JP2006179658A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a light emitting device of high light emitting efficiency wherein light is subjected to effective visible light conversion and heat dissipation property is improved, while restraining reflected transmitting light of a light source such as an LED which becomes an excitation light in a light emitting device using a light emitting source such as a short wavelength LED. <P>SOLUTION: The light emitting device comprises a light source using a purple-blue or blue LED; a reflected wavelength converter which is constituted of a phosphor for reflexively performing wavelength conversion to other color light using light from the light source part as excitation light, and its bind material or the like; and a housing having a permeable surface transmitting material which picks up color light subjected to wavelength conversion in the reflected wavelength converter to a surface. The device is provided with a permeable wavelength converter constituted of the phosphor which has light distribution not allowing emitted light from a light source light emitter to be directly injected into a permeable surface transmitting material, and permeably carries out color light conversion using light source light which is reflected in a reflection wavelength converter without being subjected to color light conversion and reaches a surface transmitting material as excitation light, and a bind material or the like. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a light-emitting device that realizes high-efficiency visible light emission, and uses an ultraviolet, blue-violet, or blue light source such as a light-emitting diode (LED).

  In conventional light emitting devices, many light emitting devices that obtain white light by combining a light emitting diode that emits ultraviolet, blue, or blue-violet light and a fluorescent conversion material that emits light from the light emitting diode as excitation light have been proposed. Yes. For example, a color light conversion resin film configured to reflect specific color light from a light emitting element of a short wavelength LED on a reflection concave surface and then radiate to the outside, and convert the specific color light reflected on the reflection concave surface There is a light emitting device in which specific color light is reciprocally transmitted through a color light conversion resin film to convert colors by forming a film (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2001-230451 (pages 3 to 4, FIG. 2)

  In a conventional light emitting device, particularly when a blue-violet LED is used as a light source, the proportion of blue-violet light incident on the color light conversion resin film is not transmitted through the external light emitting surface of the light emitting device as it is without color light conversion (wavelength conversion). Furthermore, the blue-violet light itself has a problem that the visual efficiency is low and the contribution to the improvement of the light emission efficiency is low, and as a result, high visible efficiency cannot be obtained.

  Further, the blue-violet light that is not converted into color light has a high light energy because it has a short wavelength in the visible light range, and the danger is low when the user is exposed to an illumination environment using the light-emitting device for a long time. However, there are also concerns about the effects on the body surface that may damage the eyes and skin.

  In addition, when a conventional light emitting device is used for illumination, it is mainly used downward (with the external light emitting surface facing down), but the LED light source becomes a heat source and its heat dissipation path cannot be secured, and the LED There is also a problem that heat is accumulated in the space between the light source and the reflective concave curved surface, and as a result, the ambient temperature of the LED light source increases and the luminous efficiency of the LED light source itself decreases.

  The present invention has been made to solve the above-described problems. In a light-emitting device using a light source such as a short-wavelength LED light source, while suppressing direct reflected and transmitted light of the LED light source serving as excitation light, A light emitting device with high luminous efficiency that efficiently converts excitation light into visible light is obtained.

  In the light-emitting device according to the present invention, a light source unit composed of ultraviolet light, blue-violet or blue light-emitting diodes, a reflection wavelength conversion unit that reflects the wavelength of light from the light source unit into other color light as excitation light, In a light-emitting device comprising a housing having an external light-emitting surface made of a surface transmitting material that radiates wavelength-converted emitted light to the outside of the device, the reflected light from the reflection wavelength conversion unit is placed on or near the external light-emitting unit. A transmission wavelength conversion unit that emits light by wavelength conversion transparently is disposed.

  In this invention, visible light conversion is improved and high visible efficiency is provided by providing a transmission wavelength conversion unit that transparently converts the reflected light from the reflection wavelength conversion unit at or near the external light emitting surface made of a surface transmitting material. Can be obtained.

Embodiment 1 FIG.
FIG. 1 is a cross-sectional view of a light-emitting device according to Embodiment 1 for carrying out the present invention, and FIG. 2 is a cross-sectional view taken along line AA of FIG. In the figure, the light source unit 2 of the light emitting device 1 includes a single or a plurality of LED chips 3, a sealing resin 4 for sealing the LED chips 3, and a high light source for controlling the light distribution of the light sources from the LED chips 3. The reflecting plate 5 is composed of a reflectance plate 5 and a mounting substrate 6 on which the LED chip 3 is mounted.

  The sealing resin 4 is molded into a curved surface or the like with a material such as epoxy or silicone having a refractive index between the bare chip refractive index and the air refractive index in order to increase the light source light extraction efficiency from the LED chip 3. . In FIG. 1, a plurality of LED chips 3 are collectively sealed with a sealing resin 4. However, a configuration in which a single LED chip 3 is individually sealed (see FIG. 3) or a plurality of commercially available products. LED packages (surface mount type or lead type) may be used.

  The housing 7 of the light-emitting device 1 has an inner surface formed in a recess 7a, and a reflection wavelength conversion unit 8 that converts the wavelength of the light source light from the LED chip 3 as excitation light is provided on the surface of the recess 7a. The reflection wavelength converter 8 is made of, for example, a phosphor and a phosphor binding material that binds the phosphor, and the recess 7a is processed. At this time, the surface of the recess 7a is formed of a mirror surface or a diffused high reflectance member 7b so that the light source light or the converted light incident on the reflection wavelength converter 8 is efficiently reflected by the surface of the recess 7a. .

The reflection wavelength converter 8 uses three types of phosphors that emit red, green, and blue light with the light source wavelength of the LED chip 3 as excitation light of blue-violet light (wavelength of about 360 to 420 nm). By combining these three kinds of phosphors, white light emission is realized. For example, the phosphor is composed of blue: BaMgAl ₁₀ O ₁₇ : Eu, green: BaMgAl ₁₀ O ₁₇ : Eu, Mn, and red: La ₂ O ₂ S: Eu. The phosphor is not limited to these combinations.

  As shown in FIG. 5, the reflection wavelength conversion unit 8 is formed in a sheet shape by using the phosphor binder 9 as silicone and mixing the phosphor 10 therein. And the high reflectance member 7b formed in the surface of the recessed part 7a is formed with a highly reflective mirror-like sheet | seat, and the sheet-like reflection wavelength conversion part 8 mentioned above is formed on it. The specular sheet is, for example, silver, aluminum, or a diffusive sheet whose surface is coated with PET or silicone resin. By adopting such a configuration, it is possible to form a reflecting surface corresponding to a curved shape such as the recess 7a while maintaining the wavelength conversion function.

  In addition, the reflection wavelength conversion unit 8 may be formed by printing (transferring) or spraying the phosphor-mixed silicone material as described above, or by directly applying the phosphor-mixed binder liquid to the surface of the recess 7a. You may form by the method of applying drying and temperature, such as spraying. Moreover, you may form a highly reflective surface not only the said mirror surface sheet but the surface of a housing | casing by vapor deposition or application | coating of a high reflectance for the recessed part 7a.

  A surface transmitting material 11 such as glass or acrylic is provided on the surface of the light emitting device 1 (external light emitting surface in the claims), and the light source of the LED chip 3 is provided inside or outside the surface transmitting material 11. A transmission wavelength conversion unit 12 capable of transparently converting the wavelength of light as excitation light is provided. This transmission wavelength conversion unit 12 excites the light source light (V3) of the LED chip 3 reflected without being converted into color light by the reflection wavelength conversion unit 8 with the wavelength conversion material, and emits external light via the surface transmission material 11. At the same time, the light of the visible wavelength (V1) converted by the reflection wavelength converter 8 is transmitted to the outside of the light emitting device 1 in a transparent manner.

  Next, the arrangement of the light source unit 2 of the light emitting device 1 will be described. The light source unit 2 of the light emitting device 1 directly irradiates the reflected wavelength conversion unit 8 in the concave portion 7a of the housing 7 so that light is not directly transmitted from the surface transmitting material 11 and exits the light emitting device 1. To place. That is, the light source optical axis of the light source unit 2 (the axis of the UV1 or UV2 light in FIG. 1) is arranged toward the reflection wavelength conversion unit 8 (see FIG. 1).

  Next, with regard to the film thickness of the reflection wavelength conversion unit 8, in general, the wavelength conversion efficiency in the wavelength conversion in the reflection wavelength conversion unit 8 is more improved than the wavelength conversion in the transmission wavelength conversion unit 12 by adjusting the film thickness. (See Fig. 6: Development of high-efficiency electro-optic conversion compound semiconductor (lighting plan for the 21st century) Result report (2002 P238) New Energy and Industrial Technology Development Organization (NEDO) commissioned research, metal-based Materials Research and Development Center, March 2015). Therefore, by adjusting the film thickness of the reflection wavelength conversion unit 8, the light source light (primary excitation light) from the LED chip 3 is first wavelength-converted efficiently by the reflection wavelength conversion unit 8 and then the transmission wavelength conversion unit 12. Can be configured to perform visible light conversion

  The role of the transmission wavelength converter 12 will be described. FIG. 7 is a diagram showing excitation reflected light in the reflected wavelength conversion unit 8 and emitted light that is wavelength-converted thereby and emitted, and as shown in the figure, the ratio of excitation light reflected without being wavelength converted in the reflected wavelength conversion unit 8 There are many cases (the light rays are UV2 (near ultraviolet) → UV3 (near ultraviolet) in FIG. 1). In that case, the excitation light that has not been wavelength-converted by the reflection wavelength conversion unit 8 passes through the surface transmitting material 11 as it is and emits external light. Therefore, the transmission wavelength conversion unit 12 has a role of performing wavelength conversion in a transparent manner by using the excitation light reflected without being converted by the reflection wavelength conversion unit 8 as a secondary excitation light source. (The light rays are UV2 (near ultraviolet) → UV3 (near ultraviolet) → V2 (visible) in FIG. 1).

  In the light emitting device configured as described above, the LED light source light from the LED chip 3 of the light source unit 2 is first subjected to visible light conversion (wavelength conversion) in the reflection wavelength conversion unit 8 and visible in the reflection wavelength conversion unit 8. The LED light source light that has not undergone light conversion (wavelength conversion) is subjected to visible light conversion (wavelength conversion) by the transparent wavelength conversion unit 12 provided on the surface (external light emitting surface) of the housing 7, and then is converted into visible light as external light. Is emitted. Therefore, the light radiant flux radiated to the outside of the device with respect to the LED radiant flux (light source excitation) as a whole can be raised, and a visible light (white) light emitting device with high luminous efficiency can be obtained. Furthermore, the excitation light radiant flux (LED light emitted to the outside without being wavelength-converted) irradiated directly from the light emitting device 1 to the outside of the light emitting device 1 can be kept low, and is safe for use on the living body. It is also possible to realize a light emitting device.

Embodiment 2. FIG.
Further, as shown in FIG. 1, the light source unit 2 is arranged on the side surface side of the housing 7 because the irradiation range of the light source light from the LED chip 3 is formed in the concave portion 7 a of the housing 7. The generated heat from the LED chip 3 can be easily released to the outside of the light emitting device 1 through the mounting substrate 6 and the housing 7, and the ambient temperature of the LED chip 3 The rise can be prevented and the excitation light emission efficiency of the LED chip 3 itself can be kept high.

  Further, as a method of arranging the light source unit 2 on the side surface side (end side) of the housing 7, as shown in FIG. 1, an attachment portion that is inclined toward the reflection wavelength conversion unit 8 side is formed on the upper end of the side surface of the housing 7. The light source unit 2 may be attached. In addition, as shown in FIG. 3, when the light source unit 2 is arranged on the side surface side of the housing 7 and the light source light of the light source unit 2 cannot directly irradiate the reflection wavelength conversion unit 8, the reflected light emitted from the light source light is controlled. A plate 13 may be provided, or the light source optical axis of the light source unit 2 may be directed to the reflection wavelength conversion unit 8. In addition, this emission light reflecting plate 13 is formed so that at least the reflection surface is made of a material having a high specular reflectance with respect to the excitation wavelength (for example, silver or aluminum), and other portions have a high reflectance. In addition, the light source part 2 may be only one side of the housing 7 instead of the both side surfaces of the housing 7. Further, if the above-described emission light reflecting plate 13 is used, the same effect as described above can be obtained regardless of the shape of the inner surface of the housing 7 other than the hemispherical concave shape, for example, a rectangular shape.

Embodiment 3 FIG.
In the first embodiment, the transmission wavelength conversion unit 12 provided on the external light emitting surface of the light emitting device 1 is reflected when the film thickness is extremely increased or the concentration of the phosphor in the transmission wavelength conversion unit 12 is extremely increased. The ratio that the light converted into visible light by the wavelength converter 8 is absorbed and reflected increases (transmitted light decreases). The binder in the transmission wavelength conversion unit 12 has a property of absorbing light basically, although the absolute amount varies depending on the type. If the thickness of the binder increases, the ratio of light absorption increases. If the amount of the body is extremely large, the ratio of light reflection increases.

  Therefore, the thickness of the transmission wavelength conversion unit 12 is configured to be equal to or less than the thickness of the reflection wavelength conversion unit 8, or the weight concentration ratio of the binder to the phosphor in the transmission wavelength conversion unit 12 is set to the reflection wavelength conversion unit 8. It is configured to be equal to or higher than the weight concentration ratio of the binder to the inner phosphor. With such a configuration, by reducing the thickness of the binder in the transmission wavelength conversion unit 12, the ratio of light absorption of the transmitted light is reduced and the ratio of the phosphor in the transmission wavelength conversion unit 12 is reduced. Therefore, it is possible to maintain the transparency of the transmission wavelength conversion unit 12 of the light converted into visible light by the reflection wavelength conversion unit 8.

  In addition, as a method for forming the transmission wavelength conversion unit 12, the surface transmission material 11 is formed of an acrylic plate or glass, and the transmission wavelength conversion unit 12 is formed in a dot shape or a mesh shape on the surface using a transfer or screen printing method. The thin film phosphor layer may be formed by depositing the phosphor on the surface transmitting material 11 by the CVD method, and the same effect as described above can be obtained.

Embodiment 4 FIG.
FIG. 8 is a cross-sectional view of the external light emitting surface of the light emitting device showing the light emitting device in the fourth embodiment for carrying out the present invention. This is a configuration in which the visible light of the LED light source light in the reflection wavelength conversion unit 8 is efficiently obtained in the light emitting device of the first embodiment, and the transparency of the external light emission of the converted visible light is also maintained. It is. The configuration is such that the wavelength selective transmission / reflection surface 14 that transmits light having a wavelength longer than the light emission wavelength of the light source light from the LED chip 3 and reflects light having a wavelength shorter than the light emission wavelength of the light source light is a surface that is an external light emission surface. The transmission wavelength converter 8 is provided on the inner surface side of the casing 7 of the transmission material 11 and further on the inner surface side of the casing 7 of the wavelength selective transmission / reflection surface 14. By adopting an external light emitting surface having such a configuration, the phosphor of the transmission wavelength conversion unit 12 is excited and converted into visible light by light in the vicinity of the light emission wavelength of the LED chip 3 out of light incident on the surface transmitting material 11. Then, the light is transmitted through the wavelength selective transmitting / reflecting surface 14 as it is and irradiated onto the external light emitting surface of the light emitting device 1. Further, the light that is not wavelength-converted by the phosphor in the transmission wavelength converter 12 is reflected as it is at the wavelength selective transmission / reflection surface 14, and part of the light is returned into the housing 7 and incident on the reflection wavelength converter 8 or again. Converted to visible light in the transmission wavelength converter 12

  Therefore, since the ratio of utilization of excitation light in the light emitting device 1 can be increased, the light emission efficiency of the light emitting device 1 can also be increased.

Embodiment 5. FIG.
9 (a) and 9 (b) are plan views of the wavelength selective transmission / reflection surface 14 shown in the fourth embodiment as viewed from the housing 7 side. The transmission wavelength conversion part 12 is formed in a dot shape or a mesh shape on the inner surface side, and FIG. 9C is a sectional view thereof. With such a configuration, light in the vicinity of the emission wavelength of the light source light of the LED chip 3 that is directly incident on the wavelength selective transmission / reflection surface 14 is reflected and incident on the reflection wavelength converter 8 to be converted into visible light. Then, light in the vicinity of the emission wavelength of the light source light of the LED chip 3 incident on the dot-shaped transmission wavelength conversion unit 12 is converted into visible light, and directly passes through the wavelength selective transmission / reflection surface 14 to the outside of the light emitting device 1. Emits light.

  As shown in FIG. 9D, a dot-shaped or mesh-shaped transmission wavelength conversion portion 12 is formed on the surface transmission material 11 with a pattern, and the wavelength selective transmission / reflection surface 14 is formed on a portion where this pattern is not formed. It is good also as a structure which formed. As a result, the excitation light reflected by the reflection wavelength conversion unit 8 and partially incident on the surface transmissive material 11 is partially reflected and reused in the light emitting device 1 so that the transmission wavelength can be converted. Can be improved.

  Further, when the near-ultraviolet transmitted light amount is large, all of the light emitted from the light source unit 2 of the light-emitting device 1 is mixed into the transmission wavelength conversion unit 12 by mixing an ultraviolet-absorbing filler having strong wavelength selectivity in the near-ultraviolet region. It is good also as a structure which makes low the ratio of the transmission near-ultraviolet light with respect to light.

Embodiment 6 FIG.
Moreover, although the wavelength conversion layer of the reflection wavelength conversion part 8 and the transmission wavelength conversion part 12 in the said Embodiment 1-5 is formed with the RGB fluorescent substance which produces white, for example, a fluorescent material with a large particle diameter or specific gravity It is also possible to form the reflection wavelength converter 8 based on the base material and to form the transmission wavelength converter 12 based on a fluorescent material having a small particle diameter or specific gravity. By adopting such a configuration, even when it is difficult to obtain a uniform wavelength conversion layer because the weight ratio of each phosphor is large, the phosphor mixture ratio should be designed with each wavelength conversion member 8, 12. Thus, it is possible to obtain a light emitting device that efficiently emits white light with little color unevenness.

  Further, the reflection wavelength conversion unit 8 and the transmission wavelength conversion unit 12 are made of the same material, and a method of changing the RGB mixing ratio is used, or both wavelength conversion units 8 and 12 are mixed with different combinations of RGB mixtures. By doing so, the color of light emitted from the light emitting device 1 can be changed intentionally.

Embodiment 7 FIG.
Further, the thickness of the reflection wavelength conversion unit 8 is formed so as to follow the light distribution of the light source light from the LED chip 3, that is, corresponding to the change in the illumination intensity of the light source light to the reflection wavelength conversion unit 8. Thus, wavelength conversion can be performed efficiently while reducing the amount of the conversion part material of the reflection wavelength conversion part 8. For example, as shown in FIGS. 10 and 11, the thickness of the reflection wavelength conversion portion 8 is made thicker at the central portion of the recess 7 a of the housing 7 where the irradiation density of the light source light is higher than the end of the recess 7 a of the housing 7. Thus, wavelength conversion is efficiently performed, and a light-emitting device that is inexpensive in terms of cost can be obtained.

Embodiment 8 FIG.
12 and 13 are a sectional view showing a light emitting device according to an eighth embodiment for carrying out the present invention and a sectional view taken along the line CC in FIG. 12, and improve the wavelength conversion efficiency in the reflection wavelength conversion section 8. It is. In the figure, the surface of the reflection wavelength conversion unit 8 in which the amount of direct irradiation from the light source unit 2 increases is formed into a concavo-convex shape composed of a recess 8a and a projection 8b, and the wavelength convertible area in the reflection wavelength conversion unit 8 is The wavelength conversion of the light source light from the LED chip 3 can be performed efficiently.

  Further, the area ratio between the concave and convex concave portions 8a and 8b formed on the surface of the reflection wavelength converting portion 8 may be partially changed in accordance with the amount of irradiation from the light source unit 2, and efficient. In addition, an inexpensive light emitting device can be obtained. Further, for example, as a configuration that is partially changed according to the irradiation amount from the light source unit 2, stripes are formed in the longitudinal direction of the light emitting device 1 on the surface of the reflection wavelength conversion unit 8 along the light source beam direction from the light source unit 2. The convex shape 8c may be formed (see FIG. 14). The tip of the concavo-convex convex portion formed on the surface of the reflection wavelength conversion portion 8 may be a gently curved surface or a shape having an acute angle.

  In the seventh embodiment and the eighth embodiment described above, the reflection wavelength conversion unit 8 is described as an object. However, the change in film thickness and the uneven shape of the surface may be applied to the transmission wavelength conversion unit 12. Absent.

  Moreover, in each said embodiment, although the reflective wavelength conversion part 8 is provided in the recessed part 7a inner surface of the housing 7, the recessed part 7a inner surface part of the housing | casing 7 of the light-emitting device 1 which does not provide this reflected wavelength converting part 8 is provided. The light source unit 2 may be made of a wavelength conversion material that converts the wavelength of the light source, and the wavelength conversion efficiency in the recess 7a of the housing 7 may be increased to obtain a light emitting device with high light emission efficiency. . The wavelength conversion material may be the same material as the reflection wavelength conversion unit 8 and the transmission wavelength conversion unit 12.

Embodiment 9 FIG.
In addition, when a plurality of the light-emitting devices described in Embodiments 1 to 8 are used at the same time, a large light-emitting device can be realized. FIGS. 15 and 16 are a cross-sectional view of a longitudinal connection and a cross-connection of a plurality of light emitting devices 15, in which a plurality of light emitting devices 15 and a power feeding unit 17 are arranged in a composite light emitting device housing 16. It is a thing. Based on such a basic configuration, it is possible to obtain a light emitting device that emits a large luminous flux having an arbitrary shape to some extent.

  In the first to ninth embodiments, in consideration of heat dissipation from the LED chip 3 of the light source unit 2, the mounting substrate 6 on which the LED chip 3 is mounted is replaced with a heat dissipation substrate such as a ceramic or an aluminum substrate. Or at least a portion of the housing 7 that contacts the back surface of the mounting base 6 is made of a heat-dissipating material such as aluminum, or the light source unit 2 is installed on the side of the housing 7, that is, at the end. Thus, the heat generated by the LED chip 3 can be released to the outside of the housing 7 via the mounting substrate 6 and the housing 7. Therefore, at least when the LED chip 3 is continuously lit, a situation in which the temperature characteristics inside the housing 7 are extremely increased due to the heat generated by the LED chip 3 is avoided, and the light emission efficiency of the LED chip 3 itself is also high. It is possible to keep on.

  The LED chip 3 serves as excitation light for exciting the phosphors of the respective conversion units to convert white, and the form thereof is a face-up type / flip chip type, a small output type / a large output type. There is no question of distinction.

  Moreover, in the structure in each said embodiment, you may make it the structure which raises airtightness, for example by making a surface permeation | transmission material and a housing closely_contact | adhere and enclosing a vacuum state or nitrogen gas. With such a structure, a light-emitting device with good characteristics and long lifetime and high luminous efficiency can be obtained.

  As described above, the present invention can be used as a light emitting device, and has an advantage that it can be used as an indoor and outdoor lighting device, a vehicle lighting device, and a light source for a display device.

It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. It is AA sectional drawing of the light-emitting device which shows Embodiment 1 of this invention of FIG. It is sectional drawing of the light-emitting device which shows Embodiment 1 of this invention. It is BB sectional drawing of FIG. 3 of the light-emitting device which shows Embodiment 1 of this invention. It is a top view of the reflective wavelength conversion part of the light-emitting device which shows Embodiment 1 of this invention. It is an ultraviolet LED excitation light emission characteristic view which shows Embodiment 1 of this invention. It is a figure which shows the emitted reflected light which is wavelength-converted and the excitation reflected light in the reflective wavelength conversion part which shows Embodiment 1 of this invention. It is sectional drawing of the external light emission surface of the light-emitting device which shows Embodiment 4 of this invention. (A) It is a top view of the wavelength selection transmission reflection surface of the light-emitting device which shows Embodiment 5 of this invention. (B) It is a top view of the wavelength selection transmission reflection surface of the light-emitting device which shows Embodiment 5 of this invention. (C) It is sectional drawing of FIG. 9 (a) or FIG.9 (b) of the light-emitting device which shows Embodiment 5 of this invention. (D) It is sectional drawing of the light-emitting device which shows Embodiment 5 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 7 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 8 of this invention. It is CC sectional drawing of FIG. 12 of the light-emitting device which shows Embodiment 8 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 9 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 9 of this invention. It is sectional drawing of the light-emitting device which shows Embodiment 9 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Light-emitting device, 2 light source part, 3 LED chip, 4 sealing resin, 5
Reflector, 6 mounting substrate, 7 housing, 7a recess, 8 reflection wavelength converter, 9 phosphor binder, 10 phosphor, 11 surface transmission material (external light emitting surface), 12 transmission wavelength converter, 13 ejected light reflector, 14 wavelength selective transmission / reflection surface, 15 light emitting device, 16 composite light emitting device housing, 17 power feeding unit.

Claims (10)

A light source unit composed of ultraviolet, blue-violet or blue light emitting diodes, a reflection wavelength conversion unit that converts the wavelength of the light from the light source unit into other color light in a reflective manner as excitation light, and the wavelength-converted emitted light outside the device In a light-emitting device comprising a housing having an external light-emitting surface made of a surface transmitting material that radiates to the external light-emitting device, the reflected light from the reflection wavelength conversion unit is transparently converted to emit light at or near the external light-emitting unit. A light emitting device characterized in that a transmission wavelength converter is provided. The light-emitting device according to claim 1, wherein the light-emitting device is disposed on the light source unit and the housing, and is disposed so that an optical axis of the light source is directed to the reflection wavelength conversion unit. The reflection wavelength conversion unit is configured in a sheet shape with a phosphor and a transmissive material that binds the phosphor, and the surface of the reflection wavelength conversion unit disposition portion of the housing has a high reflectance with respect to the excitation wavelength. The light-emitting device according to claim 1. The reflection wavelength conversion unit and the transmission wavelength conversion unit are configured by a phosphor and a phosphor binder that binds the phosphor, and the film thickness of the transmission wavelength conversion unit is equal to or less than the film thickness of the reflection wavelength conversion unit. The light-emitting device according to claim 1, wherein the light-emitting device has a thickness. The reflection wavelength conversion unit and the transmission wavelength conversion unit include a phosphor and a phosphor binder that binds the phosphor, and the weight concentration ratio of the phosphor binder to the phosphor of the transmission wavelength conversion unit is the reflection wavelength conversion. The light emitting device according to any one of claims 1 to 3, wherein the weight concentration ratio of the phosphor binder to the phosphor of the portion is equal to or higher than the weight concentration ratio. The thickness of at least the reflection wavelength conversion unit among the reflection wavelength conversion unit and the transmission wavelength conversion unit is adjusted corresponding to the irradiation intensity distribution of light from the light source unit. Or a light-emitting device. The light emitting device according to claim 1, wherein the reflection wavelength conversion unit and the transmission wavelength conversion unit are configured to have different emission wavelength distributions. The light emitting device according to any one of claims 1 to 7, wherein a surface side of the reflection wavelength conversion portion is formed in an uneven shape. A wavelength-selective transmission / reflection surface is disposed in or near the external light-emitting portion so as to transmit at least a wavelength equal to or greater than the emission wavelength of the light-emitting diode and reflect at least a wavelength equal to or less than the center emission wavelength of the light-emitting diode. The light emitting device according to claim 1. The light emitting device according to claim 1, wherein a wavelength conversion material that converts the wavelength of the irradiation light from the light source unit is applied to a surface other than the reflection wavelength conversion unit in the housing of the light emitting device.

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