JP2006289720A - Inkjet recording head and inkjet recording apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inkjet recording head with an electric wiring board, which prevents the crack and leakage of lead wiring seal, which enhances the reliability of corrosion resistance and which prevents a short circuit and an ejection failure, and an inkjet recording apparatus. <P>SOLUTION: The inkjet recording head and the inkjet recording apparatus are characterized as follows: the dummy wiring is constituted so that the quantity of cover plate adhesive near an electric connection part of the electric wiring board and on a protrusion including dummy wiring can be set constant; and close adhesion to a second plate is enhanced by eliminating the swelling of the protrusion. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an ink jet recording head and an ink jet recording apparatus that perform recording by discharging a liquid, and more specifically, protrusions formed at four corners of an opening portion of an electric wiring board configured in the ink jet recording head. This relates to the shape of the dummy wiring.

  The ink jet recording apparatus is a non-impact recording type recording apparatus that can perform high-speed recording and can record on various recording media (paper, OHP sheets, etc.). In addition, there is a feature that noise during recording hardly occurs. For this reason, the ink jet recording apparatus is widely adopted as an apparatus that forms a recording mechanism such as a printer, a word processor, a facsimile machine, and a copying machine.

  As a typical ink discharge method in this ink jet recording apparatus, there is a method using an electrothermal conversion element. In this method, bubbles are generated by the heat generated by the electrothermal transducer, and recording is performed on a recording medium by discharging minute droplets from minute discharge ports using the pressure generated when bubbles are generated. In general, the recording head includes a recording head having discharge nozzles for forming droplets, and a recording liquid supply system for supplying a recording liquid to the recording head.

  An ink jet recording head using an electrothermal conversion element is provided with an electrothermal conversion element in a recording liquid chamber and gives an electric pulse as a recording signal to give thermal energy to the recording liquid, and when the recording liquid is foamed (boiling) ) Bubble pressure is used to eject recording droplets.

  FIG. 6 is a diagram showing a substrate (hereinafter referred to as a recording element substrate) having a general electrothermal conversion element array and a function of discharging a recording liquid. FIG. 6A is a plan view thereof, and FIG. A bottom view and (c) are side views. FIG. 7 is a diagram showing a state in which the recording element substrate shown in FIG. 6 is connected to the electric wiring substrate.

  As shown in FIG. 6, the recording element substrate 601 is formed with a through hole (recording liquid supply port) 608 for supplying the recording liquid from the back surface thereof, and the recording element substrate 601 has a discharge energy for discharging the recording liquid. A plurality of electrothermal conversion elements (not shown) for application are arranged on both sides of the through-hole 608, and a discharge port plate 605 is provided on the recording element substrate 601, and the discharge port plate 605 includes a plurality of discharge port plates 605. A plurality of discharge ports 606 are formed so as to face the electrothermal conversion elements. A plurality of electrodes 609 that are electrically connected to the plurality of electrothermal transducers are formed at both ends of the surface of the recording element substrate 601.

  Further, as shown in FIG. 7, a plurality of electrodes (not shown) provided on the recording element substrate 701 and a plurality of electrode leads 710 provided on the electric wiring substrate 703 are electrically connected by, for example, TAB technology. Thus, the recording element unit 721 is configured. In order to protect against the corrosion due to the recording liquid and the disconnection due to the externally acting force, the second sealant is provided on the upper portion of the electrical connection portion up to the protrusions 720 formed at the four corners of the opening of the electrical wiring board 703. 714 is covered and heat cured.

  Since the second sealing agent 714 is disposed at a position facing the recording sheet, the width (between paper) between the upper surface of the recording sheet to be printed and the upper surface of the second sealing agent 714 is set. The height of the second sealant 714 is defined and the second sealant 714 must be applied at a predetermined height.

  8A and 8B are diagrams showing an example of the configuration of a conventional ink jet recording head provided with the recording element unit 821 shown in FIG. 7, in which FIG. 8A is an external perspective view, and FIG. The partial expanded view of only the electric wiring board of the DD cross section shown to a), the figure (c) is an enlarged view of the dotted-line part shown to Fig.1 (a).

  As shown in FIG. 8A, the recording element unit 821 is bonded and fixed to the upper surface of the first plate 802 with an adhesive (not shown). Further, a second plate 804 having an opening is bonded and fixed to the upper surface of the first plate 802 with an adhesive (not shown), and an electric wiring board 803 is bonded to the upper surface of the second plate 804 with an adhesive (not shown). ). An end portion of the electric wiring board 803 has an external signal input terminal 828 for receiving an electric signal from the main body.

  In order to protect the concave portion 811 formed between the second plate 804 and the recording element substrate 801 and a part of the electrical connection portion between the recording element substrate 801 and the electric wiring substrate 803, the first sealant 812 is used. Applied and heat-cured.

  If the height of the first sealant 812 is not stable and the filling amount is insufficient, the recording liquid scattered during the cleaning of the head during printing or wiping is gradually formed in the concave portion 811 formed between the recording element substrate 801 and the recording liquid. It accumulates in and sticks to thickening. If this thickened recording liquid adheres to the wiper during wiping and further adheres to the ejection port, it causes a failure in stably ejecting recording droplets. Is specified.

  Further, the second sealant 814 is formed at the four corners of the opening of the electric wiring substrate 803 at the electrical connection portion between the electrode (not shown) of the recording element substrate 801 and the electrode lead 810 of the electric wiring substrate 803. Up to 820 applied and covered.

  When the second sealant 814 is applied in the absence of the protrusion 820, the second seal that should be applied to the protrusion 820 due to the thickness of the second sealant 814 applied to the electrical connection portion. Since the end portion of the agent 814 falls on the first sealing agent 812 and becomes thin and the end portion is cracked and peeled off, the end portion of the second sealing agent 814 is prevented from being cracked and peeled off. Therefore, the protrusion 820 is configured.

  As shown in FIG. 8B, the electric wiring substrate 803 includes a dummy wiring 822, a wiring 815, a cover film 816, and a base film 817, and the base film is interposed between the dummy wiring 822 and the wiring 815 and the base film 817. The adhesive 818, the dummy wiring 822 and the wiring 815, and the cover film 816 are bonded with a cover film adhesive 819.

As shown in FIG. 8C, solid-shaped dummy wirings 822 are formed on the protrusions 820 formed at the four corners of the opening of the electric wiring board 803. If the protrusion 820 does not have the dummy wiring 822, the thickness of the protrusion region 833 including the dummy wiring 822 is reduced with respect to the region 829 portion in the vicinity of the electrical connection portion of the electric wiring board. ), When the electric wiring board 803 is bonded and fixed to the second plate 804, a gap is formed between the protrusion 820 and the second plate 804. Thereafter, the first sealant 812 is applied, and when the first sealant 812 wraps around the lower portion of the electrical connection portion, the first sealant 812 enters the gap and the height of the first sealant 812 is increased. Therefore, the dummy wiring 822 illustrated in FIG. 8C is provided.
Japanese Patent Laid-Open No. 10-44441

  However, in the above-described conventional ink jet recording head, the dummy wirings at the protrusions formed at the four corners of the opening of the electric wiring board have a solid dummy wiring configuration as shown in FIG. The escape portion of the cover film adhesive formed on the region of the protrusion including the wiring is eliminated, and the region including the dummy wiring and the region in the vicinity of the electrical connection portion of the electric wiring board in the portion where the second sealing agent is applied. The thickness of the cover film adhesive on the region of the part becomes non-uniform, the thickness of the cover film adhesive in the region near the electrical connection part is thin, and the cover film adhesive on the region of the protrusion including the dummy wiring The thickness of was thick.

  When the adhesive plate is bonded and fixed to the flat second plate in the state of the electric wiring board, the thick portion of the cover film adhesive, that is, the region of the protrusion including the dummy wiring is raised, and the second sealing agent is applied to the raised portion. The applied second sealant was thinner than the prescribed height.

  The second sealing agent applied thinner than the prescribed height may have cracks on the protrusions after thermosetting.

  When an electrical signal is applied to discharge the recording liquid during printing, etc. with this crack in place, the recording liquid enters from the crack, causing corrosion due to the recording liquid to the electrical connection and short circuit via the recording liquid. May occur.

  Furthermore, the electrical wiring board in the region near the electrical connection portion and the second plate cannot be adhered to each other by the thickness of the electrical wiring board, leaving a gap, and the adhesive for joining the electrical wiring board and the second plate extends. If the first sealant is applied in a state where the first sealant is not present, the first sealant enters the gap when the first sealant wraps around the lower part of the electrical connection portion, and the height of the first sealant is stable. I didn't.

  Accordingly, an object of the present invention is to provide a dummy wiring configuration in which the amount of the cover film adhesive in the region of the protrusion including the dummy wiring formed at the four corners of the opening portion of the electric wiring board and the region in the vicinity of the electrical connection portion is constant. Thus, the difference between the thickness of the electrical wiring board in the region near the electrical connection portion and the thickness of the electrical wiring board in the region of the protrusion including the dummy wiring is eliminated, and the electrical wiring substrate is bonded and fixed to the second plate. When the protrusion of the protrusion is eliminated, the second sealant is applied in a uniform thickness, and the second sealant is prevented from cracking after thermosetting, Highly reliable ink jet recording that can prevent the first sealant from entering the gap between the electric wiring board and the second plate in the region near the connecting portion and can stabilize the height of the first sealant. Provide head and ink jet recording apparatus Lies in the fact.

  In order to achieve the above object, the present invention provides an ink jet recording head configured as described in (1) to (2) below.

(1) A recording element substrate having a plurality of recording elements for discharging a recording liquid and an opening into which the recording element substrate is incorporated are formed, and electric energy for discharging the recording liquid to the recording element substrate is formed. An electrical wiring substrate electrically connected to the recording element substrate for applying, a first plate on which the recording element substrate is fixedly held, and an opening through which the recording element substrate is passed, An ink jet recording head having a second plate that is interposed between an electric wiring board and the first plate and fixes and holds the electric wiring board,
The electric wiring board is composed of a cover film, a base film, a cover film adhesive, and a base film adhesive, and has dummy wirings at projections formed at four corners of the opening of the electric wiring board, and the dummy wiring An ink jet recording head having a dummy wiring configuration in which the amount of the cover film adhesive is constant in the region of the projecting portion and the region in the vicinity of the electrical connection portion.

  (2) An ink jet recording apparatus comprising the ink jet recording head according to (1).

  By adopting a dummy wiring configuration in which the amount of the cover film adhesive in the region of the protrusion including the dummy wiring formed in the four corners of the opening portion of the electric wiring board according to the present invention and the region in the vicinity of the electrical connection portion becomes constant, The protrusion when the electric wiring board is bonded and fixed to the second plate by eliminating the difference between the thickness of the electric wiring board in the vicinity of the electrical connection portion and the thickness of the electric wiring board in the region of the protrusion including the dummy wiring. The second encapsulant is applied at a uniform height to prevent cracks after heat curing of the second encapsulant, and the region near the electrical connection portion is eliminated. To provide a highly reliable ink jet recording head capable of preventing the first sealant from entering the gap between the electric wiring board and the second plate and stabilizing the height of the first sealant. did it.

  Embodiments of an ink jet recording head according to the present invention will be described below with reference to the drawings.

  FIG. 1 is a diagram showing a recording element unit forming a part of an embodiment of an ink jet recording head of the present invention. FIG. 1 (a) is a perspective view showing the recording element unit, and FIG. The partial enlarged view of only the electric wiring board of the AA cross section shown to a), the figure (c) is an enlarged view of the dotted-line part shown to a figure (a).

  As shown in FIG. 1A, the recording element unit 21 in the ink jet recording head of the present invention includes a recording element substrate 1, a first plate 2 to which the recording element substrate 1 is bonded and fixed, an electrical wiring substrate 3, A second plate 4 is provided between the first plate 2 and the electric wiring board 3 to bond and fix the electric wiring board 3.

  In order to protect the concave portion 11 formed between the second plate 4 and the recording element substrate 1 and a part of the electrical connection portion between the recording element substrate 1 and the electric wiring substrate 3, the first sealing agent 12 is used. Applied and heat-cured.

  If the height of the first sealant 12 is not stable and the filling amount is insufficient, the recording liquid scattered during the cleaning of the head during printing or wiping is gradually formed in the concave portion 11 formed between the recording element substrate 1 and the recording liquid. It accumulates in and sticks to thickening. If this thickened recording liquid adheres to the wiper during wiping and further adheres to the ejection port, it causes a problem in stably ejecting recording droplets. And the height to the upper surface after the application of the first sealant 12 is specified to be 0.26 mm or less.

  Further, protrusions at which the second sealant 14 is formed at the four corners of the opening of the electric wiring board 3 are electrically connected to the electrodes (not shown) of the recording element substrate 1 and the electrode leads 10 of the electric wiring board 3. The coating is protected up to 20.

  When the second sealing agent 14 is applied without the protrusion 20, the second sealing that should be applied to the protrusion 20 due to the thickness of the second sealing agent 14 applied to the electrical connection portion. Since the end portion of the agent 14 falls on the first sealing agent 12 and becomes thin and the end portion is cracked and peeled off, the end portion of the second sealing agent 14 is prevented from being cracked and peeled off. Therefore, the protrusion 20 is configured.

  As shown in FIG. 1B, the electric wiring board 3 is composed of dummy wirings 22, wirings 15, a cover film 16, and a base film 17, and between the dummy wirings 22 and 15 and the base film 17. The base film adhesive 18, the dummy wiring 22 and the wiring 15, and the cover film 16 are bonded with a cover film adhesive 19.

  As shown in FIG. 1C, dummy wirings 22 having dummy wiring grooves 31 are formed on the protrusions 20 formed at the four corners of the opening of the electric wiring board 3. A dummy wiring structure having a dummy wiring groove 31 having a fixed amount of cover film adhesive in the protruding region 33 including the dummy wiring 22 and the region 29 in the vicinity of the electrical connection portion. This eliminates the difference in the thickness 32 of the cover film adhesive 19 illustrated in FIG. 1B configured on the region 29 in the vicinity of the electrical connection portion and the region 33 of the protrusion including the dummy wiring 22.

  Then, when the electric wiring board 3 is bonded and fixed to the second plate which is a flat surface, the protrusion 20 does not rise, and the second sealing agent 14 is applied with a uniform thickness. It became possible, and the crack after the thermosetting of the 2nd sealing agent 14 which had generate | occur | produced on the said protrusion 20 was able to be prevented.

  Since the second sealing agent 14 is disposed at a position facing the recording sheet, a width (between paper) between the upper surface of the recording sheet to be printed and the upper surface of the second sealing agent 14 is set. The height of the second sealant 14 is defined, and the second sealant 14 must be applied at a height of 0.2 mm to 0.3 mm from the upper surface of the recording element substrate 1.

  Further, by eliminating the difference in thickness 32, the adhesion between the electrical wiring board 3 and the second plate is improved. Therefore, the gap between the electrical wiring board 3 and the second plate becomes very small, and the adhesive (not shown) for joining the electrical wiring board 3 and the second plate 4 can be extended to fill the slight gap. become. Therefore, the first sealing agent 12 is prevented from entering the gap that has occurred between the electric wiring board 3 and the second plate in the region 29 in the vicinity of the electrical connection portion, and the height of the first sealing agent 12 is increased. It was possible to stabilize.

  The necessity of the dummy wiring 22 of the protrusion 20 is that if there is no dummy wiring 22 in the protrusion 20, the thickness is reduced with respect to the region 29 in the vicinity of the electrical connection portion, as shown in FIG. In addition, when the electric wiring board 3 is bonded and fixed to the second plate 4, a gap is formed between the protrusion 20 and the second plate 4. Thereafter, the first sealant 12 is applied, and when the first sealant 12 wraps around the lower part of the electrical connection portion, the first sealant 12 enters the gap and the height of the first sealant 12 is increased. Therefore, the dummy wiring 22 illustrated in FIG. 1C is provided.

  FIG. 2 is a diagram showing a recording element unit forming a part of an embodiment of the ink jet recording head of the present invention. FIG. 2A is a perspective view showing the recording element unit, and FIG. The enlarged view of the BB cross section shown to a), and the same figure (c) are the enlarged views of the CC cross section shown to Fig. (a).

  As shown in FIG. 2B, the ejection port plate 205 provided on the surface side of the recording element substrate 201 has an ejection port 206 for ejecting the recording liquid, an electrothermal conversion element 207 that is a recording element. A plurality of openings are provided in two rows at positions facing each other. On the back side of the recording element substrate 201, a recording liquid supply port 208 through which recording liquid is supplied is opened with a length substantially equal to the length of the ejection ports 206 in the arrangement direction. These recording element substrates 201 are arranged on the first plate 202 on the back side, and are bonded and fixed at predetermined positions. 2B and 2C show only a few discharge ports 206 and electrodes 209, but in actuality, several tens to several hundreds are provided.

  Furthermore, a recess 211 formed between the opening of the electric wiring board 203, the opening of the second plate 204, and the periphery of the recording element substrate 201, and the electrical connection portion between the recording element substrate 201 and the electric wiring board 203 In order to protect a part (the lower part of the electrode lead and the periphery of the electrode), the first sealing agent 212 is applied. The first sealing agent 212 is preferably a thermosetting sealing agent having elasticity even after curing, such as a thermosetting silicone-modified epoxy resin (NR200C) manufactured by Nippon Lec Co., Ltd. A groove 213 is provided in a portion of the surface of the first plate facing the recess 211 so as to surround the recording element substrate 201. The groove 213 makes the first sealing agent 212 poured into the recess 211 easy to turn around the entire periphery of the recess 211.

  If the filling amount of the first sealing agent 212 is insufficient, the recording liquid scattered during the cleaning of the head during printing or wiping gradually accumulates in the concave portion 211 formed between the recording element substrate 201 and becomes thickened and fixed. . If this thickened recording liquid adheres to the wiper during wiping and further adheres to the ejection port, it causes a problem in stably ejecting recording droplets. Is specified.

  As shown in FIG. 2C, the electrical wiring substrate 203 is provided with an opening that is incorporated in a state where the recording element substrate 201 is exposed. In order to electrically connect the recording element substrate 201, electrode leads 210 electrically connected to the electrodes 209 of the recording element substrate 201 are provided at the edge of the opening as many as the number of the electrodes 209. The electrode lead 210 and the electrode 209 are electrically connected. As can be seen from FIG. 2A, the end portion of the electric wiring board 203 has an external signal input terminal 228 for receiving an electric signal from the main body.

  Further, the upper part of the electrical connection portion between the recording element substrate 201 and the electric wiring substrate 203 (the region including the discharge port plate 205 from the electric wiring substrate 203 with the electrode lead 210 interposed therebetween) is covered and protected by the second sealing agent 214. Has been. The second sealing agent 214 is preferably a thermosetting sealing agent having a very hard hardness after curing, such as a thermosetting epoxy resin (CV5420D) manufactured by Matsushita Electric Works, Ltd.

  These sealing agents 212 and 214 are cured at the same time after application and are cured at the same time. In this embodiment, the sealants 212 and 214 are cured simultaneously by curing at 100 ° C. for 2 hours and then curing at 150 ° C. for 3 hours. The curing condition is determined in consideration of the degree of damage to the device using these sealing agents 212 and 214 due to the heat of curing.

  A method of manufacturing the recording element unit described above will be described with reference to FIG.

  In the above method for manufacturing an ink jet recording head, first, the second plate 204 is first bonded to a predetermined position on the first plate 202 using the first adhesive 223.

  Next, the recording element substrate 201 is bonded to a predetermined position on the first plate 202 through the opening of the second plate 204 using the second adhesive 224, and the electric wiring substrate 203 is bonded to the predetermined plate on the second plate 204. The position is bonded using the third adhesive 225.

  Next, the electrode leads 210 of the electric wiring substrate 203 are electrically connected to the electrodes 209 of the recording element substrate 201, respectively.

  After filling the concave portion 211 formed between the opening of the electric wiring substrate 203 and the opening of the second plate 204 and the periphery of the recording element substrate 201 with the first sealing agent 212 having elasticity after curing. The electrical connection portion between the recording element substrate 201 and the electrical wiring substrate 203 is covered with the second sealant 214.

  Then, the first sealing agent 212 and the second sealing agent 214 are simultaneously cured and cured.

  FIG. 3 is a completed view of the ink jet recording head of the present invention, and shows a state in which the recording element unit 321, which forms part of one embodiment, the flow path member 327 and the recording liquid supply container 326 are joined.

  An adhesive (not shown) is applied to the joint between the recording element unit 321 and the flow path member 327 manufactured by the manufacturing method described with reference to FIG. Thereafter, an adhesive (not shown) is applied to the joining portion of the flow path member 327 to which the recording element unit 321 is joined with the recording liquid supply container 326, and is thermally cured to complete the ink jet recording head of this embodiment.

  The recording element unit forming a part of one embodiment of the ink jet recording head of Example 2 of the present invention follows FIG. 1, and FIG. 4 is an enlarged view when viewed from the dotted line portion shown in FIG. Yes, the configuration other than the dummy wiring 22 is in accordance with the first embodiment.

  The dummy wiring 22 shown in FIG. 4A has a configuration of an oblique parallelogram (rotated by 180 ° with respect to FIG. 1C) with respect to the protrusion 20.

  The dummy wiring 22 shown in FIG. 4B has a rectangular configuration that is lateral to the protrusion 20.

  The dummy wiring 22 shown in FIG. 4C has a vertical rectangular configuration with respect to the protrusion 20.

  The dummy wiring 22 shown in FIG. 4D has a structure in which the dummy wiring width and the dummy wiring groove are halved compared to FIG.

  If the configuration of the dummy wiring 22 of FIGS. 4A to 4D of the present embodiment is used, the second sealant is prevented from cracking after thermosetting as in the first embodiment, and the electrical connection is made. It is possible to prevent the first sealant from entering the gap between the electric wiring board 3 and the second plate 4 in the region 29 in the vicinity of the part.

  Further, even in the configuration of the dummy wiring 22 other than those listed in FIGS. 4A to 4D, the amount of the cover film adhesive in the region 33 of the protrusion including the dummy wiring 22 and the region 29 in the vicinity of the electrical connection portion is small. Cracks after thermosetting of the second sealant in a configuration in which the difference between the thickness 32 of the cover film adhesive 19 formed on the protrusion 29 including the region 29 near the electrical connection portion and the dummy wiring 22 is constant. It is included in the embodiment of the present invention if the first sealant can be prevented from entering the gap between the electric wiring board 3 and the second plate 4 in the region 29 in the vicinity of the electrical connection portion.

  The recording element unit forming a part of one embodiment of the ink jet recording head of Example 3 of the present invention is in accordance with FIG. 1, and FIG. 5 is only the electric wiring board of the AA cross section shown in FIG. It is an enlarged view when it sees from a partial enlarged view and a dotted line part, and forms other than dummy wiring 22 follow Example 1. FIG.

  The height of the dummy wiring 22 shown in FIG. 5A is configured such that the height of the wiring 15 in the region 29 in the vicinity of the electrical connection portion> the height of the dummy wiring 22.

  The height of the dummy wiring 22 shown in FIG. 5B is configured such that the height of the wiring 15 in the region 29 in the vicinity of the electrical connection portion <the height of the dummy wiring 22.

  If the configuration of the dummy wiring 22 in FIGS. 4A and 4B of the present embodiment is used, cracking after the second sealant is thermally cured can be prevented and electrical connection can be achieved as in the first embodiment. It is possible to prevent the first sealant from entering the gap between the electric wiring board 3 and the second plate 4 in the region 29 in the vicinity of the part.

  4A and 4B, the amount of the cover film adhesive in the region 33 of the protrusion including the dummy wire 22 and the region 29 in the vicinity of the electrical connection portion is also different. It becomes constant, and after the thermosetting of the second sealant, there is no difference in the thickness 32 of the cover film adhesive 19 formed on the protrusions 33 including the region 29 near the electrical connection portion and the dummy wiring 22. It is included in the embodiment of the present invention if cracks can be prevented and the first sealant can be prevented from entering the gap between the electrical wiring board 3 and the second plate 4 in the region 29 in the vicinity of the electrical connection portion.

FIG. 4 is a diagram illustrating a configuration in which dummy wirings of protrusions formed at four corners of an opening of an electric wiring board of a recording element unit that forms a part of an embodiment of the inkjet recording head of the present invention have dummy wiring grooves. FIG. 2 is a diagram illustrating a configuration of a recording element substrate and a sealing element of a recording element unit forming a part of an embodiment of an inkjet recording head of the present invention. It is the figure which showed the completion drawing of the head of this invention. It is the figure which showed the structure which changed the width direction and arrangement | positioning of the dummy wiring of the protrusion formed in the four corners of the opening part of the electrical wiring board of this invention. It is the figure which showed the structure which changed the height direction of the dummy wiring of the protrusion formed in the four corners of the opening part of the electrical wiring board of this invention. It is a diagram showing a conventional recording element substrate in which general electrothermal conversion elements are arranged and has a function of discharging a recording liquid. FIG. 6 is a diagram showing a state in which the recording element substrate shown in FIG. 5 is connected to an electric wiring substrate. FIG. 6 is a diagram showing a solid configuration of protrusion dummy wirings formed at four corners of an opening of an electric wiring board of a recording element unit that forms a part of a conventional ink jet recording head.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Recording element board | substrate 2 1st plate 3 Electrical wiring board 4 2nd plate 10 Electrode lead 11 Recess 12 First sealing agent 13 Groove 14 Second sealing agent 15 Wiring 16 Cover film 17 Base film 18 Base film adhesive 19 Cover Film adhesive 20 Projection 21 Recording element unit 22 Dummy wiring 29 Area near electrical connection 31 Dummy wiring width 32 Thickness 33 Projection area including dummy wiring 205 Discharge port plate 206 Discharge port 207 Electrothermal conversion element 208 Recording Liquid supply port 209 Electrode 223 First adhesive 224 Second adhesive 225 Third adhesive 228 External signal input terminal 326 Recording liquid supply container 327 Channel member

Claims (2)

A recording element substrate having a plurality of recording elements for discharging a recording liquid and an opening into which the recording element substrate is incorporated are formed, and electric energy for discharging the recording liquid is applied to the recording element substrate. An electrical wiring substrate electrically connected to the recording element substrate, and a first plate on which the recording element substrate is fixedly held, and an opening through which the recording element substrate is passed. And an ink jet recording head having a second plate that is interposed between the first plate and the electric wiring substrate.
The electric wiring board is composed of a cover film, a base film, a cover film adhesive, and a base film adhesive, and has dummy wirings at projections formed at four corners of the opening of the electric wiring board, and the dummy wiring An ink jet recording head having a dummy wiring configuration in which the amount of the cover film adhesive is constant in the region of the projecting portion and the region in the vicinity of the electrical connection portion.   An ink jet recording apparatus comprising the ink jet recording head according to claim 1.

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