JP2007115723A - Metal foil laminated body and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal foil laminated body where thermal damage of a thin film dielectric layer can be avoided. <P>SOLUTION: Parts where polyamideimide resin layers 21 and 22 and metal foil layers 31 and 32 are laminated in the order are included on both faces of a polycarbonate polyurethane resin layer 10 which contains isocyanurate compound as curing agent. The metal foil laminated body can be used for a capacitor and a circuit board. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a metal foil laminate, a capacitor using the metal foil laminate, a circuit board, and further an electronic component using the capacitor and the circuit board as circuit elements.

  In recent years, with the development of electronic devices, circuit elements such as capacitors and circuit boards are also required to have high performance, and as a means to respond to this, the one in which a dielectric thin film is bonded to metal copper foil has been proposed. ing. Usually, general-purpose resins such as polyethylene resin and polypropylene resin are used as the dielectric thin film, but these resins have poor heat resistance and are directly soldered like a single plate capacitor or a circuit board. It cannot be used for circuit elements.

  Therefore, heat-resistant resins such as polyimide resins and polyamide-imide resins are used as dielectric thin films for circuit elements that require heat resistance. However, when a heat-resistant resin such as polyimide resin is used as the dielectric thin film, it is difficult to laminate by thermal bonding with a single substance such as polyimide resin because of its high heat resistance.

  As a means to solve the problems related to the lamination properties such as polyimide resin, in a circuit board application, a thermosetting silicone resin is used as an adhesive and a polyimide resin is adhered (Patent Document 1), an epoxy resin. Has been proposed (Patent Document 2) and the like in which a polyamide-imide resin is adhered.

However, even in this case, high-temperature and high-pressure pressure bonding is required for thermal bonding, and further, long-time treatment at high temperature is required for thermosetting as well. Also, in these methods, if the resin layer is thinned for capacitor use, the dielectric layer is damaged by high-temperature and high-pressure treatment, the product yield is deteriorated, and it is difficult to put into practical use. Furthermore, the possibility of causing oxidation of the metal copper foil is increased by long-time treatment at a high temperature.
Japanese Patent Publication No. 63-30797 Japanese Patent No. 3223894

  An object of the present invention is to provide a metal foil laminate capable of avoiding thermal damage to a thin film dielectric layer, a specific application of a capacitor, a circuit board, and an electronic component having the capacitor or the circuit board as a circuit element. It is to be.

  In order to solve the above-described problems, the metal foil laminate according to the present invention is obtained by laminating a polyamideimide resin layer and a metal foil layer in this order on both sides of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent. Including parts.

  In the metal foil laminate described above, the polyamideimide resin layer and the polycarbonate polyurethane resin layer function as a thin film dielectric layer. Of the thin film dielectric layer, a metal imide layer that receives heat from the outside during soldering or the like is adjacent to a polyamideimide resin having high heat resistance. Accordingly, a thin film dielectric layer having high heat resistance can be formed.

  Applications of the metal foil laminate according to the present invention are diverse, such as a circuit board, a capacitor, a composite component, or a wiring board. As a typical example, a circuit board having a metal foil layer on both sides, a capacitor, and the like have a structure in which a polyamideimide resin layer and a metal foil layer are laminated in this order on both sides of a polycarbonate polyurethane resin layer.

  Such a laminated sheet of double-sided metal foil layers can ensure sufficient heat resistance even when a soldering process or the like is performed on the surface of the metal foil layer on both sides.

  In addition, since the polyamideimide resin layer and the metal foil layer are laminated on both sides of the polycarbonate polyurethane resin layer, the polyamideimide resin layer and the metal foil layer are arranged in this order on one side of the polycarbonate polyurethane resin layer in the manufacturing process. By preparing two laminates, stacking them so that the polycarbonate polyurethane resin layers face each other, and bonding the polycarbonate polyurethane resin layers together, a metal foil laminate can be obtained easily and reliably it can.

  Furthermore, the present invention also discloses a nonreciprocal circuit element such as an electronic component including the above-described capacitor or circuit board, for example, an isolator.

  As described above, according to the present invention, the metal foil laminate capable of avoiding thermal damage to the thin film dielectric layer, the specific application of the capacitor, the circuit board, and further the capacitor or the circuit board as a circuit element It is possible to provide an electronic component having the following.

  Other objects, configurations and advantages of the present invention will be described in more detail with reference to the accompanying drawings. However, the attached drawings are merely examples.

  FIG. 1 is a diagram schematically showing a cross-sectional structure of a metal foil laminate according to the present invention. Referring to the figure, a polyamideimide resin layer 21 and a metal foil layer 31 are laminated in this order on one surface of a polycarbonate polyurethane resin layer 10 containing an isocyanurate compound as a curing agent, and a polyamideimide resin layer 22 and It has a double-sided metal foil laminate structure in which the metal foil layers 32 are laminated in this order. This structure is suitable for a double-sided circuit board and a capacitor. In the polycarbonate polyurethane resin layer 10, the isocyanurate compound serving as a curing agent can be contained in the range of 1 wt% to 30 wt%.

  Further, the polycarbonate polyurethane resin layer 10 and the polyamideimide resin layers 21 and 22 may contain ceramic dielectric powder or magnetic powder or both. Ceramic dielectric powder can be used to improve the apparent relative permittivity, and magnetic powder can be used to improve the relative permeability. As the magnetic powder, ferrite magnetic powder or the like can be used.

  In the metal foil laminate, the polyamideimide resin layers 21 and 22 and the polycarbonate polyurethane resin layer 10 are adjacent to each other and function as a thin film dielectric layer as a whole. Of these thin film dielectric layers, the metal foil layers 31 and 32 that receive heat from the outside during soldering are adjacent to the polyamideimide resins 21 and 22 having high heat resistance. Accordingly, a thin film dielectric layer having high heat resistance can be formed.

  Further, the polyamideimide resin layers 21 and 22 are adjacent to the polycarbonate polyurethane resin layer 10 containing the isocyanurate compound as a curing agent on the other surface opposite to the one surface adjacent to the metal foil layers 31 and 32. The polyamideimide resin layers 21 and 22 that are the objects can be bonded to the polycarbonate polyurethane resin layer 10. For this reason, unlike the case where only the polyamideimide resin layers 21 and 22 are provided on the metal foil layers 31 and 32, an adhesion treatment process under high temperature and high pressure is unnecessary, and the adhesion treatment process can be completed in a short time. become.

  Moreover, since the polyamide imide resin layers 21 and 22 and the metal foil layers 31 and 32 are laminated on both surfaces of the polycarbonate polyurethane resin layer 10, the polycarbonate polyurethane resin layer 101 as shown in FIG. The polyamide imide resin layer 21 and the metal foil layer 31 are laminated in this order on one side, and the polyamide imide resin layer 22 and the metal foil layer 32 are laminated in this order on one side of the polycarbonate polyurethane resin layer 102. Two metal foil laminates prepared as shown in FIG. 3 are stacked so that the polycarbonate polyurethane resin layers 101 and 102 face each other, and the polycarbonate polyurethane resin layers 101 and 102 are adhered to each other, Easy and reliable double-sided metal foil laminate It is possible.

  In adhering the polycarbonate polyurethane resin layers 101 and 102, thermosetting treatment may be performed after heat bonding before thermosetting. Thereby, thermal bonding at a lower temperature is possible, and sufficient heat resistance can be ensured.

  The thicknesses of the polycarbonate polyurethane resin layers 101 and 102, the polyamideimide resin layers 21 and 22 and the metal foil layers 31 and 32 are not particularly limited, but can be selected within a range of 5 μm to 100 μm. Therefore, the metal foil laminate according to the present invention is actually a very thin flexible sheet. This means that according to the metal foil laminate of the present invention, a capacitor or circuit board having a very thin thin film dielectric layer (insulating layer) can be obtained.

  An example of manufacturing a capacitor in accordance with the manufacturing method shown in FIGS. 2 and 3 is as follows. First, a mixed solution of polyamide-imide resin and solvent is used as the first layer 21 (22) on the metal foil layer 31 (32) made of metal copper foil so that the layer thickness after drying is 5 μm, for example. Apply using an applicator and dry thoroughly.

Next, a mixed solution of a polycarbonate polyurethane resin and a solvent is applied and dried to obtain a polycarbonate polyurethane resin layer 101 (102) as a second layer.
Specifically, a polycarbonate polyurethane resin and an isocyanurate compound are added in an amount of 15 wt% to the polycarbonate polyurethane resin, and dissolved in a solvent methyl ethyl ketone (hereinafter referred to as MEK) to prepare a lacquer solution having a concentration of 20 wt%. This lacquer solution is applied onto the dried first layer 21 (22) using an applicator so that the layer thickness after drying becomes 5 μm, and is dried.

  Next, two dried metal foil laminates are vacuum laminated at 80 ° C. so that the resin layer is on the inside. The laminated double-sided metal foil laminate is subjected to a thermosetting treatment at 180 ° C. for 3 hours, for example.

  After that, in order to obtain a capacitor of a predetermined size, the metal copper foil surface is subjected to necessary processes such as laminating a photoresist dry film, exposure, development, etching process, resist stripping, and cutting into a predetermined dimension, Create a capacitor or circuit board. Note that the various numerical values described above are merely examples for the purpose of concrete description, and are not intended to limit the present invention.

  Next, as one specific example, an example in which the metal foil laminate according to the present invention is used as a single plate capacitor will be shown. The single plate type capacitor has a layer structure shown in FIG.

Example 1
Polyamideimide resin (Vilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration: 14 wt%, Tg (glass transition temperature): 320 ° C.) on an electrolytic copper foil (F1-WS-12, manufactured by Furukawa Circuit Foil) with a thickness of 12 μm, After drying, it was applied using an applicator so as to have a layer thickness of 5 μm, dried, and wound up.

  Furthermore, for the polycarbonate polyurethane resin (N5230 Nippon Polyurethane Industry solid content concentration 30 wt%, Tg: −33 ° C., softening point 130 ° C.), an isocyanurate compound (Coronate 2030 Nippon Polyurethane Industry, solid content concentration 50 wt%) 15 wt% was added, and further dissolved with a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, two laminated metal foil laminates were vacuum-laminated at 80 ° C. so that the resin layer was inside, and then the laminated double-sided metal foil laminate was heat-cured at 180 ° C. for 3 hours. To do.

  Thereafter, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper foil surface, and a predetermined pattern is exposed with a high-pressure mercury lamp. Next, after developing by spraying 0.8 wt% anhydrous sodium carbonate aqueous solution, the copper foil surface was etched for 30 minutes (1.25 vol% dilute sulfuric acid solution mixed with 4 wt% of pre-posite etch 748 manufactured by Shipley). Next, the resist was stripped with a 2 wt% aqueous sodium hydroxide solution (50 ° C., 1 minute). The metal foil laminate having a predetermined pattern thus obtained was cut into a predetermined size to produce a capacitor.

Example 2
Polyamideimide resin (Vilomax HR11NN, manufactured by Toyobo Co., Ltd., solid content concentration 15 wt%, Tg: 300 ° C.) is dried on a 12 μm thick electrolytic copper foil (F1-WS-12, manufactured by Furukawa Circuit Foil), and the layer thickness is 5 μm. It was applied using an applicator, dried, and wound up.

  Furthermore, for the polycarbonate polyurethane resin (N5199 manufactured by Nippon Polyurethane Industry, solid content concentration 30 wt%, Tg: -29 ° C., softening point 105 ° C.), an isocyanurate compound (Coronate HX manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration 100 wt%) 15 wt% was added, and further dissolved with a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, two laminated metal foil laminates were vacuum-laminated at 80 ° C. so that the resin layer was inside, and then the laminated double-sided metal foil laminate was heat-cured at 180 ° C. for 3 hours. To do.

  Thereafter, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper foil surface, and a predetermined pattern is exposed with a high-pressure mercury lamp. Next, after developing by spraying 0.8 wt% anhydrous sodium carbonate aqueous solution, the copper foil surface was etched for 30 minutes (1.25 vol% dilute sulfuric acid solution mixed with 4 wt% of pre-posite etch 748 manufactured by Shipley). Next, the resist was stripped with a 2 wt% aqueous sodium hydroxide solution (50 ° C., 1 minute). The metal foil laminate having a predetermined pattern thus obtained was cut into a predetermined size to produce a capacitor.

Comparative Example 1
Polyamideimide resin (Vilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration 14 wt%, Tg: 320 ° C.) is dried on a 12 μm thick electrolytic copper foil (Furukawa Circuit Foil, F1-WS-12) and the layer thickness is 10 μm. It was applied using an applicator, dried, and wound up.

  Next, vacuum lamination was performed on the two dried metal foil laminates at 80 ° C. so that the resin layer was inside, but the two metal foil laminates were not bonded. Further, the temperature was raised to 300 ° C. and vacuum lamination was performed, but the two metal foil laminates were not adhered, and a capacitor could not be produced.

Comparative Example 2
Polyamideimide resin (Bilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration 14 wt%, Tg: 320 ° C.) is dried on a 12 μm thick electrolytic copper foil (Furukawa Circuit Foil, F1-WS-12), and the layer thickness is 5 μm. It was applied using an applicator, dried, and wound up.

  Furthermore, with respect to polycarbonate polyurethane resin (N5230 Nippon Polyurethane Industry Co., Ltd., solid content concentration 30 wt%, Tg: −33 ° C., softening point 130 ° C.), an isocyanate compound (Coronate L Nippon Polyurethane Industry Co., Ltd., solid content concentration 75 wt%) % And further dissolved in a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, two laminated metal foil laminates were vacuum-laminated at 80 ° C. so that the resin layer was inside, and then the laminated double-sided metal foil laminate was heat-cured at 180 ° C. for 3 hours. To do.

  Thereafter, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper foil surface, and a predetermined pattern is exposed with a high-pressure mercury lamp. Next, after developing by spraying 0.8 wt% anhydrous sodium carbonate aqueous solution, the copper foil surface was etched for 30 minutes (1.25 vol% dilute sulfuric acid solution mixed with 4 wt% of pre-posite etch 748 manufactured by Shipley). Next, the resist was stripped with a 2 wt% aqueous sodium hydroxide solution (50 ° C., 1 minute). The metal foil laminate having a predetermined pattern thus obtained was cut into a predetermined size to produce a capacitor.

Comparative Example 3
Polyamideimide resin (Bilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration 14 wt%, Tg: 320 ° C.) is dried on a 12 μm thick electrolytic copper foil (Furukawa Circuit Foil, F1-WS-12), and the layer thickness is 5 μm. It was applied using an applicator, dried, and wound up.

  Furthermore, with respect to polycarbonate polyurethane resin (N5230 Nippon Polyurethane Industry Co., Ltd., solid content concentration 30 wt%, Tg: −33 ° C., softening point 130 ° C.), 15 wt. % And further dissolved in a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, two laminated metal foil laminates were vacuum-laminated at 80 ° C. so that the resin layer was inside, and then the laminated double-sided metal foil laminate was heat-cured at 180 ° C. for 3 hours. To do.

  Thereafter, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper foil surface, and a predetermined pattern is exposed with a high-pressure mercury lamp. Next, after developing by spraying 0.8 wt% anhydrous sodium carbonate aqueous solution, the copper foil surface was etched for 30 minutes (1.25 vol% dilute sulfuric acid solution mixed with 4 wt% of pre-posite etch 748 manufactured by Shipley). Next, the resist was stripped with a 2 wt% aqueous sodium hydroxide solution (50 ° C., 1 minute). The metal foil laminate having a predetermined pattern thus obtained was cut into a predetermined size to produce a capacitor.

Comparative Example 4
Polyamideimide resin (Bilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration 14 wt%, Tg: 320 ° C.) is dried on a 12 μm thick electrolytic copper foil (Furukawa Circuit Foil, F1-WS-12), and the layer thickness is 5 μm. It was applied using an applicator, dried, and wound up.

  Furthermore, to the polyester polyurethane resin (UR1400 Toyobo, solid content concentration 30 wt%, Tg: 83 ° C.), an isocyanurate compound (Coronate 2030 manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration 50 wt%) was added at 15 wt%. A lacquer solution having a concentration of 20 wt% was prepared by dissolving with a solvent MEK.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, vacuum lamination was performed on the two dried metal foil laminates at 80 ° C. so that the resin layer was inside, but the two metal foil laminates were not adhered and a capacitor could not be produced. .

Comparative Example 5
Polyamideimide resin (Bilomax HR16NN, manufactured by Toyobo Co., Ltd., solid content concentration 14 wt%, Tg: 320 ° C.) is dried on a 12 μm thick electrolytic copper foil (Furukawa Circuit Foil, F1-WS-12), and the layer thickness is 5 μm. It was applied using an applicator, dried, and wound up.

  Furthermore, to the polyester polyurethane resin (UR8700, manufactured by Toyobo Co., Ltd., solid content concentration: 30 wt%, Tg: −22 ° C.), an isocyanurate compound (Coronate 2030 manufactured by Nippon Polyurethane Industry Co., Ltd., solid content concentration: 50 wt%) was added at 15 wt%. Then, it was dissolved with a solvent MEK to prepare a lacquer solution having a concentration of 20 wt%.

  The obtained lacquer solution was applied onto the polyamideimide resin layer using an applicator so that the layer thickness would be 5 μm after drying, and then wound up.

  Next, two laminated metal foil laminates were vacuum-laminated at 80 ° C. so that the resin layer was inside, and then the laminated double-sided metal foil laminate was heat-cured at 180 ° C. for 3 hours. To do.

  Thereafter, a photoresist dry film (Photec RY-3215 manufactured by Hitachi Chemical Co., Ltd.) is laminated on the copper foil surface, and a predetermined pattern is exposed with a high-pressure mercury lamp. Next, after developing by spraying 0.8 wt% anhydrous sodium carbonate aqueous solution, the copper foil surface was etched for 30 minutes (1.25 vol% dilute sulfuric acid solution mixed with 4 wt% of pre-posite etch 748 manufactured by Shipley). Next, the resist was peeled off with a 2 wt% sodium hydroxide aqueous solution (50 ° C., 1 minute), but the resin film was dissolved and a capacitor having a desired size could not be obtained.

  Table 1 shows the thermal adhesiveness, alkali resistance, heat resistance, capacitance value Cp, and dielectric loss tangent (tan δ) of Examples 1 and 2 and Comparative Examples 1 to 5.

  In Table 1, the thermal adhesiveness was determined by whether or not it could be peeled off after pressure-bonding at 80 ° C. for 60 seconds with the resin surface inside. Alkali resistance was judged by immersing an aqueous solution of NaOH 10 wt% at 70 ° C. for 30 minutes, thereby determining whether the resin film did not dissolve. The heat resistance was judged by whether or not peeling occurred in a solder reflow furnace.

  Referring to Table 1, in Comparative Example 1 having no polycarbonate polyurethane resin layer, the resin, that is, the polyamideimide resin layer cannot be bonded. In Comparative Examples 2 and 3 in which the polycarbonate polyurethane resin layer is present but the curing agent is isocyanate, the heat resistance is poor (x mark). Further, in Comparative Example 4 using a polyester polyurethane resin instead of the polycarbonate polyurethane resin, even if an isocyanurate compound is used as a curing agent, the thermal adhesiveness is poor and cannot be bonded (Comparative Example 4). In Comparative Example 5 using a different polyester polyurethane resin, even if an isocyanurate compound is used as a curing agent, the alkali resistance is poor and etching peeling occurs (Comparative Example 5).

  On the other hand, in Examples 1 and 2, there is no problem in any of thermal adhesiveness, alkali resistance, and heat resistance. That is, a combination of a polycarbonate polyurethane resin and an isocyanurate compound is important.

  Next, as an electronic component using the metal foil laminate according to the present invention, a non-reciprocal circuit element will be described as an example with reference to FIGS. 4 is a perspective view showing an embodiment of a non-reciprocal circuit device according to the present invention, FIG. 5 is an exploded perspective view of the non-reciprocal circuit device shown in FIG. 4, and FIG. 6 is a non-reciprocal view shown in FIGS. 7 is an exploded perspective view of the lower case in the reversible circuit element, FIG. 7 is a schematic cross-sectional view of the non-reciprocal circuit element shown in FIGS. 4 to 6, and FIG. 8 is a partially enlarged view of FIG.

  4 and 5, the nonreciprocal circuit device according to the present invention includes a magnetic rotor 2, a permanent magnet 8, and a case 9. In the illustrated embodiment, a plurality of matching capacitors C1 to C3, a terminating resistor R, a capacitor C9, a pressing member 7, and the like are further provided.

  Case 9 includes an upper case 91 and a lower case 92. Referring to FIG. 6 in addition to FIG. 4 and FIG. 5, the lower case 92 includes a conductive magnetic metal material and an electrically insulating resin material, and is formed in a rectangular box shape having an open top. The The lower case 92 is formed by bending two opposing sides of a substantially rectangular magnetic metal plate with a press or the like into a U-shaped cross section having connection portions 921 and 922 rising from the bottom plate 920, which is electrically insulated. It is constituted by integrally molding using a resin mold molding technique or the like together with a functional resin material. The lower case 92 can also be configured by combining and integrating an electrically insulating resin material portion and a magnetic metal material portion that are preliminarily molded into a frame shape.

  The bottom plate 920 and the connecting portions 921 and 922 of the lower case 92 are made of a magnetic metal material. The bottom plate 920 is a ground G, and the connecting portions 921 and 922 function as connecting portions to the upper case 91.

  The bridging pieces 925 and 926 of the lower case 92, the high step portion 95 for arranging the input / output electrodes, and the high step portion 98 for arranging the terminating resistor are made of an electrically insulating resin material. The bridging pieces 925 and 926 connect two opposite sides of the electrically insulating resin material portion. One bridging piece 925 is formed with a concave portion 927 for placing a capacitor. A capacitor C9 is disposed in the recess 927.

  The high step portion 95 for arranging the input / output electrodes is set to a height substantially the same as the thickness of the soft magnetic substrate 4 constituting the magnetic rotor 2, and the input / output electrodes 96 are arranged on the upper surface thereof. The input / output electrode 96 is drawn out to an electrically insulating resin material portion on the outer surface side of the lower case 92 to become an input / output external terminal 97. The high stage portion 98 for terminating resistor placement is set so that when the terminating resistor R is placed, the top surface of the terminating resistor R is substantially the same height as the thickness of the soft magnetic substrate 4. Ground G is pulled out.

  The matching capacitors C1 to C3 are each formed in a rectangular parallelepiped shape, have substantially the same thickness as the thickness of the soft magnetic substrate 4, and have external electrodes C11 to C32 on both end faces in the thickness direction. The matching capacitors C1 to C3 are arranged along the side wall of the lower case 92 so that the thickness direction thereof is along the thickness direction of the soft magnetic substrate 4, and one of the external electrodes C11 to C31 is soldered to the ground G, respectively. Are connected by an attachment S.

  The termination resistor R can be constituted by a general-purpose chip resistor in which external electrodes R1 and R2 (see FIG. 5) are formed on both sides of the resistor. The termination resistor R is disposed on the high step portion 98 for terminating resistor placement, and one electrode R1 is connected to the ground G drawn to the upper surface of the high step portion 98 by soldering S.

  Next, referring to FIGS. 5 and 7, the magnetic rotor 2 includes a center electrode 3, a soft magnetic base 4, and an adhesive insulating sheet 6, and is accommodated in the lower case 92. The soft magnetic substrate 4 is preferably a soft magnetic material such as yttrium / iron / garnet (YIG). The soft magnetic substrate 4 is formed in a square shape with a side of about 2 mm and a thickness of about 0.1 to 0.5 mm.

  The center electrode 3 includes a ground portion 30 and first to third center conductors 310 to 330, and is formed of, for example, a conductor plate obtained by punching a copper plate having a thickness of about 30 μm. The ground portion 30 has a substantially rectangular shape with a side of about 2 mm, which is the same as the plate surface of the soft magnetic substrate 4, and is disposed to face the lower surface of the soft magnetic substrate 4.

  The first to third central conductors 310 to 330 are drawn from the edge of the ground portion 30 so as to intersect each other at a predetermined angle, for example, an angle of 120 degrees, on the surface of the soft magnetic substrate 4. The drawn center conductors 310 to 330 are sequentially bent on the upper surface of the soft magnetic substrate 4 via the insulating sheet 6, insulated from each other, and intersected at a predetermined angle. The insulating sheet 6 is also superimposed on the uppermost third central conductor 330. The tips of the first to third center conductors 310 to 330 are formed so as to protrude from the side edges of the upper surface of the soft magnetic substrate 4 and are terminals for connection to the matching capacitors C1 to C3, the terminating resistor R, the input / output electrode 96, and the like. Parts 311 to 331.

  The magnetic rotor 2 is disposed at the center of the lower case 92, and the ground portion 30 is connected to the ground G by soldering S. The connection terminal portions 311 and 321 of the first and second center conductors 310 and 320 are connected to the other external electrodes C12 and C22 (see FIG. 5) of the matching capacitors C1 and C2 by soldering S, and are connected. The output electrode 96 is connected by soldering S. The connection terminal portion 331 of the third central conductor 330 is connected to the other external electrode C32 of the matching capacitor C3 by soldering S and connected to the other external electrode R2 of the termination resistor R by soldering S. The

  The pressing member 7 is made of an insulating material such as engineering plastic, and includes a hollow portion 70, a frame portion 71, and a pressing piece 72. The hollow portion 70 is formed by being surrounded by a frame portion 71, and the permanent magnet 8 is disposed thereon. The pressing piece 72 is formed to protrude from the frame portion 71, receives the permanent magnet 8, and is accommodated in the lower case 92, via the terminal portions 311 to 331 of the first to third center conductors 310 to 330. The matching capacitors C1 to C3 and the terminating resistor R are pressed and positioned.

  The permanent magnet 8 is formed in a flat plate shape that can be accommodated in the cavity 70, and is disposed so as to overlap the magnetic rotor 2 and applies a DC magnetic field to the magnetic rotor 2.

  The upper case 91 is formed in a U-shaped cross-section having connecting portions 911 and 912 that fall from the top plate 910 by bending two opposing sides of a substantially square magnetic metal plate by a press or the like. The top plate 910 and the connecting portions 911 and 912 of the upper case 91 are made of a magnetic metal material.

  The upper case 91 is combined with the lower case 92 so as to overlap the permanent magnet 8 and close the opening of the lower case 92. Further, the capacitor C <b> 9 is connected by soldering S between the tip of the connection portion 911 of the upper case 91 and the bottom plate 920 of the lower case 92.

  A slight gap 901 exists between the connection portion 911 of the upper case 91 and the connection portion 921 of the lower case 92. Similarly, a slight gap 902 exists between the connection portion 912 of the upper case 91 and the connection portion 922 of the lower case 92. In order to show the detailed structure of the gap 901, the gap 901 is shown wider than the gap 902 in the drawing, but in reality, the gap 901 may be the same degree.

  The upper case 91 and the lower case 92 are magnetically coupled to the permanent magnet 8 and form case magnetic paths M1 and M2 for the permanent magnet 8 and the magnetic rotor 2. The case magnetic path M1 passes from the magnetic rotor 2 through the bottom plate 920 of the lower case 92, the connection portion 921 of the lower case 92, the connection portion 911 of the upper case 91, and the top plate 910 of the upper case 91 in order. This is a magnetic path toward the magnet 8. Similarly, in the other case magnetic path M2, the bottom plate 920 of the lower case 92, the connection portion 922 of the lower case 92, the connection portion 912 of the upper case 91, and the top plate 910 of the upper case are sequentially arranged from the magnetic rotor 2. And a magnetic path toward the permanent magnet 8.

  An electrostatic capacitance element E is inserted into the case magnetic path M1. The electrostatic capacitance element E is configured with an electrically insulating magnetic material as a capacitive layer. Specifically, in the capacitive element E, the connection portion 911 of the upper case 91 is used as one electrode, the connection portion 921 of the lower case 92 is used as the other electrode, and the metal foil laminate shown in FIG. The body 903 is sandwiched between two electrodes constituted by the connection portions 911 and 921 to constitute a capacitance layer.

  In the capacitive element E, two electrodes are insulated from each other by the metal foil laminate 903 with respect to a direct current, and have high impedance. The electrostatic capacitance element E has a relatively low impedance with respect to the high-frequency current.

  The metal foil laminate 903 is bonded to both the connection portion 911 of the upper case 91 and the connection portion 921 of the lower case 92. FIG. 8 is a partially enlarged cross-sectional view showing the sandwiched structure of the metal foil laminate 903 in an enlarged manner. The present embodiment shows an example using the metal foil laminate 903 shown in FIG. 3, and the metal foil layer 31 is bonded to the connection portion 911 of the upper case 91 via the conductive adhesive 904. Similarly, the metal foil layer 32 is bonded to the connection portion 921 of the lower case 92 via the conductive adhesive 905. The conductive adhesives 904 and 905 are made of, for example, solder.

  In the illustrated embodiment, the capacitance element E is inserted only into the case magnetic path M1 out of the two case magnetic paths M1 and M2. However, the present invention is not limited to such a configuration. Alternatively, a configuration in which capacitance elements are inserted in both of the case magnetic paths M1 and M2 may be used.

  FIG. 9 is an equivalent circuit diagram of the non-reciprocal circuit device illustrated in FIGS. In the figure, L1, L2, and L3 indicate inductance components of the first to third center conductors 310 to 330, respectively. L0 indicates the inductance component of case 9. C0 indicates the capacitance component of the case 9, and is given by the sum of the capacitance value of the capacitance element E inserted in the case magnetic path M1 and the capacitance value of the capacitor C9.

  As described with reference to FIGS. 5 and 7, in the nonreciprocal circuit device according to the present invention, the magnetic rotor 2 includes the soft magnetic base 4 and the first to third central conductors 310 to 330. , Provided inside the case 9. The permanent magnet 8 is disposed inside the case 9 so as to overlap the magnetic rotor 2 and applies a DC magnetic field to the magnetic rotor 2. The case 9 includes a magnetic metal material and forms case magnetic paths M1 and M2 for the magnetic rotor 2 and the permanent magnet 8. Accordingly, the basic structure of the non-reciprocal circuit device can be obtained.

  In general, in the non-reciprocal circuit device having such a structure, when a high-frequency signal is supplied to the center conductors 310 to 330 of the magnetic rotor 2, the inductance components L1 to L3 of the center conductors 310 to 330 and the inductance component L0 ( 9), high-frequency current may be induced in the case magnetic paths M1 and M2.

  In the present invention, a capacitance element E that has a high impedance with respect to a direct current and a relatively low impedance with respect to a high-frequency current is inserted into the case magnetic path M1. In terms of an electric circuit, the capacitance element E is inserted in series with the inductance component L0 of the case 9 with respect to the case magnetic path M1. Accordingly, as shown in FIG. 9, a resonance circuit of an inductance component L0 and a capacitance component C0 is formed, and the resonance circuit suppresses a high-frequency current in the case magnetic path M1. Therefore, the electrical characteristics such as input / output V.S.W.R., insertion loss and operating frequency bandwidth are improved.

  Furthermore, since the electrostatic capacitance element E has a configuration in which the metal foil laminate 903 is a capacitive layer, it can be inserted into the case magnetic path M1 without impairing the continuity of the case magnetic path M1. Therefore, an increase in magnetic resistance due to the insertion of the capacitive element E can be avoided. Therefore, it is not necessary to apply a large DC magnetic field, and a large permanent magnet is not necessary. Therefore, an increase in the size of the nonreciprocal circuit element can be avoided.

  The capacitance value of the capacitance element E can be adjusted by appropriately selecting the thickness of the metal foil laminate 903 and the like according to the shape, size, operating frequency band, and required characteristics of the nonreciprocal circuit element. It is determined.

  Furthermore, as shown in FIG. 3, the metal foil laminate 903 constituting the capacitance element E has polyamideimide resin layers 21 and 22 and polycarbonate polyurethane resin layers 101 and 102 adjacent to each other, Functions as a thin film dielectric layer. Of these thin film dielectric layers, the metal foil layers 31 and 32 that receive heat from the outside during soldering are adjacent to the polyamideimide resins 21 and 22 having high heat resistance. Therefore, when the metal foil laminate 903 is sandwiched between two electrodes constituted by the connecting portions 911 and 921, and the metal foil layers 31 and 32 are bonded with conductive adhesives 904 and 905 such as solder, the soldering is performed. A highly heat-resistant capacitance element E that can sufficiently withstand the temperature can be configured.

  Next, the additional effect by this embodiment is demonstrated. In the present embodiment, the metal foil layers 31 and 32 are provided on both surfaces of the metal foil laminate 903. According to such a configuration, the metal foil layers 31 and 32 can function as electrodes of the capacitance element E, and the capacitance value of the capacitance element E is given by the facing area of the metal foil layers 31 and 32. It will be. Therefore, the capacitance value of the capacitance element E can be ensured without being restricted by the facing area of the connection portion 911 of the upper case 91 and the connection portion 921 of the lower case 92. For example, even when the facing area of the connection portions 911 and 921 is small, the capacitance value of the capacitance element E can be secured by setting the facing area of the metal foil layers 31 and 32 large.

  FIG. 10 is a schematic sectional view showing another embodiment of the non-reciprocal circuit device according to the present invention, and FIG. 11 is an equivalent circuit diagram of the non-reciprocal circuit device shown in FIG. In the drawing, the same reference numerals are assigned to the same components as those shown in FIGS. 4 to 9, and the duplicate description is omitted.

  The illustrated non-reciprocal circuit device shows an example in which an isolator is configured. More specifically, the magnetic rotor 2 is disposed on the ground G of the lower case 92 via the dielectric sheet 20. Therefore, the electrical equivalent circuit can be expressed as shown in FIG. In the figure, C <b> 20 indicates a capacitance element component by the dielectric sheet 20.

  Since the nonreciprocal circuit element of this embodiment has the electrostatic capacitance element component by the dielectric sheet 20 between the magnetic rotor 2 and the ground G, an operating frequency and an applied magnetic field can be lowered simultaneously. If the operating frequency is lowered, the smaller magnetic rotor 2 can be used, and if the applied magnetic field is lowered, the smaller permanent magnet 8 can be used. Therefore, the nonreciprocal circuit element can be reduced in size.

  The present invention has been described in detail with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made by those skilled in the art based on the basic technical idea and teachings. It is self-evident that

It is sectional drawing of the lamination sheet which concerns on this invention. FIG. 2 is a diagram showing a manufacturing process of the laminated sheet shown in FIG. It is sectional drawing of the lamination sheet obtained through the manufacturing process shown in FIG. It is a perspective view which shows one Embodiment of the nonreciprocal circuit device based on this invention. FIG. 5 is an exploded perspective view of the non-reciprocal circuit device illustrated in FIG. 4. FIG. 6 is an exploded perspective view of a lower case in the non-reciprocal circuit device illustrated in FIGS. 4 and 5. FIG. 7 is a schematic cross-sectional view of the nonreciprocal circuit device illustrated in FIGS. 4 to 6. FIG. 8 is a partially enlarged view of the schematic cross-sectional view illustrated in FIG. 7. FIG. 9 is an equivalent circuit diagram of the non-reciprocal circuit device illustrated in FIGS. 4 to 8. It is typical sectional drawing which shows another embodiment of the nonreciprocal circuit device based on this invention. FIG. 11 is an equivalent circuit diagram of the nonreciprocal circuit device illustrated in FIG. 10.

Explanation of symbols

10, 101, 102 Polycarbonate polyurethane resin layer 21, 22 Polyamideimide resin layer 31, 32 Metal foil layer

Claims (6)

  The metal foil laminated body containing the part which laminated | stacked the polyamideimide resin layer and the metal foil layer in this order on both surfaces of the polycarbonate polyurethane resin layer containing an isocyanurate compound as a hardening | curing agent.   A capacitor comprising a portion in which a polyamideimide resin layer and a metal foil layer are laminated in this order on both sides of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent.   A circuit board comprising a portion in which a polyamideimide resin layer and a metal foil layer are laminated in this order on both sides of a polycarbonate polyurethane resin layer containing an isocyanurate compound as a curing agent.   An electronic component including a capacitor, wherein the capacitor is the one described in claim 2. An electronic component including a circuit board, wherein the circuit board is the one described in claim 3.
Electronic components. The electronic component according to claim 4, wherein the electronic component is a non-reciprocal circuit element.

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