JP2007035988A - Chip feeding apparatus and chip mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a chip feeding apparatus and a chip mounting apparatus whereby chip components can be fed efficiently to the glass substrate of a liquid crystal panel, etc. <P>SOLUTION: A chip transferring means takes out chips successively from a chip tray or a wafer present faceup, and it transfers the chips to a chip inverting means while holding the chips faceup. Then the chip inverting means so holds the chip that a head capable of rotating around its horizontal axis rotates the chip by 180°, and that it converts the chip facedown. Next, a driving means so positions the facedown converted chip in the loading position of a slider every kind of the chip that the slider receives the chip, and the slider so transfers the chip to a predetermined position that it feeds thereto the chip facedown. The chip transferring means transfers the chip efficiently both from the chip tray, etc. to the chip inverting means, and from the chip inverting means to the predetermined position, even though the kinds of the chips are different from each other. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a chip supply device and a chip mounting device used in a process of mounting a chip such as a semiconductor element or a surface mounting component on a substrate such as a resin substrate or a glass substrate. The present invention relates to a technique for taking out and changing the posture.

  One or a plurality of chips are sequentially taken out from a chip tray containing a plurality of chips face-up or a wafer in a face-up state, transferred to a chip reversing table, and a positioning member installed on the chip reversing table. The chip is centered, and the chip reversing table holds the chip and flips the front and back to change the attitude of the chip to the face-down state. After blowing the air to the chip and cleaning it, the chip is face-down to the specified position. There is known a chip supply device that supplies a chip (for example, Patent Document 1).

  In addition, the chip is supplied face-up to a chip mounting table provided adjacent to the chip tray, and the chip lightly held on the chip mounting table is pressed with a pusher lever from four directions to perform centering. A chip supply device is known in which a tip is adsorbed to a supply arm having an L-shape and the supply arm is inverted and supplied to the bonding tool in a face-up state (for example, Patent Document 2).

JP 2002-313844 A JP-A-2-226737

  In recent years, small devices such as cellular phones and PDAs of portable terminals have been required to be small and light while mounting a liquid crystal panel. Therefore, different types of chip components and LSIs with different surface mounting types are mounted on the liquid crystal glass substrate. When such different chip parts are automatically mounted on a small liquid crystal glass substrate, in the chip supply device having the configuration as in Patent Document 1, if the chip parts have different sizes, for example, two chip transfer mechanisms can be used. When trying to convey / reverse types of chip parts, the chip transfer mechanism waits until the reversal is completed. Therefore, there is a problem that the tact time is increased.

  Further, even in the chip supply device having the configuration as in Patent Document 2, after the chip mounting table is prepared and centered for each of different types of chip parts, it is attracted to the L-shaped supply arm and reversed. Have been forced to do complicated work.

  The present invention has been made in view of such circumstances, and an object thereof is to provide a chip supply device and a chip mounting device that can efficiently supply chip components to a liquid crystal glass substrate or the like.

  In order to achieve the above object, the present invention has the following configuration.

  According to the first aspect of the present invention, the chips are sequentially taken out from the chip tray storing a plurality of chips in a face-up state or from a wafer in the face-up state, the posture is changed, and the chips are supplied to a predetermined position in a face-down state. A chip supply device for sequentially taking out the chips of the wafer in the chip tray or face-up state, holding the chips in a face-up state, and transferring the chips; receiving the chips from the chip transfer means; A chip reversing means for changing the posture of the chip into a face-down state by rotating a head capable of rotating around a horizontal axis while holding the chip, and a drive for relatively horizontally moving the chip reversing means. A chip from the chip reversing means and the chip By transferring the held face down state by positioning each type, characterized by comprising a slider supplying the chip in place.

  According to a second aspect of the present invention, in the chip supply device according to the first aspect, the slider includes a chip positioning means for positioning the chip.

  A third aspect of the present invention is a chip mounting apparatus including the chip supply device according to any one of the first to second aspects.

  According to the first aspect of the present invention, the chip transfer means sequentially takes out the chips from the chip tray or the wafer in the face-up state, holds the chips in the face-up state, and transfers them to the chip inversion means. The chip reversing means changes the posture of the chip to the face-up state when the head holding the chip and rotating around the horizontal axis rotates 180 degrees. For each type of chip, the driving means positions the chip whose posture has been changed at the slider mounting position, and the slider receives the chip. The chip is transferred to a predetermined position and supplied in a face-down state. As described above, the chip transfer from the chip tray or the like to the chip inverting means and the chip transfer from the chip inverting means to the predetermined position are efficiently performed by the chip transferring means even if the types of chips are different.

  According to the second aspect of the present invention, when receiving the chip from the chip inverting means, the slider positions the chip by the chip positioning means and then receives the chip on the slider.

  According to the invention described in claim 3, the chip supplied in a face-down state at a predetermined position by the chip supply device according to claim 1 is mounted on the substrate.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of an embodiment of a chip mounting apparatus provided with a chip supply apparatus according to the present invention.

  The chip mounting apparatus according to the present embodiment is roughly divided into an apparatus base 10, a substrate supply unit 20 disposed on one end side (left end in FIG. 1) of the apparatus base 10, and the apparatus base 10. A chip supply unit 30 disposed on the back side of the substrate, a conductive material supply unit 40 disposed adjacent to the substrate supply unit 20, a temporary pressure bonding unit 50 disposed adjacent thereto, and further disposed adjacent thereto. The main crimping unit 60 provided, the substrate storage unit 70 disposed on the other end side (right side in FIG. 1) of the apparatus base 10, and four substrate transports disposed on the front side of the apparatus base 10 It is comprised from mechanism 80A-80D.

  The substrate supply unit 20 includes a substrate storage magazine 21 that stores a plurality of substrates 1 before chip mounting in multiple stages at regular intervals, and a lift table 22 that can sequentially lift and horizontally move the substrates 1 from the substrate storage magazine 21. It has. Further, the structure of the substrate supply unit 20 is not particularly limited as long as the substrates 1 can be sequentially supplied. For example, the substrate supply unit 20 may have a tray structure in which a plurality of substrates 1 are arranged in a horizontal plane.

  As shown in FIG. 2, the chip supply unit 30 includes chip trays 3A and 3B in which a plurality of chips 2A to be mounted on a substrate 1 and chips 2B having different sizes are arranged in a vertical and horizontal manner in a face-up state. The chips 2A and 2B are taken out one by one from the trays 3A and 3B one by one, the chip transfer mechanism 31A for transferring the chips 2A and 2B in a face-up state, the chip 2A or 2B is received from the chip transfer mechanism 31A, and the chip 2A Alternatively, a head reversing mechanism 32 that holds 2B and rotates around the axis P in the X direction by rotating the heads 33A and 33B by 180 degrees to change the posture of the chip 2A or 2B to a face-down state is provided. Yes.

  Specifically, the chip transport mechanism 31A is provided with a fixed rail 35A in a direction (Y direction) along one side of the chip trays 3A and 3B. A movable rail 35B extending in the X direction runs on the fixed rail 35A. The tip transfer mechanism 31A described above is attached to the movable base 36 that travels on the movable rail 35B. A chip adsorbing unit that adsorbs and holds the chip is provided at the lower end of the chip transfer mechanism 31A. The chip transfer mechanism 31A corresponds to the chip transfer means of the present invention.

  The chip reversing mechanism 32 includes the heads 33A and 33B that suck and hold the chips 2A and 2B, the rotation mechanism 37A that rotates the heads 33A and 33B around the axis P in the X direction, and the heads 33A and 33B that are in the X direction. An expansion / contraction mechanism 37B that expands and contracts in the circumferential direction of P, a support member 37D that supports the rotation mechanism 37A on the drive mechanism 37C, and a drive mechanism 37C that moves the heads 33A and 33B and the rotation mechanism 37A in the XY directions. ing. The chip reversing mechanism 32 corresponds to the chip reversing means of the present invention, and the driving mechanism 37C corresponds to the driving means. The heads 33A and 33B are disposed at symmetrical positions on the circumference of the axis P (when the head 33A is on the upper side of the rotation mechanism 37A, the head 33B is on the lower side).

  Adsorption holes 38 are formed in the heads 33A and 33B. The suction hole 38 is connected in communication with a decompression pump (not shown) through a hose. And it acts as an adsorption hole by the operation of the decompression pump, and adsorbs and holds the chip 2A or 2B. Two air supply holes 39A and 39B are formed in the rotation mechanism 37A. As shown in FIG. 3, the air supply hole is connected to the pump 39H through a hose 39C. Solenoid valves E1 and E2 are provided in the middle of the hose 39C branching toward the air supply hole, and the heads 33A and 33B move in the X-direction axis P in accordance with the opening and closing operations of the solenoid valves E1 and E2. It is configured to be rotatable in the left-right direction within a range of 180 degrees around. An air supply hole 39D is formed in the expansion / contraction mechanism 37B. As shown in FIG. 3, the air supply hole 39D is connected to the pump 39H through a hose 39E. An electromagnetic valve E3 is provided in the middle of the hose 39E toward the air supply hole 39D, and the heads 33A and 33B extend to the position of the stopper 39F in the circumferential direction of the axis P according to the opening operation of the electromagnetic valve E3. It is configured as follows. When the electromagnetic valve E3 is closed, it is configured to contract toward the center of the axis P by the spring force of the spring 39G provided between the stopper 39F and the expansion / contraction mechanism 37B.

  The drive mechanism 37C is screwed along the guide rail 37E to move the tip reversing mechanism 32 in the X direction by driving the motor M1 to rotate forward and backward. The drive mechanism 37C is driven to rotate forward and reverse by the motor M2, thereby being screwed along the guide rail 37F to move the tip reversing mechanism 32 in the Y direction.

  The slider 34 is configured to reciprocate along a fixed rail 35 </ b> C disposed in the Y direction of the apparatus base 1. The slider 34 is provided with an L-shaped positioning plate 34A for positioning the chips 2A and 2B. The positioning plate 34A corresponds to the chip positioning means of the present invention. When the slider 34 is in the standby position (the state shown in FIG. 2), the chips 2A and 2B are placed face down from the heads 33A and 33B rotated 180 degrees below the chip reversing mechanism 32, and the chips 2A and 2B. Is supplied to the temporary pressure bonding unit 50. When the chips 2A and 2B are placed, the drive mechanism 37C operates the chip reversing mechanism 32 in the XY directions so that the chip 2A or 2B is pressed against the positioning plate 34A of the slider 34. The chips 2A and 2B are held by suction so that the heads 33A and 33B can be displaced. Thus, the chip 2A or 2B is brought into contact with each L-shaped surface of the positioning plate 34A, and the positions of the chip 2A or 2B and the heads 33A and 33B on the slider 34 are determined to have a predetermined predetermined positional relationship.

  At this time, since the lower surfaces of the chips 1A and 1B are held by the heads 33A and 33B so as not to contact the upper surface of the slider 34 (with the bonding surface not in contact), the chips 2A and 2B It is possible to prevent damage to the surface to be bonded (bonding surface), that is, the lower surface.

  Returning to FIG. 1, the conductive material supply unit 40 includes a movable table 41 that holds the substrate 1 conveyed from the substrate supply unit 20 in a horizontal posture, and a bonding portion 1a that is a portion on which the chip 1A is mounted on the substrate 1. And two heads 42A and 42B having different film widths, which transfer a conductive material from an anisotropic conductive film (ACF) to each part to a bonding part 1b which is a part where the chip 1B is mounted on the substrate 1. It has. The movable table 41 includes a substrate holding stage 43 that holds the substrate 1 by suction, and the substrate holding stage 43 is configured to be movable in two horizontal axes (X, Y) and up and down (Z). Each bonding part 1 a, 1 b that is one end of the substrate 1 extends forward from the substrate holding stage 43. Below the heads 42A and 42B, there is disposed a backup 44 which is a fixing member for supporting the bonding portions 1a and 1b of the substrate 1 from below when transferring the anisotropic conductive film.

  This anisotropic conductive film is a connecting material that has the three functions of adhesion, conduction and insulation at the same time. By thermocompression bonding, it is electrically conductive in the thickness direction of the film and insulative in the surface direction. It is a polymer film having anisotropy, and conductive particles are mixed in an adhesive binder.

  The temporary press-bonding unit 50 includes a movable table 51 that holds the substrate 1 conveyed from the conductive material supply unit 40 in a horizontal posture, and chips 2A and 2B on the bonding portions 1a and 1b of the substrate 1 to which the conductive material is transferred. A two-field recognition means (for example, a two-field camera) having a two-field recognition field for aligning the substrate 1 with the chip 2A and the chip 2B at the time of the temporary pressure bonding. 53.

  In addition, a backup 55 is fixedly installed below the temporary pressure bonding head 52. The movable table 51 includes a substrate holding stage 54 that holds the substrate 1 by suction, and the substrate holding stage 54 is arranged in two horizontal axes (X, Y), up and down (Z), and around the Z axis (θ). Each is configured to be freely movable.

  The temporary press-bonding head 52 is movable up and down, and holds the chips 2A and 2B in the face-down state, which are transferred by the slider 34 of the chip supply unit 30, at the lower end, and heats the chips 2A and 2B by a predetermined pressure. The substrate 1 is pressed against the bonding parts 1a and 1b. As a result, the adhesive is in a semi-cured state, and the chips 2A and 2B are temporarily bonded to the substrate 1. The holding structure of the temporary press-bonding head 52 is not limited to an adsorption type, and any holding structure such as electrostatic adsorption using static electricity or magnetic adsorption using magnets can be used.

  Returning to FIG. 1, the two-field recognition means 53 is movable in two horizontal (X, Y) directions and up and down (Z) directions, and recognizes the chips 2 </ b> A and 2 </ b> B sucked and held by the temporary pressure bonding head 52. The mark and the recognition mark of the substrate 1 transferred onto the movable table 51 are respectively recognized, and the positional deviation between the both recognition marks is detected. The movable table is driven and controlled in the X, Y, and θ directions during provisional pressure bonding so as to eliminate this positional deviation.

  The main crimping unit 60 includes two main crimping blocks 60A and 60B. The main crimping blocks 60A and 60B each include a movable table 61A and 61B that holds the substrate 1 conveyed from the temporary crimping unit 50 in a horizontal posture, and a substrate. 1 is provided with main pressure-bonding heads 62A and 62B for main-bonding each mounting member to each bonding portion 1a and 1b. Backups 63A and 63B are fixedly installed below the main pressure bonding heads 62A and 62B, respectively. The movable tables 61A and 61B include substrate holding stages 64A and 64B similar to the movable table 41 of the conductive material supply unit 40. Further, in each of the main press-bonding blocks 60A and 60B, when the chip 2A is pressed by the main press-bonding head 62A and the chip 2B is pressed by the main press-bonding head 62B, the adhesive contained in the conductive material attached to the substrate 1 is subjected to the main press-bonding. In order to prevent the heads 62A and 62B from adhering to the heads 62A and 62B, the main pressure-bonding blocks 60A and 60B are provided with a mechanism for supplying a protective tape T made of fluorine resin. The protective tape T is unwound from supply rollers 65A and 65B attached to the main body frame of the main pressure bonding unit 60, and is wound around the winding rollers 66A and 66B. In this embodiment, the chip 2A is finally pressure-bonded by the main pressure-bonding block 60A, and then the chip 2B is conveyed to the main pressure-bonding block 60B on the substrate 1 and the chip 2B is finally pressure-bonded.

  The substrate storage unit 70 is capable of moving up and down and horizontally moving the substrate storage magazine 71 that stores a plurality of substrates 1 mounted with each mounting member in multiple stages at regular intervals, and that sequentially stores the substrates 1 in the substrate storage magazine 71. Elevating table 72 is provided. Instead of the substrate storage magazine 71, a tray structure storage structure may be provided as described in the substrate supply unit 20. Further, the substrate supply unit 20 and the substrate storage unit 70 do not necessarily have to be separate. By using these as a single unit, the substrate 1 on which the chips 2A and 2B are mounted is returned to the original substrate supply unit. Also good.

  The substrate transport mechanisms 80A to 80D are attached to the rail 81 arranged in the longitudinal direction of the apparatus base 10, the support 82 that runs along the rail 81, and the support 82 that can be moved up and down to adsorb the substrate 1. And a substrate holder 83 to be held.

  Next, the operation of the chip mounting apparatus having the above-described configuration will be described.

  The substrate transport mechanism 80A takes out the substrate 1 to be processed from the substrate supply unit 20 and transports the substrate 1 to the conductive material supply unit 40. The substrate 1 is transferred onto the substrate holding stage 43 of the movable table 41 and held by suction. The substrate holding stage 43 moves forward (Y direction), and the bonding portion of the substrate 1 is placed on the backup 44.

  In a state where the bonding part 1a for mounting the chip 2A on the substrate 1 is horizontally supported by the backup 44, the head 42A is lowered and a conductive material corresponding to the electrode width of the chip 2A is transferred onto the bonding part 1a. Thereafter, the substrate 1 is moved to the right horizontal direction in the figure to align with the bonding part 1b where the chip 2B is mounted, and the head 42B is lowered to transfer the conductive material corresponding to the electrode width of the chip 2B to the bonding part 1b. To do. When the transfer of the conductive material to each bonding site 1a, 1b is completed, the substrate holding stage 43 moves horizontally to the delivery position of the substrate 1. The substrate 1 returned to the delivery position is transported to the temporary pressure bonding unit 50 by the substrate transport mechanism 80B.

  The substrate 1 transported to the temporary pressure bonding unit 50 is transferred onto the substrate holding stage 54 of the movable table 51 and held by suction. The substrate holding stage 54 moves forward (Y direction), and the bonding portion 1 a of the substrate 1 is first positioned on the backup 55.

  On the other hand, in the chip supply unit 30, when the movable rail 35B and the movable base 36 move in the X and Y directions, the chip transfer mechanism 31A moves onto the predetermined chip 2A on the chip tray 3A. Subsequently, the chip transfer mechanism 31A descends, and the chips 2A in the chip tray 3A are sucked and held by the chip suction portion. After the chip transfer mechanism 31A rises and the chip 2A is taken out from the chip tray 3A, the movable rail 35B and the movable base 36 move in the X and Y directions, respectively, so that the chip transfer mechanism 31A is placed on the chip reversing mechanism 32. Moving. At this time, the head 33A of the chip reversing mechanism 32 is in a standby posture (state shown in FIG. 2) with the axis P facing upward. Further, the heads 33A and 33B are in a state in which the electromagnetic valve E3 is opened and extended in the circumferential direction of the shaft center P by the expansion / contraction mechanism 37B and is stopped against the stopper 39F.

  When the chip 2A is placed and sucked and held on the head 33A of the chip reversing mechanism 32, the electromagnetic valve E3 is closed and the heads 33A and 33B are contracted in the center direction of the axis P by the spring 39G of the expansion / contraction mechanism 37B. Subsequently, when the electromagnetic valve E1 is opened and E2 is closed, the heads 33A and 33B are rotated 180 degrees around the axis P by the rotation mechanism 37A to change the posture of the face-up chip 2A to the face-down state. The slider 34 enters under the head 33A of the inverted chip reversing mechanism 32.

  Subsequently, when the electromagnetic valve E3 is opened, the heads 33A and 33B extend in the circumferential direction of the axis P by the expansion / contraction mechanism 37B of the chip reversing mechanism 32 and are stopped against the stopper 39F. In the extended state, the corners of the chip 2 </ b> A are in contact with the positioning plate 34 </ b> A disposed on the slider 34. The drive mechanism 37C operates in the X and Y directions, and the corners of the chip 2A come into contact with the positioning plate 34A, thereby positioning the chip 2A. When the positioning is completed, the suction holding of the chip 2A is released, and the chip 2A is transferred from the head 33A to the slider 34. When the delivery of the chip 2A is completed, the drive mechanism 37C returns to the standby position.

  While the chip 2A is being reversed / delivered, the chip transport mechanism 31A takes out the chip 2B from the tray 3B. When the drive mechanism 37C returns to the standby position, the transport mechanism 31A moves above the head 33B of the chip reversing mechanism 32.

  The chip transport mechanism 31 </ b> A places the chip 2 </ b> B held in the chip suction unit on the head 33 </ b> B of the reversing mechanism 32 and sucks and holds it. Thus, since the operations of the chip transport mechanism 31A and the chip reversing mechanism 32 can be performed simultaneously in parallel, the processing efficiency of the apparatus can be improved.

  The slider 34 that has received the chip 2 </ b> A in the face-down state moves toward the temporary press-bonding unit 50, and transfers the chip 2 </ b> A to below the temporary press-bonding head 52. Meanwhile, the chip reversing mechanism 32 performs the reversal of the chip 2B in the same procedure as the chip 2A.

   The temporary press-bonding head 52 sucks and holds the chip 2 </ b> A transferred by the slider 34. (When the transfer is completed, the slider 34 returns to the lower side of the head 33B of the chip reversing mechanism 32.) Subsequently, two fields of view are provided between the temporary press-bonding head 52 and the bonding portion 1a of the substrate 1 supported by the backup 55. The recognizing means 53 advances and detects a positional deviation between the chip 2A sucked and held by the temporary pressure bonding head 52 and the substrate 1. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the chip 2A and the substrate 1 are aligned. When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered to temporarily pressure-bond the chip 2A to the bonding portion 1a of the substrate 1 to which the conductive material is transferred.

  When the temporary pressure bonding of the chip 2A is completed, the chip 2B transferred by the slider 34 is sucked and held by the temporary pressure bonding head 52. Subsequently, a two-view recognition means 53 advances between the temporary press-bonding head 52 and the bonding portion 1b of the substrate 1 supported by the backup 55, and the chip 2B and the substrate 1 held by the temporary press-bonding head 52 are held by suction. Detect misalignment. The movable table 51 is controlled in the X, Y, and θ directions so as to eliminate this positional deviation, and the alignment between the chip 2B and the substrate 1 is performed. When the alignment is completed, the two-field recognition means 53 moves back to the original position. Subsequently, the temporary pressure bonding head 52 is lowered to temporarily pressure-bond the chip 2B to the bonding portion 1b of the substrate 1 to which the conductive material is transferred.

  When the temporary pressure bonding of both the mounting members is completed, the substrate holding stage 54 moves horizontally to the delivery position of the substrate 1. The substrate that has moved to the delivery position is transported to the main pressure bonding unit 60 by the substrate transport mechanism 80C.

  The substrate 1 transported to the main press-bonding block 60A is transferred and held on the substrate holding stage 64A of the movable table 61A. The substrate holding stage 64A moves forward (Y direction), and the bonding portion 1a of the substrate 1 is positioned on the backup 63A. When the bonding part 1a is supported by the backup 63A, the main pressure-bonding head 62A descends, and the temporarily pressure-bonded chip 2A is heated and pressurized via the protective tape T. As a result, the bumps of the chip 2A are electrically connected to the electrodes of the substrate 1 through the conductive material.

  When the final pressure bonding of the chip 2A is completed, the substrate holding stage 64 moves horizontally to the delivery position of the substrate 1. The substrate 1 moved to the delivery position is transferred by the substrate transfer mechanism 80C and transferred to the main press block 60B.

  The substrate 1 conveyed to the main press-bonding block 60B is transferred and held on the substrate holding stage 64B of the movable table 61B. The substrate holding stage 64B moves forward (Y direction), and the bonding portion 1b of the substrate 1 is positioned on the backup 63B. When the bonding part 1b is supported by the backup 63B, the main pressure bonding head 62B is lowered, and the temporarily pressure-bonded chip 2B is heated and pressurized via the protective tape T. As a result, the bumps of the chip 2B are electrically connected to the electrodes of the substrate 1 through the conductive material.

  When the final press-bonding of the chip 2B is completed, the substrate holding stage 64B moves horizontally to the delivery position of the substrate 1. After moving to the delivery position, the substrate 1 is transferred by the substrate transport mechanism 80D and transferred to the lifting table 72 of the substrate storage unit 70, and is stored in the substrate storage magazine 71 by the lifting table 72.

  This completes the chip mounting of one substrate. The conductive material is transferred to the next substrate 1 in the conductive material supply unit 40 while the substrate 1 is temporarily pressure-bonded to the chips 2A and 2B by the temporary pressure bonding unit 50. As described above, in each unit, the transfer of the conductive material to the substrate 1, the provisional pressure bonding of the chips 2A and 2B, and the main pressure bonding of the chips 2A and 2B are performed in parallel. Further, the substrate 1 transported from the temporary press-bonding unit 50 can be processed smoothly without delaying the processing of the substrate 1 by adjusting the tact time of each pair of main press-bonding blocks 60A and 60B.

  In the chip mounting apparatus according to the above-described embodiment, the chip reversing mechanism 32 can be horizontally moved in the X and Y directions by the driving mechanism 37C. Thereby, the corner | angular part of chip | tip 2A and 2B contact | abuts to the positioning plate 34A of the slider 34, and chip | tip 2A and 2B can be positioned. Therefore, even if the type of chip is different, the chip can be transferred efficiently.

  The present invention is not limited to the above-described embodiment, and can be modified as follows.

  (1) In the above embodiment, the crimping unit is divided into two units of the temporary crimping unit 50 and the main crimping unit 60 in order to increase the processing efficiency. However, the chip alignment and electrical connection are performed by one crimping unit. You may make it carry out.

  (2) The chip mounting apparatus according to the present invention includes various forms such as a simple mounting apparatus for chip mounting and a bonding apparatus having a heating and pressing process.

  (3) In the embodiment, the chips 2A and 2B are stored in the chip trays 3A and 3B in the face-up state. However, the present invention is not limited to this, and the wafer may be diced and supplied face-up. Good.

It is a perspective view of the chip mounting apparatus concerning this embodiment. It is the perspective view which showed schematic structure of the chip | tip supply unit. It is a figure which shows schematic structure of a chip | tip inversion mechanism.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 10 Device base 1a Bonding part 1b Bonding part 20 Substrate supply unit 21 Substrate storage magazine 22 Lifting table 2A Chip 2B Chip 30 Chip supply unit 32 Chip reversing mechanism 34 Slider 36 Movable base 38 Adsorption hole 3A Chip tray 3B Chip tray 40 Conductive material supply unit 41 Movable table 43 Substrate holding stage 44 Backup 50 Temporary pressure bonding unit 51 Movable table 52 Temporary pressure bonding head 53 Two-field recognition means 54 Substrate holding stage 55 Backup 60 Main pressure bonding unit 70 Substrate storage unit 71 Substrate storage magazine 72 Elevation Table 81 Rail 82 Post 83 Board holder E1 Solenoid valve E2 Solenoid valve E3 Solenoid valve M1 Motor M2 Motor 31A Chip transfer mechanism 33A Head 3B Head 34A Positioning plate 35A Fixed rail 35B Movable rail 35C Fixed rail 37A Rotating mechanism 37B Telescopic mechanism 37C Drive mechanism 37D Support member 37E Guide rail 37F Guide rail 39A Supply hole 39B Supply hole 39C Hose 39D Supply hole 39E Hose 39F Stopper 39F Pump 42A Head 42B Head 60A Main press block 60B Main press block 61A Movable table 61B Movable table 62A Main press head 62B Main press head 63A Backup 63B Backup 64A Substrate holding stage 64B Substrate holding stage 65A Supply roller 65B Supply roller 66A Take-up roller 66B Winding roller 80A Substrate transport mechanism 80B Substrate transport mechanism 80C Substrate transport mechanism 80 The substrate transport mechanism

Claims (3)

  A chip supply device that sequentially takes out chips from a chip tray or a wafer in a face-up state and stores the chips in a face-up state, and supplies the chips to a predetermined position in a face-down state. Chips of wafers in the tray or face-up state are sequentially taken out, chip transfer means for holding and transferring the chips in the face-up state, and receiving a chip from the chip transfer means, holding the chip and holding a horizontal axis A reversing head rotates 180 degrees to change the posture of the chip into a face-down state, a driving means for relatively moving the chip reversing means, and a chip reversing means to a chip. And position the chip by chip type By transferring the held in Eisudaun state, the chip supply apparatus characterized by comprising a slider supplying the chip in place.   2. The chip supply apparatus according to claim 1, wherein the slider includes chip positioning means for positioning the chip.   A chip mounting apparatus comprising the chip supply apparatus according to claim 1.

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