JP2006080132A - Bonding apparatus and method, and electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bonding apparatus capable of bonding while maintaining a clean environment even when members related to bonding are arranged in an unstable state.
SOLUTION: A blower 143 is provided to generate an air flow 1431 so that dust does not enter a space surrounding a circuit member 121. On the other hand, the cover member 144 is provided so that the airflow directly hits the circuit member and does not cause the circuit member support portion 141 to be displaced. Therefore, it is possible to prevent bonding of the circuit member with respect to the circuit member support portion and to perform bonding while maintaining a clean environment.
[Selection] Figure 1

Description

  The present invention relates to a bonding apparatus for placing electronic components on a member on which a circuit is formed, and particularly to a bonding apparatus and method that require high cleanliness in the atmosphere in the placing process of the electronic parts, and the bonding apparatus. The present invention relates to an electronic device manufactured by

In the manufacture of semiconductor components, dust contamination into the components is a cause of deterioration of component yield, component reliability, and the like, so it is important to eliminate dust. Therefore, conventionally, a configuration has been adopted in which the atmosphere in the entire semiconductor manufacturing factory is made highly clean, and further, clean air is supplied into the semiconductor manufacturing apparatus installed in such a clean room. . Also proposed is a robot apparatus that is used when manufacturing an object to be processed such as a part or product in a place other than the clean room, and is configured to maintain a local space only in the vicinity of the object to be processed. (For example, refer to Patent Document 1).
Further, in the manufacture of an image pickup device in which a CCD (charge coupled device) is mounted on a substrate portion on which a circuit is formed, conventionally, the number of pixels in the image pickup device is small, and it is not necessary to strictly manage dust. However, in recent years, the number of pixels has increased so much that the influence of dust cannot be ignored even in an image sensor manufacturing apparatus.
Japanese Patent Laid-Open No. 9-3000271

Further, for example, as included in the manufacturing process of the imaging device, there is a step of manufacturing an electronic device by bonding an electronic component to a circuit member on which a circuit is formed. In the bonding step, if dust enters the joint between the electronic component and the circuit member, it leads to a product failure. Therefore, it is necessary to maintain the space where the electronic component and the circuit member exist in a clean environment. Therefore, for example, a method of spraying clean air on the circuit member and the electronic component using the method disclosed in Patent Document 1 can be considered.
However, in the bonding process, the circuit member to which the electronic component is bonded may not be actively held. Therefore, when clean air is blown in order to maintain the cleanliness as described above, there is a problem that the position of the circuit member is shifted or worst blown away by the wind force. However, as described above, a clean environment must be maintained in the bonding process.

  The present invention has been made in such a situation, and a bonding apparatus and method capable of bonding while maintaining a clean environment even when members related to bonding are arranged in an unstable state, and the above bonding apparatus An object of the present invention is to provide an electronic device manufactured in (1).

In order to achieve the above object, the present invention is configured as follows.
That is, the bonding apparatus according to the first aspect of the present invention includes a bonding head for holding an electronic component, raising and lowering the electronic component in the vertical direction, and bonding the held electronic component to a circuit member;
A circuit member support that supports the circuit member without actively holding the circuit member;
An air blower that is provided between the bonding head and the circuit member support, and generates an air current that prevents dust from adhering to the circuit member supported by the circuit member support;
It is provided between the air blower and the circuit member supported by the circuit member support portion, and is made of a plate material extending in a horizontal direction orthogonal to the vertical direction, and is supported by the circuit member support portion. A cover member for preventing the airflow from hitting the circuit member and preventing the circuit member from being displaced in the circuit member support portion, and preventing dust from adhering to the circuit member;
It is provided with.

  By providing the blower, an air flow is generated so that dust does not enter the space surrounding the circuit member. On the other hand, a cover member was provided so that the air current directly hits the circuit member and did not cause a positional shift of the circuit member with respect to the circuit member support portion. Therefore, dust does not adhere to the circuit member, and it is possible to prevent the circuit member from being displaced from the circuit member support portion.

The airflow is formed by providing either a blower or a suction device for sucking air, or by providing both of them. The direction of the airflow may be either the horizontal direction or the vertical direction. In the horizontal direction, the direction is not limited as long as the direction is orthogonal to the up-down direction. According to the air flow in the horizontal direction, dust falling toward the circuit member can be blown off in the horizontal direction, and dust can be prevented from adhering to the circuit member. Further, in the case of the vertical direction, the airflow may be not only from the top to the bottom but also from the bottom to the top. According to the air flow in the vertical direction, a so-called air curtain can be formed around the circuit member, and the space around the circuit member can be kept clean.
In the case of forming an air flow in the vertical direction, the blower or the suction machine can be installed separately from the bonding head, or the blower or the suction machine can be attached to the bonding head.

  Further, since the cover member is disposed so as to cover the circuit member, in order to bond the electronic component to the circuit member, the electronic component needs to pass through the cover member in the vertical direction. Therefore, the cover member has a passage having a size that allows electronic components to pass therethrough. The passage may be an opening formed in the cover member, or may be a gap between the cover member and the cover member formed by a plurality of cover members divided into a plurality of sheets.

  In the case where the airflow is formed in the horizontal direction, the windward passage forming end that is located on the windward side of the airflow generated in the blower and forms the passage in the cover member, the airflow is directed to the anti-circuit member side. The leeward side passage forming end that has a bulging portion to be oriented and is located on the leeward side of the airflow generated in the blower and forms the passage extends in the horizontal direction or at an acute angle toward the circuit member side It can also be configured to have an inclined dust entrainment prevention part.

  By providing the spring-up portion, the airflow that has approached the passage is directed upward and can be prevented from entering the circuit member side. Furthermore, by providing dust prevention, the airflow that has passed through the passage can be directed upward, and the airflow is prevented from entering the circuit member side.

  On the other hand, when the airflow is formed in the vertical direction, the passage forming end that forms the passage has the above-described jumping portion, thereby preventing the airflow from entering the circuit member side.

The bonding method according to the second aspect of the present invention is a bonding method in which an electronic component is lowered and bonded along a vertical direction with respect to a circuit member supported without being actively held by a circuit member support portion. In
When flowing a gas for preventing dust from adhering to the circuit member along a horizontal direction perpendicular to the vertical direction between the circuit member and the electronic component, a plate-like shape extending in the horizontal direction is used. The cover member prevents airflow from hitting the circuit member to prevent the circuit member from being displaced in the circuit member support portion, and performs bonding while preventing dust from adhering to the circuit member. It is characterized by that.

  The electronic device according to the third aspect of the present invention is characterized in that the circuit member and the electronic component are bonded by the bonding apparatus according to the first aspect.

  According to the bonding apparatus of the first aspect and the bonding method of the second aspect of the present invention, by providing the blower, it is possible to generate an air flow that prevents dust from entering the space surrounding the circuit member. Therefore, it is possible to prevent dust from adhering to the circuit member, and it is possible to reduce dust contamination even in bonding with electronic components. Furthermore, by providing the cover member, the airflow can be prevented from directly hitting the circuit member, and the circuit member can be prevented from being displaced relative to the circuit member support portion. Therefore, by providing the blower and the cover member, bonding is possible while maintaining a clean environment even when members related to bonding are arranged in an unstable state.

  Further, according to the electronic device of the third aspect of the present invention, the cover member provided in the bonding apparatus of the first aspect prevents the positional displacement of the circuit member and the adhesion of dust to the circuit member. It becomes an electronic element in which the circuit member is reliably and electrically joined with high accuracy.

A bonding apparatus according to an embodiment of the present invention, a bonding method executed by the bonding apparatus, and an electronic element manufactured by the bonding apparatus will be described in detail below with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected about the same component.
As shown in FIG. 2, the entire configuration of the bonding apparatus 101 according to the present embodiment includes a circuit member supply unit 120, a component supply unit 130, a bonding unit 140, an unloading unit 150, in one housing 110. A paste application unit 160 is accommodated and arranged. Further, the inside of the housing 110 is a clean environment as compared with the outside, and is in a state like a so-called clean room.
Such a bonding apparatus 101 is an apparatus for bonding the electronic component 122 to the circuit 1211 formed on the circuit member 121 in the bonding section 140 to produce the electronic element 123 shown in FIG. It is.

The circuit member supply unit 120 includes a device that conveys the circuit member 121 carried into the bonding apparatus 101 to the bonding unit 140. Actually, the circuit member 121 is transported by transporting a pallet on which a plurality of circuit members 121 are placed.
The component supply unit 130 includes a device that conveys the electronic component 122 carried into the bonding apparatus 101 to the bonding unit 140.

As shown in FIGS. 1 and 3, the bonding unit 140 is a circuit that mounts the pallet on which a plurality of circuit members 121 are mounted and supports each circuit member 121, which is supplied by the circuit member supply unit 120. A member support unit 141, a bonding head 142 that holds the electronic component 122 supplied by the component supply unit 130 and performs a bonding operation, a blower 143, and a cover member 144 are provided. The bonding unit 140 is one of characteristic components in the bonding apparatus 101 of this embodiment, and will be described in more detail below.
As shown in FIG. 3, the adhesive paste 211 is applied to the bumps 1221 formed on the electrode portions of the electronic component 122, and the bonding operation in the bonding apparatus 101 is performed in the electronic component 122 with the adhesive paste 211. Is placed on the specified position of the circuit member 121 supported by the circuit member support portion 141, and is not an operation of fixing the electronic component 122 and the circuit member 121. Further, as shown in FIG. 3, the circuit member support portion 141 merely supports the circuit member 121, and does not actively hold the circuit member 121 by, for example, an adsorption operation.

The paste application unit 160 is an apparatus for applying the adhesive paste 211 to the bumps 1221, and is installed adjacent to the bonding unit 140. The adhesive paste 211 is made of a conductive resin material containing a conductive material such as silver particles.
The carry-out unit 150 has a carry-out device for carrying out the electronic element 123 on which the electronic component 122 is placed on the circuit member 121 in the bonding unit 140 from the bonding apparatus 101 to the next process.

  The types of the circuit member 121 and the electronic component 122 are not particularly limited, but in the present embodiment, the electronic element 123 corresponds to an image sensor used in, for example, a mobile phone, and the electronic component 122 is a CCD (charge). Corresponds to a coupling element). In addition, as an example of the size of the circuit member 121, one side has a substantially square shape with a side of about 10 mm, and has a thickness of about 1 to 2 mm. Therefore, the CCD as the electronic component 122 is much smaller in size than the circuit member 121. Therefore, very fine dust can adversely affect the bonding between the electronic component 122 and the circuit member 121.

The bonding unit 140 will be described in more detail.
As described above, in the bonding apparatus 101 provided with the bonding unit 140, clean air is flowed into the housing 110, and the housing 110 maintains a cleanliness level equal to or higher than a specified level. However, in the housing 110, as described above, the transport device such as the circuit member 121 and the electronic component 122 is provided and operated, so that dust such as metal powder and grease particles is generated. Further, since the bonding part 140 is a part for bonding the electronic component 122 to the circuit member 121, the bonding part 140 is a part that requires a particularly high cleanliness even within the housing 110.
Therefore, in this embodiment, the bonding unit 140 includes a blower 143 and a cover member 144 as one of characteristic components in addition to the bonding head 142 and the circuit member support unit 141.

  As shown in FIG. 1, the bonding head 142 holds the electronic component 122 by, for example, a suction operation, and moves in the X-axis direction by the X-moving device 1421 while holding the electronic component 122. The apparatus moves in the vertical direction 119 and bonds the held electronic component 122 to the circuit member 121.

As described above, the circuit member support unit 141 is mounted on the stage 1412 on which the pallet 1411 loaded with the circuit members 121 arranged in a lattice shape and loaded from the circuit member supply unit 120 is placed. By placing the pallet 1411 on the stage 1412, a pin 1413 that supports the circuit member 121 on the pallet 1411 and a Y-movement that moves the stage 1412 in the Y-axis direction perpendicular to the X-axis on the plane. Device 1414.
In the case of the present embodiment, the electronic component 122 is placed on the electronic component placement surface of the circuit member 121 constituting the electronic element 123, but on the back surface of the circuit member 121 facing the electronic component placement surface. There is almost no flat surface. Therefore, the circuit member support part 141 cannot actively hold the circuit member 121 by, for example, an adsorption operation. Therefore, in the present embodiment, the circuit member 121 is simply supported by the pins 1413 on the circuit member support portion 141.

As described above, since the bonding head 142 is moved in the X-axis direction by the X-moving device 1421, while the circuit member support portion 141 is moved in the Y-axis direction by the Y-moving device 1414, the circuit member support is performed. The electronic component 122 can be bonded to each of the plurality of circuit members 121 mounted on the portion 141.
As described above, in the present embodiment, the bonding head 142 and the circuit member support 141 are each configured to be movable only in one direction, but are not limited thereto. For example, the circuit member support 141 may be fixed and the bonding head 142 may be movable in both the X and Y axes. Conversely, the circuit member support 141 may be moved in both the X and Y axes. A possible configuration can also be adopted. In short, the bonding head 142 and the circuit member support 141 may be configured to be relatively movable in the X and Y axis directions.

  As shown in FIG. 1, the blower 143 is provided between the bonding head 142 and the circuit member support 141 in the vertical direction 119, more specifically, between the bonding head 142 and the cover member 144. It is an airflow generation device that generates an airflow 1431 that is a flow of clean gas such as air or nitrogen gas. Dust can be blown off by the air flow 1431, and adhesion of dust to the circuit member 121 supported by the circuit member support portion 141 can be prevented. Therefore, in other words, the airflow 1431 can be said to be an airflow that prevents dust from adhering to the circuit member 121 supported by the circuit member support portion 141. In the present embodiment, the blower 143 includes a blower 1432 and a suction machine 1433 that sucks air, and generates an air flow 1431 along a horizontal direction 118 that is parallel or substantially parallel to the cover member 144 and perpendicular to the vertical direction 119. generate. In order to prevent generation of excessive gas and generation of an unnecessary air flow, it is preferable that the suction flow rate by the suction device 1433 is made larger than the flow rate by the blower 1432. The blower 143 is configured to generate a laminar flow instead of a turbulent flow.

As shown in FIG. 5, the direction of the airflow 1431 is related to the extending direction 1442 of the passage 1441 included in the cover member 144 described below. That is, since the probability that dust will pass through the passage 1441 and reach the circuit member 121 can be reduced when the crossing distance of the passage 1441 in the airflow 1431 is as short as possible, the direction of the airflow 1431 is planar with respect to the extending direction 1442. It is preferable that the direction is orthogonal. In the present embodiment, the direction of the airflow 1431 is along the Y-axis direction. Therefore, the direction of the airflow 1431 changes according to the extending direction 1442 of the passage 1441, and may be in the Y-axis direction or the like.
However, the direction of the airflow 1431 is not limited to the above-described configuration, and may be a direction along the extending direction 1442.

  In addition, as shown in FIG. 1, the gap size 1434 between the airflow 1431 and the cover member 144 is not particularly specified, but the airflow 1431 blows off the dust that adheres to the circuit member 121 as described above. Therefore, it is preferable that the cover member 144 is formed so as to flow slightly above the surface 144a rather than in contact with the surface 144a of the cover member 144.

  Further, for the purpose of forming an air flow for blowing off dust to be attached to the circuit member 121, the width 1435 of the air flow 1431 may be at least a dimension that matches the length 1443 along the extending direction 1442 of the passage 1441. However, as shown in FIG. 5, the airflow 1431 is preferably formed over the entire surface of the cover member 144. In the present embodiment, the blower 1432 and the suction device 1433 have a length equal to or greater than the full width of the cover member 144. The airflow width 1435 and the passage length 1443 are dimensions in a direction perpendicular to the airflow 1431 on a plane.

  Further, as shown in FIG. 1, the thickness 1436 of the airflow 1431 in the vertical direction 119 is not particularly specified, but the bonding head 142 is disposed above the cover member 144 as described above. When the electronic component 122 moves in the horizontal direction 118 while being held by the bonding head 142, a size that prevents the airflow 1431 from hitting the electronic component 122 is preferable.

  The speed of the airflow 1431 is theoretically determined with respect to the dust until the dust that freely falls in the vertical direction 119 toward the one end on the windward side of the passage 1441 falls on the other end on the leeward side of the passage 1441. The flow rate is such that the passage 1441 is traversed. However, since various dusts are present as described above, it is not possible to determine the flow velocity in general.

In the present embodiment, as described above, the air blower 143 includes both the air blower 1432 and the suction device 1433. In short, since it is sufficient to generate the air flow 1431, it is only necessary to have at least one of them. However, as described above, it is preferable to provide the suction machine 1433 when either one is provided from the viewpoint of preventing unnecessary airflow. The suction machine 1433 preferably has a filter for filtering the sucked air and is configured to discharge the air that has passed through the filter. Similarly, the blower 1432 is also preferably configured to supply, for example, clean air that has passed through a filter or gas such as nitrogen gas.
Of course, the blower 143 is installed in a place where it does not interfere with the bonding head 142.

  The cover member 144 is provided between the air blower 143 and the circuit member 121 supported by the circuit member support portion 141, is made of a plate material extending in the horizontal direction 118, and is formed by the air blower 143. 1431 is a member that prevents the circuit member 121 from being displaced in the circuit member support portion 141 by preventing the contact 1431 from hitting the circuit member 121 supported by the circuit member support portion 141. As described above, the circuit member 121 is simply supported by the pins 1413 on the circuit member support portion 141. On the other hand, in the mounting operation of the electronic component 122 at the specified position of the circuit member 121, a mounting accuracy of about 5 to 10 μm is required. Therefore, when the airflow 1431 directly hits the circuit member 121, the circuit member 121 may be misaligned, and the mounting accuracy may not be satisfied. Therefore, the positional deviation of the circuit member 121 due to the airflow 1431 must be avoided.

  As shown in FIGS. 1 and 5, the cover member 144 is arranged so as to cover the circuit member 121 placed on the pallet 1411. In addition, since the bonding head 142 is disposed above the cover member 144 and the circuit member 121 exists below the cover member 144, the bonding head 142 is attached to the bonding member 142 when the electronic component 122 is bonded to the circuit member 121. The held electronic component 122 needs to penetrate the cover member 144. Therefore, the cover member 144 has a passage 1441 through which the electronic component 122 can pass. The passage 1441 may be an opening formed in the cover member 144 as shown in FIGS. 1 and 5. For example, as shown in FIG. 6, the cover member 144 is formed by a plurality of cover members 144. -1 and the cover member 144-2. In the present embodiment, as described above, the bonding head 142 is moved along the X-axis direction by the X-moving device 1421, and the circuit member support portion 141 includes a plurality of lattice-shaped arrangements. The electronic component 122 is supported. Therefore, for convenience of the bonding operation of the electronic component 122 to the circuit member 121, the passage 1441 extends along the X-axis direction in this embodiment. That is, in the present embodiment, the extending direction 1442 and the X-axis direction are parallel.

  The passage 1441 covers the circuit member 121 as much as possible, and has a size that allows at least the electronic component 122 and the component holding member 1422 of the bonding head 142 holding the electronic component 122 to pass therethrough. In addition, when the circuit member support part 141 is the structure which supports only one electronic component 122, the channel | path 1441 becomes a magnitude | size corresponding to this.

  In the cover member 144, as shown in FIG. 1, the passage forming end 1444 that forms the passage 1441 may have a shape parallel to the horizontal direction 118 that is the same as the direction of the airflow 1431, but the airflow 1431 passes through the passage 1441. In order to suppress the entry to the side, the shape as shown in FIG. 7 is preferable. That is, the windward passage forming end 1444-1 that is located on the windward side of the airflow 1431 and forms the passage 1441 in the passage 1441 is bent toward the anti-circuit member side 1445 so that the airflow 1431 is oriented toward the anti-circuit member side 1445. It is preferred to have a raised bounce portion 1446. The leeward side passage forming end 1444-2 that is located on the leeward side of the airflow 1431 and forms the passage 1441 has a shape extending in the horizontal direction 118, or is inclined toward the circuit member 121 side at an acute angle. It is preferable to have a dust entrainment prevention unit 1447. By providing the jump-up portion 1446, the airflow 1431 is directed to the counter-circuit member side 1445 immediately before reaching the passage 1441, so that dust can be prevented from entering the circuit member 121 side through the passage 1441. Can do. In addition, by providing the dust entrainment prevention portion 1447, the airflow 1431 that has passed over the passage 1441 can be prevented from entering the circuit member 121 side, and the airflow 1431 can be guided to the anti-circuit member side 1445. Intrusion of dust into the 121 side can be reduced.

In the above-described embodiment, the air blower 143 generates the airflow 1431 in a direction parallel to the horizontal direction 118. However, the present invention is not limited to this, and the air blower 143 is in a direction parallel or substantially parallel to the vertical direction 119 as follows. An airflow 1451 may be generated. For example, as shown in FIG. 8, a blower 145 provided with at least one of a blower 1452 and a suction machine 1453 may be provided above the cover member 144 to generate the airflow 1451. The installed blower 1452 and suction machine 1453, or the blower 1452 or suction machine 1453, is provided as a set across the passage 1441, and extends along the extending direction 1442 of the passage 1441. It is preferable to be installed as follows. Further, the passage forming end 1444 that forms the passage 1441 preferably has the above-mentioned bounce-up portion 1446 as shown in FIG.
With this configuration, a so-called air curtain is formed by the airflow 1451 along the extending direction 1442 of the passage 1441, so that dust can be prevented from entering the circuit member 121 side through the passage 1441. it can.
Note that the blower 145 must be arranged so as to prevent interference with the bonding head 142.

  Further, the configuration for generating the airflow 1451 in the vertical direction 119 is not limited to the configuration shown in FIG. 8. For example, as shown in FIG. 9, a blower 1452 extending along the extending direction 1442 of the passage 1441 is bonded. The structure attached to the head 142 can also be taken. In this configuration as well, it is preferable that the passage forming end 1444 forming the passage 1441 has the above-mentioned bounce-up portion 1446 as shown in FIG.

  The air flow 1451 is a flow of air from the top to the bottom, but conversely, an air flow from the bottom to the top may be generated. Moreover, it is preferable that the air blower which comprises the air blower 143 and the air blower 145 is comprised so that clean air which passed the filter, for example, or gas, such as nitrogen gas, for example may be supplied. Further, the airflow 1431 and the airflow 1451 can be set to a higher temperature than the gas temperature in the surrounding environment.

The operation of the bonding apparatus 101 configured as described above will be briefly described below. Note that the operation control of the bonding apparatus 101 is executed by the control apparatus 180 that is provided in the bonding apparatus 101 and controls the operation of the bonding apparatus 101.
The bonding device 101 is supplied with the circuit member 121 and the electronic component 122 from the previous step. The circuit member 121 and the electronic component 122 are supplied to the bonding unit 140 by the circuit member supply unit 120 and the component supply unit 130, respectively. In the bonding unit 140, the adhesive paste 211 is applied to the electronic component 122 held by the bonding head 142 using the paste application device 160, and then the electronic component 122 is connected to the circuit member by the bonding head 142. Bonded to 121.

  Before and after the bonding operation, as described above, the air flow 1431 is formed by the blower 143 or the air flow 1451 is formed by the blower 145. Therefore, the entry of dust into the circuit member 121 through the passage 1441 of the cover member 144 is reduced. Further, even when the airflow 1431 or the airflow 1451 is formed, the cover member 144 prevents the airflow 1431 or the airflow 1451 from directly hitting the circuit member 121. Therefore, it is possible to prevent the circuit member 121 supported in an unstable state on the circuit member support portion 141 from being displaced due to the airflow 1431 or the wind force of the airflow 1451. Therefore, since the bonding operation can be performed in a clean environment and in a state where mounting accuracy can be ensured, the yield of the electronic elements 123 can be improved.

In particular, when the air flow 1431 parallel to the horizontal direction 118 is formed, the electronic component 122 held by the bonding head 142 passes through the air flow 1431 in the vertical direction 119 during the bonding operation. Become. However, since the bonding head 142 sufficiently holds the electronic component 122 by the adsorption operation, and the wind force of the airflow 1431 does not blow the electronic component 122 held by the bonding head 142. For example, the held electronic component 122 is not displaced or skipped, and bonding can be performed normally.
As described above, the air flow 1431 can flow continuously regardless of the bonding operation. However, when the electronic component 122 held by the bonding head 142 passes through the air flow 1431, the formation of the air flow 1431 is temporarily stopped. Alternatively, the airflow 1431 may be weakened.
These airflow control operations are executed by the control device 180 of the bonding apparatus 101.

The electronic element 123 produced by the bonding operation is unloaded from the bonding unit 140 by the unloading unit 150 and further conveyed to the next process.
This completes a series of bonding steps.

  As described above, according to the bonding apparatus 101 of the present embodiment, the air blowers 143 and 145 are provided to generate the airflows 1431 and 1451 to prevent the dust from adhering to the circuit member 121, and The cover member 144 is provided so that the airflows 1431 and 1451 do not directly hit the circuit member 121 supported by the circuit member support portion 141 in a stable state. Therefore, even when the circuit member 121 is arranged in an unstable state, it is possible to perform bonding while maintaining a clean environment.

In addition, it is a structure similar to the structure shown in FIG. 8, Comprising: The structure which does not provide the cover member 144 can also be taken. In this configuration, the blower 1452 is disposed above the circuit member support 141, and the suction device 1453 is disposed at a height position equivalent to the circuit member support 141 or at a position below the circuit member support 141, Further, the blower 1452 and the suction device 1453 are arranged so as to surround the circuit member support portion 141.
According to such a configuration, a so-called air curtain is formed around the circuit member support portion 141 by the blower 1452 and the suction device 1453, and dust adversely affects the circuit member 121 during the bonding operation. Can be prevented.

  In the bonding apparatus 101 described above, the cover member 144 is fixed and does not move. However, the cover member 144 is movable in the X and Y axis directions, and the electronic component 122 is bonded to the circuit member 121. Also good. In this case, at the time of bonding, it is necessary to stop the air blowers 143 and 145 and stop the formation of the airflows 1431 and 1451, but there is also an advantage that the passage 1441 need not be formed in the cover member 144.

  The present invention is a bonding apparatus for placing electronic components on a member on which a circuit is formed, and is particularly applicable to a bonding apparatus that requires high cleanliness in an atmosphere in the placement process of the electronic components.

It is a figure which shows schematic structure of the bonding part with which the bonding apparatus in embodiment of this invention is equipped. It is a top view of the bonding apparatus shown in FIG. It is a figure for demonstrating the bonding operation performed in the bonding part shown in FIG. It is a figure which shows the electronic device produced in the bonding part shown in FIG. It is a top view of the bonding part shown in FIG. 1, Comprising: It is a figure which shows an air blower and a cover member. It is a figure which shows the modification of the cover member shown in FIG. It is a detailed figure of the channel | path part of the cover member shown in FIG. It is a figure which shows the modification of the air blower shown by FIG. It is a figure which shows another modification of the air blower shown by FIG. FIG. 10 is a detailed view of a passage portion of the cover member shown in FIG. 1 when the blower shown in FIGS. 8 and 9 is provided.

Explanation of symbols

101 ... bonding device, 118 ... horizontal direction, 119 ... vertical direction,
121 ... Circuit member, 122 ... Electronic component, 141 ... Circuit member support part,
142: bonding head, 143: blower, 144 ... cover member,
145 ... Blower,
1431 ... Airflow, 1432 ... Blower, 1433 ... Suction machine, 1441 ... Passage,
1444 ... passage forming end, 1444-1 ... windward passage forming end,
1444-2 ... the leeward side passage forming end, 1445 ... the side opposite to the circuit member,
1446 ... Bounce-up part, 1447 ... Dust entrainment prevention part, 1451 ... Airflow,
1452 ... Blower, 1453 ... Suction machine.

Claims (9)

A bonding head for holding an electronic component, raising and lowering the electronic component in the vertical direction, and bonding the held electronic component to a circuit member;
A circuit member support that supports the circuit member without actively holding the circuit member;
An air blower that is provided between the bonding head and the circuit member support, and generates an air current that prevents dust from adhering to the circuit member supported by the circuit member support;
It is provided between the air blower and the circuit member supported by the circuit member support part, and is made of a plate material extending in a horizontal direction perpendicular to the vertical direction, and is supported by the circuit member support part. A cover member for preventing the airflow from hitting the circuit member and preventing the circuit member from being displaced in the circuit member support portion, and preventing dust from adhering to the circuit member;
A bonding apparatus comprising:   The bonding device according to claim 1, wherein the blower device includes at least one of a blower and a suction device that generate an air flow parallel to the cover member.   The bonding apparatus according to claim 1, wherein the cover member has a passage through which the electronic component can pass with respect to a circuit member to which the electronic component is bonded.   In the cover member, an upwind passage forming end that is located on the upwind side of the airflow generated in the blower and forms the passage has a jumping portion that directs the airflow toward the anti-circuit member side, and The leeward side passage forming end that is located on the leeward side of the airflow generated in the apparatus and forms the passage has a dust entrainment prevention portion that extends in the horizontal direction or is inclined toward the circuit member side at an acute angle. The bonding apparatus according to claim 3. The blower device has at least one of a blower and a suction device that generate an airflow parallel or substantially parallel to the vertical direction,
The bonding apparatus according to claim 1, wherein the cover member has a passage through which the electronic component can pass with respect to a circuit member to which the electronic component is bonded.   The bonding apparatus according to claim 5, wherein a passage forming end that forms the passage has a bounce portion that directs the airflow toward the counter-circuit member.   The bonding apparatus according to claim 6, wherein the blower is attached to the bonding head. In a bonding method for bonding an electronic component downward along a vertical direction with respect to a circuit member supported without being actively held by a circuit member support portion,
When flowing a gas for preventing dust from adhering to the circuit member along a horizontal direction perpendicular to the vertical direction between the circuit member and the electronic component, a plate-like shape extending in the horizontal direction is used. The cover member prevents airflow from hitting the circuit member to prevent the circuit member from being displaced in the circuit member support portion, and performs bonding while preventing dust from adhering to the circuit member. A bonding method characterized by the above. An electronic element comprising a circuit member and an electronic component bonded together in the bonding apparatus according to claim 1.

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