JP2006237274A - Electronic component storage package and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component storage package and an electronic device in which the possibility of cracks occurring in an insulating substrate when bonding a lid is reduced.
An insulating substrate 101 having a recess 104 in which an electronic component is accommodated and having a notch 102 on a side surface, and a metallized layer 105 formed on the upper surface of the insulating substrate 101 so as to surround the recess 104 are provided. ing. A recess 103 is formed on the surface of the metallized layer 105 from the corner of the insulating substrate 101 to the notch 102.
[Selection] Figure 1

Description

  The present invention relates to an electronic component storage package and an electronic apparatus in which an electronic component such as a crystal resonator or a semiconductor element is stored, and more particularly, to an electronic component storage package in which a notch is formed on a side surface of an insulating substrate. And an electronic device.

As a conventional electronic component storage package in which electronic components such as a crystal resonator and a semiconductor element are stored, for example, there is a structure described in Patent Document 1 below. That is, in the conventional electronic component storage package, a recess for accommodating the electronic component is formed on the upper surface of the insulating base, and a notch is formed on the side surface of the insulating base. A conductor layer is formed on the inner surface of the notch, and is used as a wiring conductor for external connection or a measurement terminal for electrical characteristics. A metallized layer is formed on the upper surface of the edge base so as to surround the recess. A lid is joined to the upper surface of the insulating base by a method such as brazing or welding.
JP 2003-304138 A

  However, with the recent miniaturization and higher functionality of electronic devices, it is necessary to reduce the thickness of the frame portion of the insulating base that surrounds the recesses in which electronic components are accommodated. In addition, as electronic devices become more sophisticated, it is necessary to stack and mount a plurality of electronic components in the recesses of the insulating base, and it is also required that the depth be larger than the thickness of the frame of the insulating base. It has been.

  As described above, the thickness of the frame portion of the insulating base is reduced, and the depth of the concave portion is formed larger than the thickness of the insulating base. The possibility of cracking has increased. In particular, the possibility is further increased in a structure having a notch on the side surface of the insulating substrate.

  The present invention has been devised in view of such problems, and an object of the present invention is to provide an electronic component storage package and an electronic device in which the possibility of occurrence of cracks due to thermal stress generated when the lid is joined is reduced. Is to provide.

  An electronic component storage package according to the present invention includes an insulating base having a recess for storing an electronic component on an upper surface, a cutout portion on a side surface, and a metallization formed on the upper surface of the insulating base so as to surround the recess. And a recess is formed on the surface of the metallized layer from the corner to the notch of the insulating base.

  The electronic component storage package of the present invention is characterized in that the recess is formed so as to gradually become shallower from the cutout side toward the recess.

  In the electronic component storage package according to the present invention, the outer peripheral edge of the metallized layer is located inside the outer peripheral edge of the upper surface of the insulating base, and the inner peripheral side of the metalized layer is the insulating base. It is characterized by extending to the inner surface of the recess.

  In the electronic component storage package of the present invention, a metal frame is bonded to the upper surface of the metallized layer formed on the insulating base having an upper surface that is rectangular, and on the short side of the insulating base, The inner periphery of the metal frame is located inside the recess.

  The electronic device of the present invention includes an electronic component storage package of the present invention, an electronic component stored in the recess of the electronic component storage package, and a brazing material on the metallized layer of the electronic component storage package. The brazing material is characterized in that the brazing material is provided thicker in the hollow portion of the metallized layer than in the portion other than the hollow portion of the metallized layer.

  The electronic device of the present invention is bonded to the electronic component storage package of the present invention, the electronic component stored in the recess of the electronic component storage package, and the metal frame of the electronic component storage package. And a lid.

  In the electronic component storage package of the present invention, the recess is formed on the surface of the metallized layer from the corner portion to the notch portion of the insulating base, so that the lid is joined to the insulating base via, for example, a brazing material. In this case, the thermal stress can be effectively relieved by the accumulation of the brazing material in the recessed portion from the portion where the thermal stress is concentrated and tends to be the starting point of the crack to the direction in which the crack progresses. This can reduce the possibility of cracks.

  In addition, the electronic component storage package of the present invention is formed so that the recessed portion gradually becomes shallower from the notch portion side toward the recessed portion side, so that when the lid is bonded to the metallized layer, Thermal stress concentrated in the vicinity of the notch can be effectively mitigated by the accumulation of brazing material formed in the recess formed so as to gradually become shallower from the notch to the recess. Further, it is possible to further reduce the possibility of cracks occurring in the insulating substrate.

  In the electronic component storage package of the present invention, the outer peripheral edge of the metallized layer is located inside the outer peripheral edge of the upper surface of the insulating substrate, and the inner peripheral side of the metalized layer is the inner surface of the recess of the insulating substrate. The metallization layer can be firmly attached to the surface of the insulating base, and the brazing material formed on the inner peripheral side of the metallization layer that extends to the inner side surface of the recess. With the fillet, the metallized layer and the metal frame can be firmly bonded.

  In the electronic component storage package of the present invention, the metal frame is bonded to the upper surface of the metallized layer formed on the insulating base having a rectangular upper surface, and on the short side of the insulating base, When the inner peripheral edge is located inside the recess, when the lid is joined to the metal frame by a welding method such as seam welding, the length of the long side of the lid is set to the length of the insulating base. The expansion and contraction width due to the thermal expansion and contraction in the long side direction of the lid can be made relatively small compared to the length, and the thermal stress in the long side direction of the lid can be relaxed more effectively, The hermeticity and reliability can be further improved.

  The electronic device of the present invention includes the electronic component storage package of the present invention and the electronic component stored in the recess of the electronic component storage package, thereby improving reliability.

  The electronic component storage package of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a perspective view showing the structure of an electronic component storage package according to the present invention. The electronic component storage package of the present invention includes an insulating substrate 101 and a metallized layer 103 formed on the upper surface of the insulating substrate 101.

  A plurality of notches 102 (castellation) are formed on the side surface of the insulating base 101. In the electronic component storage package shown in FIG. 1, two notches 102 are formed on the long side surface of the rectangular insulating base 101. The notch 102 is provided so as to reach the upper end and the lower end of the side surface of the insulating base 101. In addition, a conductor layer electrically connected to the connection pad 106 is attached to the inner surface of the notch 102, and the electrode of the electronic component and the wiring conductor of the external circuit board are electrically connected via the conductor layer. Connected.

  Further, the conductor layer may be used as a data rewrite terminal for rewriting the contents stored in the memory of the electronic component. In this case, a temperature-compensating type that performs temperature compensation in accordance with the vibration characteristics of the crystal resonator, the use environment of the electronic device, and the like by mounting a crystal resonator in the recess 104 above or below the semiconductor element. A crystal oscillator can be realized.

  A recess 103 is partially formed on the upper surface of the insulating substrate 101. That is, the insulating base 101 is formed so that the height position of the upper surface is partially different. In the electronic component storage package shown in FIG. 1, a portion (dent portion 103) whose height position is lower than the other portions on the top surface of the insulating base 101 from the corners on the top surface of the insulating base 101 to the notches 102. ) Is formed. The recess 103 is formed so as to cover the notch 102.

  Further, the insulating base 101 has a recess 104 opened on the upper surface side. As shown in FIGS. 1 and 2, the recess 104 is formed with a region where the electronic component is mounted (mounting region 107) and a connection pad 106 to which an electrode of the electronic component is electrically connected. FIG. 2 is a plan view of the electronic component storage package shown in FIG.

  In the example shown in FIGS. 1 and 2, a step portion 108 is formed so as to sandwich the mounting region 107, and a connection pad 106 is formed on the upper surface of the step portion 108. The step 108 is preferably formed with a height that is about the thickness of the electronic component mounted in the recess 104. The connection pad 106 is made of a metal material such as tungsten, molybdenum, manganese, copper, or silver.

  In such a structure, the electrode of the electronic component and the connection pad 106 are electrically connected via a bonding wire. If the electronic component is a surface mount type, the electrode of the electronic component and the connection pad 106 are electrically connected via a bonding member such as solder. The electronic component mounted in the recess 104 is, for example, a semiconductor element such as a semiconductor integrated circuit element or an optical semiconductor element, a piezoelectric element such as a crystal resonator or a surface acoustic wave element, or a capacitive element.

  Further, as shown in FIG. 3, a metal layer (metallized layer) 105 is formed on the upper surface of the insulating substrate 101. Here, FIG. 3 is a cross-sectional view taken along line X-X ′ of the electronic component storage package shown in FIG. 2. The metallized layer 105 is formed on the recessed portion 103 and on a region other than the recessed portion 103. In the example shown in FIGS. 1 to 3, the metallized layer 105 is provided with a uniform thickness, and the height of the surface of the metallized layer 105 is low from the corner of the insulating base 101 to the notch 102. It has become. That is, a recess 103 is formed from the corner of the insulating base 101 to the notch 102 on the surface of the metallized layer 105. The metallized layer 103 has a thickness of about 10 to 30 μm and a width of each side of about 0.2 to 0.5 mm.

  The insulating base 101 is made of an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, a ceramic such as glass ceramics, a resin, or the like. It has a rectangular parallelepiped shape with a thickness of about 20 mm and a thickness of about 1 to 5 mm.

  The exposed surfaces of the conductor layer of the notch 102, the metallized layer 105, and the connection pad 106 are provided with a nickel plating layer having a thickness of, for example, about 1 to 10 μm, and 0. A gold plating layer having a thickness of about 1 to 3 μm is preferably sequentially deposited.

  Next, the manufacturing method of the electronic component storage package of this invention is demonstrated. Here, the case where the insulating substrate 101 is made of an aluminum oxide sintered body will be described.

  First, an appropriate organic binder, solvent, plasticizer, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry, which is formed by a doctor blade method or a calendar roll method. To obtain a plurality of ceramic green sheets.

  Then, the ceramic green sheet is punched. Also, a conductive paste prepared by adding and kneading an organic solvent, a binder, etc. to metal powder (for example, tungsten powder) is printed in a predetermined pattern (pattern of metallized layer 105 and connection pad 106) on the surface of the ceramic green sheet. .

  Next, a plurality of ceramic green sheets that have been subjected to the punching process and the printing process are stacked to produce a stacked body having a recess 104 on the upper surface. Further, a conductive paste that becomes a conductor layer of the notch 102 is printed on the side surface of the laminate. And this laminated body is baked at high temperature (about 1600 degreeC).

  It should be noted that, for example, a nickel plating layer having a thickness of about 1 to 10 μm and a gold plating layer having a thickness of about 0.1 to 3 μm are formed on the exposed portions of the conductor layer of the metallized layer 105, the connection pad 106, and the notch 102. Should be attached in sequence.

  Next, the structure of the electronic device of the present invention will be described. 4 is a perspective view showing the structure of the electronic device of the present invention, and FIG. 5 is a cross-sectional view of the electronic device shown in FIG. In the electronic device of the present invention, an electronic component is accommodated in the recess 104 of the insulating base 101, and a lid 410 is attached to the upper surface of the insulating base 101. The lid 410 is joined to the package metallization layer 105 via a brazing material 411.

  Here, in the electronic device according to the present invention, the brazing material 411 is provided thicker in the hollow portion 103 of the metallized layer 105 than in portions other than the hollow portion 103 of the metallized layer 105. That is, in the present invention, the surface of the metallized layer 105 of the package is provided between the metallized layer 105 and the lid 410 because the height position is lowered from the corner to the notch of the insulating base 101. The amount of the brazing material 411 is larger than other portions from the corner portion to the notch portion of the insulating base 101.

  The lid 410 is made of an iron-nickel alloy plate, an iron-nickel-cobalt alloy plate, or the like, and is a flat plate having a thickness of about 0.1 to 0.3 mm. On the lower surface of the lid 410, a nickel plating layer is applied to a thickness of about 10 to 30 μm.

  In the electronic component storage package of the present invention, the recess 103 is formed on the surface of the metallized layer 105 from the corner to the notch 102 of the insulating base 101, so that the lid is formed on the metallized layer 105 via a brazing material. When the body 410 is joined, the possibility of cracks occurring in the insulating base 101 can be reduced.

  In other words, the electronic component storage package of the present invention has such a structure that when the lid 410 is joined to the insulating base 101 via the brazing material, the thermal stress is concentrated and the crack is generated from the portion that is likely to start the crack. The thermal stress can be effectively relieved by the accumulation of the brazing material provided in the hollow portion 105 in the direction in which the heat travels, and the possibility that the insulating substrate 101 may crack due to the thermal stress can be reduced. it can. And the package for electronic component accommodation excellent in airtight sealing can be provided.

  Next, a second embodiment of the electronic component storage package and the electronic device according to the present invention will be described. FIG. 6 is a perspective view showing the structure of the second embodiment of the electronic component storage package and the electronic device according to the present invention. In the present embodiment, lid 410 is joined onto metal frame 620. About another structure, it is the same as that of the electronic component storage package and electronic device which were shown in FIGS.

  Here, the metal frame 620 is made of an iron-nickel alloy plate, an iron-nickel-cobalt alloy plate, or the like, and is a frame plate having a thickness of about 0.1 to 0.3 mm. Further, a brazing material 411 such as silver-copper eutectic brazing is applied to the entire lower surface of the metal frame 620 to a thickness of about 20 to 40 μm. Then, it is bonded to the upper surface of the metallized layer 103 of the insulating substrate 101 by bonding to the metallized layer 105 of the insulating substrate 101 by heat treatment through the brazing material 110.

  In the case of such a sealing method via the metal frame 620, a nickel plating layer is preliminarily deposited on the surfaces of the metal frame 620 and the lid 410 made of metal. The metal frame 620 and the lid 410 are welded by melting a part of the nickel plating layer or the brazing material 411 rolled on the lower surface of the lid 410.

  The electronic component storage package and the electronic device according to the present embodiment can reduce the possibility of cracks occurring in the insulating base 101 when the lid 410 is seam welded to the insulating base 101. That is, when the metal lid 410 is seam welded to the metal frame 620, the temperature of the lid 410 decreases and heat shrinkage starts, and the welded portion of the hardened nickel plating layer (the surface of the metal frame 620). Even if a thermal stress is generated that pulls the metallized layer 105 inward from the outer peripheral portion in contact with the lid 410, this thermal stress is effectively relieved by the accumulation of the brazing material 411 provided in the recess 103.

  Next, a third embodiment of the electronic component storage package and the electronic device according to the present invention will be described. FIG. 7 is a cross-sectional view showing the structure of the third embodiment of the electronic component storage package and the electronic device according to the present invention. In the electronic component storage package and the electronic device according to the present embodiment, the recess 103 of the metallized layer 105 is formed so as to gradually become shallower from the notch 102 side toward the recess 104 side. About another structure, it is the same as that of the electronic component storage package and electronic device which were shown in FIGS.

  With such a configuration, the electronic component storage package and the electronic device according to the present exemplary embodiment have a thermal stress that tends to concentrate in the vicinity of the notch 102 when the lid 410 is seam welded to the metallized layer 105. Further, it can be effectively relaxed by the accumulation of the brazing material 411 formed in the hollow portion 103 formed so as to become gradually shallower from the notch portion 102 side toward the concave portion 104 side. Therefore, the possibility that cracks will occur in the insulating substrate 101 can be further reduced.

  In addition, the electronic component storage package and the electronic device according to the present embodiment have an airtightness by gradually reducing the gap between the lid 410 and the insulating base 101 on the concave portion 104 side where the thermal stress is small. Can be increased. Further, since the brazing material 411 located in the depression 103 of the metallized layer 105 is formed thick, it is difficult to transfer heat at the time of seam welding to the insulating base 101, and the insulating base 101 is not cracked or cracked by thermal shock. The possibility of occurring can be further reduced.

  Here, the recess 103 of the metallized layer 105 is formed by, for example, the insulating substrate 101 by a pressure head formed so that the surface of the insulating substrate 101 becomes gradually shallower from the notch 102 side toward the recess 104 after pressing. The surface of the insulating substrate 101 may be pressed, or a ceramic paste may be printed on the surface of the insulating substrate 101 so as to gradually become shallower from the notch 102 side toward the recess 104 side.

  Next, a fourth embodiment of the electronic component storage package and the electronic device according to the present invention will be described. FIG. 8 is a cross-sectional view showing the structure of a fourth embodiment of the electronic component storage package and the electronic device according to the present invention. In the electronic component storage package and the electronic device according to the present embodiment, the outer peripheral edge of the metallized layer 105 is located inside the outer peripheral edge of the upper surface of the insulating base 101, and the inner peripheral side of the metallized layer 105 is insulated. The inner surface of the recess 104 of the base 101 is extended. About another structure, it is the same as that of the electronic component storage package and electronic device which were shown in FIGS.

  With such a configuration, the electronic component storage package and the electronic device according to the present embodiment can firmly adhere the metallized layer 105 to the surface of the insulating base 101. When a metal frame is provided on the metallized layer 105, the metallized layer 105 and the metal are formed by a fillet of the brazing material 411 formed on the inner peripheral side of the metallized layer 105 extending on the inner surface of the recess 104. The lid body 410 can be bonded to the insulating base 101 more firmly by bonding the frame body 108 to a wide area.

  Next, a fifth embodiment of the electronic component storage package and the electronic device according to the present invention will be described. FIG. 9 is a cross-sectional view showing the structure of the fifth embodiment of the electronic component storage package and the electronic device according to the present invention. In the electronic component storage package and the electronic device according to the present embodiment, the metal frame 920 is bonded to the upper surface of the metallized layer 103 formed on the insulating base 101 whose upper surface is rectangular, and the short side of the insulating base 101 is On the side, the inner peripheral edge of the metal frame 920 is formed so as to be located inside the recess 104. About another structure, it is the same as that of the electronic component storage package and electronic device which were shown in FIGS.

  With this configuration, the electronic component storage package and the electronic device according to the present embodiment have a length in the long side direction of the metal lid 410 when a rectangular electronic component such as a crystal resonator is accommodated. The length of the insulating base 101 can be made shorter than the length in the long side direction, and the expansion / contraction width due to the thermal expansion / contraction of the long side direction of the lid 410 can be made relatively small. The thermal stress in the long side direction can be more effectively relaxed, and the hermetic sealing performance and reliability can be further improved.

  In the electronic component storage package and the electronic device according to the present invention, it is desirable that the depth of the recessed portion 103 is formed to be about 10 to 20 μm lower than the portion of the other metallized layer 105 where the recessed portion 103 is not formed. . The thickness of the brazing material 411 is usually about 20 to 40 μm on the metallized layer 105, and since this brazing material 411 spreads and is joined to the metallized layer 105, the recess 105 has a depth of about 10 to 20 μm. It is formed as follows.

  In addition, if the depth of the recess 103 is less than 10 μm, the effect of suppressing the thermal stress generated when the lid 410 is seam welded onto the metallized layer 105 from being concentrated around the notch 102. The metallization layer 105 is peeled off from the upper surface of the insulating base 101 and a crack is likely to occur on the side surface of the insulating base 101.

  Further, when the depth of the recess 105 is 20 μm or more, the excess brazing material 411 flows out into the recess 104 in which the electronic component is accommodated, and there is a high possibility that an electrical short circuit will occur.

It is a perspective view which shows the structure of the electronic component storage package of this invention. FIG. 2 is a plan view of the electronic component storage package shown in FIG. 1. It is sectional drawing in the X-X 'line | wire of the electronic component storage package shown in FIG. It is a perspective view which shows the structure of the electronic device of this invention. It is sectional drawing of the electronic device shown in FIG. It is a perspective view which shows the structure of 2nd Embodiment of the electronic component storage package and electronic device of this invention. It is a perspective view which shows the structure of 3rd Embodiment of the electronic component storage package and electronic device of this invention. It is a perspective view which shows the structure of 4th Embodiment of the electronic component storage package and electronic device of this invention. It is a perspective view which shows the structure of 5th Embodiment of the electronic component storage package and electronic device of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Insulating substrate 102 ... Notch part 103 ... Recessed part 104 ... Recessed part 105 ... Metallization layer 106 ... Connection pad

Claims (6)

An insulating base having a recess for accommodating an electronic component on the upper surface and having a notch on a side surface; and a metallization layer formed on the upper surface of the insulating base so as to surround the recess, and having a corner of the insulating base. A package for storing an electronic component, wherein a recess is formed on a surface of the metallized layer from a portion to the notch. 2. The electronic component storage package according to claim 1, wherein the recess is formed so as to gradually become shallower from the cutout side toward the recess. The outer peripheral edge of the metallized layer is located inside the outer peripheral edge of the upper surface of the insulating substrate, and the inner peripheral side of the metallized layer extends to the inner surface of the recess of the insulating substrate. 3. The electronic component storage package according to claim 1, wherein the electronic component storage package is characterized in that: A metal frame is bonded to the upper surface of the metallized layer formed on the insulating base having a rectangular upper surface, and the inner peripheral edge of the metal frame is on the inner side of the recess on the short side of the insulating base. The electronic component storage package according to claim 1, wherein the electronic component storage package is located. The electronic component storage package according to any one of claims 1 to 3, the electronic component stored in the recess of the electronic component storage package, and a brazing material on the metallized layer of the electronic component storage package An electronic device, wherein the brazing material is provided thicker in the hollow portion of the metallized layer than in the portion other than the hollow portion of the metallized layer. An electronic component storage package according to claim 4, an electronic component stored in the recess of the electronic component storage package, and a lid joined on the metal frame of the electronic component storage package. An electronic device characterized by comprising:

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