JP2007131652A - Impact resistant polyketone resin composition and molded article thereof - Google Patents

Abstract

Provided is a polyketone resin composition having remarkably excellent impact resistance and antistatic properties while maintaining mechanical properties and heat resistance.
The composition comprises (A) a polyketone resin, (B) a polyetheresteramide resin, and (C) a polyamide resin, and the blending amounts of the component (A), the component (B), and the component (C) satisfy the following requirements. The polyketone resin composition characterized by the above-mentioned.
(A) Component content: 40 to 99.5 parts by weight (B) Component content + (C) Component content: 0.5 to 60 parts by weight (B) Component content / (C) component Compounding amount (weight ratio): 10/90 to 90/10
[Selection figure] None

Description

  The present invention relates to a polyketone resin composition, and more particularly, to a polyketone resin composition having excellent impact resistance without impairing mechanical properties and heat resistance, and further having antistatic performance. The composition of the present invention is suitable for parts in precision equipment, home appliances / OA equipment, automobiles, industrial materials, sundries and the like.

  The polyketone resin has balanced mechanical properties and is excellent in heat resistance and chemical resistance, and can be used for various mechanical parts and OA equipment. However, the polyketone resin does not have a sufficient level of impact resistance depending on the application to which it is applied. For this reason, attempts have been made to obtain a composition in which a thermoplastic resin or a thermoplastic elastomer is added as a component for imparting flexibility to the polyketone resin.

  For example, Patent Document 1 discloses a technique for blending a polyamide resin with a polyketone resin, Patent Document 2 discloses a technique for blending a polyetheresteramide resin and a polyolefin-based thermoplastic elastomer with a polyketone resin, and Patent Document 3 discloses a technique for blending a polyketone resin. A technique for blending a polystyrene-based thermoplastic elastomer is disclosed in Patent Document 4 and a technique for blending an aromatic-based thermoplastic elastomer into a mixture of a polyketone resin and a polycarbonate resin. However, these compositions have not yet reached a satisfactory level in impact resistance, and further improvement in impact resistance is desired.

Japanese Patent Laid-Open No. 11-256027 Japanese Patent No. 3015108 JP-A-2-38452 Japanese Patent Laid-Open No. 10-1601

  An object of this invention is to provide the composition which has the outstanding impact resistance, and also has antistatic performance, without impairing the mechanical physical property and heat resistance of polyketone resin.

  As a result of studying various impact resistance improving materials in order to improve the impact resistance of the polyketone resin, the inventors have (A) a polyketone resin, (B) a polyetheresteramide resin, and (C) a polyamide resin. , (B) / (C) is a composition comprising a resin within a specific range, and the present invention has found that the composition has excellent impact resistance without impairing the mechanical properties and heat resistance of the polyketone resin. Was completed. That is, this invention is a polyketone resin composition and its molded object as described below.

(1) It consists of (A) polyketone resin, (B) polyetheresteramide resin, and (C) polyamide resin, and the blending amounts of (A) component, (B) component, and (C) component satisfy the following requirements. A polyketone resin composition characterized by the above.
(A) Component content: 40 to 99.5 parts by weight (B) Component content + (C) Component content: 0.5 to 60 parts by weight (B) Component content / (C) component Compounding amount (weight ratio): 10/90 to 90/10
(2) (A) The polyketone resin composition according to 1, wherein the polyketone resin comprises a polyketone polymer represented by the following general formula:

(3) A molded product obtained by molding the polyketone resin composition according to (1) or (2) above,
(4) Mechanical parts obtained by molding, cutting or molding / cutting the polyketone resin composition according to (1) or (2) above (5) Gear, cam, slider, lever, arm The polyketone resin composition as described in (1) or (2) above, which is used as a molding material for a clutch, joint, shaft, bearing, key stem or key top.
(6) As described in (1) or (2) above, which is used as a molding material for office automation equipment, video equipment, music equipment, video equipment, information equipment, communication equipment, automotive interior / exterior parts, or industrial goods Polyketone resin composition.

  Compared to conventional compositions, the composition of the present invention has an excellent resin composition having remarkably excellent impact resistance and antistatic performance while maintaining the mechanical properties and heat resistance of the polyketone resin. It is a thing.

  The (A) polyketone resin of the present invention refers to those containing alternating copolymer units in which units derived from carbon monoxide and units derived from olefins are alternately arranged. Preferably, those composed of repeating units represented by the following general formula are employed.

In the above formula, x and y represent the molar ratio of each repeating unit in the polymer, and a polymer in which R ₁ is hydrogen and R ₂ is a methyl group is preferably employed. The copolymerization ratio is preferably y / x of 0.01 to 0.10, more preferably 0.03 to 0.10, and particularly preferably 0.05 to 0.10. By making it into such a range, the mechanical properties and impact strength of the resin structure obtained are further improved.
Moreover, as a polyketone resin of this invention, a well-known polyketone derivative, for example, the polyketone-polyalkylene glycol copolymer etc. which are shown by Unexamined-Japanese-Patent No. 2005-146000 can be used.

Although there is no restriction | limiting in particular in the molecular weight of the polyketone resin used for this invention, In order to make a moldability and impact property more favorable, the limit of the polymer measured at 60 degreeC in m-cresol with the standard capillary viscosity measuring apparatus. The viscosity (LVN) is preferably 0.5 to 10.0, more preferably 0.8 to 4.0, and particularly preferably 1.0 to 2.0.
The melting point of the polyketone resin is preferably 175 ° C to 300 ° C, more preferably 210 ° C to 270 ° C.

  As a production method of the polyketone resin, a known polymerization method can be adopted. For example, carbon monoxide and olefin are converted to a palladium compound, an acid having a pKa measured in an aqueous solution at 18 ° C. of 6 or less and a non-hydrohalic acid and phosphorus. Examples include a production method in which contact is made in the presence of a catalyst composition comprising a bidentate ligand compound, and a reaction diluent such as an alkanol (for example, methanol or ethanol) is contained in a gas phase substantially free of reaction diluent A method of carrying out polymerization in a liquid phase containing it can be employed. Moreover, the method of making it polymerize by making a monomer contact with a catalyst composition by methods, such as shaking or stirring, can be illustrated.

  A suitable reaction temperature is 20 to 150 ° C, preferably 50 to 135 ° C. A suitable reaction pressure is 100 to 10000 kPa, preferably 1000 to 10000 kPa. After polymerization, the polymer is recovered by decantation or filtration. The polymer may contain catalyst composition residues, but is optionally treated and removed with a complexing agent selective for the solvent or residue.

Here, the palladium compound is not particularly limited as long as it is a compound containing palladium. For example, palladium acetate and palladium acetylacetonate can be used. In addition, these palladium compounds may be used by being supported on carbon, and ion exchangers, for example, those bonded to an ion exchanger having a sulfonic acid group can also be used. The amount of the palladium compound used is not particularly limited, but it is preferably 10 ⁻⁸ to 10 ⁻¹ mol per mol of the total number of monomers to be polymerized.

  Specific examples of non-hydrohalic acid having a pKa of 6 or less (measured in an aqueous solution at 18 ° C.) include sulfonic acid anions such as methanesulfonic acid, trifluoromethanesulfonic acid, p-toluenesulfonic acid, and carboxylic acid. Examples thereof include trichloroacetic acid, difluoroacetic acid, trifluoroacetic acid, monochloroacetic acid, difluoropropionic acid, acetic acid, tartaric acid and 2,5-dihydroxybenzoic acid. Among these, p-toluenesulfonic acid and trifluoroacetic acid can be preferably used. The amount of acid having a pKa of 6 or less is preferably 0.5 to 200 equivalents, more preferably 1.0 to 100 equivalents, per 1 g of palladium metal in the catalyst composition.

  In addition, the phosphorus bidentate ligand compound to be used is not particularly limited. For example, 1,3-bis (diphenylphosphino) propane, 1,3-bis [di (2-methoxyphenyl) phosphino] propane, 1,4-bis (diphenylphosphino) butane, 2,3-dimethyl-1,4-bis (diphenylphosphino) butane, 1,5-bis (methyl-phenyl-phosphino) pentane, 1,4-bis ( Dicyclohexylphosphino) butane, 1,5-bis (naphthylphosphino) pentane, 1,3-bis (di-p-tolylphosphino) propane, 1,4-bis (di-p-methoxyphenylphosphino) propane, 1, 2-bis (phenylphosphino) ethene, 2,3-bis (phenylphosphino) -2-oxapropane, 2-methyl, 2- (methyldiphene) Ruphosphino) -1,3-bis (diphenylphosphino) propane, 0.07-bis (diphenylphosphino) biphenyl, 1,2-bis (diphenylphosphino) benzene, 2,3-bis (diphenylphosphino) naphthalene 1,2-bis (diphenylphosphino) cyclohexane, 2,2-dimethyl-4,5-bis (diphenylphosphino) dioxolane, and the like. Preferably, 1,3-bis (diphenylphosphino) propane and 1,3-bis [di (2-methoxyphenyl) phosphino] propane are used. The amount of the phosphorus bidentate ligand compound is not particularly limited, but can be usually 0.1 to 10 mol, preferably 0.2 to 5 mol, particularly preferably, per mol of the palladium compound. 0.33 to 3 mol.

  In the polyketone resin of the present invention, stabilizers known to be used in conventional polyketone resins, for example, heat stabilizers, weathering (light) stabilizers, processing aids, etc. are used alone or in combination. I can do it. As the heat stabilizer, an antioxidant, a heavy metal deactivator and a combination thereof are effective.

  The antioxidant is preferably a hindered phenol antioxidant, such as n-octadecyl-3- (3′5′-di-t-butyl-4′-hydroxyphenyl) -propionate, n-octadecyl-3. -(3'-methyl-5'-t-butyl-4'-hydroxyphenyl) -propionate, n-tetradecyl-3- (3'5'-di-t-butyl-4'-hydroxyphenyl) -propionate, 1,6-hexanediol-bis- (3- (3,5-di-t-butyl-4-hydroxyphenyl) -propionate), 1,4-butanediol-bis- (3- (3,5-di -T-butyl-4-hydroxyphenyl) -propionate), triethyleneglycol-bis- (3- (3-t-butyl-5-methyl-4-hydroxyphenyl)- Lopionate), tetrakis- (methylene-3- (3 ′, 5′-di-t-butyl-4′-hydroxyphenyl) propionate methane, 3,9-bis (2- (3- (3-t- Butyl-4-hydroxy-5-methylphenyl) propionyloxy) -1,1-dimethylethyl) 2,4,8,10-tetraoxaspiro (5,5) undecane, N, N′-bis-3- ( 3'5'-di-t-butyl-4-hydroxyphenol) priionyl hexamethylenediamine, N, N'-tetramethylenebis-3- (3'-methyl-5'-t-butyl-4-hydroxy) Phenol) propionyldiamine, N, N′-bis- (3- (3,5-di-tert-butyl-4-hydroxyphenol) propionyl) hydrazine, N-salicyloyl-N′-salicylide Hydrazine, 3- (N-salicyloyl) amino-1,2,4-triazole, N, N′-bis (2- (3- (3,5-di-butyl-4-hydroxyphenyl) propionyloxy) ethyl) Examples include oxyamide.

  As a heavy metal deactivator, a compound having a chelating ability having an unpaired electron in the structure, for example, N, N′-bis [3- (3,5-di-t-butyl-4-hydroxyphenyl) Propionyl] hydrazine, oxalic bis (benzylidenehydrazide), 1,2,3-benzotriazole, other ADK STAB CDA-1 (Asahi Denka Co., Ltd.), ADK STAB CDA-6 (Asahi Denka Co., Ltd.), Quonox ( Mitsui Toatsu Fine Co., Ltd.), Naugard XL-1 (Uni Royal Chemical Co., Ltd.) and the like.

As the weathering (light) stabilizer, (i) benzotriazole-based materials, (b) oxalic acid anilide-based materials, (c) triazine-based materials, and (d) hindered amine-based materials are preferable.
(I) Examples of the benzotriazole-based substance include 2- (2′-hydroxy-5′-methyl-phenyl) benzotriazole, 2- [2′-hydroxy-3,5-di-t-butyl-phenyl] benzo Triazole, 2- [2′-hydroxy-3,5-di-isoamyl-phenyl] benzotriazole, 2- [2′-hydroxy-3,5-bis- (α, α-dimethylbenzyl) phenyl] -2H— And benzotriazole, 2- (2′-hydroxy-4′-octoxyphenyl) benzotriazole, and the like.

(B) Examples of oxalic acid anilide-based substances include 2-ethoxy-2′-ethyloxalic acid bisanilide, 2-ethoxy-5-tert-butyl-2′-ethyloxalic acid bisanilide, 2 -Ethoxy-3'-dodecyl oxalic acid bisanilide and the like.
(C) Examples of triazine-based substances include 2- (4,6-diphenyl-1,3,5, triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4,6 -Bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) phenol and the like.
These substances may be used alone or in combination of two or more.

(D) As hindered amine substances, 4-acetoxy-2,2,6,6-tetramethylpiperidine, 4-stearoyloxy-2,2,6,6-tetramethylpiperidine, 4-acryloyloxy-2,2 , 6,6-tetramethylpiperidine, 4- (phenylacetoxy) -2,2,6,6-tetramethylpiperidine 4-benzoyloxy-2,2,6,6-tetramethylpiperidine, 4-methoxy-2, Examples include 2,6,6-tetramethylpiperidine and 4-stearyloxy-2,2,6,6-tetramethylpiperidine.
In addition, 4-cyclohexyloxy-2,2,6,6-tetramethylpiperidine, 4-benzyloxy-2,2,6,6-tetramethylpiperidine, 4-phenoxy-2,2,6,6-tetramethyl Piperidine, 4- (ethylcarbamoyloxy) -2,2,6,6-tetramethylpiperidine, 4- (cyclohexylcarbamoyloxy) -2,2,6,6-tetramethylpiperidine, 4- (phenylcarbamoyloxy)- 2,2,6,6-tetramethylpiperidine, bis (2,2,6,6-tetramethyl-4-piperidine) -carbonate, bis (2,2,6,6-tetramethyl-4-piperidyl)- Oxalate, bis (2,2,6,6-tetramethyl-4-piperidyl) -malonate, bis (2,2,6,6-tetramethyl-4-pipe Jill) - sebacate, bis (2,2,6,6-tetramethyl-4-piperidyl) - adipate, bis (2,2,6,6-tetramethyl-4-piperidyl) - terephthalate and the like. Furthermore, 1,2-bis (2,2,6,6-tetramethyl-4-piperidyloxy) -ethane, α, α′-bis (2,2,6,6-tetramethyl-4-piperidyloxy) ) -P-xylene, bis (2,2,6,6-tetramethyl-4-piperidyl) tolylene-2,4-dicarbamate, bis (2,2,6,6-tetramethyl-4-piperidyl)- Hexamethylene-1,6-dicarbamate, tris (2,2,6,6-tetramethyl-4-piperidyl) -benzene-1,3,5-tricarboxylate, tris (2,2,6,6- Tetramethyl-4-piperidyl) -benzene-1,3,4-tricarboxylate and the like, and bis (2,2,6,6-tetramethyl-4-piperidyl) -sebacate is preferred.
The above hindered amine materials may be used alone or in combination of two or more. The combination of at least one of the above benzotriazole-based materials, oxalic acid anilide-based materials, and triazine-based materials with a hindered amine-based material is most preferable.

The processing aid includes hydroxyapatite of the formula: M ₁₀ (PO ₄ ) ₆ (OH) ₂ [wherein M is barium (Ba), strontium (Sr) or calcium (Ca)], and is preferred. Hydroxyapatite is calcium hydroxyapatite [Ca ₁₀ (PO ₄ ) ₆ (OH) ₂ ], that is, natural calcium phosphate, and is a main component of minerals in bone and teeth. Calcium hydroxyapatite is also called tribasic calcium phosphate.

A commercially available general material can be used as the polyketone resin in the present invention.
The polyether ester amide resin used in the component (B) of the present invention is a block copolymer comprising a polyamide having carboxyl groups at both ends and an alkylene oxide adduct of polyether or bisphenol.

The polyamide having carboxyl groups at both ends is (1) a ring-opening polymer of lactam, (2) a polycondensate of aminocarboxylic acid, or (3) a polycondensate of dicarboxylic acid and diamine. Examples of the lactam (1) include caprolactam, enantolactam, laurolactam, and undecanolactam. Examples of the aminocarboxylic acid (2) include ω-aminocaproic acid, ω-aminoenanthic acid, ω-aminocaprylic acid, ω-aminopergonic acid, ω-aminocapric acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and the like. Can be mentioned. Examples of the dicarboxylic acid (3) include adipic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid, and isophthalic acid. Examples of the diamine include hexamethylenediamine, heptamethylenediamine, octamethylenediamine, and decamethylenediamine. Is mentioned.
Those exemplified as the above-mentioned polyamide-forming monomer may be used in combination of two or more.

  A polyamide having carboxyl groups at both ends is obtained by using a dicarboxylic acid component having 4 to 20 carbon atoms as a molecular weight regulator, and in the presence of this, the polyamide-forming monomer is subjected to ring-opening polymerization or polycondensation by a conventional method. It is done. Examples of the dicarboxylic acid having 4 to 20 carbon atoms include aliphatic dicarboxylic acids such as succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanediic acid, dodecanediic acid, terephthalic acid, isophthalic acid, and naphthalene. An aromatic dicarboxylic acid such as dicarboxylic acid, an aliphatic dicarboxylic acid such as dicyclohexyl-4,4-dicarboxylic acid, and an alkali metal salt of isophthalic acid such as sodium 3-sulfoisophthalate and potassium 3-sulfoisophthalate. The number average molecular weight of such polyamide is 300 to 15000, preferably 500 to 5000.

On the other hand, the polyether block unit is (1) polyalkylene oxide having 2 to 4 carbon ring-opened alkylene oxide as a structural unit or (2) an alkylene oxide adduct of bisphenols.
(1) Polyalkylene oxide having a C2-C4 ring-opened alkylene oxide as a structural unit is polyethylene oxide, polypropylene oxide, poly (1,2-butylene oxide), poly (1,3-butylene oxide) , Poly (1,4-butylene oxide) or a mixture or copolymer thereof.

(2) Alkylene oxide adducts of bisphenols include bisphenol A (4,4′-dihydroxydiphenyl-2,2-propane), bisphenol F (4,4′-dihydroxydiphenylmethane), bisphenol S (4,4′- It can be obtained by adding alkylene oxide to bisphenols such as dihydroxydiphenylsulfone) and 4,4′-dihydroxydiphenyl-2,2-butane. The alkylene oxide is preferably ethylene oxide, and other alkylene oxides can be used in combination, but the other alkylene oxides are preferably 10% by weight or less of ethylene oxide. The molecular weight of such polyether or bisphenol alkylene oxide adduct polyether block units is 200 to 8000, preferably 500 to 3000.
This (B) polyetheresteramide resin can be produced by the methods disclosed in Japanese Patent Publication No. 2-57583 and Japanese Patent No. 2565846.

  The molecular weight of the polyetheresteramide resin obtained as described above is not particularly limited for the purpose of the present invention, but is generally 1000 to 100,000, preferably 5,000 to 50,000. Furthermore, the constituent ratio of the polyether component / lactam component or polyamide component in the polyetheresteramide resin is in the range of 10/90 to 90/10% by weight, desirably 20/80 to 80/20% by weight. Two or more kinds of the polyetheresteramide resins may be used in combination. Commercially available general materials can be used for the polyetheresteramide resin of the present invention.

  Examples of the polyamide resin used in the component (C) of the present invention include nylon 46, nylon 6, nylon 66, nylon 610, nylon 612, nylon 12, and the like, and copolymers thereof such as nylon 6/66, nylon 6 / 66/610, nylon 6/612 and the like. Two or more kinds of the polyamide resins may be used in combination. Commercially available general materials can be used for the polyamide resin of the present invention.

In this invention, it is preferable that the quantity of (A) component shall be 40-99.5 weight part, More preferably, it is 50-99.0 weight part. Moreover, it is preferable that the total amount of (B) component and (C) component shall be 0.5-60 weight part, More preferably, it is 1.0-50 weight part. In the present invention, the ratio of (B) polyether ester amide resin to (C) polyamide resin is such that (B) / (C) is in the range of 10/90 to 90/10% by weight, preferably 15 / 85 to 85/15% by weight.
If (B) is less than 10%, the impact resistance of the composition is lowered, which is not preferable. If (C) is less than 10%, the compatibility with the polyketone resin is remarkably deteriorated and the impact resistance is lowered. Therefore, it is not preferable.

  The method for adding the (B) polyether ester amide resin and (C) polyamide resin of the present invention to the (A) polyketone resin is not particularly limited, but (B) the polyether ester amide resin and (C) the polyamide. Examples thereof include a method in which each of the resins is independently added to (A) the polyketone resin, or a method in which (B) the polyether ester amide resin and (C) the polyamide resin are previously kneaded and added.

<Manufacture of polyketone resin composition>
The melt composition machine generally used can be used for the manufacturing method of the resin composition of this invention. Examples of the melt kneader include a kneader, a roll mill, a single screw extruder, a twin screw extruder, and a multi screw extruder. The processing temperature at this time is preferably 180 to 270 ° C., and in order to maintain the quality and the working environment, it is preferable to perform deaeration by substitution with an inert gas or single-stage and multistage vents.

<Molding method>
The molded body of the present invention includes an injection molding method, a hot runner injection molding method, an outsert molding method, an insert molding method, a hollow injection molding method (gas injection molding method), a high frequency heating injection molding method of a mold, a compression molding method, It is molded by a molding method such as inflation molding, blow molding, extrusion molding or cutting of an extrusion molded product.

  Such molded products are represented by gears, cams, sliders, levers, arms, clutches, felt clutches, idler gears, pulleys, rollers, rollers, key stems, key tops, shutters, reels, shafts, joints, shafts, bearings, guides, etc. Mechanical parts, plastic parts for outsert molding, plastic parts for insert molding, chassis, trays, side plates, parts for office automation equipment such as printers and copiers, VTR (Video Tape Recorder), video movies, digital video Cameras, parts for cameras and video equipment typified by cameras and digital cameras, cassette players, DAT, LD (Laser Disk), MD (Mini Disk), CD (Compact Disk) [CD-ROM (Read Only Memory), CD -R (Recordable), CD-RW (Rewritable) included) DVD (Digital Versatile Disk) (including DVD-ROM, DVD-R, DVD-RW, DVD-RAM (Random Access Memory), DVD-Audio), other optical disk drives, MFD, MO, navigation system and mobile personal computer Parts for music, video or information equipment, mobile phone and facsimile, parts for electric equipment, parts for electronic equipment, parts for automobiles, gasoline tanks, fuel pump modules, valves, gasoline Fuel-related parts typified by tank flanges, door-lock parts, door handles, window regulators, speaker-gear parts typified by speaker grills, seat belt peripheral parts typified by seat belt slip rings, press buttons, etc. Switch parts, Switch and clip parts, mechanical parts for inserting and removing the mechanical pencil tip and mechanical pencil core, wash basin and drain port, drain plug opening and closing mechanism parts, opening and closing part locking mechanism and product discharge mechanism parts , Cord stoppers for clothing, adjusters and buttons, sprinkling nozzles and sprinkling hose connection joints, building supplies that support stair railings and flooring, disposable cameras, toys, fasteners, chains, conveyors, buckles, sports equipment It can be suitably used as industrial parts represented by vending machines, furniture, musical instruments, and housing equipment.

  EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these examples, unless the summary is exceeded. The contents of components used in Examples and Comparative Examples and evaluation methods are shown below.

[Reference Example 1]
(A) Preparation of polyketone resin Carbon monoxide, ethylene and propylene are contacted with palladium acetate, trifluoroacetic acid and 1,3-bis [bis (2-methoxyphenyl) phosphino] propane in methanol to produce a wire An alternating copolymer polyketone resin was produced.
The melting point of this polyketone resin was 220 ° C., and the LVN was 1.78 dl / g (measured in m-cresol at 60 ° C.).
The crude polyketone resin obtained here is blended with various stabilizers (antioxidants, weathering stabilizers, heavy metal deactivators, processing aids), mixed in a mixer, and then a twin screw extruder with a vent. Was used to obtain a polyketone resin pellet containing a stabilizer.

[Reference Example 2]
(B) Manufacture of polyetheresteramide resin In a 3 L stainless steel autoclave, 105 parts by weight of ε-caprolactam, 17.1 parts by weight of adipic acid, antioxidant (Irganox 1010, manufactured by Ciba Specialty Chemicals, trade name) 0 .3 parts by weight and 6 parts by weight of water were charged, and after substitution with nitrogen, the mixture was heated and stirred at 220 ° C. for 4 hours to obtain 117 parts of a polyamide oligomer having carboxyl groups at both ends.
Next, 113 parts by weight of a bisphenol A ethylene oxide adduct having a number average molecular weight of 2,000 and 0.5 parts by weight of zirconyl acetate were added thereto, and the mixture was polymerized for 5 hours at 245 ° C. under reduced pressure of 133 Pa or less. A polymer was obtained. This polymer was taken out in a strand form on a belt and pelletized to obtain a polyetheresteramide resin.
The relative viscosity of this product was 2.2 (0.5 wt%, m-cresol solution, 25 ° C.), and the copolymer composition by NMR was as follows.
Residue of ε-caprolactam 48.1 parts by weight Residue of bisphenol A ethylene oxide adduct 50.0 parts by weight Residue of adipic acid 1.9 parts by weight (C) Polyamide resin Commercial nylon 6 resin (melting point: 225 ° C , Specific gravity; 1.13).

[Evaluation methods]
(1) Evaluation of physical properties After pellets obtained in Examples and Comparative Examples were dried at 80 ° C. for 3 hours, a 1 ounce molding machine (manufactured by FANUC CORPORATION; FAS) set to a cylinder temperature of 250 ° C. and a mold temperature of 70 ° C. -15A), a test piece for evaluating physical properties was produced under conditions of an injection time of 10 seconds and a cooling time of 15 seconds.
The following test was done using this test piece.
a. Tensile strength, elongation; measured according to ASTM-D638.
b. Flexural strength, elastic modulus; measured according to ASTM-D790.
c. Izod impact strength; measured at 23 ° C. and −30 ° C. according to ASTM-D256.
(2) Thermal deformation temperature (HDT)
Measurement was performed according to ASTM D648 (load: 1.82 MPa) using the test piece used in (1) above.
(3) Volume resistivity After pellets obtained in Examples and Comparative Examples were dried at 80 ° C. for 3 hours, a 3 ounce molding machine (manufactured by FANUC; FAS50D) set at a cylinder temperature of 250 ° C. was used. A flat plate of 100 × 100 × 3 mm was produced under conditions of a mold temperature of 70 ° C., an injection time of 10 seconds, and a cooling time of 20 seconds.
The flat plate was allowed to stand for 48 hours in a thermostatic chamber at a temperature of 23 ° C. and a humidity of 50%, and then measured according to JIS-K-6911.

[Example 1]
Blender 75 parts by weight of the polyketone resin (A) prepared in Reference Example 1, 5 parts by weight of the polyether ester amide resin (B) prepared in Reference Example 2, and 20 parts by weight of the polyamide resin (C) After uniformly blending, melt kneading is performed at a screw rotation speed of 200 rpm and 2 kg / hr using a 15 mmφ twin screw extruder (Technobel Co., Ltd .; KZW15-45MG) set at 250 ° C. went. The extruded molten resin strand was cooled and solidified in a water bath, and the strand was cut into a pellet by a strand cutter. The pellets were used for evaluation according to the above evaluation method, and the results are shown in Table 1.

[Examples 2 to 6]
It implemented similarly to Example 1 by the component and quantity shown in Table 1. FIG. The results are shown in Table 1.
[Comparative Examples 1-3]
It implemented similarly to Example 1 by the component and quantity shown in Table 1. FIG. The results are shown in Table 1. In Comparative Example 1, the melt kneading in Example 1 was not performed, and the pellets produced in Reference Example 1 were used as they were for evaluation.

  The composition of the present invention has remarkably superior impact resistance and antistatic performance while maintaining the mechanical properties and heat resistance of the polyketone resin as compared with the conventional composition. It can be suitably used for parts in equipment, automobiles, industrial materials, miscellaneous goods and the like.

Claims (6)

It consists of (A) polyketone resin, (B) polyether ester amide resin and (C) polyamide resin, and the blending amount of (A) component, (B) component and (C) component satisfies the following requirements: A polyketone resin composition.
(A) Component content: 40 to 99.5 parts by weight (B) Component content + (C) Component content: 0.5 to 60 parts by weight (B) Component content / (C) component Compounding amount (weight ratio): 10/90 to 90/10 (A) The polyketone resin composition according to claim 1, wherein the polyketone resin comprises a polyketone polymer represented by the following general formula.

(X and y are positive numbers representing the molar ratio in the polymer.)   The molded object obtained by shape | molding the polyketone resin composition of Claim 1 or 2.   A mechanical component obtained by molding, cutting or molding / cutting the polyketone resin composition according to claim 1.   The polyketone resin composition according to claim 1 or 2, which is used as a molding material for gears, cams, sliders, levers, arms, clutches, joints, shafts, bearings, key stems or key tops. 3. The polyketone resin composition according to claim 1, wherein the polyketone resin composition is used as a molding material for office automation equipment, video equipment, music equipment, video equipment, information equipment, communication equipment, automobile interior / exterior parts, or industrial goods.