JP2006322866A - Temperature controlling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temperature controlling device capable of controlling the temperature of test object efficiently. <P>SOLUTION: The temperature controlling device is equipped with a temperature varying section, in which the temperature is controlled variably, and a temperature controlling means, which controls the temperature varying section. The varying temperature section includes a plurality of mobile heat conduction sections, in which each contact surface with the test object can move according to the shape of test object. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a temperature control device, and more particularly to a temperature control device for performing a temperature test of an electronic device.

  In general, an electronic device is required to satisfy a predetermined performance in a temperature environment determined for each product. For this reason, a product characteristic test (hereinafter also referred to as a temperature characteristic test) is performed under a predetermined temperature environment. For temperature characteristic tests of electronic devices, a thermostatic chamber that can maintain and control the temperature of a sealed space at a constant temperature has been used. However, the constant temperature bath has a problem that heat transfer efficiency is low because air having a small heat capacity is used as a heat medium, and it takes time until the DUT reaches the target temperature and stabilizes.

  On the other hand, in the temperature characteristic test of a single electronic component, there is a method in which a Peltier element or a heater is brought into direct contact with the device under test, and the device under test can be stabilized at the target temperature in a short time. However, since the majority of the surface of the device under test needs to be flat, a sufficient contact area can be obtained when a large number of electronic components are combined and an electronic circuit board or the like with uneven surfaces is the target. Not applicable.

Therefore, in order to solve the above problem, each heater chip is urged against each of the plurality of heating target members by the urging means (conductive spring member), and the heater chip is heated while being pressed against the substrate. Thus, a pressure heating apparatus using a technique for heating by direct heat transfer between a heater chip and a member (hereinafter also referred to as conventional technique A) is disclosed in Japanese Patent Laid-Open No. 10-291100 (Patent Document 1). Yes.
Japanese Patent Laid-Open No. 10-291100

  However, the heater chip used in the prior art A has conductivity. Therefore, there is a problem that the pressure heating apparatus of the conventional technique A cannot be used in a temperature test in an energized state of an electronic substrate or the like.

  Further, the biasing means of the prior art A has a problem that it is not a structure that can absorb a large difference in height. Moreover, in the prior art A, since the heater chip is used as a temperature change means, there exists a problem that it cannot control to low temperature.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a temperature control device capable of efficiently controlling the temperature of a device under test.

  In order to solve the above-described problems, according to one aspect of the present invention, a temperature control device that changes the temperature of a device under test controls a temperature-variable portion whose temperature is variably controlled, and a temperature of the temperature-variable portion. And the temperature changing section includes a plurality of movable heat conducting sections in which each contact surface with the device under test is movable according to the shape of the device under test.

  The temperature control device according to the present invention includes a temperature changing section in which the temperature is variably controlled, and a temperature control means for controlling the temperature of the temperature changing section. The temperature changing unit includes a plurality of movable heat conducting units in which the respective contact surfaces with the device under test move according to the shape of the device under test.

  Therefore, there is an effect that the temperature of the device under test can be efficiently controlled.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the same parts are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed description thereof will not be repeated.

FIG. 1 is a cross-sectional view of a temperature control apparatus 1000 in the present embodiment.
With reference to FIG. 1, the temperature control device 1000 includes a thermostatic bath 100.

  The thermostat 100 is constituted by a thermostat upper lid 100A and a thermostat lower part 100B. The thermostat upper lid 100A and the thermostat lower part 100B are in close contact so that the heat in the thermostat 100 is not easily released to the outside.

  The thermostatic chamber 100 includes a device under test base 110, a device under test 120, a heat conduction plate 130, a temperature change plate 140, a heat sink 142, and a heat dissipation fan 144.

  The DUT installation table 110 is a table for fixing and installing the DUT 120. The device under test base 110 includes an adjustment unit 112 for adjusting the height at which the device under test 120 is installed. The device under test 120 is an object to be subjected to a temperature characteristic test. The heat conduction plate 130 has a mechanism for efficiently transferring heat to the device under test 120.

  The temperature change plate 140 has a function of efficiently transferring the heat of the heat conducting plate 130 to the heat sink 142. The temperature changing plate 140 and the heat conducting plate 130 are temperature changing portions in which the temperature is variably controlled. The heat sink 142 has a mechanism that efficiently dissipates heat transmitted from the temperature change plate 140. The heat dissipation fan 144 is a fan for cooling the heat sink 142.

  A device under test 120 is installed above the device under test base 110. A heat conduction plate 130 is provided on the upper portion of the device under test 120.

FIG. 2 is a cross-sectional view showing a detailed configuration of the heat conduction plate 130.
Referring to FIG. 2, heat conduction plate 130 includes movable heat conduction portions 130.1,. n is included. Movable heat conduction part 130.1, ..., 130. Each of n is connected in series in the lateral direction. Movable heat conduction part 130.1, ..., 130. n all have the same configuration. In addition, the movable heat conduction parts 130.1, ..., 130. As described later, n may not all have the same configuration.

  Movable heat conduction unit 130. n is composed of a spring 131 as an elastic body, a cylinder 132, a piston 133, a head 134, and an insulating heat conducting member 135. The head 134 and the insulative heat conducting member 135 are insulative and heat conducting members. The spring 131, the cylinder 132, and the piston 133 are also members that conduct heat. The side surface and bottom surface of the head 134 are covered with an insulating heat conducting member 135. The shape of the head 134 may be either a circular shape or a square shape.

  FIG. 3 is a bottom view of the heat conducting plate 130 when the shape of the head 134 is circular.

  Referring to FIG. 3, the heat conducting plate 130 includes a plurality of movable heat conducting units arranged in two dimensions. Here, one of the plurality of movable heat conducting units 130. The shape of the n head 134 is circular. Therefore, the shape of the insulating heat conducting member 135 that covers the head 134 is also circular. That is, the shape of the insulating heat conductive member corresponding to each of the plurality of movable heat conductive portions is circular.

  As a result, each of the insulating heat conductive members of the plurality of movable heat conductive portions has an appropriate interval, and can cope with the fine unevenness of the device under test 120.

  FIG. 4 is a bottom view of the heat conducting plate 130 when the shape of the head 134 is a square shape.

  Referring to FIG. 4, the heat conducting plate 130 includes a plurality of movable heat conducting units arranged in two dimensions. Here, one of the plurality of movable heat conducting units 130. The shape of the n head 134 is a square shape. Therefore, the shape of the insulating heat conducting member 135 covering the head 134 is also a square shape. That is, the shape of the insulating heat conductive member corresponding to each of the plurality of movable heat conductive portions is a square shape.

  As a result, the interval between the insulating heat conducting members of each of the plurality of movable heat conducting parts is smaller than that in the case of FIG. 3, and the contact area between the heat conducting plate 130 and the DUT 120 is maximized. be able to.

  When the shape of the head 134 is a square shape, in order to prevent the head 134 from rotating, V-groove machining is performed on the piston 133 and a V-groove guide is provided on the cylinder 132.

  Referring to FIG. 2 again, a piston 133 is connected to the top of the head 134. The piston 133 is connected to a cylinder 132 as a fixed portion via a spring 131. The spring 131 greatly expands and contracts vertically. Therefore, the piston 133 to which the head 134 is connected greatly strokes up and down. That is, the movable heat conducting unit 130. n has a movable heat conduction mechanism.

  Movable heat conduction unit 130. n has a configuration in which the piston 133 can be largely stroked up and down, that is, a configuration in which the insulating heat conducting member 135 as a movable portion can be largely stroked up and down.

  Therefore, since the heat conduction plate 130 is configured to include a plurality of movable heat conduction portions, even if the unevenness of the DUT 120 is large, each insulating heat conduction member of the plurality of movable heat conduction portions. And the effect that a contact area with the to-be-tested object 120 can be ensured to the maximum is produced.

  As a result, the heat conduction plate 130 can efficiently conduct the heat of the device under test 120 absorbed by the insulating heat conduction member of each of the plurality of movable heat conduction parts to the upper part of the heat conduction plate 130. There is an effect.

  Since the head 134 and the insulating heat conducting member 135 of each of the plurality of movable heat conducting parts in the heat conducting plate 130 are insulative, they are in contact with the device under test 120 even in a temperature characteristic test of an electronic substrate or the like. Surface insulation is maintained. Therefore, the temperature control apparatus 1000 has an effect that the temperature characteristic test of the device under test 120 can be performed even in the energized operation state.

  Further, the heat conducting plate 130 can be formed by setting the shapes of the plurality of heads and the insulating heat conducting members respectively corresponding to the plurality of movable heat conducting portions to a circular shape, a square shape, or a combination thereof. 120 and an optimal contact surface can be obtained. Therefore, the heat conduction plate 130 has an effect that it is possible to perform efficient heat conduction.

  In addition, by injecting heat conduction grease between the cylinder 132 and the piston 133, the heat conduction efficiency of the heat conduction plate 130 can be further improved.

  Referring again to FIG. 1, a temperature change plate 140 is provided on the heat conduction plate 130. A heat sink 142 is provided on the top of the temperature change plate 140. A heat radiating fan 144 is provided on the heat sink 142.

  In other words, an exhaust heat unit including a heat sink 142 and a heat radiating fan 144 is provided on the temperature change plate 140. Thereby, the heat exchanged by the temperature change plate 140 can be efficiently released to the outside air.

  Between the heat sink 142 and the constant temperature bath upper lid 100A, a heat insulating material 100AD is provided in close contact so that the heat in the constant temperature bath 100 does not escape to the outside.

  Therefore, the heat exhausting part constituted by the heat sink 142 and the heat radiating fan 144, the temperature change plate 140, and the heat conduction plate 130 are integrated with the thermostatic bath upper lid 100A via the heat insulating material 100AD.

  As a result, the exhaust heat unit has a structure supported by the thermostat upper lid 100A, and the heat conduction plate 130 can contact the device under test 120 with an appropriate pressure. The contact pressure between the conductive plate 130 and the device under test 120 can be adjusted by adjusting the height by the adjusting unit 112 of the device under test base 110 on which the device under test 120 is installed.

  The thermostatic bath upper lid 100A is provided with a lid-side cable port 102 through which a cable connected to the thermostatic bath upper lid 100A can be passed. Moreover, the tank side cable port 104 is provided in the thermostat lower part 100B, and the cable connected to the thermostat lower part 100B side can be passed. That is, by providing an independent cable port in each of the thermostatic bath upper lid 100A and the thermostatic bath lower portion 100B, the thermostatic bath upper lid 100A can be opened and closed with the cable connected.

  The temperature control apparatus 1000 further includes a power source 160, a temperature controller 170, and a digital multimeter 180. The power supply 160 supplies a voltage to the device under test 120. The temperature controller 170 controls the temperature of the temperature change plate 140. That is, the temperature controller 170 operates as temperature control means.

  The temperature change plate 140 is connected to a temperature controller 170 via a temperature change plate control cable 174. The temperature controller 170 controls the temperature of the temperature change plate 140.

  The temperature change plate 140 is generated by a Peltier element. Therefore, by using a Peltier element for the temperature change plate 140, the temperature controller 170 has an effect that the temperature change plate 140 can be controlled to a wide temperature range from a low temperature to a high temperature.

  A temperature measuring unit 139 is connected to the heat conducting plate 130. The temperature measuring unit 139 has a function of measuring the temperature of the connected member. The temperature measurement unit 139 is connected to the temperature controller 170 via the temperature measurement cable 172. The temperature controller 170 uses the temperature measurement unit 139 to acquire the temperature of the heat conduction plate 130 and perform feedback control, thereby controlling the temperature of the temperature change plate 140, thereby controlling the heat conduction plate 130 at a desired temperature. To control.

  Therefore, the temperature control apparatus 1000 in the present embodiment has an effect that the temperature of the device under test 120 in which the contact surface with the heat conducting plate 130 is ensured to the maximum can be quickly and uniformly controlled. That is, the temperature of the device under test 120 can be controlled efficiently.

  An external connector 129 is attached to the device under test 120. The external connection connector 129 has a power supply terminal to the device under test and a monitor terminal to be measured. The power supply 160 is connected to the external connector 129 via the power cable 162 for the device under test. The power supply 160 supplies a voltage to the device under test 120. The external connection connector 129 is connected to the digital multimeter 180 via the measurement cable 182. The digital multimeter 180 has a function of measuring the voltage value to be measured of the device under test 120. As a result, the temperature characteristic test of the device under test 120 can be performed using the heat conducting plate 130 that has been brought to a desired temperature by the temperature controller 170.

  The temperature control device 1000 further includes a dry air cylinder 190. The dry air cylinder 190 has a function of supplying dry air. That is, the dry air cylinder 190 operates as a dry air supply unit.

  A dry air inlet 106 is provided in the constant temperature bath lower part 100B. The dry air inlet 106 is connected to a dry air cylinder 190 via a dry air inlet hose 192 as an air inlet. The dry air cylinder 190 supplies dry air into the constant temperature bath 100 through the dry air introduction hose 192. As a result, there is an effect that condensation can be prevented during the low temperature test of the device under test 120.

  In addition, since the inside of the thermostatic bath 100 has the lid side cable port 102 and the bath side cable port 104, it is not completely sealed. However, by always supplying dry air, the pressure inside the thermostatic bath 100 is controlled from the outside air. The effect of being able to prevent damp outside air from flowing in is also achieved.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

It is sectional drawing of the temperature control apparatus in this Embodiment. It is sectional drawing which showed the detailed structure of the heat conductive plate. It is a bottom view of the heat conductive plate when the shape of the head is circular. It is a bottom view of the heat conductive plate when the shape of the head is a square shape.

Explanation of symbols

  100 constant temperature bath, 130 heat conduction plate, 130.1, 130. n Movable heat conduction unit, 131 spring, 139 temperature measurement unit, 170 temperature controller, 140 heat conduction plate, 1000 temperature control device.

Claims (5)

A temperature control device that changes the temperature of a device under test,
A temperature-variable section whose temperature is variably controlled;
Temperature control means for controlling the temperature of the temperature changing section,
The temperature changing device includes a plurality of movable heat conducting units in which respective contact surfaces with the device under test are movable according to the shape of the device under test. Each of the plurality of movable heat conducting parts is
A fixed part;
A movable part that contacts the device under test by moving in a predetermined direction;
The temperature control device according to claim 1, comprising: an elastic body connected between the fixed portion and the movable portion.   The temperature control device according to claim 1, wherein a contact surface of each of the plurality of movable heat conduction parts with the device under test is covered with an insulating heat conduction member. The temperature changing part is
A temperature change plate whose temperature is controlled by the temperature control means;
Including a heat conduction plate provided between the temperature change plate and the plurality of movable heat conduction parts,
The temperature control device according to claim 1, wherein the temperature change plate is generated by a Peltier element. A thermostatic chamber that shuts off the temperature-changing part from outside air;
A dry air supply unit for supplying dry air;
The temperature control device according to claim 1, wherein the thermostatic chamber includes an air introduction unit for taking in the dried air from the dry air supply unit.

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