector 5 is attached to the circuit unit 3 whose upper end side is indirectly supported by the case 4, while the lower end side is attached to the sensor 2 indirectly supported by the case 4. The connector 5 is configured so as to exhibit the function as the structure of the case 4 by being attached, and is used as a signal line between the sensor 2 and the circuit unit 3 and is arranged on a substantially straight line. And the sensor side central contact body 512 and the sensor side central contact body 512, and the shields of both the contact bodies 511 and 512 (hereinafter collectively referred to as "contact body 51"). The circuit part side shell body 521 (corresponding to the “outer conductor” of the present invention) and the sensor side shell body 522, the contact body 51, and both shell bodies 521 and 522 ( The three insulators 531 to 533 (hereinafter collectively referred to as “insulator 53”) disposed between the “shell body 52” and the sensor-side shell body 522 on the sensor 2 side. And a spring ring 54 for connecting the sensor 2. Each part will be described more specifically.

  The circuit part side center contact body 511 is formed of a stainless steel material and has a substantially solid shaft shape. The circuit part 3 side is gradually tapered to prevent heat transfer, and the sensor 2 side is centered on the sensor side. A tapered shape is formed for connection to the contact body 512.

  The sensor-side center contact body 512 has a substantially solid shaft shape made of beryl copper, and has a first fitting that fits and holds the sensor-side end 511b of the circuit-part-side center contact body 511 on the circuit part 3 side. A portion 512a is provided.

  The circuit part side shell body 521 is formed in a substantially cylindrical shape made of a stainless material, and the circuit part 3 side is gradually tapered to prevent heat transfer. Further, a heat radiation promotion hole 521x is provided on the peripheral wall of the circuit part side shell body 521 to promote heat radiated from the circuit part side center contact body 511 to the outside space of the circuit part side shell body 521. . In the present embodiment, the shape of the heat radiation promotion hole 521x is a long hole, but the shape is not limited to this, for example, a round hole.

  The sensor-side shell body 522 has a substantially cylindrical shape made of phosphor bronze, and includes a second fitting portion 522a that fits and holds the sensor-side end portion 521b of the circuit-side shell body 521 on the circuit portion 3 side. ing.

  The insulators 531 to 533 are each made of tetrafluoroethylene resin (PTFE).

  The spring ring 54 has a substantially cylindrical shape made of beryl copper.

  Next, the operation of the capacitive pressure sensor device A having the above configuration will be described.

  First, the sensor 2 is heated by the heater H so as to be in the vicinity of the operating temperature of 200 ° C.

  Then, since the sensor 2 heated by the heater H is connected to the connector 5, the heat of the sensor 2 is transferred to the connector 5 (hereinafter referred to as “heat transfer path in the direction of the connector 5”). Further, the heat of the heater H is partially insulated by the heat insulating material 4D disposed in the vicinity thereof, but the remaining heat is transferred to the inner case 42 (hereinafter, “heat transfer path toward the inner case 42”). Called).

  The heat transferred through the heat transfer path in the direction of the connector 5 is further transferred to the circuit unit 3 via the connector 5. However, the connector 5 uses stainless steel for the circuit part side central contact body 511 and the circuit part side shell body 521 which are the main parts of the connector 5, and each circuit part 3 side is gradually tapered. Therefore, a good heat insulating effect can be obtained here. Further, even when the circuit part side center contact body 511 radiates heat, the heat is radiated to the circuit housing part 4 b from the heat radiation promotion hole 521 x provided in the circuit part side shell body 521. Further, the inside of the circuit accommodating portion 4b is cooled by the air entering and exiting from the circuit side convection promoting hole 41y. Therefore, the heat transmitted through the heat transfer path toward the connector 5 is well insulated in the middle of the path.

  On the other hand, heat transmitted to the inner case 42 through the heat transfer path toward the inner case 42 is reflected by the glossy inner surface of the inner case 42 and is prevented from being radiated to the outside. Further, the warmed inner case 42 is cooled by air entering and exiting from the sensor side convection promoting hole 41x. Moreover, the heat which is going to be transmitted from the upper surface side of the inner case 42 to the circuit part 3 side is insulated by the heat transfer prevention part 4c.

  Thus, even if the sensor 2 is heated by the heater H so as to be close to the operating temperature of 200 ° C., the heat transferred through each heat transfer path is well radiated or insulated in the middle of the path, and the circuit unit The temperature in the vicinity of 3 can be 70 degrees or less, and the surface temperature of the case 4 can be 50 degrees or less.

  Therefore, according to such a capacitance type pressure sensor device A, the heat transfer prevention part 4c prevents heat transfer, convection, and heat radiation from the sensor housing part 4a to the circuit housing part 4b, and the circuit part. 3 can be prevented, and contributes to the extension of the life of the electronic component. Further, since the sensor housing portion 4a and the circuit housing portion 4b are partitioned by the heat transfer prevention portion 4c and the housing portions 4a and 4b are provided in the common case 4 without being separated from each other, the device can be made compact. In addition to improving the ease of assembly, the total cost can be reduced.

  That is, it is possible to provide an excellent capacitive pressure sensor device A that can be used for high temperatures but can be reduced in size and ease of assembly and can reduce the total cost.

  Further, the connector 5 is formed in a substantially cylindrical shape and used as a shield member, and a circuit portion side shell body 521, and a circuit portion side center contact body 511 used in the internal space of the circuit portion side shell body 521 and used as a signal line; Since both of these conductors have a function as the structure, the distance between the circuit part side shell body 521 and the circuit part side center contact body 511 is constant. be able to. Therefore, since the electrostatic capacity of the air in between does not change, it contributes to preferably preventing malfunction of the circuit unit 3.

  Further, since the circuit part 3 side of the circuit part side shell body 521 and the circuit part 3 side of the circuit part side central contact body 511 are gradually formed in a tapered shape, heat transfer from the sensor 2 to the circuit part 3 Can be effectively prevented by the shape of the tip.

  Further, a heat radiation promotion hole 521x is provided on the peripheral wall of the circuit part side shell body 521 to promote heat radiated from the circuit part side center contact body 511 to the outside space of the circuit part side shell body 521. Therefore, the heat transferred from the sensor 2 to the circuit unit 3 via the circuit unit side center contact body 511 is radiated from the heat dissipation promotion hole 521x, and therefore the heat on the sensor 2 side is transferred to the circuit unit 3 side. Can be effectively prevented.

  Moreover, since the main part of the connector 5 is made of stainless steel, its heat conductivity is lower than that of, for example, copper, so that heat transfer from the sensor 2 to the circuit part 3 can be effectively prevented. it can.

  Moreover, since phosphor bronze is used for the sensor 2 side end portion of the connector 5, for example, compared to the case where the sensor 2 side end portion is formed of a stainless steel material, the attachment portion to the sensor 2 can be easily processed. Therefore, the degree of freedom in design such as selection of the sensor 2 is increased. In order to obtain a higher heat transfer prevention effect, the entire connector 5 may be made of stainless steel.

  Further, since the sensor accommodating portion 4a is formed in the inner case 42 provided at a position offset inward from the outer case 41 which is the peripheral wall of the case 4, the outer case 41 and the inner case 42 are formed. The heat generated by the heater H can be effectively prevented from being transferred to the outside.

  Further, since the inner case 42 is formed of a stainless steel material that is a glossy metal, the radiant heat radiated to the outside of the inner case 42 can be reduced.

  In addition, a sensor-side convection promoting hole that promotes convection between the air in the inner space formed between the outer case 41 and the inner case 42 and the air in the outer space of the outer case 41 in the peripheral wall of the outer case 41. Since 41x is provided, the surface of the inner case 42 can be cooled using air flowing in and out of the sensor side convection promoting hole 41x.

  In addition, a circuit-side convection promoting hole 41y that promotes convection between the air in the internal space of the circuit housing portion 4b and the air in the external space of the circuit housing portion 4b is provided in the peripheral wall forming the circuit housing portion 4b. Therefore, the surface of the connector 5 exposed in the circuit housing portion 4b and the surface of the circuit portion 3 can be cooled using the air flowing in and out from the circuit side convection promoting hole 41y.

  Further, since the circuit unit 3 includes a plurality of substrates 31a arranged in a plurality of stages through an air layer in a direction contacting and separating from the sensor 2, for example, among the plurality of substrates 31, the sensor It is also possible to easily arrange a component with relatively low heat resistance on the substrate 31a located far from the accommodating portion 4a so as to contribute to extending the life of the component.

  The present invention is not limited to the above embodiment.

  For example, although the heat transfer preventing portion 4c is made of stainless steel, an appropriate material such as a resin can be used.

  Moreover, it can be set as the structure which put the heat conductive member (for example, silicon sponge etc.) in the space formed between a contact body and a shell body. If comprised in this way, a contact body can be made thinner and flexible than the thing of this embodiment, for example, a copper wire can be used for a contact body.

  Moreover, although the circuit part side shell body 521 has a substantially cylindrical shape, the shape can be appropriately changed according to the embodiment, for example, a substantially rectangular tube shape.

  Further, the connector 5 may be provided with heat radiating fins. If comprised in this way, since a bigger heat dissipation effect can be acquired, the whole length of the connector 5 can be shortened, and it contributes to the compactization of an apparatus.

  Moreover, although each part of the outer case 41 is integrally formed of a stainless steel material, for example, a stainless steel bush having a relatively low thermal conductivity is used for a portion in contact with the connection port 1 of the outer case bottom wall 413. Other portions may be made of aluminum having a relatively high thermal conductivity.

  In addition, the specific configuration of each part is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.

1 is a structural cross-sectional view, a plan view, and a side view showing a capacitive pressure sensor device according to an embodiment of the present invention. The figure for demonstrating the operation principle of the sensor in the embodiment. The front view of the connector in the embodiment. The structure sectional view of the connector in the embodiment.

Explanation of symbols

A ... Capacitance type pressure sensor device ... Heater ... 2 Sensor ...・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Circuit 4 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Case 4 a ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Sensor housing 4 b ・ ・ ・ ・ ・ ・.... Circuit housing part 4c ... Heat transfer prevention part 5 ... Connector 31 (31a-31c) ... Board 41 ... ·········· Outside case 41x ······ Sensor side convection promoting hole 41y ····· Circuit side convection promoting hole 42 ···・ ・ ・ ・ ・ Inner case 511 ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ Inner conductor (Circuit part side center contact body)
521 ・ ・ ・ ・ ・ External conductor (Circuit side shell)
521x ・ ・ ・ ・ ・ ・ ・ ・ ・ Heat dissipation promotion hole

Claims (12)

A capacitive sensor that senses the pressure of the gas in the external chamber;
A heater for heating the sensor to a predetermined operating temperature;
A circuit unit for generating an output signal representing the pressure of the gas in the external chamber from the capacitance value sensed by the sensor;
A sensor housing portion for housing the sensor and the heater, a circuit housing portion for housing the circuit portion, and partitioning these housing portions to prevent heat generated by the heater from being transferred to the circuit housing portion. A case provided with a heat transfer prevention part;
While electrically connecting the sensor and the circuit unit, the function as a structure that stably supports the sensor and the circuit unit, and heat transfer between the housing units at least as much as the heat transfer prevention unit A capacitive pressure sensor device comprising a connector having at least one of functions as a heat transfer prevention body to prevent.   The connector comprises a substantially cylindrical outer conductor used as a shield material and an inner conductor used as a signal line arranged in the inner space of the outer conductor, and both of these conductors are used as the structure. 2. The capacitance type pressure sensor device according to claim 1, wherein the device is configured to have a function.   3. The capacitive pressure sensor device according to claim 2, wherein the circuit portion side of the outer conductor or the circuit portion side of the inner conductor is formed in a gradually tapered shape.   The electrostatic capacity type | formula of Claim 2 or 3 which provided the heat-radiation promotion hole which accelerates | stimulates that the heat radiated | emitted by an inner conductor is thermally radiated to the outer space of an outer conductor in the surrounding wall of the said outer conductor. Pressure sensor device.   5. The capacitance type pressure sensor device according to claim 1, wherein a stainless material is used for a main part of the connector.   6. The capacitive pressure sensor device according to claim 1, wherein the connector includes a heat radiating fin.   The capacitance type pressure sensor device according to claim 1, wherein the connector is configured to exhibit a function as a structure of the case.   The static sensor according to any one of claims 1 to 7, wherein the sensor housing portion is formed in an inner case provided at a position offset inward from an outer case which is a peripheral wall of the case. Capacitive pressure sensor device.   9. The capacitance type pressure sensor device according to claim 8, wherein the inner case is made of a glossy metal.   A sensor-side convection promoting hole is provided on the peripheral wall of the outer case to promote convection between the air in the inner space formed between the outer case and the inner case and the air in the outer space of the outer case. 10. The capacitive pressure sensor device according to claim 8,   A circuit-side convection promoting hole for promoting convection between air in the internal space of the circuit housing portion and air in the external space of the circuit housing portion is provided in the peripheral wall forming the circuit housing portion. The capacitive pressure sensor device according to claim 1. The electrostatic capacity according to claim 1, wherein the circuit unit includes a plurality of substrates arranged in a plurality of stages through an air layer in a direction contacting and separating from the sensor. Pressure sensor device.