JP2007013048A - Multilayer wiring board manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board manufacturing method capable of efficiently manufacturing a multilayer wiring board on which all layers are conductively connected by inter-layer connection bodies, capable of preventing laminates from being easily peeled off or turned up from a temporary fitting base material, having a high handling property, and forming guide holes. <P>SOLUTION: The multilayer wiring substrate manufacturing method comprises a process (a) for forming first metallic layers 10 of which the peripheries are partially stuck to both surfaces of the temporary fitting base material CL; a process (b) for forming protection metallic layers 11 composed of metals different from the first metallic layers 10 approximately on the whole surfaces of the first metallic layers 10; a process (c) for successively or repeatedly forming insulating layers 21 having interlayer connection bodies 14a and wiring layers 18 or metallic layers on the protection metallic layers 11, to form wiring substrate precursors BP in which all layers are connected by the interlayer connection bodies 14a; and a process (d) for cutting off the portions to which the first metallic layers 10 are stuck to separate the wiring substrate precursors BP from the temporary fitting base material 1. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a multilayer wiring board including a step of manufacturing a wiring board precursor by forming each layer by build-up on both sides thereof using a temporary wearing base material.

  In recent years, with the miniaturization and high functionality of electronic devices and the like, demands for multilayering, thinning, fine patterning, etc. are increasing for multilayer wiring boards for mounting electronic components. As a method for producing such a high-density multilayer wiring board, a build-up method, a batch lamination method, or the like is known. And it is thought that the latter batch lamination method becomes more advantageous as the number of wiring layers increases.

  The former build-up method includes a method in which an insulating layer and a wiring layer are sequentially laminated on both sides of a double-sided wiring board that is a core, or a double-sided wiring board that has a circuit formed on both sides of a double-sided wiring board that is a core. Further, there is a method of further forming a laminate. Further, the batch lamination method includes a type in which a lamination unit (unit) has one wiring layer and a type in which two wiring layers (that is, double-sided wiring boards).

  On the other hand, when manufacturing a multilayer wiring board by any method, a structure for conductive connection between upper and lower wiring layers is required, and interlayer connection structures such as conductive paste, laser via, filled via, and plating bump are known. . And as a lamination | stacking unit of a batch lamination method, what penetrated the insulating layer, these interlayer connection structures were formed, and the wiring pattern was formed in the single side | surface or both surfaces is generally used. And the said wiring pattern is formed by the etching etc., and the shape by which the wiring pattern was convexly formed in the surface of the insulating layer is common (for example, refer nonpatent literature 1).

  Patent Document 1 discloses a wiring board member having an interlayer connection structure with high connection reliability and a flat wiring pattern forming surface, and a manufacturing method thereof. In this manufacturing method, after a wiring pattern, a protective metal layer, and another metal layer are sequentially formed on a temporary wearing base material such as a mirror plate, a metal layer is masked and selectively etched to form a bump, and further insulation is performed. A method of removing the temporary wearing substrate after forming the layer forming material is employed.

  However, when a mirror plate is used as a temporary wearing base material, even when a metal layer is formed by plating on the lower layer of the wiring pattern, the metal layer is easily peeled off from the mirror plate, and when the subsequent process is performed, There was a problem that peeling and mekre occurred. Further, since the mirror plate is heavy, handling properties in each process are poor. Furthermore, the presence of the mirror plate makes it difficult to make a hole when drilling into the laminate, and therefore a guide hole for positioning cannot be provided.

JP 2004-221310 A Nagano Prefectural Institute of Technology Junior College Open Technology Lecture (July 24, 2002) Text, Latest High-Performance Multi-layer Substrate Technology “Batch Multi-layer Substrate Technology and High-Speed Multi-layer Substrate Technology”

  Accordingly, an object of the present invention is to efficiently produce a multilayer wiring board in which all layers are conductively connected by an interlayer connection body, and to produce a multilayer wiring board that is less likely to cause peeling or peeling of a laminate from a temporary wearing base material. It is to provide a method.

The above object can be achieved by the present invention as described below.
That is, the method for manufacturing a multilayer wiring board of the present invention includes a step of forming a wiring board precursor in which peripheral portions are partially bonded to both surfaces of a temporary wearing base material, and a portion where the wiring board precursor is bonded. And the process of isolate | separating the said temporary wearing base material and the said wiring board precursor is characterized by the above-mentioned.

  According to the method for manufacturing a multilayer wiring board of the present invention, a wiring board precursor having a peripheral portion partially bonded is formed. Therefore, peeling of the laminate and creaking are less likely to occur in a later process, and the wiring board precursor later. By excising the part where the adhesive is adhered, the temporary wearing base material and the wiring board precursor can be easily separated. Moreover, since the wiring board precursor is formed on both surfaces of the temporary wearing base material, there is no waste of a mask or plating on the back surface, and the manufacturing efficiency can be increased in terms of manufacturing speed and manufacturing cost. Furthermore, a multilayer wiring board in which all layers are conductively connected with the interlayer connector can be manufactured by sequentially or repeatedly forming the insulating layer having the interlayer connector and the wiring layer or the metal layer.

A preferred method for producing a multilayer wiring board of the present invention is as follows.
(A) a step of forming a first metal layer in which peripheral portions are partially bonded to both surfaces of a temporary wearing substrate;
(B) forming a protective metal layer made of a metal different from the first metal layer on substantially the entire surface of the first metal layer;
(C) An insulating layer having an interlayer connector and a wiring layer or a metal layer are sequentially or repeatedly formed on the protective metal layer to form a wiring board precursor in which all layers are connected by the interlayer connector. And (d) cutting the portion where the first metal layer is bonded, and separating the temporary wearing base material and the wiring board precursor.

  According to this method for manufacturing a multilayer wiring board, the first metal layer with the peripheral portion partially bonded is formed, and therefore, it is difficult for the laminate to be peeled off or peeled off in a later step, and the first metal layer is bonded later. By excising the part that has been removed, the temporary wearing base material and the wiring board precursor can be easily separated. Moreover, since the wiring board precursor is formed on both surfaces of the temporary wearing base material, there is no waste of a mask or plating on the back surface, and the manufacturing efficiency can be increased in terms of manufacturing speed and manufacturing cost. Furthermore, since the insulating layer having the interlayer connection and the wiring layer or the metal layer are formed sequentially or repeatedly, a multilayer wiring board in which all the layers are conductively connected with the interlayer connection can be manufactured.

  In the above, in the step (a), the first metal layer was laminated through the metal foil partially disposed on both surfaces of the prepreg, and the periphery was partially adhered to both surfaces of the temporary wearing base material. It is preferable to form a first metal layer. According to this method, the partially disposed metal foil and the prepreg are bonded, but the metal foil and the first metal layer are not bonded to each other, and the portion where the first metal layer is bonded is cut off. The temporary wearing base material and the wiring board precursor can be easily separated. When the metal foil and the first metal layer are the same metal or the like, both have appropriate adhesion. Moreover, since a prepreg is used as a main material of a temporary wearing base material, it becomes lightweight compared with metal plates, such as a mirror surface board, and handling property becomes favorable in each process. Furthermore, it becomes easier to form the guide hole by drilling or the like than the metal plate.

  Further, in the step (c), after forming a second metal layer made of a metal different from the protective metal layer and serving as the interlayer connector, a surface portion of the second metal layer forming the interlayer connector is formed. It is preferable to include a step of forming a mask layer, selectively etching the second metal layer to form an interlayer connection, and further forming an insulating layer.

  According to this step, the metal interlayer connection is formed by etching. At this time, since the protective metal layer protects the first metal layer, the temporary connection is made over the entire surface of the first metal layer even after the formation of the interlayer connection. An appropriate adhesion force with the wearing base material can be maintained. In addition, a wiring substrate precursor electrically connected to the first metal layer through the protective metal layer can be formed by forming an insulating layer and further forming a wiring layer.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 5 are process diagrams showing an example of a method for manufacturing a multilayer wiring board according to the present invention. FIG. 6 is a plan view showing a temporary wearing substrate used in the production method of the present invention.

  The method for producing a multilayer wiring board according to the present invention includes a step of forming a wiring board precursor in which peripheral portions are partially bonded to both surfaces of a temporary wearing base material, and a portion where the wiring board precursor is bonded And a step of separating the temporary wearing base material and the wiring board precursor.

  As shown in FIGS. 1 to 5, a preferable method for manufacturing a multilayer wiring board according to the present invention forms (a) a first metal layer 10 in which peripheral portions are partially bonded to both surfaces of a temporary wearing substrate CL. A step, (b) a step of forming a protective metal layer 11 made of a metal different from the first metal layer 10 on substantially the entire surface of the first metal layer 10, and (c) an interlayer connector 14a on the protective metal layer 11. Forming a wiring board precursor BP in which all layers are connected by the interlayer connector, and (d) the first metal. A step of cutting off the portion to which the layer 10 is bonded to separate the temporary wearing base material 1 and the wiring board precursor BP. Hereinafter, this will be described as an example.

  In this method of manufacturing a multilayer wiring board, as shown in FIGS. 1A to 1B, a step of forming a first metal layer 10 in which peripheral portions are partially bonded to both surfaces of a temporary wearing base material CL ( a) including a step. In this embodiment, the 1st metal layer 10 is laminated via the metal foil 2 partially arrange | positioned on both surfaces of the prepreg 1, and the periphery was adhere | attached partially on both surfaces of the temporary wearing base material CL. The example which forms the metal layer 10 is shown.

  First, as shown in FIG. 1A, a prepreg 1, a metal foil 2, and a first metal layer 10 are laminated. The prepreg 1 may be any material as long as it has heat resistance required for the wiring board. Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites thereof with glass fibers, ceramic fibers, aramid fibers, and the like.

  Although any metal may be sufficient as the metal foil 2, the same metal as the 1st metal layer 10 is preferable, for example, copper, copper alloy, nickel, tin, aluminum etc. can be used. Although the thickness of the metal foil 2 may be any, 1-100 micrometers is mentioned, for example.

  The metal foil 2 is partially disposed on both surfaces of the prepreg 1 as shown in FIGS. As a result, the bonding portion 1a is exposed, and the first metal layer 10 in which the peripheral portion is partially bonded to both surfaces of the temporary wearing substrate CL by bonding the first metal layer 10 to this portion. Can be formed.

  As the first metal layer 10, copper, copper alloy, nickel, tin or the like can be used. As thickness of the 1st metal layer 10, since this becomes the thickness of a wiring layer, 1-100 micrometers is mentioned, for example.

  After completion of the step (a), a guide hole can be formed in the temporary wearing substrate CL on which the first metal layer 10 is formed by drilling, punching, or the like. With this guide hole as a reference, the pattern formation of wirings and interlayer connectors can be performed with high accuracy in a later process.

  Next, as shown in FIG. 1B, the prepreg 1, the metal foil 2, and the first metal layer 10 are laminated. As conditions for laminating, the pressure, temperature, and time corresponding to the type of prepreg 1 are set. By the lamination, the bonding portion 1a of the prepreg 1 and the first metal layer 10 are firmly bonded.

  In the method for manufacturing a multilayer wiring board according to the present invention, as shown in FIG. 2A, a protective metal layer 11 made of a metal different from the first metal layer 10 is formed on substantially the entire surface of the first metal layer 10 (b). ) Process. In addition, since this FIG. 2 (A) has shown the center part, the adhesion part 1a is not shown.

  As the protective metal layer 11, when the metal constituting the first metal layer 10 is copper, for example, gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, nickel-gold alloy, or the like Is used. However, the present invention is not limited to the combination of these metals, and any combination with another metal exhibiting resistance when the metal is etched can be used. The same applies to the relationship between the metal constituting the second metal layer 14 and the protective metal layer 11.

  The protective metal layer 11 can be formed by, for example, plating, sputtering, vapor deposition, etc., but it is preferable to use plating, particularly electrolytic plating. The thickness of the protective metal layer 2 is, for example, about 1 to 20 μm.

  Electrolytic plating can be performed by a known method. In general, while immersing the target laminated plate in a plating bath, the laminated plate is used as a cathode, and the metal ion supply source of the metal to be plated is used as an anode. This is carried out by depositing a metal on the cathode side by an electrolysis reaction.

  Electroless plating solutions are well known for various metals, and various types are commercially available. In general, the liquid composition contains a metal ion source, an alkali source, a reducing agent, a chelating agent, a stabilizer, and the like. A plating catalyst such as palladium may be deposited prior to electroless plating.

  In the method for manufacturing a multilayer wiring board according to the present invention, an insulating layer 21 having an interlayer connector 14a and a wiring layer 18 or a metal layer are sequentially or repeatedly formed on the protective metal layer 11, and the entire interlayer connector is used. (C) The process of forming the wiring board precursor BP with which the layer was connected is included. In this embodiment, after the step (c) is performed, the second metal layer 14 made of a metal different from the protective metal layer 11 and serving as the interlayer connector 14a is formed, and then the interlayer connector 14a of the second metal layer 14 is formed. An example including a step of forming a mask layer 15 on the surface portion on which the second metal layer 14 is formed, selectively etching the second metal layer 14 to form an interlayer connector 14a, and further forming an insulating layer 15 is shown.

  In the present embodiment, as shown in FIG. 2B, the second metal layer 14 that is made of a metal different from the protective metal layer 11 and serves as the interlayer connector 14a is formed. As the second metal layer 14, for example, copper, copper alloy, nickel, tin or the like can be used. In the present invention, the first metal layer 10 and the second metal layer 14 are preferably made of copper, and the protective metal layer 11 is preferably made of nickel.

  The second metal layer 14 can be formed by, for example, plating, sputtering, vapor deposition, etc., but it is preferable to use plating, particularly electrolytic plating. The thickness of the second metal layer 14 is, for example, 30 to 1000 μm.

  Next, as shown in FIG. 2C, a mask layer 15 is formed on the surface portion of the second metal layer 14 where the second interlayer connector 14a is to be formed. The mask layer 15 can be formed by a method of exposure / development or screen printing after applying a photosensitive resin or laminating a dry film resist.

  The individual size (area, outer diameter, etc.) of the mask layer 15 is determined in accordance with the size of the interlayer connector 14a, and is defined as the outer diameter of the interlayer connector 14a for conductive connection (via) between wiring layers. Can be, for example, 50 to 1000 μm, and the outer diameter of the interlayer connector 14a for the heat dissipation structure can be 1000 μm or more. The mask layer 15 may have any shape, and may be a circle, an ellipse, a quadrangle, a polygon, a pattern, or the like, and the interlayer connector 14a corresponding to the shape can be formed.

Next, as shown in FIG. 3A, the second metal layer 14 is selectively etched to form an interlayer connector 14a. At this time, if the amount of erosion caused by etching is too large, the formed interlayer connector 14a may be reduced in diameter (increase in undercut), thereby hindering subsequent processes, and conversely, the amount of erosion is too small. Then, the second metal layer 14 may remain in the non-patterned portion, causing a short circuit. Therefore, the degree of erosion due to the etching is preferably as shown in FIG. 3A or within a range that slightly increases or decreases.
Examples of the etching method include etching methods using various etching liquids according to the types of metals constituting the second metal layer 14 and the protective metal layer 11. For example, when the second metal layer 14 is copper and the protective metal layer 11 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used.

  Next, as shown in FIG. 3B, the mask layer 15 is removed and the insulating material 16a is applied. The removal of the mask layer 15 may be appropriately selected according to the type of the mask layer 15 such as removal of chemicals and removal of peeling. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.

  As an insulating material at the time of applying the insulating material, for example, a reactive curable resin such as a liquid polyimide resin or an epoxy resin that has good insulating properties and is inexpensive can be used. This may be applied by various methods so as to be slightly thicker than the height of the interlayer connector 14a, and then cured by heating or light irradiation. As a coating method, various coaters such as a curtain coater can be used. Alternatively, a hot pressing or vacuum laminating method may be used using an adhesive sheet, a prepreg, or the like containing a reactive curable resin.

  Next, as shown in FIG. 3C, an insulating layer 16 in which the interlayer connector 14 is exposed is formed. In the present embodiment, an example is shown in which the interlayer connector 14a is exposed after the insulating layer forming material is laminated. In this example, the insulating layer 16 having substantially the same thickness as the height of the interlayer connector 14a is formed by grinding and polishing the hardened insulating material. Examples of the grinding method include a method using a grinding apparatus having a hard rotary blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotary plate, and the hard rotary blade is fixedly supported while rotating. By moving along the upper surface of the wiring board, the upper surface can be planarized. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing etc. is mentioned.

  In the present embodiment, as shown in FIGS. 4A to 4B, an example in which an insulating layer 21 having a wiring layer 18 and an interlayer connector 20 is sequentially formed is shown.

  Usually, copper, copper alloy, nickel, tin, or the like can be used as the metal constituting the wiring layer 18, but it is preferable that the wiring layer 18 be made of the same metal as the interlayer connector 14a. Any pattern forming method may be used for the wiring layer 18, and examples thereof include a panel plating method in which a pattern is formed using an etching resist, and a pattern plating method in which a pattern plating resist is used for plating. The thickness of the wiring layer 18 is, for example, 1 to 100 μm.

  As a method of forming the insulating layer 21 having the interlayer connector 20, a step of forming a protective metal layer 19 covering at least the wiring layer 18, a step of further forming a metal layer different from the protective metal layer 19, A step of forming a mask layer on the surface portion of the metal layer on which the interlayer connector 20 is formed, a step of selectively etching the metal layer on which the mask layer is formed, a step of selectively etching the protective metal layer 19, and A method including the step of forming the insulating layer 21 having an interlayer connector is preferable.

  In the present embodiment, an example in which the metal layer 22 for forming a wiring pattern is formed before the wiring board precursor BP is peeled off is shown. The metal layer 22 can be formed by, for example, electroless plating or a combination of electroless plating and electrolytic plating.

  In the manufacturing method of the present invention, as shown in FIG. 4 (C), the portion where the first metal layer 10 is bonded is excised to separate the temporary wearing base material 1 and the wiring board precursor BP (d). It includes a process. A router, a rotary blade, or the like can be used for cutting. Thereby, the adhesive force with the temporary wearing base material 1 is lost, and it becomes easy to peel the first metal layer 10. In the case where only a portion bonded by a router or the like is cut and removed, the wiring board precursor is preferably formed with a wiring layer or the like in a region other than the portion.

  In this embodiment, peeling is performed in a state in which the metal layer 22 before forming the wiring pattern is formed on the outermost layer, but in this case, the first metal layer 10 and the metal layer 22 are etched simultaneously. Thus, since the wiring pattern can be formed, there is an advantage that the subsequent process is further simplified.

  Next, as shown in FIGS. 5A to 5B, the metal layer 22 and the first metal layer 10 are etched to form wiring patterns 22a and 10a. At that time, an etching resist 23 is used. As the etching resist 23, a photosensitive resin, a dry film resist (photoresist), or the like can be used.

  Examples of the etching method include etching methods using various etching solutions according to the types of each metal constituting the protective metal layer 11, the metal layer 22, and the first metal layer 10. For example, when the metal layers 22 and 10 are copper and the protective metal layer 11 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used. After the etching, the etching resist 4 is removed.

  Further, as shown in FIG. 5C, at least the non-patterned portion of the protective metal layer 11 is selectively etched and removed.

  As an etching method, an etching method using an etching solution different from that of the second metal layer can be mentioned. However, when a chloride etching solution is used, both the metal-based resist and copper are eroded, so other etching solutions are used. It is preferable to use it. Specifically, when the interlayer connector 14a and the wiring patterns 22a and 10a are copper, and the protective metal layer 11 is the above-mentioned metal, nitric acid-based, sulfuric acid-based, cyan-based, etc., which are commercially available for solder peeling. It is preferable to use an acid-based etching solution or the like.

  In the case where a wiring layer is further laminated, it is preferable to perform surface treatment such as blackening treatment on the pattern portion exposed by etching to improve the adhesion with the insulating layer. The same applies to other conductor patterns.

  By the manufacturing method of the present invention as described above, as shown in FIG. 5C, a protective metal layer 11 made of a metal different from this and an interlayer connection made of a metal different from this are formed on the upper surface of the wiring layer 10a. The body 14a is formed, the wiring layer 18 is formed on the upper surface thereof, the protective metal layer 19 made of a metal different from this, and the interlayer connection body 20 made of a metal different from this is formed. Further, the wiring layer 22a is formed on the upper surface thereof. A multilayer wiring board on which is formed can be manufactured.

[Another embodiment]
Hereinafter, another embodiment of the present invention will be described.

  (1) In the above embodiment, the first metal layer is laminated via the metal foil partially disposed on both surfaces of the prepreg, and the periphery is partially bonded to both surfaces of the temporary wearing base material. Although the example which forms 1 metal layer was shown, as a temporary wearing base material, what has resin as a main component is preferable, the resin sheet which provided the release film instead of metal foil, the resin sheet containing a reinforced fiber, etc. But you can. Moreover, you may form the 1st metal layer by which the periphery was partially adhere | attached on both surfaces of the temporary wearing base material using what performed the hardening reaction partially using photosensitive resin. In addition, as a temporary wearing base material, it is also possible to use metal plates, such as a mirror surface board. Moreover, the structure where a core material interposes between two layers of prepregs may be sufficient.

  (2) In the above-described embodiment, an example in which the precursor of the wiring board having three wiring layers is peeled from the temporary wearing base material has been described, but the precursor of the wiring board having two wiring layers and 4 The method of peeling the precursor of the wiring board which has a wiring layer more than a layer from a temporary wearing base material may be sufficient.

  Further, in the above-described embodiment, peeling is performed in a state where the metal layer 22 before forming the wiring pattern is formed on the outermost layer, but the wiring board precursor having the wiring pattern formed on the outermost layer is temporarily used. You may peel from a wearing base material.

  (3) In the above embodiment, the example in which the second metal layer is selectively etched to form the interlayer connector is shown. However, the interlayer connector is formed by using a laser via, a photo via, a conductive paste, a filled via, or the like. Also good.

  (4) In the above-described embodiment, an example in which the first metal layer is bonded by the adhesive force of the prepreg at the time of lamination has been described. A first metal layer partially bonded may be formed.

(5) In the above-described embodiment, an example of a method for manufacturing a multilayer wiring board including the steps (a) to (d) has been described. (A) The peripheral portion is partially bonded to both surfaces of the temporary wearing base material. Forming a first metal layer formed; (b ′) forming an insulating layer on substantially the entire surface of the first metal layer;
(C ′) forming a wiring board precursor by sequentially or repeatedly forming a wiring layer or a metal layer and an insulating layer having an interlayer connection on the insulating layer; and (d) the first metal layer comprising: Cutting the bonded part and separating the temporary wearing base material and the wiring board precursor;
The manufacturing method of the multilayer wiring board containing this may be sufficient.

  In this case, the first metal layer preferably has a thickness of 100 μm to 5 mm in order to improve heat dissipation characteristics. In addition, the insulating layer formed in the step (b ′) preferably contains a heat conductive filler or has a thickness of 100 μm or less in order to improve heat transfer characteristics. On the insulating layer, a wiring layer or a metal layer and an insulating layer having an interlayer connector can be sequentially or repeatedly formed by, for example, the steps shown in FIGS. 4A to 5B. .

Process drawing which shows an example of the manufacturing method of the multilayer wiring board of this invention Process drawing which shows an example of the manufacturing method of the multilayer wiring board of this invention Process drawing which shows an example of the manufacturing method of the multilayer wiring board of this invention Process drawing which shows an example of the manufacturing method of the multilayer wiring board of this invention Process drawing which shows an example of the manufacturing method of the multilayer wiring board of this invention The top view which shows the temporary wearing base material used for the manufacturing method of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Prepreg 1a Adhesion part of prepreg 2 Metal foil 10 1st metal layer 11 Protective metal layer 14 2nd metal layer 14a Interlayer connection body 15 Mask layer 16 Insulating layer 18 Wiring layer (wiring pattern)
21 Insulating layer BP Wiring board precursor CL Temporary wearing base material

Claims (4)

A step of forming a wiring board precursor in which peripheral portions are partially bonded to both surfaces of the temporary wearing base material; and a portion where the wiring board precursor is bonded is excised to form the temporary wearing base material and the wiring board precursor. Separating the body,
A method of manufacturing a multilayer wiring board including: (A) a step of forming a first metal layer in which peripheral portions are partially bonded to both surfaces of a temporary wearing substrate;
(B) forming a protective metal layer made of a metal different from the first metal layer on substantially the entire surface of the first metal layer;
(C) An insulating layer having an interlayer connector and a wiring layer or a metal layer are sequentially or repeatedly formed on the protective metal layer to form a wiring board precursor in which all layers are connected by the interlayer connector. And (d) a step of excising a portion where the first metal layer is bonded to separate the temporary wearing base material and the wiring board precursor.
A method of manufacturing a multilayer wiring board including:   A first metal obtained by laminating a first metal layer through metal foils partially disposed on both sides of the prepreg in the step (a) and partially adhering the periphery to both sides of the temporary wearing substrate. The manufacturing method of the multilayer wiring board of Claim 2 which forms a layer.   In the step (c), after forming a second metal layer made of a metal different from the protective metal layer and serving as the interlayer connection, a mask layer is formed on the surface portion of the second metal layer where the interlayer connection is formed. 4. The method of manufacturing a multilayer wiring board according to claim 2, further comprising a step of selectively etching the second metal layer to form an interlayer connector and further forming an insulating layer.

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