JP2006261921A - Structure for mounting optical communication module and mobile electronic apparatus using same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for mounting an optical communication module capable of attaining a low profile and to provide a mobile electronic apparatus using the same. <P>SOLUTION: In the structure A1 wherein an infrared ray data communication module D is mounted on a circuit board C including mount pads P, the infrared ray data communication module D being provided with a board 1 including mount terminals 11, a light receiving element and a light emitting element mounted on the board 1, and a resin package 5 for sealing the light receiving element and the light emitting element and with lens sections 51, 52 located in front of the light receiving element and the light emitting element, the circuit board C is provided with a recess Cd and at least part of the infrared ray data communication module D is contained in the recess Cd. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention particularly relates to a mounting structure of an optical communication module mounted on a circuit board such as a portable telephone, and a portable electronic device having this mounting structure.

  As an optical communication module capable of bidirectional communication by including a light emitting element and a light receiving element, for example, there is an IrDA compliant infrared data communication module. Such infrared data communication modules are widely used in portable electronic devices such as notebook computers, mobile phones, and electronic notebooks.

  An example of the mounting structure of a conventional infrared data communication module is shown in FIG. The figure shows a mounting structure X of the infrared data communication module D mounted on the circuit board C. The infrared data communication module D includes a substrate 91 on which a light emitting element (not shown) that can emit infrared light and a light receiving element (not shown) that can receive infrared light, and a resin that seals the light emitting element and the light receiving element. Package 92. Two lens portions are formed in front portions of the light emitting element and the light receiving element in the resin package 92. The illustrated lens unit 93 is one of these lens units. A plurality of terminals 94 are formed on the substrate 91 from the side surface to the bottom surface. The circuit board C is one of components of, for example, a mobile phone, and electronic components such as the infrared data communication module D are mounted on the circuit board C. A plurality of pads P are formed on the mounting surface Ci of the circuit board C. In this mounting structure X, the infrared data communication module D is mounted on the mounting surface Ci in such a posture that the optical axis Op of the lens portion 93 faces the normal direction of the end surface Ce of the circuit board C. The plurality of terminals 94 and the plurality of pads P are joined to each other by solder (not shown). According to such a configuration, it is possible to realize a so-called side surface light emitting / emitting type mounting structure that emits light in the normal direction of the end face Ce and can receive infrared rays that are directed in the opposite direction. If the mounting structure X is used in a mobile phone (not shown), data communication between the mobile phones can be easily performed by providing, for example, a transmission / reception transmission window on the side surface of the housing.

  However, in recent years, the above-described mobile phone has been increasingly reduced in thickness. In order to reduce the thickness of the casing of the portable phone, it is necessary to suppress the height in the drawing including the circuit board C and the infrared data communication module D even in the mounting structure X. For example, the infrared data communication module D is thinned to a height of about 2 mm in the figure, but the height including the circuit board C is, for example, 3 mm or more. In the mobile phone described above, it may be important to reduce the thickness in units of 0.1 mm, and the mounting structure X has not sufficiently met the demand for such a reduction in thickness.

JP 2003-8066 A

  The present invention has been conceived under the circumstances described above, and it is an object of the present invention to provide a mounting structure of an optical communication module that can be thinned and a portable electronic device using the same. And

  In order to solve the above problems, the present invention takes the following technical means.

  A mounting structure of an optical communication module provided by the first aspect of the present invention includes a substrate having mounting terminals, a light receiving element and a light emitting element mounted on the substrate, and sealing the light receiving element and the light emitting element. And an optical communication module comprising a light receiving element and a resin package having a lens portion positioned in front of the light emitting element, wherein the optical communication module is mounted on a circuit board having a mounting pad. Is formed with a gap, and at least a part of the optical communication module is accommodated in the gap.

  According to such a configuration, the optical communication module and the circuit board included in the mounting structure are combined by an amount corresponding to the height of the portion accommodated in the gap portion of the optical communication module. It is possible to reduce the height. Therefore, the mounting structure can be thinned.

  In a preferred embodiment of the present invention, the gap is a recess formed so as to open to one end surface side of the circuit board, and the optical communication module has an optical axis of the lens portion on the one end surface. At least a part thereof is accommodated in the recess. According to such a configuration, the mounting structure is suitable for a so-called side-receiving / emitting type mounting structure capable of data communication in the normal direction of the one end face of the circuit board while reducing the thickness of the mounting structure. .

  In a preferred embodiment of the present invention, the terminal is formed on one side of the substrate of the optical communication module, and the pad is formed on the one side of the optical communication module and the circuit substrate. The surface of the circuit board is the same in the thickness direction of the circuit board. According to such a configuration, the pad and the terminal are arranged at the same position in the thickness direction of the circuit board, and can be easily connected using, for example, a lead.

  In a preferred embodiment of the present invention, the optical communication module is disposed between the front and back surfaces of the circuit board in the thickness direction of the circuit board. According to such a configuration, the optical communication module does not protrude from the circuit board in the thickness direction of the circuit board. Therefore, it is possible to make the thickness of the mounting structure about the thickness of the circuit board.

  In a preferred embodiment of the present invention, the gap portion is a window portion that penetrates the circuit board in the thickness direction, and the optical communication module has the optical axis of the lens portion in the thickness direction of the circuit board. At least a part of which is housed in the window. According to such a configuration, a so-called top surface receiver capable of emitting infrared rays in the normal direction of one of the front and back surfaces of the circuit board and receiving infrared rays directed in the opposite direction. A light emitting type mounting structure can be obtained. Further, the mounting structure can be thinned by an amount corresponding to the height of the portion accommodated in the gap portion of the optical communication module.

  In a preferred embodiment of the present invention, the terminal is formed on the bottom surface of the optical communication module that is located on the opposite side of the surface on which the lens portion is formed, and the bottom surface of the optical communication module The position of the circuit board in the thickness direction is the same as the surface of the circuit board on which the pad is formed. According to such a configuration, the pad and the terminal can be easily connected.

  A portable electronic device provided by the second aspect of the present invention includes a substrate having a mounting terminal, a light receiving element and a light emitting element mounted on the substrate, and a resin for sealing these light receiving element and the light emitting element. An optical communication module including a package is a portable electronic device mounted on a circuit board having a mounting pad, and has a mounting structure according to the first aspect of the present invention. Such a configuration is suitable for reducing the thickness of the portable electronic device.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 3 show an example of a mounting structure of an infrared data communication module according to the first aspect of the present invention. In this mounting structure A1, the infrared data communication module D is mounted on the circuit board C, and is a so-called side surface light emitting / receiving type mounting structure as will be described later.

  As shown in FIG. 2, the infrared data communication module D includes a substrate 1, a light emitting element 2, a light receiving element 3, a driving IC 4, and a sealing resin 5, and is an electronic component capable of infrared data communication conforming to the IrDA standard. It is configured as.

  The substrate 1 is formed in a long rectangular shape as a whole by a resin such as glass epoxy. A wiring pattern (not shown) is formed on the substrate 1. As shown in FIG. 3, portions extending from a part of the wiring pattern form a plurality of terminals 11 extending in the thickness direction of the substrate 1 on one side surface of the substrate 1. The terminal 11 is for mounting the infrared data communication module D on the circuit board C.

  As shown in FIG. 2, the light emitting element 2 is made of, for example, an infrared light emitting diode capable of emitting infrared light, and is mounted in the recess 1 a of the substrate 1. The light emitting element 2 is connected to the wiring pattern by wire bonding (not shown). The light receiving element 3 is composed of, for example, a PIN photodiode capable of sensing infrared rays, and is connected to the wiring pattern by wire bonding (not shown). The drive IC 4 is for controlling transmission / reception operations by the light emitting element 2 and the light receiving element 3, is connected to the wiring pattern by wire bonding (not shown), and is connected to the light emitting element 2 and the light receiving element 3 through the wiring pattern. It is connected.

  The resin package 5 is made of, for example, an epoxy resin containing a pigment, and has no translucency for light of any wavelength other than infrared rays, but has transparency for infrared rays. The resin package 5 is formed by a transfer molding method or the like, and is provided on the substrate 1 so as to cover the light emitting element 2, the light receiving element 3, and the driving IC 4. As shown in FIGS. 1 to 3, two lens portions 51 and 52 are integrally formed in the resin package 5. As shown in FIG. 2, the lens portions 51 and 52 both have a shape that bulges upward in the drawing. The lens unit 51 is positioned in front of the light emitting element 2 and is configured to emit infrared light emitted from the light emitting element 2 while condensing. The lens unit 52 is positioned in front of the light receiving element 3 and is configured to collect the infrared light transmitted to the infrared data communication module D and enter the light receiving element 3.

  The circuit board C is one of the components of a mobile phone, for example, and holds a plurality of electronic components such as the infrared data communication module D, and allows them to conduct electricity to supply power and input / output signals. Is for. The circuit board C is formed of a resin such as glass epoxy. As shown in FIGS. 1 and 2, the circuit board C has a recess Cd. The concave portion Cd is an example of a gap portion in the present invention, and is open to the end face Ce side of the circuit board C. As shown in FIGS. 1 and 3, a plurality of pads P are formed on the circuit board C, and a surface on which these pads P are formed is a mounting surface Ci. The plurality of pads P are a part of the wiring pattern formed on the mounting surface Ci, and extend toward the bottom of the recess Cd.

  In the mounting structure A1, a part of the infrared data communication module D is accommodated in the recess Cd of the circuit board C as shown in FIGS. In the present embodiment, as shown in FIG. 2, a portion of the infrared data communication module D excluding the lens portions 51 and 52 is accommodated in the recess Cd. The infrared data communication module D is mounted on the circuit board C so that the optical axes Op1 and Op2 of the lens portions 51 and 52 are oriented in the normal direction of the end face Ce. As a result, the infrared data communication module D is configured to emit infrared light from the light emitting element 2 in the normal direction of the end face Ce, and to receive infrared light directed in the direction opposite to the normal direction by the light receiving element 3. Yes. Such a mounting structure A1 is called a so-called side surface light emitting / receiving type. In the present embodiment, as shown in FIG. 3, the infrared data communication module D has a height smaller than the thickness of the circuit board C in the drawing, and the mounting surface of the circuit board C in the thickness direction of the circuit board C. It arrange | positions between Ci and the surface on the opposite side.

  As shown in FIGS. 2 and 3, the infrared data communication module D is fixed to the circuit board C with an adhesive B. Further, as shown in FIGS. 1 and 2, the corresponding ones of the plurality of terminals 11 of the infrared data communication module D and the plurality of pads P of the circuit board C are electrically connected via leads L, respectively. The lead L is, for example, a strip member made of iron or copper. The lead L is bonded to each of the terminal 11 and the pad P via the solder S. The solder S is formed, for example, by applying a solder paste between the lead L, the terminal 11 and the pad P and drying it at a high temperature. In the present embodiment, the mounting surface Ci and the surface on which the terminal 11 is formed in the infrared data communication module D are flush with each other.

  Next, the operation of the mounting structure A1 will be described.

  According to the present embodiment, as shown in FIG. 3, the infrared data included in the mounting structure A1 is equivalent to the height of the portion of the infrared data communication module D accommodated in the recess Cd of the circuit board C. The total height of the data communication module D and the circuit board C can be reduced. Therefore, it is possible to reduce the thickness of an electronic device using the mounting structure A1.

  Further, if the infrared data communication module D is accommodated in the recess Cd, it is suitable for a side receiving and emitting type mounting structure capable of data communication in the normal direction of the end surface Ce of the circuit board C while achieving a reduction in thickness. Yes.

  Further, in the present embodiment, the infrared data communication module D does not protrude from the circuit board C in the thickness direction of the circuit board C. As a result, the thickness of the mounting structure A1 can be made about the thickness of the circuit board C. Therefore, it is suitable for reducing the thickness of the electronic device. Note that, unlike the present embodiment, a part of the infrared data communication module D may protrude in the thickness direction of the circuit board C. If at least a part of the infrared data communication module D is accommodated in the recess Cd in the thickness direction of the circuit board C, the mounting structure A1 can be made thinner by that amount.

  Further, since the pads P and the terminals 11 are arranged at the same position in the thickness direction of the circuit board C, the joining work using the leads L is easy. Furthermore, the lead L is not unreasonably bent, and stress due to deformation hardly occurs. Therefore, it is advantageous to appropriately exhibit the function of the infrared data communication module D.

  FIG. 4 shows an example of a portable telephone as a portable electronic device according to the second aspect of the present invention. The mobile phone M1 shown in the figure has a structure in which an operation unit Ma and a display unit Mb having a liquid crystal display are connected via a hinge, and the mounting structure A1 described above is used.

  A transmission window Mw is provided on the side surface of the operation unit Ma. The transmission window Mw is obtained by fitting a resin plate into an opening provided on the side surface of the operation unit Ma. This resin plate is formed using, for example, a resin capable of transmitting infrared rays, similarly to the resin package 5 of the infrared data communication module D. Thereby, data communication using infrared rays is possible through the transmission window Mw.

  An infrared data communication module D is mounted on the circuit board C inside the transmission window Mw of the operation unit Ma. For this mounting, the mounting structure A1 described above is employed. That is, the optical axes Op1 and Op2 of the infrared data communication module D are oriented in the normal direction of the end face of the circuit board C and intersect the transmission window Mw. Thereby, the mobile phone M1 is configured to be able to perform data communication using infrared rays with another mobile phone placed on the side of the operation unit Ma.

  According to such an embodiment, as can be understood from the operation of the mounting structure A1 described above, the operation portion Ma having the mounting structure A1 can be thinned. Therefore, it is possible to reduce the thickness of the mobile phone M1 in both the state in which the illustrated mobile phone M1 is operated and the state in which the display unit Mb is folded from the illustrated state.

  5 and 6 show other examples of the mounting structure according to the first aspect of the present invention. In the mounting structure A2 of the present embodiment, the infrared data communication module D is mounted on the circuit board C having the window portion Cw, and the mounting structure described above is a so-called top surface light emitting / receiving type as described later. Different from A1. In FIG. 5 and subsequent figures, elements similar to those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

  The window portion Cw is formed at a position separated from the edge of the circuit board C, and is not open to any end face side. The window Cw has a long rectangular shape that is slightly larger than the planar view shape of the infrared data communication module D. As shown in FIG. 5, the infrared data communication module D is mounted such that the optical axes Op1 and Op2 of the lens portions 51 and 52 face upward in the drawing. As shown in FIG. 6, in the present embodiment, a plurality of terminals 11 are provided on the bottom surface of the infrared data communication module D. The bottom surface and the mounting surface Ci of the circuit board C are substantially flush with each other. For the connection between the terminal 11 and the pad P, a lead L is used as in the mounting structure A1.

  According to the present embodiment, so-called top surface receiving and emitting that can emit infrared rays toward the normal direction of the top surface of the circuit board C in FIG. 5 and can receive infrared rays directed in the opposite direction. It can be a type of mounting structure. Also in the mounting structure A2 that is a top surface light emitting / receiving type, a part of the infrared data communication module D is accommodated in the window Cw of the circuit board C, so that the protrusion height of the infrared data communication module D from the circuit board C is increased. Can be reduced. Therefore, the mounting structure A2 can be thinned, and an electronic apparatus using the mounting structure A2 can be thinned.

  FIG. 7 shows another example of the mobile phone according to the second aspect of the present invention. The mobile phone M2 of the present embodiment uses the above-described top surface light emitting / receiving type mounting structure A2.

  In the present embodiment, a transmission window Mw is provided on the back side of the display unit Mb. An infrared data communication module D is mounted on the circuit board C inside the transmission window Mw of the display unit Mb. This mounting structure is a mounting structure A2. Thereby, the optical axes Op1 and Op2 of the infrared data communication module D intersect with the transmission window Mw and extend from the back surface of the display unit Mb toward the outside of the apparatus.

  According to such an embodiment, it is possible to perform data communication using infrared rays between the mobile phones M2 in which the back surfaces of the display units Mb face each other. Although the display unit Mb incorporates the infrared data communication module D due to the effect of thinning the mounting structure A2 described above, the increase in thickness due to the display unit Mb is, for example, from the circuit board C to the lens unit shown in FIG. The height can be suppressed to about 51,52. Therefore, it is suitable for reducing the thickness of the mobile phone M2.

  The mounting structure of the optical communication module and the portable electronic device using the same according to the present invention are not limited to the above-described embodiments. The mounting structure of the optical communication module according to the present invention and the specific configuration of each part of the portable electronic device using the same can be varied in design in various ways.

  The optical communication module is not limited to the above-described infrared data communication module, and an optical communication module using light of any wavelength such as visible light other than infrared light may be employed. Further, the mounting structure according to the present invention can be used for various electronic devices such as a notebook personal computer and a PDA (Personal Digital Assistance) other than the mobile phone.

It is a principal part perspective view which shows an example of the mounting structure of the optical communication module which concerns on this invention. It is sectional drawing which follows the II-II line | wire of FIG. It is sectional drawing which follows the III-III line of FIG. It is a partial cross section perspective view which shows an example of the portable telephone which concerns on this invention. It is a principal part perspective view which shows the other example of the mounting structure of the optical communication module which concerns on this invention. It is a principal part perspective view which shows the other example of the mounting structure of the optical communication module which concerns on this invention. It is a whole perspective view which shows the other example of the portable telephone which concerns on this invention. It is a principal part perspective view which shows an example of the mounting structure of the conventional optical communication module.

Explanation of symbols

A1, A2 Mounting structure B Adhesive C Circuit board Cd Recess (gap)
Ce End face Ci Mounting face Cw Window part (gap part)
Ir infrared data communication module (optical communication module)
L Lead M1, M2 Mobile phone Op1, Op2 Optical axis P Pad S Solder 1 Substrate 11 Terminal 2 Light emitting element 3 Light receiving element 4 Driving IC
5 Resin package 51, 52 Lens part

Claims (7)

A substrate having terminals for mounting;
A light receiving element and a light emitting element mounted on the substrate;
An optical communication module comprising: a resin package that seals the light receiving element and the light emitting element and has a lens portion positioned in front of the light receiving element and the light emitting element.
A mounting structure mounted on a circuit board having mounting pads,
In the circuit board, a gap is formed,
A mounting structure of an optical communication module, wherein at least a part of the optical communication module is accommodated in the gap. The gap is a recess formed so as to open to one end face side of the circuit board,
2. The optical communication module mounting structure according to claim 1, wherein the optical communication module has a posture in which an optical axis of the lens unit faces a normal line direction of the one end surface, and at least a part of the optical communication module is accommodated in the recess. . The terminal is formed on one side of the substrate of the optical communication module,
The optical communication module mounting according to claim 2, wherein the one side surface of the optical communication module and the surface of the circuit board on which the pad is formed have the same position in the thickness direction of the circuit board. Construction.   The optical communication module mounting structure according to claim 2, wherein the optical communication module is disposed between the front and back surfaces of the circuit board in the thickness direction of the circuit board. The gap is a window that penetrates the circuit board in the thickness direction,
2. The optical communication module according to claim 1, wherein the optical communication module has an attitude in which an optical axis of the lens unit faces a thickness direction of the circuit board, and at least a part of the optical communication module is accommodated in the window unit. The terminal is formed on the bottom surface of the optical communication module located on the opposite side to the surface on which the lens portion is formed,
The mounting structure for an optical communication module according to claim 5, wherein the bottom surface of the optical communication module and the surface of the circuit board on which the pad is formed have the same position in the thickness direction of the circuit board. . A circuit in which an optical communication module comprising a substrate having a mounting terminal, a light receiving element and a light emitting element mounted on the substrate, and a resin package for sealing the light receiving element and the light emitting element has a mounting pad A portable electronic device mounted on a substrate,
A portable electronic device comprising the mounting structure according to claim 1.

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