JP2007128030A - ペリクル用収納容器 - Google Patents
ペリクル用収納容器 Download PDFInfo
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- JP2007128030A JP2007128030A JP2006142826A JP2006142826A JP2007128030A JP 2007128030 A JP2007128030 A JP 2007128030A JP 2006142826 A JP2006142826 A JP 2006142826A JP 2006142826 A JP2006142826 A JP 2006142826A JP 2007128030 A JP2007128030 A JP 2007128030A
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- 229920006311 Urethane elastomer Polymers 0.000 claims abstract description 44
- 239000012528 membrane Substances 0.000 claims abstract description 8
- 238000003860 storage Methods 0.000 claims description 76
- 229920005862 polyol Polymers 0.000 claims description 26
- 150000003077 polyols Chemical class 0.000 claims description 25
- 229920000570 polyether Polymers 0.000 claims description 18
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 14
- 239000000843 powder Substances 0.000 abstract description 15
- 238000005299 abrasion Methods 0.000 abstract description 5
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- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- 239000000463 material Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 14
- 239000002131 composite material Substances 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- -1 polypropylene Polymers 0.000 description 8
- 238000000465 moulding Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000004970 Chain extender Substances 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000007666 vacuum forming Methods 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000011109 contamination Methods 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 239000000020 Nitrocellulose Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 229920001220 nitrocellulos Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920002121 Hydroxyl-terminated polybutadiene Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67359—Closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Library & Information Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Packaging Frangible Articles (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Packages (AREA)
- Closures For Containers (AREA)
Abstract
【解決手段】ペリクル膜6と当該ペリクル膜6を支持する支持枠7とからなるペリクル5を輸送するためのペリクル用収納容器1であって、トレイ3とその蓋となるカバー2と、トレイ3とカバー2の外側または内側において、トレイ3とカバー2との隙間を塞ぐ閉塞部材4とを備え、閉塞部材4における少なくとも上記トレイまたは上記カバーに接する接触部がウレタンエラストマーからなるペリクル用収納容器1としている。
【選択図】図6
Description
図1は、本発明の第1の実施の形態に係るペリクル用収納容器の分解斜視図である。また、図2は、図1に示すペリクル用収納容器にクリップを装着する状態を示す斜視図である。
次に、本発明に係るペリクル用収納容器の第2の実施の形態について、説明する。
次に、本発明に係るペリクル用収納容器の第3の実施の形態について、説明する。
次に、本発明に係るペリクル用収納容器の第4の実施の形態について、説明する。
2 カバー
3 トレイ
4 クリップ(閉塞部材の一例)
5 ペリクル
6 ペリクル膜
7 支持枠
8 粘着材
20 カバー天面
21 側面
22 水平面
23 側面
24 水平面
25 垂直面
26 水平面
30 トレイ底面
31 斜面
32 水平面
33 垂直面
34 水平面
50 複合クリップ(閉塞部材の一例)
52 接触部
60 カバーシート(閉塞部材の一例)
61 クリップ
70 シール部材(閉塞部材の一例)
Claims (7)
- ペリクル膜と当該ペリクル膜を支持する支持枠とからなるペリクルを輸送するためのペリクル用収納容器であって、
トレイと
その蓋となるカバーと、
上記トレイと上記カバーの外側または内側において、上記トレイと上記カバーとの隙間を塞ぐ閉塞部材とを備え、
上記閉塞部材における少なくとも上記トレイまたは上記カバーに接する接触部がウレタンエラストマーからなることを特徴とするペリクル用収納容器。 - 前記閉塞部材は、前記トレイと前記カバーの内側に配置され、前記トレイおよび前記カバーの各対向面の少なくともいずれか一方の面に備えられるウレタンエラストマー製のシール部材であることを特徴とする請求項1に記載のペリクル用収納容器。
- 前記トレイと前記カバーを挟持して固定するクリップを、さらに備えることを特徴とする請求項1または2に記載のペリクル用収納容器。
- 前記ウレタンエラストマーは、主なポリオールとしてポリエーテルポリオールを使用して製造されるものであることを特徴とする請求項1から3のいずれか1項に記載のペリクル用収納容器。
- ペリクル膜と当該ペリクル膜を支持する支持枠とからなるペリクルを輸送するためのペリクル用収納容器であって、
トレイと
その蓋となるカバーと、
上記トレイと上記カバーを挟持して固定するクリップとを備え、
上記クリップは、ウレタンエラストマーからなることを特徴とするペリクル用収納容器。 - 前記クリップは、そのショアー硬度がA80以上のウレタンエラストマーからなることを特徴とする請求項5に記載のペリクル用収納容器。
- 前記クリップは、主なポリオールとしてポリエーテルポリオールを使用して製造されるウレタンエラストマーからなることを特徴とする請求項5または6に記載のペリクル用収納容器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006142826A JP2007128030A (ja) | 2005-10-07 | 2006-05-23 | ペリクル用収納容器 |
KR1020087010820A KR101131688B1 (ko) | 2005-10-07 | 2006-06-27 | 펠리클용 수납 용기 |
PCT/JP2006/312795 WO2007043217A1 (ja) | 2005-10-07 | 2006-06-27 | ペリクル用収納容器 |
TW095135729A TW200714528A (en) | 2005-10-07 | 2006-09-27 | Pellicle storing container |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005294607 | 2005-10-07 | ||
JP2006142826A JP2007128030A (ja) | 2005-10-07 | 2006-05-23 | ペリクル用収納容器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2007128030A true JP2007128030A (ja) | 2007-05-24 |
Family
ID=37942479
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006142826A Pending JP2007128030A (ja) | 2005-10-07 | 2006-05-23 | ペリクル用収納容器 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2007128030A (ja) |
KR (1) | KR101131688B1 (ja) |
TW (1) | TW200714528A (ja) |
WO (1) | WO2007043217A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008083618A (ja) * | 2006-09-29 | 2008-04-10 | Asahi Kasei Electronics Co Ltd | ペリクル収納容器の補強材 |
JP2009062918A (ja) * | 2007-09-07 | 2009-03-26 | Toyota Industries Corp | シールキャップ用抜止具 |
JP2011232388A (ja) * | 2010-04-23 | 2011-11-17 | Shin Etsu Chem Co Ltd | ペリクル収納容器 |
JP2012046239A (ja) * | 2010-08-30 | 2012-03-08 | Shin-Etsu Chemical Co Ltd | ペリクル収納ケース用コーナークリップ |
JP2014167627A (ja) * | 2014-03-20 | 2014-09-11 | Asahi Kasei E-Materials Corp | 収納容器からの大型ペリクルの取出し方法 |
EP3043207A1 (en) * | 2014-12-18 | 2016-07-13 | Shin-Etsu Chemical Co., Ltd. | A container for storing a pellicle for lithography |
JP2022028958A (ja) * | 2017-03-30 | 2022-02-16 | 旭化成株式会社 | ペリクル用緩衝材、及び梱包体 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4822357B2 (ja) * | 2007-04-20 | 2011-11-24 | 信越化学工業株式会社 | ペリクル収納容器、および、その製造方法 |
US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
EP3705943A1 (en) * | 2019-08-23 | 2020-09-09 | ASML Netherlands B.V. | Pod for housing patterning device |
CN114960121A (zh) * | 2021-02-24 | 2022-08-30 | 青岛海尔滚筒洗衣机有限公司 | 一种熔敷安装结构、熔敷方法及衣物处理装置 |
TW202414078A (zh) * | 2022-08-17 | 2024-04-01 | 美商恩特葛瑞斯股份有限公司 | 具有減少邊緣構建之電鍍之光罩容器 |
Citations (13)
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JPS5529800U (ja) * | 1979-09-08 | 1980-02-26 | ||
JPS5771802U (ja) * | 1980-10-20 | 1982-05-01 | ||
JPS57101698U (ja) * | 1980-12-13 | 1982-06-22 | ||
JPS5824609A (ja) * | 1982-07-05 | 1983-02-14 | 明邦株式会社 | U字形クリップ組立体 |
JPH06288477A (ja) * | 1991-11-20 | 1994-10-11 | Nippon Valqua Ind Ltd | ウレタンパッキン |
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JP2000258897A (ja) * | 1999-03-05 | 2000-09-22 | Shin Etsu Chem Co Ltd | ペリクル収納容器 |
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Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20030064084A (ko) * | 2002-01-25 | 2003-07-31 | 김진희 | 용기 뚜껑 밀폐용 클립 |
JP4525960B2 (ja) * | 2002-08-01 | 2010-08-18 | 住友ゴム工業株式会社 | 導電性ウレタン組成物及び該組成物を用いた導電性ローラ |
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2006
- 2006-05-23 JP JP2006142826A patent/JP2007128030A/ja active Pending
- 2006-06-27 WO PCT/JP2006/312795 patent/WO2007043217A1/ja active Application Filing
- 2006-06-27 KR KR1020087010820A patent/KR101131688B1/ko not_active IP Right Cessation
- 2006-09-27 TW TW095135729A patent/TW200714528A/zh unknown
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS49127678U (ja) * | 1973-03-02 | 1974-11-01 | ||
JPS5246163U (ja) * | 1975-09-29 | 1977-04-01 | ||
JPS5529800U (ja) * | 1979-09-08 | 1980-02-26 | ||
JPS5771802U (ja) * | 1980-10-20 | 1982-05-01 | ||
JPS57101698U (ja) * | 1980-12-13 | 1982-06-22 | ||
JPS5824609A (ja) * | 1982-07-05 | 1983-02-14 | 明邦株式会社 | U字形クリップ組立体 |
JPH06288477A (ja) * | 1991-11-20 | 1994-10-11 | Nippon Valqua Ind Ltd | ウレタンパッキン |
JPH08172038A (ja) * | 1994-12-16 | 1996-07-02 | Shin Etsu Chem Co Ltd | ペリクル収納容器 |
JP2000258897A (ja) * | 1999-03-05 | 2000-09-22 | Shin Etsu Chem Co Ltd | ペリクル収納容器 |
JP2003165819A (ja) * | 2001-11-28 | 2003-06-10 | Nippon Polyurethane Ind Co Ltd | 熱硬化性ポリウレタンエラストマーの製造方法 |
JP2004123216A (ja) * | 2002-10-07 | 2004-04-22 | Japan Crown Cork Co Ltd | 耐熱性キャップ |
JP2005002171A (ja) * | 2003-06-10 | 2005-01-06 | Nippon Polyurethane Ind Co Ltd | 熱硬化性ポリウレタン組成物及び該組成物を用いて得られるoa機器用ロール又はベルト |
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Also Published As
Publication number | Publication date |
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TW200714528A (en) | 2007-04-16 |
KR20080059627A (ko) | 2008-06-30 |
KR101131688B1 (ko) | 2012-03-28 |
WO2007043217A1 (ja) | 2007-04-19 |
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