JP2006128261A - I / O terminal, electronic component storage package and electronic device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for storing electronic components, where transmission characteristics are satisfactory in a high-frequency signal and a light signal, by effectively preventing distortion in a substrate. <P>SOLUTION: The I/O terminal 4 comprises a dielectric flat plate section 4a having a line conductor 4c formed from a long side of a rectangular upper surface to the opposite one; a standing wall section 4b of the dielectric joined to the upper surface of the plate section 4a while one portion of the line conductor 4c is sandwiched; and a metal plate 4g that is joined to the lower surface of the plate section 4a in the longitudinal direction and has a Young's modulus in a longitudinal direction of 180 GPa or higher. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an input / output terminal used in a signal input / output unit of an electronic component storage package for storing an electronic component that operates with a high-frequency signal, and an electronic component storage package and an electronic apparatus using the input / output terminal.

  A conventional input / output terminal for transmitting a high-frequency signal such as a microwave band or a millimeter wave band and an electronic component storage package (hereinafter also referred to as a package) for storing electronic components in an airtight manner are shown in FIGS. 3 and 4, respectively. .

In FIG. 3, 104a is a rectangular flat plate portion made of a dielectric material such as alumina (Al ₂ O ₃ ) ceramic, aluminum nitride (AlN) ceramic, mullite (3Al ₂ O ₃ · 2SiO ₂ ) ceramic, A line conductor 104c made of a metallized layer such as tungsten (W) or molybdenum (Mo) is formed on the upper surface from one long side to the other opposite long side, and the line conductor 104c and the entire surface are formed on the lower surface. A lower ground conductor 104d made of a similar metallized layer is formed. Al ₂ O ₃ ceramics, AlN ceramics, 3Al ₂ O ₃ .2SiO, in which the line conductor 104c is sandwiched and joined to the upper surface of the flat plate portion 104a, and the upper ground conductor 104e is formed on the upper surface. _A standing wall portion 104b made of a dielectric material such as _two- quality ceramics is installed. Side ground conductors 104f made of a metallized layer similar to the line conductor 104c are formed on the side surfaces of the flat plate portion 104a and the standing wall portion 104b.

  A metal plate 104g made of Fe—Ni—Co alloy or the like is joined to the surface of the lower ground conductor 104d of the flat plate portion 104a via a brazing material such as Ag brazing. The metal plate 104g has a function of suppressing the warpage of the bottom surface of the base 101, which occurs when the input / output terminal 4 is brazed to the mounting portion 2a, and enhances the ground potential of the line conductor 104c, thereby generating a high-frequency signal. Has a function of suppressing deterioration of transmission loss.

  That is, the distance between the line conductor 104c and the lower ground conductor 104d is adjusted by appropriately adjusting the thickness of the flat plate portion 104a in accordance with the frequency of the high-frequency signal transmitted to the line conductor 104c, and the line conductor 104c. Match the characteristic impedance of Thus, by matching the line conductor 104c to the characteristic impedance, the transmission efficiency of the high-frequency signal transmitted through the line conductor 104c can be improved.

  Such an input / output terminal 104 is composed of a flat plate portion 104a and an upright wall portion 104b, and is fitted into a notch 102a or the like of the frame body 102, so that the inside and outside of the package are hermetically shut and the inside is sealed. is doing.

  Further, as shown in FIG. 4, an optical semiconductor element storage package, which is one type of electronic component storage package, has an electronic component 109 composed of an optical semiconductor element such as an LD (semiconductor laser) or PD (photodiode) on its upper surface. Iron (Fe) -nickel (Ni) -cobalt (Co) having a mounting portion 101a on which is mounted and a screwing hole 101b to be screwed to an external electric circuit board (not shown) is formed A rectangular base 101 made of a metal such as an alloy or a copper (Cu) -tungsten (W) alloy is included.

  Further, it is joined to the upper surface of the base 101 through a brazing material such as silver (Ag) brazing so as to surround the mounting portion 101a, and the electronic component 109 and an external electric circuit (see FIG. A mounting portion 102a for fitting the input / output terminal 104 is formed, and a through hole 102b which is an optical transmission path for optically coupling the electronic component 109 to one side portion of the short side is formed. And a rectangular frame 102 made of a metal such as an Fe—Ni—Co alloy. A cylindrical optical fiber fixing member (hereinafter also referred to as a fixing member) 103 for fixing the optical fiber 108 and made of a metal such as an Fe—Ni—Co alloy is joined to the through hole 102b by a brazing material such as Ag brazing. .

  The input / output terminal 104 shown in FIG. 3 is joined to the mounting portion 102a via a brazing material such as Ag brazing, and the lead terminal 105 is joined to the tip end outside the frame body 102 of the line conductor 104c using a brazing material such as Ag brazing. To do. In addition, the electronic component 109 is mounted and fixed on the mounting portion 101a, and the vicinity of the tip portion inside the frame body 102 of the line conductor 104c and the electrode of the electronic component 109 are electrically connected by a bonding wire (not shown). After adjusting the optical axes of the optical fiber 108 and the electronic component 109, a metal holder 107 having the optical fiber 108 attached with an adhesive such as resin is attached to the end surface of the fixing member 103 outside the frame 102 by seam welding or the like. Join. Further, a seal ring 106 made of a metal such as an Fe-Ni-Co alloy is joined to the upper surfaces of the frame body 102 and the input / output terminal 104 using a brazing material such as Ag brazing, and a lid (not shown) is attached to the upper surfaces thereof. Are joined by seam welding or the like to provide an electronic device as a product (for example, see Patent Document 1 below).

In such an electronic device, after being screwed to an external electric circuit board, an optical semiconductor device as the electronic component 109 is optically excited by a drive signal supplied from the external electric circuit, and excited light such as laser light is optical fiber By being transferred to and from the optical fiber 108, it functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed, and is often used in the field of optical communication.
Japanese Patent Laid-Open No. 2004-22945 JP 2003-338572 A

  However, in the conventional electronic component storage package using the input / output terminal 104 as shown in Patent Document 1, due to the difference in thermal expansion between the input / output terminal 104 and the frame body 102 and between the input / output terminal 104 and the seal ring 106. In some cases, the bottom surface of the base 101 is warped. When such a package is used as an electronic device and screwed to an external electric circuit board, the warp deformation of the base 101 is corrected and the entire package is distorted. As a result, bending stress may act on the electronic component 109 placed on the base 101 to cause breakage such as cracks.

  Further, when the electronic component 109 is an optical semiconductor element such as an LD or PD, the optical axis of the optical fiber 108 and the electronic component 109 may be shifted, and the optical coupling efficiency may be impaired.

  Also, if the input / output terminal 104 is long, when the entire package is distorted, bending stress is applied to the input / output terminal 104, causing breakage such as cracks in the input / output terminal 104, and the inside of the package can be sealed airtight. There was a case that disappeared.

  As a result, there is a problem that the operability of the electronic component 109 cannot be improved.

  Accordingly, the present invention has been completed in view of the above problems, and an object of the present invention is to provide an electronic component storage package having good high-frequency signal and optical signal transmission characteristics by effectively preventing distortion of the substrate. There is.

  The input / output terminal of the present invention includes a flat plate portion of a dielectric having a line conductor formed from one long side of the upper surface of the rectangular shape to the opposite long side, and an upper surface of the flat plate portion. It is characterized by comprising a standing wall portion of a dielectric material joined with a part interposed therebetween, and a metal plate having a longitudinal elastic modulus of 180 GPa or more joined to the lower surface of the flat plate portion in the longitudinal direction.

  Preferably, in the input / output terminal of the present invention, the metal plate is made of a copper-tungsten alloy or a copper-molybdenum alloy.

  Preferably, in the input / output terminal according to the present invention, the metal plate has a wide portion at a central portion and both end portions in a longitudinal direction.

  An electronic component storage package according to the present invention includes a metal base having a placement portion on which an electronic component is placed on an upper surface, and a metal attached to the upper surface of the base so as to surround the placement portion. And a mounting portion for an input / output terminal comprising a through hole or a notch communicating between the inside and the outside of the frame body, and an input / output terminal having the above-described configuration fitted to the mounting portion. To do.

  An electronic device according to the present invention includes an electronic component storage package having the above-described configuration, an electronic component that is mounted on the mounting portion and is electrically connected to the input / output terminal, and an upper surface of the frame. And a lid joined so as to cover the placing portion.

  The input / output terminal of the present invention includes a flat plate portion of a dielectric having a line conductor formed from one long side of a rectangular upper surface to the opposite long side, and a part of the line conductor on the upper surface of the flat plate portion. And a metal plate having a longitudinal elastic modulus of 180 GPa or more bonded to the lower surface of the flat plate portion and the longitudinal direction of the flat plate portion. When the base is screwed to the external electric circuit board, the metal plate joined to the lower surface of the input / output terminal serves as a reinforcing plate, and the package can be effectively prevented from being distorted. As a result, it is possible to effectively prevent the bending stress from acting on the electronic component placed on the base and to prevent the electronic component from being damaged such as a crack.

  In addition, when the electronic component is an optical semiconductor element such as an LD or PD by effectively suppressing the distortion of the package, the optical coupling efficiency between the optical fiber and the electronic component is not impaired, and the electronic component The transmission characteristic of the optical signal emitted from the light becomes good.

  Even when the input / output terminals are long, it is possible to prevent the input / output terminals from being damaged by cracks or the like due to bending stress when the electronic component storage package is distorted.

  In addition, since the ground potential of the lower ground conductor is reinforced by the metal plate, transmission loss that occurs in the high-frequency signal is reduced even if the input / output terminals are used in the package and the line conductor transmits a high-frequency signal for driving electronic components. The frequency can be reduced and the high-frequency signal can be transmitted efficiently.

  Preferably, in the input / output terminal of the present invention, since the metal plate is made of a Cu-W alloy or a Cu-Mo alloy, the alloy plate is suitable as a metal plate because its longitudinal elastic modulus is large and hard, and the package is distorted. Can be suitably suppressed, and the input / output terminals are preferably prevented from being damaged by cracks or the like. Further, when the input / output terminal is made of ceramics, the thermal expansion coefficients of these alloys are approximated, and therefore, it is suitable as a metal plate joined to the input / output terminal.

  Preferably, in the input / output terminal of the present invention, the metal plate has wide portions at the center and both ends in the longitudinal direction, so that the bending stress is greatest when the electronic device is screwed to the external electric circuit board. It can reinforce the central part of the input / output terminal that is easy to act, and when the input / output terminal is brazed to the frame, it reinforces both ends of the input / output terminal where thermal stress due to thermal expansion difference is most likely to be applied. be able to. As a result, it is possible to effectively prevent the input / output terminals from being damaged by cracks or the like.

  An electronic component storage package according to the present invention includes a metal base having a placement portion on which an electronic component is placed on an upper surface, and a metal frame attached so as to surround the placement portion on the upper surface of the base. And the input / output terminal mounting portion comprising a through hole or a notch communicating with the inside and the outside of the frame body, and the input / output terminal of the present invention fitted to the mounting portion, the high frequency in the input / output terminal Excellent signal transmission characteristics, prevents warping of the substrate, effectively prevents cracks and other damage to the flat part of the input / output terminals, and allows the metal plate to be firmly joined to the flat part to ensure airtightness. It will be highly reliable.

  The electronic device of the present invention includes the electronic component storage package of the present invention, an electronic component that is mounted on the mounting portion and electrically connected to the input / output terminal, and a mounting portion on the upper surface of the frame. By providing the lid joined so as to cover, the reliability of the electronic component storage package of the present invention is high.

  An input / output terminal and an electronic component storage package according to the present invention are shown in FIGS. 1A is a perspective view showing an example of an embodiment of an input / output terminal of the present invention, FIG. 1B is a bottom view of a flat plate portion of the input / output terminal of FIG. 1A, and FIG. FIG. 2 is a bottom view of a flat plate portion in another example of the embodiment of the terminal. FIG. 2 shows an example of the embodiment of the package using the input / output terminals of FIG. 1, and an optical semiconductor element such as an LD or PD is used as an electronic component. It is a perspective view of the package for accommodating. Hereinafter, description will be made by taking as an example a package on which an optical semiconductor element is mounted as an electronic component.

  In these drawings, 1 is a base, 2 is a frame, 3 is a cylindrical fixing member for fixing a metal holder 7 to which an optical fiber 8 is attached, 4 is an input / output terminal, and 6 is a seal ring. The base body 1, the frame body 2, the fixing member 3, the input / output terminal 4, and the seal ring 6 accommodate an electronic component 9 such as an LD or PD inside, and a lid is attached to the upper surface of the seal ring 6. A package is configured.

  The base body 1 has a mounting portion 1a for mounting the electronic component 9 on its upper surface, functions as a support member for supporting the electronic component 9, and efficiently generates heat generated when the electronic component 9 is operated to the outside. Has a function to dissipate. The base 1 has a screwing hole 1b, and is screwed to the external electric circuit board through the screwing hole 1b.

  The substrate 1 has a rectangular shape and is made of a metal such as an Fe—Ni—Co alloy or a Cu—W alloy. The substrate 1 is formed into a predetermined shape by subjecting an ingot such as an Fe—Ni—Co alloy to metal processing such as rolling or pressing.

  The base 1 is successively plated with a metal having excellent corrosion resistance and wettability with the brazing material, specifically, a Ni layer having a thickness of 0.5 to 9 μm and an Au layer having a thickness of 0.5 to 5 μm. The substrate 1 is preferably deposited by a method, and the substrate 1 can be effectively prevented from being oxidatively corroded, and the electronic component 9 can be firmly bonded and fixed to the upper surface of the substrate 1.

  In addition, the upper surface of the base body 1 is joined to the upper surface of the base body 1 with a brazing material such as Ag brazing so as to surround the mounting portion 1a, and the electronic component 9 and the external side are formed on both side portions on the long side. An optical transmission for forming an attachment portion 2a formed of a through hole or a notch for fitting the input / output terminal 4 to be electrically connected to the electric circuit, and optically coupling with the electronic component 9 on one side of the short side. It has a rectangular frame 2 made of a metal such as an Fe—Ni—Co alloy in which a through-hole 2b as a path is formed. As shown in FIG. 2, the mounting portion 2 a includes a notch formed by notching the lower side of the frame body 2 in addition to the case where the upper side of the frame body 2 is notched and the notch communicating with the inside and outside of the frame body 2. In this case, any of the cases where the frame 2 is formed of a through hole penetrating the center of the side surface of the frame 2 may be used.

  The frame 2 is formed into a predetermined shape by subjecting an ingot of the same alloy as that of the base 1 to metal processing such as rolling or pressing.

  The frame body 2 is joined to the base body 1 by joining the upper surface of the base body 1 and the lower surface of the frame body 2 through a brazing material such as preformed Ag brazing laid on the upper surface of the base body 1. Furthermore, a metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm may be deposited on the surface of the frame body 2 by a plating method in the same manner as the substrate 1.

  The mounting portion 2a of the frame 2 has a function of inputting / outputting a high frequency signal between the electronic component 9 and an external electric circuit, and an input / output terminal 4 having a function of blocking the inside / outside of the package, such as Ag solder. Joined with brazing material.

  The input / output terminal 4 has a line conductor 4c formed of a metallized layer such as W or Mo from one long side to the other long side of the upper surface of a flat plate portion 4a made of a rectangular dielectric. A standing wall portion 4b made of a quadrangular prism-shaped dielectric laid sideways on the upper surface of 4a is laminated at a substantially central portion in the short side direction of the flat plate portion 4a with a part of the line conductor 4c interposed therebetween in the longitudinal direction. Become. A metal plate 4g is bonded to the lower surface of the flat plate portion 4a.

  The line conductor 4c formed of a metallized layer such as W or Mo-Mn formed from one long side to the other long side opposite to each other is obtained by adding an organic solvent or a solvent to a powder such as W or Mo, for example. The obtained metal paste is formed by printing on a ceramic green sheet for the flat plate portion 4a in a predetermined pattern in advance by a well-known screen printing method and baking.

The flat portion 4a and the vertical wall portion 4b is, _Al 2 _{O 3} quality ceramic, AlN _ceramics, a dielectric such as 3Al ₂ O 3 · 2SiO ₂ Quality ceramics, the lower surface of the flat plate section 4a and the line conductor 4c on the entire surface A lower ground conductor 4d made of a similar metallized layer is formed. Further, a side ground conductor 4f made of a metallized layer similar to the line conductor 4c is formed on the side surfaces of the flat plate portion 4a and the standing wall portion 4b, and an upper ground conductor 4e is similarly formed on the upper surface of the standing wall portion 4b. Yes. A metal plate 4g made of a metal having a longitudinal elastic modulus of 180 GPa or more such as W, Mo, Cu—W alloy, Cu—Mo alloy or the like is provided on the surface of the lower ground conductor 4d through a brazing material such as Ag brazing along the longitudinal direction. It is joined.

  With this configuration, when the package is formed as an electronic device and the base 1 is screwed to the external electric circuit board, the metal plate 4g joined to the lower surface of the input / output terminal 4 serves as a reinforcing plate for reinforcing the package. The package can be effectively prevented from being distorted. As a result, it is possible to effectively prevent the bending stress from acting on the electronic component 9 placed on the base 1 and to prevent the electronic component 9 from being damaged such as a crack.

  Further, when the electronic component 9 is an optical semiconductor element such as an LD or PD by suppressing the distortion of the package, the optical coupling efficiency between the optical fiber 8 and the electronic component 9 is not impaired, and the electronic component 9 is not damaged. The transmission characteristic of the optical signal emitted from the component 9 is improved.

  When the input / output terminal 4 is as long as about 30 to 100 mm, the package may be distorted due to the difference in thermal expansion between the input / output terminal 4 and the frame 2 and between the input / output terminal 4 and the seal ring 6. Even in this case, the input / output terminal 4 can be prevented from being damaged by a crack or the like due to a bending stress when the package is distorted. That is, when the input / output terminal 4 is attached to the attachment portion 2a and the input / output terminal 4 is brazed in a state of being sandwiched between the seal ring 6 and the frame body 2, the difference in the thermal expansion coefficient between them causes Warpage may occur. When the warped substrate 1 is screwed to the external electric circuit board, the warp of the substrate 1 is corrected and bending stress acts on the entire package. When the input / output terminal 4 is long, a large bending stress acts. However, since the metal plate 4g is joined to the lower surface, even if the bending stress acts on the input / output terminal 4, the metal plate 4g The output terminal 4 becomes difficult to bend. As a result, even when the input / output terminal 4 is long, it is possible to prevent the input / output terminal 4 from being damaged such as a crack.

  Further, since the input / output terminal 4 is provided with the metal plate 4g on the lower surface, the ground potential of the lower ground conductor 4d is strengthened by the metal plate 4g, the input / output terminal 4 is used for the package, and the line conductor 4c is connected to the electronic component. Even if a high-frequency signal for driving 9 is transmitted, the high-frequency signal can be efficiently transmitted without causing transmission loss in the high-frequency signal, and the operability of the electronic component 9 is impaired even for the high-frequency signal. There is nothing.

  That is, the distance between the line conductor 4c, the lower ground conductor 4d, and the metal plate 4g can be adjusted, and the characteristic impedance of the line conductor 4c can be matched with a predetermined one, so that a high-frequency signal can be efficiently transmitted to the line conductor 4c. Can be transmitted.

  The metal plate 4g may be joined so that the upper surface thereof is embedded in the flat plate portion 4a. Even if the flat plate portion 4a is thinned by matching the impedance with a predetermined one, the metal plate 4g is reinforced. Thus, the strength of the input / output terminal 4 can be maintained, and the thickness of the flat plate portion 4a at both ends of the line conductor 4c is not reduced. The lead terminal is connected to the outer side of the input / output terminal 2, and the input / output terminal 4 is not easily damaged by the stress when an external force is applied to the lead terminal.

  If the longitudinal elastic modulus of the metal plate 4g is 180 GPa or more, breakage such as cracks can be effectively prevented even if the input / output terminal 4 is long, and if it is less than 180 GPa, breakage such as cracks can be prevented. It cannot be effectively prevented. Therefore, the metal plate 4g is 180 GPa or more.

  This metal plate 4g is made of W (longitudinal elastic modulus: about 500 GPa), Mo (longitudinal elastic modulus: about 330 GPa), Cu—W alloy (longitudinal elastic modulus: about 300 GPa), Cu—Mo alloy (longitudinal elastic modulus: about 200 GPa). ) Or the like is subjected to metal processing such as rolling or pressing to form a predetermined shape. Similarly to the base 1, if a metal layer such as a Ni layer having a thickness of 0.5 to 9 μm or an Au layer having a thickness of 0.5 to 5 μm is deposited by a plating method, oxidation of the surface of the metal plate 4g can be effectively prevented. .

  Preferably, the metal plate 4g is made of a Cu—W alloy or a Cu—Mo alloy, so that the longitudinal elastic modulus of these alloys is large and hard, so that the metal plate 4g is suitable as a metal plate and suitably suppresses distortion of the package. In addition, the input / output terminals are preferably prevented from being damaged by cracks or the like. Further, when the input / output terminal is made of ceramics, the thermal expansion coefficients of these alloys are approximated, and therefore, it is suitable as a metal plate joined to the input / output terminal.

  More preferably, as shown in FIG. 1C, the metal plate 4g has wide portions 4g-1 at the center and both ends in the longitudinal direction, so that the electronic device can be screwed to the external electric circuit board. It is possible to reinforce the central portion of the input / output terminal 4 that is most susceptible to bending stress, and when the input / output terminal 4 is brazed to the frame 2, the thermal stress due to the difference in thermal expansion is greatest. Both end portions of the input / output terminal 4 that are easily added can be reinforced. As a result, it is possible to effectively prevent the input / output terminal 4 from being damaged by a crack or the like.

  The side surfaces of both ends of the metal plate 4g do not need to be completely flush with the side surfaces of both ends of the flat plate portion 4a, and the flat plate portion 4a is sufficient to protect the input / output terminals 4 from thermal stress applied to the input / output terminals 4. What is necessary is just an edge part near a both-ends side surface.

  In this case, among the line conductors 4c, a high-frequency signal transmission line is preferably arranged immediately above the wide portion 4g-1 of the metal plate 4g. With this configuration, the ground potential with respect to the transmission line of the high-frequency signal can be reliably strengthened, and the high-frequency signal can be transmitted efficiently. The length of the wide portion 4g-1 of the metal plate 4g may be different depending on the position of the line conductor 4c serving as a high-frequency signal transmission line.

  A lead terminal 5 made of a metal such as an Fe-Ni-Co alloy for inputting / outputting a high frequency signal between the external electric circuit and the input / output terminal 3 is provided on the outer side of the frame body 2 of the line conductor 4c. Bonded with a brazing material such as

  When the package of the present invention is used as a package for mounting an optical semiconductor element, a through hole 2b is formed on one side of the short side of the frame 2, and the outer side of the through hole 2b in the frame 2 One end of the cylindrical fixing member 3 is joined around the opening with a brazing material such as Ag brazing. A metal holder 7 having an optical fiber 8 attached with an adhesive such as a resin is bonded to the other end surface of the fixing member 3 with a low melting point brazing material such as Au—Sn. The fixing member 3 is manufactured by processing the same metal as the base body 1 and the frame body 2 into a desired shape by the same processing method, and has a Ni layer having a thickness of 0.5 to 9 μm and a thickness of 0.5 to 5 on the surface thereof. A metal layer such as a 5 μm Au layer may be deposited by plating.

  Thus, the seal ring 6 is joined to the upper surface of the frame 2 to which the input / output terminal 4 and the fixing member 3 are attached by a brazing material such as Ag brazing. The seal ring 6 is joined to the upper surface of the frame body 2 with a brazing material such as Ag brazing to sandwich the input / output terminal 4, and a lid body for sealing the electronic component 9 is joined to the upper surface by seam welding or the like. It functions as a joining medium for

  In such a package, the electronic component 9 is mounted and fixed to the mounting portion 1a with a low melting point solder such as Sn-Pb solder, and the line conductor 4c of the input / output terminal 4 and the electrode of the electronic component 9 are bonded to the bonding wire. The metal holder 7 having the optical fiber 8 attached to the fixing member 3 with an adhesive such as resin is joined to the fixing member 3 with a low melting point brazing material such as Au—Sn, and then the upper surface of the seal ring 6. By joining the lid body so as to cover the placement portion 1a by seam welding or the like, an electronic device as a product is obtained.

  This electronic device is screwed to an external electric circuit board, and then optically excites the electronic component 9 by a drive signal supplied from the external electric circuit, and transmits and receives the excited light such as a laser beam to the optical fiber 8 as well as an optical fiber. By transmitting through the fiber 8, it functions as a photoelectric conversion device capable of transmitting a large amount of information at high speed, and is often used in the field of optical communications.

  Thus, according to the present invention, an electronic component operated by a high-frequency signal or an optical signal can be made normal and stable for a long time.

Examples of the input / output terminals of the present invention will be described below.
1A and 1B, the line conductor 4c made of a W metallization layer is formed at the center of the upper surface of the rectangular flat plate portion 4a made of Al ₂ O ₃ ceramics, and the input / output terminals shown in FIGS. A lower ground conductor 4d made of a W metallization layer was formed. Further, a rectangular parallelepiped upright wall portion 4b made of Al ₂ O ₃ ceramics on which an upper ground conductor 4e made of a W metallized layer is formed is laminated on the upper surface of the flat plate portion 4a with a part of the line conductor 4c interposed therebetween. . Side surface ground conductors 4f made of a metallized layer similar to the line conductor 4c were formed on both side surfaces of the flat plate portion 4a and the standing wall portion 4b parallel to the line direction of the line conductor 4c. Further, the input / output terminal 4 was fabricated by joining a metal plate 4g made of a Cu—W alloy, a Cu—Mo alloy, or an Fe—Ni—Co alloy to the lower surface of the flat plate portion 4a with Ag brazing.

  In this input / output terminal 4, the width of the flat plate portion 4 a in a plan view is 4.5 mm, the length is 33 mm, the flat plate portion 4 a is 1.27 mm thick, the metal plate 4 g is 0.6 mm thick, and the length is 33 mm. The width in the plan view shape was 2.3 mm.

  A rectangular flat plate-shaped base 1 made of Fe-Ni-Co alloy with a long side of 40 mm, and a rectangular tube-shaped long side made of Fe-Ni-Co alloy with a length of 36 mm and a mounting portion The frame 2 having a length of 2a of 33 mm, the seal ring 6 having a thickness of 1 mm having the same planar view shape as the frame 2, and the input / output terminal 4 attached so as to be fitted into the attachment portion 2a The sample of the electronic component storage package was produced by bonding with the above. In the sample of this package, about the metal plate 4g, three types with different component ratios of Cu and W of the Cu-W alloy, three types with different component ratios of Cu and W of the Cu-Mo alloy, A total of seven types of one Fe-Ni-Co alloy were prepared and used as samples P1 to P7, respectively. Table 1 shows the longitudinal elastic modulus and linear expansion coefficient of each metal plate 4g used in Samples P1 to P7.

In these samples P1 to P7, the longitudinal elastic modulus of Al ₂ O ₃ ceramics at room temperature (25 ° C.) is 301 Gpa (gigapascal), the linear expansion coefficient is 5.74 × 10 ⁻⁶ / ° C., and Fe—Ni—Co The longitudinal elastic modulus of the alloy is 138 Gpa, the linear expansion coefficient is 5.4 × 10 ⁻⁶ / ° C., the longitudinal elastic modulus of Ag low is 87 Gpa, and the linear expansion coefficient is 18 × 10 ⁻⁶ / ° C.

  Next, for the samples P1 to P7, after completing the package, screws were inserted into the screw fixing portions 1b provided at the four corners of the base 1 and fixed on the flat plate, and the bottom surface of the base 1 was brought into close contact with the flat plate. It was in a state. Thereafter, the package was removed from the flat plate, and the presence or absence of cracks on the surface of the input / output terminal 4 was confirmed using a 10 × optical microscope.

  Further, with respect to these samples P1 to P7, when screws are inserted into the screw fixing portions 1b provided at the four corners of the base 1 and fixed on the flat plate, the bottom surface of the base 1 is brought into close contact with the flat plate. The maximum principal stress generated at the input / output terminal 4 was determined by finite element method analysis (MSc.Marc, manufactured by mscsoftware).

Table 1 shows the results of confirming the maximum principal stress generated in the input / output terminal 4 and the presence or absence of cracks on the surface of the input / output terminal 4.

  In samples P6 and P7, a crack occurred in the input / output terminal 4. Therefore, it was found that the samples P1 to P5 are effective in preventing the input / output terminal 4 from being damaged, and that the longitudinal elastic modulus of the metal plate 4g is effective to be 180 GPa or more.

  The present invention is not limited to the above-described embodiments and examples, and various modifications may be made without departing from the scope of the present invention. For example, the above embodiment has been described by taking an optical package as an example, but the electronic component 9 is not limited to an optical semiconductor element, and the package of the present invention includes a light emitting element (LED) and a field effect transistor (FET). It can also be applied to electronic components 9 such as integrated circuit elements (ICs), capacitors, and piezoelectric elements.

  2 shows a case where the base body 1 and the frame body 2 have a quadrangular shape in plan view, but the present invention is not limited to this, and the plan view shape of the base body 1 and the frame body 2 is hexagonal, eight A square shape, an oval shape, etc. may be sufficient and it can be set as various shapes.

(A) is a perspective view showing an example of an embodiment of the input / output terminal of the present invention, (b) is a bottom view of the input / output terminal of (a), and (c) is an embodiment of the input / output terminal of the present invention. It is a bottom view which shows the other example. It is a perspective view which shows an example of embodiment of the electronic component storage package of this invention using the input / output terminal of FIG. It is a perspective view which shows the example of the conventional input / output terminal. FIG. 4 is a perspective view showing an example of a conventional electronic component storage package using the input / output terminals of FIG. 3.

Explanation of symbols

1: Base 1a: Placement part 2: Frame 2a: Mounting part 4: Input / output terminal 4a: Flat plate part 4b: Standing wall part 4c: Line conductor 4g: Metal plate 4g-1: Wide part 9: Electronic component

Claims (5)

A dielectric flat plate portion having a line conductor formed from one long side of the rectangular upper surface to the opposite long side, and a part of the line conductor sandwiched between the upper surfaces of the flat plate portion An input / output terminal comprising a standing wall portion of the dielectric material and a metal plate having a longitudinal elastic modulus of 180 GPa or more bonded to the lower surface of the flat plate portion in the longitudinal direction. 2. The input / output terminal according to claim 1, wherein the metal plate is made of a copper-tungsten alloy or a copper-molybdenum alloy. The input / output terminal according to claim 1, wherein the metal plate has a wide portion at a center portion and both end portions in a longitudinal direction. A metal base having a placement portion on which an electronic component is placed on an upper surface; a metal frame attached on the upper surface of the base so as to surround the placement portion; and inner and outer sides of the frame An input / output terminal mounting portion comprising a through hole or a notch communicating therewith, and the input / output terminal according to any one of claims 1 to 3 fitted into the mounting portion. A package for storing electronic components. The electronic component storage package according to claim 4, an electronic component placed on the placement portion and electrically connected to the input / output terminal, and the placement portion covered on the upper surface of the frame An electronic device comprising: a lid joined to the electronic device.

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