JP2006346866A - Circuit member for inkjet head, its manufacturing method, inkjet head and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit member for an inkjet head of a piezoelectric system which has an FPC and a piezoelectric element laminated in this order to be offered to the inkjet head, and which has no risk of occurrence of breaking of the piezoelectric element in a peripheral region within the piezoelectric element region outside an arrangement of a circuit of the FPC. <P>SOLUTION: While the circuit side for driving the piezoelectric element of the FPC 130 is made the piezoelectric element 40 side, the FPC and the piezoelectric element are stuck to each other by an insulating adhesive layer 65. The FPC and the piezoelectric element are electrically connected to each other by a terminal part 42 for connection with the circuit for driving the piezoelectric element of the FPC. The terminal part 42 is prepared at a side face part of the piezoelectric element. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an inkjet head, and in particular, a circuit for a piezoelectric piezoelectric inkjet head that discharges ink from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. The present invention relates to a member and a manufacturing method thereof.

In recent years, the market of inkjet printers has grown rapidly due to the spread of electronic products such as PCs (personal computers) and digital products. There are various types of inkjet systems, but from the aspect of resolution and high speed. A piezoelectric type that is a DOD (Dot On Demand) type is adopted.
In this type of ink jet printer, an ink jet head having an orifice opening for ejecting ink and a flow channel structure for flowing ink through the orifice opening is used in the ink ejection portion.

As a piezo-piezoelectric inkjet head that is a DOD (Dot On Demand) type, for example, there is a stemme method whose partial cross section is shown in FIGS. 5 (a) and 5 (b).
5B shows the cross-sectional state at the position D1-D2 in FIG. 5A, and FIG. 5A shows the cross-sectional state at the position D3-D4 in FIG. It is.
The ink jet head shown in FIG. 5 supplies ink into the flow path 211 and discharges it from the orifice 271 through the flow path 211a. However, simply, the piezoelectric element 240 is driven by an electric signal and is distorted. In the ink flow path 211a formed in the casing, the vibration plate 220 periodically deforms the convex and concave on the flow path 211a side, and a pressure wave is generated in the ink in this portion. The pressure wave travels through the ink flow path 211, reaches the orifice 271 having a diameter of 20 μm to 100 μm, and ejects ink.
A plurality of such orifices 271 are arranged in the casing 210, and similarly, an ink flow path and a piezoelectric element are arranged for each.
The flow path 211a on which the vibration plate 220 directly acts is hereinafter referred to as an ink pressure chamber.
The vibration plate 220 is a plate-like member for transmitting the distortion (vibration) of the piezoelectric element 240 directly to the ink pressure chamber 211a.
In the case of the inkjet head of the casing 210 shown in FIG. 5, the adhesive layer 250 is disposed on the entire surface of the diaphragm 120, and the FPC 230 is bonded and fixed to the diaphragm 220.
The FPC (flexible printed circuit) 230 is formed with driving electrodes for driving the piezoelectric elements 240, and sends electric signals for driving to the piezoelectric elements 240. For example, one surface of a resin base material such as polyimide In addition, an electrode portion patterned by a photo-etching method is used, and when the piezoelectric element 240 is pressure-bonded, conduction between the electrode portion of the piezoelectric element 240 and the electrode portion of the FPC is established.
In order to form the ink flow path 211 finely and accurately, the casings 210 are each formed by laminating and joining the stainless thin plates 210a etched into a predetermined shape.
In FIG. 5, the thin dotted line indicates the position of the boundary portion between the stainless steel thin plates, but the stainless steel thin plates 210a are diffusion bonded.
In addition, as a housing | casing, an integrated housing | casing may be used and it is not limited to the housing | casing formed by such diffusion bonding.
The FPC 230 provided with a driving circuit for driving the piezoelectric element 240 is pressure-bonded to the piezoelectric element 240 via the anisotropic conductive adhesive layer 260, with the circuit side being the piezoelectric element 240 side. Thereby, the electrical connection between the piezoelectric element 240 and the FPC 230 is established.

In the ink jet head shown in FIG. 5, an orifice plate portion 270 in which an orifice 271 is formed is bonded to the casing 210.
For example, in Japanese Patent Laid-Open No. 2002-283576 (Patent Document 1), an orifice plate portion formed by adhering an orifice plate formed with an orifice to a thin metal plate subjected to an etching process (see 270 in FIG. 5). Or the orifice plate portion 270 formed in the opening portion of the metal plate material by plating. However, the orifice plate portion thus formed (corresponding to 270 in FIG. 5) is described. The body 210 is joined and disposed.
JP 2002-283576 A

In the inkjet head shown in FIG. 5, the FPC 230 and the piezoelectric element 240 are thermocompression bonded via the anisotropic conductive adhesive layer 260 (corresponding to 360 in FIG. 6) by the thermocompression bonding method shown in FIG. Although electrically connected, at the time of this thermocompression bonding, as shown in E1 part and E2 part of FIG. 6B, outside the circuit arrangement of the FPC 330, in the peripheral region in the piezoelectric element region, Chipping (also referred to as breakage) 345 of the piezoelectric element 340 may occur, and quality deterioration due to the chipping of the piezoelectric element 340 is a problem.
When the chip 345 of the piezoelectric element 340 occurs, it becomes impossible to discharge ink uniformly over all nozzles.
Conventionally, as an anisotropic conductive adhesive layer (corresponding to 260 in FIG. 5 and 360 in FIG. 6), an anisotropic conductive film (ACF: Anisotropic Conductive Film) in which conductive particles are dispersed in an epoxy resin or the like is used. Is also used).

As described above, in recent years, a piezo-piezoelectric method that is a DOD (Dot On Demand) type has been adopted as an ink-jet head, and this method also has a more uniform ink from each orifice in accordance with the recent demand for quality improvement. In the case of an ink jet head having the structure shown in FIG. 5 of such a system, conventionally, as shown in FIG. 6B, the piezoelectric element 340 is arranged outside the array of the circuits 320 of the FPC 330. A chipping of the piezoelectric element 340 may occur in a peripheral region in the region, and this countermeasure has been demanded.
The present invention corresponds to this, and is a circuit member for a piezoelectric piezoelectric inkjet head in which an FPC and a piezoelectric element provided in an inkjet head are stacked in this order, outside the array of FPC circuits, An object of the present invention is to provide a circuit member for an ink jet head in which no chipping of the piezoelectric element occurs in the peripheral region in the piezoelectric element region.
Furthermore, an inkjet head using such a circuit member for an inkjet head is provided.
At the same time, an object of the present invention is to provide a method for producing a circuit member for such an ink jet head and a method for producing the ink jet head.

The circuit member for an inkjet head of the present invention is a piezoelectric piezoelectric inkjet head that discharges ink from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. A circuit member for an ink jet head provided, wherein the FPC piezoelectric element driving circuit side is a piezoelectric element side, and the FPC and the piezoelectric element are bonded together by an insulating adhesive layer Thus, the FPC and the piezoelectric element are electrically connected to each other at the terminal portion for connection with the FPC piezoelectric element driving circuit provided on the side surface of the piezoelectric element. .
A circuit member for an ink jet head as described above, wherein the electrical connection between the FPC and the piezoelectric element in the connection terminal portion is a solder connection or a wire bonding connection.
Here, it is assumed that a plurality of sets of ink pressure chambers and orifices connected thereto are substantially the same, and usually have the same structure and the same size.

An ink jet head according to the present invention is a piezo piezoelectric ink jet head that discharges ink from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. A housing having a plurality of sets of pressure chambers and orifices connected to the pressure chambers, in which the ink pressure chambers are aligned on one surface side, and the orifices are arrayed on the other surface side; The FPC and the piezoelectric element are laminated in this order on the surface of the body on the ink pressure chamber side, either directly or via a vibration plate, and the circuit side for driving the FPC piezoelectric element is the piezoelectric element side. The FPC and the piezoelectric element are bonded to each other by an insulating adhesive layer, and at the terminal portion for connecting to the FPC piezoelectric element driving circuit provided on the side surface portion of the piezoelectric element, With FPC And conductive elements are characterized in that they are electrically connected.
In the inkjet head described above, the electrical connection between the FPC and the piezoelectric element in the connection terminal portion is a solder connection or a wire bonding connection.

  A method for producing a circuit member for an inkjet head according to the present invention is a piezoelectric piezoelectric inkjet in which ink is ejected from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. A circuit member for an ink jet head to be provided to the head, and the FPC piezoelectric element driving circuit side is the piezoelectric element side, and the FPC and the piezoelectric element are bonded together by an insulating adhesive layer. In addition, a circuit member for an ink jet head in which the FPC and the piezoelectric element are electrically connected at a terminal portion for connection with the FPC piezoelectric element driving circuit provided on the side surface of the piezoelectric element. In which a terminal portion for connection with a circuit for driving an FPC piezoelectric element is provided on the side surface of the piezoelectric element in advance. After the piezoelectric element driving circuit side of the piezoelectric element is set to the piezoelectric element side and the FPC and the piezoelectric element are bonded together by an insulating adhesive layer, the FPC and the piezoelectric element are connected to each other at the connection terminal portion on the side surface of the piezoelectric element. Are electrically connected. A method for producing a circuit member for an ink jet head described above is characterized in that the electrical connection between the FPC and the piezoelectric element is a solder connection or a wire bonding connection.

  The inkjet head manufacturing method of the present invention is a piezoelectric piezoelectric inkjet head that discharges ink from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber, and A housing having a plurality of sets of ink pressure chambers and orifices connected thereto, the ink pressure chambers being aligned on one surface side, and the orifices being arrayed on the other surface side. A method of manufacturing an ink jet head in which an FPC and a piezoelectric element are laminated in this order on the surface of the body on the ink pressure chamber side, directly or via a vibration plate, for driving the piezoelectric element. The FPC and the piezoelectric element are arranged on the side of the piezoelectric element, the FPC and the piezoelectric element are bonded together by an insulating adhesive layer, and the FPC and the piezoelectric element are integrally laminated. A circuit member for a jet head is formed, and the circuit member for an ink jet head is fixed to an ink pressure chamber side surface of a casing directly or through a vibration plate with an adhesive, and the ink jet The circuit member for a head is produced by the method for producing a circuit member for an inkjet head according to any one of claims 5 to 6.

(Function)
The ink jet head circuit member of the present invention has such a structure, and an FPC and a piezoelectric element used in a piezoelectric ink jet head (see FIG. 5) are provided with an anisotropic conductive adhesive layer. In this order, circuit members for the inkjet head that are stacked in this order, are free from chipping of the piezoelectric elements in the peripheral region in the piezoelectric element region outside the FPC circuit arrangement. It is possible to provide.
Specifically, the FPC piezoelectric element drive circuit side is the piezoelectric element side, and the FPC and the piezoelectric element are bonded together by an insulating adhesive layer. The FPC is provided on the side surface of the piezoelectric element. In addition, this is achieved because the FPC and the piezoelectric element are electrically connected to each other at the terminal portion for connection with the FPC piezoelectric element driving circuit.
Specifically, in the invention of claim 1, the FPC and the piezoelectric element are electrically connected via an anisotropic conductive adhesive layer (ACF) as in the conventional piezoelectric piezoelectric ink jet head shown in FIG. 5. The FPC and the piezoelectric element are not electrically connected to each other at the connection terminal portion provided on the side surface of the piezoelectric element. Since there is no need for a thermocompression bonding step for electrical connection as in the case of using an adhesive layer (ACF), the peripheral portion of the piezoelectric element, such as the conventional piezo-piezoelectric inkjet head shown in FIG. It can be assumed that there is no occurrence of chipping.
Specific examples of the electrical connection between the FPC and the piezoelectric element in the connection terminal portion of the piezoelectric element include solder connection and wire bonding connection.

By adopting such a configuration, the inkjet head of the present invention can provide a piezo-piezoelectric inkjet head in which no chipping occurs in the peripheral portion of the piezoelectric element.
Specific examples of the electrical connection between the FPC and the piezoelectric element in the connection terminal portion of the piezoelectric element include solder connection and wire bonding connection.
Here, when the circuit member for the ink jet head is directly laminated on the surface of the casing on the ink pressure chamber side, the FPC has a function of a diaphragm.
In the ink jet head, the ink flow path can be finely formed with high precision by forming the casing by laminating and forming metal plates etched into a predetermined shape. .
When the stainless steel material is used as the metal plate material, it is preferable that the vibration plate is made of stainless steel, so that the vibration plate can be diffusion bonded to the surface of the housing on the ink pressure chamber side.

  The method for producing a circuit member for an ink-jet head according to the present invention is a circuit member for an ink-jet head that is used in a piezo-piezo-electric ink-jet head with such a configuration. Thus, it is possible to provide a method for manufacturing a circuit member for an ink-jet head, which can manufacture a circuit member for an ink-jet head in which no chipping of the piezoelectric element occurs.

The production method of the inkjet head of the present invention has such a configuration,
Therefore, it is possible to provide a method for manufacturing an ink jet head that can manufacture a piezoelectric ink jet head that does not cause chipping in the peripheral portion of the piezoelectric element.

As described above, the present invention is a circuit member for an ink-jet head that is used in a piezo-piezoelectric ink-jet head (see FIG. 5). Thus, it is possible to provide a circuit member for an ink jet head in which no occurrence of the above occurs.
Then, it is possible to provide a method for producing a circuit member for such an inkjet head.
Furthermore, it is possible to provide an ink jet head using such a circuit member for an ink jet head and a method for manufacturing the ink jet head.

Embodiments of the present invention will be described with reference to the drawings.
1A is a cross-sectional view of an embodiment of a circuit member for an ink jet head of the present invention, FIG. 1B is a perspective view thereof, and FIG. 2A is an ink jet head for the ink jet head of the present invention. FIG. 2B is a perspective view of another example of the embodiment of the circuit member of FIG. 2, and FIG. 3 is an example of an inkjet head using the circuit member for the inkjet head shown in FIG. FIG. 4 is a process flow diagram showing an example of a method for manufacturing the ink jet head shown in FIG. 1A is a cross-sectional view taken along A1-A2 in FIG. 1B, and FIG. 2A is a cross-sectional view taken along A11-A21 in FIG. 2B.
3A is a cross-sectional view taken along B3-B4 in FIG. 3B, and FIG. 3B is a cross-sectional view taken along B1-B2 in FIG.
S11 to S16 in FIG. 4 indicate processing steps.
1-4, 10 is a film substrate (here, a polyimide film), 20 is a circuit (also referred to as a wiring portion), 40 is a piezoelectric element, 41 is an electrode (of the piezoelectric element), 42 is a connection terminal portion, 45 is a side surface, 65 is an insulating adhesive layer, 80 is a bonding wire, 85 is solder, 110 is a housing, 110a is a (processed) stainless steel thin plate, 110b is a processed portion, 111 is an ink flow path, and 111a is ink. The pressure chamber, 120 is a diaphragm, 130 is an FPC, 140 is a piezoelectric element (also simply referred to as a piezoelectric element), 150 is an adhesive, 165 is an insulating adhesive layer, 170 is an orifice plate, and 171 is an orifice.

First, an example of an embodiment of a circuit member for an ink jet head according to the present invention will be described with reference to FIG.
The circuit member for the inkjet head of this example is a piezoelectric piezoelectric inkjet head that discharges ink from an orifice connected to the ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. The FPC 130 and the piezoelectric element 40 are bonded to each other by an insulating adhesive layer 65 with the piezoelectric element driving circuit 20 side of the FPC 130 provided on the piezoelectric element 40 side. The FPC 130 and the piezoelectric element 40 are electrically connected to each other at a connection terminal portion 42 provided on the side surface 45 of the piezoelectric element 40 and connected to a circuit for driving an FPC piezoelectric element.
Here, the electrical connection between the FPC 130 and the piezoelectric element 40 in the connection terminal portion 42 is bonded by a bonding wire 80.
Here, the bonding connection is made by the bonding wire 80, but the connection can be made by solder connection as shown in FIG.
Here, no circuit is formed in the bonding region of the FPC 130 with the piezoelectric element (corresponding to 40 in FIG. 1).
In the FPC 130, a plurality of the piezoelectric element driving circuits 20 are arranged so that the wiring portions are parallel to each other.
In this example, the FPC and the piezoelectric element are not electrically connected via an anisotropic conductive adhesive layer (ACF) as in the conventional piezo-piezoelectric inkjet head shown in FIG. Since the electrical connection between the piezoelectric element 40 and the piezoelectric element 40 is performed at the connection terminal portion disposed on the side surface 45 of the piezoelectric element 40, an anisotropic conductive adhesive layer ( Since a thermocompression bonding step for electrical connection as in the case of using ACF) is not required, the chip at the periphery of the piezoelectric element, such as the conventional piezoelectric piezoelectric ink jet head shown in FIG. There can be no occurrence.

Here, a polyimide film substrate is used as the film substrate of the FPC 130, but other examples include a liquid crystal polymer film substrate, an aramid film substrate, and a polyester film substrate.
The thickness is usually 25 μm to 200 μm.
As a material for forming the circuit 20, a copper foil or the like is used and is usually formed by etching. The electrodes of the piezoelectric element 40 are made of gold or the like formed by vapor deposition or the like. The surface of the connection terminal portion 42 of the piezoelectric element 40 and the wire bonding connection portion of the circuit 20 are preferably subjected to Au plating or the like.
Moreover, as the insulating adhesive layer 65, a thermosetting adhesive layer or a photocurable adhesive layer is appropriately used.
Specifically, an epoxy adhesive or the like is used, but is not limited thereto.
Moreover, as the piezoelectric element 40, for example, a material obtained by subjecting lead zirconate titanate (PZT) to polarization treatment can be cited.

Next, the circuit member for the ink jet head of this example is manufactured as follows, for example.
An FPC 130 in which the circuit 20 is formed on one surface of the film base material 10 is prepared in advance.
For example, a laminated base material in which a copper foil is bonded to one surface of a film base material (corresponding to 10 in FIG. 1) is prepared, and a resist is disposed on the copper foil surface, and then corresponds to the pattern of the circuit to be formed. Using the original mask, the resist is exposed and developed to form a resist pattern having an opening of a predetermined shape, and the copper foil is etched using the resist pattern as an etching resistant mask to form a circuit (20 in FIG. 1) as a film. An FPC is produced by forming on one surface of the substrate.
Here, the FPC is covered with a film substrate except for terminal portions that require electrical connection.
As the resist, those having desired resolution, etching resistance, and good processability are preferable, but not particularly limited.
As the etching solution, a ferric chloride solution or the like is used.
Next, an FPC (corresponding to 130 in FIG. 1) in which the circuit 20 is disposed on one surface of the film substrate 10 and the piezoelectric element 40 are disposed, and an adhesive layer is disposed in a bonding region between the two and the piezoelectric element 40. Then, apply light pressure and bond.
As appropriate, thermosetting and photocuring are performed using a thermosetting and photocurable adhesive layer.
After the bonding, the FPC 130 and the piezoelectric element 40 are electrically connected by wire bonding at the connection terminal portion 42 on the side surface 45 of the piezoelectric element 40.
The circuit member for the ink jet head of this example is manufactured in this manner.

Examples of the inkjet head provided with the circuit member for the inkjet head of this example include an inkjet head as shown in FIG.
In addition, it replaces with description of one example of embodiment of the inkjet head of this invention with the following description.
The inkjet head shown in FIG. 3 ejects ink from an orifice 171 connected to the ink pressure chamber 111a by giving a pressure wave due to distortion of the piezoelectric element 140 to the ink pressure chamber 111a. Thus, a plurality of sets of ink pressure chambers 111a and orifices 171 connected thereto are provided, the ink pressure chambers 111a are aligned on one surface side, and the orifices 171 are arrayed on the other surface side. The housing 110 is provided, and the FPC 130 and the piezoelectric element 140 are laminated in this order on the surface of the housing 110 on the ink pressure chamber 111a side through the diaphragm 120. The piezoelectric element of the FPC 130 The FPC 130 and the piezoelectric element 40 are bonded together by the insulating adhesive layer 65 with the driving circuit 20 side facing the piezoelectric element 40 side. In addition, the FPC 130 and the piezoelectric element 40 are electrically connected by wire bonding at a connection terminal portion 42 provided on the side surface 45 of the piezoelectric element 40 with the circuit 20 for driving the piezoelectric element of the FPC 130. Connected to.
Here, a portion where the FPC 130, the piezoelectric element 140, and the insulating adhesive layer 165 are combined is used as a circuit member for the ink jet head shown in FIG.
Here, no circuit is formed in the bonding region of the FPC 130 with the piezoelectric element (corresponding to 40 in FIG. 1). However, in some cases, a circuit may be formed in the bonding region. In this example, in order to form the ink flow path 111 finely and accurately, the casings 110 are each formed by stacking stainless thin plates 110a etched into a predetermined shape and performing diffusion bonding.
In FIG. 3, the thin dotted line indicates the boundary portion position between the stainless thin plates, but the stainless thin plates 110a are diffusion bonded.
As the orifice plate part 170, a thin stainless steel plate having an opening formed by etching and an orifice plate having an orifice formed thereon is used, but the present invention is not limited to this.
In addition, although the inkjet head shown in FIG. 3 is provided with the diaphragm 120, the form which gives the role of a diaphragm to the film base material of FPC without providing this is also mentioned.
In addition to the ink flow path 111, for example, an ink chamber (reservoir) or the like may be provided in the housing 110.

Next, an example of a method of manufacturing an ink jet head using the circuit member for the ink jet head of this example shown in FIG. 1 manufactured as described above will be briefly described with reference to FIG.
According to the ink flow path 111 of the casing 110 to be formed, the stainless steel thin plates 110a for laminating and forming them are each etched into a predetermined shape. (S11)
As an etching process, for example, an etching resistant resist is applied to both sides of a base material, selectively exposed through an original mask, developed, dried, etc., and a resist having an opening of a predetermined shape as a mask. Examples include, but are not limited to, a photoetching method in which an outer shape is processed by etching with a ferric chloride solution, and the resist is peeled off and washed.
Next, the etched stainless steel thin plates 110 a are stacked while being aligned, and diffusion bonded to produce the housing 110. (S12)
On the other hand, a diaphragm 120 made of a flat stainless steel thin plate on both sides is prepared. (S13)
Next, the casing 110 and the diaphragm 120 are diffusion-bonded, and an adhesive 150 is coated flat on the surface of the diaphragm 120. (S14)
Here, the case where the housing 110 and the diaphragm 120 are integrated and the adhesive 150 is disposed is referred to as a second structure.
On the other hand, as described above, the circuit member for the ink jet head of this example shown in FIG. 1 is prepared. (S15)
Next, the inkjet head circuit member is fixed to the surface of the housing 110 on the ink pressure chamber 111 side with the adhesive 150 via the vibration plate 120 to obtain an inkjet head. (S16)
In this way, an ink jet and head using the circuit member for an ink jet head shown in FIG. 1 are produced.

FIG. 1A is a cross-sectional view of an example of an embodiment of a circuit member for an ink jet head according to the present invention, and FIG. 1B is a perspective view thereof. 2A is a cross-sectional view of another example of the embodiment of the circuit member for an ink jet head of the present invention, and FIG. 2B is a perspective view thereof. FIG. 3 is a sectional view showing an example of an ink jet head using the circuit member for the ink jet head shown in FIG. FIG. 4 is a process flow diagram illustrating an example of a method for manufacturing the inkjet head illustrated in FIG. 3. It is a schematic block diagram for demonstrating the conventional piezo-piezoelectric inkjet head. It is a manufacturing process figure for demonstrating the manufacturing method of the circuit member for the conventional inkjet head.

Explanation of symbols

10 Film base (Polyimide film here)
20 Circuit (also called wiring part)
40 Piezoelectric element 41 (Piezoelectric element) electrode 42 Terminal section 45 for connection Side 65 Insulating adhesive layer 80 Bonding wire 85 Solder 110 Housing 110a (Processed) stainless steel thin plate 110b Processing section 111 Ink flow path 111a Ink pressure chamber 120 Diaphragm 130 FPC
140 Piezoelectric elements (also called simply piezoelectric elements)
150 Adhesive 165 Insulating Adhesive Layer 170 Orifice Plate 171 Orifice 210 Case 210a Stainless Steel Thin Plate 211 (Ink) Channel 211a Ink Pressure Chamber (also an Ink Channel)
220 Diaphragm 230 FPC
240 Piezoelectric element 250 Adhesive layer 260 Anisotropic conductive adhesive layer 270 Orifice plate portion 271 Orifice 310 Polyimide layer 320 Electrode circuit 330 FPC
340 Piezoelectric element 345 chip (of piezoelectric element) 360 Anisotropic conductive adhesive layer (ACF)
380 Press upper part 385 Press lower part

Claims (7)

  A circuit member for an ink jet head, which is provided to a piezoelectric piezoelectric ink jet head that discharges ink from an orifice connected to the ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. The FPC piezoelectric element driving circuit side is the piezoelectric element side, and the FPC and the piezoelectric element are bonded together by an insulating adhesive layer. The FPC is provided on the side surface of the piezoelectric element. A circuit member for an ink jet head, wherein the FPC and the piezoelectric element are electrically connected to each other at a terminal portion for connection to a circuit for driving the piezoelectric element of the FPC.   The circuit member for an ink jet head according to claim 1, wherein the electrical connection between the FPC and the piezoelectric element in the connection terminal portion is a solder connection or a wire bonding connection. Circuit member for use.   A piezoelectric piezoelectric inkjet head that discharges ink from an orifice connected to an ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber, the ink pressure chamber and an orifice connected to the ink pressure chamber A housing having a plurality of sets, with the ink pressure chambers aligned on one side thereof and the orifices arranged on the other surface side, provided on the ink pressure chamber side of the housing. An FPC and a piezoelectric element are laminated on the surface in this order, directly or via a diaphragm, and an insulating adhesive layer is formed with the circuit side for driving the FPC piezoelectric element facing the piezoelectric element. Thus, the FPC and the piezoelectric element are bonded together, and the FPC and the piezoelectric element are electrically connected to each other at the terminal portion for connection with the FPC piezoelectric element driving circuit provided on the side surface of the piezoelectric element. Connected Inkjet head characterized and.   4. The inkjet head according to claim 3, wherein the electrical connection between the FPC and the piezoelectric element in the connection terminal portion is a solder connection or a wire bonding connection.   A circuit member for an ink jet head, which is provided to a piezoelectric piezoelectric ink jet head that discharges ink from an orifice connected to the ink pressure chamber by applying a pressure wave due to distortion of the piezoelectric element to the ink pressure chamber. The FPC piezoelectric element driving circuit side is the piezoelectric element side, and the FPC and the piezoelectric element are bonded to each other by an insulating adhesive layer, and provided on the side surface of the piezoelectric element. A circuit member manufacturing method for manufacturing a circuit member for an ink jet head in which an FPC and a piezoelectric element are electrically connected at a terminal portion for connection with a circuit for driving an FPC piezoelectric element. In addition, a terminal portion for connection with the FPC piezoelectric element driving circuit is provided in advance on the side surface of the piezoelectric element, and the FPC piezoelectric element driving circuit side is set to the piezoelectric element side so as to provide insulation. A circuit member for an ink jet head, wherein an FPC and a piezoelectric element are electrically connected to each other at a connection terminal portion on a side surface of the piezoelectric element after the FPC and the piezoelectric element are bonded together by an adhesive layer. Manufacturing method.   6. A method for producing a circuit member for an inkjet head according to claim 5, wherein the electrical connection between the FPC and the piezoelectric element is a solder connection or a wire bonding connection. A method for producing a member. By applying a pressure wave due to the distortion of the piezoelectric element to the ink pressure chamber, a piezoelectric piezoelectric inkjet head that discharges ink from the orifice connected to the ink pressure chamber, and the ink pressure chamber and the orifice connected to the ink pressure chamber A housing having a plurality of sets, in which ink pressure chambers are aligned on one surface side, and orifices are arrayed on another surface side, is provided on the surface of the housing on the ink pressure chamber side, A method of manufacturing an inkjet head in which FPCs and piezoelectric elements are laminated in this order, directly or via a diaphragm, and the circuit side of the FPC on which a circuit for driving the piezoelectric elements is arranged On the piezoelectric element side, the FPC and the piezoelectric element are bonded together with an insulating adhesive layer to form a circuit member for an inkjet head in which the FPC and the piezoelectric element are integrally laminated. The circuit member for the inkjet head is fixed to the surface of the casing on the ink pressure chamber side directly or via a vibration plate by an adhesive, and the production of the circuit member for the inkjet head is described in the above claim. Item 7. A method for manufacturing an ink-jet head, which is performed by the method for manufacturing a circuit member for an ink-jet head according to any one of items 5 to 6.

Images