JP2006079258A - Interposer mounting method and mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED To quickly and surely mount an interposer on an antenna-formed sheet.
An interposer 20a including a first non-conductive sheet 11, an enlarged electrode 12, and an IC chip 20 is prepared. The interposer 20 a is mounted on each antenna 24 of the antenna-formed sheet 25 having the second non-conductive sheet 21 and a plurality of antennas 24. The antenna-formed sheet 25 and the interposer 20a are pressed and sandwiched between the receiving roller 40 and the ultrasonic roller 33. When ultrasonic vibration is applied from the ultrasonic roller 33 to the interposer 20a side, the first non-conductive sheet 11 of the interposer 20a is removed, and the antenna 24 and the enlarged electrode 12 are joined.
[Selection] Figure 1

Description

  The present invention relates to an interposer mounting method and an interposer mounting apparatus for manufacturing a sheet with a non-contact IC tag having a non-contact IC tag that can exchange data with an external reader / writer in a non-contact manner. .

  Conventionally, a non-contact IC tag that exchanges data without contact with an external reader / writer has an IC chip and an antenna, and such a non-contact IC tag is provided on a base sheet. Thus, a sheet with a non-contact IC tag is obtained. In this case, there is a method of preparing a sheet with a non-contact IC tag by preparing an interposer having an IC chip and a pair of enlarged electrodes in advance and mounting the interposer on an antenna of a base sheet ( For example, see Patent Document 1).

  As described above, the interposer has a pair of enlarged electrodes and an IC chip having a pair of bumps bonded to different enlarged electrodes, and each enlarged electrode of the interposer is electrically connected to a different contact of the antenna. Connected. The shape of the antenna is determined by the frequency of electromagnetic waves when data is transmitted and received between the IC tag and the reader / writer.

Note that the interposer itself can be used as a non-contact IC tag depending on the frequency band of the electromagnetic wave used when transmitting / receiving data to / from the reader / writer. In this case, the pair of enlarged electrodes function as an antenna, but the pair of enlarged electrodes may be joined to the antenna of the antenna-formed sheet in order to facilitate mounting on the final product or a packaging body for packaging the product. is there. The term interposer in the present application is a concept including an interposer that itself functions as a non-contact IC tag.
JP 2003-281491 A

  In the manufacturing method described in Patent Document 1 described above, after the interposer is manufactured, the interposer is disposed on the antenna of the base sheet through two stages of transport steps of the first transport device and the second transport device. An interposer is mounted on the antenna.

  In such a case, it is required to mount the interposer quickly and reliably on the antenna of the base sheet.

  The present invention has been made in consideration of such points, and provides an interposer mounting method and an interposer mounting apparatus capable of continuously and reliably mounting an interposer on a base sheet. The purpose is to provide.

  The present invention relates to a plurality of interposers having a first non-conductive sheet, an enlarged electrode made of a first conductor, and an IC chip, and a plurality of antennas made of a second non-conductive sheet and a second conductor. A step of mounting an interposer on each antenna of an antenna-formed sheet, and an ultrasonic roller provided on the interposer side. And the antenna-formed sheet and the interposer are pressed by the receiving roller provided on the antenna-formed sheet side, and the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are joined by the ultrasonic roller. This is an interposer mounting method.

  In the present invention, when the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are bonded, the enlarged electrode and the antenna are removed by applying ultrasonic vibration to the ultrasonic roller to remove the first non-conductive sheet of the interposer. And an interposer mounting method characterized by joining the two.

  The present invention relates to a plurality of interposers having a first non-conductive sheet, an enlarged electrode made of a first conductor, and an IC chip, and a plurality of antennas made of a second non-conductive sheet and a second conductor. In an interposer mounting apparatus that is mounted on an antenna-formed sheet extending in a belt shape, an antenna-formed sheet conveying apparatus that conveys the antenna-formed sheet, and an interposer is fixed on each antenna of the antenna-formed sheet Interposer mounting device that is sequentially placed at a pitch, an ultrasonic roller provided on the interposer side, and a receiving roller that presses the antenna formed sheet and interposer between the ultrasonic roller provided on the antenna formed sheet side And removing the first non-conductive sheet of the interposer by ultrasonic vibration from the ultrasonic roller. A mounting apparatus of the interposer, which comprises joining the enlarged electrode and the antenna has been formed sheet antenna interposer.

  The present invention is the interposer mounting device in which the ultrasonic roller and the receiving roller are each rotated about a rotation axis orthogonal to the conveying direction of the antenna-formed sheet.

  The present invention is the interposer mounting apparatus characterized in that the ultrasonic roller has ultrasonic protrusions formed on the outer periphery thereof at the same pitch as the mounting pitch of the interposer.

  The present invention is the interposer mounting apparatus in which the receiving roller has receiving projections formed on the outer periphery thereof at the same pitch as the mounting pitch of the interposer.

  In the present invention, each of the ultrasonic roller and the receiving roller has an ultrasonic protrusion and a receiving protrusion formed on the outer periphery at the same pitch as the mounting pitch of the interposer, and the ultrasonic protrusion and the receiving protrusion are pressed against each other. It is an interposer mounting device characterized in that it is provided at a mating position.

  The present invention is the interposer mounting device characterized in that the ultrasonic roller is an eccentric roller and presses against the receiving roller at the same circumferential pitch as the interposer mounting pitch.

  The present invention is the interposer mounting device, wherein the receiving roller is an eccentric roller, and presses against the ultrasonic roller at the same circumferential pitch as the mounting pitch of the interposer.

  In the present invention, the ultrasonic roller and the receiving roller are both eccentric rollers, and are provided at positions where they are pressed against each other at the same circumferential pitch as the mounting pitch of the interposer. It is a mounting device.

  The present invention includes a plurality of interposers having a first non-conductive sheet, an enlarged electrode made of the first conductor, and an IC chip, holding the interposer, a second non-conductive sheet, An antenna-formed sheet having a plurality of antennas made of two conductors and extending in a band shape, and the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are joined to each other, either the interposer or the antenna-formed sheet A non-contact IC tag characterized in that traces on the knurled surface of the ultrasonic roller are continuously formed along the antenna-formed sheet on one surface so as to pass through the joint between the enlarged electrode and the antenna. It is an attached sheet.

  The present invention includes an interposer having a first non-conductive sheet, an enlarged electrode made of the first non-conductive material, and an IC chip, and holding the interposer, a second non-conductive sheet, and a second conductive material. An antenna-formed sheet having an antenna made of a body, the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are joined, and the enlarged electrode is formed on one surface of the interposer or the antenna-formed sheet. The non-contact IC tag is characterized in that a mark on the knurled surface of the ultrasonic roller is formed so as to pass through the joint with the antenna.

  According to the present invention, an interposer having an IC chip and an enlarged electrode can be continuously and reliably mounted on an antenna-formed sheet. Thereby, a sheet with a non-contact IC tag can be manufactured easily and simply.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 4 are diagrams showing an embodiment of an interposer mounting method and an interposer mounting apparatus according to the present invention.

  First, the non-contact IC tag-attached sheet will be described with reference to FIGS. The sheet 10 with non-contact IC tag is made of paper or a plastic base sheet (also referred to as a second non-conductive sheet) 21 such as polyethylene (PE), vinyl chloride (PVC), ABS, etc. Are provided with a plurality of antennas 24 provided in advance, and an interposer 20a mounted on and mounted on the antenna 24.

  Of these, the interposer 20a includes a first non-conductive sheet 11 made of plastic such as polyethylene (PE), vinyl chloride (PVC), and ABS, and a first conductor provided on the first non-conductive sheet 11. A pair of enlarged electrodes 12 and an IC chip 20 connected to the enlarged electrodes 12. In this case, the IC chip 20 is connected to the enlarged electrode 12 via the bump 20b.

  Such an interposer 20a is produced in advance by punching the IC chip mounted sheet 15 as will be described later (FIG. 2), and a band-shaped antenna is formed as a mounted body including the base sheet 21 and a plurality of antennas 24. Arranged on the sheet 25.

  4A and 4B, the interposer 20a is first disposed on the antenna 24 of the antenna-formed sheet 25 (FIG. 4A). Antenna pads 24a are formed at both ends of the antenna 24, the interposer 20a straddles the antenna 24, and both end portions 42 of the interposer 20a are on the antenna pad 24a.

  Next, the first non-conductive sheet corresponding to both end portions 42 is pressed by pressing both end portions 42 of the interposer 20a and the antenna-formed sheet 25 between the ultrasonic roller 30 and the receiving roller 40 as will be described later. 11 is removed, and the enlarged electrode 12 and the antenna pad 24a of the antenna 24 are joined (FIG. 4B). In this way, the non-contact IC tag-attached sheet 10 is obtained.

  In FIG. 4A, before the interposer 20a is placed on the antenna-formed sheet 25, an adhesive material is applied in advance to the back surface of the first non-conductive sheet 11 of the interposer 20a or the antenna pad 24a. The antenna-formed sheet 25 and the interposer 20a are preferably temporarily joined.

  The non-contact IC tag-attached sheet 10 configured as described above is punched out in units of the antenna 24 in a subsequent process, and thus the base sheet 21, the antenna 24, and the interposer 20a including the IC chip 20 are formed. The non-contact IC tag 10a is obtained.

  Next, an interposer mounting apparatus and an interposer mounting method for mounting the interposer 20a on the antenna-formed sheet 25 will be described with reference to FIGS.

  The interposer mounting apparatus supplies an antenna-formed sheet 25 including a second non-conductive sheet 21 and a plurality of antennas 24 disposed on the non-conductive sheet 21 and having antenna pads 24a at both ends. A winding roll 31 and a winding roll 32, and an interposer mounting device 30 for sequentially mounting a plurality of interposers 20a at a constant pitch on each antenna 24 of the antenna-formed sheet 25 are provided. In this case, the antenna-formed sheet conveying apparatus is configured by the supply roll 31 and the winding roll 32 of the antenna-formed sheet 25.

  As shown in FIG. 2, the interposer 20 a includes a first non-conductive sheet 11, a pair of conductors 12 provided with a gap 12 a on the first non-conductive sheet 11, and a pair of conductive It is obtained by preparing an IC chip mounted sheet 15 composed of a plurality of IC chips 20 provided on the body 12 and punching out the IC chip mounted sheet 15 for each IC chip 20. The interposer 20a obtained by punching the IC chip mounted sheet 15 is mounted on the antenna formed sheet 25 by the interposer mounting apparatus 30 as described above.

  In this case, since the antennas 24 are provided on the antenna-formed sheet 25 at a constant pitch, the interposer 20a is also mounted on the antenna-formed sheet 25 at a constant pitch that is the same as the pitch of the antenna 24. The

Further, as shown in FIGS. 1 and 2, along the conveying direction L ₁ of the antenna has been formed sheet 25, an ultrasonic roller 33 on the downstream side of the interposer mounted device 30, is disposed and a receiving roller 40 Yes.

Among these, the ultrasonic roller 33 is disposed on the interposer 20a side of the antenna-formed sheet 25 and the interposer 20a mounted on the antenna-formed sheet 25, and the receiving roller 40 is disposed on the antenna-formed sheet 25. It arrange | positions at the 2nd non-conductor sheet | seat 21 side. One side of the ultrasonic roller 33 is connected to a motor 37 via a coupling 36 and is rotated by the motor 37. In addition, the ultrasonic roller 33 is connected to the ultrasonic engine 35 on the other side, and along the direction L ₂ orthogonal to the conveying direction L ₁ of the antenna-formed sheet 25 from the ultrasonic engine 35 to the ultrasonic roller 33. Ultrasonic vibration is given.

  The ultrasonic roller 35 has a knurled surface 34 on its outer periphery, and the ultrasonic roller 33 can transmit ultrasonic vibration to the interposer 20 a side more effectively by the knurled surface 34.

  Each of the ultrasonic roller 33 and the receiving roller 40 has a disk shape that rotates about the rotation shafts 33 a and 40 a, and the antenna-formed sheet 25 and the interposer 20 a are disposed between the ultrasonic roller 33 and the receiving roller 40. It comes to press. Then, the ultrasonic vibration from the ultrasonic roller 33 is transmitted to the interposer 20a, the first non-conductive sheet 11 of the interposer 20a is removed, the antenna pad 24a of the antenna-formed sheet 25, the enlarged electrode 12 of the interposer 20a, Are to be joined.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, as shown in FIG. 2, the IC chip mounted sheet 15 is punched for each IC chip 20 to produce an interposer 20a. In this case, the interposer 20a may be prepared in advance, the interposer 20a may be stuck on a sheet, and each interposer 20a may be peeled from the sheet.

  On the other hand, the antenna-formed sheet 25 is unwound from the supply roll 31 and taken up on the take-up roll 32. During this time, the interposer 20 a is placed on the antenna 24 of the antenna-formed sheet 25 by the interposer mounting device 30.

  In this case, the interposer 20a is mounted on the antenna-formed sheet 25 across the antenna 24, and both end portions 42 of the interposer 20 are disposed on the antenna pad 24a of the antenna 24 (FIG. 4A).

Then the antenna has been formed sheet 25 interposer 20a is mounted is conveyed along the conveying direction L _1, then the interposer 20a reaches to a point where the ultrasonic roller 33 and the receiving roller 40 is disposed. During this time, the ultrasonic roller 33 is rotated by the motor 37 in synchronization with the antenna-formed sheet 25.

  The antenna-formed sheet 25 and the interposer 20 are continuously conveyed even after reaching the ultrasonic roller 33.

During this time, the antenna-formed sheet 25 and the interposer 20a are sandwiched and pressed between the ultrasonic roller 33 and the receiving roller 40 (FIG. 4A). Further the ultrasound roller 33, the ultrasonic vibration is applied continuously along the ultrasound engine 35 in the arrow L ₂ direction. In this case, the ultrasonic roller 33 and the receiving roller 40 are located at a portion corresponding to one end 42 of the both end portions 42, 42 of the interposer 20a, and the antenna-formed sheet 25 and the interposer at the one end 42. 20a is pressed. Therefore, the first non-conductive sheet 11 corresponding to the one end portion 42 of the interposer 20a is removed by ultrasonic vibration from the ultrasonic roller 33, and the antenna pad 24a of the antenna-formed sheet 25 and the enlarged electrode of the interposer 20a. 12 are joined (FIG. 4B). In this case, the antenna pad 24a and the enlarged electrode 12 are directly and firmly joined, and the conduction resistance between the antenna pad 24a and the enlarged electrode 12 is dramatically improved.

Ultrasonic vibration from the ultrasonic engine 35 is given to the ultrasonic roller 33 as it is continuously an antenna has been formed sheet 25 and the interposer 20a is conveyed further in the arrow L ₁ direction.

  Thereafter, the antenna-formed sheet 25 and the interposer 20a are conveyed to a downstream ultrasonic roller and receiving roller (not shown) (FIG. 4A). When the antenna-formed sheet 25 and the interposer 20a are sent to the ultrasonic roller and the receiving roller on the downstream side, the ultrasonic vibration from the ultrasonic roller is generated at the other end portion 42 of the interposer 20a in the same manner as described above. Thus, the first non-conductive sheet 11 corresponding to the other end portion 42 of the interposer 20a is removed, and the antenna pad 24a of the antenna-formed sheet 25 and the enlarged electrode 12 of the interposer 20a are joined (FIG. 4B). )).

  In this way, the second non-conductive sheet (base material sheet) 21, the antenna 24 on the second non-conductive sheet 21, and the interposer 20 a joined to the antenna pad 24 a of the antenna 24 are non-conductive. The sheet 10 with a contact IC tag is obtained.

  In this case, on the surface of the interposer 20a of the non-contact IC tag-attached sheet 10, the knurled surface of the ultrasonic roller 33 passes through the joint portion 42a between the antenna pad 24a of the antenna 24 and the enlarged electrode 12 of the interposer 20a. 34 traces 34a are formed continuously.

  Further, when the non-contact IC tag 10a is manufactured by punching the sheet 10 with the non-contact IC tag for each antenna 24, the knurl passing through the joint 42a between the antenna pad 24a of the antenna 24 and the joint electrode 12 of the interposer 20a. The trace 34a of the surface 34 also remains on the non-contact IC tag 10a.

  In the above embodiment, the ultrasonic roller 33 is disposed on the interposer 20a side and the receiving roller 40 is disposed on the antenna formed sheet 25 side. However, the ultrasonic roller 33 is disposed on the antenna formed sheet 25. The receiving roller 40 may be disposed on the interposer 20a side.

  Further, an ultrasonic roller 33 and a receiving roller 40 for joining one end portion 42 of the interposer 20a to the antenna 24 are provided on the upstream side, and an ultrasonic roller 33 for joining the other end portion 42 of the interposer 20a to the antenna 24 and the downstream side. Although the example which provided the receiving roller 40 was shown, in order to each join the one end part 42 and the other end part 42 of the interposer 20a, a pair of ultrasonic roller 33,33 is attached on the same rotating shaft 33a, and each ultrasonic wave is provided. A pair of receiving rollers 40, 40 may be mounted on the same rotating shaft 40a corresponding to the rollers 33, 33.

  As described above, according to the present embodiment, the belt-shaped antenna-formed sheet 25 is continuously conveyed, and the interposer 20a is mounted on the antenna-formed sheet 25, and the interposer 20a and the antenna-formed sheet are mounted. 25 is pressed and sandwiched between the ultrasonic roller 33 and the receiving roller 40. Next, by applying ultrasonic vibration from the ultrasonic roller 33 to the interposer 20a, the interposer 20a can be accurately mounted on the antenna 24 of the antenna-formed sheet 25, and the sheet 10 with the non-contact IC tag can be mounted. It can be manufactured quickly and reliably.

  Next, a modification of the present invention will be described with reference to FIGS. 3 (a), (b), (c) and (d).

  1 and 2, an antenna is formed by a disk-shaped ultrasonic roller 33 having a knurled surface 34 and rotating about a rotating shaft 33a, and a disk-shaped receiving roller 40 rotating about a rotating shaft 40a. Although the example which presses the finished sheet 25 and the interposer 20a was shown, not only this but the antenna formed sheet 25 between the disk-shaped ultrasonic roller 33 and the receiving roller 40 which has the some receiving protrusion 41 is shown. And the interposer 20a may be pressed (FIG. 3A).

  In FIG. 3A, the receiving protrusions 41 of the receiving roller 40 are provided at the same pitch as the mounting pitch of the interposer 20 a mounted on the antenna-formed sheet 25.

In FIG. 3 (a), are successively conveyed and the antenna has been formed sheet 25 and the interposer 20a in the arrow L ₁ direction, during which may be continuously rotated ultrasonic roller 33 and the receiving roller 40. Ultrasonic roller 33 is rotated continuously with receiving roller 40, and ultrasonic vibration constantly arrow L ₂ direction by the ultrasonic engine 35 at the same time.

  In FIG. 3A, the receiving protrusion 41 of the receiving roller 40 comes to a position corresponding to the interposer 20a. When one end 42 of the interposer 20a reaches the ultrasonic roller 33, this end The portion 42 is pressed between the receiving projection 41 and the ultrasonic roller 33, and the first non-conductive sheet 11 of the interposer 20 a is removed by the ultrasonic vibration from the ultrasonic roller 33, and the antenna of the enlarged electrode 12 and the antenna 24. The pad 24a is joined.

  In the modification shown in FIG. 3B, an ultrasonic protrusion 38 is provided on the outer periphery of the ultrasonic roller 33 having the rotating shaft 33a, and the receiving roller 40 having the rotating shaft 40a is formed in a disc shape. The antenna-formed sheet 25 and the interposer 20a are pressed between the ultrasonic rollers 33.

  In FIG. 3B, the ultrasonic protrusions 38 of the ultrasonic roller 33 are provided at the same pitch as the mounting pitch of the interposer 20 a mounted on the antenna-formed sheet 25. Both the ultrasonic roller 33 and the receiving roller 40 shown in FIG. 3B rotate continuously, and the ultrasonic roller 33 constantly vibrates ultrasonically.

  In addition, you may use combining the receiving roller 40 which has the receiving protrusion 41 shown to Fig.3 (a), and the ultrasonic roller 33 which has the ultrasonic protrusion 38 shown in FIG.3 (b). In this case, the receiving projection 41 and the ultrasonic projection 38 are provided at positions where they are pressed against each other.

  In the modification shown in FIG. 3C, the antenna-formed sheet 25 and the interposer 20a are pressed between the ultrasonic roller 33 having the rotation shaft 33a and the receiving roller 40 having the eccentric shaft 40b.

  In FIG. 3C, the receiving roller 40 having the eccentric shaft 40b presses the antenna-formed sheet 25 and the interposer 20a with the ultrasonic roller 33 every rotation. That is, the receiving roller 40 approaches the ultrasonic roller 33 side at the same circumferential pitch as the mounting pitch of the interposer 20 a and presses the antenna-formed sheet 25 and the interposer 20 a with the ultrasonic roller 33. .

  In the modification shown in FIG. 3D, the antenna-formed sheet 25 and the interposer 20a are pressed between the receiving roller 40 having the rotating shaft 40a and the ultrasonic roller 33 having the eccentric shaft 33b.

  In FIG. 3D, the ultrasonic roller 33 having the eccentric shaft 33b presses the antenna-formed sheet 25 and the interposer 20a with the receiving roller 40 every rotation. That is, the ultrasonic roller 33 approaches the receiving roller 40 side at the same circumferential pitch as the mounting pitch of the interposer 20, and the antenna-formed sheet 25 and the interposer are interposed between the ultrasonic roller 33 and the receiving roller 40. Press 20a.

  In addition, you may use combining the receiving roller 40 which has the eccentric shaft 40b shown in FIG.3 (c), and the ultrasonic roller 33 which has the eccentric shaft 33b shown in FIG.3 (d). In this case, the receiving roller 40 and the ultrasonic roller 33 are provided at positions where they are pressed against each other.

  By the way, in each of the above embodiments, when the antenna-formed sheet 25 and the interposer 20a are pressed between the ultrasonic roller 33 and the receiving roller 40, the ultrasonic roller 33 is disposed on the interposer 20a side, Although the roller 40 is disposed on the antenna-formed sheet 25 side, as described above, the ultrasonic roller 33 may be disposed on the antenna-formed sheet 25 side, and the receiving roller 40 may be disposed on the interposer 20a side.

  Further, in each of the above embodiments, the IC chip 20 of the interposer 20a faces the side opposite to the antenna 24, but the IC chip 20 of the interposer 20a may face the antenna 24 side. In this case, an insulating layer is inserted between the antenna 24 and the IC chip 20.

The figure which shows the outline of the mounting apparatus and mounting method of the interposer by this invention. Schematic which shows an ultrasonic roller and a receiving roller. The figure which shows the modification of this invention. The side view which shows a sheet | seat with a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet | seat with non-contact IC tag 11 1st non-conductor sheet 12 Enlarged electrode 15 IC chip mounted sheet 20 IC chip 20a Interposer 21 2nd non-conductor sheet 24 Antenna 24a Antenna pad 25 Antenna formed sheet 30 Interposer mounting Apparatus 31 Supply roll 32 Winding roll 33 Ultrasonic roller 33a Rotating shaft 33b Eccentric shaft 34 Knurled surface 38 Ultrasonic projection 40 Receiving roller 40a Rotating shaft 40b Eccentric shaft 41 Receiving projection

Claims (11)

A plurality of interposers having a first non-conductor sheet, an enlarged electrode made of the first conductor, and an IC chip; a second non-conductor sheet; and a plurality of antennas made of the second conductor. In the mounting method of the interposer to be mounted on the antenna-formed sheet extending in a band shape,
A step of sequentially mounting an interposer on each antenna of the antenna-formed sheet;
A step of pressing the antenna-formed sheet and the interposer by the ultrasonic roller and the receiving roller, and joining the enlarged electrode of the interposer and the antenna of the antenna-formed sheet by applying ultrasonic vibration to the ultrasonic roller; An interposer mounting method characterized by comprising: A plurality of interposers having a first non-conductor sheet, an enlarged electrode made of the first conductor, and an IC chip; a second non-conductor sheet; and a plurality of antennas made of the second conductor; In the interposer mounting device mounted on the antenna-formed sheet extending in a band shape,
An antenna-formed sheet conveying device for conveying the antenna-formed sheet;
An interposer-equipped device for sequentially placing the interposer at a constant pitch on each antenna of the antenna-formed sheet;
An ultrasonic roller, and a receiving roller for pressing the antenna-formed sheet and the interposer between the ultrasonic roller,
A mounting apparatus for an interposer, wherein an expansion electrode of an interposer and an antenna of an antenna-formed sheet are joined by ultrasonic vibration from an ultrasonic roller.   3. The interposer mounting apparatus according to claim 2, wherein the ultrasonic roller and the receiving roller are each rotated about a rotation axis orthogonal to the conveying direction of the antenna-formed sheet.   4. The interposer mounting apparatus according to claim 2, wherein the ultrasonic roller has ultrasonic protrusions formed on the outer periphery thereof at the same pitch as the mounting pitch of the interposer.   4. The interposer mounting apparatus according to claim 2, wherein the receiving roller has receiving projections formed on the outer periphery thereof at the same pitch as the mounting pitch of the interposer.   Each of the ultrasonic roller and the receiving roller has an ultrasonic protrusion and a receiving protrusion formed on the outer periphery at the same pitch as the mounting pitch of the interposer, and the ultrasonic protrusion and the receiving protrusion are in positions where they are pressed against each other. 4. The interposer mounting apparatus according to claim 2, wherein the interposer mounting apparatus is provided.   4. The interposer mounting device according to claim 2, wherein the ultrasonic roller is an eccentric roller, and presses against the receiving roller at a circumferential pitch equal to the mounting pitch of the interposer. .   4. The interposer mounting device according to claim 2, wherein the receiving roller is an eccentric roller, and presses the ultrasonic roller at a circumferential pitch equal to the mounting pitch of the interposer.   The ultrasonic roller and the receiving roller are both eccentric rollers, and are provided at positions where they are pressed against each other at the same circumferential pitch as the mounting pitch of the interposer. Any interposer mounting device. A plurality of interposers having a first non-conductor sheet, an enlarged electrode made of the first conductor, and an IC chip;
While holding these interposers, it has a second non-conductive sheet and a plurality of antennas made of the second conductor, and includes an antenna-formed sheet extending in a strip shape,
The knurl surface of the ultrasonic roller so that the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are bonded, and passes through the bonded portion of the enlarged electrode and the antenna on one surface of the interposer or antenna-formed sheet A non-contact IC tag-attached sheet, wherein the traces are continuously formed along the antenna-formed sheet. An interposer having a first non-conductor sheet, an enlarged electrode made of the first non-conductor, and an IC chip;
While holding the interposer, and comprising an antenna-formed sheet having a second non-conductive sheet and an antenna made of the second conductor,
The knurl surface of the ultrasonic roller so that the enlarged electrode of the interposer and the antenna of the antenna-formed sheet are bonded, and passes through the bonded portion of the enlarged electrode and the antenna on one surface of the interposer or antenna-formed sheet A non-contact IC tag characterized in that a mark is formed.

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