JP2007066951A - LAMINATE PROCESSING METHOD, LAMINATE, DEVICE MANUFACTURING METHOD, DEVICE, INKJET RECORDING APPARATUS - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate processing method, a laminate, a device, and an ink jet recording apparatus that can be divided even when a part of a substrate has a gap.
A processing method of a stacked body P is a processing method of a stacked body P composed of a plurality of substrates P1, P2, and P3, and the stacked body P is a gap among the plurality of substrates P1, P2, and P3. A substrate P1 having a portion 11a, a step of disposing the functional liquid L1 in the gap portion 11a by a droplet discharge method, a step of solidifying the functional liquid L1 to form the filling member 11, and a filling member A laser beam irradiation step of irradiating the laser beam 5 so as to pass through 11 and forming the material alteration portion 7 in the stacked body P.
[Selection] Figure 6

Description

  The present invention relates to a laminate processing method, a laminate, a device manufacturing method, a device, and an inkjet recording apparatus.

  Conventionally, when dividing a silicon single crystal substrate, the substrate is irradiated with laser light to form a modified region portion by multiphoton absorption inside the substrate, and the substrate is cut and divided by applying external stress to the substrate. There was a way.

  For example, as disclosed in Patent Document 1, in the case of a substrate in which an electronic device or an electrode pattern is formed on the front surface and an adhesive sheet is attached to the back surface, a laser beam having transparency to the adhesive sheet Has been proposed to form a modified region portion by multiphoton absorption inside the substrate along the planned cutting line of the substrate. Further, as disclosed in Patent Document 2, a modified region portion by multiphoton absorption is formed inside the substrate along a planned cutting line of the substrate (processing object), and the laser beam is focused. There has also been proposed a method of forming modified region portions by multiphoton absorption so as to be aligned along the incident direction by changing the positions of the points.

JP 2002-192367 A JP 2002-205180 A

  However, in these methods, in the case of a laminated body in which a plurality of substrates are laminated, if there is a substrate having a void portion in a part of the substrate constituting the laminated body, the laser light irradiated to the void portion is Due to the influence, the laser beam is refracted in a direction different from the predetermined direction, so that the laser beam cannot be focused on the predetermined region of the laminate. If the laser beam cannot be focused on a predetermined region of the laminate, it is difficult to form a modified region portion in the laminate. If the modified region portion cannot be formed in the laminate, the laminate cannot be cut or divided even when external stress is applied. That is, when there is a substrate having a gap in a part of the substrate constituting the laminate, it is difficult to cut and divide the laminate.

  An object of the present invention is to provide a method for processing a laminate, a laminate, a device, and an ink jet recording apparatus that can be easily divided even if there is a gap in a part of a substrate.

  The method for processing a laminate of the present invention is a method for processing a laminate comprising a plurality of substrates, and the laminate includes a substrate having a gap portion among the plurality of substrates, and the gap A step of disposing a functional liquid on the portion by a droplet discharge method, a step of solidifying the functional liquid to form a filling member, and irradiating the laser beam so as to pass through the filling member, And a laser beam irradiation step for forming a material altered portion.

  According to the present invention, even if there is a substrate having a gap in a part of the substrate constituting the laminate, the laminate is formed after filling the gap with the filling member so as to pass through the filling member. Since the laser beam is irradiated to the layered material, the material altered portion can be formed in the entire depth direction of the laminate. If the material altered portion can be formed in the laminate, the laminate can be easily cut and divided along the material altered portion by applying external stress.

  In the laminate processing method of the present invention, in the step of forming the filling member, it is desirable that the refractive index of the filling member is equal to or higher than the refractive index of the substrate.

  According to the present invention, since the refractive index of the filling member is equal to or higher than that of the substrate, the laser beam is easily collected inside the laminate without being scattered when the laser beam is irradiated. A material-affected portion can be easily formed in the entire depth direction.

  The method for processing a laminate of the present invention is a method for processing a laminate comprising a plurality of substrates, and the laminate includes a substrate having a gap portion among the plurality of substrates, and the gap A step of disposing a droplet by a droplet discharge method, and a laser beam irradiation step of irradiating a laser beam so as to pass through the droplet to form a material altered portion in the laminate. It is characterized by that.

  According to the present invention, even if there is a substrate having a gap in a part of the substrate constituting the laminate, the laminate is formed after filling the void in the substrate and then passes through the droplet. Since the laser beam is irradiated as described above, the material altered portion can be formed in the laminate. If the material altered portion can be formed in the laminate, the laminate can be easily cut and divided along the material altered portion by applying external stress.

  In the laminate processing method of the present invention, it is desirable that the refractive index of the droplets is 1.3 or more in the step of arranging the droplets.

  According to the present invention, when the refractive index of the droplet is 1.3 or more, the refractive index is higher than that of air, so that processing can be performed to a deeper position. The material altered portion can be formed in the entire depth direction.

  In the laminate processing method of the present invention, the substrate is made of a material made of silicon single crystal, and in the laser light irradiation step, the stack is irradiated with a laser beam condensed by a condensing element. The material altered portion is formed.

  According to this invention, since the laser beam is condensed by the light condensing element and irradiated onto the laminated body, the material altered portion can be formed at a predetermined position of the laminated body.

  In the laminated body processing method of the present invention, in the laser light irradiation step, the laser light is a YAG laser, and it is desirable to form the material altered portion by irradiating a fundamental wave of the YAG laser.

  According to the present invention, the material altered portion can be formed at a predetermined position of the multilayer body by irradiating the multilayer body with the fundamental wave of the YAG laser.

  In the method for processing a laminate according to the present invention, in the laser beam irradiation step, the laser beam is branched into a plurality of beams by a diffractive optical element, and the plurality of beams are irradiated to form the material altered portion. desirable.

  According to the present invention, the laser beam is split into a plurality of beams by the diffractive optical element, so that the beam is split. By irradiating the split beam with the split beam, a plurality of material altered portions are formed in the stack. Can be formed.

  The laminate of the present invention is a laminate in which a plurality of substrates are laminated, and among the plurality of substrates, a functional liquid is disposed by a droplet discharge method in a substrate having a void portion, and the void portion, A filling member formed by solidifying the functional liquid; and a material alteration portion formed by altering a material constituting the laminate by irradiating a laser beam so as to pass through the filling member. It is characterized by.

  According to the present invention, even if there is a substrate having a gap in a part of the substrate constituting the laminate, the laminate is formed after filling the gap with the filling member so as to pass through the filling member. Since the laser beam is irradiated to the layered material, the material altered portion can be formed in the laminate. A laminate that can be easily cut and divided can be provided. Moreover, since the functional liquid is disposed by the droplet discharge method, even if the volume of the gap is changed, it is simple because only the amount of the functional liquid needs to be changed.

  The laminate of the present invention is a laminate in which a plurality of substrates are laminated, and among the plurality of substrates, a substrate having a void portion, a droplet disposed in the void portion by a droplet discharge method, and And a material alteration part formed by irradiating a laser beam so as to pass through the droplets and altering the material constituting the laminate.

  According to this invention, even if there is a substrate having a gap in a part of the substrate constituting the laminate, the laser is injected so that the laminate is formed after the liquid is injected into the gap and this liquid is passed through. Since the light is irradiated, the material altered portion can be formed in the laminate. A laminate that can be easily cut and divided can be provided. In addition, since the liquid droplets arranged in the gap portion flow out of the laminated body after dividing the laminated body, it is not necessary to remove them. Further, since the droplets are arranged by the droplet discharge method, even if the volume of the gap is changed, it is simple because only the amount of the droplets needs to be changed.

  The device manufacturing method of the present invention is characterized in that a device is formed by the laminate processing method described above.

  According to this invention, since the device is formed by the above-described processing method, even if there is a substrate having a gap in a part of the substrate constituting the laminate, such as an inkjet head as a device, the inside of the laminate Since the material altered portion is formed by irradiating the laser beam to the laminated body, the laminate can be easily cut and divided. In addition, since the inkjet head is obtained by irradiating the laminated body with laser light and cutting and dividing the laminated body, no chips are generated at the time of cutting. There is no clogging. Since the laser beam is condensed and the laminate is divided, the cutting width necessary for the division can be narrowed, so that the division property is improved. That is, since the number of ink-jet heads can be increased, the productivity of the ink-jet head can be improved.

  A device of the present invention is formed by the device manufacturing method described above.

  According to the present invention, a device such as an ink jet head can be provided even if there is a substrate having a gap in a part of the substrate constituting the laminate. In addition, as other devices, it is possible to cut and divide a laminated body such as a semiconductor element, a liquid crystal display device, and a piezoelectric element that requires high-precision bonding of substrates.

  The ink jet recording apparatus of the present invention is equipped with an ink jet head as the above-described device.

  According to this invention, since the ink jet head with improved quality without chip clogging is mounted in the nozzle hole, an ink jet recording apparatus with improved ejection performance can be provided.

Hereinafter, embodiments of the method for processing a laminate and the laminate of the present invention will be described in detail with reference to the accompanying drawings. Before describing the characteristic configuration and method of the present invention, first, a substrate, a functional liquid, a droplet discharge method, and a droplet discharge device used in the droplet discharge method will be described sequentially.
<Substrate>

Various substrates such as a silicon wafer, quartz glass, glass, a plastic film, and a metal plate can be used as the substrate that can be used in the present invention. In addition, a substrate in which a semiconductor film, a metal film, a dielectric film, an organic film, or the like is formed as a base layer on the surface of these various material substrates may be used as a substrate. Here, silicon was used as the base material.
<Functional liquid>

  First, the functional liquid will be described. The functional liquid that is a liquid material is a dispersion liquid in which fine particles are dispersed in a dispersion medium. In this embodiment, germanium having a refractive index higher than that of silicon as a substrate material is used as the fine particles. The refractive index of silicon is 3.6, and the refractive index of germanium is 4.0. The fine particles can be used by coating the surface with an organic substance in order to improve dispersibility. The particle diameter of the fine particles is preferably 1 nm or more and 1.0 μm or less. If it is larger than 1.0 μm, clogging may occur in the discharge nozzle of the droplet discharge head 31 described later. On the other hand, if it is smaller than 1 nm, the volume ratio of the coating agent to the fine particles becomes large, and the ratio of organic substances in the resulting film becomes excessive.

  The dispersion medium is not particularly limited as long as it can disperse the fine particles and does not cause aggregation. For example, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, dodecane, tetradecane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydro Hydrocarbon compounds such as naphthalene and cyclohexylbenzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2- Methoxyethyl) ether, ether compounds such as p-dioxane, propylene carbonate, γ- Butyrolactone, N- methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, can be exemplified polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferable and more preferable dispersion media in terms of fine particle dispersibility, dispersion stability, and ease of application to the droplet discharge method. Examples thereof include water and hydrocarbon compounds.

  The surface tension of the fine particle dispersion is preferably in the range of 0.02 N / m to 0.07 N / m. When ejecting droplets by the droplet ejection method, if the surface tension is less than 0.02 N / m, the wettability of the droplets with respect to the nozzle surface increases, and flight bending tends to occur. If it exceeds 0.07 N / m, the shape of the meniscus at the nozzle tip is not stable, and it becomes difficult to control the discharge amount and the discharge timing. In order to adjust the surface tension, a small amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based material may be added to the dispersion liquid as long as the contact angle with the substrate P is not greatly reduced. The nonionic surface tension adjusting agent improves the wettability of the functional liquid for wiring to the substrate P, improves the leveling property of the film, and helps prevent the occurrence of fine irregularities on the film. The surface tension modifier may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.

The viscosity of the dispersion is preferably 1 mPa · s or more and 50 mPa · s or less. When the functional liquid for filling is ejected as droplets using the droplet ejection method, if the viscosity is less than 1 mPa · s, the nozzle periphery is easily contaminated by the outflow of ink, and the viscosity is greater than 50 mPa · s. In this case, the clogging frequency in the nozzle holes increases, and it becomes difficult to smoothly discharge the droplets.
<Droplet ejection method>

Examples of the discharge technique of the droplet discharge method include a charge control method, a pressure vibration method, an electromechanical conversion method, an electrothermal conversion method, and an electrostatic suction method. Here, in the charge control method, a charge is applied to a material by a charging electrode, and the flight direction of the material is controlled by a deflection electrode and discharged from a discharge nozzle. Also, pressure vibration method is intended to discharge the material to the nozzle tip side by application of ultra-high pressure of about 30kg / cm ² on the material from the discharge nozzle and the material goes straight when not applying a control voltage When discharged and a control voltage is applied, electrostatic repulsion occurs between the materials, and the materials are scattered and are not discharged from the discharge nozzle. The electromechanical conversion method utilizes the property that a piezoelectric element (piezoelectric element) is deformed by receiving a pulse-like electric signal. The piezoelectric element is deformed through a flexible substance in a space where material is stored. Pressure is applied, and the material is extruded from this space and discharged from the discharge nozzle.

In the electrothermal conversion method, a material is rapidly vaporized by a heater provided in a space in which the material is stored to generate bubbles, and the material in the space is discharged by the pressure of the bubbles. In the electrostatic attraction method, a minute pressure is applied to a space in which a material is stored, a meniscus of material is formed on the discharge nozzle, and an electrostatic attractive force is applied in this state before the material is drawn out. In addition to this, techniques such as a system that uses a change in the viscosity of a fluid by an electric field and a system that uses a discharge spark are also applicable. The droplet discharge method has an advantage that the use of the material is less wasteful and a desired amount of the material can be accurately disposed at a desired position. In addition, the amount of one drop of the liquid material discharged by the droplet discharge method is 1 to 300 nanograms, for example.
<Droplet ejection device>

  Next, an example of a droplet discharge device that discharges a liquid material using the above-described droplet discharge method will be described. In the present embodiment, a description will be given of a droplet discharge apparatus that discharges (drops) droplets from a droplet discharge head onto a substrate using a droplet discharge method.

FIG. 1 is a perspective view showing a schematic configuration of the droplet discharge device IJ.
The droplet discharge device IJ includes a droplet discharge head 31, an X-axis direction drive shaft 34, a Y-axis direction guide shaft 35, a control device CONT, a stage 37, a cleaning mechanism 38, a base 39, and a heater. 45.
The stage 37 supports the bonded substrate Q on which the liquid material is arranged by the droplet discharge device IJ, and includes a fixing mechanism (not shown) that fixes the bonded substrate Q to a reference position.

  The droplet discharge head 31 is a multi-nozzle type droplet discharge head having a plurality of discharge nozzles, and the longitudinal direction and the X-axis direction are made to coincide. The plurality of ejection nozzles are provided at regular intervals on the lower surface of the droplet ejection head 31. A liquid material is discharged from the discharge nozzle of the droplet discharge head 31 to the bonded substrate Q on the stage 37.

An X-axis direction drive motor 32 is connected to the X-axis direction drive shaft 34. The X-axis direction drive motor 32 is a stepping motor or the like, and rotates the X-axis direction drive shaft 34 when a drive signal in the X-axis direction is supplied from the control device CONT. When the X-axis direction drive shaft 34 rotates, the droplet discharge head 31 moves in the X-axis direction.
The Y-axis direction guide shaft 35 is fixed so as not to move with respect to the base 39. The stage 37 includes a Y-axis direction drive motor 33. The Y-axis direction drive motor 33 is a stepping motor or the like. When a drive signal in the Y-axis direction is supplied from the control device CONT, the Y-axis direction drive motor 33 moves the stage 37 in the Y-axis direction.

The control device CONT supplies a droplet discharge control voltage to the droplet discharge head 31. In addition, a drive pulse signal for controlling the movement of the droplet discharge head 31 in the X-axis direction is supplied to the X-axis direction drive motor 32, and a drive pulse signal for controlling the movement of the stage 37 in the Y-axis direction is sent to the Y-axis direction drive motor 33. Supply.
The cleaning mechanism 38 is for cleaning the droplet discharge head 31. The cleaning mechanism 38 includes a Y-axis direction drive motor (not shown). By driving the drive motor in the Y-axis direction, the cleaning mechanism 38 moves along the Y-axis direction guide shaft 35. The movement of the cleaning mechanism 38 is also controlled by the control device CONT.
Here, the heater 45 is means for heat-treating the bonded substrate Q by lamp annealing, and evaporates and dries the solvent contained in the liquid material disposed on the bonded substrate Q. The heater 45 is also turned on and off by the control device CONT.

  The droplet discharge device IJ scans the lower surface of the droplet discharge head 31 in the X-axis direction with respect to the bonded substrate Q while relatively scanning the droplet discharge head 31 and the stage 37 supporting the bonded substrate Q. Droplets are discharged from a plurality of discharge nozzles arranged.

  FIG. 2 is a diagram for explaining the principle of discharging a liquid material by a piezo method.

  In FIG. 2, a piezo element 22 is installed adjacent to a liquid chamber 21 for storing a liquid material. The liquid material is supplied to the liquid chamber 21 via a liquid material supply system 23 including a material tank that stores the liquid material. The piezo element 22 is connected to a drive circuit 24, and the liquid chamber 21 is deformed by applying a voltage to the piezo element 22 via the drive circuit 24 to deform the piezo element 22. When the liquid chamber 21 is restored to the original state, the liquid material is discharged from the discharge nozzle 25. In this case, the amount of distortion of the piezo element 22 is controlled by changing the value of the applied voltage. Further, the strain rate of the piezo element 22 is controlled by changing the frequency of the applied voltage. The droplet discharge by the piezo method does not apply heat to the liquid material, and thus has an advantage of hardly affecting the composition of the liquid material.

  The droplet discharge device IJ described above can be used in the arrangement method and the manufacturing method according to the present invention. However, the present invention is not limited to this, and a liquid material is discharged and a predetermined landing schedule is achieved. Any device can be used as long as it can land on the position.

(First embodiment)
In the present embodiment, a laminated body having a filling member arranged by a droplet discharge method will be described.

  FIG. 3 is a schematic view showing the laminate P in the present embodiment.

  In FIG. 3, the laminate P is composed of a substrate P1, a substrate P2, and a substrate P3. The board | substrate P1 has the space | gap part 11a, The filling member 11 is filled with this space | gap part 11a. A wiring 12 is formed on the lower side of the substrate P2. The bonded substrate Q is composed of a substrate P1 and a substrate P2. Note that an adhesive is used to attach the substrates P1, P2, and P3.

  The laser light 5 is condensed by a lens 6 as a condensing element, and the laser light 5 condensed by the lens 6 is irradiated on the lower surface side of the stacked body P. The irradiated laser beam 5 is arranged so that the focal position is aligned over the entire depth direction of the stacked body P. A material altered portion 7 is formed in a portion of the substrate P1, the substrate P2, and the substrate P3 irradiated with the laser beam 5 by utilizing a phenomenon called multiphoton absorption. Note that when the stress is applied from the outside, the portion of the material-affected portion 7 is modified, so that the laminate P can be cut and divided along the material-affected portion 7.

  4A is a plan view of the multilayer body P showing a staggered arrangement of the inkjet heads 50 in the present embodiment, and FIG. 4B is a cross-sectional view of the multilayer body P. FIG. With reference to FIG. 4, a method of arranging the inkjet heads 50 will be described.

  As shown in FIG. 4A, the ink jet heads 50 are arranged in a staggered manner (in a step). By arranging the inkjet heads 50 in a zigzag pattern, the number of the ink-jet heads increases, and the material of the stacked body P can be saved. However, when the inkjet heads 50 are arranged in a zigzag pattern, a cutting method using a rotating grindstone or a slicing that has been conventionally employed is a processing method in which the rotating grindstone advances linearly. It was difficult to cut and divide into shapes.

  As described above, even if the inkjet heads 50 are arranged in a staggered manner, the laser processing method using the laser beam 5 can freely change the irradiation position of the laser beam 5, so that the laminate P can be easily formed. Can be cut and divided. Moreover, no material is wasted.

  As shown in FIG. 4B, the stacked body P has a three-layer structure in which a substrate P1, a substrate P2, and a substrate P3 are stacked. The material of the substrate P1, the substrate P2, and the substrate P3 is silicon, and the fundamental wave of the YAG laser can be transmitted.

  Next, a method for forming a material altered portion by irradiating laser light will be described.

  FIG. 5 is a view for explaining a method for forming the material-affected portion 7 by the laser beam 5.

  In FIG. 5, the laser beam 5 is condensed inside the substrate 4, and the laser beam 5 is scanned in the scanning direction X (dividing direction). Since the laser beam 5 is collected by the lens 6, the laser beam 5 can be focused inside the substrate 4. When the laser beam 5 is scanned in the scanning direction X (division direction), the material-affected portion 7 can be formed inside the substrate 4. The laser beam 5 is a fundamental wave of a YAG laser and has a wavelength of 1064 nm. The scanning speed in the scanning direction X is 100 mm / sec. The material of the substrate 4 is silicon, and the thickness thereof is about 100 μm.

  In addition, the amount of material altered portion 7 that can be formed by several scans of the laser beam 5 is several tens of μm. Therefore, in order to form the material altered portion 7 in the entire depth direction of the substrate 4, it is necessary to scan the laser beam 5 several times. Each time the laser beam 5 is scanned, the focal position of the lens 6 is raised from the lower surface of the substrate 4 toward the upper surface, and scanning is performed.

  Next, a method for cutting and dividing the laminate in the present embodiment will be described below.

  FIGS. 6A to 6H are diagrams illustrating a process of dividing the laminate, and FIG. 7 is a schematic flowchart illustrating a procedure of the process of dividing the laminate.

With reference to FIG. 6, FIG. 7, the cutting | disconnection / division | segmentation method of the laminated body P of this invention is demonstrated. The method for cutting and dividing the laminate P of the present embodiment is roughly composed of a bonding process 1, a functional liquid arranging process, a drying process, a solidification process, a bonding process 2, a modified layer forming process, and a dividing process. The Hereinafter, each step will be described in detail. In addition, the small piece after the division formed by cutting and dividing the stacked body P is the ink jet head 50.
(Lamination process 1)

In step S1 of FIG. 7, as shown in FIG. 6A, the substrate P2 on which the wiring 12 is formed is bonded to the lower side of the substrate P1 having the gap 11a to form a bonded substrate Q. . As a method for bonding the substrate P1 and the substrate P2, for example, an adhesive may be used. The material of the substrates P1 and P2 is silicon. The thickness of each of the substrates P1 and P2 is 100 μm.
(Functional liquid placement process)

In step S2 of FIG. 7, as shown in FIG. 6B, the functional liquid L1 is ejected from the droplet ejection head 31 into the gap 11a using the droplet ejection device IJ. In addition, as conditions for droplet discharge, for example, the weight of the functional liquid L1 can be 4 ng / dot, and the speed (discharge speed) of the functional liquid L1 can be 5 to 7 m / sec. Moreover, it is preferable that the atmosphere when discharging the functional liquid L1 is set to a temperature of 60 ° C. or lower and a humidity of 80% or lower. Thereby, it is possible to perform stable droplet discharge without clogging the discharge nozzle of the droplet discharge head 31. The functional liquid L1 contains germanium as fine particles.
(Drying process)

Next, in step S3 in FIG. 7, a drying process is performed as shown in FIG. The drying process can be performed, for example, by lamp annealing in addition to a process using a normal hot plate for applying heat, an electric furnace, or the like. The light source used for lamp annealing is not particularly limited, but excimer lasers such as infrared lamps, xenon lamps, YAG lasers, argon lasers, carbon dioxide lasers, XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc. It can be used as a light source. In general, these light sources have an output in the range of 10 W to 5000 W, but in the present embodiment, a range of 100 W to 1000 W is sufficient. And if the functional liquid L1 arrange | positioned in the space | gap part 11a is dried, the liquid member 10 containing the fine particle of germanium will be made.
(Solidification process)

  Next, in step S4 of FIG. 7, as shown in FIG. 6D, the liquid member 10 containing germanium fine particles disposed in the gap 11a is solidified. The liquid member 10 needs to be heat-treated and solidified to ensure strength. Therefore, the liquid member 10 is subjected to heat treatment and / or light treatment.

The heat treatment and / or light treatment is usually performed in the air, but if necessary, it can also be performed in an inert gas atmosphere such as nitrogen, argon or helium, or in a reducing atmosphere such as hydrogen. The treatment temperature of heat treatment and / or light treatment depends on the boiling point (vapor pressure) of the dispersion medium, the type and pressure of the atmospheric gas, the thermal behavior such as fine particle dispersibility and oxidation, the presence and amount of coating material, It is determined appropriately in consideration of the heat resistant temperature. In the present embodiment, a solidification process is performed on the functional liquid L1 containing germanium fine particles. The treatment temperature is preferably 100 ° C. or higher and the treatment time is preferably 30 minutes or longer. As described above, the strength between the germanium fine particles is ensured, and the filling member 11 is formed. Since the refractive index of silicon is 3.6 and the refractive index of germanium is 4.0, the refractive index of the filling member 11 is higher than that of the substrates P1 and P2.
(Lamination process 2)

Next, in step S5 of FIG. 7, as shown in FIG. 6E, the substrate P3 is bonded to the bonded substrate Q having the filling member 11 with an adhesive or the like to form the laminate P. Note that the material of the substrate P3 is silicon. The thickness of the substrate P3 is 100 μm. Therefore, the thickness of the stacked body P formed by stacking the substrate P1, the substrate P2, and the substrate P3 is about 300 μm.
(Modified layer formation process)

Next, in step S6 of FIG. 7, as shown in FIG. 6 (f), the laminated body P is irradiated with the laser beam 5 to form the material altered portion 7 as a modified layer. The laser light source used excites the semiconductor laser. Detailed conditions are as follows. Nd: YAG. Laser wavelength: 1064 nm. Laser light spot cross section: 3.14 × 10 ⁻⁸ cm ² . Oscillation form: Q switch pulse. Repeat frequency: 100 KHz. Pulse width: 30 ns. Output: 20 μJ / pulse. Laser light quality: TEM ₀₀ . Polarization characteristics: linearly polarized light (C). Condenser lens magnification: 50 times. NA: 0.55. Transmittance with respect to laser light wavelength: 60% (D). Movement speed: 100 mm / sec. First, the laser beam 5 is focused on the lower side of the substrate P2 and irradiated. Then, the laser beam 5 is irradiated while gradually moving the condensing point to the upper side of the substrate P2. Next, the laser beam 5 is focused on the lower side of the filling member 11 formed in the gap 11a of the substrate P1 and irradiated. Then, the laser beam 5 is irradiated while gradually moving the condensing point to the upper side of the filling member 11. Finally, the laser beam 5 is focused on the lower side of the substrate P3 and irradiated. Then, the laser beam 5 is irradiated while gradually moving the condensing point to the upper side of the substrate P3. Then, as shown in FIG. 6G, the material altered portion 7 as a modified layer is formed in the entire depth direction of the stacked body P.
(Division process)

  Next, in step S7 of FIG. 7, as shown in FIG. 6 (h), the stacked body P is cut and divided. The method of dividing the laminate P can be performed by applying stress from the outside. The method of applying a stress from the outside is, for example, generating a thermal stress by bending or applying a shear stress to the laminated body P along a planned cutting line, or giving a temperature difference to the laminated body P. And the laminated body P can be easily cut | disconnected and divided | segmented along the material alteration part 7 as a modified layer. In addition, when the thickness of the laminated body P is thinner, the laminated body P may be naturally cracked along the material altered portion 7 by forming the material altered portion 7. And the inkjet head 50 shown in FIG. 11 can be formed by cut | disconnecting and dividing the laminated body P. FIG.

  Since the inkjet head 50 is obtained by irradiating the laminated body P with the laser beam 5 and cutting and dividing the laminated body P, no chips are generated at the time of cutting. The nozzle hole 61 or the like is not clogged (see FIG. 11). In addition, since the stacked body P is cut and divided by irradiating the laser beam 5 collected after the filling member 11 is filled into the gap portion 11a, the cutting width necessary for the division can be made narrower. Therefore, the splitting property is improved. That is, since the number of ink-jet heads 50 can be increased, the productivity of the ink-jet heads 50 can be improved.

  In the first embodiment, the following effects can be obtained.

(1) Even if there is a substrate P1 having a gap 11a in a part of the substrates P1, P2, and P3 constituting the laminate P, the laminate P is formed after filling the gap 11a with the filling member 11 Since the laser beam 5 is irradiated so as to pass through the filling member 11, the material altered portion 7 can be formed in the stacked body P. If the material altered portion 7 can be formed in the laminate P, it can be easily cut and divided along the material altered portion 7 by applying stress from the outside. Moreover, since the functional liquid L1 disposed in the gap portion 11a is arranged by the droplet discharge method, even if the volume of the gap portion 11a is changed, it is only necessary to change the amount of the functional liquid L1. It is. And the laminated body P which can be divided | segmented easily can be provided.
(2) Since the refractive index of the filling member 11 is equal to or higher than that of the substrates P1, P2, and P3, when the laser beam 5 is irradiated, the laser beam 5 is condensed inside the stacked body P without being scattered. Since it becomes easy, the material alteration part 7 can be easily formed in the laminated body P.
(3) Since the laser beam 5 is condensed by the lens 6 as a condensing element and is irradiated on the stacked body P, the material-affected zone 7 can be formed at a predetermined position of the stacked body P.
(4) By irradiating the laminated body P with the fundamental wave of the YAG laser, the material-modified part 7 can be formed at a predetermined position of the laminated body P.

(Second Embodiment)
In the present embodiment, a stacked body having droplets arranged by a droplet discharge method will be described.

  FIG. 8 is a schematic view showing the laminate P in the present embodiment.

  With reference to FIG. 8, the laminated body P of this invention is demonstrated. The difference from the first embodiment is that the droplet L2 is arranged in the gap 15a instead of the functional liquid L1. The droplet L2 is liquid. Note that the materials of the substrates P1, P2, and P3 and the method for bonding the substrates P1, P2, and P3 are the same as those in the first embodiment, and thus description thereof is omitted.

  In FIG. 8, the laminated body P is comprised with the board | substrate P1, the board | substrate P2, and the board | substrate P3. The substrate P1 has a gap 15a, and the gap 15a is filled with the liquid 15. Note that an adhesive is used to attach the substrates P1, P2, and P3.

  The laser beam 5 is condensed by a lens 6 as a condensing element, and the laser beam 5 condensed by the lens 6 is irradiated on the lower surface side of the laminate P. The irradiated laser beam 5 is arranged so that the focal position is aligned over the entire depth direction of the stacked body P. When the laser beam 5 is irradiated to the inside of the laminated body P, the material altered portion 7 can be formed on the substrates P2 and P3 by utilizing the phenomenon of multiphoton absorption. Since the gap 15a of the substrate P1 is filled with the liquid 15, the laser beam 5 is not condensed on the liquid 15, so that the material altered portion 7 is not formed on the substrate P1. And since the part of the material alteration part 7 is modified | denatured, when stress is applied from the outside, the laminated body P can be cut | disconnected and divided | segmented.

  Next, a method for dividing the laminate P in this embodiment will be described below.

  FIG. 9A to FIG. 9F are diagrams showing a process of dividing the laminate, and FIG. 10 is a schematic flowchart showing a procedure of the process of dividing the laminate.

With reference to FIG. 9, FIG. 10, the cutting | disconnection / division | segmentation method of the laminated body P of this invention is demonstrated. Since the material, the droplet discharge method, the droplet discharge device, and the like used for forming the stacked body P are the same as those in the first embodiment, the description thereof is omitted. The method for cutting / dividing the laminate P of the present embodiment is roughly composed of a bonding process 1, a liquid injection process, a bonding process 2, a modified layer forming process, and a dividing process. In addition, the bonding process 1, the bonding process 2, and the dividing process similar to those in the first embodiment will be briefly described. The liquid injection process and the modified layer forming process different from the first embodiment will be described in detail. The small piece after the division formed by cutting and dividing the laminated body P is the inkjet head 50.
(Lamination process 1)

In step S11 of FIG. 10, as shown in FIG. 9B, the substrate P2 on which the wiring 12 is formed is bonded to the lower side of the substrate P1 having the gap 15a to form a bonded substrate Q. . Note that the bonding method, material, and thickness of the substrate P1 and the substrate P2 are the same as those in the first embodiment, and thus description thereof is omitted.
(Liquid injection process)

Next, in step S <b> 12 of FIG. 10, the droplet L <b> 2 is injected into the gap 15 a by the droplet discharge method, and the gap 15 a is filled with the liquid 15. The liquid 15 is water, for example. Other than water, ethanol, acetone, methanol, IPA, or the like may be used. These water, ethanol, acetone, methanol, IPA, and the like are substances having a higher refractive index than air, and the refractive index is about 1.3 to 1.4. The liquid 15 flows out from the gap 15a after the stacked body P is cut and divided. Although the droplet discharge method is adopted when the droplet L2 is injected into the gap portion 15a, the present invention is not limited to this, and other methods may be adopted. For example, the substrate 15 itself may be dipped into the liquid 15 to arrange the liquid 15 in the gap 15a, or the dispenser containing the liquid 15 may be used to arrange the liquid 15 in the gap 15a.
(Lamination process 2)

In step S13 of FIG. 10, as shown in FIG. 9C, the substrate P3 is bonded with an adhesive or the like to form the laminate P. Since the bonding method, material, and thickness of the substrate P3 are the same as those in the first embodiment, the description thereof is omitted. The thickness of the stacked body P formed by stacking the substrate P1, the substrate P2, and the substrate P3 is about 300 μm.
(Modified layer formation process)

In step S14 of FIG. 10, as shown in FIG. 9 (d), the laser beam 5 is irradiated to form the material altered portion 7 as a modified layer in the stacked body P. The laser light source used is the same as the laser used in the first embodiment, and excites the semiconductor laser. Note that detailed conditions for irradiating the laser beam 5 are also the same as those in the first embodiment, and thus description thereof is omitted. The laminated body P is irradiated with the laser beam 5 to form a material altered portion 7 as a modified layer inside the substrates P2 and P3 shown in FIG. 9 (e). However, since the gap 15a is filled with the liquid 15, even if the liquid 15 is irradiated with the laser beam 5, the material altered portion 7 as a modified layer is not formed on the substrate P1.
(Division process)

  Next, in step S15 of FIG. 10, the stacked body P is divided as shown in FIG. Since the division method of the stacked body P is the same as that of the first embodiment, the description thereof is omitted. Then, by dividing the laminate P, the ink jet head 50 shown in FIG. 11 can be formed.

  In the second embodiment, the following effects can be obtained.

(5) Even if there is a substrate P1 having a gap 15a in a part of the substrates P1, P2, and P3 constituting the laminate P, the laminate P is formed after the liquid 15 is filled in the gap 15a. Since the laser beam 5 is irradiated so as to pass through 15, the material altered portion 7 can be formed inside the substrates P2 and P3. If the material altered portion 7 can be formed in the entire depth direction of the laminate P, the laminate P can be easily cut and divided along the material altered portion 7 by applying stress from the outside. In addition, when the liquid 15 is disposed in the gap 15a, the liquid 15 disposed in the gap 15a after dividing the stacked body P flows out of the stacked body P, and thus does not need to be removed. . Since the liquid 15 is arranged in the gap portion 15a by the droplet discharge method, even if the volume of the gap portion 15a is changed, it is simple because only the amount of the droplet L2 to be injected is changed. And the laminated body P which can be divided | segmented easily can be provided.
(6) If the refractive index of the droplet L2 is 1.3 or higher, the refractive index is higher than that of air, so that processing can be performed to a deeper position. The material altered portion 7 can be formed in the entire depth direction.

  FIG. 11 is an explanatory view showing an ink jet head according to the forming method of Embodiment 1 and Embodiment 2 of the present invention.

  As shown in FIG. 11, the outer shape of the inkjet head 50 is composed of a nozzle plate 51, an actuator substrate 52, a driving film 53, a sealing plate 54, and a compliance substrate 55 from the lower side. It is joined with. A wiring 56 for applying a voltage is connected to the driving unit 53a which is a part of the driving film 53. A through hole is formed in the actuator substrate 52, the drive film 53, and the sealing plate 54, and a reservoir 57 is formed by closing the bottom of the through hole with the nozzle plate 51. A liquid supply hole 58 for supplying a liquid such as ink from the outside to the reservoir 57 is formed in a portion corresponding to the reservoir 57 of the compliance substrate 55.

  An elastic film 59 is formed on the upper surface of the actuator substrate 52 in contact with the drive film 53, and the elastic film 59 includes a silicon oxide layer 59a and a zirconium oxide layer 59b. The elastic film 59 is not necessarily composed of the silicon oxide layer 59a and the zirconium oxide layer 59b. On the nozzle plate 51 side of the actuator substrate 52, concave portions to be a plurality of pressure chambers 60 are formed. In the nozzle plate 51, nozzle holes 61 for discharging droplets corresponding to the pressure chambers 60 are formed. Is formed. Further, a recess serving as a sealing portion 62 for protecting the driving portion 53 a and the wiring 56 is formed on the sealing plate 54 on the driving film 53 side.

  The actuator substrate 52 is formed with orifices 63 that connect the reservoir 57 and the pressure chambers 60, and the drive portions 53 a that are part of the drive membrane 53 are individually provided above the pressure chambers 60. .

  In the ink jet head 50, a pressing portion 64 is formed at a position facing the reservoir 57 in the elastic film 59. The pressing portion 64 is formed by doping boron at a high concentration into the actuator substrate 52 made of single crystal silicon, and is formed as a part of the actuator substrate 52. The pressing portion 64 is formed in a convex shape at the orifice 63 portion of the elastic membrane 59. However, if it is formed at least at a position facing the reservoir 57 in the elastic membrane 59, the holding portion 64 is located on the reservoir 57 side or the pressure chamber 60 side. You may form in the form which protrudes.

  Here, the operation of the inkjet head 50 will be described. The ink jet head 50 is driven by the driving unit 53a by a piezoelectric method.

  The drive film 53 is composed of a lower electrode laminated with titanium, iridium, platinum or the like, a piezoelectric element (PZT, Piezoelectric Transducer Material) made of lead zirconate titanate, iridium, or the like from the lower surface side (actuator substrate 52 side). It consists of an upper electrode. When a voltage is applied to the upper electrode and the lower electrode of the drive unit 53a via the wiring 56, the piezoelectric element is bent and deformed, for example, on the upper side (sealing plate 54 side). As the piezoelectric element is bent and deformed, the lower electrode and the elastic film 59 joined to the piezoelectric element are also bent. At this time, liquid such as ink is supplied from the liquid supply hole 58 to the reservoir 57 from the outside, and this liquid flows into the pressure chamber 60 through the orifice 63 when the piezoelectric element is bent. When the voltage applied to the upper electrode and the lower electrode is removed, the piezoelectric element returns to its original state and the pressure in the pressure chamber increases. Thereby, the liquid is ejected from the nozzle hole 61 as a droplet. Even if the piezoelectric element bends downward, a liquid such as ink can be similarly ejected as droplets.

  FIG. 12 is a diagram illustrating an example of an ink jet recording apparatus as an electronic apparatus.

  As shown in FIG. 12, the ink jet recording apparatus 100 is an ink jet printer, and includes the ink jet head 50 obtained in the first embodiment or the second embodiment. Since the inkjet head 50 has the nozzle holes 61 with good quality without chip clogging, the inkjet recording apparatus 100 is excellent in ejection performance.

  In addition to the inkjet head 50, the method of cutting / dividing the stacked body P with the laser beam 5 can be used to cut and stack a stacked body such as a semiconductor element, a liquid crystal display device, and a piezoelectric element that require high-precision bonding of substrates. Can be divided. Further, it can be applied to an organic electroluminescence display device, a DNA device and the like.

  The present invention has been described above with reference to preferred embodiments. However, the present invention is not limited to the above-described embodiments, and includes the following modifications and the scope in which the object of the present invention can be achieved. Thus, it can be set to any other specific structure and shape.

  (Modification 1) In the first embodiment and the second embodiment described above, as a method of condensing the laser light in the laser light irradiation step, the light is condensed while moving the condensing point in the thickness direction of the stacked body P. Not limited to this. For example, as shown in FIG. 13, a plurality of laser beams having different divergence angles may be condensed by a condensing element and irradiated. In this way, the same effects as those of the first embodiment and the second embodiment can be obtained, and the time required for forming the material altered portion 7 in the laser light irradiation process can be shortened. Can be improved.

  (Modification 2) In the first embodiment and the second embodiment described above, as a method of condensing the laser light in the laser light irradiation step, the light is condensed while moving the condensing point in the thickness direction of the laminate P. Not limited to this. For example, as shown in FIG. 14, laser light may be split into a plurality of beams by a diffractive optical element and irradiated at multiple points simultaneously. In this way, the same effects as those of the first embodiment and the second embodiment can be obtained, and the time required for forming the material altered portion 7 in the laser light irradiation process can be shortened. Can be improved.

  (Modification 3) In the first and second embodiments described above, silicon is used as the material for the substrates P1, P2, and P3. However, the present invention is not limited to this. For example, a material other than silicon may be used. Even if it does in this way, while obtaining the effect similar to 1st Embodiment and 2nd Embodiment, it becomes possible to provide other devices other than the inkjet head 50. FIG.

  (Modification 4) In the first embodiment and the second embodiment described above, the laminated body P has the three-layer structure of the substrates P1, P2, and P3, but is not limited thereto. For example, you may make the laminated body P into the structure of 4 or more sheets. In this way, the same effects as those of the first and second embodiments can be obtained, and other devices other than the inkjet head 50 can be provided.

FIG. 2 is a schematic perspective view showing an overall configuration of a droplet discharge device. The figure for demonstrating the discharge principle of the liquid material by a piezo system. Schematic which shows the laminated body in 1st Embodiment. (A) is a top view of the laminated body which shows the staggered arrangement | sequence of an inkjet head. (B) is sectional drawing of a laminated body. The figure for demonstrating the material alteration part formation method by a laser beam. (A)-(h) is a figure which shows the division | segmentation process of a laminated body. The schematic flowchart which shows the procedure of the division | segmentation process of a laminated body. Schematic which shows the laminated body in 2nd Embodiment. (A)-(f) is a figure which shows the division | segmentation process of a laminated body. The schematic flowchart which shows the procedure of the division | segmentation process of a laminated body. The figure for demonstrating an inkjet head. FIG. 6 is a diagram illustrating an example of an inkjet recording apparatus as an electronic apparatus. The figure which shows the example which condenses and irradiates the several laser beam from which the divergence angle differs in the modification 1 with a condensing element. The figure which shows the example which divides | segments the laser beam in the modification 2 into a several beam with a diffractive optical element, and irradiates multiple points simultaneously.

Explanation of symbols

DESCRIPTION OF SYMBOLS 5 ... Laser beam, 6 ... Lens as condensing element, 7 ... Material alteration part, 10 ... Liquid member, 11 ... Filling member, 11a ... Gap part, 15 ... Liquid, 15a ... Gap part, 31 ... Droplet discharge head 50, inkjet head as device, 100, printer as electronic device, P1, P2, P3, substrate, P, laminate, Q, bonded substrate, L1, functional liquid, L2, droplet.

Claims (12)

A method for processing a laminate comprising a plurality of substrates,
The laminate includes a substrate having a void portion among the plurality of substrates, and a step of disposing a functional liquid in the void portion by a droplet discharge method;
Solidifying the functional liquid to form a filling member;
A laser beam irradiation step of irradiating a laser beam so as to pass through the filling member to form a material altered portion in the laminate;
A method for processing a laminate, comprising: In the processing method of the laminated body of Claim 1,
In the step of forming the filling member,
The processing method of a laminated body, wherein the refractive index of the filling member is equal to or higher than the refractive index of the substrate. A method for processing a laminate comprising a plurality of substrates,
The laminated body has a substrate having a void portion among the plurality of substrates, and a step of arranging droplets in the void portion by a droplet discharge method;
A laser beam irradiation step of irradiating a laser beam so as to pass through the liquid droplets to form a material altered portion in the laminate;
A method for processing a laminate, comprising: In the processing method of the laminated body of Claim 3,
In the step of arranging the droplets,
A method for processing a laminate, wherein the droplet has a refractive index of 1.3 or more. In the processing method of the laminated body as described in any one of Claims 1-4,
The substrate is made of a material made of silicon single crystal,
In the laser light irradiation step,
A laser beam is condensed and irradiated on the laminate by a condensing element,
A method for processing a laminate, wherein the material-modified part is formed. In the processing method of the laminated body as described in any one of Claims 1-5,
In the laser light irradiation step,
The laser beam is a YAG laser and is irradiated with a fundamental wave of the YAG laser.
A method for processing a laminate, wherein the material-modified part is formed. In the processing method of the laminated body as described in any one of Claims 1-6,
In the laser light irradiation step,
Branching the laser light into a plurality of beams by a diffractive optical element, irradiating the plurality of beams,
A method for processing a laminate, wherein the material-modified part is formed. A laminate in which a plurality of substrates are laminated,
Of the plurality of substrates, a substrate having a gap,
A filling member formed by disposing a functional liquid in the gap by a droplet discharge method and solidifying the functional liquid;
A material alteration part formed by irradiating a laser beam so as to pass through the filling member and altering the material constituting the laminate;
A laminate comprising: A laminate in which a plurality of substrates are laminated,
Of the plurality of substrates, a substrate having a gap,
A droplet disposed by a droplet discharge method in the gap,
A material alteration part formed by irradiating a laser beam so as to pass through the droplets and altering the material constituting the laminate;
A laminate comprising:   A device manufacturing method, comprising: forming a device by the laminate processing method according to claim 1.   A device formed by the device manufacturing method according to claim 10. An ink jet recording apparatus comprising the ink jet head as the device according to claim 11.

Images