JP2007141931A - Mounting structure and mounting method of flexible circuit board to base - Google Patents

Abstract

A flexible circuit board mounting structure and mounting method capable of easily mounting a plurality of circuit board parts made of a synthetic resin film having flexibility on a base board.
A flexible circuit board (10) having circuit board portions (20, 30, 40, 50, 60) made of a synthetic resin film having flexibility and a base (100) are provided. Auxiliary attachment portions 29, 39 and auxiliary attachment portions 49, 59, 69 provided in the vicinity of the outer periphery of the overlapped circuit board portions 20, 30 and the overlapped circuit board portions 40, 50, 60 are thermally welded to each other. Auxiliary mounting structures 200 and 210 to be fixed are provided.
[Selection] Figure 4

Description

  The present invention relates to a mounting structure and a mounting method for a flexible circuit board formed by superposing a plurality of board portions on a base.

  Conventionally, a plurality of board portions are provided on a circuit board made of a synthetic resin film having flexibility, and the circuit board is folded and attached to a base made of a hard member by superimposing the plurality of board parts. There was a case. The reason why the substrate portions are installed in such a manner is that various electrical functions of each substrate portion are integrated and installed in a narrow installation area (projection area).

  However, when trying to fix the overlapped substrate portion on the base as described above, the overlapped substrate portions are displaced from each other, or the folded portion (180 ° bent portion) of the outer periphery of the folded substrate portion is the original. Thus, the folded substrate portion is opened so as to return to the planar shape, and the attachment work of the overlapped substrate portions to the base becomes complicated. In particular, when the number of substrate portions to be overlapped is three or more, or when the folded substrate portions are attached to both sides of the base, the fixing operation becomes complicated.

  The present invention has been made in view of the above-described points, and an object of the present invention is to provide a flexible circuit in which a plurality of circuit board portions made of a synthetic resin film having flexibility can be easily attached to a base. An object of the present invention is to provide a mounting structure and a mounting method for mounting a substrate on a base.

  The invention according to claim 1 of the present invention is a mounting structure for mounting a flexible circuit board on a base, in which a plurality of circuit boards are stacked on a base. The flexible circuit board mounting structure is characterized in that, in addition to having a mounting part for mounting the circuit board on the base, there is an auxiliary mounting structure for mounting the opposing parts of the plurality of circuit board parts to each other. .

  The invention according to claim 2 of the present application is characterized in that the auxiliary mounting structure is provided in the vicinity of the outer periphery of the circuit board portion, and the flexible circuit board mounting structure according to claim 1 It is in.

  The invention according to claim 3 of the present application resides in the structure for mounting the flexible circuit board to the base according to claim 2, wherein the auxiliary mounting structure is thermal welding between circuit board portions.

  According to a fourth aspect of the present invention, the plurality of circuit board portions are constituted by a single synthetic resin film connected by a connecting portion, and the auxiliary portion is overlapped by bending the connecting portion. 4. The flexible circuit board mounting structure according to claim 1, wherein the flexible circuit boards are attached to each other by a mounting structure.

  The invention according to claim 5 of the present invention is a method of attaching a flexible circuit board to a base by attaching a flexible circuit board in which a plurality of circuit board parts are superposed on a base, wherein the plurality of circuit board parts are superposed on each other. A step of attaching the opposing portions to each other at the auxiliary attachment portion provided on both circuit board portions, and a step of attaching the mutually attached circuit board portions to a base. The method is to attach the flexible circuit board to the base.

  According to the first aspect of the present invention, the opposing portions of the plurality of circuit board portions can be attached to each other in advance by the auxiliary mounting structure. The mounting work becomes easier.

  According to the second aspect of the present invention, since the auxiliary mounting structure is provided in the vicinity of the outer periphery of the circuit board portion, it does not hinder the installation of various electrical function portions formed on each circuit board portion.

  According to the invention described in claim 3, since the auxiliary mounting structure is performed by heat welding between the circuit board portions, the fixing operation is easy and reliable.

  According to the fourth aspect of the present invention, even if the plurality of circuit board parts to be overlapped are composed of one synthetic resin film connected by the connecting part, the circuit board part can be easily provided by the auxiliary mounting structure. Can be maintained in a superposed state, and the work of attaching the superposed circuit board portion to the base becomes easy.

  According to the fifth aspect of the present invention, since the plurality of superimposed circuit board portions are attached to each other in advance, it is easy to attach these superimposed circuit board portions to the base.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded perspective view of an unfolded flexible circuit board 10 and a base 100 used in an embodiment of the present invention as viewed from the upper surface side, and FIG. 2 shows an unfolded flexible circuit board 10 and the base 100 on its lower surface. It is the disassembled perspective view seen from the side. As shown in both figures, the flexible circuit board 10 uses one flexible synthetic resin film (in this embodiment, a polyethylene terephthalate film (hereinafter referred to as “PET film”), but other various synthetic resins. The circuit pattern may be provided on the surface of the first substrate unit 20, the second substrate unit 30, the third substrate unit 40, and the fourth substrate. The part 50 and the fifth substrate part 60 are connected by belt-like connecting parts 71, 73, 75, 77, respectively. A strip-shaped lead part 79 is connected to the outer periphery of the fourth substrate part 50. In this embodiment, the first to fifth substrate portions 20, 30, 40, 50, 60 and the base 100 are substantially circular, and their outer diameters are formed to be substantially the same.

  The first substrate portion 20 is circular, and is provided with a pressing portion insertion hole 21 penetrating circularly in the center thereof, and a case mounting portion comprising a plurality (eight in this embodiment) of circular small holes penetrating in the vicinity of the outer periphery. 23 and a mounting portion (hereinafter referred to as “mounting hole”) 25 made up of a plurality of (in this embodiment, a pair) circular small holes penetrating at 180 ° in the vicinity of the outer periphery.

  The second substrate portion 30 is circular, and is provided with a pressing portion insertion hole 31 penetrating circularly at the center thereof, at a position facing each case mounting portion 23 in the vicinity of the outer periphery (a position facing when overlapped). A plurality (eight in this embodiment) of case attaching portions 33 made of circular small holes that pass therethrough are provided, and a plurality of (this embodiment is opposed to the mounting holes 25) at positions near the outer periphery at 180 °. A pair of circular small holes (hereinafter referred to as “mounting holes”) 35 are provided, and a pair of sliding contact patterns that are concentrically ring-shaped around the pressing portion insertion hole 31 on the upper surface thereof. 37 is provided. In this embodiment, the outer sliding contact pattern is a resistor pattern, and the inner sliding contact pattern 37 is a conductor pattern having a low resistance value. Of course, these sliding contact patterns may be switch patterns, and the number (number of tracks) may be one or three or more. The outputs of the sliding contact patterns 37 are drawn out to the lead-out portion 79 by a circuit pattern (not shown). In that case, a circuit pattern is provided in the upper and lower surfaces of the flexible circuit board 10 using a through hole as needed.

  The third substrate portion 40 is circular, and is provided with a pressing portion insertion hole 41 penetrating in a circle at the center thereof, at a position facing each case mounting portion 23 in the vicinity of the outer periphery (a position facing when overlapped). A plurality of (in this embodiment, eight) case attaching portions 43 formed of circular small holes that pass therethrough are provided, and two predetermined cases (two close proximity between the case attaching portions 43 arranged close to the outer periphery) are provided. A mounting portion (hereinafter referred to as “mounting hole”) 45 having a circular small hole penetrating at a position) is provided, and a single C-shaped fixed resistance pattern 47 is provided around the pressing portion insertion hole 41 on the upper surface thereof. It is provided and configured. The output of the fixed resistance pattern 47 is drawn out to the lead-out portion 79 by a circuit pattern (not shown). In that case, a circuit pattern is provided in the upper and lower surfaces of the flexible circuit board 10 using a through hole as needed. Note that the two connecting portions 73 and 75 connected to the third substrate portion 40 face in the orthogonal direction.

  The fourth substrate portion 50 is circular, and a pressing switch 51 is provided at the center of the upper surface thereof, and a plurality of (in this embodiment) positions facing each case mounting portion 23 in the vicinity of the outer periphery (positions facing each other when overlapped). In this case, the case mounting portion 53 is formed of a circular small hole that passes through, and the circular small hole that passes through two positions (positions facing each other when overlapped) facing the mounting hole 45 near the outer periphery. A mounting portion (hereinafter referred to as “mounting hole”) 55 is provided. The pressing switch 51 has a reversing plate (movable contact plate) in which an elastic metal plate is formed in a dome shape on a pair of switch patterns (not shown) formed on the surface of the fourth substrate portion 50, and its outer periphery always abuts against one switch pattern. The central lower surface is attached so as to face the other switch pattern with a predetermined gap. The output of the pressing switch 51 is drawn out to the drawing portion 79 by a circuit pattern (not shown). In that case, a circuit pattern is provided in the upper and lower surfaces of the flexible circuit board 10 using a through hole as needed. Note that the two connecting portions 75 and 77 connected to the fourth substrate portion 50 face in the orthogonal direction.

  The fifth substrate portion 60 is circular, and a plurality (eight in this embodiment) of penetrating circular shapes are provided at positions facing each case mounting portion 23 in the vicinity of the outer periphery thereof (positions facing each other when overlapped). A case mounting portion 63 made of a small hole is provided, and a mounting portion made of a circular small hole (hereinafter referred to as “mounting”) that passes through two locations (positions facing each other when overlapped) facing the mounting hole 45 near the outer periphery thereof. 65) (referred to as “hole”). In other words, in the present application, a circuit board part such as the fifth board part 60 that does not include a circuit pattern is also included in the circuit board part.

  On the other hand, as shown in FIG. 2, a ground pattern for preventing electrostatic intrusion (hereinafter referred to as “earth pattern”) is formed on the lower surfaces of the first, second, third and fourth substrate portions 20, 30, 40, 50 and the lower surface of the lead-out portion 79. 80) is provided. The ground pattern 80 is composed of a conductive pattern having a low resistance value (for example, printed with silver paste), a portion surrounding the periphery of the pressing portion insertion hole 21 on the lower surface of the first substrate portion 20, and the lower surface of the second substrate portion 30. Are formed in a portion surrounding the periphery of the pressing portion insertion hole 31, a portion of the vicinity of the outer periphery of the lower surface of the third substrate portion 40, and a portion of the vicinity of the outer periphery of the fourth substrate portion 50, which are connected to the connecting portion 71. , 73 and 75 are connected to the lower surface of the lead-out portion 79 and connected to the lower surface of the lead-out portion 79. The ground pattern 80 is grounded at a position (not shown) after being pulled out from the lead-out portion 79.

  The base 100 is formed by molding a synthetic resin into a substantially disk shape. The base 100 is provided with a pressing portion insertion hole 101 penetrating in a circle at the center thereof, and a position facing each case mounting portion 23 in the vicinity of the outer periphery ( Provided with a plurality of (8 in this embodiment) circular small holes penetrating through a plurality of (8 in this embodiment) case mounting portions 103 at positions facing the case mounting portions 23 of the first substrate unit 20 placed on the upper surface of the base 100, Further, a plurality of (a pair in this embodiment) small projections are provided at positions facing 180 ° in the vicinity of the outer periphery of the upper surface (positions facing the mounting holes 25 of the first substrate unit 20 placed on the upper surface of the base 100). A cylindrical mounting portion (hereinafter referred to as “mounting protrusion”) 105 is provided, and two locations (the mounting of the third substrate portion 40 placed on the lower surface of the base 100) facing the mounting hole 45 near the outer periphery of the lower surface thereof. From the small protrusion to the position facing the hole 45) It is constructed that a cylindrical attachment portion (hereinafter referred to as "mounting protrusions") 107 is provided.

  1 and 2, as shown by dotted lines, the auxiliary mounting portions 29, respectively, are provided in the vicinity of the outer periphery of the first substrate portion 20 and the second substrate portion 30 and the small areas facing each other by superimposing both. 39, the portions near the outer periphery of the third substrate portion 40, the fourth substrate portion 50, and the fifth substrate portion 60, and the small areas facing each other by overlapping the three members, are respectively attached to the auxiliary mounting portions 49, 59, 69. It is said. Although not shown, insulating layers are formed by printing or the like on the upper and lower surfaces of the first to fifth substrate parts 20, 30, 40, 50, 60 and the connecting parts 71, 73, 75, 77 as necessary. However, at least the auxiliary attachment portions 29, 39, 49, 59, and 69 are not formed with an insulating layer, other circuit patterns, a ground pattern 80, or the like on the upper and lower surfaces of the auxiliary mounting portions 29, 39, 49, 59, and 69. The synthetic resin film (PET film in this embodiment) is directly exposed.

  In order to attach the flexible circuit board 10 to the base 100, first, the first substrate part 20 of the flat flexible circuit board 10 shown in FIGS. Ultrasonic waves between the synthetic resin films constituting the auxiliary attachment portions 29 and 39 are arranged on the lower surface side of the 30 and the opposing auxiliary attachment portions 29 and 39 of the first and second substrate portions 20 and 30 facing each other. It fixes by the heat welding by (refer FIG. 3). Since the synthetic resin film is exposed in both of the auxiliary attachment portions 29 and 39, both can be easily and reliably welded. A portion where both auxiliary attachment portions 29 and 39 are fixed by welding is referred to as an auxiliary attachment structure 200 in which the opposing portions (surfaces) of the plurality of circuit board portions 20 and 30 are attached to each other. Since the auxiliary mounting structure 200 is configured to fix the auxiliary mounting portions 29 and 39 of the first and second substrate portions 20 and 30, the structure is simple, and the auxiliary mounting portions 29 and 39 are the first and second substrates. Since it is provided in the vicinity of the outer periphery of the parts 20 and 30, it does not hinder the installation of various electrical function parts (such as various circuit patterns and electronic components to be mounted) formed on the first and second substrate parts 20 and 30. In the case of ultrasonic heat welding, the tip of the ultrasonic horn is brought into contact with the outer surface of one of the auxiliary mounting portions 29, 39, and an insulating layer or the like is formed on each of these surfaces as described above. Therefore, there is no possibility that the insulating layer or the like adheres to the tip of the horn and the heat welding performance is lowered.

  Next, the fifth substrate portion 60 of the flat flexible circuit board 10 shown in FIGS. 1 and 2 is overlapped on the lower surface side of the fourth substrate portion 50 by folding back the connection portion 77 to obtain the state shown in FIG. Further, the superimposed fourth and fifth substrate portions 50 and 60 are superimposed on the upper surface side of the third substrate portion 40 to obtain the state shown in FIG. 4, and the superimposed third, fourth and fifth substrate portions 40 and 50 are formed. , 60 are fixed to each other by heat welding with ultrasonic waves between the synthetic resin films constituting the auxiliary mounting portions 49, 59, 69. Since all of these auxiliary mounting portions 49, 59, and 69 have the synthetic resin film exposed, the three members can be easily and reliably welded. The portion where these auxiliary mounting portions 49, 59, 69 are fixed by welding is referred to as an auxiliary mounting structure 210 in which the opposing portions (surfaces) of the plurality of circuit board portions 40, 50, 60 are attached to each other. Also in this auxiliary mounting structure 210, since the auxiliary mounting portions 49, 59, 69 of the plurality of circuit board portions 40, 50, 60 are fixed to each other, the structure is simple, and the auxiliary mounting portions 49, 59, 69 are Since it is provided in the vicinity of the outer periphery of the plurality of circuit board portions 40, 50, 60, various electrical function portions (various circuit patterns, electronic components to be mounted, etc.) formed on the plurality of circuit board portions 40, 50, 60 Will not interfere with the installation of In addition, by folding back the 5th board | substrate part 60 shown in FIG. 1 in the part of the connection part 77, when it overlaps with the lower surface side of the 4th board | substrate part 50 and it is in the state of FIG. When the fixed fourth and fifth substrate portions 50 and 60 are superimposed on the upper surface side of the third substrate portion 40 to obtain the state shown in FIG. 59 and the auxiliary mounting portion 69 may be fixed again by thermal welding using ultrasonic waves.

  Next, in FIG. 4, the base 100 is installed on the lower surfaces (first substrate part 20 side) of the superimposed first and second substrate parts 20 and 30, and a pair of mounting projections 105 provided on the base 100 at that time. Is inserted into mounting holes 25 and 35 provided in the first and second substrate portions 20 and 30, and the tips of both mounting projections 105 are fixed by heat caulking. When the first and second substrate portions 20 and 30 superimposed on the base 100 are attached, the first and second substrate portions 20 and 30 are attached to each other by the auxiliary mounting structure 200 in advance. In addition, it is easy to attach the first and second substrate portions 20 and 30 to the base 100. When the first and second substrate portions 20 and 30 are connected by the connecting portion 71 as in this embodiment, the folded portion (the portion bent by 180 °) of the folded connecting portion 71 returns to the original planar shape. The first and second substrate portions 20 and 30 that are overlapped with each other are about to open, but in the present invention, the overlapped first and second substrate portions 20 and 30 are fixed by the auxiliary mounting structure 200. These do not open, and the mounting work of the superposed first and second substrate portions 20 and 30 to the base 100 is facilitated also from this point.

  Next, in FIG. 4, the superimposed third, fourth, and fifth substrate portions 40, 50, 60 are folded back at the connecting portion 73 and installed on the lower surface of the base 100 (at this time, the third substrate portion 40 A pair of mounting projections 107 (see FIG. 2) provided on the lower surface of the base 100 at that time, provided on the third, fourth, and fifth substrate portions 40, 50, and 60. It inserts in the attachment holes 45, 55, and 65, and it fixes by thermally crimping the front-end | tip of both the attachment protrusions 107. FIG. When the third, fourth, and fifth substrate portions 40, 50, 60 are attached to the lower surface of the base 100, the auxiliary attachment structure 210 connects the third, fourth, fifth substrate portions 40, 50, 60 to each other in advance. Since they are attached, it is easy to attach the stacked third, fourth, and fifth substrate portions 40, 50, 60 to the base 100. Even in the case where the three third, fourth, and fifth substrate portions 40, 50, 60 are connected by the plurality of connecting portions 75, 77 as in this embodiment, the plurality of folded connecting portions are the same as described above. The third, fourth, and fifth substrate portions 40, 50, and 60 that are overlapped so that the folded portions 75 and 77 return to the original planar shape are about to open, but this can be prevented by the auxiliary mounting structure 210. Thus, it is easy to attach the stacked third, fourth, and fifth substrate portions 40, 50, 60 to the base 100.

  FIG. 5 is an exploded perspective view of the rotary electronic component 1-1 with a push button switch configured using the flexible circuit board 10 attached to the base 100 as described above. FIG. 6 is a perspective view of a case 310 attached with a rotary knob 330 and the like described below as seen from the lower surface side. As shown in both figures, the rotary electronic component 1-1 with a push button switch includes a case 310 such as an exterior case, a rotary knob 330 that is rotatably attached to the case 310, and a push button that is installed at the center of the rotary knob 330. A key top 350 for the switch, a rotary object 370 that rotates integrally with the rotary knob 330 and whose lower surface is exposed on the lower surface side of the case 310, the base 100, the flexible circuit board 10 attached thereto, and a base 100 and a mounting plate 390 attached to the lower surface side of the flexible circuit board 10.

  Here, the rotary knob 330 is rotatably attached to the case 310. On the lower surface of the case 310, a rotary object 370 is accommodated in a circular opening 311 provided in the case 310 so as to rotate integrally with the rotary knob 330. A slider 380 made of an elastic metal plate is attached to the lower surface of the rotary mold 370, and the lower part of the pressing portion 353 of the key top 350 protrudes from an opening 371 provided in the center of the lower surface of the rotary mold 370. . Around the opening 311 on the lower surface of the case 310, a fixing portion 313 including a plurality of protrusions is provided. The fixing portions 313 are provided on the circuit board portions 20, 30, 40, 50, 60 and the base 100, and the case mounting portions 23, 33, 43, 53, 63, 103 is provided at a position corresponding to 103. The key top 350 has a substantially cylindrical head portion 351 at the upper portion thereof, and is configured to protrude from the center of the lower surface of the head portion 351 with a cylindrical pressing portion 353, and the lower portion of the pressing portion 353 rotates as described above. Projecting from the center of the lower surface of the mold 370. The outer diameter dimension of the pressing part 353 is smaller than the inner diameter dimension of the pressing part insertion holes 21, 31, 41 of the first, second and third substrate parts 20, 30, 40, and is configured to be insertable into these. . The mounting plate 390 is formed by forming a metal plate into a substantially disc shape having substantially the same outer diameter as each of the circuit board portions 20, 30, 40, 50, 60, and the first substrate portion 20 in the vicinity of the outer periphery thereof. Are provided with a plurality of (8 in this embodiment) circular small holes penetrating at positions facing each case mounting section 23 (positions facing each other when they are overlapped). A hole 395 made of a circular small hole is provided at two positions facing the mounting hole 45 of the third substrate portion 40 (position facing each other when overlapped).

  The base 100 and the flexible circuit board 10 integrated with the mounting plate 390 are arranged on the lower surface of the case 310, and are provided on the circuit board portions 20, 30, 40, 50, 60 and the base 100. The fixing portions 313 of the case 310 are inserted into the plurality of case mounting portions 23, 33, 43, 53, 63, 103 and the case mounting portions 393 of the mounting plate 390, respectively. The ends of the fixing portion 313 are heat squeezed with the lower surface of the mounting plate 390 to integrate these members. The hole 395 provided in the mounting plate 390 is a clearance hole for inserting the heat-crimped tip portion of the mounting protrusion 107 (see FIG. 2) of the base 100 exposed on the lower surface of the fifth substrate portion 60.

  In the rotary electronic component 1-1 with the push button switch assembled as described above, the two sliding booklets 381 provided on the slider 380 are respectively connected to the pair of sliding contact patterns 37 of the second substrate unit 30. At the same time, the lower part of the pressing part 353 of the key top 350 is provided with the pressing part insertion holes 21, 31, 101, provided in the first board part 20, the second board part 30, the base 100 and the third board part 40, respectively. 41, and the lower end thereof is in contact with the reverse plate of the press switch 51 of the fourth substrate unit 50. When the rotary knob 330 is rotated, the rotary mold 370 and the slider 380 are rotated integrally therewith, and the sliding booklet 381 of the slider 380 slides on the sliding contact pattern 37 of the second substrate unit 30. This changes the electrical output. On the other hand, when the head 351 of the key top 350 is pressed, the pressing portion 353 turns on the pressing switch 51. When the pressing on the key top 350 is released, the key top 350 is raised and the pressing switch 51 is turned off. In this embodiment, the second, third, and fourth substrate portions 30, 40, and 50 are circuit substrate portions on which various electrical function portions are installed, and the first substrate portion 20 is a back surface of the second substrate portion 30. A fifth circuit board part 60 is a circuit board part for insulation, and for dropping static electricity that enters the tip of the pressing part 353 from the gap between the head 351 of the key top 350 and the rotary knob 330 to the ground pattern 80. Is a circuit board portion for insulation on the back surface of the fourth substrate portion 50.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, as the auxiliary mounting structures 200 and 210, the auxiliary mounting portions 29 and 39 (or the auxiliary mounting portions 49, 59, and 69) are fixed by ultrasonic heat welding. Various fixing structures other than heat welding, for example, a fixing structure using an adhesive, a mechanical fixing structure using a clamping member, or the like may be used. In short, any structure may be used as long as it is an auxiliary mounting structure in which facing portions of a plurality of circuit board portions are attached to each other. Rather than completely fixing between circuit board parts, temporarily attach a plurality of circuit board parts to each other (temporarily) with a fastener such as a gem clip, and attach these circuit board parts to the base. The fastener may be removed from. In the above embodiment, the mounting holes 25, 35, (45, 55, 65) of the circuit board portions 20, 30 (40, 50, 60) in which a plurality of mounting protrusions 105 (107) provided on the base 100 are overlapped. The circuit board portions 20, 30, (40, 50, 60) are attached to the base 100 by inserting into the base 100 and thermally crimping the tips of the attachment protrusions 105 (107). 55, 65) and the mounting projections 105 (107) may be replaced by mounting portions having other various structures. In short, any structure may be used as long as it is a mounting portion for attaching a plurality of circuit board portions to a base. Needless to say, various modifications can be made to the shape, material, structure, etc. of the base and the circuit board. In short, a flexible circuit in which a flexible circuit board in which a plurality of circuit board parts are stacked is attached to the base. The present invention can be applied to any part as long as it is a structure for mounting the substrate on the base. Further, the circuit board portions to be overlapped are not necessarily connected by the connecting portion as in the above embodiment.

It is the disassembled perspective view which looked at the developed flexible circuit board 10 and the base 100 from the upper surface side. It is the disassembled perspective view which looked at the developed flexible circuit board 10 and the base 100 from the lower surface side. FIG. 6 is an explanatory diagram of a method for attaching the flexible circuit board 10 to the base 100. FIG. 6 is an explanatory diagram of a method for attaching the flexible circuit board 10 to the base 100. It is a disassembled perspective view of the rotary electronic component 1-1 with a pushbutton switch. It is the perspective view which looked at the case 310 which attached rotating knob 330 grade | etc., From the lower surface side.

Explanation of symbols

10 flexible circuit board 20 first board part (circuit board part)
25 Mounting hole (Mounting part)
29 Auxiliary mounting part 30 Second board part (circuit board part)
35 Mounting hole (Mounting part)
37 Sliding contact pattern 39 Auxiliary mounting part 40 Third board part (circuit board part)
45 Mounting hole (Mounting part)
47 Fixed resistance pattern 49 Auxiliary mounting part 50 Fourth board part (circuit board part)
51 Press switch 55 Mounting hole (Mounting part)
59 Auxiliary mounting part 60 5th board part (circuit board part)
65 Mounting hole (Mounting part)
69 Auxiliary mounting portions 71, 73, 75, 77 Connecting portion 100 Base 105, 107 Mounting protrusion (mounting portion)
200, 210 Auxiliary mounting structure 1-1 Rotating electronic component with pushbutton switch 310 Case 330 Rotating knob 350 Key top 370 Rotating mold 390 Mounting plate

Claims (5)

In the mounting structure to the base of the flexible circuit board in which a flexible circuit board in which a plurality of circuit board parts are stacked is attached to the base,
In addition to having a mounting portion for attaching the circuit board portion stacked on the base to the base,
2. A mounting structure for mounting a flexible circuit board on a base, comprising: an auxiliary mounting structure for mounting opposing portions of the plurality of circuit board portions to each other.   2. The flexible circuit board mounting structure according to claim 1, wherein the auxiliary mounting structure is provided in a vicinity of an outer periphery of the circuit board portion.   3. The flexible circuit board mounting structure according to claim 2, wherein the auxiliary mounting structure is thermal welding between circuit board portions.   The plurality of circuit board portions are constituted by a single synthetic resin film connected by a connecting portion, and are attached to each other by the auxiliary mounting structure after being overlapped by folding the connecting portion portions. The mounting structure to the base of the flexible circuit board of Claim 1 characterized by these. In the mounting method to the base of the flexible circuit board, which attaches the flexible circuit board in which a plurality of circuit board parts are stacked to the base,
A step of attaching the plurality of circuit board parts to each other and attaching the opposing parts to each other at a part of an auxiliary attachment part provided on both circuit board parts;
Attaching the mutually attached circuit board parts to a base; and
A method for attaching a flexible circuit board to a base.

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