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Publication number
JP2006310650A5
JP2006310650A5 JP2005133224A JP2005133224A JP2006310650A5 JP 2006310650 A5 JP2006310650 A5 JP 2006310650A5 JP 2005133224 A JP2005133224 A JP 2005133224A JP 2005133224 A JP2005133224 A JP 2005133224A JP 2006310650 A5 JP2006310650 A5 JP 2006310650A5
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Japan
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semiconductor
conductivity type
potential barrier
semiconductor region
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JP2005133224A
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JP4854216B2 (en
JP2006310650A (en
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Priority to JP2005133224A priority Critical patent/JP4854216B2/en
Priority claimed from JP2005133224A external-priority patent/JP4854216B2/en
Publication of JP2006310650A publication Critical patent/JP2006310650A/en
Publication of JP2006310650A5 publication Critical patent/JP2006310650A5/ja
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Publication of JP4854216B2 publication Critical patent/JP4854216B2/en
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Claims (11)

半導体基板と、
前記半導体基板に形成された信号電荷と同導電型である第1導電型の第1の半導体領域、及び、前記第1の半導体領域よりも前記半導体基板の深部に形成された第2導電型の第2の半導体領域を含んで構成された光電変換部と、
前記光電変換部で生成された電荷が転送される転送領域と、
前記光電変換部及び前記転送領域を含む領域を取り囲む素子分離領域と、
前記素子分領域の下方に配置されて、前記第2の半導体領域と共に、前記領域の少なくとも一部を取り囲む第2導電型のポテンシャル障壁領域と、を備え
前記ポテンシャル障壁領域が、互いに異なる深さに配置された複数の障壁領域で構成されている、
ことを特徴とする撮像装置。
A semiconductor substrate;
A first conductivity type first semiconductor region having the same conductivity type as the signal charge formed on the semiconductor substrate, and a second conductivity type formed deeper in the semiconductor substrate than the first semiconductor region. A photoelectric conversion unit configured to include a second semiconductor region;
A transfer region to which charges generated by the photoelectric conversion unit are transferred;
An element isolation region surrounding a region including the photoelectric conversion unit and the transfer region;
Is disposed below the element content releasing region, together with the second semiconductor region, and a second conductivity type of the potential barrier region surrounding at least a portion of said region,
The potential barrier region, and a plurality of barrier regions disposed at different depths from each other,
An imaging apparatus characterized by that.
前記第1の半導体領域が前記転送領域の下に広がっていることを特徴とする請求項1に記載の撮像装置。   The imaging apparatus according to claim 1, wherein the first semiconductor region extends below the transfer region. 前記素子分離領域の下にチャネルストップ領域が配置され、
前記ポテンシャル障壁領域が前記チャネルストップ領域と前記第2の半導体領域との間を第2導電型の半導体領域で連結するように配置されている、
ことを特徴とする請求項2に記載の撮像装置。
A channel stop region is disposed under the element isolation region,
The potential barrier region is arranged to connect the channel stop region and the second semiconductor region with a semiconductor region of a second conductivity type;
The imaging apparatus according to claim 2.
前記ポテンシャル障壁領域が前記第2の半導体領域を貫通していることを特徴とする請求項3に記載の撮像装置。   The imaging apparatus according to claim 3, wherein the potential barrier region penetrates the second semiconductor region. 前記ポテンシャル障壁領域の最も深い位置に配置された障壁領域が最も高い不純物濃度を有することを特徴とする請求項3又は請求項4に記載の撮像装置。   The imaging device according to claim 3 or 4, wherein the barrier region disposed at a deepest position of the potential barrier region has the highest impurity concentration. 半導体基板に形成された第1及び第2画素を有する撮像装置であって、
前記第1及び第2画素は、各々、信号電荷と同導電型である第1導電型の第1の半導体領域、及び、前記第1の半導体領域よりも前記半導体基板の深部に形成された第2導電型の第2の半導体領域を含んで構成された光電変換部と、
前記光電変換部で生成された電荷が転送される転送領域とを含み、
前記撮像装置は、
前記第1画素の転送領域と前記第2画素の光電変換部との間に配置された素子分離領域と、
前記素子分離領域の下方に配置されたポテンシャル障壁領域と、を有し、
前記ポテンシャル障壁領域が、互いに異なる深さに配置された複数の障壁領域で構成されている、
ことを特徴とする撮像装置。
An imaging device having first and second pixels formed on a semiconductor substrate,
Each of the first and second pixels has a first conductivity type first semiconductor region having the same conductivity type as a signal charge, and a first region formed deeper in the semiconductor substrate than the first semiconductor region. A photoelectric conversion unit configured to include a second conductivity type second semiconductor region;
A transfer region to which the charge generated by the photoelectric conversion unit is transferred,
The imaging device
An element isolation region disposed between the transfer region of the first pixel and the photoelectric conversion unit of the second pixel;
A potential barrier region disposed below the element isolation region,
The potential barrier region, and a plurality of barrier regions disposed at different depths from each other,
An imaging apparatus characterized by that.
前記第1の半導体領域が前記転送領域の下に広がっていることを特徴とする請求項6に記載の撮像装置。   The imaging apparatus according to claim 6, wherein the first semiconductor region extends below the transfer region. 前記第2の半導体領域が前記第1の半導体領域の下に配置され、
前記素子分離領域の下にチャネルストップ領域が配置され、
前記ポテンシャル障壁領域が前記チャネルストップ領域と前記第2の半導体領域との間を第2導電型の半導体領域で連結するように配置されている、
ことを特徴とする請求項7に記載の撮像装置。
The second semiconductor region is disposed under the first semiconductor region;
A channel stop region is disposed under the element isolation region,
The potential barrier region is arranged to connect the channel stop region and the second semiconductor region with a semiconductor region of a second conductivity type;
The imaging apparatus according to claim 7.
前記ポテンシャル障壁領域が前記第2の半導体領域を貫通していることを特徴とする請求項8に記載の撮像装置。   The imaging device according to claim 8, wherein the potential barrier region penetrates the second semiconductor region. 前記ポテンシャル障壁領域の最も深い位置に配置された障壁領域が最も高い不純物濃度を有することを特徴とする請求項8又は請求項9に記載の撮像装置。   10. The imaging device according to claim 8, wherein a barrier region disposed at a deepest position of the potential barrier region has the highest impurity concentration. 請求項1乃至請求項10のいずれか1項に記載の撮像装置と、
前記撮像装置の撮像面に像を形成する光学系と、
前記撮像装置から出力される信号を処理する信号処理回路と、
を備えることを特徴とする撮像システム。
The imaging device according to any one of claims 1 to 10,
An optical system for forming an image on an imaging surface of the imaging device;
A signal processing circuit for processing a signal output from the imaging device;
An imaging system comprising:
JP2005133224A 2005-04-28 2005-04-28 Imaging apparatus and imaging system Expired - Fee Related JP4854216B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005133224A JP4854216B2 (en) 2005-04-28 2005-04-28 Imaging apparatus and imaging system

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Application Number Priority Date Filing Date Title
JP2005133224A JP4854216B2 (en) 2005-04-28 2005-04-28 Imaging apparatus and imaging system

Publications (3)

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JP2006310650A JP2006310650A (en) 2006-11-09
JP2006310650A5 true JP2006310650A5 (en) 2008-06-05
JP4854216B2 JP4854216B2 (en) 2012-01-18

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JP4525671B2 (en) * 2006-12-08 2010-08-18 ソニー株式会社 Solid-state imaging device
JP5366396B2 (en) 2007-12-28 2013-12-11 キヤノン株式会社 Photoelectric conversion device manufacturing method, semiconductor device manufacturing method, photoelectric conversion device, and imaging system
JP2010003928A (en) * 2008-06-20 2010-01-07 Toshiba Corp Solid-state image pickup device and method for manufacturing the same
JP5131309B2 (en) * 2010-04-16 2013-01-30 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and imaging device
JP5263220B2 (en) * 2010-04-16 2013-08-14 ソニー株式会社 Solid-state imaging device, manufacturing method thereof, and imaging device
US8883544B2 (en) 2012-05-04 2014-11-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method of forming an image device
JP6238546B2 (en) * 2013-04-08 2017-11-29 キヤノン株式会社 Photoelectric conversion device and imaging system
JP6448289B2 (en) * 2014-10-07 2019-01-09 キヤノン株式会社 Imaging apparatus and imaging system
JP6764571B2 (en) * 2015-03-12 2020-10-07 ソニー株式会社 Solid-state image sensor, image sensor, and electronic equipment
JP2016187018A (en) 2015-03-27 2016-10-27 キヤノン株式会社 Photoelectric conversion device and camera
JP2015146465A (en) * 2015-04-30 2015-08-13 キヤノン株式会社 photoelectric conversion device
JP2017045873A (en) * 2015-08-27 2017-03-02 ルネサスエレクトロニクス株式会社 Manufacturing method for semiconductor device and semiconductor device
JP2017059563A (en) * 2015-09-14 2017-03-23 ルネサスエレクトロニクス株式会社 Image sensor
JP7039205B2 (en) * 2017-07-27 2022-03-22 キヤノン株式会社 Solid-state image sensor, manufacturing method of solid-state image sensor, and image sensor

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JP3457551B2 (en) * 1998-11-09 2003-10-20 株式会社東芝 Solid-state imaging device
JP3702854B2 (en) * 2002-03-06 2005-10-05 ソニー株式会社 Solid-state image sensor
JP3840203B2 (en) * 2002-06-27 2006-11-01 キヤノン株式会社 Solid-state imaging device and camera system using the solid-state imaging device
JP2004165462A (en) * 2002-11-14 2004-06-10 Sony Corp Solid-state imaging device and method of manufacturing the same
JP4718875B2 (en) * 2005-03-31 2011-07-06 株式会社東芝 Solid-state image sensor

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