JP2006305779A - Method for correcting position of substrate for multi-area subdividing and screen printing machine - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for correcting the position of a substrate for multi-area subdividing which can perform an operation rapidly and precisely with regard to subdivided substrates of the substrate for multi-area subdividing and avoid the complication of a configuration of working machines, and a screen printing machine. <P>SOLUTION: Each two reference marks 122 are put correspondingly to each of the subdivided substrates 120 constituting the substrate 30 for multi-area subdividing, and based on a photographed image, the mean value of each positional deviation level in the X axis direction and the Y axis direction of the reference mark 122 in such a state that the rotary positional deviation of the substratge 30 is removed, is calculated. Next, in such a case that there is at least one subdivided substrate 120, with the absolute value, of a difference between the positonal deviation level of the corresponding reference mark 122 and the average value of the positional deviation level, exceeding a tolerable range, the positional deviation correction level to a screen 40 for the substrate 30, is calculated in disregard of at least one reference mark 122 for the subdivided substrate 120 of them. After that, the position of the substrate 30 is registered with the screen 40 and thus the register precision is enhanced with regard to the subdivided substrates 120 other than the subdivided substrate 120 whose reference mark 122 is disregarded. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for correcting a position of a multi-sided board and a screen printing machine, and more particularly, to an improvement in the accuracy of correcting a misalignment of a multi-sided board.

2. Description of the Related Art Conventionally, after performing a predetermined operation on each of a plurality of sub-substrates of a multi-sided substrate formed by integrally joining a plurality of sub-substrates, a plurality of substrates are obtained.
For example, when an electronic component is mounted on a wiring pattern of a substrate to form an electronic circuit, cream solder is printed on each of the plurality of sub-boards by a screen printer, and the electronic component is mounted by an electronic component mounting machine. In addition, as described in Patent Document 1 below, when a liquid crystal display device is manufactured by bonding another glass substrate to each of a plurality of sub-substrates of a multi-chamfer glass substrate, a plurality of sub-substrates are used. An adhesive is printed on each of the substrates by screen printing, and after printing, another glass substrate is bonded to each of the plurality of sub-substrates. Screen printing of a printing material on a multi-sided substrate can be performed on all of a plurality of sub-substrates at once or divided into a plurality of times, but each has advantages and disadvantages. If printing is performed at once, the printing time can be shortened, but the screen becomes large and the through hole formation position accuracy is low, and it is difficult to increase the printing accuracy. Although printing accuracy is easy to increase, printing takes time.
In the screen printing machine described in Patent Document 1, the screen is one child board, and the adhesive is printed one by one on the plurality of child boards. Every time printing for one child substrate is completed, the screen is moved onto the next child substrate, and screen printing is performed for the child substrate.
Further, in Patent Documents 2 and 3 below, when printing a printing material on a substrate using a screen, a reference mark is provided on each of the screen and the circuit board, although it is not a multi-sided board but a normal circuit board. Is provided, and the positional deviation between the reference marks is acquired, and the positional deviation between the screen and the circuit board is corrected to improve the printing accuracy.
JP 2000-171768 A JP-A-11-245370 JP-A-9-309198

  The present invention has been made against the background of the above circumstances, and can perform operations on a sub-substrate of a multi-sided substrate quickly and accurately, and can avoid the complication of the construction of the work machine. It is an object to obtain a substrate position correcting method and a screen printing machine.

In order to solve the above-described problem, the present invention provides a method for correcting a positional deviation of a multi-sided board formed by integrally joining a plurality of daughter boards with respect to a reference position, and a reference corresponding to each of the plurality of daughter boards. A mark is provided, and among the plurality of sub-boards, the reference mark of at least one sub-board where the corresponding reference mark is particularly greatly shifted from the reference mark of the other sub-board is ignored, and The gist is to correct the misalignment.
The ignoring of the reference marks for the sub-boards in which the corresponding reference marks are greatly deviated with respect to the reference marks of the other sub-boards may be performed for all the multi-sided boards, and the positional deviation is set in advance. It may be performed only when there is a child substrate to be filled.

The misalignment that should be a problem in the multi-sided board is originally the work area set for each of the plurality of sub-boards and the position of the location where the work is to be performed, but the plurality of sub-boards are combined together. Therefore, the positional deviation of the sub board is corrected by correcting the positional deviation relative to the reference position of the position of the entire multi-sided board. Each positional deviation of the plurality of sub boards is corrected by a common correction amount, and the position correction quantity of the multi-sided board is set based on the positional deviation of the plurality of sub boards. For this reason, the displacement of each of the plurality of sub-boards affects each other. For example, if all the sub-substrates are similarly misaligned and the relative positional relationship misalignment is small, the misalignment of all the sub-substrates can be similarly corrected by correcting the position of the multi-sided substrate. . However, for example, when one of the plurality of sub-substrates is largely displaced relative to the other sub-substrates, and the relative positional deviation is small between the other sub-substrates, all of the sub-substrates If the amount of misalignment correction of the multi-chip board is obtained based on the misalignment, the position correction of the other sub-board becomes inappropriate due to the large misalignment of the one sub-board, and at the same time, The correction of the position of the sub board is also insufficient due to the restriction of the positions of the other sub boards. Eventually, the positional deviation of any of the sub-boards is not sufficiently corrected, and the positional deviation of all the sub-boards remains large, and in a severe case, all the sub-boards become defective products.
On the other hand, according to the present invention, since the reference mark of the child board that has a particularly large deviation from the reference mark of the other child board is ignored, the position deviations of the other child boards are approximated to each other. If the amount of misalignment correction is obtained based on the position of the reference mark on the substrate, the misalignment can be sufficiently corrected for all the sub substrates except the sub substrate where the reference mark is ignored. Other than the sub-board where the reference mark is ignored, high positioning accuracy can be obtained for the multi-sided board, and even if a plurality of sub-boards are operated at once, the operation can be performed with high accuracy. The sub-board in which the reference mark is ignored has a large positional deviation and becomes a defective board, but it is avoided that the positional deviation of all the sub-boards becomes large or becomes a defective board. Such a reference mark having a particularly large deviation can be ignored by calculation, and a highly accurate operation can be performed quickly and easily.
Note that, as described above, for all multi-planar substrates, when the corresponding reference mark is ignored, particularly when the sub-substrate is largely deviated from the reference marks of the other sub-substrates, the yield of the substrate material is reduced. The alignment accuracy can be further improved. For example, if the board is a circuit board on which electronic components are to be mounted and the mounting pitch of the electronic components is particularly narrow, a short circuit occurs after soldering due to the printing agent applied to the adjacent printing locations on the circuit board. In order to reduce the possibility of performing the above, it is necessary to increase the alignment accuracy between the screen and the circuit board, and to precisely align the through holes of the screen and the printed portions of the circuit board. In this case, if all the reference marks having a particularly large deviation are unconditionally ignored, it is possible to align the positions of the sub-boards other than the sub-board where the reference marks are ignored with the screen with high accuracy. Thereby, the yield of finished products can be improved. If the finished product becomes defective, the work done so far and the large number of mounted electronic components will be wasted, making up for the loss of the substrate material that is considered defective at the screen printing stage. There may be too much.

Aspects of the Invention

  In the following, the invention that is claimed to be claimable in the present application (hereinafter referred to as “claimable invention”. The claimable invention is at least the “present invention” to the invention described in the claims. Some aspects of the present invention, including subordinate concept inventions of the present invention, superordinate concepts of the present invention, or inventions of different concepts) will be illustrated and described. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating the understanding of the claimable invention, and is not intended to limit the combinations of the constituent elements constituting the claimable invention to those described in the following sections. In other words, the claimable invention should be construed in consideration of the description accompanying each section, the description of the embodiments, etc., and as long as the interpretation is followed, another aspect is added to the form of each section. In addition, an aspect in which constituent elements are deleted from the aspect of each item can be an aspect of the claimable invention.

  In each of the following paragraphs, paragraph (1) corresponds to claim 1, and the combination of paragraphs (2) and (3) is claim 2, and paragraphs (2) and (4) (8) corresponds to claim 4, and (9) and (10) correspond to claim 5, respectively.

(1) A method for correcting a positional deviation of a multi-surface substrate formed by integrally joining a plurality of sub-substrates with respect to a reference position,
A reference mark corresponding to each of the plurality of sub-substrates is provided, and among the plurality of sub-substrates, the reference mark corresponding to at least one sub-substrate is significantly shifted from the reference mark of the other sub-substrate. A method for correcting the position of a multi-sided substrate, wherein the position of the multi-sided substrate is corrected while ignoring the mark.
(2) The multi-chamfer substrate position correcting method according to (1), wherein a position of a screen for performing screen printing on the multi-chamfer substrate is set as the reference position.
When correcting the relative positional deviation between the screen and the multi-sided substrate, the screen may be moved or the multi-sided substrate may be moved.
In screen printing, a printing material such as cream solder is applied to all of the plurality of sub-substrates of the multi-sided substrate at a time, but the corresponding reference marks are particularly greatly shifted from the reference marks of the other sub-substrates. Since the reference marks of the sub-substrates are ignored and the misalignment of the multi-chamfered substrate with respect to the screen is corrected, the sub-substrates other than the sub-substrates where the reference marks are ignored are formed on the printing place and screen of the printing agent The alignment with the through hole made is performed with high accuracy, and printing is performed with high accuracy.
(3) If ignoring the reference marks of the at least one sub-substrate, and correcting the position of the multi-sided substrate so that the positional deviation of all the reference marks of the plurality of sub-substrates is minimized on average, The multi-planar substrate position correction method according to (1) or (2), which is performed when a positional deviation exceeding an allowable range occurs in a reference mark of any of the sub-substrates.
Even if the reference mark of any of the multiple sub-boards is significantly deviated from the reference mark of other sub-boards, the reference mark is ignored if it is within the allowable range. However, the misalignment of the multi-sided substrate including the misalignment is corrected. For this reason, for example, the number of sub-boards in which the reference marks are ignored is small, and it is possible to improve the positioning accuracy of the multi-sided board and suppress the decrease in the yield of the material.
(4) When the position correction of the multi-planar substrate is performed so that the position shifts of all the reference marks of the plurality of sub-boards are the smallest on average, the absolute value of the position shift amount of the reference marks is the largest. The multi-chip substrate position correcting method according to any one of (1) to (3), wherein the sub-board is determined as a sub-board that should ignore the reference mark.
In this way, it is possible to easily detect one of the plurality of sub-substrates whose corresponding reference mark is significantly deviated from the reference marks of the other sub-substrates.
When it is necessary to ignore the fiducial marks of multiple sub-boards, it is possible to determine the fiducial marks to be ignored in order from the largest absolute value of the reference mark position deviation as a convenience. It is. However, the position correction of the multi-chip board was performed so that the position deviation of all the reference marks of the remaining sub-boards excluding the sub-board where the absolute value of the position deviation amount of the reference mark was the largest was the smallest on average. In this case, it is desirable to determine the daughter board having the largest absolute value of the amount of positional deviation of the reference mark as the next daughter board that should ignore the reference mark.
In an embodiment in which this item is subordinate to item (3), if there is at least one sub-board whose reference mark displacement exceeds the allowable range, one of them is the absolute value of the displacement amount of the reference mark in this item. Becomes the largest sub-board, and the sub-board is determined as the sub-board that should ignore the reference mark. Conveniently, the determination of the presence or absence of a child board to be ignored and the determination of a child board to be ignored can be made based on the same calculation.
(5) One or more different ones of the plurality of sub-boards are sequentially excluded, and the plurality of reference marks on all the sub-boards other than the sub-boards are averagely minimized so as to be the smallest. In the case where the positional deviation of the chamfered substrate is corrected, the one or more excluded child substrates in the case where the maximum absolute value of the corrected positional deviation amount is minimized is the child substrate that should ignore the reference mark. The multi-chamfer substrate position correcting method according to any one of (1) to (3), wherein
Depending on the number and combination of sub-boards that should ignore the reference mark, the maximum absolute value of the positional deviation after correction varies. Therefore, according to the present invention, it is possible to obtain the number and combination of child boards that minimize the maximum absolute value of the positional deviation amount after correction, and to further improve the positioning accuracy of the multi-sided board with respect to the reference position. Is possible.
First, each sub-board is sequentially excluded, and a combination with the minimum absolute value of the positional deviation after correction is searched for. If the minimum value is sufficiently small, the reference mark should be ignored. When the number of sub-boards is determined to be one and the minimum value cannot be said to be sufficiently small, it is desirable to exclude the two sub-boards and perform the same thing.
The feature of this section is effective when, for example, the reference mark or the sub board that maximizes the positional deviation in the X-axis direction and the positional deviation in the Y-axis direction are different.
(6) The multi-sided substrate position correcting method according to any one of (1) to (5), wherein the plurality of sub-substrates is three or more.
Even when there are two sub-boards, the inventions of the items (1) to (5) can be applied. However, as the number of sub-boards increases, the variation in misalignment increases, and it is usually difficult to reduce misalignment for any of the sub-boards. By ignoring a reference mark having a particularly large size, it is particularly effective to improve the positioning accuracy of the sub board even if there are three or more sub boards.
If there are two child boards, half of the multi-sided board is wasted if the reference marks are ignored, but if there are three or more child boards, there are some child boards where the reference marks are ignored. However, it is often less than half of the number of all the sub-boards, and even when the yield of the material is reduced, the effect of the present invention for improving the working accuracy can be effectively enjoyed for some of the sub-boards. There are many.
(7) The multi-sided substrate position correcting method according to any one of (1) to (6), wherein the multi-sided substrate is obtained by integrating the plurality of child substrates in a line.
When a plurality of sub-boards are integrated in a row, the multi-sided board has a long longitudinal shape in the direction in which the plurality of sub-boards are arranged, and misalignment tends to increase in that direction. It is effective to apply the present invention to the substrate position correction.
It is not indispensable that a plurality of sub-boards are integrated in a row. For example, a plurality of sub-substrates may be integrated in a row, and a multi-sided substrate is integrated in a desired shape, for example, a square shape. May be.
(8) A screen printing machine for printing a printing material on a circuit board through a screen,
A substrate support device for supporting a multi-sided substrate formed by integrally bonding a plurality of sub-substrates;
A screen support device for supporting the screen;
A contact and separation device for contacting and separating the screen supported by the screen support device and the multi-sided substrate supported by the substrate support device by relatively moving the screen support device and the substrate support device;
An imaging device that images a plurality of reference marks provided corresponding to each of the plurality of sub-substrates of the multi-sided substrate in a state where the screen is separated from the multi-sided substrate;
A reference mark position calculation unit that calculates the position of each of the plurality of reference marks based on the images of the plurality of reference marks captured by the imaging device;
Of the plurality of reference marks corresponding to each of the plurality of child substrates calculated by the reference mark position calculation unit, the position of at least one child substrate whose position is particularly greatly shifted from the reference marks of the other child substrates A misregistration correction unit that ignores a fiducial mark and corrects a misregistration relative to a reference position of the multi-sided substrate;
A squeegee device that moves on the screen and applies the printing material to a predetermined portion of the multi-sided substrate from a plurality of through holes provided in the screen.
The screen and the multi-chamfer substrate are contacted and separated at least when the squeegee presses the screen to apply the printing agent onto the multi-chamfer substrate, and the screen comes into contact with the multi-chamfer substrate at the portion pressed by the squeegee. Considered contacted by the device.
The reference position may be a preset position or a screen position.
The features described in the items (3) to (7) can be applied to the screen printer of this item.
In the screen printing machine described in this section, for example, the effects of the invention or the operations and effects described in the section (2) can be obtained.
(9) The screen printer according to (8), further including a subsequent work unnecessary child board storage unit that stores a subsequent work unnecessary child board that is a child board corresponding to the reference mark ignored in the misalignment correction unit.
Although the printing material is printed even on the sub-board on which the reference mark is ignored, since the misregistration is not corrected for the sub-board, the deviation between the printing location and the printed printing material is large, and the subsequent work, For example, it is useless to perform mounting of electronic components, inspection of mounting state, and the like. For this reason, the child board in which the reference mark is ignored is stored in the subsequent work unnecessary child board storage unit as the subsequent work unnecessary child board so that the information can be used.
In addition, when it is possible to prevent printing, such as a child board where the reference mark is ignored is one of both ends arranged in a row, the printing is not performed. It is desirable to do.
(10) Subsequent work unnecessary child board information supply unit that supplies the subsequent work unnecessary child board information stored in the subsequent work unnecessary child board storage unit to the subsequent work machine, and the subsequent work unnecessary child board does not require subsequent work. The screen printing machine according to item (9), including at least one of a work unnecessary mark marking device for attaching a work unnecessary mark indicating that
The subsequent work unnecessary child board information supply unit can supply only the information of the subsequent work unnecessary child board, or it can be supplied together with the identification information of the multi-sided board to which the subsequent work unnecessary child board belongs. is there.
The information on the subsequent work unnecessary child board stored in the subsequent work unnecessary child board storage unit is cleared after the operation of at least one of the subsequent work unnecessary child board information supply unit and the work unnecessary marking device. However, it may be stored in association with the identification information of the multi-sided substrate. The identification information may be substrate identification information that can identify each single-sided substrate, or lot identification information that can identify a production lot to which the multiple-sided substrate belongs. In any case, it is useful as management information for the production process of a multi-sided substrate.
When the screen printing machine described in this section includes a subsequent work unnecessary child board information supply unit, the information supply can identify a child board that does not require work in the subsequent work machine of the screen printing machine, and the work unnecessary marking device. For example, the work unnecessary mark detection device of the subsequent work machine checks whether or not a work unnecessary mark is attached to the slave board, and the execution of the unnecessary work is automatically stopped.
The information on the sub-work unnecessary board is not limited to use in various operations performed after screen printing, and can be used, for example, to eliminate the cause of such a large displacement that the reference mark is ignored. For example, when a sub-board whose reference mark is ignored occurs for a plurality of multi-sided boards of the same type, the misalignment depends on whether the sub-board is the same sub-board or a different sub-board. Estimate the cause, modify the original plate for forming the wiring pattern on the multi-sided board, or improve the multi-sided board positioning device when forming the wiring pattern on the multi-sided board, etc. It can be used to improve the positioning accuracy with respect to.
The work-unnecessary marking device can be, for example, a mark drawing device that draws work-unnecessary marks on a multi-sided substrate, or a mark sticking device that sticks a seal-like work-unnecessary mark on a multi-sided substrate.

  Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. In addition to the following examples, the claimable invention can be practiced in various modifications based on the knowledge of those skilled in the art, including the aspects described in the above [Aspect of the Invention] section. .

  FIG. 1 illustrates a screen printing machine as an embodiment of the claimable invention. The screen printing machine includes a frame 10, a substrate transport device 12 (see FIG. 2), a substrate support device 14, a substrate support device lifting device 16, a screen support device 18, a squeegee device 20, an imaging device 22, and a control device 24 (FIG. 2). Etc.).

  The substrate transfer device 12 includes, for example, a substrate transfer conveyor, and transfers the circuit board 30 in the horizontal direction in FIG. 1 in the horizontal direction, which is parallel to the solder printing surface of the circuit board 30. 14 and then unload from the substrate support device 14. The board transfer device 12 also transfers the circuit board 30 in a posture in which the longitudinal direction is parallel to the board transfer direction. The substrate support device 14 is a substrate holding device in this embodiment, and includes a support pin and a support pin support member. The substrate support device 14 supports the circuit board 30 from below and includes a substrate clamp device. The circuit board 30 is sandwiched from a direction parallel to the solder printing surface and perpendicular to the board conveying direction, and is held horizontally.

  In the present embodiment, the substrate support device lifting device 16 includes a substrate support device lifting motor 34 as a drive source, and a feed screw mechanism 36 (see FIG. 2) including a ball screw and a nut, which is a kind of feed screw. The substrate support device 14 is moved up and down to move toward and away from the screen support device 18 to bring the circuit board 30 supported by the substrate support device 14 into contact with the screen 40 supported by the screen support device 18. The contact position or the printing position where the cream solder as the printing material is printed is separated from the screen 40 and is released from the support by the substrate support device 14 and can be transported by the substrate transport device 12. Raise and lower to position. The substrate support device 14 is provided on the substrate support device lifting / lowering device 16 via a misalignment correction device 44 (see FIG. 2). The misalignment correcting device 44 is a surface parallel to the direction parallel to the substrate transport direction (X-axis direction) and the solder print surface of the circuit board 30 supported by the substrate support device 14. In the horizontal plane, they are moved in the Y-axis direction, which is a direction perpendicular to the X-axis direction, and rotated around an axis line perpendicular to the solder printing surface and perpendicular to the Z-axis direction.

  The screen support device 18 is provided on the frame 10 at a position above the substrate support device 14. The screen 40 is held by a rectangular screen frame 48, is horizontally supported by the screen support device 18 in the screen frame 48, and is positioned directly above the circuit board 30 supported by the substrate support device 14. Although not shown in the drawing, a plurality of, in this embodiment, two reference marks are provided on the screen 40 at positions diagonally separated from each other, and cream solder, which is a kind of highly viscous fluid as a printing material, is provided. A large number of through holes to be filled are provided corresponding to the wiring patterns formed on the circuit board 30.

  As shown in FIG. 1, the squeegee device 20 is provided on the frame 10 and is located above the screen support device 18. In this embodiment, the squeegee device 20 is a release type, and each of the squeegee heads 50 has only one pair of squeegee heads 50 (only one is shown in FIG. 1). A squeegee head lifting device 52 and a squeegee head moving device 54 for moving the squeegee head 50 in a direction parallel to the screen 40 supported by the screen support device 18 are included. The squeegee head moving device 54 includes a moving member 56, a squeegee head moving motor 58 as a driving source, a feed screw mechanism 60 including a ball screw and a nut (see FIG. 2), and the moving member 56 is used as a pair of guides. The pair of squeegee heads 50 mounted on the moving member 56 are moved by moving them in the Y-axis direction while being guided by the guide rails 62.

  In this embodiment, the image pickup device 22 includes a CCD camera 70 and is moved by an image pickup device moving device 72 to any arbitrary plane parallel to a horizontal plane that is parallel to the solder print surface of the circuit board 30 supported by the board support device 14. Moved to position. The imaging device moving device 72 includes an X-axis direction moving device 74 and a Y-axis direction moving device 76. The X-axis direction moving device 74 includes a moving member 78, an X-axis direction moving motor 80 as a driving source, a feed screw mechanism 82 (see FIG. 2) including a ball screw and a nut, and the moving member 78 is a pair of guide rails. It is moved in the X-axis direction while being guided by 84. The Y-axis direction moving device 76 is provided on the moving member 78, and similarly to the X-axis direction moving device 74, includes a moving member 86, a Y-axis direction moving motor 88, and a feed screw mechanism 90 (see FIG. 2). The member 86 is moved in the Y-axis direction while being guided by the guide rail 92. The CCD camera 70 is provided on the moving member 86, and an arbitrary space in the space between the circuit board 30 supported by the substrate support device 14 located at the lower end position and the screen 40 supported by the screen support device 18 is provided. Moved to position. The imaging device 22 is configured similarly to the imaging device described in, for example, Japanese Patent Application Laid-Open No. 2000-238233, and can capture the circuit board 30 and the screen 40, respectively.

  As shown in FIG. 2, the control device 24 includes a control unit including a control computer 100 and an input / output unit 102, and a plurality of drive circuits 104. The control computer 100 includes a CPU 106, a ROM 108, a RAM 110, and a bus for connecting them. An image processing computer 112 and an input device 114 are connected to the input side of the input / output unit 102. The substrate transfer device 12, the notification device 116, and the like. Is connected to the output side of the input / output unit 102 via the drive circuit 104. The notification device 116 is constituted by, for example, a sound generation device, an image display device, or the like, and is a device that notifies an operator of information or the like. The input / output unit 102 is also connected to an adhesive applicator 118 that forms an electronic circuit production line together with the screen printing machine, which is a subsequent working machine that performs work on the circuit board 30 immediately after the screen printing machine. For example, data is exchanged by communication. The motor constituting the drive source of the apparatus constituting the screen printing machine is an electric rotary motor capable of accurately controlling the rotation angle, and is constituted by a servo motor provided with an encoder. The ROM 108 stores various programs and data such as a main routine (not shown), a reference mark ignore board determination routine and a cream solder printing routine shown in the flowchart of FIG.

  FIG. 4 shows an example of the circuit board 30 to be printed in the screen printing machine. The circuit board 30 is a multi-sided board in which a plurality of sub-boards are integrally coupled. For example, four sub-boards 120 are integrated in a row, and an electronic component is placed on each of the four sub-boards 120. After mounting and forming an electronic circuit, it is separated into four substrates. Hereinafter, the circuit board 30 is referred to as a multi-sided board 30.

  Although not shown, wiring patterns are formed on each of the four sub-boards 120. These wiring patterns may be the same or different from each other. A plurality of reference marks 122 are provided corresponding to each of the four sub-boards 120 in the present embodiment. Each of the two reference marks 122 is provided at a position separated on a diagonal line of the daughter board 120, and in this embodiment, the planar view shape is circular. The multi-sided substrate 30 is further provided with a two-dimensional code 124 as an information recording unit. In the two-dimensional code 124, for example, a production lot number of the multi-planar substrate 30 and a substrate ID as substrate identification information that can identify each multi-planar substrate 30 one by one are recorded. The two-dimensional code 124 is imaged by the imaging device 22 and the recorded content is read based on the imaging data.

  The screen 40 for printing cream solder on the multi-sided board 30 has through holes formed at positions corresponding to the lands of the respective wiring patterns of the four child boards 120, and cream solder is once applied to the four child boards 120. Can be printed. The screen 40 is provided with four printing patterns, which are sets of through holes, arranged in a line.

  The multi-sided board 30 is supported by the board support device 14 in the same manner as a circuit board in which a plurality of sub-boards are not integrated, is brought into contact with the screen 40, and cream solder is printed by the squeegee device 20. After the multi-sided substrate 30 is carried into and supported by the substrate support device 14 by the substrate transport device 12, the imaging device is in a state where the substrate support device 14 is positioned at the lower end position and the screen 40 is separated from the multi-sided substrate 30. 22, all the reference marks 122 of the four sub-boards 120 are imaged, and based on the imaging data, a misalignment correction amount for correcting misalignment of the multi-sided board 30 with respect to the screen 40 is obtained. In the present embodiment, when there is a sub-board 120 in which the corresponding reference mark 122 among the plurality of sub-boards 120 is particularly greatly displaced from the reference mark 122 of the other sub-board 120, the reference mark 122 of the sub-board 120 is present. The amount of misalignment correction is obtained by ignoring.

  In the correction of the positional deviation between the multi-planar substrate 30 and the screen 40, the positional deviation of the reference mark provided on the screen 40 is also taken into consideration. The screen 40 is, for example, immediately after being supported by the screen support device 18 or when a preset condition is satisfied (for example, cream solder printing has been continuously performed on a set number of multi-sided substrates 30), Alternatively, each time the cream solder is printed on the multi-sided substrate 30, the reference mark is imaged by the imaging device 22, the center position of the reference mark is calculated based on the imaging data, the rotational position shift of the screen 40 and the two The average value of the positional deviation amounts in the X-axis and Y-axis directions with respect to each target position of the reference mark, and the average value of the positional deviation amounts in a state where the rotational positional deviation is removed is calculated and stored in the RAM 110. . The imaging device 22 is moved based on the target position data of the reference mark and images the reference mark.

The determination of the child substrate 120 that should ignore the reference mark 122 will be described based on the reference mark ignorant child substrate determination routine shown in FIG. In the present embodiment, for the sake of simplicity, it is assumed that the screen 40 is made with high accuracy and has no expansion or contraction.
The reference mark ignorance substrate determination routine is executed in a state where the substrate support device 14 supports the multi-sided substrate 30 and is positioned at the lower end position. First, step 1 (hereinafter abbreviated as S1. Other steps are also described). In the same manner), two reference marks 122 are imaged by the imaging device 22 for all of the four sub-boards 120. The imaging device 22 is moved based on the reference mark target position data and images the reference mark 122. The target positions of the fiducial marks 122 are positions where the eight fiducial marks 122 are each supposed to be located in a state where the multi-planar substrate 30 having an ideal shape and dimensions is supported by the substrate support device 14 without positional deviation. The data defining the reference mark target position is stored in the ROM 108 or the RAM 110. In addition, the two-dimensional code 124 is imaged by the imaging device 22, and the board ID and the like are acquired.

  After imaging all the reference marks 122, S2 is executed, and after calculating the center positions of all the reference marks 122 based on the image data of the reference marks 122 obtained by the image processing of the image processing computer 112, S3 is executed, and the rotational position deviation of the multi-planar substrate 30 is removed by calculation. In this embodiment, the rotational position deviation is calculated by a method similar to the method described in Japanese Patent Laid-Open No. 2003-209396. If the calculation of the rotational position deviation is schematically described, a straight line (solid line) that minimizes the square of the distances from the actual center positions of all the reference marks 122 calculated based on the imaging of the reference marks 122. The slope of a straight line (referred to as a target straight line) is also obtained from the formula for the target positions of all the reference marks 122 of the multi-planar substrate 30, and the actual straight line and the target The rotational position shift of the multi-planar substrate 30 is calculated by comparing each gradient with the straight line. Then, based on the calculated rotational position deviation and the actual center position of the reference mark 122 obtained by imaging, each center of the reference mark 122 in a state where the multi-sided substrate 30 is rotated and the rotational position deviation is removed. A position (referred to as an actual position after rotation) is calculated. The gradient of the target straight line may be obtained once for the same type of multi-sided board 30. For example, the slope of the target straight line is calculated in advance before the start of the screen printing operation on the circuit board 30, and the ROM 108 or RAM 110 together with the target position of the reference mark 122. And is read out at the time of execution of S3 and used to remove rotational misalignment. Alternatively, after the start of the screen printing work, it is calculated when the first printing work on the circuit board 30 of the same type is executed and is stored in the ROM 108 or the RAM 110 together with the target position. The value may be read from the ROM 108 or the RAM 110 and used.

  Next, S4 is executed, and for each of all the reference marks 122 of the multi-sided board 30, the positional deviation amounts Δx and Δy in the X-axis direction and the Y-axis direction, which are errors in the direction parallel to the solder printing surface, are calculated. . This positional deviation amount is calculated by comparing the actual post-rotation positions of all the reference marks 122 calculated in S3 with the corresponding target positions, and includes positive and negative signs. Next, in S5, the average value ΔAx of the positional deviation amounts in the X-axis direction and the average value ΔAy of the positional deviation amounts in the Y-axis direction of all the reference marks 122 are calculated. Then, in S6, for each of all the reference marks 122, the absolute value of the difference between the positional deviation amount Δx in the X-axis direction and the positional deviation amount Δy in the Y-axis direction, respectively, is calculated. After the calculation, S7 is executed, and it is determined whether or not there is a difference exceeding the allowable range among the absolute values of the differences calculated in S6. For all the reference marks 122, the absolute value of the difference between the positional deviation amount and the average positional deviation amount does not exceed the allowable range in both the X-axis and Y-axis directions. If the mark 122 has no positional deviation exceeding the allowable range and the corresponding reference mark 122 is not significantly different from the reference mark 122 of the other child substrate 120, the determination result in S7 is NO. The routine execution ends.

  Of at least one of the eight reference marks 122 in the X-axis direction and the Y-axis direction, the absolute value of the difference between the positional deviation amount and the average positional deviation amount exceeds the allowable range, and the positional deviation amount is within the allowable range. If there is a reference mark 122 exceeding, the determination result in S7 is YES and S8 is executed, and it is determined whether or not there is one child substrate 120 whose positional deviation amount of the reference mark 122 exceeds the allowable range. . Even if the X-axis direction and the Y-axis direction are combined, if a positional deviation exceeding the allowable range of the reference mark 122 occurs in one child substrate 120, the determination result in S8 is YES and S9 is executed. The child board 120 that has caused the positional deviation is determined to be an ignorant child board that is a child board that should ignore the reference mark 122, and a subsequent work unnecessary child board memory provided in the RAM 110 as a subsequent work unnecessary child board. Remembered. Also in S9, based on the center positions of the reference marks 122 calculated in S2 and the center positions of all the reference marks 122 except for the reference marks 122 of the child board 120 determined as the neglected child boards, in S3. In the same manner as described above, the rotational misalignment of the multi-chamfer substrate 30 is obtained, and after the rotational misalignment is removed, the positional deviation amounts in the X-axis and Y-axis direction of each reference mark 122 and the X-axis of the reference mark 122, An average value of misalignment amounts in each direction of the Y-axis (each misalignment amount in the X-axis and Y-axis directions of the entire multi-sided substrate 30 after the rotational misalignment is removed) is calculated, and a subsequent work unnecessary child substrate memory is calculated. Is memorized.

The subsequent work unnecessary sub-board memory stores various types of information for printing on the multi-sided board 30, for supplying information to the subsequent working machine, and for improving the production process of the multi-sided board 30. Be made.
Information for executing printing on the multi-sided board 30 includes the rotational position shift calculated by excluding the reference mark 122 of the child board 120 determined as the neglected child board as described above, and the X of the reference mark 122. An average value of each positional deviation amount in the axial and Y-axis directions (each positional deviation amount in the X-axis and Y-axis directions of the entire multi-sided substrate 30 after the rotational positional deviation is removed) is stored.
Further, as information common to the supply of information to the subsequent work machine and the improvement of the production process of the multi-planar board 30, information for specifying the subsequent work unnecessary child board (for example, the child board 120 determined as the neglected child board). Is a multi-planar substrate obtained by reading the identification information of the multi-planar substrate 30, for example, the two-dimensional code 124. It is associated with the 30 substrate IDs and the production lot number and stored in the subsequent operation unnecessary child substrate memory.
As information for improving the production process of the multi-sided board 30, the positional deviation amount of all the reference marks 122 and the average value of the positional deviation amounts, in addition to the information specifying the subsequent work unnecessary child board, are included. Information on the difference, information on the absolute value of the difference, and information on the maximum value of the absolute value are stored. The positional deviation amount is a positional deviation amount in a state in which the rotational positional deviation is removed, and these positional deviation amounts and the like are obtained based on the execution of S4 to S6.
After execution of S9, S12 is executed, and subsequent work unnecessary child board information and the like are supplied immediately to the adhesive applicator 118 which is the subsequent work machine, and the execution of the routine ends.

  Regardless of the X-axis direction or the Y-axis direction, when there are two or more child substrates 120 whose absolute value of the difference between the positional deviation amount of each reference mark 122 and the average value of the positional deviation amounts exceeds the allowable range, The determination result in S8 is NO and S10 is executed, and an ignorant child substrate is determined according to a preset rule from two or more child substrates 120 whose positional deviation amount of the reference mark 122 exceeds the allowable range. At the same time, as in S9, the subsequent operation unnecessary child substrate is stored in the subsequent operation unnecessary child substrate memory.

  In the present embodiment, the “pre-set rule” is assumed to be a neglected child substrate, and based on the position of each reference mark 122 of the child substrate 120 other than the assumed neglected child substrate, the same as in S3. The rotational misalignment of the chamfered substrate 30 is obtained, the misalignment amount of each reference mark 122 in each of the X-axis and Y-axis directions in a state where the rotational misalignment is removed, and the X-axis and Y-axis of these misalignment amounts. The average value in each direction is calculated, and it is checked whether the absolute value of the difference between the positional deviation amount and the average value of the positional deviation amounts is all within the allowable range. The rule is that an assumed neglected substrate is determined to be an ignored substrate. When a plurality of sets of neglector substrates in which the positional deviation of the reference mark 122 falls within an allowable range is obtained, it is assumed that the maximum absolute value of the difference is the smallest in the X-axis and Y-axis directions. The neglect substrate is determined to be the neglect substrate.

  First, one neglector substrate is assumed. When the determination result of S8 is NO, two or more sub-boards 120 (the positional shift amount allowable range) in which the absolute value of the difference between the positional shift amount of the reference mark 122 and the average positional shift amount exceeds the allowable range Each of which is referred to as a super substrate 120), and each of the reference marks 122 of all the sub substrates 120 other than the assumed neglect substrate is misaligned in a state where the rotational misalignment is removed. If the absolute value of the difference between the amount and the average value of the positional deviation amounts is all within the allowable range, and the positional deviation of the multi-chip substrate 30 as a whole is corrected, the positional deviation amount of the reference mark 122 is within the allowable range. It is checked whether it fits within. By assuming one neglector board, if the amount of positional deviation of each reference mark 122 of all the child boards 120 excluding the neglector board falls within the allowable range, the assumed ignore board at that time is ignored. It is determined as a sub board. When two or more neglector substrates are determined, it is assumed that the maximum absolute value of the difference between the positional deviation amount of the reference mark 122 and the average value of the positional deviation amount is the smallest among them. The neglect substrate is determined to be the neglect substrate.

  If the position shift amount of the reference mark 122 does not fall within the allowable range even if one assumed ignore child substrate is set, two ignore child substrates are assumed. When there are three or more super-substrates 120, the combination of two neglected substrates is made out of the sub-substrates 120, and the positional displacement amount of the reference mark 122 is allowed for all the combinations. It is checked whether it falls within the range.

  In this way, the number of assumed neglector substrates is increased by one in accordance with the number of superposition substrates 120 in the allowable amount of positional deviation, and a combination of assumed neglected substrates is created, so that the positional deviation of the reference mark 122 is within the acceptable range. Is checked to determine whether the ignorant substrate is included. However, in the present embodiment, the number of child boards 120 determined as the neglected child boards is less than half of the number of all the child boards 120 included in the multi-sided board 30, and the maximum number of neglected elements is less than half. If the positional deviation amount of the reference mark 122 does not fall within the allowable range even if the substrate is assumed, the examination is completed without increasing the number of neglector substrates.

  If the neglector board is determined in S10, as in S9, information for executing printing on the multi-sided board 30, supply of information to subsequent work machines, improvement of the production process of the multi-sided board 30 and the like The common information and the information for improving the production process of the multi-planar board 30 are stored in the subsequent work unnecessary board memory. In S10, as the information for executing printing on the multi-sided board 30, the rotation position deviation calculated previously when the child board 120 determined as the ignorant board is assumed to be the ignorant board and the reference mark 122 is obtained. The average value of each positional deviation amount in the X-axis and Y-axis directions (each positional deviation amount in the X-axis and Y-axis directions of the entire multi-sided substrate 30 after the rotational positional deviation is removed) is stored.

  Whether or not the neglector board 120 is determined, if the examination is completed, S11 is executed to determine whether or not the neglector board is determined. If the ignore board is determined for the multi-chip board 30 for which the ignore board is currently determined by the execution of S10 and the information is stored in the subsequent work unnecessary slave board memory, the determination result of S11 is YES. After S12 is executed, the execution of the routine ends. If the ignore substrate is not determined, the determination result of S11 is NO and S13 is executed, and the positional deviation amount of the reference mark 122 exceeds the allowable range, but the ignore substrate is not determined. This is notified by the notification device 116. The board ID and the like of the multi-sided board 30 are also notified, and based on the notification, for example, the operator can use the multi-sided board 30 for which the neglected board has not been determined as a defective board and discharge it without printing cream solder. An appropriate process is input and instructed by the input device 114, such as calculating and printing the misregistration correction amounts for all the sub-substrates 120 other than the allowable misalignment super substrate 120.

  After execution of the reference mark ignorance board determination routine, cream solder is printed on the multi-sided board 30. At this time, in the multi-planar board 30 on which cream solder is actually printed, there is no positional deviation exceeding the allowable range in the reference mark 122 for any of the child boards 120, and the determination result of S7 is NO and there is no child board. If so, the rotational position shift of the multi-planar substrate 30 calculated in S3, the average value of each positional shift amount in the X-axis and Y-axis directions of the multi-planar substrate 30 calculated in S5, and the rotational position of the screen 40 Based on the deviation and the average value of the positional deviation amounts of the reference marks of the screen 40 in the X-axis and Y-axis directions, the X-axis, Y-axis directions, and Z for aligning the positions of the multi-sided substrate 30 and the screen 40. A misalignment correction amount around the axis is obtained, and the misalignment correction device 44 rotates and moves the substrate support device 14 to correct the misalignment. Position is combined for over emissions 40. When the determination result in S7 is NO, the subsequent work unnecessary child board information is not stored in the subsequent work unnecessary child board memory for the multi-sided board 30 to be actually printed, and the neglected child board is determined. Since there is no notification of the absence, it can be seen that there is no neglector board. Data indicating that there is no neglector board may be stored.

  When the neglector substrate has been determined, a misalignment correction amount for aligning the positions of the multi-sided substrate 30 excluding the neglector substrate and the screen 40 is calculated. The rotational position deviation of the multi-sided substrate 30 calculated in S9 or S10 and stored in the subsequent work unnecessary board memory, the average value of the positional deviation amounts of the reference mark 122 in the X-axis and Y-axis directions, and the screen 40 Displacement correction amounts around the X-axis, Y-axis direction, and Z-axis line are calculated based on the rotational position shift of each of the two reference marks on the screen 40 and the average value of the respective position shift amounts in the X-axis and Y-axis directions. The positional deviation is corrected by the positional deviation correction device 44.

  Regardless of the presence or absence of the neglector substrate, after the positional deviation between the multi-planar substrate 30 and the screen 40 is corrected, the substrate support device 14 is raised so that the multi-planar substrate 30 is brought into contact with the screen 40 and the squeegee. 49 is moved on the screen 40 while being in contact with the screen 40, and the cream solder placed on the screen 40 is pushed into the through-hole while moving, and the screen 40 is pressed against the multi-sided substrate 30 to provide cream solder. Is applied to a predetermined portion of the multi-sided substrate 30. Printing is performed once on the entire surface of the multi-sided substrate 30, and cream solder is also applied to the neglected substrate. After the application, the substrate support device 14 is lowered, and the multi-sided substrate 30 is separated from the screen 40 and carried out by the substrate transport device 12.

  In this way, among the plurality of sub-boards 120, the corresponding reference marks 122 are particularly greatly displaced from the reference marks 122 of the other sub-boards 120, ignoring the reference marks 122 of the sub-board 120 and the multi-planar board 30. By aligning the position with the screen 40, the alignment accuracy is improved as compared with the case where alignment is performed based on the positions of all the reference marks 122. For example, among the four sub-boards 120 arranged in a row, when the positional deviation of the reference mark 122 of the first sub-board 120 relative to the reference mark 122 of the other sub-board 120 is particularly large, all the sub-boards 120 Based on the positional deviation of each of the reference marks 122, the amount of positional deviation correction with respect to the screen 40 of the multi-planar substrate 30 is obtained, and if the position is corrected, as shown by the solid line in FIG. Three child substrates 120 other than the particularly large child substrate 120 (the rightmost child substrate 120 in FIG. 4) are greatly affected by the child substrate 120 having a particularly large positional deviation with respect to the target position indicated by the two-dot chain line. Misalignment and misalignment are not sufficiently resolved. On the other hand, if the reference marks 122 having a particularly large positional deviation are ignored, the positional deviations of the reference marks 122 of the other sub-substrates 120 are small, and therefore, based on the positional deviation correction amount obtained based on those positions. If the alignment is performed, as shown in FIG. 5, the three sub-substrates 120 except the end sub-substrate 120 where the reference mark 122 is ignored are aligned with the target position indicated by the two-dot chain line, and the defective substrate is aligned. Is avoided.

The multi-chamfer substrate 30 on which the cream solder is printed in the screen printing machine is then sent to the adhesive applicator 118 where the adhesive is applied. At this time, if there is a neglected child substrate, the information is supplied to the adhesive applicator 118. Therefore, the adhesive applicator 118 determines whether or not the neglected child substrate information is supplied prior to the start of application. It is checked that the adhesive is not applied to the neglect substrate. As a result, although the cream solder is printed, the deviation from the printing location is large, and it is possible to avoid wasteful operations on the sub-board 120 that cannot be made into a product. The neglector board information and the like are further supplied from the adhesive applicator 118 to a subsequent work machine, for example, an electronic component placement machine, so that the electronic component is not placed on the ignore board.
In the present embodiment, the information stored in the subsequent work unnecessary child board memory is not cleared and stored even after the subsequent work unnecessary child board information or the like is supplied to the subsequent work machine, for example, the multi-chip board 30. Used for production. Information for printing on the multi-sided board 30 may be cleared after the supply. Information stored in the subsequent work unnecessary child board memory, such as subsequent work unnecessary child board information, may be stored in an external storage device, sent to a production management computer, stored, or backed up. May be left behind.

  As is apparent from the above description, in the present embodiment, the portion of the control computer 100 that executes S2 constitutes the reference mark position calculation unit. Further, the portion of the control computer 100 that executes S9 and S10 constitutes a reference mark ignorant substrate determination unit, and ignores the reference mark 122 of the ignorance substrate and calculates the amount of misalignment correction for the screen 40 of the multi-sided substrate 30. The misalignment correction device 44 is controlled based on the misalignment correction amount to form a misalignment correction unit together with a portion for correcting misalignment of the multi-chip board 30, and a portion for executing S12 is a sub-workless substrate. The information supply unit is configured. Further, the substrate support device lifting device 16 constitutes a contact / separation device. Furthermore, the part that acquires the recording content based on the imaging data of the two-dimensional code 124 of the imaging device 22 and the control computer 100 constitutes a board information acquisition unit.

  In the above embodiment, for the sake of simplicity, the screen has been described as being made with high accuracy and without expansion or contraction. However, if there are any, for example, a plurality of sub-boards of the screen are used. A plurality of reference marks are provided for each of the print patterns formed corresponding to each, and the neglected child substrate is determined based on the positional deviation of the reference marks and the positional deviation of the reference marks of the child substrate.

Further, when determining the neglected substrate when there are a plurality of superposition substrates with a positional deviation amount tolerance range, it may be determined in consideration of the magnitude of the absolute value of the difference between the positional deviation amount and the average value of the positional deviation amounts. Good. A child board with a large absolute value of the difference is preferentially assumed to be an ignorant board, and whether or not the misalignment of the reference marks of other child boards is within an allowable range is checked. To decide.
It is also effective to set the positional deviation amount allowable range in two steps or more. For example, an allowable range (allowable range for determining neglected child substrate) that is slightly wider than the original allowable range of misalignment is set, and the child substrate corresponding to the reference mark that does not fall within the allowable range is determined as the reference mark ignored child substrate. is there. Also, the tolerance for determining the neglector board is set in multiple stages, and the reference mark neglector board is decided in order from the one that does not fall within the wide tolerance range, and the misregistration amount of the other child boards is the original misalignment tolerance. If it falls within the range, the determination step of the reference mark ignorant substrate is terminated. If not, the same step is executed for the second largest ignorant substrate determination allowable range.
More simply, all the child boards whose absolute value of the difference between the positional deviation amount of each reference mark and the average value of the positional deviations is out of the allowable range can be determined to be neglected child boards.

Further, the subsequent work unnecessary sub-board information supply unit may supply only the information for specifying the sub board that does not require the subsequent work to the subsequent work machine. This information is supplied as information about the multi-planar substrate to be sent out when the multi-planar substrate is sent out to the next work unit after the work is finished in the work unit.
Further, the identification information of the multi-sided board may be, for example, printing order information indicating what number of the same type of multi-sided board on which the cream solder is printed is printed.

  Furthermore, a tag chip may be provided on the multi-sided substrate as an information recording unit. In this case, when the neglected child board is determined, the subsequent work unnecessary child board information can be stored in the memory of the tag chip and can be read and used later by the information reading device.

  Further, the substrate transport device may transport the circuit board in a posture in which the longitudinal direction is perpendicular to the substrate transport direction.In this case, for example, the information for specifying the subsequent work unnecessary child substrate is the squeegee device, When the movement direction of the squeegee at the time of printing is provided at right angles to the substrate conveyance direction, it can be information including the number of child substrates from the upstream side or the downstream side in the squeegee movement direction.

  Further, the subsequent work unnecessary child board information may be supplied not only to the work immediately after the work machine on which the subsequent work unnecessary child board is determined, but also to each of all subsequent work machines.

  The claimable invention is a working machine other than a screen printing machine, and can be applied to position correction of a multi-sided board in a working machine that performs work on all of a plurality of sub-boards of a multi-sided board at once.

It is a front view which shows schematically the screen printer which is one Example of claimable invention. It is a block diagram which shows notionally the control apparatus of the said screen printer. It is a flowchart which shows the reference mark ignorance board | substrate determination routine memorize | stored in ROM of the computer which comprises the main body of the said control apparatus. It is a figure which shows the relationship between the position of a sub-board | substrate in the multi-surfaced board | substrate with which the position was correct | amended based on the position of each reference mark of all the sub-boards, and a target position. It is a figure which shows the relationship between the position of the sub-board | substrate of a multi-sided board | substrate when a reference mark ignorant board | substrate determination routine is determined by the said reference mark ignorance board | substrate determination routine, and position correction is performed, and a target position.

Explanation of symbols

  14: Substrate support device 18: Screen support device 20: Squeegee device 22: Imaging device 24: Control device 30: Circuit board (multi-sided board) 40: Screen 100: Control computer 120: Sub board 122: Reference mark

Claims (5)

A method of correcting a positional deviation with respect to a reference position of a multi-sided board formed by integrally joining a plurality of sub-boards,
A reference mark corresponding to each of the plurality of sub-substrates is provided, and among the plurality of sub-substrates, the reference mark corresponding to at least one sub-substrate is significantly shifted from the reference mark of the other sub-substrate. A method for correcting the position of a multi-sided substrate, wherein the position of the multi-sided substrate is corrected while ignoring the mark.   The substrate position correcting method is a method of correcting a positional deviation of the multi-chamfered substrate with respect to a screen position for performing screen printing on the multi-chamfered substrate, and ignoring the reference mark of the at least one sub-substrate. If the position correction of the multi-sided substrate is performed so that the positional deviation of all the reference marks of the plurality of sub-substrates with respect to the position of the screen as the reference position becomes the smallest on average, 2. The method for correcting a position of a multi-chip substrate according to claim 1, wherein the correction is performed when a positional deviation exceeding an allowable range occurs in the reference mark.   The substrate position correcting method is a method of correcting the positional deviation of the multi-chamfered substrate with respect to the screen position for performing screen printing on the multi-chamfered substrate, of all the reference marks of the plurality of sub-substrates, A sub-board in which the absolute value of the position shift amount of the reference mark is the largest when the position correction of the multi-planar board is performed so that the position shift relative to the position of the screen as the reference position becomes the smallest on average. 3. The multi-chamfer substrate position correcting method according to claim 1, wherein a positional deviation of the multi-chamfer substrate with respect to the screen is corrected while ignoring the reference mark. A screen printing machine for printing a printing material on a circuit board through a screen,
A substrate support device for supporting a multi-sided substrate formed by integrally bonding a plurality of sub-substrates;
A screen support device for supporting the screen;
A contact and separation device for contacting and separating the screen supported by the screen support device and the multi-sided substrate supported by the substrate support device by relatively moving the screen support device and the substrate support device;
An imaging device that images a plurality of reference marks provided corresponding to each of the plurality of sub-substrates of the multi-sided substrate in a state where the screen is separated from the multi-sided substrate;
A reference mark position calculation unit that calculates the position of each of the plurality of reference marks based on the images of the plurality of reference marks captured by the imaging device;
Of the plurality of reference marks corresponding to each of the plurality of child substrates calculated by the reference mark position calculation unit, the position of at least one child substrate whose position is particularly greatly shifted from the reference marks of the other child substrates A misregistration correction unit that ignores a fiducial mark and corrects a misregistration relative to a reference position of the multi-sided substrate;
A squeegee device that moves on the screen and applies the printing agent to a predetermined portion of the multi-sided substrate from a plurality of through holes provided in the screen. A subsequent operation unnecessary child substrate storage unit for storing a subsequent operation unnecessary child substrate which is a child substrate corresponding to the reference mark ignored in the misalignment correction unit;
The subsequent work unnecessary child board information supply unit that supplies the subsequent work unnecessary child board information stored in the subsequent work unnecessary child board storage unit to the subsequent work machine and the subsequent work unnecessary child board that the subsequent work is unnecessary. The screen printing machine according to claim 4, further comprising at least one of a work-unnecessary marking device that places a work-unnecessary mark to be expressed.

Images