JP2006331469A - Thin film magnetic head equipped with heat generating coil unit, head gimbal assembly equipped with the thin film magnetic head, and magnetic disk drive equipped with the head gimbal assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin film magnetic head having high projection efficiency in the projection of a magnetic head element caused by a heat generation and also capable of evading WATE. <P>SOLUTION: The thin film magnetic head is provided with a read-out magnetic head element including first and second shield layers and a write-in magnetic head element including first and second magnetic pole layers, wherein the second shield layer and the first magnetic pole layer are adjacently located and opposed each other, and at least one heat generating coil unit which has a coil face having a normal in the track width direction while being perpendicular to a floating surface and generates the heat by being energized is arranged between the second shield layer and the second magnetic pole layer. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a thin film magnetic head including a heating coil body, a head gimbal assembly (HGA) including the thin film magnetic head, and a magnetic disk device (HDD) including the HGA.

  In recent years, in order to further improve the surface recording density in the HDD, a perpendicular magnetic recording system different from the conventional in-plane magnetic recording system has been actively developed.

  In the perpendicular magnetic recording system, the demagnetizing field in the magnetization transition region in the magnetic disk surface is much smaller than in the in-plane magnetic recording system, so that the magnetization transition width can be narrowed. Furthermore, since the recording bit is not easily affected by the thermal fluctuation of magnetization, which is a problem in increasing the recording density in the in-plane magnetic recording method, a stable high recording density can be obtained.

  In a thin film magnetic head (perpendicular magnetic head) used for this perpendicular magnetic recording system, a single magnetic pole structure including a main magnetic pole, an auxiliary magnetic pole as a return yoke, and an exciting coil acting on both magnetic poles is mainly employed. In this case, writing is performed on the magnetic disk by a magnetic field generated from the main magnetic pole. The magnetic flux at this time draws a loop that reaches the auxiliary magnetic pole from the main magnetic pole through the recording layer and the soft magnetic underlayer of the magnetic disk.

FIG. 12 shows the distribution of magnetic flux in this single magnetic pole structure. According to the figure, the magnetic flux generated from the main magnetic pole 1202 induced by the write coil 1204 during the write operation returns to the auxiliary magnetic pole layer 1203 as the magnetic flux F _Y via the soft magnetic backing layer 1206 in the magnetic disk. Come on. This magnetic flux F _Y further reaches the upper and lower shields 1201 and 1200 of the MR effect element for reading, and affects these shields as a magnetic flux F _S. As a result, a considerable magnetic field is generated from the ends 1201a and 1200a on the head end face side of the upper and lower shields 1201 and 1200, and an abnormal signal is written to a track located several μm to several tens μm away from the track to be written. In some cases, the recording signal may be erased. In this specification, such an abnormal phenomenon is called wide area track erasure (WATE). As described above, in the perpendicular magnetic head, the magnetic flux distribution in the magnetic head element has a great influence on the quality of writing due to the presence of the soft magnetic backing layer unique to the magnetic disk for perpendicular magnetic recording.

One way to avoid WATE described above, the backing coil 1205 is provided, it is effective to induce a magnetic flux F _B. Indeed, it is possible to cancel or reduce the magnetic flux F _S by the magnetic flux F _B.

  On the other hand, the track width of thin-film magnetic heads tends to decrease as the recording density increases with the recent reduction in capacity and capacity of HDDs. In order to avoid a decrease in writing and reading ability due to the decrease in the track width, for example, in Patent Documents 1 to 4, although a longitudinal magnetic recording method is used, a heating element is provided in the vicinity of the magnetic head element or in the magnetic head element. Technology is disclosed. In these technologies, the end of the magnetic head element protrudes in the direction of the magnetic disk by thermal expansion due to heat from the heating element, and the magnetic effective distance (magnetic spacing) between the magnetic head element and the magnetic disk surface is increased. It is set to an extremely small value and controlled. Thereby, it is possible to avoid a decrease in writing and reading ability.

US Pat. No. 5,991,113 JP 2003-272335 A JP 2003-168274 A Japanese Patent Laid-Open No. 05-020635

  However, when the heating element as described above is employed in the perpendicular magnetic head, there is a problem that WAIT cannot be avoided if the protrusion efficiency due to heat generation of the magnetic head element is increased.

  For example, when trying to project a perpendicular magnetic head element using the techniques described in Patent Documents 1 to 3, since the heating element is provided not in the head element but in the vicinity of the element, the efficiency of protrusion due to heat generation is increased. Is not good. Therefore, even if an attempt is made to project the magnetic head element prior to the start of writing and reading, the projecting of a sufficient and appropriate size cannot be caused in a timely manner.

  Although the protrusion efficiency is improved by making the heating element small, depending on the structure, the reliability of the heating element tends to decrease due to the temperature rise of the heating element itself, and it is difficult to deal with mere miniaturization. .

  On the other hand, in the technique disclosed in Patent Document 4, since the thin film resistor is formed between the upper and lower magnetic poles like the thin film coil, the protrusion efficiency due to the heat generation of the thin film resistor is the same as the protrusion efficiency due to the heat generation of the thin film coil. It can be set as high as possible.

  However, including this technique, when the heating element is installed in the perpendicular magnetic head element, magnetic flux is induced in the magnetic layer such as the shield and the magnetic pole in the perpendicular magnetic head element by energizing the heating element, and the above-described WAIT. May occur. That is, as described above, the write characteristic of the perpendicular magnetic head element is very sensitive to the magnetic flux distribution in the element. Therefore, if a means for generating a magnetic field is installed in the element, this write characteristic can be adversely affected. At this time, a method of coping with the magnetic flux induction capability of the backing coil can be considered. However, since the gradient of the write magnetic field by the main magnetic pole is greatly reduced, there is a limit to this coping.

  Accordingly, an object of the present invention is to provide a thin film magnetic head that has a high protrusion efficiency in the protrusion of a magnetic head element due to heat generation and that can avoid WAIT, an HGA including the thin film magnetic head, and an HDD including the HGA. There is to do.

  Still another object of the present invention is to provide a thin film magnetic head in which the reliability of the heat generating means for projecting the magnetic head element is improved, an HGA equipped with the thin film magnetic head, and an HDD equipped with the HGA.

  Before describing the present invention, terms used in the specification will be defined. In the laminated structure of the magnetic head elements formed on the element formation surface of the substrate, it is assumed that the component on the element formation surface side of the reference layer is “down” or “downward” and viewed from the reference layer. It is assumed that the component on the side opposite to the element formation surface is “upper” or “upper”. For example, “there is a shield layer on the insulating layer” means that there is a shield layer on the side opposite to the element formation surface of the insulating layer.

  Further, when comparing the positions of two components in one laminated structure, the closer to the element formation surface is defined as “lower”, and the farther is defined as “upper”. For example, of the two magnetic pole layers provided in the electromagnetic coil element, the “lower magnetic pole layer” means the one closer to the element formation surface. Further, “being directly above” means that within the “upper” region, the region is in a region formed of a position where a perpendicular can be drawn with respect to the reference layer or the surface of the layer.

  According to the present invention, a read magnetic head element including a first shield layer and a second shield layer, and a write magnetic head element including a first magnetic pole layer and a second magnetic pole layer are provided. A thin film magnetic head in which a shield layer and a first magnetic pole layer are adjacent to each other and are opposed to each other, and has an air bearing surface (ABS) between the second shield layer and the second magnetic pole layer. A thin film magnetic head having a coil surface that is perpendicular to each other and whose normal line is in the track width direction and provided with at least one heating coil body that generates heat when energized is provided.

  The coil surface of the heating coil body is perpendicular to the ABS (and therefore perpendicular to the head end surface on the ABS side), and the normal line is in the track width direction. Therefore, the magnetic field generated from the heating coil body is substantially composed of components in the track width direction, and does not have ABS, that is, a component perpendicular to the head end surface. Thereby, even if this heat generating coil body is energized, it does not participate in formation of the magnetic flux loop through the shield layer in the magnetic head element. As a result, WAIT is avoided during writing.

  In addition, the heating coil body is located between the second shield layer and the second magnetic pole layer. That is, the magnetic head element is disposed in the vicinity of the read magnetic head element and the write magnetic head element or in the write magnetic head element. Therefore, the protrusion efficiency due to heat generation is very high. Thus, according to the thin film magnetic head of the present invention, the protrusion efficiency of the protrusion of the magnetic head element due to heat generation is high, and WATE is avoided.

  Preferably, the first magnetic pole layer is a main magnetic pole layer, the second magnetic pole layer is an auxiliary magnetic pole layer, and the write magnetic head element is for perpendicular magnetic recording. Actually, the problem that the magnetic flux forms a loop through the shield layer and causes WAIT at the time of write operation needs to be solved particularly in the perpendicular magnetic recording system. Here, providing the heat generating coil body according to the present invention in the perpendicular magnetic head is a very effective WAIT measure.

  At least one heating coil body is formed from a set of at least one coil portion having a coil surface and a lead conductor layer extending opposite to each other and carrying a current in the opposite direction. It is preferable that the lead conductor portion is provided. Here, it is also preferable that the at least one coil portion is two layers made of an electric resistance material or a conductive material, one end of which is connected to each other to form a half-turn coil. Moreover, it is preferable that the lead conductor portion is led out to the outside of the region directly above the second shield layer.

  When the coil part is formed of such two layers, the area of the coil surface is on the order of the layer cross section of these layers and is very small. Moreover, the coil part only forms the half turn as a coil. Therefore, the magnetic field generated from the coil portion is reduced, and can be suppressed to such an extent that the magnetic flux flow in the magnetic head element is not greatly affected.

  Furthermore, as described above, the heating coil body according to the present invention has a very high protrusion efficiency due to heat generation. Thereby, a very large energization amount is not required to obtain a predetermined protrusion amount. Therefore, even if the coil portion has a structure that is relatively simple and can be miniaturized by such two layers, the current density does not need to be excessively increased. As a result, while maintaining the reliability as a heating element, this miniaturization can further contribute to the improvement of the protrusion efficiency.

  In addition, the first and second lead conductor layers facing each other have opposite directions of current due to energization, so that the generated magnetic field cancels out at a predetermined distance and becomes very weak. . As a result, the magnetic field from these lead conductor layers is avoided from participating in the generation of WAIT. Further, since the lead conductor portion in which the generation of the magnetic field is thus suppressed is drawn out to the outside of the region directly above the second shield layer, the lead conductor portion is generated in the magnetic head element during energization of the coil portion. It is avoided that the magnetic field participates in the generation of WAIT.

  Furthermore, it is preferable that at least one coil part is installed at a position closer to the head end surface on the ABS side than the lead conductor part. By arranging the coil portion that generates heat by energization closer to the ABS, the protrusion efficiency due to heat generation is further improved.

  It is preferable that at least one heating coil body is disposed between the second shield layer and the first magnetic pole layer. In addition, it is also preferable to be installed between the first and second magnetic pole layers. When installed between the first and second magnetic pole layers, the response of the magnetic coil element due to heat becomes as fast as the response of the protrusion phenomenon due to heat from the write coil, which has been a problem in the past. It is also possible to solve the initial shortage of write characteristics.

  According to the present invention, there is also provided at least one thin-film magnetic head as described above, a lead wire for supplying current to at least one heating coil body, a read magnetic head element, and a write magnetic head element. An HGA further provided with a signal line and a support mechanism for supporting the thin film magnetic head is provided.

  Further, according to the present invention, at least one HGA described above is provided, at least one magnetic disk, a heat generation control circuit for controlling a current supplied to at least one heat generating coil body, and reading and writing. An HDD further provided with a recording / reproducing circuit for controlling the operation is provided.

  Here, it is preferable to include a CPU that controls the heat generation control circuit and the recording / reproduction circuit and drives the heat generation control circuit in synchronization with the read and / or write operations. By using such a CPU, more various energization modes for the heating elements can be implemented.

  According to the present invention, the protrusion efficiency of the magnetic head element due to heat generation is high, and WAIT can be avoided. Further, it is possible to improve the reliability of the heating coil body that is a heating means for projecting the magnetic head element.

  EMBODIMENT OF THE INVENTION Below, the form for implementing this invention is demonstrated in detail, referring an accompanying drawing. In the drawings, the same elements are denoted by the same reference numerals. In addition, the dimensional ratios in the components in the drawings and between the components are arbitrary for easy viewing of the drawings.

  FIG. 1 is a perspective view schematically showing a configuration of a main part in an embodiment of an HDD according to the present invention, and FIG. 2 is a perspective view showing an embodiment of an HGA according to the present invention. 3A is a perspective view showing a thin film magnetic head (slider) attached to the tip of the HGA in the embodiment of FIG. 2, and FIG. 3B is a perspective view of FIG. 1 is a plan view schematically showing an embodiment of a magnetic head element.

  In FIG. 1, 10 is a plurality of magnetic disks rotating around the rotation axis of the spindle motor 11, 12 is an assembly carriage device for positioning a thin film magnetic head (slider) 21 on a track, and 13 is this thin film. A recording / reproducing and heat generation control circuit for controlling writing and reading operations of the magnetic head and for controlling a current applied to a heating coil body to be described later are shown.

  The assembly carriage device 12 is provided with a plurality of drive arms 14. These drive arms 14 can be angularly swung about a pivot bearing shaft 16 by a voice coil motor (VCM) 15 and are stacked in a direction along the shaft 16. An HGA 17 is attached to the tip of each drive arm 14. Each HGA 17 is provided with a thin film magnetic head (slider) 21 so as to face the surface of each magnetic disk 10. A single magnetic disk 10, drive arm 14, HGA 17, and slider 21 may be provided.

  As shown in FIG. 2, the HGA 17 is configured by fixing a slider 21 having a magnetic head element to the tip of a suspension 20 and electrically connecting one end of a wiring member 25 to a terminal electrode of the slider 21. The

  The suspension 20 includes a load beam 22, a flexure 23 having elasticity fixedly supported on the load beam 22, a base plate 24 provided at the base of the load beam 22, and a lead conductor provided on the flexure 23. And a wiring member 25 composed of connection pads electrically connected to both ends thereof. Although not shown, a head driving IC chip may be mounted in the middle of the suspension 20.

  As shown in FIG. 3A, the thin film magnetic head (slider) 21 includes an ABS 30 processed so as to obtain an appropriate flying height, a magnetic head element 32 formed on the element formation surface 31, and an element formation. Four signal terminal electrodes 36 and two drive terminal electrodes 37 exposed from the layer surface of the covering layer 46 formed on the surface 31 are provided. Here, the magnetic head element 32 includes an MR effect element 33 for reading, an electromagnetic coil element 34 for writing, and a heating coil body 35 for projecting the magnetic head element 32 in the magnetic disk direction by thermal expansion. . Here, the four signal terminal electrodes 36 are connected to the MR effect element 33 and the electromagnetic coil element 34, and the two drive terminal electrodes 37 are connected to the heating coil body 35.

  The two drive terminal electrodes 37 are arranged on both sides of the group of four signal terminal electrodes 36, respectively. This is an arrangement capable of preventing crosstalk between the wiring of the MR effect element 33 and the wiring of the electromagnetic coil element 34 as described in JP-A-2004-234792. However, when crosstalk is allowed, the two drive terminal electrodes 37 may be disposed at a position between any of the four signal terminal electrodes 36, for example. In addition, the number of these terminal electrodes is not limited to the form of FIG. In FIG. 3, the number of terminal electrodes is six. However, for example, the number of electrodes may be five and the ground may be grounded to the slider substrate.

  In the MR effect element 33 and the electromagnetic coil element 34, as shown in FIG. 3B, one end of the element reaches the head end surface 300 on the ABS 30 side. When these ends face the magnetic disk, reading by sensing the signal magnetic field and writing by applying the signal magnetic field are performed. Further, the heating coil body 35 is bent in an L shape within the magnetic head element 32 and includes a coil portion 350 at the end of the bent portion. The end 350 a of the coil portion reaches the vicinity of the head end surface 300. The coil surface of the coil portion 350 is perpendicular to the head end surface 300, and its normal 38 is in the track width direction. The coil portion 350 is arranged with the coil surface aligned with the center line so that the magnetic head element 32 protrudes symmetrically about the center line (corresponding to the AA line in the figure). .

  With the configuration described above, the heating coil body 35 has a structure in which, as will be described later, the protrusion efficiency of the magnetic head element due to heat generation is increased and no magnetic adverse effect such as causing WAIT is exerted.

  4 is a cross-sectional view taken along line AA of FIG. 3B, showing the configuration of the perpendicular magnetic head element 32 as an embodiment of the magnetic head element of FIG. Note that the number of turns of the write coil layer in FIG. 4 is shown to be smaller than the number of turns in FIG. 3B in order to simplify the drawing. Each write coil layer may be one layer, two layers or more, or a helical coil.

  In FIG. 4, reference numeral 210 denotes a slider substrate, which has an ABS 30 facing the surface of the magnetic disk, and floats with a predetermined flying height hydrodynamically on the surface of the rotating magnetic disk during a write or read operation. An MR effect element 33 for reading, a heating coil body 35, a backing coil section 42, and an electromagnetic coil element for writing are formed on an element forming surface 31 which is one side surface when the ABS 30 of the slider substrate 210 is the bottom surface. 34 and a covering layer 46 for protecting these elements are mainly formed.

  The MR effect element 33 includes an MR multilayer 332, and a lower shield layer 330 and an upper shield layer 334 disposed at positions sandwiching the multilayer. The MR multilayer 332 is composed of an in-plane energization type (CIP (Current In Plain)) giant magnetoresistance (GMR (Giant Magneto Resistive)) multilayer film, a vertical energization type (CPP (Current Perpendicular to Plain)) GMR multilayer film, or a tunnel. It has a magnetoresistive (TMR (Tunnel Magneto Resistive)) multilayer film and senses a signal magnetic field from a magnetic disk with very high sensitivity. The upper and lower shield layers 334 and 330 prevent the MR multilayer 332 from receiving an external magnetic field that causes noise.

  When the MR multilayer 332 includes a CIP-GMR multilayer film, upper and lower shield gap layers 333 and 331 for insulation are provided between the upper and lower shield layers 334 and 330 and the MR multilayer 332, respectively. Further, an MR lead conductor layer 335 for supplying a sense current to the MR multilayer 332 and taking out a reproduction output is formed. On the other hand, when the MR multilayer 332 includes a CPP-GMR multilayer film or a TMR multilayer film, the upper and lower shield layers 334 and 330 also function as upper and lower electrodes, respectively. In this case, the upper and lower shield gap layers 333 and 331 and the MR lead conductor layer 335 are unnecessary and are omitted. However, insulating layers are formed on the shield layer opposite to the head end surface 300 of the MR multilayer 332 and on both sides of the MR multilayer 332 in the track width direction.

  The electromagnetic coil element 34 is for perpendicular magnetic recording in this embodiment, and includes a main magnetic pole layer 340, an auxiliary magnetic pole layer 345, and a writing coil layer 343. The main magnetic pole layer 340 is a magnetic path for guiding the magnetic flux induced by the writing coil layer 343 while converging it to the perpendicular magnetic recording layer of the magnetic disk on which writing is performed, and the main magnetic pole main layer 3400 and the main magnetic pole auxiliary layer. 3401. Here, the length (thickness) in the layer thickness direction of the end portion 340a on the head end surface 300 side of the main magnetic pole layer 340 corresponds to the thickness of the main magnetic pole main layer 3400 alone and is small. As a result, a fine write magnetic field corresponding to higher recording density can be generated.

  The end portion of the auxiliary magnetic pole layer 345 on the head end surface 300 side is a trailing shield portion 3450 having a wider layer cross section than the other portion of the auxiliary magnetic pole layer 345. By providing the trailing shield part 3450, the magnetic field gradient becomes steeper between the end part 3450a of the trailing shield part 3450 and the end part 340a of the main magnetic pole layer 340. As a result, the jitter of the signal output is reduced, and the error rate at the time of reading can be reduced.

  The backing coil section 42 is formed of a backing coil layer 420 and a backing coil insulating layer 421, and generates a magnetic flux that cancels the magnetic flux loop generated from the electromagnetic coil element 34 and passes through the MR effect element 32, thereby suppressing WAIT. I am trying. Note that the magnetic flux from the backing coil section 42 also acts in the direction of weakening the gradient of the write magnetic field. Therefore, in order to limit this action within an allowable range, the number of turns of the backing coil layer 420 is preferably set to be equal to or less than the number of turns of the write coil layer 343.

  The heat generating coil body 35 is formed on the backing coil portion 42 with the insulating layer 43 interposed therebetween, so that the coil portion 350 including the first heat generating layer 3500 and the second heat generating layer 3501 and the coil portion 350 are energized. The lead conductor portion 351 includes the first lead conductor layer 3510 and the second lead conductor layer 3511. Here, the first and second heat generating layers 3500 and 3501 are electrically connected to each other in the vicinity of the end 350a.

  Further, as described above, the end 350 a reaches the vicinity of the head end surface 300. Further, the coil surface 47 (surface shown by shading) of the coil portion 350 is perpendicular to the head end surface 300, and its normal line is in the track width direction (direction perpendicular to the paper surface of the drawing). In addition, the area is equivalent to the layer cross section and is very small, and the coil part 350 only forms a half turn as a coil. Therefore, the magnetic field generated from the coil portion 350 is substantially composed of a component in the track width direction, does not have a component perpendicular to the head end surface 300, and has a small strength. Furthermore, the first and second lead conductor layers 3510 and 3511 are opposite in current direction due to energization, so that the generated magnetic field cancels out at a predetermined distance and becomes very weak.

  Since the heating coil body 35 has such a structure, as described later, the protrusion efficiency of the magnetic head element due to heat generation is increased, and magnetic adverse effects such as causing WAIT are avoided.

  Furthermore, each heat generating layer generates heat by the current flowing through the first and second heat generating layers 3500 and 3501 of the coil portion 350. Due to this amount of heat, a layer made of an insulating material surrounding the heating coil body 35 expands itself to push out the MR effect element 33 and the electromagnetic coil element 34, and the ends on the head end face 300 side of these elements protrude in the magnetic disk direction. It is done. Note that the ends of these elements also protrude due to the thermal expansion of the elements themselves. By this protrusion, the distance between these elements and the magnetic disk is controlled to a small value, and the writing and reading ability is improved.

  Here, since the heating coil body 35 is disposed in the vicinity of the MR effect element 33 and the electromagnetic coil element 34 and in the vicinity of the head end surface 300, the protrusion efficiency due to heat generation is very high. Thereby, a very large energization amount is not required to obtain a predetermined protrusion amount. Therefore, the heating coil body 35 can be formed relatively small without excessively increasing the current density. As a result, while maintaining the reliability as a heating element, this miniaturization can further contribute to the improvement of the protrusion efficiency.

  Next, the configuration of the magnetic head element 32 shown in FIG. 4 will be described in more detail with reference to FIG.

First, a first insulating layer 40 made of Al ₂ O ₃ or the like and having a thickness of about 0.05 to 10 μm is formed on a slider substrate 210 made of AlTiC (Al ₂ O ₃ —TiC) or the like. ing. Next, a lower shield layer 330 having a thickness of about 0.3 to 3 μm made of, for example, NiFe, NiFeCo, CoFe, FeN, FeZrN or the like is formed on the first insulating layer 40, and an MR multilayer 332 is further formed. Yes. For example, when the MR multilayer 332 includes a TMR multilayer film, the MR multilayer 332 includes a stacked structure in which a magnetization fixed layer, a tunnel barrier layer, and a magnetization free layer are sequentially stacked.

Further, an upper shield layer 334 made of, for example, NiFe, NiFeCo, CoFe, FeN, or FeZrN and having a thickness of about 0.3 to 4 μm is formed so as to sandwich the MR multilayer 332 with the lower shield layer 330. . Further, on the upper shield layer 334, a second insulating layer 41 made of, for example, Al ₂ O ₃ or the like and having a thickness of about 0.1 to 2.0 μm is formed.

On the second insulating layer 41, a backing coil layer 420 made of Cu or the like and having a thickness of about 0.5 to 3 μm is formed. Further, for example, the backing coil layer 420 is thermally cured so as to cover the backing coil layer 420. A backing coil insulating layer 421 having a thickness of about 0.1 to 5 μm and formed of a resist layer or the like is formed. Further, a third insulating layer 43 made of Al ₂ O ₃ or the like and having a thickness of about 0.1 to 2.0 μm is formed so as to cover the backing coil insulating layer 421.

  The heating coil body 35 covers the first heating layer 3500 and the first lead conductor layer 3510 formed on the second insulating layer 41, and the first heating layer 3500 and the first lead conductor layer 3510. The second heat generating layer 3501 and the second lead conductor layer 3511 formed on the fourth insulating layer 44 are provided. These components of the heat generating coil body 35 and the modification thereof will be described in detail later.

A fifth insulating layer 45 made of, for example, Al ₂ O ₃ or the like and having a thickness of about 0.1 to 2.0 μm is formed so as to cover the heat generating coil body 35. Further, on the fifth insulating layer 45, for example, a thickness of 0 made of an alloy made of any two or three of Ni, Fe and Co, or an alloy to which a predetermined element is added with these as a main component, etc. Main magnetic pole main layer 3400 having a thickness of about 0.01 to 0.5 μm and an alloy composed of any two or three of Ni, Fe and Co, or an alloy to which a predetermined element is added as a main component. A main magnetic pole auxiliary layer 3401 having a thickness of about 0.5 to 3 μm is formed.

A gap layer 341 made of, for example, Al ₂ O ₃ or DLC and having a thickness of about 0.01 to 0.5 μm is formed on the main magnetic pole auxiliary layer 3401. Further, on the gap layer 341, for example, thermosetting is performed. A first write coil insulating layer 3440 having a thickness of about 0.1 to 5 μm made of a resist layer or the like is formed. On the first write coil insulating layer 3440, for example, a write coil layer 343 made of Cu or the like and having a thickness of about 0.5 to 3 μm is formed. Further, for example, a heat coil layer 343 is formed so as to cover the write coil layer 343. A second write coil insulating layer 3441 having a thickness of approximately 0.1 to 5 μm and formed of a cured resist layer or the like is formed.

Further, for example, an alloy composed of any two or three of Ni, Fe and Co, or an alloy to which a predetermined element is added as a main component so as to cover the second write coil insulating layer 3441. An auxiliary magnetic pole layer 345 having a thickness of about 0.5 to 5 μm is formed. Furthermore, a coating layer 46 made of, for example, Al ₂ O ₃ is formed so as to cover the MR effect element 33, the heating coil body 35, the electromagnetic coil element 34, and the like.

  It is obvious that the magnetic head element according to the present invention is not limited to the embodiment described above. For example, the electromagnetic coil element for writing may be based on the longitudinal magnetic recording method. Even in the longitudinal magnetic recording system, it is not as important as in the perpendicular magnetic recording system, but unnecessary writing and erasing to adjacent tracks should be avoided, and other than the magnetic flux path between the magnetic pole layers in the magnetic head element. It is preferable to suppress the flow of magnetic flux having a path as much as possible. Further, even if the backing coil portion is not provided in the magnetic head element, it is within the scope of the present invention. Actually, the backing coil section generates a magnetic flux in a direction that weakens the gradient of the write magnetic field. Therefore, it is desirable to omit it when the flow of the magnetic flux is below the generation limit of the WAIT.

  FIG. 5 is a cross-sectional view of the magnetic head element 32 for explaining the operational effects of the heating coil body 35 in the embodiment of FIG.

According to FIG. 5A, the magnetic flux generated from the main magnetic pole layer 340 induced by energizing the write coil layer 343 during the write operation causes the auxiliary magnetic pole layer to pass through the soft magnetic backing layer 100 in the magnetic disk. come back as the magnetic flux _{F Y} to 345. The magnetic flux F _Y further passes through the upper and lower shield layers 334 and 330 of the MR effect element 33 as the magnetic flux F _S and reaches the soft magnetic backing layer 100 in the magnetic disk 10. At this time, the flow of the magnetic flux _{F S} causes a WATE by generating unnecessary magnetic fields on the end 330a and 334a. The As a countermeasure against WATE, the backing coil portion 42 is provided, thereby canceling or reducing the magnetic flux F _S by generating a magnetic flux F _B.

Here, the heat generating coil body 35 according to the present invention is provided at a position between the upper shield layer 334 and the main magnetic pole layer 340 according to FIG. This position is in the loop formed by the magnetic fluxes F _S and F _B. Therefore, for example, when a conventional heating element is installed at such a position and energized, the balance between the magnetic fluxes F _S and F _B described above is lost due to the generated magnetic flux, which may cause WAIT. However, as described above, the magnetic field generated from the coil portion 350 of the heating coil body 35 according to the present invention has a component substantially in the track width direction (direction perpendicular to the paper surface of the drawing) and a component perpendicular to the head end surface 300. Besides, its strength is small. As a result, since even by energizing the heating coil 35, is hardly disturbing the balance between the magnetic flux F _S and F _B, you can avoid the occurrence of WATE.

  Even when the flow of magnetic flux is less than or equal to the generation limit of WATE and the backing coil portion 42 is not provided in the magnetic head element 32, the heat generating coil body 35 according to the present invention causes a problem of WATE generation. It becomes possible to install without. That is, according to the heating coil body 35, there is no possibility that the WAIT generation limit will be exceeded due to the flow of magnetic flux.

  Further, the heating coil body 35 is located at a position substantially adjacent to the MR effect element 33 and the electromagnetic coil element 34, and the end 350 a of the heating coil body 35 reaches the vicinity of the head end surface 300. Therefore, the protrusion efficiency of the magnetic head element 32 due to heat generation can be sufficiently increased while avoiding adverse magnetic effects such as causing WAIT.

  In addition, although the heat generating coil body 35 of this embodiment is installed in the position P1 in FIG.5 (B), it is not limited to this position. For example, it may be at a position P2 between the upper shield layer 334 and the backing coil portion 42, or may be at a position P3 between the main magnetic pole layer 340 and the auxiliary magnetic pole layer 345. At any position, high protrusion efficiency can be realized while avoiding WATE. In particular, when installed at the position P3, the response of the magnetic coil element 34 due to the heat becomes as fast as the response of the protrusion phenomenon due to the heat from the write coil layer, which is a problem in the initial stage of writing, which has been a problem in the past. It is also possible to solve the shortage of writing characteristics.

  Furthermore, a plurality of heating coil bodies may be arranged at any of the above-described positions or at each position. Here, for example, when two heating coil bodies are installed at any position, it is preferable that the coil portion of each heating coil body be installed at a symmetrical position with respect to the center line of the magnetic head element. As a result, the center of the heat distribution for the protrusion can be aligned with the center line, so that an effective protrusion of the magnetic head element can be realized.

  6 and 7 are plan views schematically showing configurations of various modifications of the heating coil body according to the present invention. In any of the modifications, the heating coil body is formed between the upper shield layer and the main magnetic pole layer (or the backing coil portion). The electromagnetic coil element is omitted.

  According to FIG. 6 (A), the heat generating coil body 35 'has a coil portion 350' composed of a heat generating layer 3500 'and a coil conductor layer 3501' made of a conductive material, and a current for energizing the coil portion 350 '. And a lead conductor portion 351 ′ composed of first and second lead conductor layers 3510 ′ and 3511 ′. Here, the end 350 a ′ of the coil portion 350 ′ reaches the vicinity of the head end surface 300. Further, the first and second lead conductor layers 3510 'and 3511' extend opposite to each other. Further, the lead conductor portion 351 ′ is drawn to the outside of the region directly above the upper shield layer 334 across the end side 334 a perpendicular to the head end surface 300 of the upper shield layer 334.

  That is, the heating coil body 35 ′ has a configuration in which the second heating layer 3501 is replaced with a coil conductor layer 3501 ′ in the heating coil body 35 of FIG. Therefore, although there are few heat_generation | fever layer parts, there exists an effect similar to the heat_generation | fever coil body 35. FIG. Note that the coil conductor layer 3501 ′ and the second lead conductor layer 3511 ′ may be collectively formed by patterning one conductor layer in the manufacturing process. Further, in the heat generating coil body 35 of FIG. 4, the first heat generating layer may be replaced with a coil conductor layer.

  According to FIG. 6B, the heating coil body 35 ″ is formed by using the first and second lead conductor layers 3510 ″ and 3511 ″ and the third lead conductor layer 3512 ″. A plurality of coil portions 350 ′ of (A) are connected in series. According to such a configuration, by selecting a longer value as the overall length of the heat generating layer portion to be energized, it is possible to set the element resistance value as the heat generating coil body to a desired and sufficient size.

  According to FIG. 6C, the heating coil body 35 ″ ″ is a coil composed of a U-shaped heating layer 3500 ″ ″ and a coil conductor layer 3501 ″ ″ made of a U-shaped conductive material. Part 350 ″ ″ and a lead conductor part 351 ″ ″ composed of first and second lead conductor layers 3510 ″ ″ and 3511 ″ ″ for energizing the coil part 350 ″ ″. ing. Here, since the coil portion 350 ″ ″ is U-shaped, the heat generation layer portion per coil portion can be made longer than the coil portion 350 ′ in FIG. The element resistance value can be set to a desired sufficient value.

  In addition, the coil portion 350 ″ ″ is installed with the back portion of the U shape (the side opposite to the side where the U shape is opened) facing the head end surface 300, and is present near the end 350 a ″ ″. The coil surface to be performed is perpendicular to the head end surface 300. Thereby, in the vicinity of the head end surface 300, consideration is given so that a magnetic field component perpendicular to the head end surface is not generated as much as possible. Further, the lead conductor portion 351 ″ ″ crosses the end side 334a perpendicular to the head end surface 300 of the upper shield layer 334 outside the region directly above the upper shield layer 334, similarly to the lead conductor layer 351 ′ of FIG. Has been pulled out.

  Note that the coil conductor layer 3501 ″ ″ and the second lead conductor layer 3511 ″ ″ may be collectively formed by patterning one conductor layer in the manufacturing process. Further, a heat generating layer made of a heat generating material may be provided instead of the coil conductor layer 3501 ″ ″.

  According to FIG. 6D, the heating coil body 35 ′ ″ ″ has a configuration in which a plurality of coil portions 350 ′ ″ of FIG. 6C are connected in series. According to such a configuration, by selecting a longer value as the overall length of the heat generating layer portion to be energized, it is possible to set the element resistance value as the heat generating coil body to a desired and sufficient size.

  According to FIG. 7A, the lead conductor portion 70 is drawn to the outside of the region directly above the upper shield layer 334 across the end side 334b of the upper shield layer 334 opposite to the head end surface 300. Even in such an embodiment, the first and second lead conductor layers 700 and 701 are drawn out while extending opposite to each other, and do not leak a large magnetic field to the outside, so that they do not participate in the generation of WAIT. There is an effect. As shown in FIG. 7B, the lead conductor layers 700 ′ and 701 ′ of the lead conductor portion 70 ′ are drawn from the end sides 334a and 334c perpendicular to the head end surface 300 of the upper shield layer 334, respectively. However, the direction of the magnetic field generated from the coil portion is limited to prevent WATE, and thus falls within the scope of the present invention.

  6A to 6D and FIGS. 7A and 7B, the heating coil body is formed on the upper shield layer. For example, this heating coil A backing coil portion may be provided between the body and the upper shield layer. Further, the heating coil body may be formed between the main magnetic pole layer and the auxiliary magnetic pole layer. In this case, it is preferable that the lead conductor portion is drawn out from the electromagnetic coil element while the first and second lead conductor layers face each other. Thereby, not only the prevention of WAIT but also the adverse effect on the write magnetic field itself can be avoided.

  8 and 9 are perspective views for explaining specific laminated structures of the various heat generating coil bodies shown in FIG. Hereinafter, the laminated structure of the heating coil body shown in FIG. 6A is HC1, the laminated structure shown in FIG. 6C is HC2, and the laminated structure shown in FIG. 6B is HC3.

FIG. 8A specifically shows the stacked structure HC1. According to the figure, the coil conductor layer 3501 'is laminated on the heat generating layer 3500' via an insulating layer, and is electrically connected in the vicinity of the end 350a '. The first lead conductor layer 3510 ′ is stacked so as to ride on the end opposite to the end 350 ′ of the heat generating layer 3500 ′ and is electrically connected to the heat generating layer 3500 ′. The second lead conductor layer 3511 ′ is formed as a pattern integral with the coil conductor layer 3501 ′. Here, the width in the track width direction in the vicinity of 350a ′ of the coil portion 350 ′ is about 2 to about 15 μm. The first and second lead conductor layers 3510 ′ and 3511 ′ have a width of about 5 to about 15 μm, and are about 40 to about 80 μm and about 30 to about 70 μm from the head end surface 300, respectively. It is far apart. The distance _{D HC} from the head end surface of the connecting portion near the end 350a' of the coil portion 350 'is on the order of about 2 to about 10 [mu] m.

FIG. 8B specifically shows the stacked structure HC2. According to the figure, a U-shaped coil conductor layer 3501 '''' is laminated on an U-shaped heat generating layer 3500 '''' via an insulating layer, and is electrically connected in the vicinity of the end 350a ''. It is connected to the. The first lead conductor layer 3510 ″ ″ is stacked on the end of the heat generating layer 3500 ″ ″ opposite to the end 350 a ″ ″, and is electrically connected to the heat generating layer 3500 ″ ″. Has been. The second lead conductor layer 3511 ″ ″ is formed as an integral pattern with the coil conductor layer 3501 ″ ″. Here, both the first and second lead conductor layers 3510 ″ ″ have a width of about 5 to about 15 μm and are separated from the head end surface 300 by about 15 μm or more. Further, the heat generating layer 3500 ″ ″ and the coil conductor layer 3501 ″ ″ have a width of about 2 to about 10 μm. Further, the heat generating layer 3500 ″ ″ and the coil conductor layer 3501 ″ ″ have a width. The width W _{HC ″ ″ of the} character part is about 2 to about 15 μm. Furthermore, the distance D _{HC ″ ″} from the head end surface of the coil portion 350 ″ ″ is about 2 to about 10 μm.

  FIG. 9A specifically shows the stacked structure HC3. According to the figure, the coil conductor layer 3501 '' is laminated on the heat generating layer 3500 '' via the insulating layer, and is electrically connected in the vicinity of the end 350a ''. The second lead conductor layer 3511 ″ is formed as an integral pattern with the coil conductor layer 3501 ″. The third lead conductor layer 3512 ″ is stacked on the end of the heat generating layer 3500 ″ opposite to the end 350a ″ and connects adjacent coil portions in series. Here, the width of the coil portion 350 ″ in the track width direction is about 2 to about 15 μm.

As shown in FIG. 9B, in the stacked structure HC3, a part of the second and third lead conductor layers 3511 ″ and 3512 ″ may overlap each other with an insulating layer interposed therebetween. . In this overlapped portion, the current directions of the layers are opposite, so that the magnetic fields generated from the layers cancel each other and hardly leak to the outside. Here, the length L _{HC ″} of the heat generation portion of the heat generation layer is about 5 to about 15 μm, and the distance D _{HC ″} from the head end surface in the connection portion near the end 350 a ″ is about 2 to about It is about 10 μm. Furthermore, as shown in FIG. 9C, a heat generating layer 90 may be provided instead of the coil conductor layer 3501 ''.

  Hereinafter, the composition of each layer forming the laminated structure described above will be described.

  8A and 8B and FIGS. 9A to 9C have a thickness of about 0.05 to about 0.2 μm, for example, and include NiCu, for example. Made of material. Here, the content ratio of Ni in NiCu is, for example, about 15 to about 60 atomic%, and preferably 25 to 45 atomic%. Further, the additive for NiCu contains at least one element of Ta, Al, Mn, Cr, Fe, Mo, Co, Rh, Si, Ir, Pt, Ti, Nb, Zr and Hf. Also good. The content of these additives is preferably 5 atomic% or less.

  8A and 8B and FIGS. 9A to 9C have a thickness of, for example, about 0.05 to about 0.2 μm and contain NiCr. It may consist of materials. In this case, the content ratio of Ni in NiCr is, for example, about 55 to about 90 atomic%, and preferably 70 to 85 atomic%. Further, the additive for NiCr contains at least one element of Ta, Al, Mn, Cu, Fe, Mo, Co, Rh, Si, Ir, Pt, Ti, Nb, Zr and Hf. Also good. The content of these additives is preferably 5 atomic% or less.

  Further, the heat generating layer in FIGS. 8A and 8B and FIGS. 9A to 9C has a thickness of about 0.05 to about 0.2 μm, for example, Ta alone or It may be made of a material containing Ta. Here, as an additive to Ta, at least one element of Al, Mn, Cu, Fe, Mo, Co, Rh, Si, Ir, Pt, Ti, Nb, Zr, and Hf may be included. . The content of these additives is preferably 5 atomic% or less.

  Further, the lead conductor layer and the coil conductor layer in FIGS. 8A and 8B and FIGS. 9A to 9C are made of, for example, one of Au, Au alloy, Cu, and Cu alloy. It may be.

  FIG. 10 is a cross-sectional view taken along line BB in FIG. 3A for illustrating the structure of the drive terminal electrode 37 in FIG.

  In the cross section shown in the same figure, lead electrodes 3510a and 3511a appear, and these electrodes are electrically connected to the first and second lead conductor layers drawn out of the region directly above the upper shield layer, respectively. Connected. Conductive electrode film members 91 and 94 are formed on the extraction electrodes 3520a and 3521a, respectively. On the electrode film members 91 and 94, bumps 92 and 95 extending upward are formed by electroplating using the electrode film members 91 and 94 as electrodes. The electrode film members 91 and 94 and the bumps 92 and 95 are made of a conductive material such as Cu. The thickness of the electrode film members 91 and 94 is about 10 to about 200 nm, and the thickness of the bumps 92 and 95 is about 5 to about 30 μm.

  The upper ends of the bumps 92 and 95 are exposed from the coating layer 46, and pads 93 and 96 for the heating coil bodies are provided on these upper ends, respectively. A current is supplied to the heating coil body through the pads 93 and 96. Similarly, the MR effect element and the electromagnetic coil element are connected to the signal terminal electrode 36 (FIG. 3A), but these connection structures are not shown for the sake of clarity of the drawing. .

  FIG. 11 is a block diagram showing a circuit configuration of the HDD recording / reproducing and heat generation control circuit 13 in the embodiment of FIG.

  In the figure, reference numeral 1000 denotes a recording / reproducing circuit, 1001 denotes a heat generation control circuit, and 1002 denotes a CPU. The recording / reproducing circuit 1000 includes a recording / reproducing channel 1003 and a preamplifier unit 1004. The heat generation control circuit 1001 includes a register 1005, a D / A converter 1006, and a current control unit 1007.

  The recording data output from the recording / reproducing channel 1003 is supplied to the preamplifier unit 1004. The preamplifier unit 1004 receives the recording control signal output from the CPU 1002 by the write gate, and supplies the recording data to the electromagnetic coil element 34 only when the recording control signal instructs a writing operation. At this time, the preamplifier unit 1004 sends a write current to the coil layer 332 according to the recording data, and recording is performed on the magnetic disk.

  In addition, a constant current flows from the preamplifier unit 1004 to the MR multilayer 332 only when the reproduction control signal output from the CPU 1002 and received by the read gate instructs a read operation. The reproduction signal received from the MR effect element 33 to the preamplifier unit 1004 is amplified and demodulated and output to the recording / reproduction channel 1003 as reproduction data.

  The current control unit 1007 receives the heating coil body ON / OFF signal output from the recording / reproducing channel 1003 and the current value control signal output from the CPU 1002 via the register 1005 and the D / A converter 1006. When the heating coil body ON / OFF signal is an ON operation instruction, a current flows through the heating coil body 35. The current value at this time is controlled to a value corresponding to the current value control signal.

  As described above, by providing the heat generation control circuit 1001 independently of the recording / reproducing circuit 1000, more various energization modes can be used. Further, since the CPU 1002 controls the recording / reproducing circuit 1000 and the heat generation control circuit 1001, it is possible to energize the heat generating coil body 35 in synchronism with the read and / or write operation.

  For example, in order to cope with the problem of insufficient writing characteristics in the initial stage of the writing operation, it is effective to stabilize the magnetic spacing to a predetermined small value immediately before writing by using heat from the heating element. In this case, it is necessary to project the electromagnetic coil element with good response. For such a problem, the heating coil body is installed at the same position as the writing coil layer or in the very vicinity of the electromagnetic coil element, and for the first time by using the thin film magnetic head of the present invention having a high heat projecting efficiency. Thus, stabilization of such write characteristics can be achieved without causing WAIT.

  It is apparent that the circuit configuration of the recording / reproducing and heat generation control circuit 13 is not limited to that shown in FIG. The write and read operations may be specified by a signal other than the recording / reproduction control signal. Further, a direct current, an alternating current, a pulse current, or the like can be used as a current to be supplied to the heating coil body 35.

  All the embodiments described above are illustrative of the present invention and are not intended to be limiting, and the present invention can be implemented in other various modifications and changes. Therefore, the scope of the present invention is defined only by the claims and their equivalents.

1 is a perspective view schematically showing a configuration of a main part in an embodiment of an HDD according to the present invention. It is a perspective view showing the whole HGA by this invention. It is the schematic of the thin film magnetic head with which the front-end | tip part of HGA in the embodiment of FIG. 2 was mounted | worn, and a magnetic head element. FIG. 4 is a cross-sectional view showing a configuration of a perpendicular magnetic head element as an embodiment of the magnetic head element of FIG. It is sectional drawing of the magnetic head element explaining the effect of the heat generating coil body in embodiment of FIG. It is a top view which shows roughly the structure of the various change aspect of the heat generating coil body by this invention. It is a top view which shows roughly the structure of the various change aspect of the heat generating coil body by this invention. It is a perspective view for demonstrating the specific laminated structure of the various heat generating coil bodies shown in FIG. It is a perspective view for demonstrating the specific laminated structure of the various heat generating coil bodies shown in FIG. FIG. 4 is a cross-sectional view taken along line B-B in FIG. 3A for illustrating the structure of the drive terminal electrode in FIG. FIG. 2 is a block diagram showing a circuit configuration of an HDD recording / reproducing and heat generation control circuit in the embodiment of FIG. 1. It is a distribution map of the magnetic flux in a magnetic head element for demonstrating the cause of WAIT generation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Magnetic disk 100 Soft magnetic backing layer 11 Spindle motor 12 Assembly carriage apparatus 13 Recording / reproduction and heat generation control circuit 14 Drive arm 15 Voice coil motor (VCM)
16 Pivot bearing shaft 17 Head gimbal assembly (HGA)
20 Suspension 21 Slider 210 Slider substrate 22 Load beam 23 Flexure 24 Base plate 25 Wiring member 30 Air bearing surface (ABS)
300 Head end surface 31 Element formation surface 32 Magnetic head element 33 MR effect element 330 Lower shield layer 331 Lower shield gap layer 332 MR stack 333 Upper shield gap layer 334 Upper shield layer 334a, 334b, 334c End side 34 Electromagnetic coil element 340 Main Pole layer 340a, 3450a End 3400 Main pole main layer 3401 Main pole auxiliary layer 341 Gap layer 343 Coil layer 344 Write coil insulation layer 3440 First write coil insulation layer 3441 Second write coil insulation layer 345 Auxiliary pole layer 3450 Tray Ring shield part 35 Heat generating coil body 350, 350 ′, 350 ″, 350 ″ ″ Coil part 350a, 350a ′, 350a ″, 350a ″ end 3500 First heat generating layer 3500 ′, 3500 ″, 35 00 ″ ″ Heat generation layer 3501, 90 Second heat generation layer 3501 ′, 3501 ″, 3501 ″ ″ Coil conductor layer 351, 351 ′, 351 ″, 351 ″ ″, 70, 70 ′ Lead conductor portion 3510 , 3510 ′, 3510 ″, 3510 ″ ″, 700 First lead conductor layer 3510a, 3511a Lead electrode 3511, 3511 ′, 3511 ″, 3511 ″ ″, 701 Second lead conductor layer 3512 ″ first 3 lead conductor layer 36 signal terminal electrode 37 drive terminal electrode 38 normal 40 first insulating layer 41 second insulating layer 42 backing coil part 420 backing coil layer 421 backing coil insulating layer 43 third insulating layer 44 fourth Insulating layer 45 Fifth insulating layer 46 Cover layer 47 Coil surface 700 ', 701' Lead conductor layer 91, 94 Electrode film member 92, 95 bar Flops 93 and 96 pads 1000 recording reproducing circuit 1001 for controlling heat generation circuit 1002 CPU
1003 Recording / reproduction channel 1004 Preamplifier unit 1005 Register 1006 D / A converter 1007 Current control unit

Claims (11)

  A read magnetic head element including a first shield layer and a second shield layer, and a write magnetic head element including a first magnetic pole layer and a second magnetic pole layer are provided, the second shield layer and the second magnetic shield element A thin film magnetic head that is adjacent to each other and facing each other, and is perpendicular to the air bearing surface between the second shield layer and the second pole layer A thin film magnetic head having a coil surface whose normal line is in the track width direction and provided with at least one heating coil body that generates heat when energized.   The at least one heat generating coil body is formed of a set of at least one coil portion having the coil surface and a lead conductor layer that extends opposite to each other and flows a current in the opposite direction. The thin-film magnetic head according to claim 1, further comprising a lead conductor portion.   The said at least 1 coil part is two layers which consist of an electrical resistance material or a conductive material in which one edge part is connected and forms the coil of a half turn, The 1 or 2 characterized by the above-mentioned. The thin film magnetic head described in 1.   4. The thin film magnetic head according to claim 1, wherein the at least one coil portion is disposed at a position closer to the head end surface on the air bearing surface side than the lead conductor portion. 5.   5. The thin film magnetic head according to claim 1, wherein the lead conductor portion is led out to a region directly above the second shield layer. 6.   6. The thin film magnetic head according to claim 1, wherein the at least one heat generating coil body is disposed between the second shield layer and the first magnetic pole layer. 7. .   6. The thin film magnetic head according to claim 1, wherein the at least one heating coil body is disposed between the first and second magnetic pole layers.   8. The method according to claim 1, wherein the first magnetic pole layer is a main magnetic pole layer, the second magnetic pole layer is an auxiliary magnetic pole layer, and the write magnetic head element is used for perpendicular magnetic recording. The thin film magnetic head according to any one of the above items.   9. A thin film magnetic head according to claim 1, comprising at least one thin film magnetic head, a lead wire for supplying a current to the at least one heating coil body, the read magnetic head element, and the write A head gimbal assembly, further comprising a signal line for the magnetic head element and a support mechanism for supporting the thin film magnetic head.   10. A head gimbal assembly according to claim 9, comprising at least one magnetic disk, a heat generation control circuit for controlling a current supplied to the at least one heat generating coil body, and read and write operations. And a recording / reproducing circuit for controlling the magnetic disk device.   11. The CPU according to claim 10, further comprising: a CPU that controls the heat generation control circuit and the recording / reproducing circuit and drives the heat generation control circuit in synchronization with a read and / or write operation. The magnetic disk device described.

Images