JP2007005091A - Linear light emitting device array - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a linear light emitting element array capable of increasing the light emission efficiency without reducing the mixing efficiency.
A linear light-emitting element array for a backlight, comprising a substrate 1, an RGB LED bare chip 2 arranged in a line on the substrate 1, and a sealing resin 3 continuously covering each of the LED bare chips 2. The sealing resin 3 has a surface shape 30 for deflecting light emitted from the light emitting element on its surface, and the contour of the surface shape 30 in a cross section along the arrangement direction of the LED bare chips 2 is plural. Have a continuous shape with a pitch of 50 μm shorter than the arrangement pitch of the LED bare chips 2.
[Selection] Figure 2

Description

  The present invention relates to a linear light emitting element array for an edge light type backlight.

  In recent years, edge-light type LED (light-emitting diode) backlights have been widely used in liquid crystal display devices. The LED backlight is composed of a planar light guide plate and a linear light emitting element array attached to an end surface of the light guide plate.

  In a linear light emitting element array used for a display device of a small device such as a mobile phone or a PDA, generally, a white color of SMD (surface mount) type is provided on a flexible substrate having a length corresponding to the length of the end face of the light guide plate. LEDs are mounted at predetermined intervals.

On the other hand, a large screen display device such as a large monitor requires high luminance and high color rendering, so a large area (about 1 mm ² ) LED bare chip capable of large current drive (100 to 500 mA) is used. A linear light emitting element array in which RGB individual LED modules are mounted at predetermined intervals is used. The RGB individual LED module is obtained by modularizing a plurality of single-color LEDs that respectively emit three primary colors of red, green, and blue. When using a single color LED of multiple colors, white light is obtained by mixing (mixing) the single color light emitted from each LED.

  In addition, in order to shorten the mixing distance and to reduce the size and weight of the light source device using the linear light emitting element array, a plurality of color small area (about 0.3 mm) LED bare chips each emitting monochromatic light are heated. A linear light-emitting element array mounted directly on a highly conductive substrate (chip-on-board) is also used. In this case, in order to ensure the same brightness as when the RGB individual LED modules are used, a large number of LED bare chips are arranged.

  Incidentally, in each of the above-described various linear light emitting element arrays, bare chip LEDs are sealed with a sealing resin. For this reason, the light emitted from the LED passes through the sealing resin and is emitted. The refractive index of the sealing resin is, for example, about 1.4 to 1.6, which is considerably higher than the refractive index of air. For this reason, among the light emitted from the LED, the surface of the sealing resin, that is, the incident angle to the interface between the sealing resin and air is not less than the critical angle, and is totally reflected to the substrate side at the interface. For example, the critical angle when the refractive index of the sealing resin is 1.55 is about 40 °.

  Such a conventional linear light emitting element array for a backlight will be briefly described with reference to FIG. FIG. 12A is a cross-sectional view along the arrangement direction of the light emitting elements. FIG. 12B is a cross-sectional view along a plane perpendicular to the arrangement direction of the light emitting elements. 12A and 12B, the conventional linear light emitting element array includes a substrate 1, a plurality of color light emitting elements 2 arranged in a line on the substrate 1, and each of the light emitting elements 2. And a sealing resin 3 that continuously covers.

  Of the light emitted from the light emitting element 2, light having a small incident angle that is an angle formed with the normal line of the flat surface of the sealing resin 3 is emitted from the surface of the sealing element. FIG. 12A schematically shows a light beam emitted from the sealing element 3 by an arrow t. On the other hand, light having an incident angle larger than the critical angle is totally reflected on the surface of the sealing resin. FIG. 12A schematically shows the totally reflected light beam with an arrow r. The light totally reflected on the surface of the sealing resin is attenuated by leaking light from the end of the linear light emitting element array, or by multiple reflection on the mounting surface of the LED bare chip and the surface of the sealing resin. As described above, the conventional linear light emitting element array has a problem that the light emission efficiency is reduced due to total reflection.

  Therefore, various techniques have been proposed in order to improve the emission efficiency of the linear light emitting element array. For example, Patent Document 1 discloses a linear light emitting element array in which a highly reflective portion is formed on a substrate surface. By this high reflection portion, the light totally reflected on the surface of the sealing resin is reflected again on the surface of the substrate and is emitted from the surface of the sealing resin.

  Further, Patent Document 1 discloses a linear light-emitting element array in which a V-shaped concave prism having a pitch larger than the arrangement pitch of LED chips is formed only on the light emitting surface directly above the LED chips in order to improve luminance unevenness. Is also disclosed. By this concave prism, the light emitted directly above the LED chip returns into the sealing resin, and is repeatedly reflected and emitted from the sealing resin.

  A technique for selectively forming a lens directly on each LED by a stencil or ink jet is also known. With this lens, the emitted light of the LED is brought close to parallel light perpendicular to the substrate surface, and the emission efficiency is improved.

JP 2004-165124 A

  However, when the emitted light of the LED is reflected at a critical angle or less in the sealing resin, the light is unavoidably attenuated by light leaking from the end of the linear light emitting element array or multiple reflection. On the other hand, when the emitted light is made close to parallel light, the mixing efficiency is lowered, and it becomes difficult to obtain white light at a short distance.

  Therefore, the present invention provides a linear shape that increases mixing efficiency without reducing the efficiency of light incident on a linear light-emitting element array or light guide plate that can increase light emission efficiency without reducing mixing efficiency. An object of the present invention is to provide a light emitting element array.

  In order to achieve the above object, a first linear light-emitting element array of the present invention is a linear light-emitting element array for a backlight, which emits light of a plurality of color types arranged in one or more rows on the substrate. A sealing resin that continuously covers each of the light emitting elements, and the sealing resin has a surface shape that deflects light emitted from the light emitting elements on the surface, The outline of the cross section along the arrangement direction of the light emitting elements is characterized in that a plurality of triangles or isosceles trapezoids have a continuous shape with a pitch shorter than the arrangement pitch of the light emitting elements.

  By forming such a surface shape on the surface of the sealing resin, total reflection on the surface of the sealing resin can be reduced and the amount of light emitted from the surface of the sealing resin can be increased. Further, since the outgoing light beam is refracted in various directions depending on the surface shape, the mixing efficiency is not lowered. Thereby, according to the 1st linear light emitting element array of this invention, the light emission efficiency can be improved, without reducing mixing efficiency.

  In the first linear light-emitting element array of the present invention, the base angle of the surface shape triangle or isosceles trapezoid is preferably in the range of 25 ° to 50 °.

  The second linear light-emitting element array of the present invention is a backlight linear light-emitting element array, comprising a substrate, a plurality of color light-emitting elements arranged in one or more rows on the substrate, and the light-emitting element. A sealing resin that continuously covers each of the sealing resin, and the sealing resin has a surface shape in which a polygonal pyramid or a conical shape is two-dimensionally arranged on the surface at a pitch shorter than the arrangement pitch of the light emitting elements. It is characterized by having.

  By forming such a surface shape on the surface of the sealing resin, total reflection on the surface of the sealing resin can be reduced, and the amount of light emitted from the sealing resin can be increased. Moreover, since the outgoing light beam is refracted in various directions depending on the surface shape, the mixing efficiency can be increased. Thereby, according to the 2nd linear light emitting element array of this invention, the emission efficiency of light can be improved, without reducing mixing efficiency.

  In the second linear light-emitting element array of the present invention, the base shape of the polygonal pyramid or conical shape of the surface shape is preferably in the range of 25 ° to 50 °.

  The third linear light-emitting element array of the present invention is a linear light-emitting element array for backlight, comprising a substrate, a plurality of color light-emitting elements arranged in one or more rows on the substrate, and the light-emitting element. A sealing resin that individually covers each of the light-emitting elements, and a reflection unit that reflects light emitted from the light-emitting element toward the front of the substrate for each of the light-emitting elements. It has a tapered side surface that totally reflects the light reflected by the reflecting means.

  Thus, by combining the reflecting means and the tapered side surface of the sealing resin, the light reflected by the reflecting means can be efficiently incident on the light guide plate from the sealing resin. At this time, the traveling direction of the light incident on the light guide plate is various. Thereby, according to the 3rd linear light emitting element array of this invention, mixing efficiency can be raised, without reducing the incident efficiency of the light to a light-guide plate.

In the third linear light-emitting element array of the present invention, preferably, the reflecting means is configured by a concave shape formed on the substrate, and the light-emitting element is disposed on a central bottom surface of each of the concave shapes. The sealing resin is formed on the concave shape.
Thereby, the light emitted from the light emitting element can be reflected in the front direction of the substrate by the concave slope formed on the substrate.

  According to the first to third linear light emitting element arrays according to the present invention, the light emission efficiency can be increased or the light incidence efficiency to the light guide plate or the like can be reduced without reducing the mixing efficiency. Without increasing the mixing efficiency.

  Embodiments of the first to third linear light emitting element arrays of the present invention will be described below with reference to the accompanying drawings.

  First, an embodiment (first embodiment) of a first linear light emitting element array of the present invention will be described with reference to FIG. FIG. 1 is a perspective view of a first linear light emitting element array. FIG. 2A is a cross-sectional view along the arrangement direction of the light emitting elements of the linear light emitting element array shown in FIG. FIG. 2B is a cross-sectional view taken along a direction perpendicular to the arrangement direction of the light emitting elements of the linear light emitting element array shown in FIG.

  The linear light-emitting element array of the present embodiment is a linear light-emitting element array for backlight, and includes a substrate 1, a plurality of color-type light-emitting elements 2 arranged in a line on the substrate 1, and each of the light-emitting elements 2. And a sealing resin 3 that continuously covers.

The board | substrate 1 consists of an aluminum board | substrate with favorable heat conductivity, and the printed wiring (not shown) is formed in the surface.
As the light emitting element 2, LED bare chip 2 that emits monochromatic light of each of the three primary colors of RGB (LED usually has a light emission distribution of several tens of nm to several hundreds of nm but is expressed as monochromatic light) is used. Here, in order to realize high color rendering, the LED bare chips 2 are mounted at a ratio of the number of chips of red: green: blue = 2: 3: 1. The mounting interval between adjacent LED bare chips is about 2 mm.

  An anode electrode (not shown) on the back surface of the LED bare chip 2 is connected to a connection electrode (not shown) on the substrate 1 via a conductive sheet. Further, a cathode electrode (not shown) on the upper surface of the LED bare chip 2 is bonded to a printed wiring formed on the substrate 1 with a lead wire 4. And it drives with the drive current of 50 mA per LED bare chip.

  The sealing resin generally requires excellent workability with high transparency, high refractive index, and low viscosity, and further there is no discoloration deterioration of the cured product, that is, with respect to flow resistance, heat resistance and weather resistance. It is required to be excellent. Therefore, in Example 1, as the sealing resin 3, a two-component silicone resin having a refractive index of 1.5 with little deterioration due to light or heat is used. Moreover, the thickness of the sealing resin 3 is about 0.5 to 2.0 mm.

  As shown in FIG. 1, the sealing resin 3 is formed so as to cover the light emitting element 2 in a bellows-like shape, and has a surface shape 30 for deflecting light emitted from the light emitting element 2 on the surface thereof. Have The contour of the surface shape 30 in the cross section along the arrangement direction of the light emitting elements 2 has a convex prism shape in which a plurality of isosceles triangles are continuous as shown in FIG. The shape covering the light emitting element 2 with the sealing resin 3 is preferably a bellows shape as in the present embodiment, but it is a flat plate shape that allows easy shaping of the surface shape as in a sixth embodiment described later. May be.

  The pitch (A) of the continuous convex prism shape is 50 μm, which is shorter than 2 mm, which is the arrangement pitch (B) of the LED bare chips 2. The base angle of the convex prism is 45 ° (that is, the apex angle is 90 °). The triangular base angle of the surface shape is preferably in the range of 25 to 50 °. When the base angle is larger than 50 ° (ie, when the apex angle is smaller than 80 °), the light emitted in the front direction of the substrate surface, that is, the normal direction of the substrate surface increases, but the prism is This is because light that crosses and is not emitted in the substrate direction tends to increase, and the emission efficiency and mixing efficiency tend to decrease. On the other hand, when the base angle is smaller than 25 ° (that is, when the apex angle is larger than 130 °), the mixing efficiency is high, but the total reflected light increases and the emission efficiency tends to decrease.

  By forming such a continuous surface shape 30 of the convex prism, it is possible to reduce the light that is totally reflected on the sealing resin surface and returns to the substrate surface, and the emitted light is refracted in various directions. In addition, it is possible to increase the light emission rate without reducing the mixing efficiency.

Next, a second embodiment of the first linear light emitting element array of the present invention will be described with reference to FIG.
FIG. 3A is a cross-sectional view along the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment. FIG. 3B is a cross-sectional view along a direction perpendicular to the arrangement direction of the light emitting elements of the linear light emitting element array.

  The linear light-emitting element array of the present embodiment is the same as the above-described linear light-emitting element array except that the surface shape 30a of the sealing resin 3 is different from that of the linear light-emitting element array of the first embodiment. Have the same structure. For this reason, in this embodiment, the same code | symbol is attached | subjected to the component same as 1st Embodiment, and those description is abbreviate | omitted.

In the present embodiment, the contour of the surface shape 30a of the sealing resin 3 in the cross section along the arrangement direction of the light emitting elements 2 has a shape in which a plurality of isosceles trapezoids are continuous as shown in FIG. . The continuous pitch of the isosceles trapezoid is a 50 μm pitch shorter than the arrangement pitch 2 mm of the LED bare chips 2. The base angle of the isosceles trapezoid in Example 2 is 45 °.
The base angle of the isosceles trapezoid is preferably 25 to 50 °, like the base angle of the triangle in the first embodiment.

  By forming such an isosceles trapezoidal continuous surface shape 30, in addition to the effects of the first embodiment, the optical adhesion between the sealing resin 3 and the light guide plate (not shown) through which light enters is improved. This makes it possible to simplify the structure of the linear light emitting element array.

Next, a third embodiment of the first linear light-emitting element array of the present invention will be described with reference to FIG.
FIG. 4A is a cross-sectional view along the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment. FIG. 4B is a cross-sectional view along a direction perpendicular to the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment.

  The linear light emitting element array of the present embodiment has the same configuration as the linear light emitting element array of the second embodiment described above, except that a reflecting member is provided on the substrate 1. For this reason, in this embodiment, the same code | symbol is attached | subjected to the component same as 2nd Embodiment, and those description is abbreviate | omitted.

  In the present embodiment, the reflecting means 5 extending on both sides of the light emitting element 2 along the arrangement direction of the light emitting elements 2 is provided on the substrate 1. The reflecting means 5 includes a support body 50 made of a heat resistant resin, and a reflection surface 51 formed on the slope of the support body 50 on the light emitting element 2 side. The light emitted from the light emitting element is reflected by the reflecting surface 51 in the front direction of the substrate 1. Thus, by providing the reflection means 5, the emission efficiency can be further improved.

Next, an example of a method for manufacturing the linear light-emitting element array of the present embodiment will be described with reference to FIG.
First, the light emitting elements 2 are respectively arranged at predetermined positions on the substrate 1 on which the reflecting means 5 is formed (the center position of the reflecting means 5 in the figure), and the anode electrode (not shown) of each light emitting element 2 is electrically conductive. It connects with the electrode on a board | substrate via a property sheet | seat (not shown), Furthermore, the cathode electrode (not shown) of each light emitting element 2 is bonded to the wiring on a board | substrate by the lead wire 4 (FIG. 5). (A)).

  Next, while the dispenser 7 is running at a constant speed, the transparent sealing resin 13 is quantitatively discharged from the dispenser 7 onto the substrate 1, and the light emitting element 2 is continuously covered with the resin 13 (FIG. 5B).

  Thereafter, the mold 8 having the prism forming pattern formed on the resin surface is pressed to transfer the pattern shape of the mold 8 to the resin surface (FIG. 5C). In this case, the mold 8 is preferably heated in advance. Further, depending on the viscosity of the resin 13, the shape may be transferred by pressing the mold 8 after the resin gelation is somewhat advanced.

Subsequently, in a state where the mold 8 is pressed against the resin, the temperature of the mold 8 and the resin is raised to the curing temperature of the resin to cure the resin. Here, the resin 13 is cured by heating at 150 ° C. for 1 hour to form the sealing resin 3 having a surface shape.
After the resin is cured, the mold 8 is removed to obtain a linear light emitting element array (FIG. 5D).

  In this embodiment, an example in which a resin is applied using a dispenser has been described. However, the resin application method is not limited to this. For example, the resin may be applied by a printing method using a stencil and a squeegee. In this case, for example, an LED may be disposed in the hole of the stencil, a predetermined amount of transparent resin may be poured into the hole portion with a squeegee, and then the resin may be cured.

Next, with reference to FIG.6 and FIG.7, 4th Embodiment of the 1st linear light emitting element array of this invention is described.
FIG. 6 is a top view for explaining the arrangement of the light emitting elements of the linear light emitting element array of the present embodiment. In FIG. 6, illustration of the sealing resin and the wiring is omitted. FIG. 7A is a cross-sectional view along the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment. FIG. 7B is a cross-sectional view along a direction perpendicular to the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment. FIG. 7 shows a state in which a light guide plate is installed on the linear light emitting element array.

  The linear light emitting element array of the present embodiment has the same configuration as the linear light emitting element array of the second embodiment described above, except that the light emitting elements are arranged in two rows on the substrate 1. For this reason, in this embodiment, the same code | symbol is attached | subjected to the component same as 2nd Embodiment, and those description is abbreviate | omitted.

  In the present embodiment, as shown in FIG. 6, 0.3 mm square LED bare chips 2 as light emitting elements 2 are arranged in two rows at a pitch (P1) of 2.5 mm on a substrate 1 having a length (L) of 300 mm. Has been. The pitch (P2) between the arrays is 2.0 mm.

  Here, the three primary color single-color LEDs are arranged so that the ratio of the number of chips is red: green: blue = 1: 2: 1.

  Further, as shown in FIGS. 7A and 7B, a sealing resin 3 having a thickness H = 1 mm is provided on the substrate 1 with a width W = 4 mm. Then, on the surface of the sealing resin 3, as shown in FIG. 7A, a surface shape 30a having an isosceles trapezoidal cross section is formed at a pitch (P3) of 50 μm. The top surface of the isosceles trapezoid is in optical contact with the light guide plate 6.

Next, a fifth embodiment of the first linear light-emitting element array of the present invention will be described with reference to FIG.
FIG. 8 is a cross-sectional view along the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment.

  The linear light emitting element array of the present embodiment has an emission surface 35 a on the side surface of the sealing resin 3. And the reflection means 5 is provided on the curved surface 35b except the output surface 35a in the surface of the sealing resin 3.

  A bellows-like surface shape for deflecting light emitted from the LED bare chip 2 is formed on the emission surface 35a. The contour of the surface shape in the cross section along the arrangement direction of the light emitting elements 2 has a convex prism shape in which a plurality of isosceles triangles are continuous, as in the first embodiment. The pitch of the convex prisms is 50 μm, which is shorter than the arrangement pitch 2 mm of the LED bare chips 2.

  Of the light emitted from the light emitting element 2, the light directed toward the curved surface 35 b is reflected by the reflecting means 5 to the emission surface 35 a. For this reason, in combination with the light directly emitted from the LED bare chip 2, the emission efficiency can be increased from the emission surface 35a. Light is emitted mainly from the emission surface 35a in a direction parallel to the substrate surface.

  Also in the present embodiment, as in the first embodiment, the continuous surface shape of the convex prism is formed on the emission surface 35a, so that the substrate is totally reflected at the interface between the sealing resin 3 and the air. Light that returns to the surface can be reduced. As a result, the emission efficiency can be improved. Further, the outgoing light beam is refracted in various directions depending on the surface shape. As a result, the light emission efficiency can be increased without reducing the mixing efficiency.

  Next, an embodiment (sixth embodiment) of the second linear light-emitting element array of the present invention will be described with reference to FIG. FIG. 9 is a perspective view of the linear light emitting element array according to the present embodiment.

  The linear light emitting element array of the present embodiment has the same structure as that of the first embodiment except for the surface shape 31 of the sealing resin 3. For this reason, in this embodiment, the same code | symbol is attached | subjected to the component same as 1st Embodiment, and those description is abbreviate | omitted.

  In the present embodiment, the sealing resin 3 has a surface shape in which quadrangular pyramids are two-dimensionally arranged on the surface thereof. The arrangement pitch of the quadrangular pyramids is a 50 μm pitch shorter than the arrangement pitch 2 mm of the LED bare chips 2. The base angle of each quadrangular pyramid is 45 ° (that is, the apex angle is 90 °).

  By forming such a surface shape 31 in which square pyramids are two-dimensionally arranged, light that is totally reflected on the surface of the sealing resin 3 and returns to the substrate surface is reduced. As a result, the emission efficiency can be improved. Further, the outgoing light beam is refracted in various directions depending on the surface shape. As a result, the light emission efficiency can be increased without reducing the mixing efficiency.

  In the present embodiment, an example in which a quadrangular pyramid is formed as the surface shape has been described, but the surface shape is not limited to this. For example, a polygonal pyramid shape such as a triangular pyramid or a hexagonal pyramid other than a quadrangular pyramid or a conical shape may be two-dimensionally arranged. The base angles of these polygonal pyramids are preferably set to 25 to 50 ° as in the first embodiment.

Next, an embodiment (seventh embodiment) of a third linear light-emitting element array of the present invention will be described with reference to FIGS.
FIG. 10 is a top view for explaining the arrangement of the light emitting elements of the linear light emitting element array of the present embodiment. In FIG. 10, illustration of the sealing resin and the wiring is omitted. Moreover, Fig.11 (a) is sectional drawing along the arrangement direction of the light emitting element of the linear light emitting element array of this embodiment. FIG. 11B is a cross-sectional view along a direction perpendicular to the arrangement direction of the light emitting elements of the linear light emitting element array of the present embodiment. FIG. 11 shows a state where the light guide plate is placed on the linear light emitting element array.

  The linear light-emitting element array of the present embodiment includes a substrate 1 having a length (L) of 300 mm, monochromatic light-emitting elements 2 of three primary colors arranged in a line on the substrate 1, and a sealing that individually covers each of the light-emitting elements 2. Each of the light emitting elements 2 is provided with a resin 3 a and reflecting means for reflecting light emitted from the light emitting elements 2 in the front direction of the substrate 1.

  In the present embodiment, the reflecting means is constituted by the concave shape 10 formed on the substrate 1. Each concave shape 10 has a circular shape when viewed from above. The diameter (D1) of the circular opening is 5 mm, the diameter (D2) of the bottom surface 10a is 3 mm, and the depth (d) is 0.5 mm. And the circumference | surroundings of the recessed part shape 10 form the mortar-like slope 10b.

On the bottom surface 10a of each concave shape 10, a 1 mm square large area LED bare chip as a light emitting element is arranged.
Note that the arrangement pitch of the light emitting elements, that is, the interval (P) between the concave shapes is 12.5 mm.

  Each of the sealing resins 3 a has a tapered side surface 32 substantially above the mortar-shaped slope 10 b having the concave shape 10. Each of the sealing resins 3 a has a flat emission surface 33 substantially above the central bottom 10 a of the concave shape 10. The emission surface 33 is in optical contact with the light guide plate 6 having a thickness (W) of 4 mm.

  Some of the light emitted from the light emitting element is directly emitted from the emission surface 31 into the light guide plate 6. Some are totally reflected by the tapered side surface 32 of the sealing resin 3 a and are emitted from the emission surface 31. Further, some of the light is reflected by the inclined surface 10 b of the concave shape 10 in the front direction of the substrate 1, further totally reflected by the tapered side surface 32, and emitted from the emission surface 31.

  Thus, by combining the reflecting means having the concave shape 10 and the tapered side surface 32 of the sealing resin 3, light can be efficiently emitted from the sealing resin 3a. At this time, since the traveling direction of the light emitted from the sealing resin 3a is various, the mixing efficiency can be increased. Thereby, according to the 3rd linear light emitting element array of this invention, mixing efficiency can be raised, without reducing the incident efficiency to a light-guide plate.

  In each embodiment mentioned above, although the example which constituted the present invention on specific conditions was explained, the present invention can perform various change and combination, and is not limited to these. For example, in the embodiment described above, an example in which an aluminum substrate is used as the substrate has been described. However, in the present invention, the substrate is not limited to this, and for example, a ceramic substrate such as aluminum nitride may be used.

  Moreover, although each embodiment mentioned above demonstrated the example which arranged the light emitting element in 1 row or 2 rows, in this invention, you may arrange 3 or more light emitting elements.

  In each of the above-described embodiments, examples in which small chips of 0.2 to 0.4 mm square are arranged as light emitting elements and examples of modules in which large chips of 0.5 to 2 mm square are arranged have been described. The invention is not limited to these, and for example, a submount on which a plurality of small chips are mounted may be used as a light emitting element, and one or more rows may be arranged. Further, for example, a plurality of small chips may be mounted as light emitting elements on the bottom surface of each concave shape in the seventh embodiment. In these cases, a single-color or multiple-color LED bare chip group can be mounted on each of the submount or the recess shape.

  Further, in each of the above-described embodiments, the example in which the light emitting elements of the three primary colors are used as the light emitting elements, but the color types of the light emitting elements are not limited to this. For example, monochromatic light emitting elements of six color types may be used.

  Moreover, although each embodiment mentioned above demonstrated the example which uses a two-pack type silicone resin as sealing resin, in this invention, the material of sealing resin is not limited to this. The sealing resin includes, for example, an epoxy resin, an acid anhydride as a curing agent, a cationic polymerized onium salt as a curing catalyst, a compound containing a curing agent such as a phenol resin, and an amine-based curing agent. Arbitrary suitable things, such as what combined these, can be used.

1 is a perspective view of a linear light emitting element array according to a first embodiment of the present invention. (A) is sectional drawing along the arrangement direction of the light emitting element of the linear light emitting element array shown in FIG. 1, (b) is perpendicular | vertical to the arrangement direction of the light emitting element of the linear light emitting element array shown in FIG. It is sectional drawing along the various directions. (A) is sectional drawing along the sequence direction of the light emitting element of the linear light emitting element array which concerns on 2nd Embodiment, (b) is the linear light emitting element array which concerns on 2nd Embodiment. It is sectional drawing along the direction perpendicular | vertical to the sequence direction of a light emitting element. (A) is sectional drawing along the sequence direction of the light emitting element of the linear light emitting element array which concerns on 3rd Embodiment, (b) is light emission of the linear light emitting element array which concerns on 3rd Embodiment. It is sectional drawing along the direction perpendicular | vertical to the arrangement direction of an element. (A)-(d) is sectional process drawing which shows an example of the manufacturing method of the linear light emitting element array which concerns on 3rd Embodiment. It is a top view for demonstrating the arrangement | sequence of the light emitting element of the linear light emitting element array of 4th Embodiment. (A) is sectional drawing along the sequence direction of the light emitting element of the linear light emitting element array of 4th Embodiment, (b) is the light emitting element of the linear light emitting element array of 4th Embodiment. It is sectional drawing along the direction perpendicular | vertical to the arrangement direction. It is sectional drawing along the arrangement direction of the light emitting element of the linear light emitting element array of 5th Embodiment. It is a perspective view of the linear light emitting element array of 6th Embodiment. It is a top view for demonstrating the arrangement | sequence of the light emitting element of the linear light emitting element array of 7th Embodiment. (A) is sectional drawing along the sequence direction of the light emitting element of the linear light emitting element array of 7th Embodiment, (b) is the light emitting element of the linear light emitting element array of 7th Embodiment. It is sectional drawing along the direction perpendicular | vertical to the arrangement direction. (A) is sectional drawing along the arrangement direction of the light emitting element of the conventional light emitting element array, (b) is sectional drawing along the direction perpendicular | vertical to the arrangement direction.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 2 Light emitting element, LED bare chip 3, 3a Sealing resin 4 Lead wire 5 Reflecting means 6 Light guide plate 7 Dispenser 8 Mold 10 Recessed shape 10a Bottom surface 10b Slope 13 Resin 30, 30a, 31 Surface shape 32 Side surface 33 Emitting surface 35a Output surface 35b Curved surface 50 Support 51 Reflecting surface

Claims (4)

A linear light emitting element array for backlight,
A substrate,
A plurality of color light-emitting elements arranged in one or more rows on the substrate;
A sealing resin continuously covering each of the light emitting elements,
The sealing resin has a surface shape that deflects light emitted from the light emitting element on the surface thereof,
The outline of the surface shape in a cross section along the arrangement direction of the light emitting elements is characterized in that a plurality of triangles or isosceles trapezoids have a continuous shape with a pitch shorter than the arrangement pitch of the light emitting elements. Linear light emitting element array. A linear light emitting element array for backlight,
A substrate,
A plurality of color light-emitting elements arranged in one or more rows on the substrate;
A sealing resin continuously covering each of the light emitting elements,
The sealing resin has a surface shape in which a polygonal pyramid or a cone shape is two-dimensionally arranged on the surface thereof at a pitch shorter than the arrangement pitch of the light emitting elements. A linear light emitting element array for backlight,
A substrate,
A plurality of color light-emitting elements arranged in one or more rows on the substrate;
A sealing resin that individually covers each of the light emitting elements;
Reflecting means for reflecting the light emitted from the light emitting element in the front direction of the substrate for each of the light emitting elements,
3. The linear light emitting element array according to claim 1, wherein the sealing resin has a tapered side surface that totally reflects light reflected by the reflecting means above the reflecting means. 4. . The reflecting means is constituted by a concave shape formed in the substrate,
The light emitting element is disposed on the center bottom surface of each of the concave shapes,
The linear light-emitting element array according to claim 3, wherein the sealing resin is formed on the concave shape.

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