JP2006303876A - Solid state image sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solid state image sensor in which the time required for preliminary imaging is shortened without degrading the image quality of an image obtained by actual imaging. <P>SOLUTION: A part of cross-wired vertical transfer paths 158 and 160 of a solid state image sensor 104 transfer charges vertically upward opposite to other vertical transfer path 152 even if a eight-phase drive signal is imparted similarly to other vertical transfer path 152. In case of preliminary imaging where AE(Auto Exposure)/AF(Auto Focus) processing is performed, charges transferred upward are delivered directly to a charge-voltage converting sections 162 and 164 not through a horizontal transfer path. Consequently, charges can be converted into an electric signal in a short time to produce a preliminary imaging signal. Such a preliminary imaging signal is recorded and a lacking part of the actual imaging signal is interpolated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device used in an imaging apparatus such as a digital camera.

  As a conventional solid-state imaging device, for example, as described in Patent Document 1, there is a cross-wiring of electrodes that supply a drive signal to a vertical transfer path of a solid-state imaging device. When a four-phase or eight-phase drive signal is applied to such a solid-state imaging device, the odd-numbered vertical transfer paths in which electrodes are wired as usual transfer charges downward. On the other hand, even-column vertical transfer paths in which the electrodes are cross-wired transfer charges in the reverse upward direction even though the same drive signal is applied. The charges transferred in the opposite directions to each other in this way are horizontally transferred through the two upper and lower horizontal transfer paths provided in the solid-state imaging device and output.

As described above, Patent Document 1 is a system in which horizontal transfer paths are arranged vertically and the same drive signal is input during imaging, so that charges are simultaneously distributed vertically and the transfer time is shortened.
JP-A-8-125158 JP 2003-218343 A

  However, Patent Document 1 does not particularly take into consideration preliminary imaging that is used for preliminary photometry operation such as AE (Auto Exposure) / AF (Auto Focus) performed before the main imaging.

  It is an object of the present invention to provide a solid-state imaging device that eliminates the drawbacks of the prior art and shortens the time required for preliminary imaging.

  In order to solve the above-described problem, a solid-state imaging device according to the present invention includes a plurality of vertical transfer paths configured by continuously coupled charge coupled devices and a part of the plurality of vertical transfer paths. And a drive signal for transferring charges to charge-voltage conversion means for converting charges coming from some vertical transfer paths into electric signals and to charge-coupled elements constituting a plurality of vertical transfer paths. Drive signals applied to two consecutive charge-coupled elements that constitute a part of a vertical transfer path including a plurality of electrodes, and two consecutive charge couplings that constitute a vertical transfer path other than a part The plurality of electrodes are cross-wired so as to invert the drive signal applied to the element, so that some and some of the vertical transfer paths transfer charges in opposite directions to each other. Part of the vertical transfer path Charge, the charge - characterized in that it is directly output to the voltage conversion means.

  According to the present invention, the charge for preliminary imaging transferred upward in the cross-wired vertical transfer path is directly output to the charge-voltage conversion means without passing through the horizontal transfer path. The transfer time is omitted, and the time required for preliminary imaging is shortened.

  According to the present invention, since a part of the cross-wired vertical transfer path is used for preliminary imaging, a part where an image signal for main imaging is not obtained is used as part of the cross-wired vertical transmission path used for preliminary imaging. The vertical transfer path in the vicinity of the transfer path is interpolated with an electric signal converted from the transferred charge. Alternatively, the preliminary imaging signal read upward in the preliminary imaging is stored, and this is used to interpolate the main imaging signal. By these interpolation processes, the image quality of the actually captured image does not deteriorate despite the speedup of the preliminary imaging.

  Next, embodiments of a solid-state imaging device according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, elements not directly related to the present invention are omitted, and similar elements are described by the same reference numerals.

  FIG. 2 is a block diagram of a digital camera in which an embodiment of a solid-state imaging device according to the present invention is used. The digital camera 10 includes an imaging system 10A that photoelectrically converts incident light from the object scene into an electrical signal. The imaging system 10A includes a lens 102 that collects incident light from the object scene, and an AF (Auto Focus) adjustment unit 106 that moves the lens 102 mechanically back and forth to perform focusing. The imaging system 10A also includes an aperture mechanism 105 that partially blocks incident light collected by the lens 102, and an AE (Auto Exposure) adjustment unit 108 that adjusts the amount of incident light by adjusting the aperture mechanism 105. Further, the imaging system 10A includes a solid-state imaging element 104 that receives incident light through the color filter CF and converts the incident light into electric charges by a photoelectric conversion element such as a photodiode arranged on the imaging surface.

  FIG. 1 is a schematic diagram showing a first embodiment of the solid-state imaging device of FIG. As shown in the figure, the photoelectric conversion element 150 arranged on the imaging surface of the solid-state imaging element 104 has three primary colors of R (Red), G (Green), and B (Blue) according to the color arrangement of the color filter CF. Generate a signal. In FIG. 1, only one photoelectric conversion element that is an R pixel is represented by reference numeral 150 as a representative. In the color filter CF of this embodiment, as shown in FIG. 1, the colors are arranged so that the G columns and the RB columns appear alternately. In addition, the photoelectric conversion elements 150 are arranged in a so-called honeycomb structure in which pixels are shifted from the state of being arranged in a lattice shape.

  As shown in FIG. 1, there are a plurality of vertical transfer paths 152 formed of charge coupled devices (CCDs) between the columns of photoelectric conversion elements. In FIG. 1, each vertical point runway 152 receives charges photoelectrically converted by the photoelectric conversion element 150 located on the left side during imaging and transfers them in the vertical direction, that is, the downward direction in FIG. 1. In this embodiment, the drive signal applied to the vertical transfer path 152 is an eight-phase drive system, and the drive signals applied to the charge coupled devices indicated by the same numbers are as shown by numbers 1 to 8 in FIG. It is common.

  However, the electric charges read from the G column 154 and the RB column 156 indicated by the broken line 166 are transferred through the vertical transfer paths 158 and 160 having the cross wiring characteristic of the present invention. This cross wiring will be described below. As can be seen from the numbers 1 to 8, the drive signals given to the two consecutive charge-coupled elements constituting the vertical transfer paths 158 and 160 that receive charges from the G column 154 and the RB column 156 are the vertical transfer paths 158. , 160 are inverted drive signals given to two consecutive charge-coupled devices constituting the vertical transfer path 152. For example, two charge coupled devices in the transfer path 158 located at positions corresponding to the two charge coupled devices indicated by the numbers 5 and 6 from the top to the bottom in the transfer path 152 This is indicated by numerals 6 and 5. When an 8-phase drive signal is applied to the cross-wired electrodes in this way, the vertical transfer path 152 wired as usual transfers charges in the vertical downward direction, but the cross-wired vertical transfer paths 158 and 160 are Charges are transferred vertically upward. This will be described below.

  FIG. 3 is a diagram of potentials formed in the respective transfer paths by the same 8-phase drive signal applied to the vertical transfer path 152 wired as usual in FIG. 1 and the vertical transfer path 160 cross-wired. is there. These transfer paths 152 and 160 both read and transfer charges from the RB column on the left side of them. Blocks 152 and 160 shown in the upper part of FIG. 3 indicate electrodes v1 to v8 that supply drive signals to the charge coupled devices 1 to 8 constituting the vertical transfer paths 152 and 160 of FIG. The two potential diagrams at times t0 to t7 below are formed by the drive signals v1 to v8 given to the charge coupled devices 1 to 8 constituting the vertical transfer paths 152 and 160, respectively.

  First, as an initial state, at time t0, field shift pulses are applied to the odd-numbered electrodes v1, v3, v5, v7, and the numbers 1, 3, 5, If there is a photoelectric conversion element on the left side of the charge coupled device 7, the field-shifted charge from the photoelectric conversion element is accumulated in the potential hole. In the case of FIG. 3, charges are field-shifted from the RB photoelectric conversion elements to the charge-coupled elements 1 and 5 by the field shift pulse applied to the electrodes v1 and v5 in the vertical transfer path 152 wired as usual. On the other hand, in the cross-wired vertical transfer path 160, the electric field is shifted from the RB photoelectric conversion element to the charge coupled devices 3 and 7 by the field shift pulse applied to the electrodes v3 and v7.

  Then, as the time transitions from time t1 to time t7, the charges are transferred from left to right in FIG. 3, that is, from top to bottom in FIG. On the other hand, in the cross-wired vertical transfer path 160, charges are transferred in the opposite direction from right to left in FIG. 3, that is, from bottom to top in FIG.

  As shown in FIG. 1, the cross-wired vertical transfer paths 158 and 160 are directly connected to charge-voltage conversion units 162 and 164 arranged in the upward direction where they output charges. The charge-voltage converters 162 and 164 are devices that convert electric charges into electric signals having voltages corresponding to the electric charges. The term “directly” as used in the present invention means not via a horizontal transfer path. That is, charges coming from the cross-wired vertical transfer paths 158 and 160 are not transferred horizontally, but are immediately converted into electrical signals and output from the solid-state imaging device. The transfer time is shortened by the charge transferred through 152 downward and further transferred through the horizontal transfer path.

  FIG. 4 is another schematic diagram of the solid-state imaging device 104 shown in FIG. 1, and is a diagram showing the positions where the cross-wired vertical transfer paths 158 and 160 are arranged. As shown in FIG. 4, the cross-wired vertical transfer paths 158 and 160 may be arranged at the center of the solid-state image sensor 104.

  Hereinafter, returning to FIG. 2, the description of the configuration of the digital camera in which the embodiment of the solid-state imaging device according to the present invention is used will be continued. The digital camera 10 includes an analog-to-digital (A / D) converter 112 that converts an analog image signal into a digital image signal, preliminary photometry using a preliminary imaging signal, and interpolation and compression for the main imaging signal obtained in the main imaging. A signal processing unit 114 that performs various signal processing such as expansion / decompression processing.

  FIG. 5 is a detailed block diagram of the signal processing unit 114 of FIG. The signal processing unit 114 is connected to the two output signal lines 116 and 117 from the A / D conversion unit 112. The signal line 116 outputs an image signal read out from the solid-state imaging device 104 in the movie mode among the camera modes described later. On the other hand, the signal line 117 outputs a preliminary imaging signal read out above the solid-state imaging device 104 in the AE mode 182 and AF mode 184 described later, and an image signal read out from the solid-state imaging device 104 in the main imaging mode following them. To do.

  FIG. 6 is a schematic diagram showing the transition of the operation mode of the digital camera 10 in time series. The digital camera 10 is automatically in the movie mode 180 when imaging is possible. In the movie mode 180, since it is necessary to quickly frame the scene as a moving image on the display unit 124 described later, charges are not read out from all the photoelectric conversion elements of the solid-state image sensor 104, and are limited to a certain extent. The charge is read from only the photoelectric conversion element. For example, the system control unit 12 moves the drive signal generation unit 10C so that the field shift pulse for reading out charges from the photoelectric conversion element to the vertical transfer path is different from the case of all pixel reading at the time of the main imaging with four intervals. A movie mode is realized by performing thinning readout by a method such as applying only to electrodes v4 and v8 indicated by multiples. The thinned and read image signal passes through the signal line 116 from the A / D conversion unit 112 and is directly transferred to the digital signal processing device 192 of the signal processing unit 114.

  Here, the release shutter switch 128 will be described. The release shutter switch 128 is a button that has a stroke of two steps and transmits a signal that becomes a trigger when imaging is performed to the system control unit 12 described later. Timing T1 in FIG. 6 is a point in time when release shutter switch 128 shown in FIG. 2 is half-pressed, that is, up to the first stroke. At this time, the system control unit 12 that senses that the release shutter button 128 is half-pressed changes the mode from the movie mode to the AE mode 182 and shifts to preliminary imaging.

  In the AE mode 182, some vertical transfer paths 158 and 160 included in the solid-state imaging device 104 in FIG. 1 are cross-wired. Therefore, in the AE mode 182 and the subsequent AF mode 184, the vertical transfer paths 158, Only the preliminary imaging signal converted from the charge transferred upward through 160 is output to the A / D converter 112 through the signal line 118, digitized, and further processed through the signal line 117. The data is output to the unit 114. The preliminary imaging signal is recorded in the interpolation unit 190 of the signal processing unit 114.

  Although not shown, the interpolation unit 190 has a RAM (Random Access Memory) inside, and records a preliminary imaging signal in the RAM (Random Access Memory). On the other hand, in the AE mode 182 and the AF mode 184, charges transferred downward through the vertical transfer path 152 wired as usual are transferred to the substrate along the vertical transfer path 152 or in the horizontal transfer path 170. It can be discarded.

  In addition to being recorded in the RAM of the interpolation unit 190, the preliminary imaging signal is naturally used for preliminary photometry, and is therefore sent to the digital signal processing unit 192. In the AE mode 182, the digital signal processing unit 192 uses information on all colors of R, G, and B among the preliminary imaging signals converted from the charges transferred through the crossed vertical transfer paths 158 and 160, Perform photometry. The signal processing unit 114 sends information related to the luminance of the preliminary imaging signal measured by the digital signal processing unit 192 to the system control unit 12, and the system control unit 12 sends the information to the AE adjustment unit 108 of the imaging system 10A according to this information. An instruction signal is output, and the AE adjustment unit 108 moves the aperture mechanism 105 to perform AE adjustment.

  Further, in the AF mode 184 following the AE mode 182, the digital signal processing unit 192 performs photometry using the information of the color G that is the preliminary imaging signal converted from the transferred charge through the cross-wired vertical transfer path 158. . This is because when performing AF adjustment, only the information of the color G that occupies about 70% of the luminance information is sufficient. The signal processing unit 114 sends information related to the luminance of the color G in the preliminary imaging signal measured by the digital signal processing unit 192 to the system control unit 12, and the system control unit 12 performs AF of the imaging system 10A according to this information. An instruction signal is output to the adjustment unit 106, and the AF adjustment unit 106 moves the lens 102 to perform AF adjustment.

  Timing T2 in FIG. 6 is a time point when the release shutter switch 128 shown in FIG. 2 is fully pressed, that is, up to the second stroke. Accordingly, the system control unit 12 switches the digital camera 10 from the AF mode 184 to the main imaging mode 186. In the main imaging mode 186, only the charges transferred downward through the vertical transfer path 152 wired as usual are further transferred horizontally through the horizontal transfer path 170 and converted into an electric signal by the charge-voltage converter 172. The signal is digitized by the A / D converter 112 and output as a main imaging signal through the signal line 117. The main imaging signal is also recorded in the RAM of the interpolation unit 190, like the preliminary imaging signal.

  Since the main imaging signal recorded in the RAM of the interpolation unit 190 is the signal read upward in the preliminary imaging, the image signal is missing at the position corresponding to the cross-wired vertical transfer paths 158 and 160. Yes. Therefore, the interpolation unit 190 interpolates the main imaging signal using the preliminary imaging signal already recorded in the RAM in the AE / AF mode in accordance with the instruction signal 192 given from the signal generation unit 120. The method of using the preliminary imaging signal is a first interpolation method performed by the interpolation unit 190. Since the preliminary imaging signal is a signal before the preliminary imaging operation is performed, the signal is not ideal compared to the main imaging signal, but it is used for interpolation on a limited column of cross-wired vertical transfer paths. Is helpful enough. By this interpolation, the present invention does not cause deterioration in image quality even though the preliminary operation including AE / AF adjustment is speeded up.

  FIG. 7 is a conceptual diagram showing a second interpolation method different from the first interpolation method described above. The interpolation unit 190 adopts this second interpolation method that interpolates a missing portion of an image signal with an image signal obtained from neighboring pixels, instead of the first interpolation method that performs interpolation using a preliminary imaging signal. May be. As shown in FIG. 7, since the charge obtained from the G pixel 200 is transferred upward along the cross-wired vertical transfer path 158 and converted into a preliminary imaging signal, a book at a position corresponding to the G pixel 200 is obtained. The imaging signal is missing. Therefore, the main imaging signal at a position corresponding to the G pixel 200 is obtained by converting the charge obtained from the right and left G pixels 202 and 204 closest to the interpolation target pixel 200 as indicated by solid arrows 206 and 208. Interpolate according to the average value of the signal.

  Similarly, as shown in FIG. 7, the charges obtained from the R pixel 210 and the B pixel 212 are transferred upward along the cross-wired vertical transfer path 160 and converted into a preliminary imaging signal. The main imaging signal at a position corresponding to the pixel 210 and the B pixel 212 is missing. Therefore, the main imaging signals at positions corresponding to the R pixel 210 and the B pixel 212 are the same in the lower left and upper right nearest to the interpolation target pixels 210 and 211, as indicated by dotted arrows 214, 216, 218, and 220. Interpolation is performed by average values of the main imaging signals obtained by converting the charges obtained from the color pixels 222, 224 and 226, 228, respectively.

  FIG. 8 is a schematic view showing a second embodiment of the solid-state imaging device of FIG. Hereinafter, the solid-state imaging device 250 of FIG. 8 will be described only with respect to differences from the first embodiment shown in FIGS. 1 and 4. As shown in FIG. 8, the solid-state imaging device 250 in FIG. 8 has two vertical transfer paths 158A / 160A, 158B / 160B, 158C / This is different from the first embodiment in that it has 160C and has two rows of cross-wired vertical transfer paths 158 and 160 in the center. As described above, the number of cross-wired two columns of vertical transfer paths is not limited to one, and a plurality of vertical transfer paths may be provided as long as they are appropriately separated from each other.

  Further, in FIG. 8, as in FIGS. 1 and 4, the charge-voltage converters 162 </ b> A / 164 </ b> A, 162 </ b> B / 164 </ b> B, 162 </ b> C <b> 164 </ b> C that convert the output charges into electrical signals are provided for each of the columns arranged in a cross arrangement. Is provided. However, the charges from the cross-arranged columns are also output to the signal line 262 connected to the only charge-voltage converter 260. The charge-voltage converter 260 is provided for use in the AE mode. Then, in the AE mode, all color information is mixed before entering the conversion unit 260. However, since the AE is integrated by the signal processing unit, there is no problem in the arrangement of signals.

  Further, the system control unit 12 determines which of the charge-voltage conversion units the solid-state imaging device 250 has to output charges from which charge-voltage conversion unit to the output line 118 to the A / D conversion unit 112. You can decide freely. For example, in the AE mode, the electrical signals output from the charge-voltage converters 162A / 164A, 162B / 164B, 162C / 164C are discarded, and only the electrical signals output from the charge-voltage converter 260 for AE are used. The AE process can be executed by outputting to the A / D converter 112. The system control unit 12 refers to the integrated value stored in the RAM (not shown) of the signal processing unit 114, adjusts the exposure by the AE adjustment unit 108 until the value becomes preferable, and continues the AE mode.

  When the integrated value stored in the RAM becomes preferable, the system control unit 12 switches to the AF mode. That is, this time, electric signals are output from the six charge-voltage conversion units 162A and 164A, 162B and 164B, and 162C and 164C for AF. In other words, an electrical signal is sent to the RAM while maintaining the order of the charges transferred through the vertical wiring paths crossed. Then, using the RAM as a work area, the AF adjustment unit 106 adjusts the lens 102 until the signal charge value is favorable, and the AF mode may be continued.

  Returning to FIG. 2 again, the description of the configuration of the digital camera 10 is continued. The digital camera 10 has a drive signal generation unit 10C. The drive signal generation unit 10C is a device that provides a drive signal to the solid-state imaging device 104 according to an instruction from the system control unit 12. The drive signal generation unit 10C includes a signal generation unit 120 and a driver unit 122 therein. The signal generation unit 120 is a device that gives an operation signal and other instruction signals to the image processing system devices of the A / D conversion unit 112 and the signal processing unit 114. On the other hand, the driver unit 122 is a device that provides a drive signal to the solid-state image sensor 104.

  The digital camera 10 has a signal output system 10D. The signal output system 10D is a device that records and displays a captured image. The signal output system 10D includes a display unit 124 such as a liquid crystal display (LCD) and a recording / reproducing unit 126. The display unit 124 is a display that displays the scene as a rough moving image in the movie mode, and reproduces and displays the captured image. The recording / reproducing unit 126 is a memory that records the image signal that has been subjected to various digital signal processing in the signal processing unit 114.

  The digital camera 10 has a system control unit 12. The system controller 12 serves as a central processing unit that controls all devices in the camera 10.

  The operation of the embodiment according to the present invention configured as described above will be described below. First, when the digital camera is turned on, the movie mode 180 shown in FIG. 6 is automatically set. In the movie mode, by thinning out and reading out charges from only certain limited photoelectric conversion elements of the solid-state imaging element 104, the scene is rapidly framed on the display unit 124 as a moving image. Since there are few cross-wired vertical transfer paths, in the movie mode, of course, the solid-state image sensor 104 is framed using charges that are transferred vertically downward, and upward through the cross-wired vertical transfer paths. The charge transferred to is not output from the solid-state imaging device 104. After the electric signal converted from the thinned-out charge is output from the output line 118 shown in FIG. 2, it passes through the path of the A / D conversion unit 112 and the signal line 116, and the signal processing unit 114 has the minimum necessary amount. Is displayed on the display unit 124 as a coarse moving image.

  As shown in FIG. 6, at timing T1, when the user half-presses the release shutter button, preliminary imaging is started. First, the AE mode 182 is established. In the AE mode, charges transferred upward in the cross-wired vertical transfer paths 158 and 160 of the solid-state imaging device 104 in FIG. 1 are directly transferred to the charge-voltage conversion units 162 and 164. Output and convert to electrical signal. Thus, since the preliminary imaging signal used for preliminary imaging is not sent to the next process via the horizontal transfer path 170 unlike the main imaging signal, the time required for preliminary imaging is reduced.

  After the preliminary imaging signal is output from the output line 118, the preliminary imaging signal passes through the path of the A / D conversion unit 112 and the signal line 117, and is recorded in the interpolation unit 190 of the signal processing unit 114. At the same time, it is output to the digital signal processing unit 192, and AE adjustment is performed according to the brightness measured here. That is, the system control unit 12 issues an instruction to the AE adjustment unit 108 according to the obtained luminance, and moves the aperture mechanism 105 to execute AE adjustment.

  When the AE adjustment is completed, the AF mode 184 shown in FIG. In this mode, AF adjustment is also performed by the system control unit 12 instructing the AF adjustment unit 106 according to the brightness obtained from the preliminary imaging signal output to the digital signal processing unit 192, and moving the lens 102 to perform AF adjustment. Let it run.

  When the AF adjustment is completed, the main imaging mode 186 is started from the timing T2 when the release shutter button is fully pressed. The system control unit 12 controls the driver unit 122 of the drive signal generation unit 10C to supply a drive signal to the solid-state image sensor 104, and reads out charges from all pixels of the solid-state image sensor 104. This charge is vertically transferred, then horizontally transferred through the horizontal transfer path 170, then converted into an electric signal by the charge-voltage converter 172, and output as a main imaging signal. Note that, at the stage of performing the main imaging, preliminary imaging including AE / AF processing has already been completed, and thus the main imaging signal obtained by the main imaging is an ideal signal.

  After being output from the output line 118, the main imaging signal is stored in the interpolation unit 190 of the signal processing unit 114 through the path of the A / D conversion unit 112 and the signal line 117 in the same manner as the preliminary imaging signal. Is interpolated. The interpolation method may be a first interpolation method that interpolates using a preliminary imaging signal already recorded in the interpolation unit 190, or a second interpolation that interpolates using a signal in the vicinity of the missing portion of the main imaging signal. The method may be used.

  As described above, in the embodiment of the present invention, the charge transferred upward in the cross-wired vertical transfer path is directly output to the charge-voltage conversion unit without passing through the horizontal transfer path. Is shortened. In addition, since the main image signal is interpolated by the interpolation unit 190, the image quality of the image does not deteriorate. The main image signal interpolated by the interpolation unit 190 is subjected to various processes by the digital signal processing unit 192, and then recorded in the recording / reproducing unit 126, and displayed on the display unit 124 as a still image after imaging as necessary. Is done. Thereafter, the digital camera 10 returns again to the movie mode 188 shown in FIG.

  The operation of the embodiment of the present invention is the same when the solid-state image sensor 250 shown in FIG. 8 is used instead of the solid-state image sensor 104 in FIG.

1 is a schematic diagram illustrating a first embodiment of a solid-state imaging device according to the present invention. 1 is a block diagram of a digital camera in which an embodiment of a solid-state imaging device according to the present invention is used. FIG. 2 is a potential diagram showing the same 8-phase drive signal given to a cross-wired vertical transfer path and a normal transfer path wired as usual in FIG. 1. It is another schematic diagram which shows the 1st Example of the solid-state image sensor shown in FIG. FIG. 3 is a detailed block diagram of a signal processing unit in FIG. 2. It is a schematic diagram which shows transition of the operation mode of a digital camera along a time series. It is a conceptual diagram which shows the 2nd interpolation system performed by the interpolation part of FIG. It is a schematic diagram which shows the 2nd Example of the solid-state image sensor by this invention.

Explanation of symbols

10 Digital camera
104, 250 solid-state image sensor
158, 160 Cross-routed vertical transfer path
162, 164 Charge-voltage converter
170 Horizontal transfer path
190 Interpolator

Claims (3)

A plurality of vertical transfer paths composed of charge-coupled devices arranged in series;
A charge-voltage conversion unit that is directly connected to some of the plurality of vertical transfer paths and converts charges coming from the some vertical transfer paths into electrical signals;
A plurality of electrodes for providing a drive signal for transferring charges to the charge coupled devices constituting the plurality of vertical transfer paths;
The drive signal applied to every two consecutive charge-coupled elements that constitute the part of the vertical transfer paths is applied to every two consecutive charge-coupled elements that constitute the vertical transfer path other than the part. The plurality of electrodes are cross-wired so that the signal is inverted,
As a result, the partial and non-part vertical transfer paths transfer charges in opposite directions, and the charges transferred through the partial vertical transfer paths are directly output to the charge-voltage conversion means. A solid-state imaging device. The solid-state imaging device according to claim 1, wherein the device further includes:
Preliminary imaging signal storage means for storing the preliminary imaging signal converted into an electrical signal by the charge-voltage conversion means;
A solid-state imaging device, comprising: interpolation means for interpolating a main imaging signal converted from an electric charge transferred through a vertical transfer path other than the part into an electric signal by the preliminary imaging signal. The solid-state imaging device according to claim 1, wherein the device further includes:
Of the main imaging signal converted from the electric charge transferred through the other vertical transfer path to the electric signal, the electric signal converted from the electric charge transferred through the vertical transfer path in the vicinity of the partial vertical transfer path A solid-state imaging device, comprising: interpolation means for interpolating the main imaging signal using