JP2006339268A - Semiconductor manufacturing apparatus, method of controlling the same, and method of manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus capable of restoring the content of a queue table, and to provide a method of controlling the semiconductor manufacturing apparatus and a method of manufacturing a device. <P>SOLUTION: The semiconductor manufacturing apparatus 1 processes a lot according to the content of the queue table 11 for reserving a processing condition and the order of a plurality of lots. The apparatus comprises a volatile storage region 2 for storing the queue table 11, and a control unit 10 for storing the content of the queue table 11 stored in the volatile storage region 2 in a nonvolatile storage region 3. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a semiconductor manufacturing apparatus, a control method thereof, and a device manufacturing method.

In semiconductor manufacturing apparatuses, particularly semiconductor exposure apparatuses, the number of wafers per lot tends to decrease and the number of lots tends to increase as the number of semiconductors increases. In such a situation, it is necessary to switch lots in a semiconductor manufacturing apparatus quickly and efficiently. For example, in Patent Document 1, the semiconductor manufacturing apparatus is configured to reserve a lot to be processed using a queue table for registering a lot processing condition and a lot processing order.
Japanese Patent Laid-Open No. 2002-217092 (FIG. 4, paragraph number 0031)

  However, in Patent Document 1, for example, if the semiconductor manufacturing apparatus is restarted in a state where lot information is registered in the queue table, the contents of the queue table are lost. Therefore, in the event of an unexpected situation where it is necessary to restart the semiconductor manufacturing apparatus, it is necessary to register lot information again on the queue table in order to continue lot processing. As a result, the production efficiency of the semiconductor manufacturing apparatus has been reduced.

  The present invention has been made in view of the above problems, and an object of the present invention is to make it possible to restore the contents of a queue table.

  A first aspect of the present invention relates to a semiconductor manufacturing apparatus for processing a lot according to the contents of a queue table for reserving processing conditions and processing order of a plurality of lots, and a volatile storage area for storing the queue table; A control unit that stores the contents of the queue table stored in the volatile storage area in the nonvolatile storage area.

  A second aspect of the present invention relates to a method for controlling a semiconductor manufacturing apparatus that processes lots according to the contents of a queue table for reserving processing conditions and processing orders of a plurality of lots. Processing conditions and processing orders of a plurality of lots Storing a queue table for reserving a queue in a volatile storage area, and storing the contents of the queue table stored in the volatile storage area in a nonvolatile storage area.

  A third aspect of the present invention relates to a device manufacturing method, and includes a step of preparing a substrate on which a latent image pattern is formed using the semiconductor exposure apparatus, and a step of developing the latent image pattern. It is characterized by.

  According to the present invention, the contents of the queue table can be restored.

[Semiconductor manufacturing equipment]
FIG. 1 is a diagram showing a schematic configuration of a semiconductor manufacturing apparatus 1 according to a preferred embodiment of the present invention.

  As shown in FIG. 1, a semiconductor manufacturing apparatus 1 according to a preferred embodiment of the present invention includes, for example, a volatile storage area 2, a nonvolatile storage area 3, a terminal unit 4, a communication unit 5, and a semiconductor manufacturing unit 8. Is done. Here, as the volatile or non-volatile storage area, one appropriately selected from various volatile or non-volatile storage devices or storage units can be used.

  The volatile storage area 2 is used to rewrite, hold, and read various storage information used in the semiconductor manufacturing apparatus 1. The storage information stored in the volatile storage area 2 is lost when the power is turned off. Normally, the volatile storage area 2 stores a queue table 11 in which information on lots to be processed (for example, processing conditions and processing orders of a plurality of lots) is registered.

  The nonvolatile storage area 3 stores the contents of the queue table 11 stored in the volatile storage area 2 and is used for reading the stored contents of the queue table 11 when the semiconductor manufacturing apparatus 1 is restarted. In FIG. 1, the non-volatile storage area 3 is arranged inside the semiconductor manufacturing apparatus 1, but the present embodiment is not limited to this, and is arranged outside the semiconductor manufacturing apparatus 1 so that it can communicate with the semiconductor manufacturing apparatus 1. A connected nonvolatile storage area may be used.

  The terminal unit 4 has a user interface attached to the semiconductor manufacturing apparatus 1. The operator can operate each unit in the semiconductor manufacturing apparatus 1 via the terminal unit 4 and can refer to each apparatus information in the semiconductor manufacturing apparatus 1. The terminal unit 4 gives an instruction for restoring the contents of the queue table 11 stored in the nonvolatile storage area 3 to the volatile storage area 2 to the control unit 10. Further, the terminal unit 4 includes a display unit 9 for displaying the contents of the queue table 11 stored in the nonvolatile storage area 3. The operator can check the contents of the queue table 11 stored in the nonvolatile storage area 3 via the display unit 9.

  The communication unit 5 connects the semiconductor manufacturing apparatus 1 and the host computer 7 through a communication line 6 conforming to a standard such as RS-232C. Thus, the semiconductor manufacturing apparatus 1 can be controlled from the host computer 7. The communication unit 5 notifies the host computer 7 of the contents of the queue table 11 stored in the nonvolatile storage area 3.

  The semiconductor manufacturing unit 8 includes an apparatus for processing a semiconductor, and includes a semiconductor exposure apparatus, a semiconductor cleaning apparatus, and other various semiconductor processes (such as various processes related to a wafer process described in paragraph 0028 below). Can be applied.

  The control unit 10 controls the operation of the entire semiconductor manufacturing apparatus 1 and executes lot processing according to the contents of the queue table 11 stored in the volatile storage area 2. In addition, the control unit 10 causes the display unit 9 of the terminal unit 4 to display the contents of the queue table 11 stored in the nonvolatile storage area 3 when the semiconductor manufacturing apparatus 1 is activated in response to an instruction from the terminal unit 4. .

  FIG. 2 is a diagram illustrating an example of the lot information 20 registered in the queue table 11. Reference numeral 20-1 denotes the name of a lot as a processing unit. 20-2 indicates the name of the recipe used for the process. Reference numeral 20-3 denotes a name of a mask used in, for example, a semiconductor exposure apparatus. Reference numeral 20-4 denotes a parameter specific to the control unit 10 that controls the processing of the entire semiconductor manufacturing apparatus 1. Reference numeral 20-5 indicates the current processing state of the lot. The contents of the lot information 20-1 to 20-5 registered in the queue table 11 are rewritten by the control unit 10.

  FIG. 3 is a diagram showing a specific example of the processing state 20-5 in FIG. The processing state shown in FIG. 3 transitions in the order of 30-1, 30-2, 30-3, and 30-4. In the processing state 20-5 in FIG. 2, the current processing state among 30-1 to 30-4 is registered. Reference numeral 30-1 denotes a standby state in which the lot information 20 is only registered in the queue table 11. Reference numeral 30-2 denotes a state in preparation for carrying a wafer to be used in a lot. Reference numeral 30-3 denotes a state in which a wafer is being processed. Reference numeral 30-4 denotes a process completion state in which the processing of all the wafers in the lot is completed.

  FIG. 4 is a diagram illustrating an example of the restoration screen 40 when the contents of the queue table 11 saved in the nonvolatile storage area 3 are restored to the display unit 9 of the terminal unit 4. The restoration screen 40 is used when restoring the contents of the queue table 11 saved in the nonvolatile storage area 3 as the current queue table 11. Reference numeral 40-1 denotes a screen area for displaying the contents included in the saved queue table 11. Reference numeral 40-2 denotes the contents included in the saved queue table 11. 40-2 can be composed of one or a plurality of pieces of lot information 20 (see FIG. 2). In FIG. 4, as an example, lot information 20 regarding four lots of LOT-A, LOT-B, LOT-C, and LOT-D is shown. In LOT-A, the used recipe name 20-2 is “Recipe01”, the used mask name 20-3 is “Mask01”, and the processing state 20-5 is “processing”. In LOT-B, the used recipe name 20-2 is “Recipe03”, the used mask name 20-3 is “Mask02”, and the processing state 20-5 is “preparing”. In LOT-C, the used recipe name 20-2 is “Recipe01”, the used mask name 20-3 is “Mask01”, and the processing state 20-5 is “standby”. In LOT-D, the used recipe name 20-2 is “Recipe02”, the used mask name 20-3 is “Mask05”, and the processing state 20-5 is “standby”.

  Reference numeral 40-3 denotes a check box for selecting the lot information 20 to be restored when the contents of the queue table 11 are restored. Reference numeral 40-4 denotes a button for restoring the contents of the queue table 11. When the operator presses the button 40-4 using the terminal unit 4, the lot information 20 selected by the check box 40-3 is restored to the current queue table 11. After the queue table 11 is restored, the screen 40 is closed. Reference numeral 40-5 denotes a cancel button. By pressing the button 40-5 using the terminal unit 4, the operator closes the screen 40 without restoring the contents of the queue table 11.

  When manufacturing is performed by the semiconductor manufacturing apparatus, the operator or the host computer 6 registers lot information 20 to be processed in the queue table 11. Next, the control unit 10 of the semiconductor manufacturing apparatus 1 monitors the contents of the queue table 11 and executes lot processing using the registered lot information 20 in order. Further, the control unit 10 of the semiconductor manufacturing apparatus 1 writes the current processing state 30 of each lot in the lot information 20 registered in the queue table 11.

  Here, every time the contents of the queue table 11 change, the control unit 10 of the semiconductor manufacturing apparatus 1 stores the contents in the nonvolatile storage area 3. Further, when the queue table 11 becomes empty, the control unit 10 of the semiconductor manufacturing apparatus 1 erases the contents stored in the nonvolatile storage area 3.

  During manufacturing by the semiconductor manufacturing apparatus, the apparatus 1 may be restarted in a state where the lot information 20 is registered in the queue table 11 due to a failure or the like. In this case, the control unit 10 of the semiconductor manufacturing apparatus 1 once erases all the contents of the queue table 11 at startup. However, the control unit 10 of the semiconductor manufacturing apparatus 1 does not change the information stored in the nonvolatile storage area 3. Therefore, after the start of the semiconductor manufacturing apparatus 1 is completed, the control unit 10 of the semiconductor manufacturing apparatus 1 displays the screen 40 on the terminal unit 4. Thereby, the control unit 10 of the semiconductor manufacturing apparatus 1 can present the contents of the queue table 11 stored in the nonvolatile storage area 3 to the operator. The contents of the queue table 11 presented here match the contents of the queue table 11 immediately before the semiconductor manufacturing apparatus 1 is restarted.

  The operator who has confirmed the contents of the screen 40 checks the check box 40-3 of the lot information to be restored and then presses the restore button 40-4. As a result, the selected lot information 20 is restored on the queue table 11 and the lot processing is continued in the semiconductor manufacturing apparatus 1. When the operator does not want to restore the lot information 20, the cancel button 40-5 is pressed on the screen 40. Then, the queue table 11 remains empty, and the apparatus 1 is in a standby state until the lot information 20 is newly registered.

In the above embodiment, the case where the operator performs the restoration operation of the contents of the queue table 11 is shown as an example, but the restoration operation may be executed by the host computer 7. In this case, the contents of the queue table 11 stored in the nonvolatile storage area device 3 are notified to the host computer 7 by the communication mechanism 5 via the communication path 6 after the start-up of the device 1 is completed. Further, the host computer 7 that has received the notification instructs the apparatus 1 which lot information is to be restored.
[Control method of semiconductor manufacturing equipment]
Next, a flow of a method for controlling a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention will be described. First, the control unit 10 stores a queue table 11 for reserving processing conditions and processing orders of a plurality of lots in the volatile storage area 2. Next, the control unit 10 stores the contents of the queue table 11 stored in the volatile storage area 2 in the nonvolatile storage area 3. As a result, the control unit 10 can restore the contents of the queue table stored in the nonvolatile storage area 3 to the display unit 9 of the terminal unit 4 when the semiconductor manufacturing apparatus 1 is started in response to an instruction from the terminal unit 4. it can.

  FIG. 5 is a flowchart showing in more detail the flow of control for restoring the contents of the queue table stored in the nonvolatile storage area.

  In step 50-1, the control unit 10 of the semiconductor manufacturing apparatus 1 is activated.

  In Step 50-2, the control unit 10 determines whether or not the queue table 11 is stored in the nonvolatile storage area 3. If the queue table 11 is stored in the nonvolatile storage area 3 (“YES” in step 50-2), the process proceeds to step 50-3, and if the queue table 11 is not stored in the nonvolatile storage area 3 (step In step 50-2, "NO"), the process proceeds to step 50-7.

  In step 50-3, the control unit 10 displays the contents of the queue table 11 stored in the nonvolatile storage area 3 on the display unit 9 of the terminal unit 4, or is stored in the nonvolatile storage area 3. The contents of the existing queue table 11 are notified to the host computer 7 by the communication unit 5.

  In step 50-4, the control unit 10 receives an instruction from the terminal unit 4 or the host computer 7 to restore the lot information of the queue table 11 stored in the nonvolatile storage area 3 to the volatile storage area 2. It is determined whether or not. If an instruction for restoration is given (“YES” in step 50-4), the process proceeds to step 50-5, and if no instruction for restoration is given (“NO” in step 50-4). ), Go to Step 50-7.

  In step 50-5, the control unit 10 generates the queue table 11 in the volatile storage area 2 in accordance with the lot information of the queue table 11 instructed in step 50-4.

  In step 50-6, the control unit 10 updates the queue table 11 in the nonvolatile storage area 2 according to the lot information in the queue table 11 instructed in step 50-4. The lot information of the queue table 11 that is not instructed in step 50-4 can be deleted from the nonvolatile storage area 2.

  In Step 50-7, the control unit 10 determines whether or not an instruction for updating the lot information in the queue table 11 is given from the terminal unit 4 or the host computer 7. If an instruction for updating is given (“YES” in step 50-7), the process proceeds to step 50-8, and if an instruction for restoration is not given (“NO” in step 50-7). ), Go to Step 50-9.

  In step 50-8, the control unit 10 updates the lot information in the volatile storage area 2 and the nonvolatile storage area 3 in accordance with the update instruction in step 50-7.

  In step 50-9, the control unit 10 determines whether an instruction for shutting down the semiconductor manufacturing apparatus 1 is given from the terminal unit 4 or the host computer 7. If an instruction to shut down is given (“YES” in step 50-9), the process is terminated, and if an instruction to shut down is not given (“NO” in step 50-9), Return to step 50-7.

[Semiconductor device manufacturing process]
Next, a semiconductor device manufacturing process when this semiconductor manufacturing apparatus is used as a semiconductor exposure apparatus will be described. FIG. 6 is a flowchart showing the overall manufacturing process of the semiconductor device. In step 1 (circuit design), a semiconductor device circuit is designed. In step 2 (mask fabrication), a mask is fabricated based on the designed circuit pattern. On the other hand, in step 3 (wafer manufacture), a wafer is manufactured using a material such as silicon. Step 4 (wafer process) is called a pre-process, and an actual circuit is formed on the wafer using the above mask and wafer by lithography using the semiconductor manufacturing apparatus according to the preferred embodiment of the present invention. To do. The next step 5 (assembly) is called a post-process, which is a process for forming a semiconductor chip using the wafer produced in step 5, and is an assembly process (dicing, bonding), packaging process (chip encapsulation), etc. Process. In step 6 (inspection), the semiconductor device manufactured in step 5 undergoes inspections such as an operation confirmation test and a durability test. A semiconductor device is completed through these processes, and is shipped in Step 7.

  The wafer process in step 4 includes the following steps. An oxidation step for oxidizing the surface of the wafer, a CVD step for forming an insulating film on the wafer surface, an electrode formation step for forming electrodes on the wafer by vapor deposition, an ion implantation step for implanting ions on the wafer, and applying a photosensitive agent to the wafer A resist processing step, an exposure step for transferring the circuit pattern to the wafer after the resist processing step by the above exposure apparatus, a development step for developing the wafer exposed in the exposure step, and an etching step for scraping off portions other than the resist image developed in the development step A resist stripping step that removes the resist that has become unnecessary after etching. By repeating these steps, multiple circuit patterns are formed on the wafer.

1 is a block diagram showing a semiconductor manufacturing apparatus according to a preferred embodiment of the present invention. It is a figure which shows an example of the content of the lot information which concerns on suitable embodiment of this invention. It is a figure which shows an example of the transition of the lot state which concerns on suitable embodiment of this invention. It is a figure which shows an example of the queue table decompression | restoration screen which concerns on suitable embodiment of this invention. It is a figure which shows the flow of the control method of the semiconductor manufacturing apparatus which concerns on suitable embodiment of this invention. It is a figure which shows the flow of the whole manufacturing process of a semiconductor device.

Explanation of symbols

1: Semiconductor manufacturing apparatus, 2: Nonvolatile storage area, 3: Nonvolatile storage area, 10: Control unit, 11: Queue table

Claims (10)

A semiconductor manufacturing apparatus that processes lots according to the contents of a queue table for reserving processing conditions and processing order of a plurality of lots,
A volatile storage area for storing the queue table;
A control unit for storing the contents of the queue table stored in the volatile storage area in the nonvolatile storage area;
A semiconductor manufacturing apparatus comprising:   2. The semiconductor manufacturing apparatus according to claim 1, further comprising a terminal unit that gives an instruction to the control unit to restore the contents of the queue table stored in the nonvolatile storage area to the volatile storage area.   The semiconductor manufacturing apparatus according to claim 2, wherein the terminal unit includes a display unit that displays the contents of the queue table stored in the nonvolatile storage area.   In accordance with an instruction from the terminal unit, the control unit causes the display unit of the terminal unit to display the contents of the queue table stored in the nonvolatile storage area when the semiconductor manufacturing apparatus is activated. The semiconductor manufacturing apparatus according to claim 3.   5. The semiconductor manufacturing apparatus according to claim 1, further comprising a communication unit that notifies a host computer of the contents of the queue table stored in the nonvolatile storage area.   The semiconductor manufacturing apparatus according to claim 5, wherein the communication unit is configured to give an instruction to restore the contents of the queue table stored in the nonvolatile storage area to the volatile storage area.   7. The semiconductor device according to claim 6, wherein the communication unit is configured to transmit the contents of a queue table stored in the nonvolatile storage area to the host computer when the semiconductor manufacturing apparatus is activated. Manufacturing equipment.   The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor manufacturing apparatus is a semiconductor exposure apparatus. A method for controlling a semiconductor manufacturing apparatus for processing a lot according to the contents of a queue table for reserving processing conditions and processing order of a plurality of lots,
Storing a queue table for reserving processing conditions and processing order of a plurality of lots in a volatile storage area;
Storing the contents of the queue table stored in the volatile storage area in a nonvolatile storage area;
A method for controlling a semiconductor manufacturing apparatus, comprising: Preparing a substrate on which a latent image pattern is formed using the semiconductor exposure apparatus according to claim 8;
Developing the latent image pattern;
A device manufacturing method comprising:

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