JP2007079133A - Display module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a display module which can be reduced in frame size and thickness. <P>SOLUTION: The liquid crystal display module 10 is equipped with a liquid crystal panel 13 and a display panel driving circuit, and a filmy flexible board 20 connected to an end of the liquid crystal panel 13 is folded to the back side of the liquid crystal panel 13. A liquid crystal driver controller (LCDC) IC 30 as a component of the display panel driving circuit and a circuit component 21 are mounted on both the surfaces of the flexible board 20. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display module that includes a display panel drive circuit such as a display panel and a driver integrated circuit, and is formed by bending a film-like flexible substrate connected to an end of the display panel to the back side of the display panel. Specifically, the present invention relates to a display module that can reduce the frame size.

  Conventionally, in the liquid crystal display module 100, as shown in FIGS. 8 (a) and 8 (b), a driver integrated as a semiconductor device (component) by a COG (Chip On Glass) method at the end of the TFT glass 101 of the liquid crystal panel 110. A circuit (IC: Integrated Circuit) 102 is mounted and bonded. In this liquid crystal display module 100, a flexible substrate (FPC: Flexible Printed Circuits) 103 is connected to the outermost portion of the TFT glass 101, and a circuit component 104 mounted on the back side of the flexible substrate 103 is placed on the back side. Used by bending.

In addition, the liquid crystal display module 100 is provided with an LED (Light Emitting Diode) 105 and a light guide plate 106 that give light to the liquid crystal panel 110.
Japanese Patent Laid-Open No. 7-111278 (published on April 25, 1995)

  However, in the conventional liquid crystal display module 100, a driver integrated circuit (IC) 102 is mounted and bonded to the end of the TFT glass 101, and a flexible substrate (FPC: Flexible) is attached to the end of the TFT glass 101. Since Printed Circuits) 103 is connected, as shown in FIG. 8A, there is a problem that the so-called frame size AL cannot be reduced.

  Further, when a driver integrated circuit (IC) 102 is mounted on the end of the TFT glass 101, an anisotropic conductive adhesive (ACF) 107 is used to form a driver integrated circuit (IC: Integrated Circuit). Integrated Circuit) 102 is pressure-bonded to the TFT glass 101. Therefore, since the TFT glass 101 has a strength that can withstand this pressure bonding, it must be thickened. That is, in order to ensure the strength of the liquid crystal display module 100, the constituent members themselves are thick, which is against the thinning of the module. Specifically, the thickness of a conventional driver integrated circuit (IC) 102 is as thin as 0.4 mm.

  In addition, the fixing method of the flexible substrate may cause a deterioration in display quality such as a wave in the liquid crystal panel.

  Patent Document 1 discloses a device in which a driver integrated circuit is soldered to an insulating wiring board, but this technique is generally used for a large-sized liquid crystal display device.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a display module capable of reducing the frame size and reducing the thickness.

  In order to solve the above problems, the display module of the present invention includes a display panel and a display panel driving circuit, and a film-like flexible substrate connected to an end of the display panel is bent to the back side of the display panel. In the display module, the display panel drive circuit components are mounted on both sides of the flexible substrate. Note that the components of the display panel drive circuit include, for example, a semiconductor integrated circuit such as a liquid crystal controller IC or a power supply IC, and a circuit component such as a capacitor or a resistor.

  2. Description of the Related Art Conventionally, for example, a semiconductor integrated circuit such as a liquid crystal controller IC in a display panel driving circuit is COG (Chip On Glass) mounted at an end of a display panel in a liquid crystal display module, and an edge of the display panel A flexible substrate was connected to and bent inside. In addition, display panel drive circuit components are mounted only on one side of the flexible substrate. As a result, the frame size L cannot be reduced.

  Therefore, in the present invention, parts of the display panel drive circuit are mounted on both surfaces of the flexible substrate. That is, for example, a semiconductor integrated circuit such as a liquid crystal controller IC conventionally mounted with COG is mounted on the surface of the flexible substrate, and a circuit component such as a capacitor or a resistor is mounted on the back surface of the flexible substrate.

  Accordingly, since a semiconductor integrated circuit such as a liquid crystal controller IC that has been conventionally COG-mounted on the end of the display panel is mounted on the surface of the flexible substrate, a space for mounting the semiconductor integrated circuit provided on the end of the display panel. Is no longer necessary. Therefore, the frame size of the display module can be reduced.

  Conventionally, when a semiconductor integrated circuit such as a liquid crystal controller IC is COG-mounted on an end of a display panel, an anisotropic conductive adhesive (ACF) is used. In this case, since the semiconductor integrated circuit is pressure-bonded, the display panel and the semiconductor integrated circuit cannot be formed thin in order to ensure the pressure-bonding strength.

  However, in the present invention, since there is no semiconductor integrated circuit such as a liquid crystal controller IC that protrudes from the surface of the display panel, the display module can be formed thinner by the protrusion.

  Therefore, it is possible to provide a display module capable of reducing the frame size and reducing the thickness.

  In the display module of the present invention, a semiconductor integrated circuit, which is a component of the display panel drive circuit, is mounted on the first surface of the flexible substrate facing the display panel when the flexible substrate is bent to the back side of the display panel. On the other hand, the semiconductor, which is a component of the display panel driving circuit, is formed on the second flexible substrate surface opposite to the first flexible substrate surface facing the display panel when the flexible substrate is bent to the back side of the display panel. It is preferable that circuit components other than the integrated circuit are mounted.

  According to the above invention, the semiconductor integrated circuit which is a component of the display panel driving circuit is mounted on the first surface of the flexible substrate facing the display panel when the flexible substrate is bent to the back side of the display panel. On the other hand, on the second surface of the flexible substrate opposite to the first surface of the flexible substrate facing the display panel when the flexible substrate is bent to the back side of the display panel, other than the semiconductor integrated circuit that is a component of the display panel driving circuit The circuit parts are mounted.

  Specifically, the display panel drive circuit components can be mounted on both sides of the flexible substrate, such as mounting a semiconductor integrated circuit on the front surface of the flexible substrate and mounting circuit components on the back surface of the flexible substrate. it can.

  In addition, conventionally, circuit components are mounted only on one side of a flexible substrate and the back surface thereof is in a flat state, whereas in the present invention, the back surface of the flexible substrate that has conventionally been an empty space is used. A semiconductor integrated circuit is mounted. For this reason, it is not necessary to enlarge the flexible substrate in order to secure a space for mounting the semiconductor integrated circuit.

  In the display module of the present invention, the semiconductor integrated circuit is mounted on a semiconductor integrated circuit substrate, and the external connection terminal of the semiconductor integrated circuit is connected to a through electrode penetrating the semiconductor integrated circuit substrate. The through electrode and the flexible substrate are preferably soldered.

  That is, when a semiconductor integrated circuit such as a liquid crystal controller IC is COG mounted on the end of the display panel, an anisotropic conductive adhesive (ACF) is generally used. Also in the present invention, it is possible to pressure-bond to one side of the flexible substrate using an anisotropic conductive adhesive (ACF). However, by doing so, the strength of the semiconductor integrated circuit that can withstand pressure bonding is required, and thus the semiconductor integrated circuit cannot be thinned.

  On the other hand, in the present invention, the semiconductor integrated circuit is soldered to the flexible substrate using the through electrode. That is, since soldering is not used for pressure bonding, the strength of the semiconductor integrated circuit need not be obtained. Therefore, since the semiconductor integrated circuit can be formed thin, the thickness of the display module can be further reduced.

  In the display module of the present invention, it is preferable that the semiconductor integrated circuit has a thickness of 0.2 mm or less.

  According to the above invention, the thickness of the semiconductor integrated circuit is set to 0.2 mm or less as a result of solder mounting the semiconductor integrated circuit to the flexible substrate using the through electrode. Therefore, the thickness of the display module can be surely reduced.

  In the display module of the present invention, the display panel drive circuit component is mounted on the semiconductor integrated circuit substrate on the opposite side of the semiconductor integrated circuit mounting side, and the flexible substrate has the display panel drive. It is preferable that a through hole is provided through the protruding portion of the circuit component.

  According to the above invention, the semiconductor integrated circuit is mounted on the surface of the semiconductor integrated circuit substrate, and the components of the display panel drive circuit are mounted on the back surface of the semiconductor integrated circuit substrate. At this time, since the flexible substrate exists on the back surface of the semiconductor integrated circuit substrate, it interferes with the components of the display panel drive circuit. Therefore, in the present invention, the flexible substrate is provided with a through hole through which the protruding portion of the component of the display panel drive circuit passes. Thereby, when mounting the components of the display panel drive circuit on the back surface of the semiconductor integrated circuit substrate, the flexible substrate does not get in the way.

  Moreover, by doing in this way, the height of a circuit component is measured from a semiconductor integrated circuit board about a high circuit component. Therefore, the protrusion height from the flexible substrate is smaller than mounting circuit components on the flexible substrate.

  Therefore, the thickness of the display module can be further reduced.

  In the display module of the present invention, it is preferable that a spacer for ensuring a height space of a semiconductor integrated circuit mounted on the flexible substrate is provided between the display panel and the flexible substrate.

  Thus, by supporting the space between the display panel and the flexible substrate with the spacer, it is possible to secure a height space of the semiconductor integrated circuit mounted on the flexible substrate and prevent a load from being applied to the semiconductor integrated circuit. Therefore, the semiconductor integrated circuit can be further thinned.

  In the display module of the present invention, it is preferable that the display panel includes a liquid crystal display element.

  According to the above invention, since the display panel includes the liquid crystal display element, the display module is a liquid crystal display module. Therefore, it is possible to provide a liquid crystal display module capable of reducing the frame size and reducing the thickness.

  In the display module of the present invention, it is preferable that a light source of the backlight system is further mounted on the second surface of the flexible substrate.

  According to said invention, the light source of a backlight system is further mounted in the flexible substrate 2nd surface. Therefore, this liquid crystal display module is a transmissive liquid crystal display module employing a backlight system. In the present invention, the light source of the backlight system is mounted on the second surface of the flexible substrate, and the power source mounted on the flexible substrate can be easily used as the power source of the light source.

  In the display module of the present invention, it is preferable that the liquid crystal display element has a reflector.

  According to said invention, the liquid crystal display element has a reflecting plate. That is, the display module of the present invention is a reflective liquid crystal display module. Therefore, it is possible to provide a reflective liquid crystal display module that can reduce the frame size and reduce the thickness.

  In the display module of the present invention, it is preferable that the display panel includes a light emitting display element.

  According to the above invention, the display panel includes the light emitting display element. That is, the display module of the present invention is a light emitting element display module. Therefore, it is possible to provide a light emitting element display module that can reduce the frame size and reduce the thickness.

  As described above, the display module of the present invention has the display panel drive circuit components mounted on both sides of the flexible substrate.

  Therefore, since a semiconductor integrated circuit such as a liquid crystal controller IC that has been conventionally COG mounted on the end of the display panel is mounted on one surface of the flexible substrate, the semiconductor integrated circuit provided on the end of the display panel Space to install becomes unnecessary. Therefore, the frame size can be reduced.

  Further, in the present invention, since there is no semiconductor integrated circuit protruding on the surface of the display panel, the display module can be formed thinner by the protruding amount.

  Therefore, it is possible to provide a display module capable of reducing the frame size and reducing the thickness.

[Embodiment 1]
An embodiment of the present invention will be described with reference to FIGS. 1 to 5 as follows. Note that the liquid crystal display module of this embodiment is used for small electronic devices such as mobile phones, pagers, and game devices.

  A liquid crystal display module 10 as a display module of the present embodiment includes a light guide plate as a backlight system via a reflection sheet 2 on the upper side of the back case 1 as shown in FIGS. 3 and an LED (Light Emitting Diode) 4 as a light source of the backlight system.

  On the light guide plate 3, a TFT (Thin Film Transistor) glass substrate sandwiched between the back deflection plate 8 and the front deflection plate 9 via the diffusion sheet 5, the first optical sheet 6 and the second optical sheet 7. 11 and a color filter (CF) glass substrate 12 are provided as a display panel.

  The liquid crystal display module 10 of the present embodiment is mounted with CG silicon (Continuous Grain Silicon), and a full monolithic integrated driver and pixel TFT for driving the panel. It is a panel. CG silicon is a panel that can form a circuit that operates at high speed by adding a metal additive to a conventional p-Si film, promoting crystallization, and improving TFT characteristics.

  A liquid crystal layer (not shown) is sandwiched between the TFT glass substrate 11 and the color filter glass substrate 12 together with pixel electrodes and the like. The TFT glass substrate 11 is formed longer than the color filter glass substrate 12, and a plurality of external connection terminals are provided side by side at the end of a wiring pattern (not shown) extending from the liquid crystal panel 13 at the end thereof. A flexible substrate (FPC: Flexible Printed Circuits) 20 is soldered to the external connection terminals.

  The flexible substrate 20 is made of a thin film tape made of polyimide resin and has flexibility. Here, the flexible substrate 20 made of the polyimide resin is bent in a U-shape on the back side of the TFT glass substrate 11 at the end of the liquid crystal display module 10, and extends below the liquid crystal panel 13. Yes.

  A spacer 15 is provided inside the U-shaped bent part, and the distance between the TFT glass substrate 11 and the flexible substrate 20 is kept constant. A spacer 16 is also provided between the flexible substrate 20 and the back case 1 to keep the distance between the flexible substrate 20 and the back case 1 constant. Therefore, the thickness of the liquid crystal display module 10 can be kept constant even when pressure is applied between the front and back surfaces of the liquid crystal display module 10 due to the presence of the spacers 15 and 16.

  Here, in the present embodiment, the circuit component 21 is mounted on the surface of the flexible substrate 20 on the back case 1 side, while the liquid crystal driver controller (LCDC: Liquid) is mounted on the surface of the flexible substrate 20 on the TFT glass substrate 11 side. A semiconductor integrated circuit such as a crystal driver controller (IC30) is mounted.

  Specifically, in the present embodiment, as shown in FIG. 3A, a circuit component 21 such as a resistor and a capacitor and the LED 4 are formed on one surface (second surface) of the flexible substrate 20. It is installed. Further, as shown in FIG. 3B, the liquid crystal driver controller (LCDC) IC 30 and the power supply circuit (DCDC) IC 22 are mounted on the back surface which is the other surface (first surface) of the flexible substrate 20. Both sides are mounted on the flexible substrate 20.

  The flexible substrate 20 extends at a right angle from the side, and an input connector 23 is provided at the end thereof.

  The liquid crystal driver controller (LCDC) IC 30 is mounted on a CSP as shown in FIGS. 4A and 4B, and solder bumps, gold bumps, etc. are formed to connect to a substrate on a wafer such as a controller IC. The method of letting you connect is adopted.

  Specifically, the liquid crystal driver controller (LCDC) IC 30 includes an integrated circuit (IC) 32 on the upper side of the semiconductor integrated circuit substrate 31 and a pad electrode 33 on the lower side of the semiconductor integrated circuit substrate 31. Yes. That is, an external connection terminal (not shown) of the integrated circuit (IC) 32 is connected to the pad electrode 33 on the back surface through a through electrode (not shown) that penetrates the semiconductor integrated circuit substrate 31. Therefore, the pad electrode 33 of the semiconductor integrated circuit substrate 31 to which the integrated circuit (IC) 32 is attached is connected to a terminal (not shown) of the flexible substrate 20 by soldering.

  With the liquid crystal display module 10 having this configuration, as shown in FIG. 1A, the frame size L can be made smaller than the frame size AL in the conventional liquid crystal display module 100 shown in FIG. It becomes. Also, since the liquid crystal driver controller (LCDC) IC 30 is soldered to the flexible substrate 20, the liquid crystal driver controller (LCDC) IC 30 does not require crimping strength, and is, for example, 0.2 mm or less, preferably 0.1 mm or less. Can be thinned.

  As described above, in this embodiment, high-density mounting is achieved by using an IC such as a liquid crystal driver controller (LCDC) IC 30 having a thickness of 0.2 mm or less as a soldering type via the flexible substrate 20 as an intermediate substrate. Yes. Then, the flexible substrate 20 is arranged at the center of the liquid crystal display module 10 in the thickness direction, and the circuit component 21 that is a driving component such as a capacitor and the IC are optimally arranged.

  This makes it possible to reduce the thickness of the liquid crystal driver controller (LCDC) IC 30 that is vulnerable to external impacts to 0.2 mm or less, and to reduce the total thickness of the liquid crystal display module 10 to 2 mm or less. Further, since the mountable area of the flexible substrate 20 can be utilized to the maximum to enable high-density mounting of the drive components, the outer shape of the flexible substrate 20 can be reduced, and the outer shape of the liquid crystal display module 10 has also been conventionally used. It is possible to make it smaller.

  Furthermore, the space between the upper liquid crystal panel 13 and the first optical sheet 6 and the second optical sheet 7 of the backlight can be kept constant, and stable performance can be maintained without impairing display quality.

  Further, disassembling the liquid crystal display module 10 of the present embodiment can facilitate separation and collection because structural components can be disassembled simultaneously by reflow.

  As described above, in the liquid crystal display module 10 of the present embodiment, the components of the display panel drive circuit are mounted on both surfaces of the flexible substrate 20. That is, a conventional semiconductor integrated circuit such as a liquid crystal driver controller (LCDC) IC 30 mounted with COG is mounted on the surface of the flexible substrate 20, and a circuit component 21 such as a capacitor or a resistor is mounted on the back surface of the flexible substrate 20. Yes.

  Accordingly, a semiconductor integrated circuit such as a liquid crystal driver controller (LCDC) IC 30 that has been conventionally COG mounted on the end of the liquid crystal panel 13 is mounted on the surface of the flexible substrate 20, and thus is provided on the end of the liquid crystal panel 13. In addition, a space for mounting the liquid crystal driver controller (LCDC) IC 30 becomes unnecessary. Therefore, the frame size L of the liquid crystal display module 10 can be reduced.

  Conventionally, when a semiconductor integrated circuit such as a liquid crystal driver controller (LCDC) IC 30 is COG-mounted on the end of the liquid crystal panel 13, an anisotropic conductive adhesive (ACF) has been used. In this case, since the semiconductor integrated circuit is pressure-bonded, the display panel and the semiconductor integrated circuit cannot be formed thin in order to ensure the pressure-bonding strength.

  However, in this embodiment, since there is no semiconductor integrated circuit such as the liquid crystal driver controller (LCDC) IC 30 protruding on the surface of the liquid crystal panel 13, the liquid crystal display module 10 can be formed thinner by the protruding portion.

  Therefore, it is possible to provide the liquid crystal display module 10 in which the frame size L can be reduced and the thickness can be reduced.

  In the liquid crystal display module 10 of the present embodiment, a semiconductor integrated circuit such as a liquid crystal driver controller (LCDC) IC 30 is mounted on the surface of the flexible substrate 20, and a circuit component 21 is mounted on the back surface of the flexible substrate 20. Specifically, the display panel drive circuit components are mounted on both surfaces of the flexible substrate 20.

  Conventionally, the circuit component 21 is mounted only on one side surface of the flexible substrate 20 and the back surface thereof is in a flat state. On the other hand, in the present embodiment, the back surface of the flexible substrate 20 that has conventionally been an empty space. A liquid crystal driver controller (LCDC) IC 30 is mounted using Therefore, it is not necessary to enlarge the flexible substrate 20 in order to secure a space for mounting the liquid crystal driver controller (LCDC) IC 30.

  Further, in the liquid crystal display module 10 of the present embodiment, the liquid crystal driver controller (LCDC) IC 30 is soldered to the flexible substrate 20 using through electrodes and pad electrodes 33 (not shown). That is, since pressure bonding is not performed in the mounting by soldering, it is not necessary to obtain the strength from the liquid crystal driver controller (LCDC) IC 30. Therefore, since the liquid crystal driver controller (LCDC) IC 30 can be formed thin, the thickness of the liquid crystal display module 10 can be further reduced.

  Further, in the liquid crystal display module 10 of the present embodiment, the liquid crystal driver controller (LCDC) IC 30 is soldered and mounted on the flexible substrate 20 using the through electrodes, so that the thickness of the liquid crystal driver controller (LCDC) IC 30 is reduced to 0. .2 mm or less, preferably 0.1 mm or less. Therefore, the thickness of the liquid crystal display module 10 can be surely reduced.

  In the liquid crystal display module 10 of the present embodiment, a spacer 15 is provided between the liquid crystal panel 13 and the flexible substrate 20. Thereby, the height space of the liquid crystal driver controller (LCDC) IC 30 mounted on the flexible substrate 20 can be secured, and the liquid crystal driver controller (LCDC) IC 30 can be prevented from being loaded. Therefore, the liquid crystal driver controller (LCDC) IC 30 can be further thinned.

  In the present embodiment, since the liquid crystal panel 13 includes a liquid crystal display element, the display module is the liquid crystal display module 10. Therefore, it is possible to provide the liquid crystal display module 10 in which the frame size L can be reduced and the thickness can be reduced.

  The liquid crystal display module 10 of the present embodiment is a transmissive liquid crystal display module, and an LED 4 of a backlight system is further mounted on one surface of the flexible substrate 20. Therefore, the power source mounted on the flexible substrate 20 can be easily used as the power source of the LED 4.

  In the present embodiment, the liquid crystal display module 10 has been described as a transmissive liquid crystal display module by a backlight system using the LED 4 as a light source. However, in the present invention, the present invention is not limited to this, and the reflective liquid crystal display module 10 is not limited thereto. The present invention can also be applied to a liquid crystal display module.

  In the case of a reflective liquid crystal display module, as shown in FIG. 5, the pixel electrode 11a is made of, for example, aluminum (Al). Thereby, the light 18 from the outside is reflected by the pixel electrode 11a.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIGS. Configurations other than those described in the present embodiment are the same as those in the first embodiment. For convenience of explanation, members having the same functions as those shown in the drawings of the first embodiment are given the same reference numerals, and explanation thereof is omitted.

  In the liquid crystal display module 10 of the first embodiment, the circuit component 21 is mounted on the flexible substrate 20, but in the liquid crystal display module 40 of the present embodiment, as shown in FIG. The difference lies in that a through-hole 20a is formed in the flexible substrate 20 and the circuit component 21 is fitted into the through-hole 20a while being mounted on the circuit board 31.

  That is, in the liquid crystal display module 40 of the present embodiment, the circuit component 21 is attached to the back surface of the semiconductor integrated circuit substrate 31 to which the integrated circuit (IC) 32 is attached. 7A and 7B, the circuit components 21 are not arranged directly under the integrated circuit (IC) 32 but are arranged in a line with each other in a plane. As a result, contact between the pad electrode 33 of the integrated circuit (IC) 32 and the circuit component 21 is avoided.

  As described above, in the liquid crystal display module 40 of the present embodiment, the liquid crystal driver controller (LCDC) IC 30 is mounted on the front surface of the semiconductor integrated circuit substrate 31, and the circuit component 21 is mounted on the back surface of the semiconductor integrated circuit substrate 31. At this time, since the flexible substrate 20 exists on the back surface of the semiconductor integrated circuit substrate 31, the circuit component 21 is obstructed. Therefore, in the present embodiment, the flexible substrate 20 is provided with a through hole 20a through which the protruding portion of the circuit component 21 passes. Thereby, when the circuit component 21 is mounted on the back surface of the semiconductor integrated circuit substrate 31, the flexible substrate 20 does not get in the way.

  Moreover, by doing in this way, the height of the circuit component 21 from the semiconductor integrated circuit board 31 is measured for the circuit component 21 having a high height. Therefore, the protrusion height from the flexible substrate 20 is smaller than mounting circuit components directly on the flexible substrate 20. Therefore, the thickness of the liquid crystal display module 40 can be further reduced.

  In the present embodiment, since the liquid crystal panel 13 includes a liquid crystal display element, the display module is the liquid crystal display module 4. Therefore, it is possible to provide the liquid crystal display module 40 that can reduce the frame size L and can be thinned.

  Further, the liquid crystal display module 40 of the present embodiment is a transmissive liquid crystal display module, and an LED 4 of the backlight system is further mounted on one surface of the flexible substrate 20. Therefore, the power source mounted on the flexible substrate 20 can be easily used as the power source of the LED 4.

  In the first and second embodiments, the liquid crystal display modules 10 and 40 using liquid crystal display elements have been described as display modules. However, the present invention is not limited to this, and for example, the display module does not have a backlight system. For example, the present invention can be applied to a light emitting element display module using a light emitting element such as EL (Electro Luminescence).

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Such embodiments are also included in the technical scope of the present invention.

  The present invention relates to a display module that includes a display panel drive circuit such as a display panel and a driver integrated circuit, and is formed by bending a film-like flexible substrate connected to an end of the display panel to the back side of the display panel. . The display module is, for example, a display module for a mobile phone, a car navigation, a personal digital assistant (PDA), a word processor, a personal computer, a television, or a monitor. In addition to the liquid crystal display module, the display module can be applied to a light emitting element display module.

  As a liquid crystal display module, it can be used for an active matrix type liquid crystal display module regardless of a transmissive type or a reflective type, and an electrophoretic display, a twist ball type display, a reflective type display using a fine prism film, The present invention can be applied to a liquid crystal display module using a light modulation element such as a digital mirror device.

  The light-emitting element display module can be used for a light-emitting element display module using a light-emitting element with variable emission luminance, such as an organic EL light-emitting element, an inorganic EL light-emitting element, and an LED (Light Emitting Diode).

(A) is a top view which shows one Embodiment of the liquid crystal display module in this invention, (b) is sectional drawing which shows the structure of the principal part of the said liquid crystal display module. It is a perspective view which shows the structure of the principal part of the said liquid crystal display module. (A) is a top view which expands and shows the structure of the flexible substrate of the said liquid crystal display module, (b) is a bottom view which expands and shows the structure of the flexible substrate of the said liquid crystal display module. (A) is a top view which shows the structure of the integrated circuit (IC) of the said liquid crystal display module, (b) is a front view which shows the structure of the integrated circuit (IC) of the said liquid crystal display module. It is sectional drawing which shows the said liquid crystal display module of a reflection type. (A) is a top view which shows the structure of the integrated circuit (IC) of the said liquid crystal display module, (b) is a bottom view which shows the structure of the integrated circuit (IC) of the said liquid crystal display module. It is principal part sectional drawing which shows other embodiment of the liquid crystal display module in this invention. (A) is a top view which shows the conventional liquid crystal display module, (b) is sectional drawing which shows the structure of the principal part of the said liquid crystal display module.

Explanation of symbols

1 Back Case 2 Reflective Sheet 3 Light Guide Plate 4 LED
DESCRIPTION OF SYMBOLS 5 Diffusion sheet 6 1st optical sheet 7 2nd optical sheet 8 Back deflection plate 9 Front deflection plate 10 Liquid crystal display module 11 TFT glass substrate 12 Color filter glass substrate 13 Liquid crystal panel (display panel)
15 Spacer 16 Spacer 20 Flexible substrate 21 Circuit component 22 Power supply circuit (DCDC) IC
23 Input connector 30 LCD driver controller (LCDC) IC
31 Semiconductor Integrated Circuit Board 32 Integrated Circuit (IC)
33 Pad electrode 40 Liquid crystal display module

Claims (10)

In a display module comprising a display panel and a display panel drive circuit, and a film-like flexible substrate connected to the end of the display panel is bent to the back side of the display panel.
A display module, wherein the display panel drive circuit components are mounted on both sides of the flexible substrate. On the first surface of the flexible substrate facing the display panel when the flexible substrate is bent to the back side of the display panel, a semiconductor integrated circuit that is a component of the display panel drive circuit is mounted,
Other than the semiconductor integrated circuit, which is a component of the display panel driving circuit, on the second surface of the flexible substrate opposite to the first surface of the flexible substrate facing the display panel when the flexible substrate is bent to the back side of the display panel The display module according to claim 1, wherein the circuit component is mounted. The semiconductor integrated circuit is mounted on a semiconductor integrated circuit substrate,
3. The display module according to claim 2, wherein the external connection terminal of the semiconductor integrated circuit is connected to a through electrode penetrating the semiconductor integrated circuit substrate, and the through electrode and the flexible substrate are soldered. .   The display module according to claim 3, wherein the semiconductor integrated circuit has a thickness of 0.2 mm or less. The display panel drive circuit component is mounted on the side opposite to the semiconductor integrated circuit mounting side of the semiconductor integrated circuit substrate,
The display module according to claim 3, wherein the flexible substrate is provided with a through hole through which a protruding portion of a component of the display panel drive circuit passes.   The spacer which ensures the height space of the semiconductor integrated circuit mounted in the said flexible substrate is provided between the said display panel and the flexible substrate in any one of Claims 1-5 characterized by the above-mentioned. Display module described.   The display module according to claim 1, wherein the display panel includes a liquid crystal display element.   The display module according to claim 7, wherein a light source of the backlight system is further mounted on the second surface of the flexible substrate.   The display module according to claim 7, wherein the liquid crystal display element includes a reflector.   The display module according to claim 1, wherein the display panel includes a light emitting display element.

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