JP2007051301A - Lens with improved mold-releasability - Google Patents
Lens with improved mold-releasability Download PDFInfo
- Publication number
- JP2007051301A JP2007051301A JP2006310232A JP2006310232A JP2007051301A JP 2007051301 A JP2007051301 A JP 2007051301A JP 2006310232 A JP2006310232 A JP 2006310232A JP 2006310232 A JP2006310232 A JP 2006310232A JP 2007051301 A JP2007051301 A JP 2007051301A
- Authority
- JP
- Japan
- Prior art keywords
- episulfide
- lens
- resin
- bis
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 229920005989 resin Polymers 0.000 claims abstract description 79
- 239000011347 resin Substances 0.000 claims abstract description 79
- -1 episulfide compound Chemical class 0.000 claims abstract description 44
- 150000003553 thiiranes Chemical class 0.000 claims abstract description 38
- 150000001875 compounds Chemical class 0.000 claims abstract description 32
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 28
- 239000000203 mixture Substances 0.000 claims abstract description 14
- 239000003054 catalyst Substances 0.000 claims description 15
- 239000003607 modifier Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 150000003512 tertiary amines Chemical class 0.000 claims description 3
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- 125000000732 arylene group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 4
- 150000003141 primary amines Chemical class 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000005266 casting Methods 0.000 abstract 1
- 230000000379 polymerizing effect Effects 0.000 abstract 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 11
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- 239000000178 monomer Substances 0.000 description 8
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 7
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- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 6
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000001294 propane Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
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- JRKRMWWBDZSDMT-UHFFFAOYSA-N 2-[(thiiran-2-ylmethyldisulfanyl)methyl]thiirane Chemical compound C1SC1CSSCC1CS1 JRKRMWWBDZSDMT-UHFFFAOYSA-N 0.000 description 4
- GSCCALZHGUWNJW-UHFFFAOYSA-N N-Cyclohexyl-N-methylcyclohexanamine Chemical compound C1CCCCC1N(C)C1CCCCC1 GSCCALZHGUWNJW-UHFFFAOYSA-N 0.000 description 4
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 4
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- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 4
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- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 4
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- 238000000465 moulding Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
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- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000007983 Tris buffer Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
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- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000007872 degassing Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 3
- 150000008442 polyphenolic compounds Chemical class 0.000 description 3
- 238000010526 radical polymerization reaction Methods 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 2
- FAXWFCTVSHEODL-UHFFFAOYSA-N 2,4-dibromophenol Chemical compound OC1=CC=C(Br)C=C1Br FAXWFCTVSHEODL-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- MXZROAOUCUVNHX-UHFFFAOYSA-N 2-Aminopropanol Chemical compound CCC(N)O MXZROAOUCUVNHX-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- VTHKQKIHOQTGQZ-UHFFFAOYSA-N 2-[4-[[4-(2-prop-2-enoyloxyethoxy)phenyl]methyl]phenoxy]ethyl prop-2-enoate Chemical compound C1=CC(OCCOC(=O)C=C)=CC=C1CC1=CC=C(OCCOC(=O)C=C)C=C1 VTHKQKIHOQTGQZ-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical compound CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- YCLSOMLVSHPPFV-UHFFFAOYSA-N 3-(2-carboxyethyldisulfanyl)propanoic acid Chemical compound OC(=O)CCSSCCC(O)=O YCLSOMLVSHPPFV-UHFFFAOYSA-N 0.000 description 2
- LPUBRQWGZPPVBS-UHFFFAOYSA-N 3-butoxypropan-1-amine Chemical compound CCCCOCCCN LPUBRQWGZPPVBS-UHFFFAOYSA-N 0.000 description 2
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- DGUJJOYLOCXENZ-UHFFFAOYSA-N 4-[2-[4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenol Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 DGUJJOYLOCXENZ-UHFFFAOYSA-N 0.000 description 2
- HRXZRAXKKNUKRF-UHFFFAOYSA-N 4-ethylaniline Chemical compound CCC1=CC=C(N)C=C1 HRXZRAXKKNUKRF-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
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- 239000002841 Lewis acid Substances 0.000 description 2
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 2
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- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- UXNLVLGXXFWCNX-UHFFFAOYSA-N fluoroarsonic acid;triphenylsulfanium Chemical compound O[As](O)(F)=O.O[As](O)(F)=O.O[As](O)(F)=O.O[As](O)(F)=O.O[As](O)(F)=O.O[As](O)(F)=O.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 UXNLVLGXXFWCNX-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- DDRPCXLAQZKBJP-UHFFFAOYSA-N furfurylamine Chemical compound NCC1=CC=CO1 DDRPCXLAQZKBJP-UHFFFAOYSA-N 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
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- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 239000004611 light stabiliser Substances 0.000 description 1
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 1
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- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- MKQLBNJQQZRQJU-UHFFFAOYSA-N morpholin-4-amine Chemical compound NN1CCOCC1 MKQLBNJQQZRQJU-UHFFFAOYSA-N 0.000 description 1
- WHDUKLPCKZTPFY-UHFFFAOYSA-N n,n'-diethylbutane-1,4-diamine Chemical compound CCNCCCCNCC WHDUKLPCKZTPFY-UHFFFAOYSA-N 0.000 description 1
- DXVRWLSEDKIGGF-UHFFFAOYSA-N n,n'-diethylheptane-1,7-diamine Chemical compound CCNCCCCCCCNCC DXVRWLSEDKIGGF-UHFFFAOYSA-N 0.000 description 1
- LDQWVRMGQLAWMN-UHFFFAOYSA-N n,n'-diethylhexane-1,6-diamine Chemical compound CCNCCCCCCNCC LDQWVRMGQLAWMN-UHFFFAOYSA-N 0.000 description 1
- BZRMPKDZBITGKE-UHFFFAOYSA-N n,n'-diethylpentane-1,5-diamine Chemical compound CCNCCCCCNCC BZRMPKDZBITGKE-UHFFFAOYSA-N 0.000 description 1
- BEPGHZIEOVULBU-UHFFFAOYSA-N n,n'-diethylpropane-1,3-diamine Chemical compound CCNCCCNCC BEPGHZIEOVULBU-UHFFFAOYSA-N 0.000 description 1
- CZPRYVBLOUZRGD-UHFFFAOYSA-N n,n'-dimethylbutane-1,4-diamine Chemical compound CNCCCCNC CZPRYVBLOUZRGD-UHFFFAOYSA-N 0.000 description 1
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 description 1
- LFBJWQBNKOIOMJ-UHFFFAOYSA-N n,n'-dimethylheptane-1,7-diamine Chemical compound CNCCCCCCCNC LFBJWQBNKOIOMJ-UHFFFAOYSA-N 0.000 description 1
- MDKQJOKKKZNQDG-UHFFFAOYSA-N n,n'-dimethylhexane-1,6-diamine Chemical compound CNCCCCCCNC MDKQJOKKKZNQDG-UHFFFAOYSA-N 0.000 description 1
- BESLVGXJZXNIJE-UHFFFAOYSA-N n,n'-dimethylpentane-1,5-diamine Chemical compound CNCCCCCNC BESLVGXJZXNIJE-UHFFFAOYSA-N 0.000 description 1
- CIXSDMKDSYXUMJ-UHFFFAOYSA-N n,n-diethylcyclohexanamine Chemical compound CCN(CC)C1CCCCC1 CIXSDMKDSYXUMJ-UHFFFAOYSA-N 0.000 description 1
- DIAIBWNEUYXDNL-UHFFFAOYSA-N n,n-dihexylhexan-1-amine Chemical compound CCCCCCN(CCCCCC)CCCCCC DIAIBWNEUYXDNL-UHFFFAOYSA-N 0.000 description 1
- UQUPIHHYKUEXQD-UHFFFAOYSA-N n,n′-dimethyl-1,3-propanediamine Chemical compound CNCCCNC UQUPIHHYKUEXQD-UHFFFAOYSA-N 0.000 description 1
- RWIVICVCHVMHMU-UHFFFAOYSA-N n-aminoethylmorpholine Chemical compound NCCN1CCOCC1 RWIVICVCHVMHMU-UHFFFAOYSA-N 0.000 description 1
- HVAAHUDGWQAAOJ-UHFFFAOYSA-N n-benzylethanamine Chemical compound CCNCC1=CC=CC=C1 HVAAHUDGWQAAOJ-UHFFFAOYSA-N 0.000 description 1
- OBYVIBDTOCAXSN-UHFFFAOYSA-N n-butan-2-ylbutan-2-amine Chemical compound CCC(C)NC(C)CC OBYVIBDTOCAXSN-UHFFFAOYSA-N 0.000 description 1
- PXSXRABJBXYMFT-UHFFFAOYSA-N n-hexylhexan-1-amine Chemical compound CCCCCCNCCCCCC PXSXRABJBXYMFT-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- XJINZNWPEQMMBV-UHFFFAOYSA-N n-methylhexan-1-amine Chemical compound CCCCCCNC XJINZNWPEQMMBV-UHFFFAOYSA-N 0.000 description 1
- IOXXVNYDGIXMIP-UHFFFAOYSA-N n-methylprop-2-en-1-amine Chemical compound CNCC=C IOXXVNYDGIXMIP-UHFFFAOYSA-N 0.000 description 1
- CRBACSXYCMQSAH-UHFFFAOYSA-N n-pentan-3-ylpentan-3-amine Chemical compound CCC(CC)NC(CC)CC CRBACSXYCMQSAH-UHFFFAOYSA-N 0.000 description 1
- JACMPVXHEARCBO-UHFFFAOYSA-N n-pentylpentan-1-amine Chemical compound CCCCCNCCCCC JACMPVXHEARCBO-UHFFFAOYSA-N 0.000 description 1
- DYUWTXWIYMHBQS-UHFFFAOYSA-N n-prop-2-enylprop-2-en-1-amine Chemical compound C=CCNCC=C DYUWTXWIYMHBQS-UHFFFAOYSA-N 0.000 description 1
- XTBLDMQMUSHDEN-UHFFFAOYSA-N naphthalene-2,3-diamine Chemical compound C1=CC=C2C=C(N)C(N)=CC2=C1 XTBLDMQMUSHDEN-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- AYUGZEPJBRZOHA-UHFFFAOYSA-N o-benzyl 2-methylprop-2-enethioate Chemical compound CC(=C)C(=S)OCC1=CC=CC=C1 AYUGZEPJBRZOHA-UHFFFAOYSA-N 0.000 description 1
- VHALHNJABQFTEG-UHFFFAOYSA-N o-methyl 2-methylprop-2-enethioate Chemical compound COC(=S)C(C)=C VHALHNJABQFTEG-UHFFFAOYSA-N 0.000 description 1
- SQVGTULYLYOGPL-UHFFFAOYSA-N o-methyl prop-2-enethioate Chemical compound COC(=S)C=C SQVGTULYLYOGPL-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- PQPFFKCJENSZKL-UHFFFAOYSA-N pentan-3-amine Chemical compound CCC(N)CC PQPFFKCJENSZKL-UHFFFAOYSA-N 0.000 description 1
- WATYAKBWIQTPDE-UHFFFAOYSA-N pentane-2,4-dione;zinc Chemical compound [Zn].CC(=O)CC(C)=O WATYAKBWIQTPDE-UHFFFAOYSA-N 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- QIWKUEJZZCOPFV-UHFFFAOYSA-N phenyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1 QIWKUEJZZCOPFV-UHFFFAOYSA-N 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- JAKNYTQAGPEFJB-UHFFFAOYSA-N piperidin-2-amine Chemical compound NC1CCCCN1 JAKNYTQAGPEFJB-UHFFFAOYSA-N 0.000 description 1
- RHPBLLCTOLJFPH-UHFFFAOYSA-N piperidin-2-ylmethanamine Chemical compound NCC1CCCCN1 RHPBLLCTOLJFPH-UHFFFAOYSA-N 0.000 description 1
- BCIIMDOZSUCSEN-UHFFFAOYSA-N piperidin-4-amine Chemical compound NC1CCNCC1 BCIIMDOZSUCSEN-UHFFFAOYSA-N 0.000 description 1
- LTEKQAPRXFBRNN-UHFFFAOYSA-N piperidin-4-ylmethanamine Chemical compound NCC1CCNCC1 LTEKQAPRXFBRNN-UHFFFAOYSA-N 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- ZJLMKPKYJBQJNH-UHFFFAOYSA-N propane-1,3-dithiol Chemical compound SCCCS ZJLMKPKYJBQJNH-UHFFFAOYSA-N 0.000 description 1
- ZNZJJSYHZBXQSM-UHFFFAOYSA-N propane-2,2-diamine Chemical compound CC(C)(N)N ZNZJJSYHZBXQSM-UHFFFAOYSA-N 0.000 description 1
- HMPSOEYFMTWOFC-UHFFFAOYSA-N propane-2,2-dithiol Chemical compound CC(C)(S)S HMPSOEYFMTWOFC-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- KOUKXHPPRFNWPP-UHFFFAOYSA-N pyrazine-2,5-dicarboxylic acid;hydrate Chemical compound O.OC(=O)C1=CN=C(C(O)=O)C=N1 KOUKXHPPRFNWPP-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- CVHLOUDPCBXUES-UHFFFAOYSA-N thiiran-2-ylmethanethiol Chemical compound SCC1CS1 CVHLOUDPCBXUES-UHFFFAOYSA-N 0.000 description 1
- UVZICZIVKIMRNE-UHFFFAOYSA-N thiodiacetic acid Chemical compound OC(=O)CSCC(O)=O UVZICZIVKIMRNE-UHFFFAOYSA-N 0.000 description 1
- 235000019303 thiodipropionic acid Nutrition 0.000 description 1
- RSPCKAHMRANGJZ-UHFFFAOYSA-N thiohydroxylamine Chemical class SN RSPCKAHMRANGJZ-UHFFFAOYSA-N 0.000 description 1
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- 229960000790 thymol Drugs 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- IFXORIIYQORRMJ-UHFFFAOYSA-N tribenzylphosphane Chemical compound C=1C=CC=CC=1CP(CC=1C=CC=CC=1)CC1=CC=CC=C1 IFXORIIYQORRMJ-UHFFFAOYSA-N 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- IGNTWNVBGLNYDV-UHFFFAOYSA-N triisopropylphosphine Chemical compound CC(C)P(C(C)C)C(C)C IGNTWNVBGLNYDV-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- JQPMDTQDAXRDGS-UHFFFAOYSA-N triphenylalumane Chemical compound C1=CC=CC=C1[Al](C=1C=CC=CC=1)C1=CC=CC=C1 JQPMDTQDAXRDGS-UHFFFAOYSA-N 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- KCTAHLRCZMOTKM-UHFFFAOYSA-N tripropylphosphane Chemical compound CCCP(CCC)CCC KCTAHLRCZMOTKM-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
Abstract
Description
本発明は、プラスチックレンズ、プリズム、光ファイバー、情報記録基板、フィルター
、発光ダイオード等の光学材料に使用される樹脂に関するものであり、特に眼鏡用プラス
チックレンズの樹脂として好適に使用されるレンズ及びその製造方法に関する。
The present invention relates to a resin used for an optical material such as a plastic lens, a prism, an optical fiber, an information recording substrate, a filter, and a light emitting diode, and in particular, a lens suitably used as a resin for a plastic lens for spectacles and its production. Regarding the method.
プラスチックレンズは、無機レンズに比べ軽量で割れ難く、染色が可能なため、近年、
眼鏡レンズ、カメラレンズ等の光学材料に急速に普及してきている。
Since plastic lenses are lighter and harder to break than inorganic lenses and can be dyed,
It is rapidly spreading to optical materials such as eyeglass lenses and camera lenses.
これらプラスチックレンズに要求され続けている光学性能としては、高屈折率、高アッ
ベ数、物理的性質としては高耐熱性、低比重、加工性である。
The optical performance that is continuously required for these plastic lenses is a high refractive index, a high Abbe number, and physical properties such as high heat resistance, low specific gravity, and workability.
これらの性能のうち、高耐熱性、低比重については現在の高屈折率プラスチックレンズ
でも高いレベルで実現されてきている。現在、これらの目的に広く用いられる樹脂として
は、ジエチレングリコールビス(アリルカーボネート)(以下、D.A.Cと称す)をラ
ジカル重合させたものがある。この樹脂は、耐衝撃性に優れていること、軽量であること
、染色性に優れていること、切削性および研磨性等の加工性が良好であることなど、種々
の特徴を有している。しかしながら、この樹脂は、屈折率ndが1.50と低く、レンズ
の中心厚やコバ厚が厚くなってしまい、より屈折率の高いレンズ用樹脂が望まれていた。
Among these performances, high heat resistance and low specific gravity have been realized at a high level even with current high refractive index plastic lenses. Currently, resins widely used for these purposes include those obtained by radical polymerization of diethylene glycol bis (allyl carbonate) (hereinafter referred to as DAC). This resin has various features such as excellent impact resistance, light weight, excellent dyeability, and good workability such as machinability and abrasiveness. . However, this resin has a refractive index nd as low as 1.50, and the center thickness and edge thickness of the lens are increased, so that a lens resin having a higher refractive index has been desired.
D.A.C樹脂よりも屈折率を高くしたものとして、樹脂中に硫黄原子を導入した、ポ
リウレタン樹脂(特公平4−58489等)や含硫O−(メタ)アクリレート樹脂(特開
平4−161410等)やチオ(メタ)アクリレート樹脂(特公平3−59060等)が
知られている。ポリウレタン樹脂は、高屈折率で耐衝撃性が良好であるなど、バランスの
優れた樹脂である。
D. A. As those having a refractive index higher than that of C resin, polyurethane resin (Japanese Patent Publication No. 4-58489 etc.), sulfur-containing O- (meth) acrylate resin (Japanese Patent Laid-Open No. Hei 4-161410 etc.) introduced with sulfur atoms in the resin, A thio (meth) acrylate resin (Japanese Patent Publication No. 3-59060) is known. Polyurethane resin is a resin with an excellent balance such as high refractive index and good impact resistance.
しかしながら、屈折率とアッベ数に関しては屈折率が上昇するほどアッベ数が低下する
といった相反する物性であるため、両方を同時に向上させることは、非常に困難である。
そこで、アッベ数の低下を抑えながら、高屈折率化を行う検討が盛んに行われている。
However, with respect to the refractive index and the Abbe number, it is very difficult to improve both at the same time because of the contradictory physical properties that the Abbe number decreases as the refractive index increases.
In view of this, studies have been actively conducted to increase the refractive index while suppressing the decrease in the Abbe number.
これらの検討に中で最も代表的な提案は、特許文献1(特開平9−110979号公報
)および特許文献2(特開平9−71580号公報)、特許文献3(特開平9−2557
81号公報)、特許文献4(特開平10−2982878号公報)、特許文献5(特開平
11−166037号公報)でエピスルフィド化合物を使用する方法である。また本出願
人らも特許文献6(WO89/10575)、特許文献7(特開平11−140070号
公報)、特許文献8(特開平11−183702号公報)、特許文献9(特開平11−1
89592号公報)、特許文献10(特開平11−322930号公報)等のエピスルフ
ィド化合物を使用した高屈折率レンズ用樹脂を提案している。
Among these examinations, the most typical proposals are Patent Document 1 (Japanese Patent Laid-Open No. 9-110579), Patent Document 2 (Japanese Patent Laid-Open No. 9-71580), and Patent Document 3 (Japanese Patent Laid-Open No. 9-2557).
81), Patent Document 4 (Japanese Patent Laid-Open No. 10-298878), and Patent Document 5 (Japanese Patent Laid-Open No. 11-166037). The present applicants also disclosed Patent Document 6 (WO89 / 10575), Patent Document 7 (JP-A-11-140070), Patent Document 8 (JP-A-11-183702), Patent Document 9 (JP-A-11-1).
No. 89592) and Patent Document 10 (Japanese Patent Laid-Open No. 11-322930) have proposed a resin for a high refractive index lens using an episulfide compound.
これらの方法によれば、比較的高いアッベ数を有しながら、高い屈折率が実現できる。
しかしながら、これらの特許には樹脂中に残存するエピスルフィド基に関する記載は無く
、樹脂中に存在しているエピスルフィド基が諸物性に与える影響が明らかでなかった。し
たがって、樹脂中に存在するエピスルフィド基の量を規定することが重要であった。
However, these patents do not describe the episulfide groups remaining in the resin, and the effects of the episulfide groups present in the resin on various physical properties have not been clarified. Therefore, it was important to define the amount of episulfide groups present in the resin.
本発明の目的は、エピスルフィド化合物を原料とするエピスルフィド系レンズ用樹脂に
おいて、物性、品質の安定したレンズ用樹脂を提供することである。
An object of the present invention is to provide a lens resin having stable physical properties and quality in an episulfide lens resin using an episulfide compound as a raw material.
このような状況に鑑み本発明者らは、上記の課題を解決するために鋭意検討した結果、
樹脂中に存在しているエピスルフィド基の影響により、樹脂の耐熱性が低下したり、離型
時のガラスモールドとの離型性が悪くなったりし、得られるレンズ用樹脂の品質がぶれ、
生産性が低下する場合があることを見出し、本発明に至った。
In view of such a situation, the present inventors have intensively studied to solve the above problems,
Due to the influence of the episulfide group present in the resin, the heat resistance of the resin is reduced, or the release property from the glass mold at the time of release is deteriorated, and the quality of the obtained lens resin is blurred,
It discovered that productivity might fall and it came to this invention.
すなわち本発明は、(A):1分子内に下記式(1) That is, the present invention provides the following formula (1):
(式中、R1は炭素数1〜10の2価の炭化水素基、R2、R3、R4はそれぞれ炭素数1〜
10の炭化水素基または水素原子を示す。)で示される示される構造を1個以上持つエピ
スルフィド化合物を含有する重合性組成物を、注型重合させて得られるエピスルフィド系
レンズの製造において、得られる樹脂中に存在するエピスルフィド基が、0.3質量%以
下となるように重合を行うことを特徴とするレンズの製造方法及び該方法により得られる
レンズ用樹脂に関する。
(In the formula, R 1 is a divalent hydrocarbon group having 1 to 10 carbon atoms, and R 2 , R 3 and R 4 are each 1 to 10 carbon atoms.
10 hydrocarbon groups or hydrogen atoms are shown. In the production of an episulfide-based lens obtained by cast polymerization of a polymerizable composition containing an episulfide compound having one or more of the structures shown by (1), the episulfide group present in the resulting resin is 0. The present invention relates to a method for producing a lens, wherein the polymerization is carried out so as to be 3% by mass or less, and a lens resin obtained by the method.
(B):エピスルフィド化合物が下記式(2)で表される(A)のレンズの製造方法及び
レンズ用樹脂。
(B): The manufacturing method and lens resin of the lens of (A) whose episulfide compound is represented by following formula (2).
(式中、R5〜R10はそれぞれ炭素数1〜10の炭化水素基または水素原子を示す。Yは
、置換または未置換の直鎖、分岐または環状の炭素数1〜10の炭化水素基、置換または
未置換の1,4−ジチアン基、アリーレン基を表す。mは、0〜2の整数を表し、nは、
0〜4の整数を表す。)
(In the formula, R 5 to R 10 each represent a hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom. Y represents a substituted or unsubstituted linear, branched or cyclic hydrocarbon group having 1 to 10 carbon atoms. Represents a substituted or unsubstituted 1,4-dithiane group or an arylene group, m represents an integer of 0 to 2, and n represents
Represents an integer of 0 to 4; )
(C):エピスルフィド化合物が下記式(3)で表される(A)のレンズの製造方法及び
レンズ用樹脂に関するものである。
(C): The episulfide compound relates to a method for producing the lens of (A) represented by the following formula (3) and a lens resin.
(式中、R11〜R16はそれぞれ炭素数1〜10の炭化水素基または水素原子を表す。) (In the formula, R 11 to R 16 each represent a hydrocarbon group having 1 to 10 carbon atoms or a hydrogen atom.)
本発明において、樹脂中に存在するエピスルフィド基が0.3質量%以下とは、後述す
る分析法により樹脂中のエピスルフィド基のモル数を定量し、それにエピスルフィド基部
分の分子量(59/1モル)を乗じて樹脂中のエピスルフィド基部分の質量を算出し、樹
脂の質量で割った値である。
In the present invention, the fact that the episulfide group present in the resin is 0.3% by mass or less means that the number of moles of the episulfide group in the resin is quantified by the analysis method described later, and the molecular weight of the episulfide group portion (59/1 mole). The mass of the episulfide group portion in the resin is calculated by multiplying by and divided by the mass of the resin.
本発明により、樹脂中に存在するエピスルフィド基を0.3質量%以下にすることで、
離型性に優れ、且つ耐熱性の高いレンズを得ることが出来る。
According to the present invention, by making the episulfide group present in the resin 0.3 mass% or less,
A lens having excellent releasability and high heat resistance can be obtained.
その結果、レンズ製造時における離型時のレンズの破損または変形を防止することがで
き、レンズの生産性の向上につながる。
As a result, it is possible to prevent the lens from being damaged or deformed at the time of mold release during the manufacture of the lens, leading to an improvement in lens productivity.
以下に、本発明を詳細に説明する。 The present invention is described in detail below.
本発明のレンズ用樹脂は、樹脂中に存在するエピスルフィド基が0.3質量%以下とな
ることにより、耐熱性が優れ、離型性の良好なレンズが得られる。逆に樹脂中に存在する
エピスルフィド基が0.3質量%を越えて含有した場合、樹脂の耐熱性が低くなったり、
離型時の離型性が悪くなったり、離型時のレンズの破損または変形することがある。
The lens resin according to the present invention has an episulfide group present in the resin of 0.3% by mass or less, whereby a lens having excellent heat resistance and good releasability can be obtained. Conversely, if the episulfide group present in the resin exceeds 0.3% by mass, the heat resistance of the resin is reduced,
In some cases, the releasability at the time of releasing may be deteriorated, or the lens may be damaged or deformed at the time of releasing.
本発明において原料として用いられるエピスルフィド樹脂の具体例としては、ビス(β
−エピチオプロピル)スルフィド、ビス(β−エピチオプロピル)ジスルフィド、ビス(
β−エピチオプロピルチオ)メタン、1,2−ビス(β−エピチオプロピルチオ)エタン
、1,2−ビス(β−エピチオプロピルチオ)プロパン、1,3−ビス(β−エピチオプ
ロピルチオ)プロパン、1,3−ビス(β−エピチオプロピルチオ)−2−メチルプロパ
ン、1,4−ビス(β−エピチオプロピルチオ)ブタン、1,4−ビス(β−エピチオプ
ロピルチオ)−2−メチルブタン、1,3−ビス(β−エピチオプロピルチオ)ブタン、
1,5−ビス(β−エピチオプロピルチオ)ペンタン、1,5−ビス(β−エピチオプロ
ピルチオ)−2−メチルペンタン、1,5−ビス(β−エピチオプロピルチオ)−3−チ
アペンタン、1,6−ビス(β−エピチオプロピルチオ)ヘキサン、1,6−ビス(β−
エピチオプロピルチオ)−2−メチルヘキサン、3,8−ビス(β−エピチオプロピルチ
オ)−3,6−ジチアオクタン、1,2,3−トリス(β−エピチオプロピルチオ)プロ
パン、2,2−ビス(β−エピチオプロピルチオ)−1,3−ビス(β−エピチオプロピ
ルチオメチル)プロパン、2,2−ビス(β−エピチオプロピルチオメチル)−1−(β
ーエピチオプロピルチオ)ブタン、1,5−ビス(β−エピチオプロピルチオ)−2−(
β−エピチオプロピルチオメチル)−3−チアペンタン、1,5−ビス(β−エピチオプ
ロピルチオ)−2,4−ビス(β−エピチオプロピルチオメチル)−3−チアペンタン、
1−(β−エピチオプロピルチオ)−2,2−ビス(β−エピチオプロピルチオメチル)
−4−チアヘキサン、1,8−ビス(β−エピチオプロピルチオ)−4−(β−エピチオ
プロピルチオメチル)−3,6−ジチアオクタン、1,8−ビス(β−エピチオプロピル
チオ)−4,5−ビス(β−エピチオプロピルチオメチル)−3,6−ジチアオクタン、
1,8−ビス(β−エピチオプロピルチオ)−4,4−ビス(β−エピチオプロピルチオ
メチル)−3,6−ジチアオクタン、1,8−ビス(β−エピチオプロピルチオ)−2,
5−ビス(β−エピチオプロピルチオメチル)−3,6−ジチアオクタン、1,8−ビス
(β−エピチオプロピルチオ)−2,4,5−トリス(β−エピチオプロピルチオメチル
)−3,6−ジチアオクタン、1,1,1−トリス[{2−(β−エピチオプロピルチオ
)エチル}チオメチル]−2−(β−エピチオプロピルチオ)エタン、1,1,2,2−
テトラキス[{2−(β−エピチオプロピルチオ)エチル}チオメチル]エタン、1,1
1−ビス(β−エピチオプロピルチオ)−4,8−ビス(β−エピチオプロピルチオメチ
ル)−3,6,9−トリチアウンデカン、1,11−ビス(β−エピチオプロピルチオ)
−4,7−ビス(β−エピチオプロピルチオメチル)−3,6,9−トリチアウンデカン
、1,11−ビス(β−エピチオプロピルチオ)−5,7−ビス(β−エピチオプロピル
チオメチル)−3,6,9−トリチアウンデカン等の鎖状脂肪族のβ−エピチオプロピル
チオ化合物、及び、1,3−ビス(β−エピチオプロピルチオ)シクロヘキサン、1,4
−ビス(β−エピチオプロピルチオ)シクロヘキサン、1,3−ビス(β−エピチオプロ
ピルチオメチル)シクロヘキサン、1,4−ビス(β−エピチオプロピルチオメチル)シ
クロヘキサン、2,5−ビス(β−エピチオプロピルチオメチル)−1,4−ジチアン、
2,5−ビス[{2−(β−エピチオプロピルチオ)エチル}チオメチル]−1,4−ジ
チアン等の環状脂肪族のβ−エピチオプロピルチオ化合物、及び、1,3−ビス(β−エ
ピチオプロピルチオ)ベンゼン、1,4−ビス(β−エピチオプロピルチオ)ベンゼン、
1,3−ビス(β−エピチオプロピルチオメチル)ベンゼン、1,4−ビス(β−エピチ
オプロピルチオメチル)ベンゼン、ビス{4−(β−エピチオプロピルチオ)フェニル}
メタン、2,2−ビス{4−(β−エピチオプロピルチオ)フェニル}プロパン、ビス{
4−(β−エピチオプロピルチオ)フェニル}スルフィド、ビス{4−(β−エピチオプ
ロピルチオ)フェニル}スルフォン、4,4’−ビス(β−エピチオプロピルチオ)ビフ
ェニル等の芳香族β−エピチオプロピルチオ化合物等、更に3−メルカプトプロピレンス
ルフィド、4−メルカプトブテンスルフィド等、メルカプト基含有エピチオ化合物等を挙
げることができるが、これらの例示化合物のみに限定されるものではない。また、これら
の化合物は単独でも2種類以上を混合して使用しても良い。
Specific examples of the episulfide resin used as a raw material in the present invention include bis (β
-Epithiopropyl) sulfide, bis (β-epithiopropyl) disulfide, bis (
β-epithiopropylthio) methane, 1,2-bis (β-epithiopropylthio) ethane, 1,2-bis (β-epithiopropylthio) propane, 1,3-bis (β-epithiopropyl) Thio) propane, 1,3-bis (β-epithiopropylthio) -2-methylpropane, 1,4-bis (β-epithiopropylthio) butane, 1,4-bis (β-epithiopropylthio) ) -2-methylbutane, 1,3-bis (β-epithiopropylthio) butane,
1,5-bis (β-epithiopropylthio) pentane, 1,5-bis (β-epithiopropylthio) -2-methylpentane, 1,5-bis (β-epithiopropylthio) -3- Thiapentane, 1,6-bis (β-epithiopropylthio) hexane, 1,6-bis (β-
Epithiopropylthio) -2-methylhexane, 3,8-bis (β-epithiopropylthio) -3,6-dithiaoctane, 1,2,3-tris (β-epithiopropylthio) propane, 2, 2-bis (β-epithiopropylthio) -1,3-bis (β-epithiopropylthiomethyl) propane, 2,2-bis (β-epithiopropylthiomethyl) -1- (β
-Epithiopropylthio) butane, 1,5-bis (β-epithiopropylthio) -2- (
β-epithiopropylthiomethyl) -3-thiapentane, 1,5-bis (β-epithiopropylthio) -2,4-bis (β-epithiopropylthiomethyl) -3-thiapentane,
1- (β-epithiopropylthio) -2,2-bis (β-epithiopropylthiomethyl)
-4-thiahexane, 1,8-bis (β-epithiopropylthio) -4- (β-epithiopropylthiomethyl) -3,6-dithiaoctane, 1,8-bis (β-epithiopropylthio) -4,5-bis (β-epithiopropylthiomethyl) -3,6-dithiaoctane,
1,8-bis (β-epithiopropylthio) -4,4-bis (β-epithiopropylthiomethyl) -3,6-dithiaoctane, 1,8-bis (β-epithiopropylthio) -2 ,
5-bis (β-epithiopropylthiomethyl) -3,6-dithiaoctane, 1,8-bis (β-epithiopropylthio) -2,4,5-tris (β-epithiopropylthiomethyl)- 3,6-dithiaoctane, 1,1,1-tris [{2- (β-epithiopropylthio) ethyl} thiomethyl] -2- (β-epithiopropylthio) ethane, 1,1,2,2-
Tetrakis [{2- (β-epithiopropylthio) ethyl} thiomethyl] ethane, 1,1
1-bis (β-epithiopropylthio) -4,8-bis (β-epithiopropylthiomethyl) -3,6,9-trithiaundecane, 1,11-bis (β-epithiopropylthio)
-4,7-bis (β-epithiopropylthiomethyl) -3,6,9-trithiaundecane, 1,11-bis (β-epithiopropylthio) -5,7-bis (β-epithio) Chain aliphatic β-epithiopropylthio compounds such as propylthiomethyl) -3,6,9-trithiaundecane, 1,3-bis (β-epithiopropylthio) cyclohexane, 1,4
-Bis (β-epithiopropylthio) cyclohexane, 1,3-bis (β-epithiopropylthiomethyl) cyclohexane, 1,4-bis (β-epithiopropylthiomethyl) cyclohexane, 2,5-bis ( β-epithiopropylthiomethyl) -1,4-dithiane,
Cycloaliphatic β-epithiopropylthio compounds such as 2,5-bis [{2- (β-epithiopropylthio) ethyl} thiomethyl] -1,4-dithiane, and 1,3-bis (β -Epithiopropylthio) benzene, 1,4-bis (β-epithiopropylthio) benzene,
1,3-bis (β-epithiopropylthiomethyl) benzene, 1,4-bis (β-epithiopropylthiomethyl) benzene, bis {4- (β-epithiopropylthio) phenyl}
Methane, 2,2-bis {4- (β-epithiopropylthio) phenyl} propane, bis {
Aromatic β such as 4- (β-epithiopropylthio) phenyl} sulfide, bis {4- (β-epithiopropylthio) phenyl} sulfone, 4,4′-bis (β-epithiopropylthio) biphenyl -Epithiopropylthio compounds and the like, 3-mercaptopropylene sulfide, 4-mercaptobutene sulfide and the like, and mercapto group-containing epithio compounds can be exemplified, but are not limited to these exemplified compounds. These compounds may be used alone or in combination of two or more.
本発明の重合性組成物には、これらエピスルフィド樹脂の混合物ばかりでなく、その他
、これら樹脂の2量体、3量体、4量体等のポリスルフィドオリゴマー類、エピスルフィ
ド樹脂合成の際にエピハロヒドリンが不足した場合に生成するメルカプト基を有するエピ
スルフィド樹脂類、更に、エピスルフィド合成時に用いた、無機酸類や有機酸類、溶媒、
未反応原料及びその他副生物並びに不純物等の有機化合物、無機化合物も問題にならない
範囲で含まれてよい。
The polymerizable composition of the present invention lacks not only a mixture of these episulfide resins, but also other polysulfide oligomers such as dimers, trimers and tetramers of these resins, and epihalohydrin in the synthesis of episulfide resins. Episulfide resins having a mercapto group to be generated in the case of the above, and further, inorganic acids and organic acids, solvents,
Organic compounds such as unreacted raw materials and other by-products, impurities, and inorganic compounds may be included as long as they do not cause a problem.
本発明の方法においてレンズを得る場合、硬化触媒の存在下あるいは不存在下に、加熱
あるいは常温放置により重合がなされ、レンズを製造することができるが、硬化触媒がな
い場合は重合が良好に進行せず重合不良となる、または重合しない場合がある。本発明の
レンズを製造する際に用いる硬化触媒としてはアミン類、ホスフィン類、ルイス酸類、ラ
ジカル重合触媒類、カチオン重合触媒類等が通常用いられる。
When a lens is obtained by the method of the present invention, polymerization can be carried out by heating or standing at room temperature in the presence or absence of a curing catalyst, and a lens can be produced, but when there is no curing catalyst, the polymerization proceeds well. May cause poor polymerization or may not polymerize. As the curing catalyst used in producing the lens of the present invention, amines, phosphines, Lewis acids, radical polymerization catalysts, cationic polymerization catalysts and the like are usually used.
具体的にアミン類としては、エチルアミン、n−プロピルアミン、イソプロピルアミン
、n−ブチルアミン、sec−ブチルアミン、t−ブチルアミン、シクロヘキシルアミン
、2−アミノエタノール、ジブチルアミン、トリエチルアミン、トリn−ブチルアミン、
トリn−ヘキシルアミン、N,N−ジイソプロピルエチルアミン、トリエチレンジアミン
、トリフェニルアミン、N,N−ジエチルエタノールアミン、N,N−ジn−ブチルエタ
ノールアミン、N,N−ジメチルベンジルアミン、ジエチルベンジルアミン、N,N−ジ
メチルシクロヘキシルアミン、N,N−ジエチルシクロヘキシルアミン、N−メチルジシ
クロヘキシルアミン、N−メチルモルホリン、N−イソプロピルモルホリン、ピリジン、
N,N−ジメチルアニリン、β−ピコリン、ピペリジン、2,2’−ビピリジル、ジシア
ンジアミド、ヘキサメチレンテトラミン、1,8−ジアザビシクロ(5,4,0)−7−
ウンデセン等が挙げられる。ホスフィン類としては、トリメチルホスフィン、トリエチル
ホスフィン、トリn−プロピルホスフィン、トリイソプロピルホスフィン、トリn−ブチ
ルホスフィン、トリフェニルホスフィン、トリベンジルホスフィン、1,2−ビス(ジフ
ェニルホスフィノ)エタン、1,2−ビス(ジメチルホスフィノ)エタン等が挙げられる
。ルイス酸類としては、ジメチル錫ジクロライド、ジブチル錫ジクロライド、ジブチル錫
ジラウレート、テトラクロロ錫、ジブチル錫オキサイド、塩化亜鉛、アセチルアセトン亜
鉛、塩化アルミ、フッ化アルミ、トリフェニルアルミ、テトラクロロチタン、酢酸カルシ
ウム等が挙げられる。ラジカル重合触媒としては、2,2’−アゾビス(2−シクロプロ
ピルプロピオニトリル)、2,2’−アゾビス(4−メトキシ−2,4−ジメチルバレロ
ニトリル)、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、t−ブチルパー
オキシ−2−エチルヘキサノエート、n−ブチル−4,4’−ビス(t−ブチルパーオキ
シ)バレレート、t−ブチルパーオキシベンゾエート等が挙げられ、カチオン重合触媒と
しては、ジフェニルヨードニウムヘキサフルオロ燐酸、ジフェニルヨードニウムヘキサフ
ルオロ砒酸、ジフェニルヨードニウムヘキサフルオロアンチモン、トリフェニルスルフォ
ニウムテトラフルオロ硼酸、トリフェニルスルフォニウムヘキサフルオロ燐酸、トリフェ
ニルスルフォニウムヘキサフルオロ砒酸等が挙げられるがこれら例示化合物のみに限定さ
れるものではない。これらは単独でも2種以上を混合して用いても良い。
Specific examples of amines include ethylamine, n-propylamine, isopropylamine, n-butylamine, sec-butylamine, t-butylamine, cyclohexylamine, 2-aminoethanol, dibutylamine, triethylamine, tri-n-butylamine,
Tri-n-hexylamine, N, N-diisopropylethylamine, triethylenediamine, triphenylamine, N, N-diethylethanolamine, N, N-di-n-butylethanolamine, N, N-dimethylbenzylamine, diethylbenzylamine N, N-dimethylcyclohexylamine, N, N-diethylcyclohexylamine, N-methyldicyclohexylamine, N-methylmorpholine, N-isopropylmorpholine, pyridine,
N, N-dimethylaniline, β-picoline, piperidine, 2,2′-bipyridyl, dicyandiamide, hexamethylenetetramine, 1,8-diazabicyclo (5,4,0) -7-
Undecene etc. are mentioned. Examples of phosphines include trimethylphosphine, triethylphosphine, tri-n-propylphosphine, triisopropylphosphine, tri-n-butylphosphine, triphenylphosphine, tribenzylphosphine, 1,2-bis (diphenylphosphino) ethane, 1,2 -Bis (dimethylphosphino) ethane etc. are mentioned. Lewis acids include dimethyltin dichloride, dibutyltin dichloride, dibutyltin dilaurate, tetrachlorotin, dibutyltin oxide, zinc chloride, acetylacetone zinc, aluminum chloride, aluminum fluoride, triphenylaluminum, tetrachlorotitanium, calcium acetate, etc. Can be mentioned. As the radical polymerization catalyst, 2,2′-azobis (2-cyclopropylpropionitrile), 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2′-azobis (2 , 4-dimethylvaleronitrile), t-butylperoxy-2-ethylhexanoate, n-butyl-4,4′-bis (t-butylperoxy) valerate, t-butylperoxybenzoate and the like. As the cationic polymerization catalyst, diphenyliodonium hexafluorophosphoric acid, diphenyliodonium hexafluoroarsenic acid, diphenyliodonium hexafluoroantimony, triphenylsulfonium tetrafluoroboric acid, triphenylsulfonium hexafluorophosphoric acid, triphenylsulfonium hexafluoroarsenic acid, etc. Can be mentioned It is not limited only to these exemplary compounds. These may be used alone or in admixture of two or more.
これらの例示化合物のうち、好ましい化合物としては、N,N−ジイソプロピルエチル
アミン、N−メチルジシクロヘキシルアミン、N,N−ジメチルシクロヘキシルアミン、
N,N−ジエチルエタノールアミンであり、これらの3級アミン類は触媒活性の異なるも
のを2種類以上混合し用いることで良好な結果が得られる。
Among these exemplified compounds, preferred compounds include N, N-diisopropylethylamine, N-methyldicyclohexylamine, N, N-dimethylcyclohexylamine,
It is N, N-diethylethanolamine, and good results can be obtained by mixing two or more of these tertiary amines having different catalytic activities.
触媒活性の異なる3級アミン類の組み合わせの好ましい例としては、使用するエピスル
フィド化合物の種類や樹脂改質剤等の種類によって一概に限定はできないが、N,N−ジ
メチルシクロヘキシルアミンとN−メチルジシクロヘキシルアミン、N,N−ジメチルシ
クロヘキシルアミンとN,N−ジイソプロピルエチルアミン、N,N−ジエチルエタノー
ルアミンとN−メチルジシクロヘキシルアミン等の組み合わせが挙げられる。
Preferable examples of combinations of tertiary amines having different catalytic activities are not limited in general depending on the type of episulfide compound used or the type of resin modifier, but N, N-dimethylcyclohexylamine and N-methyldicyclohexyl Examples thereof include a combination of amine, N, N-dimethylcyclohexylamine and N, N-diisopropylethylamine, N, N-diethylethanolamine and N-methyldicyclohexylamine.
硬化触媒の添加量は、エピスルフィド樹脂から成る組成物の総重量に対して0.001
〜10質量%の範囲で用いられ、好ましくは0.01〜5質量%の範囲で使用される。硬
化触媒の添加量が0.001質量%未満であると重合不良の原因となる場合がある。一方
、10質量%を越えてもできるが、ポットライフが短くなり、透明性、光学物性、又は耐
候性が低下するなどの不都合が生じてくる場合がある。
The addition amount of the curing catalyst is 0.001 with respect to the total weight of the composition comprising the episulfide resin.
It is used in the range of 10 to 10% by mass, preferably in the range of 0.01 to 5% by mass. If the addition amount of the curing catalyst is less than 0.001% by mass, polymerization failure may be caused. On the other hand, even if it exceeds 10% by mass, the pot life is shortened, and there may be inconveniences such as a decrease in transparency, optical properties, or weather resistance.
本発明におけるレンズ用モノマーには、主に得られるレンズの屈折率等の光学物性の調
整や比重等の諸物性の調整、モノマーの粘度、その他の取り扱いを調整するため等、樹脂
の改良をする目的で樹脂改質剤を加えることができる。
In the lens monomer of the present invention, the resin is improved mainly for adjustment of optical physical properties such as refractive index of the lens obtained, adjustment of various physical properties such as specific gravity, adjustment of monomer viscosity, and other handling. A resin modifier can be added for the purpose.
樹脂改質剤としては、本発明に係わる重合性組成物に含まれる以外のエピスルフィド化
合物類、エポキシ化合物類、(メタ)アクリレート類を含むオレフィン類、アミン化合物
類、チオール化合物類、ポリフェノール類、アミノ酸及びメルカプトアミン類、有機酸類
及び無水物、メルカプト有機酸類、が挙げられる。
Examples of the resin modifier include episulfide compounds other than those contained in the polymerizable composition according to the present invention, epoxy compounds, olefins including (meth) acrylates, amine compounds, thiol compounds, polyphenols, amino acids And mercaptoamines, organic acids and anhydrides, and mercapto organic acids.
樹脂改質剤としてのエポキシ化合物類の好ましいものの具体例としては、ビスフェノー
ルAグリシジルエーテル等の多価フェノール化合物とエピハロヒドリン化合物との縮合反
応により得られるフェノール系エポキシ化合物、水添ビスフェノールAグリシジルエーテ
ル等の多価アルコール化合物とエピハロヒドリン化合物との縮合により得られるアルコー
ル系エポキシ化合物、3,4−エポキシシクロヘキシルメチル−3’,4’−エポキシシ
クロヘキサンカルボキシレートや1,2−ヘキサヒドロフタル酸ジグリシジルエステル等
の多価有機酸化合物とエピハロヒドリン化合物との縮合により得られるグリシジルエステ
ル系エポキシ化合物、一級及び二級ジアミン化合物とエピハロヒドリン化合物との縮合に
より得られるアミン系エポキシ化合物等その他、ビニルシクロヘキセンジエポキシド等脂
肪族多価エポキシ化合物等を挙げることができるが、これらの例示化合物のみに限定され
るものではない。また、これらは単独でも、2種類以上を混合して使用してもかまわない
。
Specific examples of preferred epoxy compounds as resin modifiers include phenolic epoxy compounds obtained by condensation reaction of polyphenol compounds such as bisphenol A glycidyl ether and epihalohydrin compounds, hydrogenated bisphenol A glycidyl ether, and the like. Alcohol-based epoxy compounds obtained by condensation of polyhydric alcohol compounds and epihalohydrin compounds, 3,4-epoxycyclohexylmethyl-3 ′, 4′-epoxycyclohexanecarboxylate, 1,2-hexahydrophthalic acid diglycidyl ester, etc. Glycidyl ester epoxy compounds obtained by condensation of polyvalent organic acid compounds and epihalohydrin compounds, amine epoxidation obtained by condensation of primary and secondary diamine compounds with epihalohydrin compounds Objects, etc. and, there may be mentioned vinyl cyclohexene diepoxide and an aliphatic polyhydric epoxy compound such as, but not limited to only these exemplified compounds. These may be used alone or in combination of two or more.
また、樹脂改質剤としてのオレフィン類の好ましいものの具体例としては、ベンジルア
クリレート、ベンジルメタクリレート、ブトキシエチルアクリレート、ブトキシメチルメ
タクリレート、シクロヘキシルアクリレート、シクロヘキシルメタクリレート、2−ヒド
ロキシエチルアクリレート、2−ヒドロキシメチルメタクリレート、グリシジルアクリレ
ート、グリシジルメタクリレート、フェノキシエチルアクリレート、フェノキシエチルメ
タクリレート、フェニルメタクリレート、エチレングリコールジアクリレート、エチレン
グリコールジメタクリレート、ジエチレングリコールジアクリレート、ジエチレングリコ
ールジメタクリレート、トリエチレングリコールジアクリレート、トリエチレングリコー
ルジメタクリレート、テトラエチレングリコールジアクリレート、テトラエチレングリコ
ールジメタクリレート、ポリエチレングリコールジアクリレート、ポリエチレングリコー
ルジメタクリレート、ネオペンチルグリコールジアクリレート、ネオペンチルグリコール
ジメタクリレート、エチレングリコールビスグリシジルアクリレート、エチレングリコー
ルビスグリシジルメタクリレート、ビスフェノールAジアクリレート、ビスフェノールA
ジメタクリレート、2,2−ビス(4−アクロキシエトキシフェニル)プロパン、2,2
−ビス(4−メタクロキシエトキシフェニル)プロパン、2,2−ビス(4−アクロキシ
ジエトキシフェニル)プロパン、2,2−ビス(4−メタクロキシジエトキシフェニル)
プロパン、ビスフェノールFジアクリレート、ビスフェノールFジメタクリレート、1,
1−ビス(4−アクロキシエトキシフェニル)メタン、1,1−ビス(4−メタクロキシ
エトキシフェニル)メタン、1,1−ビス(4−アクロキシジエトキシフェニル)メタン
、1,1−ビス(4−メタクロキシジエトキシフェニル)メタン、ジメチロールトリシク
ロデカンジアクリレート、トリメチロールプロパントリアクリレート、トリメチロールプ
ロパントリメタクリレート、グリセロールジアクリレート、グリセロールジメタクリレー
ト、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート
、ペンタエリスリトールテトラメタクリレート、メチルチオアクリレート、メチルチオメ
タクリレート、フェニルチオアクリレート、ベンジルチオメタクリレート、キシリレンジ
チオールジアクリレート、キシリレンジチオールジメタクリレート、メルカプトエチルス
ルフィドジアクリレート、メルカプトエチルスルフィドジメタクリレート等の(メタ)ア
クリレート化合物、アリルグリシジルエーテル、ジアリルフタレート、ジアリルテレフタ
レート、ジアリルイソフタレート、ジアリルカーボネート、ジエチレングリコールビスア
リルカーボネート等のアリル化合物、スチレン、クロロスチレン、メチルスチレン、ブロ
モスチレン、ジブロモスチレン、ジビニルベンゼン、3,9−ジビニルスピロビ(m−ジ
オキサン)等のビニル化合物、ジイソプロペニルベンゼン等が挙げられるが、これらの例
示化合物のみに限定されるものではない。また、これらは単独でも、2種類以上を混合し
て使用してもかまわない。
Specific examples of preferred olefins as the resin modifier include benzyl acrylate, benzyl methacrylate, butoxyethyl acrylate, butoxymethyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxymethyl methacrylate, Glycidyl acrylate, glycidyl methacrylate, phenoxyethyl acrylate, phenoxyethyl methacrylate, phenyl methacrylate, ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene Lenglycol diacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, ethylene glycol bisglycidyl acrylate, ethylene glycol bisglycidyl methacrylate, bisphenol A diacrylate, Bisphenol A
Dimethacrylate, 2,2-bis (4-acryloxyethoxyphenyl) propane, 2,2
-Bis (4-methacryloxyethoxyphenyl) propane, 2,2-bis (4-acryloxydiethoxyphenyl) propane, 2,2-bis (4-methacryloxyethoxy)
Propane, bisphenol F diacrylate, bisphenol F dimethacrylate, 1,
1-bis (4-acryloxyethoxyphenyl) methane, 1,1-bis (4-methacryloxyethoxyphenyl) methane, 1,1-bis (4-acryloxyethoxyphenyl) methane, 1,1-bis ( 4-methacryloxydiethoxyphenyl) methane, dimethyloltricyclodecane diacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, glycerol diacrylate, glycerol dimethacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, pentaerythritol Tetramethacrylate, methylthioacrylate, methylthiomethacrylate, phenylthioacrylate, benzylthiomethacrylate, xylylenedithiol diacrylate, key (Meth) acrylate compounds such as lylene dithiol dimethacrylate, mercaptoethyl sulfide diacrylate, mercaptoethyl sulfide dimethacrylate, allyl compounds such as allyl glycidyl ether, diallyl phthalate, diallyl terephthalate, diallyl isophthalate, diallyl carbonate, diethylene glycol bisallyl carbonate , Styrene, chlorostyrene, methylstyrene, bromostyrene, dibromostyrene, divinylbenzene, vinyl compounds such as 3,9-divinylspirobi (m-dioxane), and diisopropenylbenzene, but are limited to these exemplified compounds. Is not to be done. These may be used alone or in combination of two or more.
以上の樹脂改質剤はいずれも単独種で使用することも、2種類以上を混合して使用する
こともできる。
Any of the above resin modifiers can be used alone or in combination of two or more.
樹脂改質剤としてのアミン化合物類の好ましいものの具体例としては、エチルアミン、
n−プロピルアミン、イソプロピルアミン、n−ブチルアミン、sec−ブチルアミン、
tert−ブチルアミン、ペンチルアミン、ヘキシルアミン、ヘプチルアミン、オクチル
アミン、デシルアミン、ラウリルアミン、ミリスチルアミン、3−ペンチルアミン、2−
エチルヘキシルアミン、1,2−ジメチルヘキシルアミン、アリルアミン、アミノメチル
ビシクロヘプタン、シクロペンチルアミン、シクロヘキシルアミン、2,3−ジメチルシ
クロヘキシルアミン、アミノメチルシクロヘキサン、アニリン、ベンジルアミン、フェネ
チルアミン、2,3−、あるいは4−メチルベンジルアミン、o−、m−、あるいはp−
メチルアニリン、o−、m−、あるいはp−エチルアニリン、アミノモルホリン、ナフチ
ルアミン、フルフリルアミン、α−アミノジフェニルメタン、トルイジン、アミノピリジ
ン、アミノフェノール、アミノエタノール、1−アミノプロパノール、2−アミノプロパ
ノール、アミノブタノール、アミノペンタノール、アミノヘキサノール、メトキシエチル
アミン、2−(2−アミノエトキシ)エタノール、3−エトキシプロピルアミン、3−プ
ロポキシプロピルアミン、3−ブトキシプロピルアミン、3−イソプロポキシプロピルア
ミン、3−イソブトキシプロピルアミン、2,2−ジエトキシエチルアミン等の単官能1
級アミン化合物、エチレンジアミン、1,2−、あるいは1,3−ジアミノプロパン、1
,2−、1,3−、あるいは1,4−ジアミノブタン、1,5−ジアミノペンタン、1,
6−ジアミノヘキサン、1,7−ジアミノヘプタン、1,8−ジアミノオクタン、1,1
0−ジアミノデカン、1,2−、1,3−、あるいは1,4−ジアミノシクロヘキサン、
o−、m−あるいはp−ジアミノベンゼン、3,4−あるいは4,4’−ジアミノベンゾ
フェノン、3,4−あるいは4,4’−ジアミノジフェニルエーテル、4,4’−ジアミ
ノジフェニルメタン、4,4’−ジアミノジフェニルスルフィド、3,3’−、あるいは
4,4’−ジアミノジフェニルスルフォン、2,7−ジアミノフルオレン、1,5−、1
,8−、あるいは2,3−ジアミノナフタレン、2,3−、2,6−、あるいは3,4−
ジアミノピリジン、2,4−、あるいは2,6−ジアミノトルエン、m−、あるいはp−
キシリレンジアミン、イソホロンジアミン、ジアミノメチルビシクロヘプタン、1,3−
、あるいは1,4−ジアミノメチルシクロヘキサン、2−、あるいは4−アミノピペリジ
ン、2−、あるいは4−アミノメチルピペリジン、2−、あるいは4−アミノエチルピペ
リジン、N−アミノエチルモルホリン、N−アミノプロピルモルホリン等の1級ポリアミ
ン化合物、ジエチルアミン、ジプロピルアミン、ジ−n−ブチルアミン、ジ−sec−ブ
チルアミン、ジイソブチルアミン、ジ−n−ペンチルアミン、ジ−3−ペンチルアミン、
ジヘキシルアミン、ジオクチルアミン、ジ(2−エチルヘキシル)アミン、メチルヘキシ
ルアミン、ジアリルアミン、N−メチルアリルアミン、ピペリジン、ピロリジン、ジフェ
ニルアミン、N−メチルアミン、N−エチルアミン、ジベンジルアミン、N−メチルベン
ジルアミン、N−エチルベンジルアミン、ジシクロヘキシルアミン、N−メチルアニリン
、N−エチルアニリン、ジナフチルアミン、1−メチルピペラジン、モルホリン等の単官
能2級アミン化合物、N,N’−ジメチルエチレンジアミン、N,N’−ジメチル−1,
2−ジアミノプロパン、N,N’−ジメチル−1,3−ジアミノプロパン、N,N’−ジ
メチル−1,2−ジアミノブタン、N,N’−ジメチル−1,3−ジアミノブタン、N,
N’−ジメチル−1,4−ジアミノブタン、N,N’−ジメチル−1,5−ジアミノペン
タン、N,N’−ジメチル−1,6−ジアミノヘキサン、N,N’−ジメチル−1,7−
ジアミノヘプタン、N,N’−ジエチルエチレンジアミン、N,N’−ジエチル−1,2
−ジアミノプロパン、N,N’−ジエチル−1,3−ジアミノプロパン、N,N’−ジエ
チル−1,2−ジアミノブタン、N,N’−ジエチル−1,3−ジアミノブタン、N,N
’−ジエチル−1,4−ジアミノブタン、N,N’−ジエチル−1,5−ジアミノペンタ
ン、N,N’−ジエチル−1,6−ジアミノヘキサン、N,N’−ジエチル−1,7−ジ
アミノヘプタン、ピペラジン、2−メチルピペラジン、2,5−ジメチルピペラジン、2
,6−ジメチルピペラジン、ホモピペラジン、1,1−ジ−(4−ピペリジル)メタン、
1,2−ジ−(4−ピペリジル)エタン、1,3−ジ−(4−ピペリジル)プロパン、1
,4−ジ−(4−ピペリジル)ブタン、テトラメチルグアニジン等の2級ポリアミン化合
物等を挙げることができるが、これらの例示化合物のみに限定されるものではない。また
、これらは単独でも、2種類以上を混合して使用してもかまわない。これら例示化合物の
なかで、より好ましいものは、ベンジルアミン、ピペラジン類である。
Specific examples of preferred amine compounds as resin modifiers include ethylamine,
n-propylamine, isopropylamine, n-butylamine, sec-butylamine,
tert-butylamine, pentylamine, hexylamine, heptylamine, octylamine, decylamine, laurylamine, myristylamine, 3-pentylamine, 2-
Ethylhexylamine, 1,2-dimethylhexylamine, allylamine, aminomethylbicycloheptane, cyclopentylamine, cyclohexylamine, 2,3-dimethylcyclohexylamine, aminomethylcyclohexane, aniline, benzylamine, phenethylamine, 2,3-, or 4 -Methylbenzylamine, o-, m-, or p-
Methylaniline, o-, m-, or p-ethylaniline, aminomorpholine, naphthylamine, furfurylamine, α-aminodiphenylmethane, toluidine, aminopyridine, aminophenol, aminoethanol, 1-aminopropanol, 2-aminopropanol, amino Butanol, aminopentanol, aminohexanol, methoxyethylamine, 2- (2-aminoethoxy) ethanol, 3-ethoxypropylamine, 3-propoxypropylamine, 3-butoxypropylamine, 3-isopropoxypropylamine, 3-iso Monofunctional 1 such as butoxypropylamine, 2,2-diethoxyethylamine
Quaternary amine compounds, ethylenediamine, 1,2- or 1,3-diaminopropane, 1
, 2-, 1,3- or 1,4-diaminobutane, 1,5-diaminopentane, 1,
6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,1
0-diaminodecane, 1,2-, 1,3-, or 1,4-diaminocyclohexane,
o-, m- or p-diaminobenzene, 3,4- or 4,4'-diaminobenzophenone, 3,4- or 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'- Diaminodiphenyl sulfide, 3,3′- or 4,4′-diaminodiphenylsulfone, 2,7-diaminofluorene, 1,5-, 1
, 8-, or 2,3-diaminonaphthalene, 2,3-, 2,6-, or 3,4-
Diaminopyridine, 2,4-, or 2,6-diaminotoluene, m-, or p-
Xylylenediamine, isophoronediamine, diaminomethylbicycloheptane, 1,3-
1,4-diaminomethylcyclohexane, 2-, or 4-aminopiperidine, 2-, or 4-aminomethylpiperidine, 2-, or 4-aminoethylpiperidine, N-aminoethylmorpholine, N-aminopropylmorpholine Primary polyamine compounds such as diethylamine, dipropylamine, di-n-butylamine, di-sec-butylamine, diisobutylamine, di-n-pentylamine, di-3-pentylamine,
Dihexylamine, dioctylamine, di (2-ethylhexyl) amine, methylhexylamine, diallylamine, N-methylallylamine, piperidine, pyrrolidine, diphenylamine, N-methylamine, N-ethylamine, dibenzylamine, N-methylbenzylamine, Monofunctional secondary amine compounds such as N-ethylbenzylamine, dicyclohexylamine, N-methylaniline, N-ethylaniline, dinaphthylamine, 1-methylpiperazine, morpholine, N, N'-dimethylethylenediamine, N, N'- Dimethyl-1,
2-diaminopropane, N, N′-dimethyl-1,3-diaminopropane, N, N′-dimethyl-1,2-diaminobutane, N, N′-dimethyl-1,3-diaminobutane, N,
N′-dimethyl-1,4-diaminobutane, N, N′-dimethyl-1,5-diaminopentane, N, N′-dimethyl-1,6-diaminohexane, N, N′-dimethyl-1,7 −
Diaminoheptane, N, N′-diethylethylenediamine, N, N′-diethyl-1,2
-Diaminopropane, N, N'-diethyl-1,3-diaminopropane, N, N'-diethyl-1,2-diaminobutane, N, N'-diethyl-1,3-diaminobutane, N, N
'-Diethyl-1,4-diaminobutane, N, N'-diethyl-1,5-diaminopentane, N, N'-diethyl-1,6-diaminohexane, N, N'-diethyl-1,7- Diaminoheptane, piperazine, 2-methylpiperazine, 2,5-dimethylpiperazine, 2
, 6-dimethylpiperazine, homopiperazine, 1,1-di- (4-piperidyl) methane,
1,2-di- (4-piperidyl) ethane, 1,3-di- (4-piperidyl) propane,
, 4-di- (4-piperidyl) butane, secondary polyamine compounds such as tetramethylguanidine, and the like, but are not limited to these exemplified compounds. These may be used alone or in combination of two or more. Of these exemplified compounds, more preferred are benzylamine and piperazines.
また、チオール化合物類の好ましいものの具体例としては、メチルメルカプタン、エチ
ルメルカプタン、1,2−エタンジチオール、1,2−プロパンジチオール、1,3−プ
ロパンジチオール、2,2−プロパンジチオール、1,4−ブタンジチオール、1,2,
3−トリメルカプトプロパン、テトラキス(メルカプトメチル)メタン、1,2−ジメル
カプトシクロヘキサン、ビス(2−メルカプトエチル)スルフィド、2,3−ジメルカプ
ト−1−プロパノール、エチレングリコールビス(3−メルカプトプロピオネート)、ジ
エチレングリコールビス(3−メルカプトプロピオネート)、ジエチレングリコールビス
(2−メルカプトグリコレート)、ペンタエリスリトールテトラキス(2−メルカプトチ
オグリコレート)、ペンタエリスリトールテトラキス(3−メルカプトプロピオネート)
、トリメチロールプロパントリス(2−メルカプトチオグリコレート)、トリメチロール
プロパントリス3−メルカプトプロピオネート)、1,1,1−トリメチルメルカプトエ
タン、1,1,1−トリメチルメルカプトプロパン、2,5−ジメルカプトメチルチオフ
ァン、4−メルカプトメチル−1,8−ジメルカプト−3,6−ジチアオクタン、2,5
−ジメルカプトメチル−1,4−ジチアン、2,5−ビス{(2−メルカプトエチル)チ
オメチル}−1,4−ジチアン、1,3−シクロヘキサンジチオール、1,4−シクロヘ
キサンジチオール、4,8−ジメルカプトメチル−1,11−ジメルカプト−3,6,9
−トリチアウンデカン、4,7−ジメルカプトメチル−1,11−ジメルカプト−3,6
,9−トリチアウンデカン、5,7−ジメルカプトメチル−1,11−ジメルカプト−3
,6,9−トリチアウンデカン等の脂肪族チオール、及びベンジルメルカプタン、チオフ
ェノール、1,2−ジメルカプトベンゼン、1,3−ジメルカプトベンゼン、1,4−ジ
メルカプトベンゼン、1,2−ビス(メルカプトメチル)ベンゼン、1,3−ビス(メル
カプトメチル)ベンゼン、1,4−ビス(メルカプトメチル)ベンゼン、2,2’−ジメ
ルカプトビフェニル、4,4’−ジメルカプトビフェニル、ビス(4−メルカプトフェニ
ル)メタン、ビス(4−メルカプトフェニル)スルフィド、ビス(4−メルカプトフェニ
ル)スルフォン、2,2−ビス(4−メルカプトフェニル)プロパン、1,2,3−トリ
メルカプトベンゼン、1,2,4−トリメルカプトベンゼン、1,2,5−トリメルカプ
トベンゼン等の芳香族チオールが挙げられるが、これらの例示化合物のみに限定されるも
のではない。また、これらは単独でも、2種類以上を混合して使用してもかまわない。
Specific examples of preferred thiol compounds include methyl mercaptan, ethyl mercaptan, 1,2-ethanedithiol, 1,2-propanedithiol, 1,3-propanedithiol, 2,2-propanedithiol, 1,4 -Butanedithiol 1,2,
3-trimercaptopropane, tetrakis (mercaptomethyl) methane, 1,2-dimercaptocyclohexane, bis (2-mercaptoethyl) sulfide, 2,3-dimercapto-1-propanol, ethylene glycol bis (3-mercaptopropionate) ), Diethylene glycol bis (3-mercaptopropionate), diethylene glycol bis (2-mercaptoglycolate), pentaerythritol tetrakis (2-mercaptothioglycolate), pentaerythritol tetrakis (3-mercaptopropionate)
, Trimethylolpropane tris (2-mercaptothioglycolate), trimethylolpropane tris3-mercaptopropionate), 1,1,1-trimethylmercaptoethane, 1,1,1-trimethylmercaptopropane, 2,5- Dimercaptomethylthiophane, 4-mercaptomethyl-1,8-dimercapto-3,6-dithiaoctane, 2,5
-Dimercaptomethyl-1,4-dithiane, 2,5-bis {(2-mercaptoethyl) thiomethyl} -1,4-dithiane, 1,3-cyclohexanedithiol, 1,4-cyclohexanedithiol, 4,8- Dimercaptomethyl-1,11-dimercapto-3,6,9
-Trithiaundecane, 4,7-dimercaptomethyl-1,11-dimercapto-3,6
, 9-trithiaundecane, 5,7-dimercaptomethyl-1,11-dimercapto-3
Aliphatic thiols such as 1,6,9-trithiaundecane, and benzyl mercaptan, thiophenol, 1,2-dimercaptobenzene, 1,3-dimercaptobenzene, 1,4-dimercaptobenzene, 1,2-bis (Mercaptomethyl) benzene, 1,3-bis (mercaptomethyl) benzene, 1,4-bis (mercaptomethyl) benzene, 2,2′-dimercaptobiphenyl, 4,4′-dimercaptobiphenyl, bis (4- Mercaptophenyl) methane, bis (4-mercaptophenyl) sulfide, bis (4-mercaptophenyl) sulfone, 2,2-bis (4-mercaptophenyl) propane, 1,2,3-trimercaptobenzene, 1,2, Aromatic thiols such as 4-trimercaptobenzene and 1,2,5-trimercaptobenzene Including but not limited to these exemplified compounds. These may be used alone or in combination of two or more.
ポリフェノール類の好ましいものの具体例としては、芳香環にフェノール性のヒドロキ
シル基を1つ以上有するものであり、モノフェノールとしてはフェノール、o−クレゾー
ル、m−クレゾール、p−クレゾール、3−メトキシフェノール、4−エトキシフェノー
ル、4−n−プロポキシフェノール、3−ブトキシフェノール、ノニルフェノール、2−
n−プロピルフェノール、2,3,4,6−テトラクロロフェノール、2,3,5,6−
テトラフルオロフェノール、2,4,6−トリブロモフェノール、2,6−ジクロロ−4
−フルオロフェノール、2,6−ジクロロ−4−ニトロフェノール、2,3,4−トリク
ロロフェノール、4−ブロモ−2−クロロフェノール、2,4−ジブロモフェノール、2
−クロロ−4−ニトロフェノール、2,3−ジクロロフェノール、2−フルオロ−4−ニ
トロフェノール、3,5−キシレノール、2,3−ジフルオロフェノール、2,4−ジニ
トロフェノール、2−ブロモフェノール、2−アミノ−4−クロロ−5ニトロフェノール
、2−クロロフェノール、4−アミノ−2,6−ジクロロフェノール、2−ニトロフェノ
ール、2−アミノ−4−ニトロフェノール、チモール、カルバクロール、α−ナフトール
、2−アミノフェノール等が挙げられ、ポリフェノールとしては、カテコール、3−クロ
ロカテコール、レゾルシン、ハイドロキノン、クロロハイドロキノン、ピロガロール、フ
ルオログルシン等が挙げられるが、これらの例示化合物のみに限定されるものではない。
これらのポリフェノール類化合物は単独でも2種類以上を混合して使用しても良い。
Specific examples of preferred polyphenols include those having one or more phenolic hydroxyl groups in the aromatic ring, and monophenols include phenol, o-cresol, m-cresol, p-cresol, 3-methoxyphenol, 4-ethoxyphenol, 4-n-propoxyphenol, 3-butoxyphenol, nonylphenol, 2-
n-propylphenol, 2,3,4,6-tetrachlorophenol, 2,3,5,6-
Tetrafluorophenol, 2,4,6-tribromophenol, 2,6-dichloro-4
-Fluorophenol, 2,6-dichloro-4-nitrophenol, 2,3,4-trichlorophenol, 4-bromo-2-chlorophenol, 2,4-dibromophenol, 2
-Chloro-4-nitrophenol, 2,3-dichlorophenol, 2-fluoro-4-nitrophenol, 3,5-xylenol, 2,3-difluorophenol, 2,4-dinitrophenol, 2-bromophenol, 2 -Amino-4-chloro-5nitrophenol, 2-chlorophenol, 4-amino-2,6-dichlorophenol, 2-nitrophenol, 2-amino-4-nitrophenol, thymol, carvacrol, α-naphthol, Examples of the polyphenol include catechol, 3-chlorocatechol, resorcin, hydroquinone, chlorohydroquinone, pyrogallol, and fluoroglucin, but are not limited to these exemplified compounds. .
These polyphenol compounds may be used alone or in admixture of two or more.
メルカプト有機酸類の好ましいものの具体例としては、チオグリコール酸、3−メルカ
プトプロピオン酸、チオ酢酸、チオ乳酸、チオリンゴ酸、チオサリチル酸等が挙げられる
が、これら例示化合物のみに限定されるものではない。また、これらは単独でも、2種類
以上を混合して使用してもかまわない。
Specific examples of preferred mercapto organic acids include thioglycolic acid, 3-mercaptopropionic acid, thioacetic acid, thiolactic acid, thiomalic acid, thiosalicylic acid, and the like, but are not limited to these exemplified compounds. These may be used alone or in combination of two or more.
有機酸及びその無水物の好ましいものの具体例としては、チオジグリコール酸、チオジ
プロピオン酸、ジチオジプロピオン酸、無水フタル酸、ヘキサヒドロ無水フタル酸、メチ
ルヘキサヒドロ無水フタル酸、メチルテトラヒドロ無水フタル酸、メチルノルボルネン酸
無水物、メチルナルボルナン酸無水物、無水マレイン酸、無水トリメリット酸、無水ピロ
メリット酸等が挙げられるが、これらの例示化合物のみに限定されるものではない。また
、これらは単独でも、2種類以上を混合して使用してもかまわない。
Specific examples of preferred organic acids and anhydrides include thiodiglycolic acid, thiodipropionic acid, dithiodipropionic acid, phthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride , Methylnorbornenoic anhydride, methylnalbornanoic anhydride, maleic anhydride, trimellitic anhydride, pyromellitic anhydride and the like, but are not limited to these exemplified compounds. These may be used alone or in combination of two or more.
これら樹脂改質剤の他に、目的に応じ問題のない範囲で、内部離型剤、光安定剤、紫外
線吸収剤、酸化防止剤、染料、充填剤等の公知の各種添加剤などを加えてもよい。
In addition to these resin modifiers, various known additives such as internal mold release agents, light stabilizers, UV absorbers, antioxidants, dyes, fillers, etc. are added within a range where there is no problem depending on the purpose. Also good.
本発明のレンズは、通常注型重合により得られる。具体的にはエピスルフィド化合物と
重合触媒等の添加剤を添加し、この混合液を必要に応じて脱気を行った後、モールド型に
注入して加熱重合させる。
The lens of the present invention is usually obtained by cast polymerization. Specifically, an additive such as an episulfide compound and a polymerization catalyst is added, and this mixed solution is deaerated as necessary, and then injected into a mold and polymerized by heating.
本発明のレンズ用樹脂は、樹脂中に存在するエピスルフィド基が0.3質量%以下であ
ることが重要であり、樹脂中に存在するエピスルフィド基を0.3質量%以下とするため
には、例えば、次のような方策を採り、重合性、重合条件を管理することで達成できる。
In the lens resin of the present invention, it is important that the episulfide group present in the resin is 0.3% by mass or less. In order to make the episulfide group present in the resin 0.3% by mass or less, For example, this can be achieved by taking the following measures and managing the polymerizability and polymerization conditions.
(a)使用するエピスルフィド化合物の種類、添加剤、樹脂改質剤等の種類によって、
硬化触媒の種類及び使用量、重合条件等を最適化する。使用する硬化触媒は活性の異なる
2種以上の触媒を組み合わせる場合もあり、重合時において、重合反応が暴走して急激に
起きたり、逆に加熱して重合が進まなくなることを避けるように硬化触媒の種類及び使用
量を決定する。
(A) Depending on the type of episulfide compound used, additives, resin modifiers, etc.
Optimize the type and amount of curing catalyst, polymerization conditions, etc. The curing catalyst to be used may be a combination of two or more types of catalysts having different activities. During the polymerization, the curing catalyst will avoid the polymerization reaction from going out of control and suddenly occurring, or conversely heating to prevent the polymerization from proceeding. Determine the type and amount of use.
(b)重合条件として、硬化温度は、30℃〜100℃の範囲で徐々に昇温し、最終的
に80℃以上の温度で硬化させ、昇温条件としては短時間での急激な昇温は避け、6時間
〜21時間の範囲で昇温する。
(B) As the polymerization conditions, the curing temperature is gradually raised in the range of 30 ° C. to 100 ° C., and finally cured at a temperature of 80 ° C. or higher. The temperature is raised in the range of 6 hours to 21 hours.
(c)使用するエピスルフィド化合物中に含まれる重合性に影響を及ぼす不純物や高分
子量化物等を低減、除去する。これらの方策で得られた樹脂は、樹脂中に存在するエピス
ルフィド基が0.3質量%以下となり、良好な結果が得られる。
(C) Reduce or remove impurities, high molecular weight substances, and the like that affect the polymerizability contained in the episulfide compound to be used. The resin obtained by these measures has an episulfide group present in the resin of 0.3% by mass or less, and good results are obtained.
さらに、本発明の硬化樹脂を用いたレンズでは、必要に応じ、反射防止、高硬度付与、
耐摩耗性向上、耐薬品性向上、防曇性付与、あるいは、ファッション性付与等の改良を行
うため、表面研磨、帯電防止処理、ハードコート処理、無反射コート処理、染色処理等の
物理的あるいは化学的処理を施すことができる。又、得られた樹脂成型体については、必
要に応じアニールなどの処理を行っても良い。
Furthermore, in the lens using the cured resin of the present invention, if necessary, antireflection, imparting high hardness,
In order to improve wear resistance, chemical resistance, antifogging, or fashion, etc., physical or surface polishing, antistatic treatment, hard coat treatment, anti-reflective coating treatment, dyeing treatment, etc. Chemical treatment can be applied. Moreover, about the obtained resin molding, you may perform processes, such as annealing, as needed.
このようにして得られる本発明のエピスルフィド型レンズは無色透明で、光学物性、機
械物性に優れ、眼鏡レンズ、カメラレンズ等の光学素子材料として好適である。
The thus obtained episulfide type lens of the present invention is colorless and transparent, has excellent optical properties and mechanical properties, and is suitable as a material for optical elements such as eyeglass lenses and camera lenses.
以下、本発明を実施例により具体的に説明する。尚、得られた樹脂の残存官能基数およ
び離型性評価、耐熱性は以下の試験法により評価した。
Hereinafter, the present invention will be specifically described by way of examples. In addition, the number of residual functional groups, release property evaluation, and heat resistance of the obtained resin were evaluated by the following test methods.
・樹脂中のエピスルフィド基量:レンズを厚さ1mm程度に切断し、紙ヤスリにより厚さ
0.2mm以下まで表面研磨する。作製した試料を赤外分光光度計を用い、吸光度よりエ
ピスルフィド基を定量し、算出した。
-Amount of episulfide group in the resin: The lens is cut to a thickness of about 1 mm, and the surface is polished to a thickness of 0.2 mm or less with a paper file. The episulfide group was quantified and calculated from the absorbance of the prepared sample using an infrared spectrophotometer.
・離型性評価方法:重合終了後室温まで冷却し、自然に離型したものについては○、冷水
を用いて離型したものについては△で評価した。
-Releasability evaluation method: after polymerization was completed, the product was cooled to room temperature and naturally released, and the product released using cold water was evaluated as Δ.
・耐熱性:TMAペネトレーション法(荷重50g、針先0.5mmφ、昇温速度10℃
/分)でTg温度を測定した。
Heat resistance: TMA penetration method (load 50 g, needle tip 0.5 mmφ, temperature increase rate 10 ° C.
/ G), the Tg temperature was measured.
実施例1
エピスルフィド系化合物としてビス(2,3−エピチオプロピル)ジスルフィドを10
0gに、硬化触媒として、N,N−ジメチルシクロヘキシルアミン20mgと、更には樹
脂改質剤として4,8−ジメルカプトメチル−1,11−ジメルカプト−3,6,9−ト
リチアウンデカン10gを混合溶解させた。このモノマー混合物を真空度667Paで0
.5時間脱気した後、ガラスモールドとガスケットからなる成型モールドに注入した。こ
のモノマー混合物の入ったモールドを30℃で10時間静置保温した後、30℃から80
℃まで徐々に昇温し、21時間で重合を行った。重合終了後、モールドを室温まで徐々に
冷却したところ、自然に離型し、レンズが得られた。同時に得られた樹脂について、樹脂
中に存在するエピスルフィド基を調べた結果、0.22質量%であり、耐熱性は、78.
0℃であった。得られた樹脂の評価を表1に示した。
Example 1
As an episulfide compound, bis (2,3-epithiopropyl) disulfide is 10
0 g is mixed with 20 mg of N, N-dimethylcyclohexylamine as a curing catalyst and 10 g of 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane as a resin modifier. Dissolved. This monomer mixture was reduced to 0 at a vacuum of 667 Pa.
. After degassing for 5 hours, it was poured into a molding mold consisting of a glass mold and a gasket. The mold containing the monomer mixture was allowed to stand at 30 ° C. for 10 hours and then kept at 30 ° C. to 80 ° C.
The temperature was gradually raised to ° C. and polymerization was carried out in 21 hours. After completion of the polymerization, the mold was gradually cooled to room temperature, and then released spontaneously to obtain a lens. As a result of examining the episulfide group present in the resin for the resin obtained at the same time, it was 0.22% by mass, and the heat resistance was 78.
It was 0 ° C. The evaluation of the obtained resin is shown in Table 1.
実施例2
エピスルフィド系化合物としてビス(2,3−エピチオプロピル)ジスルフィドを10
0gに、硬化触媒として、N,N−ジメチルシクロヘキシルアミン20mgと、更には樹
脂改質剤として4,8−ジメルカプトメチル−1,11−ジメルカプト−3,6,9−ト
リチアウンデカン10gを混合溶解させた。このモノマー混合物を真空度667Paで0
.5時間脱気した後、ガラスモールドとガスケットからなる成型モールドに注入した。こ
のモノマー混合物の入ったモールドを30℃で10時間静置保温した後、30℃から80
℃まで徐々に昇温し、21時間で重合を行った。重合終了後、モールドを室温まで徐々に
冷却したところ、自然に離型し、レンズが得られた。同時に得られた樹脂を120℃で3
時間の加熱処理を施した。結果、樹脂中に存在するエピスルフィド基が検出限界以下(0
.2質量%以下)で、耐熱性の高いレンズが得られた。得られた樹脂の評価を表1に示し
た。
Example 2
As an episulfide compound, bis (2,3-epithiopropyl) disulfide is 10
0 g is mixed with 20 mg of N, N-dimethylcyclohexylamine as a curing catalyst and 10 g of 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane as a resin modifier. Dissolved. This monomer mixture was reduced to 0 at a vacuum of 667 Pa.
. After degassing for 5 hours, it was poured into a molding mold consisting of a glass mold and a gasket. The mold containing the monomer mixture was allowed to stand at 30 ° C. for 10 hours and then kept at 30 ° C. to 80 ° C.
The temperature was gradually raised to ° C. and polymerization was carried out in 21 hours. After completion of the polymerization, the mold was gradually cooled to room temperature, and then released spontaneously to obtain a lens. The resin obtained at the same
Heat treatment for hours was applied. As a result, episulfide groups present in the resin are below the detection limit (0
. 2% by mass or less), a lens having high heat resistance was obtained. The evaluation of the obtained resin is shown in Table 1.
実施例3
樹脂改質剤として4,8−ジメルカプトメチル−1,11−ジメルカプト−3,6,9
−トリチアウンデカン10gの代わりにベンジルアミン5gを用いた以外は、すべて実施
例1と同じ操作を行った。離型性及び樹脂中に存在するエピスルフィド基量、耐熱性を表
1に示した。
Example 3
4,8-dimercaptomethyl-1,11-dimercapto-3,6,9 as a resin modifier
-All the same operations as in Example 1 were carried out except that 5 g of benzylamine was used instead of 10 g of trithiaundecane. Table 1 shows the releasability, the amount of episulfide groups present in the resin, and the heat resistance.
実施例4
硬化触媒として、N,N−ジメチルシクロヘキシルアミン20mgとN−メチルジシク
ロヘキシルアミンを100mg用いた以外は、すべて実施例1と同じ操作を行った。離型
性及び樹脂中に存在するエピスルフィド基量、耐熱性を表1に示した。
Example 4
The same operation as in Example 1 was performed except that 20 mg of N, N-dimethylcyclohexylamine and 100 mg of N-methyldicyclohexylamine were used as curing catalysts. Table 1 shows the releasability, the amount of episulfide groups present in the resin, and the heat resistance.
比較例1
エピスルフィド系化合物としてビス(2,3−エピチオプロピル)ジスルフィドを10
0gに、硬化触媒として、N,N−ジメチルシクロヘキシルアミン20mgと、更には樹
脂改質剤として4,8−ジメルカプトメチル−1,11−ジメルカプト−3,6,9−ト
リチアウンデカン10gを混合溶解させた。このモノマー混合物を真空度667Paで0
.5時間脱気した後、ガラスモールドとガスケットからなる成型モールドに注入した。こ
のモノマー混合物の入ったモールドを25℃で、48時間で重合を行った。重合終了後、
室温まで徐々に冷却したが、自然には離型せず冷水により冷却することで離型した。同時
に得られた樹脂について、樹脂中に存在するエピスルフィド基量を調べた結果、4.0質
量%であり、耐熱性は、47.0℃であった。得られた樹脂の評価を表1に示した。
Comparative Example 1
As an episulfide compound, bis (2,3-epithiopropyl) disulfide is 10
0 g is mixed with 20 mg of N, N-dimethylcyclohexylamine as a curing catalyst and 10 g of 4,8-dimercaptomethyl-1,11-dimercapto-3,6,9-trithiaundecane as a resin modifier. Dissolved. This monomer mixture was reduced to 0 at a vacuum of 667 Pa.
. After degassing for 5 hours, it was poured into a molding mold consisting of a glass mold and a gasket. The mold containing the monomer mixture was polymerized at 25 ° C. for 48 hours. After polymerization is complete
Although it was gradually cooled to room temperature, it was not released naturally and released by cooling with cold water. As a result of investigating the amount of episulfide groups present in the resin, the resin obtained at the same time was 4.0% by mass, and the heat resistance was 47.0 ° C. The evaluation of the obtained resin is shown in Table 1.
比較例2
重合条件を30℃で10時間保持した後、30℃〜60℃まで徐々に昇温し、12時間
で重合を行った以外はすべて比較例1と同じ操作を行った。重合終了後、室温まで徐々に
冷却したが離型しなかった為、冷水を用い離型を行させた。同時に得られた樹脂について
、樹脂中に存在するエピスルフィド基量及び耐熱性を調べ、結果を表1に示した。
Comparative Example 2
After maintaining the polymerization conditions at 30 ° C. for 10 hours, the same operation as in Comparative Example 1 was performed except that the temperature was gradually raised to 30 ° C. to 60 ° C. and polymerization was performed in 12 hours. After the polymerization was completed, the mixture was gradually cooled to room temperature, but did not release, so the release was performed using cold water. The resin obtained simultaneously was examined for the amount of episulfide groups present in the resin and the heat resistance, and the results are shown in Table 1.
比較例3
重合条件を30℃〜100℃まで徐々に昇温し、5時間で重合を行った以外はすべて比
較例1と同じ操作を行った。重合終了後、室温まで徐々に冷却したが離型しなかった為、
冷水を用い離型を行させた。同時に得られた樹脂について、樹脂中に存在するエピスルフ
ィド基量及び耐熱性を調べ、結果を表1に示した。
Comparative Example 3
The same operation as in Comparative Example 1 was performed except that the polymerization conditions were gradually raised from 30 ° C. to 100 ° C. and polymerization was performed in 5 hours. After the polymerization was completed, it was gradually cooled to room temperature but did not release,
Release was performed using cold water. The resin obtained simultaneously was examined for the amount of episulfide groups present in the resin and the heat resistance, and the results are shown in Table 1.
Claims (5)
(a)活性の異なる2種以上の硬化触媒を組み合わせて使用する。
(b)硬化は、30〜100℃の範囲で徐々に昇温し、最終的に80℃以上の温度で硬化させ、その際、6〜21時間の範囲で昇温する。
(c)使用するエピスルフィド化合物中に含まれる重合性に影響を及ぼす不純物及び高分子量化物を低減、除去する。 The following formula (1) in one molecule
(A) Two or more curing catalysts having different activities are used in combination.
(B) In the curing, the temperature is gradually raised in the range of 30 to 100 ° C., and finally cured at a temperature of 80 ° C. or higher, and the temperature is raised in the range of 6 to 21 hours.
(C) Impurities and high molecular weight substances affecting the polymerizability contained in the episulfide compound to be used are reduced and removed.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2014084440A (en) * | 2012-10-26 | 2014-05-12 | Mitsubishi Gas Chemical Co Inc | Method for producing cured material of episulfide-based resin |
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JPH0971580A (en) * | 1995-09-08 | 1997-03-18 | Mitsubishi Gas Chem Co Inc | New branched alkyl sulfide type episulfide compound |
JPH09110979A (en) * | 1995-08-16 | 1997-04-28 | Mitsubishi Gas Chem Co Inc | New linear alkyl sulfide type episulfide compound |
JPH09255781A (en) * | 1996-01-17 | 1997-09-30 | Mitsubishi Gas Chem Co Inc | New episulfide compound |
EP0942027A2 (en) * | 1998-03-13 | 1999-09-15 | Mitsui Chemicals, Inc. | A polymerizable composition |
JPH11311702A (en) * | 1998-02-25 | 1999-11-09 | Hoya Corp | High refractive index plastic lens and its production |
JP2000186086A (en) * | 1998-10-15 | 2000-07-04 | Mitsubishi Gas Chem Co Inc | Production of episulfide compound |
JP2000281787A (en) * | 1999-01-29 | 2000-10-10 | Mitsubishi Gas Chem Co Inc | High-refractive-index resin |
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2006
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH09110979A (en) * | 1995-08-16 | 1997-04-28 | Mitsubishi Gas Chem Co Inc | New linear alkyl sulfide type episulfide compound |
JPH0971580A (en) * | 1995-09-08 | 1997-03-18 | Mitsubishi Gas Chem Co Inc | New branched alkyl sulfide type episulfide compound |
JPH09255781A (en) * | 1996-01-17 | 1997-09-30 | Mitsubishi Gas Chem Co Inc | New episulfide compound |
JPH11311702A (en) * | 1998-02-25 | 1999-11-09 | Hoya Corp | High refractive index plastic lens and its production |
EP0942027A2 (en) * | 1998-03-13 | 1999-09-15 | Mitsui Chemicals, Inc. | A polymerizable composition |
JP2000186086A (en) * | 1998-10-15 | 2000-07-04 | Mitsubishi Gas Chem Co Inc | Production of episulfide compound |
JP2000281787A (en) * | 1999-01-29 | 2000-10-10 | Mitsubishi Gas Chem Co Inc | High-refractive-index resin |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2014084440A (en) * | 2012-10-26 | 2014-05-12 | Mitsubishi Gas Chemical Co Inc | Method for producing cured material of episulfide-based resin |
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