JP2006202913A - Wiring structure and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring structure capable of avoiding breakage in a bonding interface between a base material and wiring and exhibiting excellent strength by releasing stress concentration of the wiring consisting of a convex structure on the base material, having high reliability, and capable of forming a minute pattern, and to provide a manufacturing method thereof. <P>SOLUTION: The convex structure 2 of the wiring to be provided on the base material 1 is configured by a base member 3 and a conductive portion 4. The conductive portion is formed of a conductive material, and the base material is formed of a molding material as a part of the base material, and both the member 3 and the portion 4 are provided at a position where the bonding interface 5 between the conductive portion and the base material may have a different height as that of the base material surface 6. A resist pattern is formed in one mold to form the conductive portion, the other mold is mated and a molding material is injected, and thermal processing is performed. After that, the molds are released, thereby manufacturing the wiring structure. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a wiring structure having wiring on a base material, and more particularly to a wiring structure having wiring having a convex structure on a base material.

  Due to the demand for miniaturization and high performance, the wiring pattern on the wiring board is required to be miniaturized. And with miniaturization of wiring, the adhesion and electrical characteristics of the wiring with respect to the base material have become major issues.

  In response to such a request, for example, a method of manufacturing a printed wiring board using an injection mold having a plating resist pattern pasted on the inner surface has been proposed (for example, see Patent Document 1). This forming method includes a step of forming a wiring pattern of a metal conductor, a step of injecting a thermoplastic resin into an injection mold and molding the substrate, and transferring the wiring pattern to the substrate, and the formed wiring pattern transfer substrate This is composed of a step of releasing from the mold and a step of heating the metal conductor wiring pattern to a temperature higher than the melting temperature of the thermoplastic resin.

According to the manufacturing method described above, it is said that the fine patterning of wiring and the time required for forming can be shortened.
However, in this method, in order to improve the adhesion strength between the transferred wiring pattern and the substrate, the thermoplastic resin is remelted by heating. For this reason, the wiring pattern tends to collapse when the thermoplastic resin is melted, which is not suitable for making a fine pattern sufficient.

In addition, a conductor circuit pattern is formed on the surface of the insulating substrate, and a molded circuit body in which an insulating mask is provided in the gap between the conductor circuit patterns so as to be substantially flush with the surface of the conductor circuit pattern, and its manufacture A method has been proposed (see, for example, Patent Document 2).
In the above proposal, a photocurable resin is applied onto a temporary substrate, exposed and developed to form a reverse pattern opposite to the conductor wiring pattern, and then the conductor is formed by electroplating on the electric circuit formed in the gap of the reverse pattern. Form the wiring, and then place the obtained temporary substrate in the mold and mold the insulating substrate on the wiring pattern forming surface, then remove the temporary substrate from the molded body and mold the insulating mask together with the conductor wiring pattern Adhesion is improved by transferring to the body surface.

According to the above manufacturing method, the exposed surface of the conductor wiring is flattened, and therefore the assembly process can be simplified without damaging the contact portion when the obtained molded circuit body is connected to another part.
However, in this method, it is necessary to increase the wiring width in order to obtain adhesion, that is, a bonding force, and miniaturization is difficult. Moreover, since it is necessary to produce an insulating mask every time, there exists a problem that a manufacturing process becomes complicated.

Further, a conductor pattern having a connection portion is formed on the surface of the insulator, and a concave shape portion is formed on the insulator surface in the vicinity of the connection portion so that the conductor patterns are connected to each other through, for example, an anisotropic conductive film. There has been proposed a conductor pattern connector (see, for example, Patent Document 3).
However, in the wiring shape in which the concave portion is provided on the surface of the insulator, there is a limit to the miniaturization of the wiring, and further improvement is required to make the pattern finer.

  In the case of a wiring structure having a wiring having a convex structure on the base material, if the wiring having the convex structure and the interface where the base material, that is, the molded body is joined, are present on the same surface, stress is applied to the root portion. If the adhesion strength at the bonding interface, ie, the so-called bonding strength, is weaker than the strength of the wiring material itself or the molded body itself, there is a problem that breakage occurs at the bonding interface, and improvement has been desired.

Japanese Patent Laid-Open No. 5-7066 Japanese Patent Laid-Open No. 11-17314 Japanese Patent No. 2633680

  The present invention has been made in view of the above-described prior art, and alleviates the stress concentration of the wiring composed of the convex structure provided on the base material, thereby avoiding the breakage at the bonding interface between the base material and the wiring. An object of the present invention is to provide a wiring structure that exhibits excellent strength, has high reliability, and is capable of forming a fine pattern, and a manufacturing method thereof.

As a result of intensive studies, the inventors of the present invention have configured a wiring provided on a base material by a conductive portion made of a conductive material and a base portion made of a molding material to form a convex structure. The present inventors have found that the above-mentioned problems can be solved by providing the bonding interface at a position different from the height of the substrate surface. In addition, a base material part is formed using a molding material as a part of base material.
Hereinafter, the present invention will be specifically described.

That is, the present invention is a wiring structure having a wiring having a convex structure on a substrate,
The convex structure is composed of a conductive part formed of a conductive material and a base part formed as a part of the base material by a molding material, and a bonding interface between the conductive part and the base part is the The wiring structure is provided at a position different from the height of the substrate surface.

  Here, the bonding interface preferably has a flat surface parallel to the substrate surface.

  In any one of the above wiring structures, the surface roughness of the bonding interface is preferably larger than the surface roughness of the convex structure surface.

  Furthermore, in any one of the above wiring structures, it is preferable that the conductive material forming the conductive portion is copper.

  In the above wiring structure, it is preferable that a blackening treatment film is formed at the bonding interface of the conductive portion.

  Or it is preferable that the oxide film is formed in the joining interface of the said electroconductive part.

  In any of the above wiring structures, the wiring is provided on a base material having a curved surface shape or a polyhedral shape.

  Further, in any one of the above wiring structures, an insulating material is embedded between adjacent wirings of the convex structure.

  In any of the above wiring structures, it is preferable that the molding material for forming the base material and the base material portion is a thermosetting resin.

  In any of the above wiring structures, the base material and the base material part are formed using two or more types of molding materials.

  In any of the above wiring structures, a terminal for component mounting is provided on the conductive portion, and a connection portion to which a connection material is applied is formed on the terminal.

  And in the said wiring structure, components are mounted through the said connection part, This component is integrally sealed in the base material with the molding material, It is characterized by the above-mentioned.

Furthermore, the present invention includes a step of forming a resist pattern on the molding surface of one mold,
Forming a conductive portion in a recessed region surrounded by the wall surface of the resist pattern;
Filling the molding material by superposing the other mold for molding the base material and the base material part on one mold on which the resist pattern and the conductive part are formed;
A step of heat-treating the filled molding material to form a structure having a wiring having a convex structure, and then releasing the structure;
The present invention relates to a method for manufacturing a wiring structure including at least

  Here, the wiring structure is any one of the wiring structures described above.

  In the method for manufacturing a wiring structure, the resist material is preferably a hydrophobic material.

  Furthermore, in any one of the above-described methods for manufacturing a wiring structure, the one mold is a mold having a material configuration in which a conductive coating is provided on an insulating base.

  Furthermore, in any one of the above-described methods for manufacturing a wiring structure, the wall surface of the resist pattern has a tapered structure narrowed in a direction in contact with the mold.

According to the wiring structure of the present invention, the stress concentration of the wiring having a convex structure is relieved, and the breakage at the bonding interface between the base material and the wiring is avoided. And the outstanding intensity | strength is demonstrated and formation of a fine pattern is attained. If the bonding interface between the conductive portion and the base portion constituting the convex structure is flat, it is possible to obtain a wiring having excellent electrical conductivity in the high frequency region. It is possible to further enhance the bonding strength at the bonding interface by surface treatment (for example, roughening treatment, blackening treatment film, oxide film, etc.). If an insulating material is embedded between the wirings, it is possible to obtain high-density wirings suitable for high frequencies.
If a thermosetting resin is used as the molding material, the shape accuracy of the wiring structure can be improved and the reliability can be improved. Moreover, various required specifications can be met by using a plurality of molding materials. If the components are integrally sealed in the base material, the size can be reduced and the reliability can be improved.
In addition, according to the method for manufacturing a wiring structure of the present invention, a wiring structure having a convex-shaped wiring composed of a conductive portion and a base material portion can be easily and accurately manufactured on the base material. . Since injection molding can be applied, productivity is also good.

As described above, the wiring structure of the present invention has a convex structure composed of a conductive portion formed of a conductive material and a base material portion formed as a part of the base material by a molding material, and has a convex shape. The bonding interface between the conductive portion and the base material portion of the structure has a wiring provided at a position different from the height of the base material surface.
Preferred embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic sectional view showing a configuration example (I) for explaining a wiring structure according to the present invention.
As shown in FIG. 1, the wiring structure is provided with a wiring having a convex structure 2 composed of a base material portion 3 and a conductive portion 4 on a base material 1. The wiring is a fine wiring, and is formed as a so-called wiring pattern.

  When forming fine wiring with a molding material and providing on a base material, it is important to improve the adhesiveness in the junction part of wiring and a molded object. For this purpose, it is necessary to improve the adhesion between the wiring and the molded body, that is, the bonding force itself, and to have a structure in which stress at the joint between the wiring and the molded body is hardly applied.

  As shown in FIG. 1, in the case of the wiring structure of the present invention having a convex structure 2 composed of a base material portion 3 and a conductive portion 4, the bonding interface at the root portion that becomes the stress concentration point of the convex structure 2. Can be shifted out of the stress concentration point. That is, by shifting the bonding interface 5 where the dissimilar materials of the conductive material and the molding material are bonded to a height different from that of the substrate surface 6, the stress concentration of the wiring is relaxed and the bonding force at the bonding interface is improved. A fine pattern with high reliability and high reliability can be formed.

  Further, as shown in the schematic cross-sectional view of the configuration example (II) in FIG. 2, the wiring of the wiring structure in the present invention may have a side surface of the convex structure 2 having a tapered structure. Alternatively, the wiring may be a convex structure 2 constituted by the base portion 3 and the conductive portion 4 as shown in the schematic sectional view of the configuration example (III) of FIG.

When sufficient adhesion between the conductive portion and the substrate portion is obtained, the contact area of the bonding interface can be reduced. And when it is the structure where a joining interface has a parallel and flat surface with respect to the base-material surface, it can be set as the wiring excellent in the electrical conductivity in a high frequency area | region.
As the shape of the bonding interface between the conductive portion and the substrate portion, it is usually desirable that the contact area be as large as possible, and the surface roughness of the bonding interface is preferably larger than the surface roughness of the convex structure surface, The more complex the shape, the more effective. By increasing the surface roughness or having a complex cross-sectional shape, the contact area of the bonding interface increases, so that the bonding strength can be effectively improved. FIG. 4 is a schematic cross-sectional view showing a configuration example (IV) in which the surface roughness of the bonding interface is larger than the surface roughness of the convex structure surface.

As the conductive material forming the conductive portion, a metal having good conductivity and excellent patterning workability is used, and copper is particularly preferably used.
When the conductive part is formed using copper, it is preferable to form a blackening treatment film on the copper surface on the interface side to be joined to the base part. By performing the blackening treatment on the copper surface, the wettability with the molded body material can be improved and the contact area can be increased, and the bonding force at the bonding interface can be enhanced to improve the adhesion. The schematic sectional view of FIG. 5 shows a structural example (V) in which a blackening treatment film is formed on the copper surface.

Moreover, when copper is selected as the conductive material, it is preferable to form an oxide film on the copper surface on the interface side to be joined to the base material portion. By forming an oxide film on the copper surface, hydroxyl groups are adsorbed on the surface of the oxide film, and molecular bonds and hydrogen bonds with the molded body material forming the substrate portion can be increased. These bonds can increase the bonding force at the bonding interface and improve the adhesion. The schematic sectional view of FIG. 6 shows a configuration example (VI) in which an oxide film is formed on the copper surface.
The oxide film can be formed by high-temperature heating (for example, about 200 ° C.) in air, or can be formed only by supplying active oxygen as in plasma treatment.

Furthermore, the wiring structure of the present invention can be configured by providing wiring on a substrate having a curved surface shape or a polyhedral shape. The schematic cross-sectional view of FIG. 7 shows a configuration example (VII) in which wiring is provided on a substrate having a curved surface shape or a polyhedral shape.
As shown in FIG. 7, the wiring structure is provided with a wiring composed of a convex structure 12 composed of a base portion 13 and a conductive portion 14 on a curved or polyhedral base 11. Such a wiring structure is an example of a form suitable for being formed by molding or transfer using a mold.

In the wiring structure of the present invention, an insulating material can be embedded between adjacent wirings having a convex structure. FIG. 8 is a schematic sectional view showing a configuration example (VIII) in which an insulating material is embedded between wirings. In the figure, reference numeral 21 denotes a base material, 22 denotes a convex structure, 23 denotes a base material portion, 24 denotes a conductive portion, 25 denotes a bonding interface, 26 denotes a surface of the base material, and 27 denotes an insulating material.
By embedding the insulating material, the wiring capacity between adjacent wirings can be reduced. That is, the insulating material between adjacent wirings increases the coupling capacity between the two wirings, and the electric lines of force concentrate to reduce radiation loss to the outside. In particular, since a signal line and a ground line in the wiring pattern can be configured as a pair, a high-density wiring suitable for high frequency can be formed. As the insulating material, a molding material itself can be used from the viewpoint of simplicity, but other insulating materials are also applicable. For example, an insulating material such as polyimide resin may be used.

In the wiring structure of the present invention, the base material and the base material portion are molded by a molding material. Such a molding material satisfies the performance required as a wiring structure and is a structure of the present invention. Any thermoplastic resin or thermosetting resin can be used as long as it has processability that can be used. In particular, a thermosetting resin is preferably used because it can satisfy these requirements.
In addition, the use of a thermosetting resin can improve the shape accuracy of the wiring structure, and is particularly effective when applied to an electronic component package that requires high accuracy. Furthermore, since heat resistance is required in the solder connection process when mounting electronic components on the wiring structure or mounting the wiring structure on a printed circuit board, light such as thermosetting resin or ultraviolet curable resin can be used. A cured resin is preferably used. The ultraviolet curable resin has an advantage that it can be cured in a short time, and is effective in shortening the process tact.

Moreover, a base material and a base-material part can be formed using a 2 or more types of molding material. As an example, the schematic sectional view of FIG. 9 shows a configuration example (IX) in which a base material and a base material portion are molded using two types of molding materials.
That is, by selecting a molding material, it is possible to mold a base material and a base material portion that meet the required characteristics. For example, when the molding material (molding material base material) that forms the base material and the base material part has poor adhesion to the wiring, a resin that mediates adhesion between the wiring and the molding base material is used. By selecting and combining them, a wiring structure with good adhesion can be obtained.

Specifically, when a thermoplastic resin is used as the molding material, the adhesiveness to the wiring may be insufficient depending on the material selected. In such a case, for example, by forming the base material portion 33 and the base material 31 using the first resin 30a (epoxy resin) and the second resin 30b (thermoplastic resin), respectively, the wiring Adhesion can be improved while maintaining the accuracy of the pattern, and molding using a thermoplastic resin can be made possible.
When the wiring structure is required to have heat resistance, the thermoplastic resin used is also required to have high heat resistance, and therefore the molding temperature must be set high. For this reason, difficulty in handling is accompanied, but there is an advantage in that the curing time of the resin can be shortened.

  Furthermore, even when a single type of resin cannot be used for heat resistance, water resistance, and migration resistance, multiple materials can be used with a wide range of molding materials to meet the required specifications and ensure reliability. can do. Note that, if necessary, a resin having good decomposability can be used as the resin interposed between the conductive portion and the base material to facilitate separation of the conductive portion and the base material.

Moreover, it can be set as the structure which provided the terminal for component mounting in the electroconductive part of the wiring structure in this invention, and provided the connection material to this terminal, and formed the connection part. And a component can be mounted via this connection part and it can be set as the structure which sealed the component integrally in the base material with the molding material. FIG. 10 is a schematic cross-sectional view showing a configuration example (X) in which components are integrally sealed in a base material.
In FIG. 10, each reference numeral 41 is a base material, 42 is a convex structure, 43 is a base material portion, 44 is a conductive portion, 45 is a bonding interface, 46 is a substrate surface, 47 is a connecting material, and 48 is a component. .

  That is, a connecting material is required to connect the wired formed body to another functional component or wiring board. In the present invention, when the wiring is formed, a terminal is provided in the conductive portion, and a connection material is applied to the terminal, thereby facilitating mounting and miniaturization. Furthermore, by sealing the functional parts integrally in the wiring structure, for example, the reliability can be improved as compared with a structure connected to the outside of the wiring structure. In addition, as a connection material, conventionally well-known various materials, such as a conductive adhesive and solder plating, can be used, for example.

Next, the manufacturing method of the wiring structure in this invention is demonstrated.
As described above, the method for manufacturing a wiring structure according to the present invention includes the following steps.
1. [Resist pattern forming step]: A step of forming a resist pattern on the molding surface of one mold. [Conductive part forming step]: a step of forming a conductive part in a recessed region surrounded by the wall surface of the resist pattern. [Molding Material Filling Step]: A step of filling the molding material by superimposing the base material and the other die for molding the base material portion on one die on which the resist pattern and the conductive portion are formed. [Structure release step]: A step of heat-treating the filled molding material to form a structure having a wiring having a convex structure, and then releasing the structure.

  The “resist pattern” in the present invention is a pattern for forming a conductive portion and a substrate portion of a wiring having a convex structure, and is not limited to a pattern formed by a resist material. A pattern formed of a material (insulating material) is also included.

A specific manufacturing method will be described below by taking the above configuration example as an example.
FIG. 11 is a flowchart showing a schematic manufacturing process of the configuration example (I) in the present invention.
<Manufacturing process of configuration example (I)>
1. [Resist pattern forming step]: After forming a film by applying a resist material to the molding surface of one mold (for example, a mold made of nickel), for example, contact exposure using a photomask, and resist is developed by development. Form a pattern.
The resist pattern can be formed using another insulating material such as a polyimide resin in addition to the resist material. The resist pattern when polyimide resin is used can be formed by an etching method as described later.
2. [Conductive part forming step]: A conductive part is formed, for example, by electrolytic plating in a recessed region surrounded by the wall surface of the resist pattern.
Since the conductive part is formed by the electrolytic plating method, one mold needs to be conductive. As the electrolytic solution, a copper pyrophosphate plating solution or the like is used.
3. [Molding material filling step]: The base material and the other die for forming the base material portion are overlapped on one die on which the resist pattern and the conductive portion are formed, and a predetermined cavity is filled with the molding material. .
As a molding method, transfer molding or the like can be applied. In this case, a molding resin for transfer is used. For example, a molding resin for transfer is poured into a cavity in a molten state, and filling molding is performed.
4). [Structure release step]: The filled molding material is heat-treated to obtain a wiring structure having a wiring having a convex structure to which the conductive portion is transferred, and then the wiring structure is released. The molding material can be released in a temporarily cured state, and the taken wiring structure can be heat-treated in an oven for further curing.
The molding resin in the above process can be selected according to the purpose and specifications, and may be a thermosetting resin or a thermoplastic resin as described above.

FIG. 12 shows another schematic manufacturing process of the configuration example (I) in the present invention.
<Another manufacturing process of configuration example (I)>
1. [Resist pattern forming step]: As one mold, a mold having a configuration in which a conductive film is provided on an insulating base can be used.
Examples of such a mold include, but are not limited to, a mold in which a Cr film is formed on a ceramic substrate by sputtering and then a Ni film is laminated.
2. [Conductive part forming step]: A conductive part is formed by electrolytic plating in a recessed region surrounded by the wall surface of the resist pattern. That is, the conductive portion is formed in the pattern portion where the resist is removed by electrolytic copper plating using the conductive film as a cathode. As the electrolytic solution, a copper pyrophosphate plating solution or the like is used.
3. [Molding material filling step]: The base material and the other die for forming the base material portion are overlapped on one die on which the resist pattern and the conductive portion are formed, and a predetermined cavity is filled with the molding material. .
4). [Structure release step]: The filled molding material is heat-treated to form a wiring structure having a wiring having a convex structure to which the conductive portion is transferred, and then the wiring structure is released.

FIG. 13 shows a schematic manufacturing process of the configuration example (II) in the present invention.
<Manufacturing process of configuration example (II)>
1a. [Resist pattern forming step]: An insulating film is formed on the molding surface of one mold. For example, a polyimide solution is applied by spin coating and temporarily cured to form an insulating film. A resist material is applied on the insulating film to form a film, and for example, contact exposure using a photomask is performed, followed by development to form a resist pattern.
1b. [Insulating film etching step]: After developing the resist pattern, the polyimide insulating film is etched into a wiring pattern using a polyimide etching solution.
1c. [Resist removal step]: After removing the resist pattern film using a solvent (for example, acetone), the polyimide insulating film is further heated in an oven to cure.
Thus, it can be set as the shape which has the taper structure where the wall surface of the resist pattern which consists of polyimides narrowed in the direction which touches a type | mold.
2. [Conducting part forming step]: Same as the structural example (I).
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

  In the above process, an example in which polyimide is used as the insulating film is shown, but other insulating materials may be used as long as the material is an insulating material and can be patterned. Although a method using a resist material has been shown as a manufacturing method, the method is not limited to this. For example, a material that replaces the resist material, for example, a metal mask is closely attached to an insulating material and etched into a pattern with an etching solution. It can also be implemented by removing the metal mask later.

FIG. 14 shows a schematic manufacturing process of the configuration example (III) in the present invention.
<Manufacturing process of configuration example (III)>
1. [Resist pattern forming step]: A resist pattern is formed on one of the etched protrusions of the mold using a hydrophobic resist material. Note that the resist material is not limited to a hydrophobic material, but may be any material having an insulating property.
2. [Conductive part forming step]: The conductive part is formed by, for example, electrolytic plating so as to extend over the wall surface of the valley in the one mold, that is, the bottom and side surfaces of the so-called groove. As the electrolytic solution, a copper pyrophosphate plating solution or the like is used.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

FIG. 15 shows a schematic manufacturing process of the configuration example (IV) in the present invention.
<Manufacturing process of configuration example (IV)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2. [Conductive part forming step]: After forming the conductive part in the same manner as in the configuration example (I), for example, the surface roughness of the conductive part serving as the bonding interface is obtained by applying a sandblasting treatment to the surface roughness of the convex structure surface. Roughening while adjusting to be larger than the above. The same surface roughening effect can be obtained by plasma treatment.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

FIG. 16 shows a schematic manufacturing process of the configuration example (V) in the present invention.
<Manufacturing process of configuration example (V)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2. [Conductive portion forming step]: Conductive portions (Cu) are formed in the same manner as in the configuration example (I). After oxidizing the Cu surface that becomes the bonding interface with a blackening agent, a reducing treatment is performed using a reducing agent to form a blackening film. This film has a rough surface.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

FIG. 17 shows a schematic manufacturing process of the configuration example ((VI)) in the present invention.
<Manufacturing process of configuration example (VI)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2. [Conductive portion forming step]: Conductive portions (Cu) are formed in the same manner as in the configuration example (I). The Cu surface that becomes the bonding interface is heat-treated in an oven (for example, about 200 ° C. × 5 minutes) to form an oxide film. Note that, as a method of oxidizing, as described above, a treatment effect can be obtained even by supplying active oxygen as in the plasma treatment.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

FIG. 18 shows a schematic manufacturing process of the configuration example (VII) in the present invention.
<Manufacturing process of structural example (VII)>
1. [Resist pattern forming step]: A resist material (positive resist) is spray-coated on a molding surface having a curved surface shape or a multi-surface shape of one die (for example, a metal mold made of nickel) to form a film and prebaked. One mold on which this resist film is formed is placed on a multi-axis moving stage, and the resist film at the plating portion for forming the conductive portion is processed and removed by an excimer laser. The processed resist pattern is heated to accelerate curing.
2. [Conductive part forming step]: In the same manner as in the configuration example (I), a conductive part is formed in the resist-removed portion by electrolytic plating.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

FIG. 19 shows a schematic manufacturing process of the configuration example (VIII) in the present invention.
<Manufacturing process of configuration example (VIII)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2a. [Conductive part forming step]: Conductive parts are formed in the same manner as in the configuration example (I).
2b. [Resist part removal step]: After the conductive part is formed, a part of the resist pattern in which an insulating material is embedded between adjacent wirings is partially removed by, for example, excimer laser.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

  Note that the insulating material can also be embedded by separately injecting a resin between adjacent wirings in the above.

FIG. 20 shows a schematic manufacturing process of the configuration example (IX) in the present invention.
<Manufacturing process of configuration example (IX)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2. [Conductive part forming step]: Conductive parts are formed in the same manner as in the configuration example (I).
3a. [First Resin Filling Step]: After the conductive portion is formed, a first resin (for example, an ultraviolet curable resin) is applied and filled so as to cover the entire surface of the wiring pattern, and cured by a low-pressure mercury lamp or the like.
3b. [Second resin filling step]: The resist pattern and the conductive portion are formed, and the base material and the other die for forming the base material portion are superposed on one die filled with the first resin. Then, a predetermined cavity is filled with the second resin.
4). [Structure release step]: After forming a wiring structure having a wiring having a convex structure with a conductive portion transferred, the wiring structure is released.

As the molding method, transfer molding or the like can be applied. Moreover, as 1st resin and 2nd resin, according to the objective as mentioned above, it can select and use from thermosetting resin, a thermoplastic resin, an ultraviolet curable resin, etc., respectively.
The use of the ultraviolet curable resin in the manufacturing process has an advantage that it can be cured in a short time, and is effective in shortening the process tact. On the other hand, as described above, when a thermoplastic resin is used as the resin material, there may be a problem in adhesion to the wiring depending on the material selected. In this case, for example, an epoxy resin can be used as the first resin to ensure adhesion, the pattern accuracy can be maintained, and a thermoplastic resin can be used as the second resin. Thus, by selecting different resin materials, it is possible to facilitate the removal of the wiring pattern during recycling and repair.

FIG. 21 shows a schematic manufacturing process of the configuration example (X) in the present invention.
<Manufacturing process of configuration example (X)>
1. [Resist pattern forming step]: A resist pattern is formed in the same manner as in the configuration example (I).
2a. [Conductive part forming step]: Conductive parts are formed in the same manner as in the configuration example (I).
2b. [Component mounting step]: After the conductive portion is formed, a connection material, for example, an epoxy-based conductive adhesive is applied to the connection terminal portion by a dispenser. Next, a component (for example, a semiconductor chip) is connected to the wiring pattern through the connection material. In the case of a connection material that requires heat curing, a heat curing process is performed. In addition to the dispenser, the connection material can be supplied by a method of supplying solder onto wiring or functional parts by plating.
3. [Molding material filling step]: Same as the structural example (I).
4). [Structural mold release step]: Same as the structural example (I).

  EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated further more concretely, this invention is not limited to this.

Example 1
A wiring structure similar to that of the configuration example (I) was manufactured in accordance with the manufacturing process shown in FIG.
First, a positive resist (OFPR-5000: manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied on the molding surface of one mold (mold) made of nickel to form a film having a resist thickness of 3 μm. Next, contact exposure was performed using a photomask having a line having a width of 20 μm and development was performed, followed by curing by heating at 120 ° C. for 2 minutes in an oven. As a result, a pattern having an opening diameter of 20 μm width could be formed on the mold.
Next, this mold was immersed in a copper pyrophosphate plating solution (PY-61: manufactured by Uemura Kogyo Co., Ltd.) to grow the copper film thickness to 2 μm (formation of a conductive part).
Next, the other mold for molding the base material and the base material part is overlaid on the one mold on which the resist pattern and the conductive part are formed, and a transfer molding resin (G770-L: manufactured by Sumitomo Bakelite Co., Ltd.) ) Was injected in a molten state at 120 ° C. to perform molding. The mold was released after pre-curing by heating at 200 ° C. for 5 minutes. An excellent wiring structure could be formed by curing a molded body having a wiring having a convex structure to which the conductive portion was transferred, in an oven at 200 ° C. for 1 hour.

  The conductive part formed of copper is formed up to 2 μm from the top of the convex structure, and the base part around the base part of the convex structure is formed of molding resin. For this reason, although the wiring is fine, the joint interface between the conductive part and the base material part is at a position different from the height of the base material surface, so the stress concentration on the wiring is alleviated and the base material adheres well. Was a wiring structure. Further, since the molding material is a thermosetting resin, the heat resistance is excellent, and the dimensional accuracy of the wiring pattern is also good.

(Example 2)
A wiring structure similar to that of the configuration example (I) was manufactured in accordance with the manufacturing process shown in FIG.
A wiring structure was obtained by the same manufacturing process as in Example 1 except that a mold having a configuration in which a conductive film was provided on an insulating base was used as one mold. That is, a Cr film (50 nm thickness) is formed on a ceramic substrate (50 mm square × 0.38 mm thickness) by sputtering, and a Ni film (1 mm thickness) is further laminated, and a conductive film is formed on an insulating base. The mold formed was used.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was also good. In addition, since the conductive film is provided on the ceramic substrate, the conductive portion can be easily formed by electrolytic plating.

(Example 3)
A wiring structure similar to that of the configuration example (II) was manufactured in accordance with the manufacturing process shown in FIG.
A polyimide solution was applied on the molding surface of one mold made of nickel by a spin coating method, and then temporarily cured to form a polyimide insulating film. Next, a positive resist (OFPR-5000: manufactured by Tokyo Ohka Kogyo Co., Ltd.) was applied on the insulating film to form a film having a resist thickness of 0.5 μm. Next, after a contact exposure using a photomask having a line having a width of 20 μm, development was performed to form a resist pattern. After forming the resist pattern, the polyimide insulating film was etched into a wiring pattern using a polyimide etching solution. Then, after removing a resist film with acetone, the polyimide insulating film was hardened by heat-processing at 200 degreeC for 60 minute (s) in oven.
Subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure having a taper could be formed.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was also good. In addition, since the wiring has a convex structure having a taper, the transfer bonding property of the conductive portion to the base portion can be improved, and the conductive portion can be molded without remaining in the mold.

Example 4
A wiring structure similar to that of the configuration example (III) was manufactured in accordance with the manufacturing process shown in FIG.
On the molding surface of one mold (made of nickel) etched into a line with a width of 20 μm, a silicone resin (Epolyse SS-96: manufactured by Nihon Pernox Co., Ltd.), which is a hydrophobic material, is spray-applied from an oblique direction. A resist pattern was formed on the convex portions of the mold by adjusting the thickness to about 0.2 μm. Thereafter, as shown in the conductive part forming step of FIG. 14, the conductive part was formed by electrolytic plating so as to have a film thickness of about 0.5 μm.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was also good. Further, by using a hydrophobic material as the resist material, the wettability of the molded body material can be reduced, and the releasability is improved.

(Example 5)
A wiring structure similar to that of the configuration example (IV) was produced in accordance with the manufacturing process shown in FIG.
In the same manner as in Example 1, after forming a resist pattern on the molding surface of one mold (made of nickel) and forming a conductive part, the surface of the conductive part was roughened by sandblasting with Al particles. The sandblasting was performed by adjusting the surface roughness of the conductive portion to be larger than the surface roughness of the convex structure surface.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  In the wiring of the produced wiring structure, the stress concentration is relaxed similarly to Example 1, the contact area of the bonding interface is increased by roughening the conductive portion, and the effective bonding force between the conductive portion and the base portion is increased. Was further increased, and the adhesion could be improved. In addition, the dimensional accuracy of the wiring pattern was good as in Example 1.

(Example 6)
A wiring structure similar to that of the configuration example (V) was manufactured based on the manufacturing process shown in FIG.
Similarly to Example 1, a resist pattern was formed on the molding surface of one mold (made of nickel) to form a conductive portion (Cu), and then a blackening treatment was performed on the Cu surface serving as a bonding interface.
First, after forming an oxide film on the copper surface using a blackening treatment agent (HIST-500: manufactured by Hitachi Chemical Co., Ltd.), copper oxidation using a reducing agent (HIST-100B: manufactured by Hitachi Chemical Co., Ltd.). The membrane was reduced. By this treatment, the copper surface was roughened.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  In the wiring of the produced wiring structure, the stress concentration is alleviated in the same manner as in Example 1, and the wettability and the contact area with respect to the molding material can be increased by the blackening treatment of the conductive part. The bonding strength of the part was further increased, and the adhesion could be improved. In addition, the dimensional accuracy of the wiring pattern was good as in Example 1.

(Example 7)
A wiring structure similar to that of the configuration example (VI) was manufactured in accordance with the manufacturing process shown in FIG.
Similarly to Example 1, a resist pattern was formed on the molding surface of one mold (made of nickel) to form a conductive portion (Cu), and then an oxidation treatment was performed on the Cu surface serving as a bonding interface. That is, the Cu surface serving as the bonding interface was heat-treated in an oven at 200 ° C. for 5 minutes to form an oxide film.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  The wiring of the produced wiring structure is relaxed in stress concentration as in Example 1, and a large number of hydroxyl groups are adsorbed on the surface by oxidation treatment of the conductive part, thereby increasing molecular bonds and hydrogen bonds with the molding material. The bonding force between the conductive portion and the base material portion was further increased, and the adhesion could be improved. In addition, the dimensional accuracy of the wiring pattern was good as in Example 1.

(Example 8)
A wiring structure similar to that of the configuration example (VII) was manufactured in accordance with the manufacturing process shown in FIG.
A positive resist (OFPR-5000: manufactured by Tokyo Ohka Kogyo Co., Ltd.) was spray-coated on the molding surface of one mold made of nickel having a curved surface shape or a polyhedral shape to obtain a film having a resist thickness of 3 μm. After this resist film was pre-baked, the mold was placed on a multi-axis moving stage, and the resist film at the plating portion forming the conductive portion was processed and removed by an excimer laser to form a pattern having a 30 μm wide line. Then, it was cured by heating in an oven at 120 ° C. for 2 minutes.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed. A conductive portion having a thickness of 2 μm was formed in the resist removal portion.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was also good. Moreover, the wiring structure of such a form is suitable for forming by transfer and molding, and a fine wiring can be easily formed.

Example 9
A wiring structure similar to that of the configuration example (VIII) was manufactured in accordance with the manufacturing process shown in FIG.
In the same manner as in Example 1, a resist pattern is formed on the molding surface of one mold (made of nickel), a conductive portion is formed, and then the resist pattern between the wirings in the portion where the insulating material is embedded is formed by excimer laser. Removed.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was also good. In addition, a high-density wiring suitable for high frequency could be formed.

(Example 10)
A wiring structure similar to that of the configuration example (IX) was manufactured in accordance with the manufacturing process shown in FIG.
As in Example 1, after forming a resist pattern on the molding surface of one mold (made of nickel) and forming a conductive portion, an ultraviolet curable resin (SD2200: SD2200: (Dainippon Ink Chemical Co., Ltd.) was applied with a dispenser.After supplying the ultraviolet curable resin, the resin was cured by irradiating with a low-pressure mercury lamp.Next, on one mold filled with the first resin The other mold for molding the base material and the base material portion was overlapped to fill a predetermined cavity with the second resin.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure provided with a wiring having a convex structure could be formed.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was good.

(Example 11)
A wiring structure similar to that of the configuration example (X) was manufactured based on the manufacturing process shown in FIG.
As in Example 1, after forming a resist pattern on the molding surface of one mold (made of nickel) and forming a conductive portion, an epoxy-based conductive adhesive (connecting material) is applied to the connection terminal portion with a dispenser. The connection terminal part was provided. Next, the semiconductor chip was connected to the wiring pattern through the connecting material, and the connecting material was heat-cured and bonded under the conditions of 200 ° C. × 1 hour.
The subsequent steps were performed in the same manner as in Example 1, and a wiring structure in which convex wiring was provided and the functional components were integrally sealed in the base material could be formed.

  The wiring of the produced wiring structure was relaxed in stress concentration as in Example 1, and was in good contact with the substrate, and the dimensional accuracy of the wiring pattern was good. As a result, it was possible to obtain a wiring structure that is more compact and more reliable than a structure in which functional parts are connected to the outside of the wiring structure.

It is a schematic sectional drawing which shows the structural example (I) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (II) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (III) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (IV) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (V) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (VI) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (VII) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (VIII) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (IX) for demonstrating the wiring structure of this invention. It is a schematic sectional drawing which shows the structural example (X) for demonstrating the wiring structure of this invention. It is a flow which shows the schematic manufacturing process of the structural example (I) in the manufacturing method of this invention. It is a flow which shows another schematic manufacturing process of the structural example (I) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (II) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (III) in the manufacturing method of this invention. It is a flow which shows the outline manufacturing process of the structural example (IV) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (V) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example ((VI)) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (VII) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (VIII) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (IX) in the manufacturing method of this invention. It is a flow which shows the schematic manufacturing process of the structural example (X) in the manufacturing method of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base material 2 Convex structure 3 Base material part 4 Conductive part 5 Joint interface 6 Base material surface 11 Base material 12 Convex structure 13 Base material part 14 Conductive part 15 Joint interface 16 Base material surface 21 Base material 22 Convex structure 23 Base material part 24 Conductive part 25 Bonding interface 26 Base material surface 27 Insulating material 30a First resin 30b Second resin 31 Base material 32 Convex structure 33 Base material part 34 Conductive part 35 Bonding interface 36 Base material surface 41 Base material 42 Convex Structure 43 Base Part 44 Conductive Part 45 Bonding Interface 46 Base Surface 47 Connection Material 48 Parts

Claims (17)

A wiring structure having a wiring made of a convex structure on a substrate,
The convex structure is composed of a conductive part formed of a conductive material and a base part formed as a part of the base material by a molding material, and a bonding interface between the conductive part and the base part is the A wiring structure provided at a position different from a height of a substrate surface.   The wiring structure according to claim 1, wherein the bonding interface has a flat surface parallel to the substrate surface.   The wiring structure according to claim 1, wherein a surface roughness of the bonding interface is larger than a surface roughness of the convex structure surface.   The wiring structure according to claim 1, wherein the conductive material forming the conductive portion is copper.   The wiring structure according to claim 4, wherein a blackening treatment film is formed at a bonding interface of the conductive portion.   The wiring structure according to claim 4, wherein an oxide film is formed at a bonding interface of the conductive portion.   The wiring structure according to claim 1, wherein the wiring is provided on a substrate having a curved surface shape or a polyhedral shape.   The wiring structure according to claim 1, wherein an insulating material is embedded between adjacent wirings of the convex structure.   The wiring structure according to claim 1, wherein the molding material forming the base material and the base material part is a thermosetting resin.   The wiring structure according to claim 1, wherein the base material and the base material part are formed using two or more kinds of molding materials.   The wiring structure according to claim 1, wherein a terminal for component mounting is provided on the conductive portion, and a connection portion to which a connection material is applied is formed on the terminal.   The wiring structure according to claim 11, wherein a component is mounted through the connection portion, and the component is integrally sealed in a base material with a molding material. Forming a resist pattern on the molding surface of one mold;
Forming a conductive portion in a recessed region surrounded by the wall surface of the resist pattern;
Filling the molding material by superposing the other mold for molding the base material and the base material part on one mold on which the resist pattern and the conductive part are formed;
A step of heat-treating the filled molding material to form a structure having a wiring having a convex structure, and then releasing the structure;
A method for manufacturing a wiring structure comprising:   The method for manufacturing a wiring structure according to claim 13, wherein the wiring structure is the wiring structure according to claim 1.   The method for manufacturing a wiring structure according to claim 13, wherein the resist material is a hydrophobic material.   The method of manufacturing a wiring structure according to claim 13 or 14, wherein the one mold is a mold having a material configuration in which a conductive coating is provided on an insulating base. The method for manufacturing a wiring structure according to any one of claims 13 to 16, wherein a wall surface of the resist pattern has a tapered structure narrowed in a direction in contact with a mold.

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